CN104485426A - OLED (organic light-emitting diode) package structure and package method - Google Patents
OLED (organic light-emitting diode) package structure and package method Download PDFInfo
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- CN104485426A CN104485426A CN201410831196.9A CN201410831196A CN104485426A CN 104485426 A CN104485426 A CN 104485426A CN 201410831196 A CN201410831196 A CN 201410831196A CN 104485426 A CN104485426 A CN 104485426A
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- sealing
- oled
- frame
- encapsulating structure
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention belongs to the technical field of OLED (organic light-emitting diode) sealing, and particularly relates to an OLED package structure and a package method. The OLED package structure comprises a substrate, OLED devices arranged on the substrate and a package cover plate for covering the OLED devices, wherein a sealing frame is arranged between the substrate and the package cover plate and comprises a sealing border and at least two sealing blocks integrally formed on the outer side of the sealing border. On the basis of a conventional sealing frame structure in the prior art, the package structure only has structural improvement of sealing blocks integrally formed on the outer side, that is, the laser sealing strength is enhanced, the sealing performance of the structure is greatly improved, and the OLED package service life is prolonged; and besides, extra UV (ultraviolet) glue reinforcing treatment is not required, and the OLED package structure still can have the same sealing effect with a reinforced package structure.
Description
Technical field
The invention belongs to OLED technical field of sealing technology, be specifically related to a kind of OLED encapsulating structure and method for packing.
Background technology
Display of organic electroluminescence OLED (Organic Light-Emitting Diode) is as a kind of novel flat panel display, due to its there is active illuminating, luminosity is high, resolution is high, wide viewing angle, fast response time, low energy consumption and can the feature such as flexibility, receive increasing concern, become the Display Technique of future generation that may replace liquid crystal display.
Exist in current OLED for the very responsive organic layer material of steam and oxygen, this makes the life-span of OLED display device greatly reduce.In order to address this problem, various material in prior art, is mainly utilized OLED to be encapsulated.Conventional method for packing is frit encapsulation, namely forms encapsulation region with frits upper and lower base plate, seals to protect OLED.But owing to being solid state contacts between frit and substrate, mutual cohesive force is more fragile, when the external impacts such as being fallen, the phenomenon such as rupturing easily appears in frit and upper and lower base plate, stripping, finally causes package failure.
Give the means solved the problems of the technologies described above in existing solution as shown in Figure 1, form frit-sealed frame 103 in figure between upper substrate 101 and infrabasal plate 102, OLED 104 is positioned at the sealing of this region.In order to solve the problem of above-mentioned frit and upper and lower substrate easy fracture, usually adding UV glue material 106 again in the periphery of frit-sealed frame 103, with adhesion strength horizontal outside reinforcing glass material, playing reinforcing effect.
But above-mentioned reinforcement measure, owing to being carry out reinforcement for individual unit, causes the production capacity of equipment lower, correspondingly add production cost; And when arranging UV glue material 106, UV glue material 106 may overflow, relatively adds the risk of other processing procedures; In addition, because UV glue material 106 is different from the characteristic of frit 103, cause the matching of material poor, easily occur phenomenon of expanding with heat and contract with cold, under also likely causing external impacts, there is the risk of crack, stripping in frit and upper and lower substrate.
Summary of the invention
For this reason, technical problem to be solved by this invention is the problem of OLED encapsulating structure easy fracture and stripping in prior art, and then provides a kind of OLED encapsulating structure, and provides a kind of OLED encapsulation method further.
For solving the problems of the technologies described above, OLED encapsulating structure of the present invention, comprises substrate and the encapsulation cover plate in order to cover described OLED; The sealing frame for sealing OLED is provided with between described substrate and described encapsulation cover plate; Described sealing frame comprises sealed frame and is shaped at least two sealing blocks outside described sealed frame.
Further, described sealed frame is rectangle frame, and optionally carries out rounding process.
Preferably, described sealing block is symmetric along the surrounding of described sealed frame.
As preferred structure, described sealing block is rectangular block, and its long limit and described sealed frame coincide.
Or described sealing block is arc block, and described arc block has the radius R identical with the fillet of described sealed frame.
More excellent, described sealing block has and the first limit that described sealed frame contacts and the Second Edge relative with described first limit, and the width H between described first limit and Second Edge is 0<H≤300 μm.
Described sealed frame has the 3rd limit and four limit relative with described 3rd limit that contact with described sealing block, and the width between described 3rd limit and the 4th limit is 300-1000 μm.
Described sealed frame is identical with the thickness of described sealing block between described substrate and described encapsulation cover plate, and described gauge is 3-30 μm.
Frit of the present invention is the conventional ratio material used in prior art, and preferred further, and the particle size of described frit is 0.1 μm-10 μm.
The invention also discloses a kind of OLED encapsulation method, comprise the steps:
S1, coated glass material on encapsulation cover plate, forms sealed frame and the sealing block of sealing frame;
S2, by described substrate and the corresponding laminating of described encapsulation cover plate being formed with sealed frame and sealing block, realizes sealing.
More excellent, in described steps A, utilize screen printing technique to be coated with described sealing frame, specifically comprise the steps:
(1) throw the net: the screen cloth getting polyester material is bonded on screen frame, and set angle of throwing the net, tension force;
(2) compound: get adaptive SUS net and be posted in described screen cloth bottom and fix, removing nets overlapping polyester material with SUS;
(3) net is washed: clean dirt on yarn, and dry;
(4) emulsion is coated with: at whole SUS region coating photosensitive emulsion, thickness is completely obscured with the opening between netting twine and is as the criterion, and dries;
(5) expose: prepare the film according to the shape of described sealing frame, and be attached to the surface that silk screen scribbles emulsion, be placed in exposure in vacuum exposure machine, on the described film, non-graphic region can through UV light, emulsion is hardened, and graphics field emulsion state is constant;
(6) video picture: unhardened emulsion on cleaning half tone is also dried, and described half tone defines the figure of required sealing frame, obtained required silk screen;
(7) by described silk screen, be coated with described frit with screen printing mode in the position of described encapsulation cover plate corresponding described OLED on the surface, and form described sealing frame.
Described screen frame is wooden screen frame, Aluminum Hollow frame or steel screen frame.
OLED encapsulating structure of the present invention is only by the basis of conventional sealing frame structure in the prior art, one-body molded architecture advances having at least two sealing blocks outside it, both strengthened the intensity of package sealing with laser, achieved the significantly raising of its sealing property, and improved OLED and encapsulate the life-span; Encapsulating structure of the present invention, adopts integrated structure, without the need to carrying out the reinforcement solutions of extra UV glue, and without the need to setting up reinforcement equipment, can reduce production cost, and still can obtain the sealing effectiveness identical with the encapsulating structure carrying out reinforcement solutions.
OLED encapsulation method of the present invention can sealing block needed for the edge forming of primary seal frame by means of only silk-screen mode, play side reinforcing effect, do not increase any additional step, can utilize again prior art routine, economic frit can realize the most simultaneously, save production cost, achieve fabulous sealing effectiveness simultaneously.
Accompanying drawing explanation
In order to make content of the present invention be more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 is the structural representation of OLED encapsulating structure in prior art;
Fig. 2 is the structural representation of OLED encapsulating structure of the present invention;
Fig. 3 is that sealing frame of the present invention is printed on structural representation on encapsulation cover plate;
Fig. 4 is a kind of structure of sealing frame of the present invention;
Fig. 5 is the another kind of structure of sealing frame of the present invention;
Fig. 6 is the structural representation that the present invention processes the silk screen of described sealing frame;
Fig. 7 is the screen net structure schematic diagram of processed glass material sealing frame in prior art;
In figure, Reference numeral is expressed as: 301-substrate, 302-encapsulation cover plate, 303-sealed frame, 304-OLED device, 305-sealing block, 306-fillet, 3061-screen frame, 3062-screen cloth, 3063-emulsion region, 4064 sealing frames.
Embodiment
As shown in Figure 2, described OLED encapsulating structure comprises substrate 301 to OLED encapsulating structure of the present invention, at least one OLED 304 be arranged on substrate 301, and covers the encapsulation cover plate 302 of described OLED 304.Described substrate 301 be provided with sealing frame (in figure namely 303 and 305 shown in part) of mating corresponding with described OLED 304 between encapsulation cover plate 302.Described sealing frame comprises sealed frame 303 and is shaped in the sealing block 305 outside described sealed frame 303.
As shown in Figure 3, the arrangement schematic diagram of the sealing frame be arranged on described encapsulation cover plate 302 is given.Described sealing frame comprises sealed frame 303 and is shaped at least two sealing blocks 305 outside described sealed frame 303.Described sealed frame 303 is the rectangle frame matched with described OLED to be sealed, and optionally can carry out rounding process to the inside casing of described sealed frame 303 and housing as required, forms fillet 306.In order to better play the effect strengthening sealing property, can in the outside on each limit of described sealed frame 303 all shaping described sealing block 305, and the long leg of described sealed frame 303 divides the number of shaping sealing block 305 can more than the number taken shape in outside described sealed frame 303 minor face.And the surrounding that described sealing block 305 is preferably along described sealing frame 303 is symmetric.
Meanwhile, the shape of described sealing block 305 includes but not limited to the arc block of rectangle or certain radian.In order to better play the effect of its sealing, sealing block 305 described is as shown in Figure 4 rectangular block, and is defined as and coincides with its long limit and described sealed frame 303.
Fig. 5 gives the structure that described sealing block 305 is arc block, and further preferred described arc block has the radius R identical with the fillet 306 of described sealed frame 303.
For the encapsulation of conventional OLED device, the width dimensions H of described sealing block 305 is set to 0<H≤300 μm.Width dimensions between the internal and external frames of described sealed frame 303 is 300-1000 μm.Described sealed frame 303 is identical with the thickness of described sealing block 305 between described substrate 301 and described encapsulation cover plate 302, and described gauge is 3-30 μm.
Sealing frame structure for sealing OLED of the present invention, identical with prior art, be formed by coated glass material.Described frit can be the conventional frit used in prior art, such as, be selected from V
2o
5, P
2o
5, BaO, SiO
2, B
2o
3, Al
2o
3, SnO, TeO
2, MgO, CaO, ZnO, TiO
2, WO
3, Bi
2o
3, Fe
2o
3, CuO, Sb
2o
3, Ru
2o, Rb
2at least one in O, tin-fluorophosphate glasses, vanadate glass and borosilicate.And the particle size of preferred described frit is 0.1 μm-10 μm.Scheme of the present invention selects frit material the most common in prior art to be that frit (its composition comprises glass dust, solvent, resin) is set forth technique effect of the present invention.
Encapsulating structure of the present invention can adopt the mode forming sealing shaped as frame shape and structure well known in the prior art to process, and preferably utilizes screen printing technique to be coated with described sealing frame, and and then the encapsulating structure stated of machining.
Present invention also offers a kind of OLED encapsulation method, namely realized the encapsulation of OLED by the above-mentioned encapsulating structure of processing, specifically comprise the steps:
S1, according to the arrangement mode of described OLED 304 on described substrate 301, position coated glass material corresponding thereto on described encapsulation cover plate 302, forms the described sealed frame 303 and sealing block 305 that match with described OLED, forms described sealing frame; The processing of described sealing frame can select prior art conventional method to realize, and preferably utilizes screen printing technique to process described sealing frame, and as shown in Figure 6, concrete steps comprise:
(1) throw the net: will get screen cloth 3062 and be bonded on screen frame 3061, and set throw the net angle 22.5 ° ~ 45 °, tension force 24N ~ 38N, described screen cloth 3062 is polyester material; Described screen frame 3061 can be wooden screen frame, Aluminum Hollow frame or steel screen frame;
(2) compound: get adaptive SUS net and be posted in described screen cloth 3062 bottom and fixing surrounding, removing nets overlapping polyester material part with SUS;
(3) net is washed: clean dirt on yarn, and dry;
(4) emulsion is coated with: whole SUS region coating photosensitive emulsion (as described in 3063 emulsion region), thickness is completely obscured be as the criterion (being generally advisable with 5 ± 1um) with the opening between netting twine, and dries;
(5) expose: prepare the film according to the shape of the sealing frame as shown in accompanying drawing 4 or 5, and the film preparing required figure is attached to the surface that silk screen scribbles emulsion, be placed in exposure in vacuum exposure machine, on the described film, non-graphic region can through UV light, emulsion is hardened, and graphics field emulsion state is constant;
(6) video picture: unhardened emulsion on cleaning half tone is also dried, and described half tone defines the figure of required described sealing frame, obtained required silk screen;
(7) by described silk screen, with the position coated glass material of screen printing mode in described encapsulation cover plate 302 corresponding described OLED 304 on the surface, and form the graph layer of described sealing frame, form the described sealing frame matched with described OLED 304 size;
S2, described OLED 304 inserted by described substrate 301, by corresponding with encapsulation cover plate 302 for described substrate 301 laminating; And by frit described in laser technology clinkering, realize sealing.
Fig. 7 gives the screen net structure figure of processed glass material sealing frame in prior art, and the material of described sealing frame is identical with aforementioned the solution of the present invention, all selects frit material, and the preparation method of described sealing frame is the same with the present invention, namely adopts screen printing technique processing.Its difference is only that the sealing frame of encapsulating structure conventional in prior art is rectangular configuration (as shown in 4064 figure); And by frit described in the clinkering of described upper and lower substrate corresponding subsides merga pass laser technology, after realizing sealing, apply in the surrounding of described sealing frame the effect that one deck UV glue plays reinforcement, and then obtain the common encapsulating structure of prior art shown in Fig. 1.
Performance Detection is carried out to OLED encapsulating structure of the present invention (sealing frame shape as shown in Figure 2), experiment proves, the present invention is provided with at primary seal frit side the frit having and be intervally arranged by a silk-screen mode, plays side reinforcing effect; Strengthen package sealing with laser intensity, improve OLED and encapsulate the life-span; Its sealing property is suitable with the encapsulating structure (accompanying drawing 1) adopting prior art to prepare, and without the need to reinforcement equipment, reduces production cost.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (10)
1. an OLED encapsulating structure, comprises substrate (301) and the encapsulation cover plate (302) in order to cover OLED, it is characterized in that:
The sealing frame for sealing OLED is provided with between described substrate (301) and described encapsulation cover plate (302);
Described sealing frame comprises sealed frame (303) and is shaped at least two sealing blocks (305) in described sealed frame (303) outside.
2. OLED encapsulating structure according to claim 1, is characterized in that, described sealed frame (303) is rectangle frame, and optionally carries out rounding process.
3. OLED encapsulating structure according to claim 1 and 2, is characterized in that, described sealing block (305) is symmetric along the surrounding of described sealed frame (303).
4. OLED encapsulating structure according to claim 3, is characterized in that, described sealing block (305) is rectangular block, and its long limit and described sealed frame (303) coincide.
5. OLED encapsulating structure according to claim 3, is characterized in that, described sealing block (305) is arc block, and described arc block has the radius R identical with the fillet of described sealed frame (303) (306).
6. the OLED encapsulating structure according to any one of claim 1-5, it is characterized in that, described sealing block (305) has and the first limit that described sealed frame (303) contacts and the Second Edge relative with described first limit, and the width H between described first limit and Second Edge is 0<H≤300 μm.
7. the OLED encapsulating structure according to any one of claim 1-6, it is characterized in that, described sealed frame (303) has and the 3rd limit that described sealing block (305) contacts and four limit relative with described 3rd limit, and the width between described 3rd limit and the 4th limit is 300-1000 μm.
8. the OLED encapsulating structure according to any one of claim 1-7, it is characterized in that, described sealed frame (303) is identical with the thickness that described sealing block (305) is positioned between described substrate (301) and described encapsulation cover plate (302), and described gauge is 3-30 μm.
9. an OLED encapsulation method, is characterized in that, comprises the steps:
S1, at the upper coated glass material of encapsulation cover plate (302), forms sealed frame (303) and the sealing block (305) of the sealing frame as described in claim 1-8;
S2, by described substrate (301) and described encapsulation cover plate (302) the corresponding laminating being formed with sealed frame (303) and sealing block (305), realizes sealing.
10. OLED encapsulation method according to claim 9, is characterized in that, in described step S1, utilizes screen printing technique to be coated with described sealing frame, specifically comprises the steps:
(1) throw the net: the screen cloth (3062) getting polyester material is bonded on screen frame (3061), and sets angle of throwing the net, tension force;
(2) compound: get adaptive SUS net and be posted in described screen cloth (3062) bottom and fix, remove and net overlapping polyester material with SUS;
(3) net is washed: clean dirt on yarn, and dry;
(4) emulsion is coated with: at whole SUS region coating photosensitive emulsion, thickness is completely obscured with the opening between netting twine and is as the criterion, and dries;
(5) expose: prepare the film according to the shape of described sealing frame, and be attached to the surface that silk screen scribbles emulsion, be placed in exposure in vacuum exposure machine, on the described film, non-graphic region can through UV light, emulsion is hardened, and graphics field emulsion state is constant;
(6) video picture: unhardened emulsion on cleaning half tone is also dried, and described half tone defines the figure of required sealing frame, obtained required silk screen;
(7) by described silk screen, be coated with described frit with screen printing mode in the position of described encapsulation cover plate (302) corresponding described OLED (304) on the surface, and form described sealing frame.
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| CN201410831196.9A CN104485426A (en) | 2014-12-26 | 2014-12-26 | OLED (organic light-emitting diode) package structure and package method |
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| CN201410831196.9A CN104485426A (en) | 2014-12-26 | 2014-12-26 | OLED (organic light-emitting diode) package structure and package method |
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Cited By (7)
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| CN105140420A (en) * | 2015-07-07 | 2015-12-09 | 深圳市华星光电技术有限公司 | OLED (organic light-emitting diode) display panel and packaging method thereof |
| CN106548987A (en) * | 2016-12-29 | 2017-03-29 | 长春海谱润斯科技有限公司 | Display floater and display floater encapsulation glue coating method |
| CN106784379A (en) * | 2016-12-29 | 2017-05-31 | 长春海谱润斯科技有限公司 | A kind of organic electroluminescence display panel and its manufacture method |
| CN107561748A (en) * | 2017-11-01 | 2018-01-09 | 深圳宇顺电子股份有限公司 | A kind of method for preventing transparent conductive glass fitting off normal |
| CN108511500A (en) * | 2018-05-07 | 2018-09-07 | 昆山国显光电有限公司 | Display screen, preparation method and display terminal |
| CN108630110A (en) * | 2018-04-24 | 2018-10-09 | 昆山国显光电有限公司 | Display screen and preparation method thereof, display device |
| CN111341732A (en) * | 2018-12-18 | 2020-06-26 | 天津大学 | Semiconductor device with sealing gasket reinforcement structure and electronic equipment having the same |
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| US9893311B2 (en) | 2015-07-07 | 2018-02-13 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | OLED display panel packaging with hydrophobic barricade corresponding to package cover enclosing OLED device and support enclosing hydrophobic barricade |
| CN106548987A (en) * | 2016-12-29 | 2017-03-29 | 长春海谱润斯科技有限公司 | Display floater and display floater encapsulation glue coating method |
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| CN107561748A (en) * | 2017-11-01 | 2018-01-09 | 深圳宇顺电子股份有限公司 | A kind of method for preventing transparent conductive glass fitting off normal |
| CN107561748B (en) * | 2017-11-01 | 2020-04-24 | 深圳市宇顺电子股份有限公司 | Method for preventing conductive transparent glass from deviation in fitting |
| CN108630110A (en) * | 2018-04-24 | 2018-10-09 | 昆山国显光电有限公司 | Display screen and preparation method thereof, display device |
| CN108630110B (en) * | 2018-04-24 | 2020-06-23 | 广州国显科技有限公司 | Display screen, manufacturing method thereof and display device |
| CN108511500A (en) * | 2018-05-07 | 2018-09-07 | 昆山国显光电有限公司 | Display screen, preparation method and display terminal |
| CN108511500B (en) * | 2018-05-07 | 2021-10-15 | 广州国显科技有限公司 | Display screen, preparation method thereof and display terminal |
| CN111341732A (en) * | 2018-12-18 | 2020-06-26 | 天津大学 | Semiconductor device with sealing gasket reinforcement structure and electronic equipment having the same |
| CN111341732B (en) * | 2018-12-18 | 2023-06-23 | 天津大学 | Semiconductor device with sealing gasket reinforcing structure and electronic equipment with same |
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