CN104440497B - A kind of burnishing device and polishing method for mobile phone faceplate cambered surface - Google Patents
A kind of burnishing device and polishing method for mobile phone faceplate cambered surface Download PDFInfo
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- CN104440497B CN104440497B CN201410680488.7A CN201410680488A CN104440497B CN 104440497 B CN104440497 B CN 104440497B CN 201410680488 A CN201410680488 A CN 201410680488A CN 104440497 B CN104440497 B CN 104440497B
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- mobile phone
- cambered surface
- polishing
- phone faceplate
- matrix
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- 238000005498 polishing Methods 0.000 title claims abstract description 89
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000011159 matrix material Substances 0.000 claims abstract description 27
- 230000001681 protective effect Effects 0.000 claims abstract description 24
- 238000010521 absorption reaction Methods 0.000 claims abstract description 19
- 239000000919 ceramic Substances 0.000 claims abstract description 19
- 239000012530 fluid Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 10
- 229910052594 sapphire Inorganic materials 0.000 claims description 9
- 239000010980 sapphire Substances 0.000 claims description 9
- 239000007767 bonding agent Substances 0.000 claims description 7
- 239000004744 fabric Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 238000013016 damping Methods 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 3
- 229920001342 Bakelite® Polymers 0.000 claims description 2
- 239000004637 bakelite Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 230000001737 promoting effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000007517 polishing process Methods 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention provides a kind of cambered surface burnishing device for mobile phone faceplate, is more particularly to a kind of burnishing device for 2.5D, 3D mobile phone faceplate cambered surface, including matrix and the ceramic disk with protective case；The deep gouge for placing mobile phone faceplate is provided with described matrix, the absorption layer for being used to adsorb the mobile phone faceplate being fixedly connected is provided with deep gouge；The protective case is fixedly connected on the ceramic disk, and the die cavity for placing matrix is provided with protective case.The present invention correspondingly provides a kind of polishing method.Cambered surface burnishing device provided by the invention can not only improve in the prior art the problem of cambered surface polishing effect is poor, device is cumbersome, clamping is difficult, processing efficiency is low, and can also improve plane polishing precision and reduce plane polishing difficulty；Devices of the invention are particularly useful for the situation that cambered surface is bad and does over again.
Description
Technical field
It is especially a kind of to be used to process the present invention relates to a kind of burnishing device and polishing method for mobile phone faceplate cambered surface
The burnishing device and polishing method of 2.5D or 3D Sapphire mobile phone panel cambered surfaces.
Background technology
Synthetic sapphire crystal (a-Al2O3) because with special physics, chemistry, optical characteristics, it is widely used in form
Material.Sapphire is as form material, it is necessary to its surface is polished, so as to obtain preferable optics and aesthetic effect.Mesh
Before, mobile phone faceplate plane polishing comparative maturity, but relative to 2.5D the or 3D mobile phone faceplates for having cambered surface, its cambered surface polishing one
It is directly technical bottleneck.Mainly mobile phone faceplate cambered surface is carried out to sweep grinding and polishing light, such as patent using the hairbrush of different materials at present
CN201320885994.0 provides a kind of globoidal glass burnishing device and patent CN201120347925.5 and provides a kind of monocrystalline silicon
Rod arc-surface polishing wheel.But its polishing effect is bad, and stability is poor, the mainly inhomogeneities of hairbrush and cambered surface reason itself
Cause unbalance stress, it is bad to ultimately result in polishing effect.Particularly with the sapphire material that hardness is larger, if without a level pressure
Power, its polishing effect extreme difference.And four arc sides are polished, it is necessary to special device and equipment using hairbrush.Its clamping
Numerous and diverse, processing efficiency is low, thereby increases and it is possible to destroys plane precision, increases plane polishing difficulty.
Therefore, the deficiency of existing hairbrush burnishing device is badly in need of improving in this area, and provides one kind and be used for mobile phone faceplate arc
The burnishing device and method in face.
The content of the invention
The present invention provides a kind of burnishing device for mobile phone faceplate cambered surface, including matrix 1 and the ceramic disk with protective case 5
4；The deep gouge 2 for placing mobile phone faceplate is provided with described matrix, be provided with deep gouge be fixedly connected be used to adsorb it is described
The absorption layer 3 of mobile phone faceplate；The protective case is fixedly connected on the ceramic disk, and is provided with protective case for placing base
The die cavity 6 of body.
In the present invention, the die cavity number on ceramic disk protective case is determined by mobile phone faceplate size, and die cavity is usually
The circumferential position of ceramic disk in a row is distributed in, such as a row totally 5 die cavities are evenly arranged with the circumferential position of ceramic disk.When
When mobile phone faceplate size is smaller, the die cavity can also be distributed in the two row or multi-row of concentric circles.
Cambered surface polishing effect that device provided by the invention can not only improve cambered surface glossing in the prior art is poor, dress
The problem of cumbersome, clamping is difficult, processing efficiency is low is put, and plane polishing precision can also be improved and reduce plane polishing difficulty.
The present invention can directly place product, avoid the troublesome operations such as clamping by setting absorption layer in deep gouge.
Preferably, the mobile phone faceplate is 2.5D or 3D Sapphire mobile phone panels.
Preferably, the material of described matrix is bakelite, and the material of the protective case is PVC or epoxy resin.
Preferably, the absorption layer is damping cloth.In the present invention, the size of the absorption layer is and mobile phone faceplate surface chi
It is very little consistent or smaller.Damping cloth of the present invention is, for example, the damping cloth for carrying glue-line.Preparing the burnishing device mistake of the present invention
Cheng Zhong, correspondingly sized damping cloth is first cut according to the size of mobile phone faceplate and deep gouge, the diaphragm of its glue-line is torn off, will damp
Cloth is pasted onto in the deep gouge 2 of matrix 1, obtains the absorption layer being fixedly connected with deep gouge 2.
Preferably, it is fixedly connected between described matrix and the ceramic disk with protective case；It is highly preferred that described matrix passes through
Bonding agent is bonded in the die cavity of the protective case.The purpose of protective case is set on ceramic disk primarily to preventing process
Middle matrix departs from.In polishing process of the present invention, matrix can be fixed effectively.In the present invention, do not specialize such as, then originally
Bonding agent used for example can be AB glue in invention.
Preferably, the absorption layer is bonded in the deep gouge by bonding agent.
Preferably, the protective case is bonded on the ceramic disk by bonding agent.
In the present invention, the 3D polishing pads that polishing pad used is, for example, high compression ratio are polished, can under the conditions of certain pressure
Cambered surface is polished.
The present invention also provides the preparation method of device as described above, including：First it is fixedly connected on ceramic disk with die cavity
Protective case, and the absorption layer is fixedly connected in the deep gouge of matrix, then matrix is fixedly connected in die cavity and produces institute
State device；It is preferred that by matrix be bonded in glue in die cavity and platen solidify 0.5~3 hour.In the present invention, the platen is for example
Compression it will be cemented between each part and glue to produce the pressure of some strength using machine.
The present invention also provides a kind of method that cambered surface to mobile phone faceplate is polished, including the use of said apparatus and four-head
Polishing machine polishes.Specific embodiment is, for example,：The absorption layer in deep gouge is first soaked, the mobile phone faceplate for treating cambered surface polishing is put
It is placed in deep gouge and is compacted, all around promoting removes, and the cambered surface of mobile phone faceplate is exposed；Use the throwing that particle diameter is 5~500nm
Light liquid is simultaneously polished using the four-head polishing machine for being fitted with 3D polishing pads to the cambered surface of mobile phone faceplate.In the present invention, will treat
The process that the mobile phone faceplate of cambered surface polishing is positioned over compacting in deep gouge uses artificial hand pressure.Complete cambered surface polishing process
In, will more preferably by sucker although directly manually can also take out mobile phone faceplate from the absorption layer in deep gouge
It takes out, and the suction caused by sucker perpendicular to mobile phone faceplate surface is more than the adhesion between mobile phone faceplate and absorption layer, thus
Easily the product for having completed cambered surface polishing can be taken out using sucker.
It can simplify cambered surface glossing using cambered surface burnishing device provided by the invention, reduce processing cost, increase simultaneously
The cambered surface surface accuracy of mobile phone faceplate.Present invention, avoiding the unequal undesirable condition of hairbrush, while CMP (chemical machines can also be reduced
Tool polish) difficulty；Especially for the product that cambered surface scuffing after plane polishing be present, it is not necessary to do over again to cambered surface and polish again
And plane polishing, it is only necessary to directly carry out cambered surface polishing using the device of the present invention.
Brief description of the drawings
Fig. 1 is the structural representation of matrix in the present invention；
Fig. 2 is the structural representation of the protective case of belt type cavity；
Fig. 3 is the cambered surface burnishing device structural representation in a kind of embodiment of the present invention；
In figure, 1- matrixes, 2- deep gouges, 3- absorption layers, 4- ceramic disks, 5- protective cases, 6- die cavities.
Embodiment
The embodiment of the present invention is described in further detail below by way of specific embodiment.Wherein embodiment
1~3 is related to the progress cambered surface polishing of normal mobile phone faceplate product.Embodiment 4, which is related to cambered surface, has scuffing, not saturating, hot spot
Deng mobile phone faceplate abnormal article do over again carry out cambered surface polishing.
Embodiment 1
Cambered surface burnishing device：A kind of cambered surface for mobile phone faceplate is provided as shown in accompanying drawing 1~3, in the present embodiment to polish
Device, including matrix 1 and the ceramic disk 4 with protective case 5；It is provided with described matrix according to mobile phone faceplate sample size and corresponding
The deep gouge 2 of design, the absorption layer 3 for being used to adsorb the mobile phone faceplate of connection fixed thereto is provided with deep gouge；The protection
Set is fixedly connected on the ceramic disk, and the die cavity 6 for placing matrix is provided with protective case.Those skilled in the art hold
Intelligibly, groove depth and/or the different deep gouge of surface size are designed according to the difference of mobile phone faceplate sample size.Make
During with cambered surface burnishing device of the present invention, mobile phone faceplate sample is positioned in deep gouge and cambered surface is exposed, using polishing machine (such as
Four-head polishing machine) it is processed by shot blasting.Those skilled in the art know that mobile phone faceplate is by its length and width and thick three directions
6 outer surfaces are formed altogether, and the present invention relates to one of long × wide outer surface of polishing, the center of the outer surface is one flat
Face, but four cambered surfaces have been processed as in the position of its former four edges, present invention is primarily intended to which this four cambered surfaces are polished, when
So the central plane can also be polished simultaneously.Wherein, during apparatus of the present invention are obtained, ceramic disk 4 is cleaned up,
Stick the protective case 5 with die cavity 6.Matrix 1 is fitted in die cavity 6, fixed with glue, and disk solidification 1 is forced with 300kg
Hour.
The application method of cambered surface burnishing device：3D polishing pads are first posted to SPEEDFAM four-head polishing machines, are pressed
Disk, patch are steady.The absorption layer in deep gouge 2 is soaked, the mobile phone faceplate sample for treating cambered surface polishing is positioned in deep gouge and is compacted, forward and backward,
Left and right promotion can not be removed, and cambered surface is highlighted outside deep gouge.
It is 75.0nm SiO2 polishing fluids to select particle diameter, is entered using the SPEEDFAM four-head polishing machines for being fitted with 3D polishing pads
Row polishing.Machined parameters are polishing fluid proportioning：3L (polishing fluid):6L (pure water)；Pressure：0.24g/cm2；Polish flow quantity：
6L/min；Lower wall rotating speed：45rpm；Polishing time：45min.
Sapphire cambered surface is processed according to the technique of the present embodiment, cambered surface roughness reaches below 1.5nm, using this processing work
Skill, plane is not damaged not only, and also help planar smoothness and finish, reduce plane CMP polishing difficulty, arc
After mirror polish, plane roughness reaches 0.5-0.8nm.
Embodiment 2
The application method of cambered surface burnishing device and cambered surface burnishing device in the present embodiment is in the same manner as in Example 1.
Select SiO of the particle diameter for 80nm2Polishing fluid, carried out using the SPEEDFAM four-heads polishing machine for being fitted with 3D polishing pads
Polishing：Machined parameters are polishing fluid proportioning：3L (polishing fluid):6L (pure water)；Pressure：0.32g/cm2；Polish flow quantity：6L/
min；Lower wall rotating speed：45rpm；Polishing time：30min.
Sapphire cambered surface is processed according to the technique of the present embodiment, cambered surface roughness reaches below 1.5nm, using this processing work
Skill, plane is not damaged not only, and also help planar smoothness and finish, reduce plane CMP polishing difficulty, arc
After mirror polish, plane roughness reaches 0.5-0.8nm.
Embodiment 3
The application method of cambered surface burnishing device and cambered surface burnishing device in the present embodiment is in the same manner as in Example 1.This
Outside, the parameter setting in polishing process is as follows.
First mill：
Select SiO of the particle diameter for 80nm2Polishing fluid, carried out using the SPEEDFAM four-heads polishing machine for being fitted with 3D polishing pads
Polishing：Machined parameters are polishing fluid proportioning：5L (polishing fluid):5L (pure water)；Pressure：0.24g/cm2；Polish flow quantity：6L/
min；Lower wall rotating speed：45rpm；Polishing time：60min；
Cleaning machine after polishing terminates, scrub card；
Second mill：
The polishing fluid of first mill recycles, new to add polishing fluid 2L (polishing fluid):2L (pure water), new plus polishing fluid material
Matter is identical with the first mill, starts to polish product.Burnishing parameters are pressure：0.24g/cm2；Polish flow quantity：6L/min；Lower wall
Rotating speed：45rpm；Polishing time：60min；
Cleaning machine after polishing terminates, scrub card；
3rd mill：
The polishing fluid of second mill recycles, and newly plus polishing fluid matches：2L (polishing fluid):2L (pure water), newly add polishing fluid
Material it is identical with the first mill.Burnishing parameters are pressure：0.24g/cm2；Polish flow quantity：6L/min；Lower wall rotating speed：
45rpm；Polishing time：60min；
Sapphire cambered surface is processed according to the technique of the present embodiment, cambered surface roughness reaches below 1.5nm, using this processing work
Skill, plane is not damaged not only, and also help planar smoothness and finish, reduce plane CMP polishing difficulty, arc
After mirror polish, plane roughness reaches 0.5-0.8nm.
Embodiment 4
The application method of cambered surface burnishing device and cambered surface burnishing device in the present embodiment is in the same manner as in Example 1.This
Outside, the parameter setting in polishing process is as follows.
First mill：
Select SiO of the particle diameter for 80nm2Polishing fluid, carried out using the SPEEDFAM four-heads polishing machine for being fitted with 3D polishing pads
Polishing：Machined parameters are polishing fluid proportioning：3L (polishing fluid):6L (pure water)；Pressure：0.2g/cm2；Polish flow quantity：6L/
min；Lower wall rotating speed：45rpm；Polishing time：45min.
Technique according to the present embodiment is done over again cambered surface bad products, a yield more than 85%, and can also be polished simultaneously
Plane scuffing etc. is bad, it is not necessary to does over again to abnormity and polishes again, then to CMP, largely optimizes technological process.Polishing
Below product cambered surface roughness 1.5nm afterwards, plane roughness reach below 0.4nm, and TTV (surface smoothness) is 5um, warpage
Spend 2um.
Claims (6)
1. a kind of burnishing device for mobile phone faceplate cambered surface, including matrix (1) and the ceramic disk (4) with protective case (5)；It is described
The deep gouge (2) for placing mobile phone faceplate is provided with matrix, be provided with deep gouge be fixedly connected be used for adsorb the mobile phone
The absorption layer (3) of panel；The protective case is fixedly connected on the ceramic disk, and is provided with protective case for placing matrix
(1) die cavity (6), the mobile phone faceplate are 2.5D or 3D Sapphire mobile phone panels, and the material of described matrix is bakelite, the guarantor
The material of sheath is PVC or epoxy resin, and described matrix is bonded in by bonding agent in the die cavity of the protective case, the absorption
Pad is bonded in the deep gouge by bonding agent, and the protective case is bonded on the ceramic disk by bonding agent, the polishing
Device also includes the 3D polishing pads being fitted on four-head polishing machine.
2. device according to claim 1, it is characterised in that the absorption layer is damping cloth.
3. a kind of preparation method of device as claimed in claim 1 or 2, including：First it is fixedly connected on ceramic disk with type
The protective case of chamber, and the absorption layer is fixedly connected in the deep gouge of matrix, then matrix is fixedly connected in die cavity and produced
Described device.
4. preparation method according to claim 3, it is characterised in that matrix is bonded in die cavity with glue and platen is consolidated
Change 0.5~3 hour.
5. a kind of method being polished to mobile phone faceplate cambered surface, thrown including the use of the device described in claim 1 or 2 and four-head
Ray machine polishes.
6. according to the method for claim 5, it is characterised in that first soak the absorption layer in deep gouge, cambered surface polishing will be treated
Mobile phone faceplate is positioned in deep gouge and is compacted, and all around promoting to remove, and the cambered surface of mobile phone faceplate is exposed；The use of particle diameter is 5
~500nm polishing fluid is simultaneously polished using the four-head polishing machine for being fitted with 3D polishing pads to the cambered surface of mobile phone faceplate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410680488.7A CN104440497B (en) | 2014-11-24 | 2014-11-24 | A kind of burnishing device and polishing method for mobile phone faceplate cambered surface |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410680488.7A CN104440497B (en) | 2014-11-24 | 2014-11-24 | A kind of burnishing device and polishing method for mobile phone faceplate cambered surface |
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| CN104440497B true CN104440497B (en) | 2017-12-19 |
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| CN104889874B (en) * | 2015-06-25 | 2017-08-04 | 蓝思科技（长沙）有限公司 | A kind of sapphire polishing absorption layer and preparation method thereof |
| CN106392854B (en) * | 2015-07-29 | 2018-09-18 | 蓝思科技（长沙）有限公司 | Device, system and polishing method for the polishing of sapphire product design |
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| CN110576341B (en) * | 2018-06-11 | 2022-04-12 | 蓝思科技（长沙）有限公司 | Polishing method, polishing fixing device and polishing equipment |
| CN109332341A (en) * | 2018-10-16 | 2019-02-15 | 重庆两江联创电子有限公司 | The repair method of 3D glass cover-plate |
| TWI678342B (en) | 2018-11-09 | 2019-12-01 | 財團法人工業技術研究院 | Cutting method for forming chamfered corners |
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| JP2004296898A (en) * | 2003-03-27 | 2004-10-21 | Ibiden Co Ltd | Vacuum chuck |
| CN102019576B (en) * | 2009-09-11 | 2014-01-15 | 鸿富锦精密工业（深圳）有限公司 | Cambered surface grinding device |
| CN202114565U (en) * | 2011-05-05 | 2012-01-18 | 深圳市科利德光电材料股份有限公司 | Glass polishing fixing device |
| CN202498431U (en) * | 2012-03-27 | 2012-10-24 | 蓝思旺科技(深圳)有限公司 | Jig for polishing glass surfaces |
| CN203409627U (en) * | 2013-08-09 | 2014-01-29 | 蓝思科技股份有限公司 | CNC (computer numerical control) groove polishing machining device |
| CN203636573U (en) * | 2013-12-31 | 2014-06-11 | 江西海纳川科技有限公司 | Device for polishing glass with cambered surface |
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