CN104456275A - Backlight module - Google Patents
Backlight module Download PDFInfo
- Publication number
- CN104456275A CN104456275A CN201310429072.3A CN201310429072A CN104456275A CN 104456275 A CN104456275 A CN 104456275A CN 201310429072 A CN201310429072 A CN 201310429072A CN 104456275 A CN104456275 A CN 104456275A
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- CN
- China
- Prior art keywords
- glass substrate
- backlight module
- metal substrate
- coupling element
- optical coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Planar Illumination Modules (AREA)
Abstract
一种背光模组，包括金属基板、贴设于金属基板上的玻璃基板及光源，玻璃基板包括入光面、出光面及接合面，玻璃基板通过接合面与金属基板贴合，光源发出的光线从入光面进入玻璃基板内，并从出光面射出玻璃基板外。背光模组可具有较小的厚度，从而适应轻薄化产品的需求。
A backlight module, comprising a metal substrate, a glass substrate mounted on the metal substrate, and a light source, the glass substrate includes a light incident surface, a light exit surface and a joint surface, the glass substrate is bonded to the metal substrate through the joint surface, and the light emitted by the light source It enters the glass substrate from the light incident surface and exits the glass substrate from the light exit surface. The backlight module can have a smaller thickness, so as to meet the demand for thinner and lighter products.
Description
Technical field
The present invention relates to a kind of lighting device, refer to a kind of backlight module especially.
Background technology
Backlight module is usually adopted and light guide plate can be adopted to adjust the light that light source sends, and makes it throw light on to display screen with large-scale bright dipping.Existing light guide plate normally adopts plastic cement to make, and is limited to process conditions and the strength reasons of self, and its thickness is uncontrollable in less scope (thickness of light guide plate the thinnest is at present still more than 0.6mm).Obviously, the light guide plate of this kind of thickness cannot adapt to the demand of more and more lightening product.
Summary of the invention
Therefore, the backlight module that a kind of thinner thickness is provided is necessary.
A kind of backlight module, comprise metal substrate, be attached at glass substrate on metal substrate and light source, glass substrate comprises incidence surface, composition surface and exiting surface, glass substrate is fitted by composition surface and metal substrate, the light that light source sends enters in glass substrate from incidence surface, and from exiting surface injection glass substrate.
Due under existing process conditions, glass substrate can manufactured place very frivolous (thickness can be less than 0.2mm), therefore adopts glass substrate effectively can reduce the integral thickness of backlight module as light guide plate.On the other hand, the metal substrate be attached on glass substrate can play good supporting role to glass substrate, prevents from crossing thin due to glass substrate and causing the problem of intensity deficiency.Further, metal substrate can obtain less thickness (being less than or equal to 0.2mm) equally under existing process conditions.That is to say, even if add the thickness of metal substrate, the integral thickness of backlight module still can control within 0.4mm, compared to the backlight module adopting plastic cement light guide plate, possesses larger lightening advantage.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Accompanying drawing explanation
Fig. 1 is the sectional view of the backlight module of one embodiment of the invention.
Fig. 2 is the sectional view of the backlight module of another embodiment of the present invention.
Main element symbol description
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Refer to Fig. 1, show the backlight module 10 of one embodiment of the invention, it comprises a metal substrate 20, and is attached at the optical coupling element 50 that glass substrate 30, light source on metal substrate 20 40 and connects light source 40 and glass substrate 30.
Metal substrate 20 can adopt the manufacture of the material such as copper, aluminium.In the present embodiment, the thickness of metal substrate 20 is 0.2mm.Metal substrate 20 comprises the end face 24 and multiple side 26 being connected bottom surface 22 and end face 24 that a bottom surface 22, one and bottom surface 22 be oppositely arranged.The bottom surface 22 of metal substrate 20 for being attached at carrier, with support glass substrate 30.The end face 24 of metal substrate 20 forms a smooth surface by polishing, to play good reflex.The end face 24 of metal substrate 20 is formed with an optical scattering structure 60 further by the integral manner of machining or etching.In the present embodiment, optical scattering structure 60 comprises the site of a large amount of circles, and it is clouded on the whole end face 24 of metal substrate 20.Diffuse effect can be played to light in site, and light is spread by surrounding.Certainly, optical scattering structure 60 is also not limited to site, and other pattern or lines also can be adopted to realize required light diffusion effect.Under existing process conditions, the thickness of optical scattering structure 60 can be controlled in less than 20 μm.
Glass substrate 30 is attached on the site of metal substrate 20.In the present embodiment, the thickness of glass substrate 30 is less than 0.2mm.Glass substrate 30 comprises the bottom surface 34 that an end face 32, one and end face 32 are oppositely arranged and the multiple sides 36 being connected end face 32 and bottom surface 34.The bottom surface 34 of glass substrate 30 is provided with layer of transparent optical cement (optically clear adhesive) 70, for bonding with the end face 24 of metal substrate 20.In gap between the site that transparent optical cement 70 is filled in metal substrate 20, the thickness of its thickness and site is consistent.In other words, the end face of transparent optical cement 70 flushes with the end face of optical scattering structure 60, and therefore the bottom surface of glass substrate 30 can be supported well, thus prevents the situation of unbalance stress.Transparent optical cement 70 except jointing metal substrate 20 and glass substrate 30, can also for light through and make light reflect by the end face 24 of metal substrate 20, thus improving extraction efficiency.A part for the bottom surface 34 of glass substrate 30 is positioned at directly over metal substrate 20, and another part extends beyond metal substrate 20 and is located on optical coupling element 50.Between the part that the bottom surface 34 that transparent optical cement 70 is also located in glass substrate 30 extends beyond metal substrate 20 and optical coupling element 50.Further, transparent optical cement 70 also extends to bonding with optical coupling element 50 for the side 36 of glass substrate 30 towards a side 36 of optical coupling element 50 from the bottom surface 34 of glass substrate 30.Thus, glass substrate 30 is fixed on metal substrate 20 and optical coupling element 50 by transparent optical cement 70 simultaneously.The area that glass substrate 30 bottom surface 34 extends beyond the part of metal substrate 20 is greater than the area of glass substrate 30 towards the side 36 of optical coupling element 50.The part that glass substrate 30 bottom surface 34 engages with metal substrate 20 is as the composition surface of glass substrate 30, glass substrate 30 bottom surface 34 extend beyond metal substrate 20 part and towards the side of optical coupling element 50 as the incidence surface of glass substrate 30, the end face of glass substrate 30 is as the exiting surface of glass substrate 30.
Optical coupling element 50 is by transparent material manufacture, and it comprises end face 54 and multiple side 56 being connected bottom surface 52 and end face 54 that a bottom surface 52, one and bottom surface 52 be oppositely arranged.The thickness of optical coupling element 50 and the gross thickness of glass substrate 30 and metal substrate 20 basically identical.The bottom surface 52 of optical coupling element 50 for being placed in carrier, with metal substrate 20 common support glass substrate 30.Optical coupling element 50 is made up of the exiting surface 562 of inclined-plane 560, level and a vertical exiting surface 564 near a side of metal substrate 20.In the present embodiment, bottom surface 52 and the inclined-plane 560 of optical coupling element 50 are reflecting surface, and the two is all coated with one deck reflectance coating 80.Reflectance coating 80 can adopt silver foil or aluminium foil manufacture, to possess higher reflector efficiency.Horizontal exiting surface 562 and the vertical exiting surface 564 of optical coupling element 50 are all bonding with the incidence surface of glass substrate 30 by transparent optical cement 70, can enter in glass substrate 30 to make light from optical coupling element 50.Optical coupling element 50 offers a cavity 566 in one side 56, for accommodating light source 40.In the present embodiment, light source is a light emitting diode, and it is installed on a circuit board 42.Circuit board 42 is attached at the side 56 of optical coupling element 50, to be supported in cavity 566 by light source 40.The height of circuit board 42 is identical with the thickness of optical coupling element 50.Optical coupling element 50 forms lens 500 on the internal face of cavity 566.Lens 500 protrude towards the side 56 of optical coupling element 50 and form a convex globoidal.In the present embodiment, the optical axis of lens 500 and the optical axis of light source 40 stagger.Thus, the light that light source 40 sends can be entered in glass substrate 30 by lens 500 deviation, thus with wide-angle in glass substrate 30 inner total reflection, to promote coupling efficiency.The internal face of cavity 566 and the convex globoidal of lens 500 form the incidence surface of optical coupling element 50 jointly, the light that light source 40 sends enters in optical coupling element 50 from incidence surface, wherein a part of light is directly entered in glass substrate 30 from exiting surface 562,564 by lens 500 deviations, another part light reflect by reflectance coating 80 after enter again in glass substrate 30.The light entering glass substrate 30 is totally reflected in glass substrate 30, and then to reflect by the end face 24 of metal substrate 20 or by the scattering of the site of optical scattering structure 60 institute, and then to penetrate from the exiting surface of glass substrate 30.Due to the end face 24 of metal substrate 20 and the reflectivity of metal site higher, the light therefore penetrated from the exiting surface of glass substrate 30 there will not be the atomizating phenomenon as plastic cement light guide plate, thus the quality of lighting of backlight module 10 is got a promotion.And, leaded light is carried out owing to adopting glass substrate 30 and the superimposed mode of metal substrate 20, not only can reduce the integral thickness of backlight module 10, the problem of the intensity deficiency caused because glass substrate 30 is excessively thin can also be avoided, thus make backlight module 10 be suitable for the application of large-scale industry.
Fig. 2 shows the backlight module 10 of another kind of structure, and it also comprises metal substrate 20, glass substrate 30, optical coupling element 50 and a light source 40.
The thickness of metal substrate 20 is 0.2mm, and the thickness of glass substrate 30 is less than 0.2mm.With previous embodiment unlike, the bottom surface 34 of glass substrate 30 directly fits in the end face 24 of metal substrate 20, therebetween not optical scattering structure 60 and transparent optical cement 70.Optical scattering structure 60 then be located at the end face 32 of glass substrate 30.In the present embodiment, optical scattering structure 60 is nano-imprinted pattern, and it also comprises a large amount of sites.The thickness of these sites is less than 20 μm.A part for the bottom surface 34 of glass substrate 30 contacts with metal substrate 20 as composition surface, and another part extends beyond metal substrate 20 and is located on optical coupling element 50.Site is positioned at the top of metal substrate 20 and optical coupling element 50 simultaneously.Glass substrate 30 bottom surface 34 extends beyond the part of metal substrate 20 and forms the incidence surface of glass substrate 30 towards a side 36 of optical coupling element 50, and the end face of glass substrate 30 forms the exiting surface of glass substrate 30.Optical coupling element 50 and metal substrate 20 interval are arranged.Optical coupling element 50 forms a cavity 566 on the side 56 near metal substrate 20, and light source 40 is contained in cavity 566.The circuit board 42 of light source 40 to be located between the side 56 of optical coupling element 50 and the side 26 of metal substrate 20 and directly to abut with the two.Circuit board 42 also abuts the bottom surface 34 of glass substrate 30, its height and the consistency of thickness of metal substrate 20.Optical coupling element 50 also forms the lens 500 of an evagination on an internal face of cavity 560.The optical axis of light source 40 and the optical axis of lens 500 stagger.The convex globoidal of lens 500 and the internal face of cavity 566 form the incidence surface of optical coupling element 50 jointly.The reflecting surface of the bottom surface 52 of optical coupling element, end face 54 and the side 560 that tilts composition optical coupling element 50 jointly, it is coated with the reflectance coating 80 manufactured by silver foil or aluminium foil.The bottom of the reflectance coating 80 of the bottom surface 52 of optical coupling element 50 flushes with the bottom surface 22 of metal substrate 20 and circuit board 42, and the top of reflectance coating 80 of end face flushes with the top of site.Optical coupling element 50 also forms horizontal exiting surface 562 and a vertical exiting surface 564 near the side of metal substrate 20.The horizontal exiting surface 562 of optical coupling element 50 and vertical exiting surface 564 are all bonded to bottom surface 34 and the side 36 of glass substrate 30 by a transparent optical cement 70.In the present embodiment, transparent optical cement 70 is connected with reflectance coating 80.After the light that light source 40 sends enters optical coupling element 50 via incidence surface, reflect by reflecting surface and inject in glass substrate 30 from exiting surface 562,564.The light entered in glass substrate 30 is totally reflected, then penetrates from exiting surface via the diffusion of site.The thickness of the backlight module 10 of the present embodiment is substantially identical with the thickness of the backlight module 10 of previous embodiment, is applicable to the backlight demand of various lightening product.
Claims (10)
1. a backlight module, it is characterized in that: comprise metal substrate, be attached at glass substrate on metal substrate and light source, glass substrate comprises incidence surface, exiting surface and composition surface, glass substrate is fitted by composition surface and metal substrate, the light that light source sends enters in glass substrate from incidence surface, and from exiting surface injection glass substrate.
2. backlight module as claimed in claim 1, it is characterized in that: also comprise the optical coupling element between glass substrate and light source, the incidence surface of glass substrate is bonding with optical coupling element by transparent optical cement.
3. backlight module as claimed in claim 2, is characterized in that: transparent optical cement also extends to composition surface, and it is bonding that metal substrate and glass substrate pass through transparent optical cement.
4. backlight module as claimed in claim 3, is characterized in that: metal substrate is towards the formation site, surface of glass substrate, and transparent optical cement is filled in the gap between site.
5. backlight module as claimed in claim 4, is characterized in that: the thickness of transparent optical cement is identical with the thickness of site.
6. backlight module as claimed in claim 2, it is characterized in that: glass substrate forms site on exiting surface, network point distribution is above metal substrate and optical coupling element.
7. backlight module as claimed in claim 2, is characterized in that: the circuit board also comprising carrying light source, circuit board is folded between metal substrate and optical coupling element.
8. the backlight module as described in any one of claim 2 to 7, is characterized in that: a glass substrate part is located on metal substrate, and another part extends beyond metal substrate and is located on optical coupling element.
9. backlight module as claimed in claim 8, is characterized in that: the incidence surface of glass substrate comprises the Part I coplanar with composition surface and the Part II with composition surface antarafacial, and the area of Part I is greater than the area of Part II.
10. the backlight module as described in any one of claim 2 to 7, is characterized in that: optical coupling element offers the cavity of collecting light source, and the internal face of cavity forms lens, and the optical axis of lens and the optical axis of light source stagger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310429072.3A CN104456275A (en) | 2013-09-22 | 2013-09-22 | Backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310429072.3A CN104456275A (en) | 2013-09-22 | 2013-09-22 | Backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104456275A true CN104456275A (en) | 2015-03-25 |
Family
ID=52902774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310429072.3A Pending CN104456275A (en) | 2013-09-22 | 2013-09-22 | Backlight module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104456275A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108253323A (en) * | 2017-12-29 | 2018-07-06 | 广州蓝豹智能科技有限公司 | Light structure and light fixture |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050146894A1 (en) * | 2002-02-22 | 2005-07-07 | Keuper Matthijs H. | Compact lighting system and display device |
| CN1683966A (en) * | 2004-04-17 | 2005-10-19 | 鸿富锦精密工业（深圳）有限公司 | Light guide plate and backlight module |
| CN202049262U (en) * | 2011-05-09 | 2011-11-23 | 光燿光电(苏州)有限公司 | Optical connector |
| CN102518984A (en) * | 2011-11-23 | 2012-06-27 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display device |
| CN102818220A (en) * | 2011-06-07 | 2012-12-12 | 易美芯光（北京）科技有限公司 | Light guide system |
-
2013
- 2013-09-22 CN CN201310429072.3A patent/CN104456275A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050146894A1 (en) * | 2002-02-22 | 2005-07-07 | Keuper Matthijs H. | Compact lighting system and display device |
| CN1683966A (en) * | 2004-04-17 | 2005-10-19 | 鸿富锦精密工业（深圳）有限公司 | Light guide plate and backlight module |
| CN202049262U (en) * | 2011-05-09 | 2011-11-23 | 光燿光电(苏州)有限公司 | Optical connector |
| CN102818220A (en) * | 2011-06-07 | 2012-12-12 | 易美芯光（北京）科技有限公司 | Light guide system |
| CN102518984A (en) * | 2011-11-23 | 2012-06-27 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108253323A (en) * | 2017-12-29 | 2018-07-06 | 广州蓝豹智能科技有限公司 | Light structure and light fixture |
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Application publication date: 20150325 |
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| WD01 | Invention patent application deemed withdrawn after publication |