CN104465415A - Method for overcoming peeling defect - Google Patents

Abstract

The invention relates to the field of micro-electronics, in particular to a method for overcoming a peeling defect. The method comprises the steps that the surface of a protective ring is treated through the grinding technology and the cleaning technology, then a quartz film layer is electroplated on the surface of the protective ring after treatment, the roughness coefficient of the surface of the protective ring is increased, and the adhesive force generated between the surface of the protective ring and high-molecular polymer generated by etching is increased effectively. The peeling defect that the high-molecular polymer is peeled off along with increasing of RF time is overcome, the replacement frequency of the protective ring is reduced, and the service life of the protective ring is prolonged.

Description

A method for improving exfoliation defects

technical field

The invention relates to the field of microelectronics, in particular to a method for improving peeling defects. the

Background technique

In the etching process of the top passivation film in the field of microelectronics, plasma is usually used to etch the metal dielectric film. The principle is that the plasma reacts with the metal dielectric film to generate a polymer etching reaction polymer. The surface of the guard ring has a certain roughness coefficient, and there is van der Waals force between these polymer molecules, so the polymer produced by the etching process The polymer can adhere to the surface of the guard ring. the

However, as the etching time increases, these high molecular polymers will destroy the van der Waals force between them and the guard ring under the bombardment of the plasma, and this layer of high molecular polymer adhered to the surface of the guard ring will be in the plasma. It falls off under bombardment, forming particle pollution. Generally, when the RF (Radio Frequency, radio frequency, referred to as RF) reaches 80 hours, it will fall off, especially near the slit door (valve). These high-molecular reactive polymers cover the surface of the wafer, blocking the reaction of the plasma to the underlying film to generate defects, which are so-called exfoliation defects, which lead to device failure and reduce product yield. Therefore, how to increase the adhesion between the polymer and the protective ring to reduce the replacement frequency of the protective ring and prolong its service life has become a major problem faced by those skilled in the art. the

Contents of the invention

In view of the above problems, the present invention proposes a method for improving peeling defects. By electroplating a protective film layer on the surface of the guard ring, the adhesion between the guard ring and the etching polymer product generated during the etching process is increased, effectively avoiding With the increase of radio frequency time, the etching polymer product will fall off, thereby reducing the replacement frequency of the protection ring, reducing the peeling defects, and prolonging the service life of the protection ring. the

A method for improving exfoliation defects, wherein the method comprises:

Provide a quartz protection ring;

Carry out grinding process and cleaning process on the protective ring;

A layer of quartz film is prepared on the surface of the protective ring, the friction coefficient of the quartz film is larger than the surface roughness coefficient of the protective ring, so as to increase the adhesion of the protective ring. the

The above method, wherein the roughness coefficient of the surface of the quartz protection ring is 0.8 μm. the

In the above method, wherein the roughness coefficient of the quartz film layer is 2.6 μm. the

The above method, wherein, the step after the described grinding process and cleaning process also includes:

Test the roughness factor of the guard ring. the

The above method, wherein the quartz film layer is prepared by electroplating. the

In the above method, wherein, the material of the quartz film layer is the same as that of the surface of the guard ring. the

The above invention has the following advantages or beneficial effects:

The invention discloses a method for improving peeling-type defects. The surface of the protection ring is treated by a grinding process and a cleaning process, and then a layer of quartz film is electroplated on the surface of the treated protection ring to increase the roughness coefficient of the surface of the protection ring, thereby effectively Increase the adhesion between the surface of the protective ring and the polymer produced by etching, effectively avoid the peeling-off defects caused by the peeling of the polymer with the increase of RF time, thereby reducing the replacement frequency of the protective ring and prolonging the service life. The service life of the protective ring. the

Description of drawings

The invention and its characteristics, configurations and advantages will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings. Like numbers designate like parts throughout the drawings. The drawings may not be drawn to scale, emphasis instead being placed upon illustrating the gist of the invention. the

Fig. 1 is a flowchart of a method for improving exfoliation defects. the

Implementation method

The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention. the

In view of the above existing problems, the present invention discloses a method for improving peeling defects. By grinding and cleaning the surface of the protective ring, and then repeatedly testing the surface roughness coefficient of the protective ring, it is found that when the surface roughness coefficient of the protective ring is The peeling-off defect at 2.6 μm can be effectively improved. By electroplating a layer of quartz film on the surface of the guard ring, the roughness coefficient of the guard ring surface is increased, and the adhesion between the guard ring and the polymer produced by etching is effectively increased. , which effectively avoids the exfoliation defects caused by the peeling of the high molecular polymer produced during the etching process with the increase of RF time, thereby reducing the replacement frequency of the protection ring and prolonging the service life of the protection ring. The present invention will be further elaborated below in conjunction with the accompanying drawings. the

Referring to the structure shown in attached drawing 1, firstly, the protective ring is subjected to a grinding process and a cleaning process. It is inevitable that some tiny particles will appear during the grinding process. The cleaning process can effectively remove the tiny particles that appear during the grinding process, and at the same time clean the surface of the protective ring. other foreign bodies. the

After grinding and cleaning the surface of the protection ring, the roughness coefficient of the surface of the protection ring was tested repeatedly. Through repeated tests, it can be concluded that when the surface roughness coefficient of the protection ring is 2.6 μm, the spalling defects can be effectively improved. the

The surface roughness coefficient of the guard ring is 0.8 μm. With the increase of the RF time, the roughness coefficient of the guard ring surface of 0.8 μm will not be able to effectively prevent the polymer produced during the etching process from falling off the surface of the guard ring, thus forming For exfoliation defects, preferably, the high molecular polymer selected in the present invention is a fluorine-containing polymer. the

Prepare a quartz film layer on the surface of the protective ring by electroplating, so that the roughness coefficient of the surface of the protective ring increases from 0.8 μm to 2.6 μm. Among them, the surface material of the protective ring is also quartz, which facilitates the effective preparation of the protective film layer. to the surface of the protective ring. After the quartz layer is electroplated on the surface of the protection ring, the roughness coefficient of the surface of the protection ring is effectively increased, and the adhesion between the high molecular polymer produced in the etching process and the surface of the protection ring is effectively increased. the

In summary, the present invention discloses a method for improving peeling defects. By electroplating a quartz film layer on the surface of the guard ring, the roughness coefficient of the guard ring surface is increased from 0.8 μm to 2.6 μm, which effectively increases the The adhesion between the polymer produced during the etching process and the surface of the protection ring effectively avoids the occurrence of peeling defects, thereby reducing the replacement frequency of the protection ring and prolonging the service life of the protection ring. the

Those skilled in the art should understand that those skilled in the art can implement the variation example by combining the existing technology and the foregoing embodiments, and details are not described here. Such variations do not affect the essence of the present invention, and will not be repeated here. the

The preferred embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and the devices and structures that are not described in detail should be understood to be implemented in a common manner in the art; Within the scope of the technical solution of the invention, many possible changes and modifications can be made to the technical solution of the present invention by using the methods and technical content disclosed above, or be modified into equivalent embodiments with equivalent changes, which does not affect the essence of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention, which do not deviate from the content of the technical solution of the present invention, still belong to the scope of protection of the technical solution of the present invention. the

Claims (5)

1. A method for improving exfoliation defects, characterized in that the method comprises: Provide a quartz protection ring; Carry out grinding process and cleaning process on the protective ring; Test the roughness coefficient of the surface of the protection ring; A layer of quartz film is prepared on the surface of the protective ring, the friction coefficient of the quartz film is larger than the surface roughness coefficient of the protective ring, so as to increase the adhesion of the quartz protective ring. 2. The method according to claim 1, wherein the roughness coefficient of the surface of the quartz guard ring is 0.8 μm. 3. The method according to claim 1, wherein the roughness coefficient of the quartz film layer is 2.6 μm. 4. The method according to claim 1, characterized in that, the quartz film layer is prepared by electroplating. 5. The method according to claim 4, wherein the material of the quartz film layer is the same as that of the surface of the protective ring.