CN104461211B - A kind of 3D manufacture methods of resistive touch screen - Google Patents

Abstract

The invention relates to a 3D manufacturing method of a resistive touch screen, which is characterized in that it comprises the following steps: step 1: providing an upper substrate; step 2: providing a lower substrate; step 3: providing an insulating isolation layer; step 4: providing an Sealing the frame; step 5: aligning and laminating the upper substrate and the lower substrate; step 6: providing a conductive column; step 7: connecting the FPC with the touch IC chip to the first electrode by hot pressing and electrically connecting with the connecting pins of the second electrodes to form a final resistive touch screen. The present invention adopts the method of 3D manufacturing to manufacture the resistive touch screen, and the process is greatly simplified compared with the traditional method, which saves multiple complex processes such as exposure, development, and etching in the traditional process, and saves production raw materials and manufacturing costs.

Description

A kind of 3D manufacturing method of resistive touch screen

technical field

The invention relates to the field of manufacturing touch screens, in particular to a 3D printing manufacturing method for resistive touch screens.

Background technique

Touch screen is one of the main applications of touch sensing technology. As a new way of human-computer communication, it gradually occupies an important position in the new operation mode of electronic product input devices. It takes capturing the touch action information of human fingers as the basic starting point, converts the information of finger touch action into electrical signals and judges and recognizes them, making them equivalent to the "press" and release actions of traditional mechanical light touch buttons.

The manufacture of existing touch screens mostly uses technologies such as photolithography, printing and coating, among which photolithography and coating technologies require many processes. For example, photolithography includes multiple processes such as exposure, development, etching, and cleaning. It is relatively cumbersome, and it belongs to "subtractive manufacturing", which inevitably leads to waste of materials. Although the printing method overcomes the problem of material waste, the precision of the touch screen produced by it is not high, and the resolution is also low. These traditional processes require multiple yellow light and coating processes, and the devices are made by subtraction, which causes problems such as complex processes, yield, and waste of raw materials.

Contents of the invention

The object of the present invention is to overcome the deficiencies of the prior art, combine the advantages of 3D printing, and provide a 3D printing manufacturing method of a resistive touch screen.

Technical scheme of the present invention is:

A 3D manufacturing method for a resistive touch screen, comprising the following steps:

Step 1: Provide an upper substrate; the upper substrate includes a first glass substrate, a first conductive layer disposed on the visible area of the first glass substrate, a first electrode disposed on the edge of the first substrate, and a first electrode disposed on the first electrode A number of first conduction channels and a number of second conduction channels; wherein,

The first conductive layer is a transparent conductive layer composed of 3D printed one or several layers of conductive material;

The first electrode adopts a conductive layer composed of 3D printing one or several layers of metal conductive material;

Step 2: Provide a lower substrate; the lower substrate includes a second glass substrate, a second conductive layer disposed on the visible area of the second glass substrate, a second electrode, a third electrode, and a fourth electrode disposed on the edge of the second substrate ;in,

The second conductive layer is a transparent conductive layer composed of 3D printed one or several layers of conductive material;

The second electrode adopts a conductive layer formed by 3D printing one or several layers of metal conductive material;

The third electrode adopts a conductive layer composed of 3D printing one or several layers of metal conductive material;

The fourth electrode adopts a conductive layer composed of 3D printing one or several layers of metal conductive material;

Step 3: providing an insulating isolation layer; using 3D printing of one or several layers of insulating isolation columns on the surface of the lower substrate to form an insulating isolation layer;

Step 4: providing a frame; 3D printing one or more layers of insulating frame sealant around the lower substrate to form the frame seal;

Step 5: Aligning and laminating the upper substrate and the lower substrate;

Step 6: providing a conductive column; using 3D to manufacture one or several layers of metal conductive material in the first conduction channel and the second conduction channel to form a conductive column for connecting the third electrode and the the fourth electrode;

Step 7: Electrically connect the FPC with the touch IC chip to the connecting pins of the first electrode and the second electrode by hot pressing to form a final resistive touch screen;

Wherein, the specific steps of the 3D printing are as follows:

S11: sequentially design and generate a three-dimensional digital model of the first conductive layer, the first electrode, the second conductive layer, the second electrode, the third electrode, the fourth electrode, the isolation layer, the sealing frame and the conductive column of the resistive touch screen;

S12: Use software to sequentially layer the established three-dimensional models of the first conductive layer, the first electrode, the second conductive layer, the second electrode, the third electrode, the fourth electrode, the isolation layer, the sealing frame and the conductive column, Obtain the two-dimensional sublayer in the Z-axis direction;

S13: Import the two-dimensional sub-layer into the 3D printer program, obtain the material and shape on the two-dimensional plane of each layer according to the built model, and design the printing path;

S14: Put the glass substrate layer on the table of the 3D printing device, print the first conductive layer and the first electrode on the surface of the upper substrate in sequence, and print the second conductive layer, the second electrode, and the third electrode on the surface of the lower substrate in sequence , a fourth electrode, an isolation layer, a sealing frame and a conductive post.

Wherein, the structures of the plurality of first conduction channels and the second conduction channels are cylinders, cuboids, and cubes, which are formed by laser processing or mechanical drilling.

The first conductive layer and the second conductive layer are transparent conductive layers, and the structure of the transparent conductive layer is an ordered grid or a disordered grid, or a planar structure; the grid conductive The layer is made of transparent conductive material or non-transparent conductive material; the planar structure conductive layer is made of transparent conductive material.

The transparent conductive layer is composed of one or two or more of metal nanoparticles, metal quantum dots, metal oxides, graphene, carbon nanotubes, and metal nanowires.

The shapes of the first electrode, the second electrode, the third electrode and the fourth electrode are grid-like, strip-like and plane-like; the first electrode, the second electrode, the third electrode and the The fourth electrode can be a strip-shaped conductive layer composed of metal nanoparticles, metal quantum dots, metal paste, and carbon paste, or two or more of them.

The isolation layer is composed of several transparent isolation columns, the isolation columns are evenly spaced from left to right in the horizontal direction to form a horizontal row, and evenly spaced in the vertical direction to form a vertical column. The distance between adjacent spacers in the direction is 1-100 millimeters, the height of the spacers is 10-5000 microns, and the diameter is 10-3000 microns.

The sealing frame body is composed of opaque sealing glue, and the thickness of the sealing glue is greater than or equal to the height of the isolation column.

The conductive pillar may be a conductive layer composed of one or more of metal nanoparticles, metal quantum dots, metal paste, and carbon paste.

The 3D printing methods include stereolithography, selective laser sintering, fusion deposition manufacturing, three-dimensional printing and inkjet printing.

One touch screen or multiple touch screen arrays are printed on the same substrate, and the multiple touch screen arrays are separated by cutting.

The advantages of the present invention are:

The present invention adopts the method of 3D manufacturing to manufacture the resistive touch screen, and the process is greatly simplified compared with the traditional method, which saves multiple complex processes such as exposure, development, and etching in the traditional process, and saves production raw materials and manufacturing costs.

Description of drawings

Fig. 1 is a flowchart of a 3D manufacturing resistive touch screen provided by the present invention.

FIG. 2 is a schematic structural diagram of a 3D-manufactured resistive touch screen provided by the present invention.

FIG. 3 is a schematic plan view of a substrate on a 3D-manufactured resistive touch screen provided by the present invention.

FIG. 4 is a schematic plan view of a lower substrate of a 3D-manufactured resistive touch screen provided by the present invention.

detailed description

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

The present invention will be further described in detail through specific examples below.

Referring to Figures 1 to 4, the 3D manufacturing method of the resistive touch screen includes the following steps:

( S1 ) Provide an upper substrate 10 . The upper substrate 10 includes a first glass substrate 11, a first conductive layer 12 disposed on the visible area of the first glass substrate, a first electrode 13 disposed on the edge of the first substrate, and several electrodes disposed on the first electrode 13. A first conduction channel 14 and several second conduction channels 15 . Wherein, the first conductive layer 12 and the first electrode 13 can be realized by using 3D manufacturing technology, and the specific manufacturing steps are as follows:

( S11 ) Provide a glass substrate 11 . According to the design size, select a suitable glass substrate, place the glass substrate 110 in a cleaning solution with a volume ratio of Win-10: DI water = 3: 97, use an ultrasonic machine with a frequency of 32KHz to clean for 15 minutes, and spray for 2 minutes. , and then placed in a cleaning solution with a volume ratio of Win41: DI water = 5: 95, using an ultrasonic machine with a frequency of 40KHz to clean for 10 minutes, spraying and rinsing with circulating tap water for 2 minutes, and then using an ultrasonic machine with a frequency of 28KHz in DI pure water Wash for 10 minutes, dry with an air knife, and then place in a clean oven at 50°C for 30 minutes.

( S12 ) Fabrication of the first conductive layer 12 . Referring to FIG. 3 , the conductive layer 12 is a transparent conductive layer, and the structure of the transparent conductive layer is an ordered grid or a disordered grid, or a planar structure. The grid-shaped conductive layer is made of transparent conductive material or non-transparent conductive material; the planar conductive layer is made of transparent conductive material. The material of the transparent conductive layer includes one or two kinds of metal nanoparticles, metal quantum dots, metal oxides, graphene, carbon nanotubes, metal nanowires, or more than one of them. The first conductive layer can be prepared by laser sintering or melt extrusion molding, and can also be prepared by stereolithography, three-dimensional printing or inkjet printing of photosensitive materials. Among them, metal nanoparticles, metal quantum dots or metal oxides can be made by selective laser sintering or melt extrusion; metal quantum dots, graphene, carbon nanotubes, metal nanowires, metal oxide nanostructures can also be It is made by stereolithography, three-dimensional printing or three-dimensional inkjet printing of photosensitive materials.

In the present embodiment, selective laser sintering of metal nano-silver particles is preferred to make the grid-shaped transparent conductive first conductive layer 12, and the specific steps are as follows:

(S121) Design and generate a three-dimensional digital model of the first conductive layer 12 in the resistive touch screen;

(S122) Using software to sequentially layer the three-dimensional model of the established graphic transparent conductive layer 12, and determine the parameters of the ordered grid-shaped planar transparent conductive layer, including grid thickness, wire diameter and aperture; this implementation Preferably, the thickness of the metal grid lines of the planar conductive layer is 0.2 microns, the width of the metal grid lines is 3 microns, and the metal grid aperture is 8 microns;

(S123) importing the two-dimensional sub-layer into a 3D printer program, obtaining the material and shape of each layer on a two-dimensional plane according to the built model, and designing a printing path;

(S124) Put the above glass substrate layer on the table of the 3D printing device, and print the first conductive layer 12 . The specific principle is as follows: Use the powder spreading roller equipment to uniformly transfer the metallic silver nanoparticles to the visible area on the surface of the glass substrate along the horizontal direction, control the laser beam so that the sintering temperature is the melting temperature of the metallic silver nanoparticles, and the laser head moves along the set direction. Moving, the high-energy laser beam emitted by the laser irradiates the metal silver nanoparticle powder on the surface of the substrate, and melts the silver nanoparticle on its scanning path; repeat the above process to obtain the required patterned transparent conductive layer 12 .

(S125) Substrate surface treatment. The finished substrate is removed from the 3D printing equipment, and the surface and interior of the array are cleaned, including excess metal copper nanoparticles remaining on the surface of the substrate during spray printing and laser sintering.

( S13 ) Fabrication of the first electrode 13 . Referring to Fig. 3, the shape of the first electrode is grid, strip, planar or other patterns; the first electrode can be made of one or two kinds of metal nanoparticles, metal quantum dots, metal paste, carbon paste And the strip structure conductive layer formed by compounding above. The first electrode can be prepared by selective laser sintering or melt extrusion molding, and can also be prepared by stereolithography, three-dimensional printing or three-dimensional inkjet printing of photosensitive materials; wherein, metal nanoparticles and metal quantum dots can be It is made by selective laser sintering or melt extrusion molding; metal quantum dots, metal paste, and carbon paste can also be made by stereolithography, three-dimensional printing or three-dimensional inkjet printing of photosensitive materials

In this embodiment, it is preferable to three-dimensionally print metallic silver quantum dots to make the first electrode 13 of a strip structure, and the specific steps are as follows:

(S131) Design and generate a three-dimensional digital model of the first electrode 130 in the resistive touch screen;

(S132) Use software to sequentially layer the established three-dimensional model of the second connecting electrode 160 to determine the structural parameters of the first electrode 13, including electrode thickness, width and the distance between adjacent electrodes; The width of the conductive layer is 150um, and the distance between adjacent strip-shaped conductive layers is 80um; the thickness of the metal forming each strip-shaped conductive layer is 250nm. ;

(S133) importing the two-dimensional sub-layer into a 3D printer program, obtaining the material and shape of each layer on a two-dimensional plane according to the built model, and designing a printing path;

(S134) Put the glass substrate layer on the table of the 3D printing device, and print the first electrode 13 . The specific principle is as follows: the metal silver quantum dots are sent out from the storage barrel, and then a roller is used to spread a thin layer of metal silver quantum dots around the glass substrate 11, and the 3D printing nozzle slices according to the computer model The final defined contour is sprayed with adhesive to adhere to the metallic silver quantum dots; after one layer is completed, the processing table is automatically lowered a little, the storage tank is raised a little, and the above process is repeated to obtain the required first electrode 13 .

(S135) The finished substrate is removed from the 3D printing device, and the surface and interior of the array are cleaned, including excess metallic silver quantum dots remaining on the surface of the substrate during the spray printing molding process. ,

( S14 ) Fabricating the first conduction channel 14 and the second conduction channel 15 . Referring to FIG. 3 , the structures of the plurality of first conducting channels 14 and the second conducting channels 15 can be cylinders, cuboids, cubes or other patterns, which can be formed by laser processing or mechanical drilling. In this example, the first conduction channel 14 and the second conduction channel 15 are preferably laser-processed into a cube structure, and the specific steps are as follows:

(S141) Designing structural parameters of the first conduction channel 14 and the second conduction channel 15, including the number of the first conduction channel 14, the size of the conduction channel, and the distance between the conduction channels. Spacing, the number of the second conduction channels 15, the size of the conduction channels, the distance between the conduction channels and the conduction channels;

( S142 ) Select a suitable laser, control laser energy, and laser process to form the first conduction channel 14 and the second conduction channel 15 .

(S2) The following substrate 20 is provided. The lower substrate 20 includes a second glass substrate 21, a second conductive layer 22 disposed on the visible area of the second glass substrate 21, a second electrode 23, a third electrode 24 and a fourth electrode 25 disposed on the edge of the second substrate . Wherein, the second conductive layer 22, the second electrode 23, the third electrode 24 and the fourth electrode 25 can be realized by using 3D manufacturing technology, and the specific manufacturing steps are as follows:

( S21 ) Provide a glass substrate 11 . According to the design size, select a suitable glass substrate, place the glass substrate 110 in a cleaning solution with a volume ratio of Win-10: DI water = 3: 97, use an ultrasonic machine with a frequency of 32KHz to clean for 15 minutes, and spray for 2 minutes. , and then placed in a cleaning solution with a volume ratio of Win41: DI water = 5: 95, using an ultrasonic machine with a frequency of 40KHz to clean for 10 minutes, spraying and rinsing with circulating tap water for 2 minutes, and then using an ultrasonic machine with a frequency of 28KHz in DI pure water Wash for 10 minutes, dry with an air knife, and then place in a clean oven at 50°C for 30 minutes.

( S22 ) Fabrication of the second conductive layer 22 . Referring to FIG. 4 , the conductive layer 22 is a transparent conductive layer, and the structure of the transparent conductive layer is an ordered grid or a disordered grid, or a planar structure. The grid-shaped conductive layer is made of transparent conductive material or non-transparent conductive material; the planar conductive layer is made of transparent conductive material. The material of the transparent conductive layer includes one or two kinds of metal nanoparticles, metal quantum dots, metal oxides, graphene, carbon nanotubes, metal nanowires, or more than one of them. The first conductive layer can be prepared by laser sintering or melt extrusion molding, and can also be prepared by stereolithography, three-dimensional printing or inkjet printing of photosensitive materials. Among them, metal nanoparticles, metal quantum dots or metal oxides can be made by selective laser sintering or melt extrusion; metal quantum dots, graphene, carbon nanotubes, metal nanowires, metal oxide nanostructures can also be It is made by stereolithography, three-dimensional printing or three-dimensional inkjet printing of photosensitive materials. In this embodiment, selective laser sintering of metal nano-silver particles is preferred to fabricate the grid-shaped transparent conductive first conductive layer 22 , and the specific steps are consistent with ( S12 ).

( S23 ) Fabrication of the second electrode 23 , the third electrode 24 and the fourth electrode 25 . Referring to Fig. 4, the shape of the second electrode 23, the third electrode 24 and the fourth electrode 25 is grid-like, strip-like, planar or other patterns; the first electrode can be made of metal nanoparticles, metal quantum dots, A conductive layer with a strip structure formed by compounding one or more of metal paste and carbon paste. The second electrode 23, the third electrode 24, and the fourth electrode 25 can be prepared by selective laser sintering or melt extrusion molding, or by stereolithography, three-dimensional printing or three-dimensional inkjet printing of photosensitive materials. Among them, metal nanoparticles and metal quantum dots can be made by selective laser sintering or melt extrusion; metal quantum dots, metal paste, and carbon paste can also be formed by stereolithography and three-dimensional printing of photosensitive materials. Or three-dimensional inkjet printing, and the cost embodiment is preferably three-dimensional printing metal silver quantum dots to make the second electrode 23, third electrode 24 and fourth electrode 25 of the strip structure, and the specific steps are consistent with the step (S23).

(S3) Fabrication of the isolation layer. The isolation layer is composed of several transparent isolation columns 30, the isolation columns 30 are evenly spaced from left to right in the horizontal direction to form a horizontal row, and evenly spaced in the vertical direction to form a vertical column. The distance between adjacent spacers 30 in the vertical direction is 1-100 mm, the height of the spacers is 10-5000 microns, and the diameter is 10-3000 microns. The spacer 30 can be fabricated by selective laser sintering or fusing transparent medium.

In the present invention, the laser sintered polyethylene particles are preferably made into the transparent isolation column 30 . Specific steps are as follows:

(S31) Design and generate a three-dimensional digital model of the isolation column 30 in the resistive touch screen;

(S32) Using software to sequentially layer the established three-dimensional model of the isolation column 30, and determine the structural parameters of the isolation column 30, including the height, diameter, and distance between adjacent isolation columns of the isolation column 30;

(S33) importing the two-dimensional sub-layer into a 3D printer program, obtaining the material and shape of each layer on a two-dimensional plane according to the built model, and designing a printing path;

(S34) Transfer of polyethylene particles. Use the powder spreading roller equipment to evenly transfer the polyethylene particles to the substrate surface in the horizontal direction, or use the nozzle in the additive equipment (3D printing) to move along its scanning path (the wire diameter direction of the metal grid) to evenly coat the polyethylene particles On the surface of the substrate; in this implementation, it is preferred that the powder spreading roller equipment evenly transfer the polyethylene particles to the surface of the substrate along the horizontal direction.

(S35) The polyethylene particles are melted. Control the laser beam so that the sintering temperature is 132°C, the laser head moves along the set planar direction, and the high-energy laser emitted by the laser irradiates the polyethylene particles on the surface of the substrate and melts the polyethylene particles on the scanning path. Polyethylene particles stick to the substrate after melting;

(S36) Steps (S34) and (S35) are repeated to form the required isolation column 30 .

(S37) The finished substrate is removed from the 3D printing device, and the surface and interior of the array are cleaned, including excess polyethylene particles remaining on the surface of the substrate during laser sintering.

(S4) Fabrication of the sealing frame body 40 . The sealing frame body can be formed by 3D printing opaque sealing glue, and the thickness of the sealing glue is greater than or equal to the height of the isolation column 30 .

(S5) Align and fit. The upper substrate 10 and the lower substrate 20 are aligned, and bonded by thermocompression.

( S6 ) Fabrication of the conductive pillar 50 . The conductive pillars 50 can be fabricated by stereolithography, selective laser sintering, fused deposition manufacturing, three-dimensional printing or inkjet printing of metal nanoparticles, metal quantum dots, metal paste, carbon paste, or two or more of them. become.

In this embodiment, inkjet printing nano-silver electronic ink is preferred to make conductive pillars 50, and the specific experimental steps are as follows:

(S61) Design and generate a three-dimensional digital model of the conductive column 50 in the resistive touch screen;

(S62) Using software to sequentially layer the established three-dimensional model of the conductive pillar 50 to obtain two-dimensional sub-layers in the Z-axis direction;

(S63) importing the two-dimensional sub-layer into a 3D printer program, obtaining the material and shape of each layer on a two-dimensional plane according to the built model, and designing a printing path;

(S64) Put the above glass substrate layer on the table of the 3D printing device, and print the conductive pillars 50 . The specific principle is as follows: disperse nano-silver particles into the solution to prepare nano-silver electronic ink for 3D printing, move the electronic ink into the liquid storage tank, and print the nano-silver electronic ink on the first conduction channel through the inkjet printing micro print head 14 and the second conduction channel 15 are dried at a low temperature to remove the solvent, and then annealed, and the above process is repeated to form the desired conductive pillar 50 .

(S65) The finished substrate is removed from the 3D printing device, and the surface and interior of the array are cleaned, including excess electronic ink remaining on the surface of the substrate during spray printing and annealing.

(S7) The FPC is pressed together with the electrode pins. The FPC60 with the touch IC chip is electrically connected to the pins of the first electrode 13 and the second electrode 23 by hot pressing to form a final resistive touch screen, as shown in FIG. 2 .

So far, the 3D printing manufacturing method of a resistive touch screen according to the first preferred embodiment of the present invention is completed.

The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the present invention.

Claims (10)

1. A3D manufacturing method of a resistive touch screen is characterized by comprising the following steps:

step 1: providing an upper substrate; the upper substrate comprises a first glass substrate, a first conducting layer arranged in a visible area of the first glass substrate, a first electrode arranged at the edge of the first substrate, a plurality of first conduction channels and a plurality of second conduction channels arranged on the first electrode; wherein,

the first conducting layer is a transparent conducting layer formed by 3D printing one or a plurality of layers of conducting materials;

the first electrode is a conducting layer formed by 3D printing one or a plurality of layers of metal conducting materials;

step 2: providing a lower substrate; the lower substrate comprises a second glass substrate, a second conducting layer arranged in a visible area of the second glass substrate, a second electrode arranged at the edge of the second substrate, a third electrode and a fourth electrode; wherein,

the second conducting layer is a transparent conducting layer formed by 3D printing one or a plurality of layers of conducting materials;

the second electrode is a conducting layer formed by 3D printing one or a plurality of layers of metal conducting materials;

the third electrode is a conducting layer formed by 3D printing one or a plurality of layers of metal conducting materials;

the fourth electrode is a conducting layer formed by 3D printing one or a plurality of layers of metal conducting materials;

and step 3: providing an insulating isolation layer; 3D printing one or more layers of insulating isolation columns on the surface of the lower substrate to form an insulating isolation layer;

and 4, step 4: providing a sealing frame body; printing one or more layers of insulating frame sealing glue on the periphery of the lower substrate in a 3D mode to form the frame sealing body;

and 5: the upper substrate is aligned and attached to the lower substrate;

step 6: providing a conductive column; a conductive column made of one or more layers of metal conductive materials is/are manufactured in the first conduction channel and the second conduction channel in a 3D mode and used for connecting the third electrode and the fourth electrode;

and 7: electrically connecting the FPC with the touch IC chip with the connecting pins of the first electrode and the second electrode through hot pressing to form a final resistance-type touch screen;

the 3D printing method comprises the following specific steps:

s11: sequentially designing and generating a three-dimensional digital model of a first conducting layer, a first electrode, a second conducting layer, a second electrode, a third electrode, a fourth electrode, an isolating layer, a sealing frame body and a conducting column of the resistive touch screen;

s12: sequentially layering the established three-dimensional models of the first conducting layer, the first electrode, the second conducting layer, the second electrode, the third electrode, the fourth electrode, the isolating layer, the sealing frame body and the conducting column by using software to obtain a two-dimensional sublayer in the Z-axis direction;

s13: importing the two-dimensional sub-layers into a 3D printer program, obtaining materials and shapes on two-dimensional planes of each layer according to the established model, and designing a printing path;

s14: and placing the glass substrate layer on a table board of a 3D printing device, printing the first conducting layer and the first electrode on the surface of the upper substrate in sequence, and printing the second conducting layer, the second electrode, the third electrode, the fourth electrode, the isolating layer, the sealing frame body and the conducting column on the surface of the lower substrate in sequence.

2. The 3D manufacturing method of the resistive touch screen according to claim 1, wherein the plurality of first conduction channels and the plurality of second conduction channels are cylinders, cuboids, or cubes, and are formed by laser processing or mechanical drilling.

3. The 3D manufacturing method of the resistive touch screen according to claim 1, wherein the first conductive layer and the second conductive layer are transparent conductive layers, and the structure of the transparent conductive layers is an ordered grid or an unordered grid, or a planar structure; the grid-shaped conducting layer is made of transparent conducting materials or non-transparent conducting materials; the planar structure conducting layer is made of transparent conducting materials.

4. The 3D manufacturing method of the resistive touch screen according to claim 3, wherein the transparent conductive layer comprises one or more of metal nanoparticles, metal quantum dots, metal oxides, graphene, carbon nanotubes, and metal nanowires.

5. The 3D manufacturing method of the resistive touch screen according to claim 1, wherein the first electrode, the second electrode, the third electrode and the fourth electrode are in a shape of a grid, a strip or a surface; the first electrode, the second electrode, the third electrode and the fourth electrode can be strip-shaped conductive layers formed by compounding one or two or more of metal nanoparticles, metal quantum dots, metal slurry and carbon slurry.

6. The 3D manufacturing method of a resistive touch screen according to claim 1, wherein the isolation layer is composed of a plurality of transparent isolation columns, the isolation columns are uniformly arranged from left to right in a horizontal direction at intervals to form a horizontal row, the isolation columns are uniformly arranged in a vertical direction at intervals to form a vertical column, the distance between adjacent isolation columns in the horizontal direction and the vertical direction is 1-100 mm, the height of each isolation column is 10-5000 microns, and the diameter of each isolation column is 10-3000 microns.

7. The 3D manufacturing method of the resistive touch screen according to claim 1, wherein the frame sealing body is made of opaque frame sealing glue, and the thickness of the frame sealing glue is greater than or equal to the height of the isolation pillars.

8. The 3D manufacturing method of a resistive touch screen according to claim 1, wherein the conductive pillar is a conductive layer formed by combining one or two or more of metal nanoparticles, metal quantum dots, metal paste, and carbon paste.

9. The 3D manufacturing method of the resistive touch screen according to claim 1, wherein the 3D printing method comprises stereolithography, selective laser sintering, fused deposition manufacturing, three-dimensional printing and inkjet printing.

10. The 3D method of claim 1, wherein one or more touch screen arrays are printed on a same substrate, and the touch screen arrays are separated by cutting.