CN104460072B - Substrate apparatus for baking - Google Patents
Substrate apparatus for baking Download PDFInfo
- Publication number
- CN104460072B CN104460072B CN201410856601.2A CN201410856601A CN104460072B CN 104460072 B CN104460072 B CN 104460072B CN 201410856601 A CN201410856601 A CN 201410856601A CN 104460072 B CN104460072 B CN 104460072B
- Authority
- CN
- China
- Prior art keywords
- substrate
- adhesion layers
- baking
- cover
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 67
- 239000000463 material Substances 0.000 claims description 7
- 229920000728 polyester Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 239000002904 solvent Substances 0.000 abstract description 30
- 230000008021 deposition Effects 0.000 abstract description 19
- 239000003517 fume Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract description 4
- 239000007789 gas Substances 0.000 description 10
- 239000004809 Teflon Substances 0.000 description 5
- 229920006362 Teflon® Polymers 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000049 pigment Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000012296 anti-solvent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Drying Of Solid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The present invention relates to a kind of substrate apparatus for baking, and it includes the cavity for being used to place substrate with cover assembly, and the inwall of cover assembly is provided with anti-adhesion layers.In baking process, solvent volatilizees and produces solvent fumes in the cavity of substrate apparatus for baking substrate.And by setting anti-adhesion layers in the inwall of cover assembly, it is deposited on avoiding or reducing smog on the cover assembly of substrate apparatus for baking.So as to, the quality for the substrate being baked ensure that by the substrate apparatus for baking of this set, avoid as smog deposition and caused by substrate flatness difference the defects of.
Description
Technical field
The present invention relates to a kind of apparatus for baking, more particularly, to a kind of substrate apparatus for baking.
Background technology
In liquid crystal display manufacture craft, it is included in deposition film on clean glass substrate, and substrate is carried out
The process such as exposed and developed.And be smoothed out in order to exposed and developed, it is necessary to the substrate for having film to deposition carries out prebake conditions,
So that the solvent remained in photoresistance film to be forced to evaporate.
In the prior art, substrate is heated frequently with baking machine, the solvent in photoresistance film is volatilized.However, in base
In plate thermal histories, substantial amounts of solvent volatile fume is produced in the cavity of baking machine.And this smog can be in the chamber of baking machine
Deposition is produced in body, so as to influence to put the yield of product.For example, the deposition of this solvent easily causes the poor flatness of substrate.
Especially, as the resolution ratio more and more higher of liquid crystal display device, the particle of photoresistance pigment used are also less and less.And it is guarantor
The scattered of the particle of photoresistance pigment is demonstrate,proved, often increases blender and photochemical dose into photoresistance pigment.This sample loading mode adds baking
The degree of a large amount of smog is produced in the cavity of machine, more detrimental effect is produced to the substrate heated.
In summary, it is necessary to design a kind of substrate apparatus for baking, to reduce the deposition of solvent wherein.
The content of the invention
For the above-mentioned technical problem in the presence of prior art, the present invention proposes a kind of substrate apparatus for baking, this
Substrate apparatus for baking can reduce or avoid the deposition of solvent fumes wherein, so as to ensure that the quality of toasted substrate.
A kind of substrate apparatus for baking is proposed according to the present invention, it includes the chamber for being used to place substrate with cover assembly
Body, the inwall of cover assembly are provided with anti-adhesion layers.
In baking process, solvent volatilizees and produces solvent fumes in the cavity of substrate apparatus for baking substrate.And pass through
Anti-adhesion layers are set in the inwall of cover assembly, are deposited on avoiding or reducing smog on the cover assembly of substrate apparatus for baking.
So as to ensure that the quality for the substrate being baked by the substrate apparatus for baking of this set, avoid and deposited and made by smog
Into substrate flatness difference the defects of.
In a detailed embodiment, anti-adhesion layers are configured to be attached to the film on the inwall of cover assembly.It is preferred that
Ground, anti-adhesion layers are arranged on the inwall of cover assembly by way of pad pasting or plated film.It is further preferred that anti-adhesion layers
Thickness is 0.2-2 millimeters.The deposition solvent on cover assembly is just avoided that or reduces in this way, so as to ensure substrate
Crudy.And the mode of production of pad pasting or plated film is simple, be advantageous to promote.
In a detailed embodiment, cover assembly with anti-adhesion layers identical material by being made.Preferably, upper lid
Component manufactures with anti-adhesion layers for integral type.This mode is equally avoided that or reduced the deposition solvent on cover assembly, so as to
Ensure the crudy of substrate.
In a detailed embodiment, cover assembly includes top cover and the middle cover positioned at the inner side of top cover, and middle cover is removable
The formula of unloading is arranged in the side wall of cavity, and anti-adhesion layers are configured to be arranged on the film on the inwall of middle cover.By this set side
Formula, the solvent of volatilization may act on the inner surface of middle cover, and due to being provided with diaphragm type anti-adhesion layers, so as to avoid
Or reduce the deposition on middle cover.Even if the substrate apparatus for baking has solvent to sink after long-time Reusability on middle cover
Product, can also be cleaned by way of dismantling middle cover or film is changed to it, to ensure to reuse.
In a detailed embodiment, cover assembly includes top cover and the middle cover positioned at the inner side of top cover, and middle cover is removable
The formula of unloading is arranged on the side wall of cavity, and middle cover with anti-adhesion layers identical material by being made.Preferably, middle cover is with anti-adhesion layers
Integral type manufactures.By this setup, the solvent of volatilization may act on the inner surface of middle cover, and due to middle cover with it is anti-stick
Attached layer manufactures for integral type, so as to avoid or reduce deposition of the solvent on middle cover.Even if the substrate apparatus for baking through it is long when
Between after Reusability, have solvent deposition on middle cover, it can also be cleaned by way of dismantling middle cover, to ensure
Recycling.
In a detailed embodiment, anti-adhesion layers are provided with the inside of the side wall of cavity.In baking substrate mistake
Cheng Zhong, deposition of the solvent fumes in the inner surface of the side wall of cavity is avoided in this way, more ensure that baking base
The quality of plate.
Preferably, anti-adhesion layers are made up of Teflon resin or PET polyester.
In a detailed embodiment, in addition to the gas flow component with air supply pipe and blast pipe, air supply pipe and
Blast pipe connects with cavity and is arranged on the two opposite sides of cavity.Stable gas is formed in cavity by this setup
, so that the solvent of volatilization is carried over from blast pipe, remained in so as to avoid or reduce solvent fumes in the side wall of cavity.
Compared with prior art, it is an advantage of the current invention that anti-adhesion layers are set by the inwall in cover assembly, to keep away
Exempt from or reduce smog to be deposited on the cover assembly of substrate apparatus for baking.So as to be protected by the substrate apparatus for baking of this set
Demonstrate,proved the quality for the substrate being baked, avoid as smog deposition and caused by substrate flatness difference the defects of.In addition, this knot
The substrate apparatus for baking of structure is simple in construction, is easy to manufacture.
Brief description of the drawings
The preferred embodiments of the present invention are described in detail below in conjunction with accompanying drawing.In figure：
Fig. 1 shows the stereogram of the substrate apparatus for baking according to the present invention.
Fig. 2 shows one embodiment of the A-A sectional views from Fig. 1.
Fig. 3 shows another embodiment of the A-A sectional views from Fig. 1.
In the accompanying drawings, identical part uses identical reference.Accompanying drawing is not drawn according to the ratio of reality.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described.
Fig. 1 schematically shows the stereogram of the substrate apparatus for baking 50 according to the present invention.As shown in Figure 1,2 and 3, base
Plate apparatus for baking 50 includes being used for the cavity 1 for placing substrate.Cavity 1 has cover assembly 2, and the inwall of cover assembly 2 is set
It is equipped with anti-adhesion layers 3.After substrate is put into cavity 1, heated baking is carried out to substrate.Substrate is in thermal histories, its light
Solvent in resistance film volatilizees and produces smog in cavity 1.And due to setting anti-adhesion layers 3 in the inwall of cover assembly 2, so as to
Avoid or reduce smog being deposited on cover assembly 2.Thus, it ensure that and dried by the substrate apparatus for baking 100 of this set
The quality of roasting substrate, avoid as smog be deposited on cover assembly 2 and caused by substrate flatness difference the defects of.
Preferably, anti-adhesion layers 3 are made up of Teflon resin or PET polyester.Anti-adhesion layers 3 make use of Teflon resin and
The good resistance to bond of PET polyester, resistant to chemical etching and heat-resisting quantity.In addition, Teflon resin and PET polyester materials are easily given birth to
It is simple into anti-adhesion layers 3, processing.
In a detailed embodiment, as shown in Fig. 2 cover assembly 2 only includes top cover 21.And anti-adhesion layers 3 can be with
It is configured to the film being attached on the inwall of top cover 21.Solvent is in volatilization process, the inwall of the gas contact top cover 21 of volatilization
Surface.And the anti-adhesion layers 3 of diaphragm type avoid or reduced deposition of the solvent on top cover 21.
For cost-effective or convenient disassembly, in embodiments of the invention, anti-adhesion layers 3 can be arranged on by way of pad pasting
On the inwall of top cover 21.For example, anti-adhesion layers 3 can be configured to glue diaphragm type " anti-adhesion layers ", its one side is provided with energy will be anti-stick
Attached layer 3 is bonded in the goo on the inwall of top cover 21.So, pad pasting operation quickly can be carried out to top cover 21, moreover it is possible to easily
Anti-adhesion layers 3 are changed to adapt to the long-term use of substrate apparatus for baking 50.
Anti-adhesion layers 3 are arranged on the inwall of top cover 21 by the way of plated film, and feasible.Such setting
Mode, it is more solid and reliable on the inwall of top cover 21 to ensure that anti-adhesion layers 3 are formed.Simply formation process is slightly cumbersome.
Top cover 21 can also be by being made with the identical material of anti-adhesion layers 3.Preferably, top cover 21 and anti-adhesion layers 3 are equal
It is made up of Teflon resin or PET polyester integral types.This setup is equally avoided that or reduced the solvent of volatilization in top cover
Deposited on 21, so as to ensure the crudy of substrate.Also, the top cover 21 with this structure processes simply, it is easy to real
It is existing.
In order to easily clean or change anti-adhesion layers 3, in another embodiment, as shown in figure 3, pushing up
The inner side of lid 21 is provided with middle cover 22.It is, cover assembly 2 includes top cover 21 and the middle cover 22 positioned at the inner side of top cover 21.
The middle cover 22 is detachable to be arranged in the side wall of cavity 1.Thus, in cavity 1, after solvent volatilization, middle cover 22 is directly contacted
Inner wall surface.Anti-adhesion layers 3 can be configured to the film being arranged on the inwall of middle cover 22.Certainly, middle cover 22 and anti-adhesion layers 3
It can also be manufactured from the same material.That is the manufacture integrated with anti-adhesion layers 3 of middle cover 22.Pass through this setup, the solvent of volatilization
The inner wall surface of middle cover 22 is may act on, and due to the presence of anti-adhesion layers 3, so as to avoid or reduce on the inwall of middle cover 22
Deposition.Even if the substrate apparatus for baking 50 has solvent deposition after long-time Reusability on middle cover 22, can also pass through
The mode of middle cover 22 is dismantled, it is cleaned or changed, to ensure that it is long-term use of that substrate apparatus for baking 50 repeats.
To ensure the quality of anti-adhesion layers 3, and give full play to the effect of its anti-solvent deposition.In a preferred embodiment
In, the thickness of the anti-adhesion layers 3 of diaphragm type may be configured as 0.2-2 millimeters.For example, the thickness of the anti-adhesion layers 3 of diaphragm type can be set
It is set to 1 millimeter.
Anti-adhesion layers 3 are provided with the inside of the side wall of cavity 1.This anti-adhesion layers 3 can be configured to film-form.Toasting
During substrate, deposition of the solvent fumes in the side wall inner surfaces of cavity 1 is avoided in this way, so as to more ensure that
The quality of the substrate toasted.
Substrate apparatus for baking 50 can be configured to cuboid.But substrate apparatus for baking 50 is not limited to this structure, may be used also
To be configured to other structures, for example, cone etc..
Substrate apparatus for baking 50 also includes gas flow component 5.Gas flow component 5 has air supply pipe 51 and blast pipe
52, both of which connects with the chamber of cavity 1, and is arranged on the two side of cavity 1.Wherein, air supply pipe 51 is used for and gas source (figure
Not shown in) connection, and blast pipe 52 is used to be connected with gas returnable (not shown).By air supply pipe 51 to cavity
Gas is conveyed in 1, the gas of the solvent with volatilization is discharged cavity 1 by blast pipe 52.Thus, air supply pipe 51 and row are passed through
Tracheae 52 forms stable gas field in cavity 1, and the solvent of volatilization is taken away, is advantageous to avoid dissolvent residual in cavity 1
Inwall on.
It should be understood that substrate apparatus for baking 50 also includes miscellaneous part, and these parts and its assembling structure are these
Known to the technical staff in field.For simplicity, repeat no more here.
The preferred embodiment of the present invention is the foregoing is only, but the scope of the present invention is not limited thereto, Ren Heben
The technical staff in field easily can be changed or change in technical scope disclosed by the invention, and this change or change
Change should be all included within the scope of the present invention.Therefore, protection scope of the present invention should be with the protection model of claims
Enclose and be defined.
Claims (8)
1. a kind of substrate apparatus for baking, it is characterised in that including the cavity for being used to place the substrate with cover assembly, institute
The inwall for stating cover assembly is provided with anti-adhesion layers；
The cover assembly includes top cover and the middle cover positioned at the inner side of the top cover, the middle cover is detachable be arranged on it is described
In the side wall of cavity, the anti-adhesion layers are configured to the film being arranged on the inwall of the middle cover, in the side wall of the cavity
Inner side be provided with anti-adhesion layers.
2. substrate apparatus for baking according to claim 1, it is characterised in that the anti-adhesion layers are configured to be attached to described
Film on the inwall of cover assembly.
3. substrate apparatus for baking according to claim 2, it is characterised in that the anti-adhesion layers pass through pad pasting or plated film
Mode is arranged on the inwall of the cover assembly.
4. substrate apparatus for baking according to claim 3, it is characterised in that the thickness of the anti-adhesion layers is 0.2-2 millis
Rice.
5. substrate apparatus for baking according to claim 1, it is characterised in that the cover assembly by with the anti-adhesion layers
Identical material and be made.
6. substrate apparatus for baking according to claim 1, it is characterised in that the cover assembly includes top cover and positioned at institute
The middle cover of the inner side of top cover is stated, the middle cover is detachable to be arranged in the side wall of the cavity, and the middle cover with described by resisting
Adhesion layer identical material and be made.
7. the substrate apparatus for baking according to any one of claim 1 to 6, it is characterised in that the anti-adhesion layers are by spy
Fluorine dragon resin or PET polyester are made.
8. substrate apparatus for baking according to claim 1, it is characterised in that also include the gas with air supply pipe and blast pipe
Body flow component, the air supply pipe and the blast pipe connect with the cavity and are separately positioned on the two relative of the cavity
Side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410856601.2A CN104460072B (en) | 2014-12-31 | 2014-12-31 | Substrate apparatus for baking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410856601.2A CN104460072B (en) | 2014-12-31 | 2014-12-31 | Substrate apparatus for baking |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104460072A CN104460072A (en) | 2015-03-25 |
| CN104460072B true CN104460072B (en) | 2018-01-05 |
Family
ID=52906372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410856601.2A Active CN104460072B (en) | 2014-12-31 | 2014-12-31 | Substrate apparatus for baking |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104460072B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105116570A (en) * | 2015-09-15 | 2015-12-02 | 武汉华星光电技术有限公司 | Glass substrate baking device |
| CN105458964B (en) * | 2015-12-10 | 2017-06-23 | 重庆茂江低空交通科技有限公司 | Vehicle glass bakes film device |
| CN106773560A (en) * | 2016-12-07 | 2017-05-31 | 武汉华星光电技术有限公司 | Substrate apparatus for baking |
| CN106643028A (en) * | 2016-12-15 | 2017-05-10 | 武汉华星光电技术有限公司 | Baking device |
| CN107561747A (en) * | 2017-10-12 | 2018-01-09 | 惠科股份有限公司 | Pre-baking device and pre-baking system of display substrate |
| CN109534686A (en) * | 2018-12-04 | 2019-03-29 | 武汉华星光电半导体显示技术有限公司 | Baking box |
| CN109581709B (en) * | 2019-01-04 | 2021-07-06 | Tcl华星光电技术有限公司 | Baking device |
| CN110128033A (en) * | 2019-05-23 | 2019-08-16 | 深圳市华星光电技术有限公司 | A kind of roasting plant |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1212380A (en) * | 1997-09-19 | 1999-03-31 | 松下电器产业株式会社 | Method and apparatus for manufacturing liquid crystal panel |
| CN1428817A (en) * | 2001-12-12 | 2003-07-09 | 株式会社半导体能源研究所 | Film forming device and film forming method, and cleaning method |
| CN2582742Y (en) * | 2002-11-29 | 2003-10-29 | 舒永兴 | Foam centrifugal spraying drying pelletizer |
| CN1584110A (en) * | 2003-08-06 | 2005-02-23 | 爱发科股份有限公司 | Device and method for manufacturing thin films |
| CN1781614A (en) * | 2004-11-29 | 2006-06-07 | 精工爱普生株式会社 | Reduced pressure drying apparatus |
| CN101008547A (en) * | 2007-01-30 | 2007-08-01 | 友达光电股份有限公司 | Apparatus for baking a substrate |
| CN101252079A (en) * | 2007-01-26 | 2008-08-27 | 东京毅力科创株式会社 | Substrate processing apparatus |
| CN101369521A (en) * | 2007-08-13 | 2009-02-18 | K.C.科技股份有限公司 | Large-area etching device with deposit preventation part and deposit preventation method thereof |
| CN102214548A (en) * | 2010-03-31 | 2011-10-12 | 大日本网屏制造株式会社 | Substrate treatment apparatus and substrate treatment method |
| CN202111064U (en) * | 2011-06-07 | 2012-01-11 | 京东方科技集团股份有限公司 | Substrate heating/cooling device |
| CN203928691U (en) * | 2014-06-21 | 2014-11-05 | 广东梅雁吉祥水电股份有限公司 | A kind of automatic constant-temperature baking box with mobile and fixed function |
| CN203964556U (en) * | 2014-07-17 | 2014-11-26 | 嘉兴职业技术学院 | A kind of automatic constant-temperature baking box with mobile and fixed function |
-
2014
- 2014-12-31 CN CN201410856601.2A patent/CN104460072B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1212380A (en) * | 1997-09-19 | 1999-03-31 | 松下电器产业株式会社 | Method and apparatus for manufacturing liquid crystal panel |
| CN1428817A (en) * | 2001-12-12 | 2003-07-09 | 株式会社半导体能源研究所 | Film forming device and film forming method, and cleaning method |
| CN2582742Y (en) * | 2002-11-29 | 2003-10-29 | 舒永兴 | Foam centrifugal spraying drying pelletizer |
| CN1584110A (en) * | 2003-08-06 | 2005-02-23 | 爱发科股份有限公司 | Device and method for manufacturing thin films |
| CN1781614A (en) * | 2004-11-29 | 2006-06-07 | 精工爱普生株式会社 | Reduced pressure drying apparatus |
| CN101252079A (en) * | 2007-01-26 | 2008-08-27 | 东京毅力科创株式会社 | Substrate processing apparatus |
| CN101008547A (en) * | 2007-01-30 | 2007-08-01 | 友达光电股份有限公司 | Apparatus for baking a substrate |
| CN101369521A (en) * | 2007-08-13 | 2009-02-18 | K.C.科技股份有限公司 | Large-area etching device with deposit preventation part and deposit preventation method thereof |
| CN102214548A (en) * | 2010-03-31 | 2011-10-12 | 大日本网屏制造株式会社 | Substrate treatment apparatus and substrate treatment method |
| CN202111064U (en) * | 2011-06-07 | 2012-01-11 | 京东方科技集团股份有限公司 | Substrate heating/cooling device |
| CN203928691U (en) * | 2014-06-21 | 2014-11-05 | 广东梅雁吉祥水电股份有限公司 | A kind of automatic constant-temperature baking box with mobile and fixed function |
| CN203964556U (en) * | 2014-07-17 | 2014-11-26 | 嘉兴职业技术学院 | A kind of automatic constant-temperature baking box with mobile and fixed function |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104460072A (en) | 2015-03-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104460072B (en) | Substrate apparatus for baking | |
| TWI412407B (en) | Reduced pressure drying apparatus | |
| CN101008547B (en) | Apparatus for baking a substrate | |
| TWI642453B (en) | Aerosol generating apparatus | |
| TW201505714A (en) | Atomizer | |
| WO2018177059A1 (en) | Display panel, and frame sealant application device and application method thereof | |
| CN105244302B (en) | Substrate apparatus for baking | |
| CN1348838A (en) | Turning-over pages type coating machine for preparing turning-over pages type coated substrates, and method therefor | |
| TW202004900A (en) | Method of forming component, and plasma processing device | |
| CN105629666A (en) | Improved photoresist pre-baking oven heating device | |
| JP5261057B2 (en) | Suction board and vacuum suction device | |
| CN107561747A (en) | Pre-baking device and pre-baking system of display substrate | |
| CN102335880B (en) | Glass processing equipment | |
| US20140255555A1 (en) | Solid Food with Surface Coating Layer and Automatic Process and Equipment for Making the Solid Food | |
| TW201638541A (en) | Heating and drying apparatus | |
| TW200827947A (en) | Heat treatment apparatus | |
| JP2003104333A (en) | Medicine packaging apparatus | |
| TWI557389B (en) | Improvement of Heating Device of Light Resistance Pre - oven | |
| CN109545711A (en) | Semiconductor technology device and its working method | |
| WO2019041496A1 (en) | Photoresist baking device | |
| TWI601926B (en) | Increase the number of independent temperature control within the pre-baking oven structure | |
| JP2009049203A (en) | Ceramic package and manufacturing method thereof | |
| KR20180097376A (en) | Separating method and separating apparatus of rotary target assembly for sputtering | |
| CN207318884U (en) | Pre-baking device and pre-baking system of display substrate | |
| JP6186437B2 (en) | Substrate irradiation processing equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |