CN104485573B - A kind of diode laser matrix side pumping module - Google Patents
A kind of diode laser matrix side pumping module Download PDFInfo
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- CN104485573B CN104485573B CN201410669895.8A CN201410669895A CN104485573B CN 104485573 B CN104485573 B CN 104485573B CN 201410669895 A CN201410669895 A CN 201410669895A CN 104485573 B CN104485573 B CN 104485573B
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- 238000005086 pumping Methods 0.000 title claims abstract description 34
- 239000011159 matrix material Substances 0.000 title claims abstract description 32
- 239000011521 glass Substances 0.000 claims abstract description 29
- 230000001681 protective effect Effects 0.000 claims abstract description 25
- 238000009413 insulation Methods 0.000 claims abstract description 13
- 239000000428 dust Substances 0.000 claims abstract description 6
- 238000011109 contamination Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 34
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000006260 foam Substances 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 210000003934 vacuole Anatomy 0.000 claims description 4
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 239000007787 solid Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 8
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 241000931526 Acer campestre Species 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The present invention relates to a kind of diode laser matrix side pumping module, it includes bottom plate, felt pad, electrode, heat insulating mattress, heat conductive pad, cover plate, protective glass, laser diode, lath, lath seat and temperature sensor；The laser diode is located at one be made up of protective glass, cover plate, heat insulating mattress and bottom plate and is used to prevent in sealed compartment of the laser diode Cavity surface from dust and moisture contamination and for insulation；There is a passage of heat being easy to laser diode accurate temperature controlling between laser diode and bottom plate；Laser diode is connected by heat conductive pad with bottom plate.The method have the advantages that：It can prevent laser diode from, by dust or moisture contamination, a quick conductive passage is provided to laser diode, be easy to carry out accurate temperature controlling to laser diode, can be widely applied to laser diode pump solid state laser device.
Description
Technical field
The invention belongs to solid state laser technical field, and in particular to a kind of diode laser matrix side pumping module,
It is particularly suitable for use in laser target designator and laser range finder etc..
Background technology
Diode laser matrix is the core devices of diode pumping solid laser, and the stabilization of its performance is directly connected to
The conversion efficiency and output energy of laser.After array device of the laser diode package into different structure form, it is necessary to
Ensure that the surface cleanliness and Cavity surface of laser diode are injury-free, because the pollution or damage of Cavity surface can have a strong impact on laser
Diode goes out optical property, and serious meeting causes the failure of whole device.Such as patent " semiconductor laser storage case "（Patent
Number：CN101746578A）, special Storage Box is devised come the need for meeting diode laser matrix storage and transport.But,
In use, laser diode has to be installed in equipment, and device cannot get necessary protection.Particularly answered some
With occasion, due to the limitation of use condition or in equipment Flight Line Maintenance, it is impossible to meet the requirement of air purity, the pole of laser two
Pipe light-emitting area is highly susceptible to pollute and cause performance drastically to decline.
Secondly, in diode pumping solid laser, the absorption that laser diode-pumped wavelength must be with laser crystal
Peak match, could obtain efficient laser output.Generally, the launch wavelength of laser diode vary with temperature for
0.2~0.3nm/ DEG C, and when the temperature increases, the Output optical power of laser diode is decreased obviously, when reaching certain temperature,
Just no longer stimulated radiation is even burnt.And the electro-optical efficiency of laser diode is generally 40%~50%, that is, the electricity inputted
Energy 50%~60% is all converted to heat energy, and this heat load is the key factor for limiting laser diode normal work.Therefore, laser
The temperature of diode is directly connected to transmitting optical maser wavelength, power output and the service life of laser diode, it is necessary to swashing
Optical diode carries out temperature control, temperature stabilization during holding laser diode work.Such as a kind of entitled " semiconductor side pumped mould
The patent of block "（Patent publication No. CN101593927A）, laser diode and laser crystal are dissipated by the way of water cooling
Heat.This pump module environmental suitability is poor, there is certain requirement during work to environment temperature.Because, when laser is in low temperature
When being worked under environment, in order to ensure the absorption peak match of laser diode-pumped wavelength and laser crystal, it is necessary to the pole of laser two
Pipe is heated.And while being heated to laser diode, due to the measure without insulation, laser diode can be to week
Collarette border is radiated, and reduces the efficiency of heating.In addition, inserting cooling tube between laser diode and laser bar and cold
But liquid, there is certain pumping depletion in this, and laser works for a period of time after, coolant can be gone bad by laser emission,
Transmitance to pump light can reduce, and reduce pumping efficiency and the stability of laser.
The content of the invention
The accurate temperature of diode laser matrix is controlled in order to prevent laser diode Cavity surface from polluting and realize, the present invention
There is provided a kind of laser diode side pumped module.This module also has while protection is sealed to diode laser matrix
The effect of insulation, it is easy to accomplish the temperature control to laser diode, and compact conformation, high conversion efficiency.
The technical scheme is that：
A kind of diode laser matrix side pumping module, it include bottom plate, felt pad, electrode, heat insulating mattress, heat conductive pad,
Cover plate, protective glass, laser diode, lath, lath seat and temperature sensor；The laser diode is located at by protection glass
Glass, cover plate, heat insulating mattress and bottom plate composition one be used for prevent laser diode Cavity surface from dust and moisture contamination and use
In in the sealed compartment of insulation；There is one to be easy to the heat conduction to laser diode accurate temperature controlling to lead between laser diode and bottom plate
Road；Laser diode is connected by heat conductive pad with bottom plate.
Further technical scheme is：
A reeded lath in middle part is fixed above described diode laser matrix side pumping module, its cover plate
Seat, lath seat is screwed on the cover board, has boss in the middle part of the groove of lath seat；In lath insertion groove, the lath two
Side is connected by Heat Conduction Material with lath seat；Heat insulating mattress is fixed on bottom plate；In the middle part of heat conductive pad insertion heat insulating mattress, the heat conductive pad
Top is laser diode；Temperature sensor is arranged near the light-emitting area of laser diode.
It is coated with described diode laser matrix side pumping module, its protective glass for increasing pumping light transmission rate
Pump light anti-reflection film；The material of protective glass be sapphire, or quartz, thickness be 0.4~0.8mm.
Described diode laser matrix side pumping module, the thermal expansion of the thermal coefficient of expansion and cover plate of its protective glass
Coefficients match；Protective glass is be bonded by heat conduction elargol with cover plate.
Described diode laser matrix side pumping module, the material of its heat conductive pad is high thermal conductivity materials, and the height is led
Conductivity material is indium foil, or liquid metal material.
Described diode laser matrix side pumping module, its temperature sensor is RTD, or thermistor, or number
Word formula thermometer.
Described diode laser matrix side pumping module, its heat insulating mattress is tetrafluoroethene plate, or plastic plate, or poly- rich
Plate.
Heat-barrier material is scribbled on the inside of described diode laser matrix side pumping module, its cover plate, the heat-barrier material is
Many vacuole foam class heat resistant layers.
Described diode laser matrix side pumping module, its lath is square or trapezoidal, or "the" shape, or many
Side shape；Lath has the adhesive of thermal conduction characteristic with the Heat Conduction Material that lath seat two sides are connected.
A width of 3~the 5mm of boss in the middle part of described diode laser matrix side pumping module, the groove of its lath seat is high
For 0.15~0.3mm；Boss surface is polished gold-plated, for unabsorbed residual pump light to be reflected into non-return lath 9.
The present invention principle and significantly have the technical effect that：
The protective glass of diode laser matrix side pumping module of the present invention is coated with pump light anti-reflection film, laser diode
The pump light sent is irradiated on laser crystal by protective glass.Heat-barrier material is scribbled on the inside of cover plate, cover plate passes through heat insulating mattress
It is connected with bottom plate, filled with high pressure nitrogen in cover plate, reduces the heat exchange inside and outside sealed compartment.Diode laser matrix passes through heat conductive pad
It is connected with bottom plate, reduces the thermal resistance of diode laser matrix passage of heat.Temperature controller carries out temperature by bottom plate to laser diode
Control.Notable technique effect mainly has：
1st, using the sealing that the cover plate of heat-barrier material, heat insulating mattress are scribbled by thick protective glass and inwall and is formed with bottom plate
Cabin, it is ensured that laser diode Cavity surface prevents laser diode to sealing convection current out of my cabin and spoke from the pollution of dust and steam
Heat transfer is penetrated, the effect of insulation is played；
2nd, lath is radiated from two sides using the shell of lath seat and cover plate, reduces the heat ladder under lath high-power operation
Degree；
3rd, lath seat inner side is designed with projection, by the way of polishing is gold-plated, will transmit through the unabsorbed pump light of lath
Lath is reflected back, the transformation efficiency of pump light is improved；
4th, using heat conductive pad, laser diode is directly connected with bottom plate, reduces laser diode and bottom plate is directly warm
Resistance；
5th, the temperature of laser diode can accurately and rapidly be reacted close to laser diode light-emitting area using temperature sensor
Degree, is easy to temperature control module to carry out temperature control to laser diode.
6th, pump module compact conformation of the present invention, small volume is lightweight, and high conversion efficiency can meet wide temperature range
Under laser diode side pumped slab laser requirement.
Brief description of the drawings
Fig. 1 is laser diode side pumped module cross-sectional view.
Fig. 2 is the decomposing schematic representation of laser diode side pumped module.
Marked in figure：1- bottom plates, 2- felt pads, 3- electrodes, 4- heat insulating mattress, 5- heat conductive pads, 6- cover plates, 7- protection glass
Glass, 8- laser diodes, 9- laths, 10- laths seat, 11- temperature sensors.
Embodiment
It is as follows that the invention will be further described in conjunction with the accompanying drawings and embodiments；
Embodiment 1：For basic embodiment：A kind of diode laser matrix side pumping module, it includes bottom plate 1, insulation
Pad 2, electrode 3, heat insulating mattress 4, heat conductive pad 5, cover plate 6, protective glass 7, laser diode 8, lath 9, lath seat 10 and temperature
Sensor 11；The laser diode 8 is located at one be made up of protective glass 7, cover plate 6, heat insulating mattress 4 and bottom plate 1 and is used for
Prevent the Cavity surface of laser diode 8 from dust and moisture contamination and in the sealed compartment of insulation；Laser diode 8 and bottom plate 1
Between have a passage of heat being easy to the accurate temperature controlling of laser diode 8；Laser diode is connected by heat conductive pad 5 with bottom plate 1
Connect, reduce laser diode 8 and the direct thermal resistance of bottom plate 1, it is ensured that temperature accurately and quickly can be carried out to laser diode 8
Control.
Embodiment 2：It is the further embodiment on the basis of embodiment 1.Described diode laser matrix profile pump
The reeded lath seat 10 in a middle part is fixed in module, the top of its cover plate 6, and lath seat 10 is screwed on cover plate 6,
There is boss in the middle part of the groove of lath seat 10；In the insertion groove of lath 9, the two sides of lath 9 pass through Heat Conduction Material and lath seat 10
Connection；Heat insulating mattress 4 is fixed on bottom plate 1；The middle part of the insertion of heat conductive pad 5 heat insulating mattress 4, the top of heat conductive pad 5 is laser diode 8；
Temperature sensor 11 is arranged near the light-emitting area of laser diode 8.Sealed compartment is inside and outside to form thermal insulation layer, to laser diode 8
Play insulation effect.It is coated with described protective glass 7 for increasing the pump light anti-reflection film of pumping light transmission rate；Protective glass
7 material be sapphire, or quartz, thickness be 0.4~0.8mm.The thermal coefficient of expansion of described protective glass 7 and cover plate 6
Matched coefficients of thermal expansion.The material of described heat conductive pad 5 is high thermal conductivity materials, and the high thermal conductivity materials are indium foil, or liquid
Metal material.Described temperature sensor 11 is RTD, or thermistor, or digital temperature meter.Described heat insulating mattress 4 is
Tetrafluoroethene plate, or plastic plate, or gather rich plate.The described inner side of cover plate 6 scribbles heat-barrier material, and the heat-barrier material is many vacuole foams
Class heat resistant layer.Described lath 9 is square or trapezoidal, or "the" shape, or polygon lath；Lath 9 and 10 both sides of lath seat
The Heat Conduction Material of face connection is the adhesive with thermal conduction characteristic.The groove middle part boss a width of 3 of described lath seat 10~
5mm, a height of 0.15~0.3mm；Boss surface is polished gold-plated, for unabsorbed residual pump light to be reflected into non-return lath
9。
Embodiment 3：It is the preferred embodiment on the basis of embodiment 2.As shown in Figure 1 and Figure 2, described laser diode
Array side pumping module, the top of its cover plate 6 is fixed on the reeded lath seat 10 in a middle part, the groove of lath seat 10
Top surface has boss；In the insertion groove of lath 9, the two sides of lath 9 are connected by Heat Conduction Material with lath seat 10, and lath seat 10 is again
It is connected on cover plate 6, the heat that lath 9 is produced is dissipated by lath seat 10 and the shell of cover plate 6.Heat insulating mattress 4 is fixed on bottom plate 1
On；The middle part of the insertion of heat conductive pad 5 heat insulating mattress 4, the top of heat conductive pad 5 is laser diode 8；Temperature sensor 11 is arranged on laser two
Near the light-emitting area of pole pipe 8, it is specifically：Temperature sensor 11 takes the mode being adhesively fixed, close to the luminous of laser diode 8
Face is installed, and reduces the thermal resistance between laser diode 8, the temperature of reaction laser diode 8 that can be accurately and fast as far as possible
Degree, is easy to temperature control module to carry out temperature control to laser diode 8.Sealed compartment is inside and outside to form thermal insulation layer, to laser diode 8
To insulation effect.It is coated with described protective glass 7 for increasing the pump light anti-reflection film of pumping light transmission rate；Protective glass 7
Material be sapphire, or quartz, thickness is 0.6mm.The thermal coefficient of expansion of described protective glass 7 and the thermal expansion of cover plate 6
Coefficients match, protective glass 7 is be bonded by heat conduction elargol with cover plate 6, plays sealed effect.The material of described heat conductive pad 5
For high thermal conductivity materials, the high thermal conductivity materials are indium foil.Described temperature sensor 11 is RTD.Described cover plate 6 with
Isolated between bottom plate 1 with heat insulating mattress 4, reduce the heat load of laser diode 8；Heat insulating mattress 4 is tetrafluoroethene plate.Described cover plate
6 inner sides scribble heat-barrier material, and the heat-barrier material is many vacuole foam class heat resistant layers, and insulation is played to laser diode in sealed compartment 8
Effect, it is ensured that pump light and the crystal optimal absorption Spectral matching of lath that laser diode 8 is launched.Described lath 9 is side
Shape lath；The Heat Conduction Material that lath 9 is connected with 10 two sides of lath seat is the adhesive with thermal conduction characteristic.Described lath seat
Boss a width of 4mm, a height of 0.2mm in the middle part of 10 groove.
The claims in the present invention protection domain is not limited to above-described embodiment.
Claims (9)
1. a kind of diode laser matrix side pumping module, it is characterised in that：Including bottom plate（1）, felt pad（2）, electrode
（3）, heat insulating mattress（4）, heat conductive pad（5）, cover plate（6）, protective glass（7）, laser diode（8）, lath（9）, lath seat（10）
And temperature sensor（11）；The laser diode（8）Positioned at by protective glass（7）, cover plate（6）, heat insulating mattress（4）And bottom
Plate（1）One of composition is used to prevent laser diode（8）Sealed compartment of the Cavity surface from dust and moisture contamination and for insulation
It is interior；Laser diode（8）With bottom plate（1）Between there is one to be easy to laser diode（8）The passage of heat of accurate temperature controlling；Laser
Diode（8）Pass through heat conductive pad（5）With bottom plate（1）Connection；Described cover plate（6）Top fix a reeded plate in middle part
Bar seat（10）, lath seat（10）It is screwed in cover plate（6）On, lath seat（10）Groove in the middle part of have boss；Lath（9）
In embedded groove, the lath（9）Two sides pass through Heat Conduction Material and lath seat（10）Connection；Heat insulating mattress（4）It is fixed on bottom plate（1）
On；Heat conductive pad（5）Embedded heat insulating mattress（4）Middle part, the heat conductive pad（5）Top is laser diode（8）；Temperature sensor（11）Peace
Mounted in laser diode（8）Light-emitting area near.
2. diode laser matrix side pumping module according to claim 1, it is characterised in that：Protective glass（7）On
It is coated with for increasing the pump light anti-reflection film of pumping light transmission rate；Protective glass（7）Material be sapphire, or quartz, thickness
For 0.4~0.8mm.
3. diode laser matrix side pumping module according to claim 1, it is characterised in that：Protective glass（7）'s
Thermal coefficient of expansion and cover plate（6）Matched coefficients of thermal expansion；Protective glass（7）With cover plate（6）It is bonded by heat conduction elargol.
4. diode laser matrix side pumping module according to claim 1, it is characterised in that：Heat conductive pad（5）Material
Expect for high thermal conductivity materials, the high thermal conductivity materials are indium foil, or liquid metal material.
5. diode laser matrix side pumping module according to claim 1, it is characterised in that：Temperature sensor（11）
For RTD, or thermistor, or digital temperature meter.
6. diode laser matrix side pumping module according to claim 1, it is characterised in that：Heat insulating mattress（4）For four
PVF plate, or plastic plate, or gather rich plate.
7. diode laser matrix side pumping module according to claim 1, it is characterised in that：Cover plate（6）Inner side is applied
There is heat-barrier material, the heat-barrier material is many vacuole foam class heat resistant layers.
8. diode laser matrix side pumping module according to claim 1, it is characterised in that：Lath（9）For " it "
Font, or polygon；Lath（9）With lath seat（10）The Heat Conduction Material of two sides connection is the adhesive with thermal conduction characteristic.
9. diode laser matrix side pumping module according to claim 1, it is characterised in that：Lath seat（10）It is recessed
Boss a width of 3~5mm, a height of 0.15~0.3mm in the middle part of groove；Boss surface is polished gold-plated, for by unabsorbed residue
Pump light is reflected back lath（9）.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410669895.8A CN104485573B (en) | 2014-11-21 | 2014-11-21 | A kind of diode laser matrix side pumping module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410669895.8A CN104485573B (en) | 2014-11-21 | 2014-11-21 | A kind of diode laser matrix side pumping module |
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| CN104485573A CN104485573A (en) | 2015-04-01 |
| CN104485573B true CN104485573B (en) | 2017-09-22 |
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| CN106567999B (en) * | 2016-11-03 | 2020-05-26 | 天台天宇光电股份有限公司 | Laser diode heating and radiating structure |
| CN109375192A (en) * | 2018-12-12 | 2019-02-22 | 广州维思车用部件有限公司 | Automated driving system, laser radar and its Laser emission structure |
| CN113937613A (en) * | 2021-09-22 | 2022-01-14 | 中国电子科技集团公司第十一研究所 | Satellite-borne pump LD strengthening assembly and laser |
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| US6137815A (en) * | 1996-12-27 | 2000-10-24 | Fuji Photo Film Co., Ltd. | Semiconductor laser |
| CN2598215Y (en) * | 2003-02-21 | 2004-01-07 | 华中科技大学 | A laser diode solid-state laser side-pumped module |
| CN1564389A (en) * | 2004-04-12 | 2005-01-12 | 武汉华工飞腾光子科技有限公司 | Laser LED pump solid laser |
| CN2674719Y (en) * | 2004-01-16 | 2005-01-26 | 深圳市大族激光科技股份有限公司 | Whole cooled laser of laser diode and resonant cavity separator |
| CN101562309A (en) * | 2009-04-02 | 2009-10-21 | 北京国科世纪激光技术有限公司 | Laser gain module of semiconductor laser monotube combined side pumped solid-state laser |
| WO2013033265A1 (en) * | 2011-08-29 | 2013-03-07 | Intellectual Light, Inc. | Mount for semiconductor devices using conformable conductive layers, and method |
-
2014
- 2014-11-21 CN CN201410669895.8A patent/CN104485573B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6137815A (en) * | 1996-12-27 | 2000-10-24 | Fuji Photo Film Co., Ltd. | Semiconductor laser |
| CN2598215Y (en) * | 2003-02-21 | 2004-01-07 | 华中科技大学 | A laser diode solid-state laser side-pumped module |
| CN2674719Y (en) * | 2004-01-16 | 2005-01-26 | 深圳市大族激光科技股份有限公司 | Whole cooled laser of laser diode and resonant cavity separator |
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