CN104394665B - The preparation method of ultra-thin printed substrate and ultra-thin printed substrate - Google Patents
The preparation method of ultra-thin printed substrate and ultra-thin printed substrate Download PDFInfo
- Publication number
- CN104394665B CN104394665B CN201410545265.XA CN201410545265A CN104394665B CN 104394665 B CN104394665 B CN 104394665B CN 201410545265 A CN201410545265 A CN 201410545265A CN 104394665 B CN104394665 B CN 104394665B
- Authority
- CN
- China
- Prior art keywords
- copper foil
- positioning
- ultra
- printed substrate
- supporting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 171
- 239000011889 copper foil Substances 0.000 claims abstract description 160
- 238000012546 transfer Methods 0.000 claims abstract description 18
- 238000007747 plating Methods 0.000 claims abstract description 14
- 238000007731 hot pressing Methods 0.000 claims abstract description 9
- 238000005520 cutting process Methods 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 238000012545 processing Methods 0.000 claims description 12
- 239000002861 polymer material Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 238000003801 milling Methods 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 6
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 5
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- 238000002834 transmittance Methods 0.000 claims description 5
- 230000003064 anti-oxidating effect Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- 230000007812 deficiency Effects 0.000 abstract description 5
- 238000005452 bending Methods 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract description 3
- 230000037303 wrinkles Effects 0.000 abstract description 2
- 239000011162 core material Substances 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 8
- 229910000906 Bronze Inorganic materials 0.000 description 5
- 239000010974 bronze Substances 0.000 description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000003701 mechanical milling Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses the preparation method of ultra-thin printed substrate and ultra-thin printed substrate.The preparation method of ultra-thin printed substrate provided by the invention, by copper foil and bonding sheet laminating hot pressing on the supporting plate, pass through the relatively thin copper foil of supporting plate support thickness, bonding sheet, equipment in the production such as plating, pattern transfer is effectively avoided to limit plate thickness, carrier (such as the first copper foil, the second copper foil, conductive layer) deformation (such as warpage, bending, small wrinkle) during laminating hot pressing is effectively improved, is avoided due to the problem of laminate hardness deficiency with the problem of planarization difference causes printed substrate to be scrapped, yield is low.
Description
Technical field
The present invention relates to the manufacturing field of wiring board, the preparation method of more particularly to a kind of ultra-thin printed substrate and ultra-thin
Printed substrate.
Background technology
Printed substrate (Printed Circuit Board), abbreviation PCB, also known as printed board, is the important of electronic product
One of part.Because the figure of printed substrate has repeated (repeatability) and uniformity, reduce the difference of wiring and assembling
Mistake, save the maintenance, debugging and review time of equipment.It can be standardized in design, beneficial to exchange；Printed substrate wiring is close
Degree is high, and small volume is in light weight, beneficial to the miniaturization of electronic equipment；Beneficial to mechanization, automated production, work production is improved
Rate and the cost for reducing electronic equipment.
Wiring board will be reprinted more towards trend developments such as light, thin, small and high density interconnection on limited surface in recent years
More microdevices, this just promotes to send out in terms of the deisgn approach high density of printed substrate, high accuracy, multiple stratification and small-bore
Exhibition.In order to adapt to the demand for development that electronic product becomes more meticulous, electronic product also constantly develops to thinner direction.This is also to printing
The manufacture craft of wiring board brings new challenge.Preparation for ultra-thin printed substrate must research and develop new technology, new equipment, to keep away
Exempt from the problems such as equipment is to plate thickness limitation or with the deformation of production development plate, warpage is avoided in production process.
The content of the invention
An object of the present invention is to overcome deficiency of the prior art, there is provided one kind is applied to ultra-thin printed wire
The preparation method of plate.
To realize object above, the present invention is achieved through the following technical solutions：
The preparation method of ultra-thin printed substrate, it is characterised in that comprise the following steps：
A., one supporting plate is provided；At least one surface of the supporting plate is provided with locating template；The locating template is used for
Position the first copper foil；The locating template is provided with positioning figure；
B. one first copper foil is set on the surface of locating template；First copper foil aligns with the locating template；It is described
The area of first copper foil is less than the area of the supporting plate；One first bonding sheet is provided and covers first copper foil；Described first
Bonding sheet area is suitable with the supporting plate；
C. one second copper foil, the second copper foil area and the supporting plate phase are set on the surface of first bonding sheet
When；Hot pressing, make second copper foil, first bonding sheet, the first described copper foil and supporting plate bonding；The step
Before d or step e, determine drilling to be formed at the positioning figure through second copper foil, the first bonding sheet and supporting plate
Position through hole；
D. laser drill is carried out on the second copper foil, chemical plating and electro-coppering make, and the second copper foil is led with the first copper foil
Be powered connection；
E. pattern transfer is carried out to second copper foil, forms the second conducting wire；
F. according to the position of positioning through hole, the product obtained using the longitudinally cutting step e of cutting tool, by what is be mutually bonded
First copper foil, the first bonding sheet and the second conducting wire are peeled off from the supporting plate, are obtained at least one including the first copper foil,
The laminate of one bonding sheet and the second conducting wire；
G. pattern transfer is carried out to the first copper foil of the laminate, forms the first conducting wire；Finally it is made described super
Thin printed substrate.
Preferably, the supporting plate includes high polymer material core plate and is arranged on the positioning of high polymer material core plate surface
Template and positioning figure；In the step a, positioning copper foil is set at least one surface of the supporting plate；The positioning copper
Paper tinsel is Nian Jie with the high polymer material core plate；The copper foil is etched or cut and forms groove, makes the positioning copper foil shape
Positioning copper frame into the locating template and around the locating template.
Preferably, it is described positioning figure be by posting through-thickness remove part or all formation or
Part or all of removal formation will be removed in addition to figure is positioned by remaining posting through-thickness.
Preferably, in the step b, according to the position of the first copper foil, sideline is positioned using infrared wire tag；In step
In c, the second copper foil position is determined according to the positioning sideline.
Preferably, in the step b, hot pressing makes first bonding sheet, first copper foil Nian Jie with the supporting plate
It is held between first bonding sheet and supporting plate.
Preferably, in the step e, the position of identification positioning figure, according to the positioning figure and first bronze medal
Position relationship between paper tinsel, determines cutting path.
Preferably, in the step e, using milling cutter along the second circuit pattern edge and the first copper foil edge
Between longitudinally cut through the product that step f is obtained.
Preferably, in the step g, in addition to the laminate is drilled, at chemical plating, plating or etching
Reason.
Preferably, in the step g, after forming the first conducting wire, set on the surface of first conducting wire
One layer of anti-oxidation protective film.
Preferably, in the step e, after forming the second conducting wire, it is laminated on the second conducting wire surface
Few one layer of bonding sheet and copper foil；Make the bonding sheet between second conducting wire and copper foil or both sides copper foil；Each layer
Copper foil and the second conducting wire and each layer copper foil are be bonded by bonding sheet；Before next layer of bonding sheet is covered, first by outside
Conductive hole and circuit is made in copper foil.
Preferably, laser drill, chemical plating, electro-coppering, pattern transfer processing, shape will carried out positioned at the copper foil in outside
Into after conductive hole and circuit, then it is laminated next layer of adhesive sheet and copper foil.
Preferably, step a-g is carried out respectively in the upper and lower surface of supporting plate；In the upper surface of the supporting plate
Form one or more layers laminate respectively with lower surface.
Preferably, the thickness of the supporting plate is not less than 0.35mm, or not less than the requirement of production equipment minimum thickness of slab.
Preferably, the thickness of the laminate is less than 0.05mm.
Preferably, it is with reference to the position for determining drilling according to the position of the positioning through hole in described step d.
Preferably, it is with reference to progress pattern transfer processing according to the position of the positioning through hole in described step e.
Preferably, the position of identification positioning figure is irradiated using X-ray；Using the light transmittance difference at figure is positioned to know
Not Ding Wei figure position, then reprocess positioning through hole.
The second object of the present invention is to overcome deficiency of the prior art, there is provided a kind of ultra-thin printed substrate.
To realize object above, the present invention is achieved through the following technical solutions：
Ultra-thin printed substrate, it is characterised in that produced using aforementioned manufacturing method.
The preparation method of ultra-thin printed substrate provided by the invention, copper foil and bonding sheet are hot stacked in thickness and are more than
In 0.35mm supporting plate, by the relatively thin copper foil of supporting plate support thickness, bonding sheet, plating, pattern transfer etc. are effectively avoided
Equipment is limited plate thickness in production, is effectively improved carrier (such as the first copper foil, second during pattern transfer or laminating hot pressing
Copper foil, conductive layer etc.) deformation (such as warpage, bending, small wrinkle), avoid asking because laminate hardness deficiency and planarization are poor
The problem of topic causes printed substrate to be scrapped, yield is low.
For ultra-thin printed substrate because thickness is small, each layer is rigidly small, therefore can not use conventional production methods directly by copper
Paper tinsel, bonding sheet lamination.When using produced in conventional processes, because each thickness degree is small, some production equipments are limited nothing by thickness of slab
Method produces, or clamp easily occurs, and the deformation such as slab warping, bending, fold easily occurs, has a strong impact on product quality.The present invention
Method by providing supporting plate solves the problems such as deforming, can not producing caused by each layer rigidity deficiency, plate are thin.Utilize supporting plate
Support is provided to copper foil, bonding sheet, prevents it from being deformed in lamination process.Supporting plate uses high polymer material core plate and positioning copper
Paper tinsel, the first copper foil can be placed on locating template, can prevent that the first copper foil is Nian Jie with high polymer material core plate and leads to not
Peel off.Using locating template, it is convenient to its position is determined, with reference to the use of infrared position line, it is convenient to determine the second bronze medal
The position of paper tinsel and remaining copper foil, enables multilayer copper foil to align.Because bonding sheet area is more than the first copper foil, the first bronze medal is covered in
After on paper tinsel, the position of the first copper foil is not easy to determine, therefore, the present invention is using positioning figure is set as reference marker, follow-up
Process in, to position figure as reference position, convenient processing and multilayer line pattern alignment.Locating template and positioning
Figure is processed to be formed using copper material, you can, again can be easily to prevent that the first copper foil is Nian Jie with high polymer material core plate
Processed using line pattern processing technology.Positioning figure, locating template in the present invention can utilize the techniques such as etching easily to add
Work is formed, using existing line board machining process, without carrying out large-scale redevelopment to production line.Using positioning figure, even if
First copper foil is completely covered, can also easily determine its position.Positioning figure in the present invention, using through posting
Figure, its shape can determine according to actual use occasion, such as variously-shaped using circle, annulus, square.In the present invention
Figure set-up mode is positioned, convenient use, when using x-ray bombardment, it is saturating from positioning figure that X ray may pass through macromolecule core plate
Cross.Therefore, present invention utilizes conventional material, it not only make use of X ray to penetrate copper material but also make use of X ray can
The characteristics of penetrating macromolecule core material, using the positioning figure positioning through posting.
In the present invention, the first copper foil is between bonding sheet and supporting plate, because the area of the first copper foil is less than bonding sheet
With the area of supporting plate, so that the edge of bonding sheet can be Nian Jie with supporting plate, the first copper foil is gripped.Actual production
In, if without positioning figure positioning, the position that the first copper foil is placed on the supporting plate is differed every time.When area is more than first
After the bonding sheet of copper foil is covered in the first copper foil surface, operating personnel can not see the first copper foil at all, i.e., can not determine first
The physical location of copper foil on the supporting plate, this is subsequently to be laminated new copper-foil conducting electricity, make conductive hole, conductive pattern, mechanical milling
Cutting all brings trouble from supporting plate and the first copper foil.If the position for the first copper foil that operating personnel judge and the first copper foil
Deviation occurs for physical location, may result in the conducting wire subsequently made and shifts, and punching, the position of cutting fall in the first bronze medal
Phenomena such as conductive pattern region of paper tinsel, product quality is influenceed, even results in and scraps.In traditional handicraft, for avoid punching, cutting
Position falls causes product rejection in the conductive pattern region of the first copper foil, it is possible to increase the area of supporting plate and adhesive sheet, makes it
Much larger than the first copper foil, punching is reduced, the position of cutting falls the probability in the conductive pattern region of the first copper foil.It can so increase
Add raw materials consumption amount, add production cost.
The present invention locating template and opens up positioning through hole by being set on the surface of supporting plate, make the first copper foil, bonding sheet,
Second copper foil and the insulating barrier being laminated on the second copper foil, conductive layer can be accurately positioned specific bit on the supporting plate
Put.The copper sheet position correspondence of first copper foil and locating template is placed, by the specified location of copper sheet positioning on the supporting plate.Subsequently
During bonding sheet, the second copper foil, insulating barrier, conductive layer are sequentially laminated on into the first copper foil surface, even if operating personnel's naked eyes
The first copper foil can not be seen, can also use identifier identification positioning through hole, by positioning through hole and the position relationship of copper sheet, it is determined that
The physical location of first copper foil on the supporting plate, bonding sheet, the second copper foil, insulating barrier, conductive layer is set accurately to be layered in successively
The surface of one copper foil.Conducting wire is avoided to shift, punching, the position of cutting fall in conductive pattern region of the first copper foil etc.
The generation of phenomenon, improve product quality and yields.The consumption of raw material can be minimized simultaneously, save and be produced into
This.
Supporting plate is cut after the insulating barrier in supporting plate, the first bonding sheet, copper sheet are cut through using cutting tool, and cuts road
Footpath is annular in shape, the first bonding sheet and the bonding portion of supporting plate is departed from the first copper foil, the first copper foil separates with supporting plate.First
Copper foil is mutually accordingly placed with copper sheet position, except playing positioning action, also the first copper foil can be avoided directly to be connect with supporting plate
Touch, so as to prevent that the first copper foil bonds together with supporting plate in hot pressing, it is ensured that the first copper foil and supporting plate after cutting
It is smoothly detached.
Brief description of the drawings
Fig. 1 is the sectional view of the supporting plate in the present invention；
Fig. 2 be step a of the present invention after the completion of supporting plate top view；
Fig. 3 is Fig. 2 A-A sectional views；
Fig. 4 is step b supporting plate and the first copper foil, the first bonding sheet sectional view schematic diagram in embodiment 1；
The supporting plate and the first copper foil, the first bonding sheet sectional view schematic diagram that Fig. 5 is the step b of embodiment 1；
Fig. 6 is the product structure sectional view after the completion of the step b of embodiment 1；
Fig. 7 is the product structure sectional view after the completion of the step c of embodiment 1；
Fig. 8 be embodiment 1 step e in after the completion of product structure sectional view；
Fig. 9 is the product structure schematic cross-sectional view after the completion of step f in embodiment 1；
Figure 10 is the product structure sectional view after the completion of the step g of embodiment 1；
Figure 11 is the product structure sectional view after the step c processes of embodiment 2；
Figure 12 is the product structure sectional view after the completion of the step c of embodiment 2；
Figure 13 is the structure sectional view of ultra-thin printed substrate made from embodiment 2；
Figure 14 is the structure sectional view of ultra-thin printed substrate made from embodiment 3；
Embodiment
The present invention is described in detail below in conjunction with the accompanying drawings：
Embodiment 1
The preparation method of ultra-thin printed substrate, it is characterised in that comprise the following steps：
A. it is as shown in Figure 1, there is provided high polymer material core plate 14, a positioning copper foil is set respectively in upper and lower surface
20, positioning copper foil 20 is be bonded with high polymer material core plate 14.As shown in Figure 2 and Figure 3, pattern transfer, erosion are carried out to positioning copper foil 20
Carve or milling forms groove 23, positioning copper foil 20 is formed locating template 21 and posting 22.Posting 22 surrounds positioning mould
Plate 21.Processing forms positioning figure 24 on posting 22.It is that the through-thickness of posting 22 is removed into one to position figure 24
Divide or be completely formed or part or all of removal shape will be removed by remaining posting through-thickness in addition to figure 24 is positioned
Into its shape and number can determine according to use occasion, can be that the figure of rule is for example circular, annular or square, rectangular
Shape or irregular shape.The processing method of positioning figure 24 can use pattern transfer, etching or the side of milling
Formula.In preferred exemplary as depicted, position smaller than other part thickness of posting 22 at figure 24.Eventually form support
Plate 10.Supporting plate 10 both can be one side use or two-sided use.Make in the present invention, it is preferred to which supporting plate 10 is two-sided
With that is, the upper and lower surface in high polymer material core plate 14 is respectively provided with locating template 21, posting 22 and positions figure 24.Positioning figure
The number of shape 24 is four, for circular positioning figure.The thickness H of supporting plate 10 is not less than 0.35mm, or not less than production equipment most
Small thickness of slab requirement.
B. it is as shown in Figure 4, there is provided one first copper foil 4, the first copper foil 4 are suitable with the shape size of locating template 21.Such as Fig. 5
It is shown, the first copper foil 4 is placed on locating template 21, and the two position is mutually corresponding.Sideline is positioned using infrared wire tag,
Using four infrared radiations at the edge of the first copper foil 4, as positioning graticule.In subsequent machining technology, positioning sideline is all the time
Light, facilitate other copper foils to position.One first bonding sheet 5 is provided and covers the first copper foil 4, the area of the first bonding sheet 5 is more than
The area of first copper foil 4, preferably it is identical with the area of supporting plate 10 by the present invention.Hot pressing, make the first bonding sheet 5 and supporting plate 10
Upper surface 11 is bonded together, and the first copper foil 4 is clamped in into centre.
Abovementioned steps are repeated, by the lower surface 12 of supporting plate 10 upward, set the first copper foil 4 and first viscous on the lower surface
Sheeting 5.After the completion of its structure it is as shown in Figure 5.
C. as shown in fig. 6, setting one second copper foil 6 on the surface of the first bonding sheet 5.Is determined by infrared positioning sideline
The position of two copper foils 6, the second copper foil 6 is covered four positioning sidelines, that is to say and cover the first copper foil 4.Lamination, makes the second bronze medal
Paper tinsel 6 is be bonded with the first bonding sheet 5.
D. laser drill is carried out on the second copper foil 6, chemical plating and electro-coppering make, and make the second copper foil 6 and the first copper foil 4
Electrical connection.
E. as described in Figure 7, pattern transfer is carried out to the second copper foil 6, forms the second conducting wire 61.Pattern transfer is using existing
There are technology, including pad pasting, exposure, development, etching etc..
In step d and e, the position of drilling, the positioning of the film are required to accurately determine.Reference by location mark is also required to during exposure
Note could accurately determine the position of line pattern.Before step d or step e, the position of identification positioning figure 24 is irradiated first with X-ray
Put.Because the thickness at positioning figure 24 is different from peripheral thickness, therefore light transmittance during X-ray irradiation is also different.Position figure
24 be that the through-thickness of posting 22 is removed into part or all of formation, then positions the posting 22 of the thickness ratio at figure 24
Remaining part thickness is small, then the light transmittance positioned at figure 24 is high, and X-ray irradiates the figure brightness height in the formation of this position.Such as
Positioning figure 24 be by will except figure 24 position in addition to remaining posting through-thickness remove part or all removal formation,
The thickness then positioned at figure 23 is big, then the light transmittance positioned at figure 24 is low, is formed after X-ray irradiation at positioning figure 23
Brightness of image is low.The position of identification 24 pairs of figure of positioning, a positioning through hole 13 is processed (as schemed in the opening position of positioning figure 24
Shown in 8), using positioning through hole 13 as telltale mark.The position of the first copper foil 4 can be determined accordingly, positioning can also be positioned
Through hole 13 is used as reference position, and is persistently used in follow-up processing.It may insure to be separately positioned on the conductor wire of different layers
Road can be aligned, convenient electrical connection processing, prevent from offseting.
F. as shown in figure 8, according to the position of positioning through hole 13, the product obtained using the longitudinally cutting step e of cutting tool,
Cutting path 25 surrounds the first copper foil 4, the first bonding sheet 5 and the second conducting wire 61.As shown in figure 9, after the completion of cutting, by phase
The first copper foil 4, the first bonding sheet 5 and the second conducting wire 61 being mutually bonded are peeled off from the supporting plate 10, are obtained at least one
Include the laminate 7 of the first copper foil 4, the first bonding sheet 5 and the second conducting wire 61.Cutting path 25 is located at the second conducting channel
Between 61 edges and the edge of the first copper foil 4, or the edge along the first copper foil 4, cut around the second conducting wire 61.Second leads
Electric line 61 is for reference to making, the relative position of the first copper foil 4 and positioning through hole 13 is true according to the position of positioning through hole 13
It is fixed, therefore can easily and accurately determine according to the position of positioning through hole 13 cutting path 25 of milling cutter.
After longitudinally cutting, by the second conducting wire 61, the first bonding sheet 5 and the first copper foil 4 that mutually bond from supporting plate
Peeled off on 10, obtain two laminates 7 as shown in Figure 9.The thickness of laminate 7 is less than 0.05mm.
G. pattern transfer processing is carried out to the first copper foil 4 of the first laminate 7, forms the first conducting wire 41, be made super
Thin printed substrate 9.
To prevent conducting wire from aoxidizing, can be set on the surface of the first conducting wire 41 and the second conducting wire 61 anti-oxidation
Diaphragm (not shown), it is ensured that good electric conductivity.The setting of anti-oxidation protective film can a conducting wire wherein
Carry out after formation, unified after conducting wire is completely formed can also set.
Embodiment 2
As shown in figure 11, the present embodiment is on the basis of embodiment 1, in step e, will be located at outermost second copper foil
After 6 are processed as the formation of the second conducting wire 61, the second bonding sheet 81 and the 3rd copper foil 82 are covered on the surface of the second conducting wire 61.
Second bonding sheet 81 covers the second conducting wire 61.The position of the 3rd copper foil 82 is determined using infrared positioning sideline.Root after lamination
According to the position of positioning through hole 13, drilling, plating, make the 3rd copper foil 82 and the second conducting wire 61 and the one of both of the first copper foil 4
Or both electrical connection.As shown in figure 12, according to the position of positioning through hole 13, pattern transfer processing is carried out to the 3rd copper foil 82, made
The conducting wire 83 of formation the 3rd.
In step f, product that the mechanical longitudinally cutting step e of milling cutter is obtained.According to the position of positioning through hole 13, it is determined that cutting
Path does not damage the second conducting wire 61, the 3rd conducting wire 83.By the 3rd conducting wire 83 mutually bonded, the second bonding sheet
81st, the second conducting wire 61, the first bonding sheet 5 and the first copper foil 4 are peeled off from supporting plate 10.
In addition to the above, the other guide of the present embodiment is same as Example 1.The present embodiment obtains two as schemed
The ultra-thin printed substrate 20 with three layers of conducting wire shown in 13.
Embodiment 3
On the basis of embodiment 2, in step e, the 3rd conducting wire will be processed as positioned at outermost 3rd copper foil 82
After 83, the surface of the 3rd conducting wire 83 covers the 3rd bonding sheet 91 and the 4th copper foil.3rd bonding sheet 91 covers the 3rd conductor wire
Road 83.According to the position of positioning through hole 13 after lamination, drilling, plating, make the 4th copper foil and the 3rd conducting wire 83, second conductive
Thrin of 61 and first copper foil of circuit 4 or both or three's electrical connection.According to the position of positioning through hole 13, the 4th copper foil is entered
The processing of row pattern transfer, is allowed to form the 4th conducting wire 93.
In step f, product that the mechanical longitudinally cutting step e of milling cutter is obtained.According to the position of positioning through hole 13, it is determined that cutting
Path does not damage the 4th conducting wire 93, the second conducting wire 61, the 3rd conducting wire 83.The 4th conductor wire that will mutually bond
Road 93, the 3rd bonding sheet 91, the 3rd conducting wire 83, the second bonding sheet 81, the second conducting wire 61, the first bonding sheet 5 and
One copper foil 4 is peeled off from supporting plate 10.
In addition to the above, the other guide of the present embodiment is same as Example 2.The present embodiment obtains two as schemed
The ultra-thin printed substrate 30 with three layers of conducting wire shown in 14.
It is upper and lower in the present invention, using Fig. 1 as reference, to clearly demonstrate the relative concept that the present invention uses, longitudinal direction
Refer to the above-below direction in Fig. 1.Thickness direction refers to above-below direction.Sectional view of the present invention, it is that the A-A in Fig. 2 is cutd open
Apparent direction.
Embodiment in the present invention is only used for that the present invention will be described, and is not construed as limiting the scope of claims limitation,
Other substantially equivalent replacements that those skilled in that art are contemplated that, all fall in the scope of protection of the present invention.
Claims (17)
1. the preparation method of ultra-thin printed substrate, it is characterised in that comprise the following steps：
A., one supporting plate is provided；At least one surface of the supporting plate is provided with locating template；The locating template is used to position
First copper foil；The locating template is provided with positioning figure；
B. one first copper foil is set on the surface of locating template；First copper foil aligns with the locating template；Described first
The area of copper foil is less than the area of the supporting plate；One first bonding sheet is provided and covers first copper foil；Described first bonds
Piece area is suitable with the supporting plate；
C. it is suitable with the supporting plate in one second copper foil of the surface of first bonding sheet setting, the second copper foil area；
Hot pressing, make second copper foil, first bonding sheet, the first described copper foil and supporting plate bonding；
D. laser drill is carried out on the second copper foil, chemical plating and electro-coppering make, and make the second copper foil and the first copper foil electric conduction
Connection；
E. pattern transfer is carried out to second copper foil, forms the second conducting wire；
Before the step d or step e, to be formed being drilled at the positioning figure through second copper foil, the first bonding sheet
With the positioning through hole of supporting plate；
F. according to the position of positioning through hole, the product obtained using the longitudinally cutting step e of cutting tool, will be mutually bonded first
Copper foil, the first bonding sheet and the second conducting wire are peeled off from the supporting plate, obtain it is at least one including the first copper foil, it is first viscous
The laminate of sheeting and the second conducting wire；
G. pattern transfer is carried out to the first copper foil of the laminate, forms the first conducting wire；The ultra-thin print is finally made
Brush wiring board；
The supporting plate includes high polymer material core plate and is arranged on the locating template and positioning figure of high polymer material core plate surface
Shape；
In the step a, positioning copper foil is set at least one surface of the supporting plate；The positioning copper foil and the high score
Sub- material core plate bonding；The copper foil is etched or cut and forms groove, the positioning copper foil is formed the positioning mould
Plate and the positioning copper frame around the locating template.
2. the preparation method of ultra-thin printed substrate according to claim 1, it is characterised in that the positioning figure is will
Posting through-thickness removes part or all and is formed or will be gone remaining posting through-thickness in addition to figure is positioned
Except part or all of removal is formed.
3. the preparation method of ultra-thin printed substrate according to claim 1, it is characterised in that in the step b, according to
The position of first copper foil, sideline is positioned using infrared wire tag；In step c, described second is determined according to the positioning sideline
Copper foil position.
4. the preparation method of ultra-thin printed substrate according to claim 1, it is characterised in that in the step b, hot pressing
First bonding sheet, first copper foil Nian Jie with the supporting plate is set to be held between first bonding sheet and supporting plate.
5. the preparation method of ultra-thin printed substrate according to claim 1, it is characterised in that in the step e, identification
The position of figure is positioned, according to the position relationship between the positioning figure and first copper foil, determines cutting path.
6. the preparation method of ultra-thin printed substrate according to claim 1, it is characterised in that in the step e, use
The product that milling cutter obtains along step f is longitudinally cut through between the second conducting wire edge and the first copper foil edge.
7. the preparation method of ultra-thin printed substrate according to claim 1, it is characterised in that in the step g, also wrap
Include and the laminate is drilled, chemical plating, plating, etching process.
8. the preparation method of ultra-thin printed substrate according to claim 1, it is characterised in that in the step g, formed
After first conducting wire, one layer of anti-oxidation protective film is set on the surface of first conducting wire.
9. the preparation method of ultra-thin printed substrate according to claim 1, it is characterised in that in the step e, formed
After second conducting wire, few one layer of bonding sheet and copper foil are laminated on the second conducting wire surface；Make the bonding sheet position
Between second conducting wire and copper foil or both sides copper foil；Each layer copper foil and the second conducting wire and each layer copper foil pass through viscous
Sheeting is bonded；Before next layer of bonding sheet is covered, conductive hole and circuit first is made in the copper foil in outside.
10. the preparation method of ultra-thin printed substrate according to claim 9, it is characterised in that by positioned at outside
Copper foil carries out laser drill, chemical plating, plating, pattern transfer processing, after forming conductive hole and circuit, then is laminated next layer of bonding
Piece and copper foil.
11. the preparation method of ultra-thin printed substrate according to claim 1, it is characterised in that in the upper table of supporting plate
Face and lower surface carry out step a-g respectively；One or more layers lamination is formed respectively in the upper and lower surface of the supporting plate
Plate.
12. the preparation method of ultra-thin printed substrate according to claim 1, it is characterised in that the thickness of the supporting plate
Degree is more than 0.35mm.
13. the preparation method of ultra-thin printed substrate according to claim 1, it is characterised in that the thickness of the laminate
Degree is less than 0.05mm.
14. the preparation method of ultra-thin printed substrate according to claim 1, it is characterised in that in described step d,
It is with reference to the position for determining drilling according to the position of the positioning through hole.
15. the preparation method of ultra-thin printed substrate according to claim 1, it is characterised in that in described step e,
It is with reference to progress pattern transfer processing according to the position of the positioning through hole.
16. the preparation method of the ultra-thin printed substrate according to claim 1,5,14 or 15, it is characterised in that using X
Light irradiation identification positioning figure, identifies the position of positioning figure using the light transmittance difference at figure is positioned, then reprocesses
Positioning through hole.
17. ultra-thin printed substrate, it is characterised in that produced using claim 1 to 16 any claim methods described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410545265.XA CN104394665B (en) | 2014-10-15 | 2014-10-15 | The preparation method of ultra-thin printed substrate and ultra-thin printed substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410545265.XA CN104394665B (en) | 2014-10-15 | 2014-10-15 | The preparation method of ultra-thin printed substrate and ultra-thin printed substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104394665A CN104394665A (en) | 2015-03-04 |
| CN104394665B true CN104394665B (en) | 2017-11-28 |
Family
ID=52612479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410545265.XA Active CN104394665B (en) | 2014-10-15 | 2014-10-15 | The preparation method of ultra-thin printed substrate and ultra-thin printed substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104394665B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428325B (en) * | 2015-12-22 | 2017-03-22 | 苏州日月新半导体有限公司 | Preparation process of single-layer ultrathin substrate packaging structure with metal shielding layer and product thereof |
| CN108575056A (en) * | 2017-03-07 | 2018-09-25 | 宏启胜精密电子(秦皇岛)有限公司 | flexible circuit board manufacturing method |
| CN108040439A (en) * | 2017-12-13 | 2018-05-15 | 上海美维电子有限公司 | A kind of production method of ultra-thin printed circuit board |
| CN108811303A (en) * | 2018-06-13 | 2018-11-13 | 广州兴森快捷电路科技有限公司 | Package substrate and its processing method |
| CN108966516B (en) * | 2018-08-27 | 2021-01-05 | 深圳崇达多层线路板有限公司 | One-time pressing and capacitance burying process based on supporting substrate |
| CN111586994B (en) * | 2020-04-27 | 2021-12-21 | 深圳市信维通信股份有限公司 | Uncovering method of multilayer circuit board for 5G communication |
| CN111723896A (en) * | 2020-05-29 | 2020-09-29 | 捷德(中国)科技有限公司 | Identification card and preparation method |
| CN117042317B (en) * | 2023-10-07 | 2023-12-01 | 江苏普诺威电子股份有限公司 | Surface conducting layer removing method in circuit board processing, circuit board and processing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1617655A (en) * | 2003-11-13 | 2005-05-18 | 昶驎科技股份有限公司 | Positioning system, positioning method and pressing positioning device for thin printed circuit board |
| CN101594740A (en) * | 2008-05-27 | 2009-12-02 | 华通电脑股份有限公司 | Circuit board with embedded electronic device and method thereof |
| CN102186316A (en) * | 2011-05-14 | 2011-09-14 | 汕头超声印制板（二厂）有限公司 | Method for manufacturing any-layer printed circuit board |
| CN104025728A (en) * | 2011-10-31 | 2014-09-03 | 名幸电子有限公司 | Method for manufacturing substrate having built-in component, and substrate having built-in component manufactured using same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050016762A1 (en) * | 2003-07-22 | 2005-01-27 | Unitech Printed Circuit Board Corp. | Method of forming a multi-layer printed circuit board and the product thereof |
-
2014
- 2014-10-15 CN CN201410545265.XA patent/CN104394665B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1617655A (en) * | 2003-11-13 | 2005-05-18 | 昶驎科技股份有限公司 | Positioning system, positioning method and pressing positioning device for thin printed circuit board |
| CN101594740A (en) * | 2008-05-27 | 2009-12-02 | 华通电脑股份有限公司 | Circuit board with embedded electronic device and method thereof |
| CN102186316A (en) * | 2011-05-14 | 2011-09-14 | 汕头超声印制板（二厂）有限公司 | Method for manufacturing any-layer printed circuit board |
| CN104025728A (en) * | 2011-10-31 | 2014-09-03 | 名幸电子有限公司 | Method for manufacturing substrate having built-in component, and substrate having built-in component manufactured using same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104394665A (en) | 2015-03-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104394665B (en) | The preparation method of ultra-thin printed substrate and ultra-thin printed substrate | |
| CN104394658B (en) | Rigid-flex circuit board and preparation method thereof | |
| CN103153000B (en) | Manufacturing method of golden finger circuit board and circuit board manufactured by method | |
| CN104270888B (en) | Disk product and preparation method thereof in high-density packages substrate aperture | |
| CN110519912B (en) | PCB manufacturing method with embedded heat conductor and PCB | |
| CN105704948B (en) | The production method of ultra-thin printed circuit board and ultra-thin printed circuit board | |
| CN102415228B (en) | Build-up multilayer printed wiring board and production method therefor | |
| CN108767084B (en) | A printed circuit of three-dimensional assembled LED and its preparation method | |
| CN104717839B (en) | Heavy copper circuit board and preparation method thereof | |
| CN106211638A (en) | A kind of processing method of ultra-thin multilayer printed circuit board | |
| CN107041077A (en) | A kind of circuit board producing method of turmeric and the golden compound base amount method of electricity | |
| CN104025728A (en) | Method for manufacturing substrate having built-in component, and substrate having built-in component manufactured using same | |
| CN104427762B (en) | Bury resistance printed board and preparation method thereof | |
| CN103327756A (en) | Multilayer circuit board with partial mixed structure and manufacturing method thereof | |
| CN102244973A (en) | Printed circuit board with blind hole structure and manufacturing method thereof | |
| TW201524298A (en) | Method for manufacturing rigid-flexible printed circuit board | |
| CN108124386A (en) | Wiring board and its production method, graph transfer method | |
| CN113490351A (en) | Circuit board manufacturing method for preventing lamination glue overflow | |
| CN112261800A (en) | Manufacturing method of high-heat-dissipation PCB | |
| CN105682363A (en) | Fabrication method of PCB with metalized plate edges | |
| CN102044446A (en) | Manufacturing method for blind hole windowing contraposition target of packaging baseplate | |
| CN110072340B (en) | Manufacturing method of same-layer dual-copper circuit board | |
| TW201417663A (en) | Method for manufacturing package board | |
| CN117500191A (en) | Copper block embedded substrate and preparation method thereof | |
| CN110740564A (en) | dense network multilayer printed circuit board and processing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |