CN104388910A - 用于化学气相沉积金刚石膜的高功率微波等离子体反应装置 - Google Patents
用于化学气相沉积金刚石膜的高功率微波等离子体反应装置 Download PDFInfo
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- CN104388910A CN104388910A CN201410760770.6A CN201410760770A CN104388910A CN 104388910 A CN104388910 A CN 104388910A CN 201410760770 A CN201410760770 A CN 201410760770A CN 104388910 A CN104388910 A CN 104388910A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/517—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
- C23C16/274—Diamond only using microwave discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32211—Means for coupling power to the plasma
- H01J37/32247—Resonators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32211—Means for coupling power to the plasma
- H01J37/32247—Resonators
- H01J37/32256—Tuning means
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
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CN201410760770.6A CN104388910B (zh) | 2014-12-13 | 2014-12-13 | 用于化学气相沉积金刚石膜的高功率微波等离子体反应装置 |
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CN201410760770.6A CN104388910B (zh) | 2014-12-13 | 2014-12-13 | 用于化学气相沉积金刚石膜的高功率微波等离子体反应装置 |
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CN104388910A true CN104388910A (zh) | 2015-03-04 |
CN104388910B CN104388910B (zh) | 2016-08-31 |
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CN201410760770.6A Active CN104388910B (zh) | 2014-12-13 | 2014-12-13 | 用于化学气相沉积金刚石膜的高功率微波等离子体反应装置 |
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Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104988578A (zh) * | 2015-07-24 | 2015-10-21 | 哈尔滨工业大学 | 一种利用等离子体挡板优化单晶金刚石同质外延生长的方法 |
CN105239057A (zh) * | 2015-11-06 | 2016-01-13 | 武汉理工大学 | 微波等离子体化学气相沉积装置 |
CN106929828A (zh) * | 2017-05-12 | 2017-07-07 | 中国工程物理研究院应用电子学研究所 | 一种用于微波等离子体化学气相沉积法制备金刚石膜的基片台 |
CN106987827A (zh) * | 2017-04-14 | 2017-07-28 | 太原理工大学 | 等离子体化学气相沉积微波谐振腔及装置 |
CN107227450A (zh) * | 2017-07-25 | 2017-10-03 | 无锡远稳烯科技有限公司 | 一种微波等离子体化学气相沉积装置及其生产方法 |
CN110230037A (zh) * | 2018-03-06 | 2019-09-13 | 丁召民 | 微波等离子反应装置以及微波等离子反应系统 |
CN110551987A (zh) * | 2018-06-04 | 2019-12-10 | 至玥腾风科技投资集团有限公司 | 环形单晶无机非金属部件的制作方法、设备及飞轮 |
CN110913556A (zh) * | 2018-09-18 | 2020-03-24 | 清华大学 | 一种微波等离子反应装置 |
CN111188023A (zh) * | 2020-02-26 | 2020-05-22 | 美若科技有限公司 | 微波等离子反应装置 |
CN111441037A (zh) * | 2019-03-08 | 2020-07-24 | 上海征世科技有限公司 | 一种用于微波等离子体沉积金刚石膜装置中的刀具托盘 |
CN112103160A (zh) * | 2020-08-19 | 2020-12-18 | 上海征世科技有限公司 | 一种基片台和调整微波等离子体球稳定的方法 |
CN110565160B (zh) * | 2018-06-05 | 2021-11-09 | 广东众元半导体科技有限公司 | 一种微波等离子体化学气相沉积装置 |
CN114164418A (zh) * | 2021-11-29 | 2022-03-11 | 深圳优普莱等离子体技术有限公司 | 一种用于化学气相沉积的微波等离子体反应腔及设备 |
CN114203510A (zh) * | 2021-12-10 | 2022-03-18 | 成都稳正科技有限公司 | 一种轴向风冷式多模圆柱谐振腔mpcvd装置 |
CN114976559A (zh) * | 2022-06-20 | 2022-08-30 | 深圳市恒运昌真空技术有限公司 | 一种微波谐振腔 |
CN115161763A (zh) * | 2022-07-28 | 2022-10-11 | 成都欧拉微波元器件有限公司 | 一种微波等离子体化学气相沉积装置 |
Citations (5)
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JPH03193880A (ja) * | 1989-08-03 | 1991-08-23 | Mikakutou Seimitsu Kogaku Kenkyusho:Kk | 高圧力下でのマイクロ波プラズマcvdによる高速成膜方法及びその装置 |
JPH11167998A (ja) * | 1997-12-04 | 1999-06-22 | Canon Inc | パラボラアンテナを用いたプラズマ処理装置および処理方法 |
CN1809915A (zh) * | 2003-03-25 | 2006-07-26 | 东京毅力科创株式会社 | 等离子成膜方法以及等离子成膜装置 |
CN101410549A (zh) * | 2007-01-29 | 2009-04-15 | 住友电气工业株式会社 | 微波等离子体cvd系统 |
WO2012158532A1 (en) * | 2011-05-13 | 2012-11-22 | Board Of Trustees Michigan State University | Improved microwave plasma reactors |
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Patent Citations (5)
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JPH03193880A (ja) * | 1989-08-03 | 1991-08-23 | Mikakutou Seimitsu Kogaku Kenkyusho:Kk | 高圧力下でのマイクロ波プラズマcvdによる高速成膜方法及びその装置 |
JPH11167998A (ja) * | 1997-12-04 | 1999-06-22 | Canon Inc | パラボラアンテナを用いたプラズマ処理装置および処理方法 |
CN1809915A (zh) * | 2003-03-25 | 2006-07-26 | 东京毅力科创株式会社 | 等离子成膜方法以及等离子成膜装置 |
CN101410549A (zh) * | 2007-01-29 | 2009-04-15 | 住友电气工业株式会社 | 微波等离子体cvd系统 |
WO2012158532A1 (en) * | 2011-05-13 | 2012-11-22 | Board Of Trustees Michigan State University | Improved microwave plasma reactors |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104988578A (zh) * | 2015-07-24 | 2015-10-21 | 哈尔滨工业大学 | 一种利用等离子体挡板优化单晶金刚石同质外延生长的方法 |
CN105239057B (zh) * | 2015-11-06 | 2018-05-01 | 武汉理工大学 | 微波等离子体化学气相沉积装置 |
CN105239057A (zh) * | 2015-11-06 | 2016-01-13 | 武汉理工大学 | 微波等离子体化学气相沉积装置 |
WO2018188406A1 (zh) * | 2017-04-14 | 2018-10-18 | 太原理工大学 | 等离子体化学气相沉积微波谐振腔及装置 |
CN106987827A (zh) * | 2017-04-14 | 2017-07-28 | 太原理工大学 | 等离子体化学气相沉积微波谐振腔及装置 |
CN106929828A (zh) * | 2017-05-12 | 2017-07-07 | 中国工程物理研究院应用电子学研究所 | 一种用于微波等离子体化学气相沉积法制备金刚石膜的基片台 |
CN107227450A (zh) * | 2017-07-25 | 2017-10-03 | 无锡远稳烯科技有限公司 | 一种微波等离子体化学气相沉积装置及其生产方法 |
CN110230037A (zh) * | 2018-03-06 | 2019-09-13 | 丁召民 | 微波等离子反应装置以及微波等离子反应系统 |
CN110551987A (zh) * | 2018-06-04 | 2019-12-10 | 至玥腾风科技投资集团有限公司 | 环形单晶无机非金属部件的制作方法、设备及飞轮 |
CN110565160B (zh) * | 2018-06-05 | 2021-11-09 | 广东众元半导体科技有限公司 | 一种微波等离子体化学气相沉积装置 |
CN110913556A (zh) * | 2018-09-18 | 2020-03-24 | 清华大学 | 一种微波等离子反应装置 |
CN111441037A (zh) * | 2019-03-08 | 2020-07-24 | 上海征世科技有限公司 | 一种用于微波等离子体沉积金刚石膜装置中的刀具托盘 |
CN111441037B (zh) * | 2019-03-08 | 2024-05-14 | 上海征世科技股份有限公司 | 一种用于微波等离子体沉积金刚石膜装置中的刀具托盘 |
CN111188023A (zh) * | 2020-02-26 | 2020-05-22 | 美若科技有限公司 | 微波等离子反应装置 |
CN111188023B (zh) * | 2020-02-26 | 2022-04-15 | 美若科技有限公司 | 微波等离子反应装置 |
CN112103160B (zh) * | 2020-08-19 | 2021-09-10 | 上海征世科技股份有限公司 | 一种基片台和调整微波等离子体球稳定的方法 |
CN112103160A (zh) * | 2020-08-19 | 2020-12-18 | 上海征世科技有限公司 | 一种基片台和调整微波等离子体球稳定的方法 |
CN114164418A (zh) * | 2021-11-29 | 2022-03-11 | 深圳优普莱等离子体技术有限公司 | 一种用于化学气相沉积的微波等离子体反应腔及设备 |
CN114203510A (zh) * | 2021-12-10 | 2022-03-18 | 成都稳正科技有限公司 | 一种轴向风冷式多模圆柱谐振腔mpcvd装置 |
CN114976559A (zh) * | 2022-06-20 | 2022-08-30 | 深圳市恒运昌真空技术有限公司 | 一种微波谐振腔 |
CN114976559B (zh) * | 2022-06-20 | 2024-10-15 | 深圳市恒运昌真空技术股份有限公司 | 一种微波谐振腔 |
CN115161763A (zh) * | 2022-07-28 | 2022-10-11 | 成都欧拉微波元器件有限公司 | 一种微波等离子体化学气相沉积装置 |
CN115161763B (zh) * | 2022-07-28 | 2023-12-08 | 成都欧拉微波元器件有限公司 | 一种微波等离子体化学气相沉积装置 |
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Inventor after: Yu Shengwang Inventor after: Gao Jie Inventor after: Hei Hongjun Inventor after: Liu Xiaoping Inventor after: An Kang Inventor after: He Zhiyong Inventor before: Yu Shengwang Inventor before: Hei Hongjun Inventor before: Liu Xiaoping Inventor before: An Kang Inventor before: Gao Jie Inventor before: He Zhiyong |
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