CN104388006A - Ultra-small stripping force anti-sticking film and preparation method thereof - Google Patents
Ultra-small stripping force anti-sticking film and preparation method thereof Download PDFInfo
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- CN104388006A CN104388006A CN201410754826.7A CN201410754826A CN104388006A CN 104388006 A CN104388006 A CN 104388006A CN 201410754826 A CN201410754826 A CN 201410754826A CN 104388006 A CN104388006 A CN 104388006A
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- peeling force
- antiadhesion barrier
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- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 88
- 239000000463 material Substances 0.000 claims abstract description 29
- 239000003094 microcapsule Substances 0.000 claims abstract description 29
- 239000006185 dispersion Substances 0.000 claims abstract description 24
- 239000004088 foaming agent Substances 0.000 claims abstract description 19
- 239000002904 solvent Substances 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 239000003054 catalyst Substances 0.000 claims abstract description 13
- 239000003085 diluting agent Substances 0.000 claims abstract description 8
- 239000002270 dispersing agent Substances 0.000 claims abstract description 8
- 238000005187 foaming Methods 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 150000001875 compounds Chemical class 0.000 claims description 39
- 230000004888 barrier function Effects 0.000 claims description 26
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 18
- 239000004604 Blowing Agent Substances 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 11
- 238000007664 blowing Methods 0.000 claims description 10
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 229920002367 Polyisobutene Polymers 0.000 claims description 7
- ULUZGMIUTMRARO-UHFFFAOYSA-N (carbamoylamino)urea Chemical compound NC(=O)NNC(N)=O ULUZGMIUTMRARO-UHFFFAOYSA-N 0.000 claims description 6
- 238000010790 dilution Methods 0.000 claims description 6
- 239000012895 dilution Substances 0.000 claims description 6
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000001556 precipitation Methods 0.000 claims description 5
- RUTYWCZSEBLPAK-UHFFFAOYSA-N (4-methylphenyl)sulfonylurea Chemical compound CC1=CC=C(S(=O)(=O)NC(N)=O)C=C1 RUTYWCZSEBLPAK-UHFFFAOYSA-N 0.000 claims description 3
- UOYIYWCAYFTQLH-UHFFFAOYSA-N 3,7-dinitro-1,3,5,7-tetrazabicyclo[3.3.1]nonane Chemical compound C1N2CN([N+](=O)[O-])CN1CN([N+]([O-])=O)C2 UOYIYWCAYFTQLH-UHFFFAOYSA-N 0.000 claims description 3
- ICGLPKIVTVWCFT-UHFFFAOYSA-N 4-methylbenzenesulfonohydrazide Chemical compound CC1=CC=C(S(=O)(=O)NN)C=C1 ICGLPKIVTVWCFT-UHFFFAOYSA-N 0.000 claims description 3
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 claims description 3
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 claims description 3
- 229930195733 hydrocarbon Natural products 0.000 claims description 3
- 150000002430 hydrocarbons Chemical group 0.000 claims description 3
- 229940095102 methyl benzoate Drugs 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims description 3
- 239000002131 composite material Substances 0.000 abstract 7
- 238000004873 anchoring Methods 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 33
- 239000010410 layer Substances 0.000 description 21
- 239000003292 glue Substances 0.000 description 9
- 238000003756 stirring Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 239000007888 film coating Substances 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003913 materials processing Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses an ultra-small stripping force anti-sticking film which comprises a base material and a composite release layer, wherein the composite release layer is coated on the base material, and the composite release layer is formed by solidifying a composite release agent; the composite release agent comprises a release agent, a thermal expansive microcapsule, a dispersing agent, an anchoring agent, a bridging agent, a catalyst and a solvent; and the thermal expansive microcapsule accounts for 1%-50% of the dry weight of the release agent. A preparation method of the ultra-small stripping force anti-sticking film comprises the following steps of: sequentially preparing foaming agent dispersion liquid, a bridging agent diluent and a catalyst diluent, uniformly mixing with a solvent, and standing to prepare a composite release agent coating agent; then coating the composite release agent coating agent on the surface of the base material; finally desolventizing, solidifying and foaming in a drying box.
Description
Technical field
The present invention relates to film class non-stick material field, particularly a kind of ultralight peeling force antiadhesion barrier and preparation method thereof.
Background technology
Non-stick material is made up of the release layer of base material and surface-coated thereof; release layer has extremely low surface free energy; non-stick material film and pressure-sensitive when supporting the use with adhesive tape/protective membrane; the low surface free energy characteristic of release layer by guarantee pressure-sensitive adhesive layer because contact angle θ is greater than 90 ° and be difficult to effective wetting; thus meet the service requirements of adhesive tape/protective membrane, be widely used in the aspects such as cross cutting, electronics, medical science, optics, plating protection and materials processing.
Common non-stick material and the pressure-sensitive adhesive layer of adhesive tape/protective membrane contact with the form in face-face, can form a kind of more weak adhesive effect between them, so the peeling force of common non-stick material is generally not less than 0.05N/25mm.
In order to meet the requirement of modern production process, external non-stick material manufacturers starts to adopt the methods such as plasma etching, the release layer of non-stick material etches striped artificially, make release layer and the way of contact of pressure-sensitive adhesive layer become line-face to contact or point-face contact, thus produced the non-stick material that peeling force is less than 0.03N/25mm, but to be equipment requirements high, investment is large, parting agent waste is serious for the feature of this production technique.
Summary of the invention
For above-mentioned technical problem, the present invention discloses a kind of ultralight peeling force antiadhesion barrier, comprise: base material and coating compound release layer on the substrate, described compound release layer is solidify to form by compound parting agent, and described compound parting agent comprises parting agent, accounts for the heat expansion microcapsule of parting agent dry weight 1% ~ 50% mass parts, dispersion agent, breaking-down agent, bridging agent, catalyzer and solvent.
Preferably, the core of described heat expansion microcapsule is one or more in organic blowing agent or inorganic foaming agent.
Preferably; described organic blowing agent is hydro carbons, Cellmic C 121, hydrazo-dicarbonamide, 4; 4 '-bis oxide sulfonyl hydrazide, 2-((4-oxyethyl group-6-methylamino-1; 3; 5-triazine-2-base) carbamoylamino alkylsulfonyl) methyl benzoate, dinitropentamethylenetetramine, 5-phenyltetrazole, p-toluene sulfonyl hydrazide, p-toluenesulfonyl Urea,amino-, azo-bis-isobutyl cyanide, disulfonyl hydrazide sulfobenzide; two benzene disulfohydrazides, one or more in benzene disulfohydrazide and hydrazo-dicarbonamide.
Preferably, described inorganic foaming agent is one or more in supercarbonate and Citric Acid, usp, Anhydrous Powder salt.
Preferably, core is the particle size range of organic blowing agent or inorganic foaming agent heat expansion microcapsule is 0.05 ~ 35 micron.
Preferably, core is the particle size range of organic blowing agent or inorganic foaming agent heat expansion microcapsule is 0.05 ~ 10 micron.
Preferably, the initial blowing temperature of described organic blowing agent or inorganic foaming agent is 60 DEG C ~ 160 DEG C.
Preferably, the initial blowing temperature of described organic blowing agent or inorganic foaming agent is 100 DEG C ~ 130 DEG C.
Preferably, described heat expansion microcapsule account for 10% ~ 50% mass parts of parting agent dry weight.
The preparation method of ultralight peeling force antiadhesion barrier of the present invention, comprises the following steps:
Step one, joins dispersion mixing in container, obtained whipping agent dispersion liquid by heat expansion microcapsule, end group polyisobutene class hyper-dispersant, breaking-down agent, solvent and parting agent;
Step 2, by bridging agent and solvent mixing, obtained bridging agent diluent;
Step 3, mixes catalysts and solvents, obtained catalyst dilution liquid;
Step 4, mixes whipping agent dispersion liquid, bridging agent diluent, catalyst dilution liquid and solvent, leaves standstill, obtained compound parting agent coating agent;
Step 5, is coated in compound parting agent coating agent the substrate surface that surface free energy is not less than 52 dynes per centimeter;
Step 6, carries out precipitation, solidification and foaming by the base material being coated with compound parting agent in baking oven.
The invention has the beneficial effects as follows: make compound parting agent by adding the heat expansion microcapsule with specific expansion temperature scope in described parting agent, be coated on base material with this compound parting agent and make film class non-stick material, heat expansion microcapsule in non-stick material release layer within specified temperatures foaming and intumescing form a large amount of cavitys, destroy the physical structure of release layer and to form a large amount of point-like protruding on release layer surface, the contact form of this non-stick material and matching used Pressuresensitive Tape is contacted from face-face and becomes point-face contact, thus make actual use peeling force be reduced to below 0.02N/25mm, change the particle size range of heat expansion microcapsule, the antiseized of the thick sizing agent of different glue can be adapted to, change the consumption of heat expansion microcapsule, actual anti-adhesion effects can be adjusted.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of ultralight peeling force antiadhesion barrier of the present invention.
Wherein, 1-base material; 2-compound parting agent; 3-heat expansion microcapsule.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail, can implement according to this with reference to specification sheets word to make those skilled in the art.
As shown in the figure, the present invention discloses a kind of ultralight peeling force antiadhesion barrier, comprise: base material 1 and coating compound release layer on the substrate, described compound release layer is solidify to form by compound parting agent 2, and compound parting agent 2 comprises parting agent, accounts for the heat expansion microcapsule 3 of parting agent dry weight 1% ~ 50% mass parts, dispersion agent, breaking-down agent, bridging agent, catalyzer and trace solvent.
Preferably, the core of described heat expansion microcapsule 3 is one or more in organic blowing agent or inorganic foaming agent.
Preferably; described organic blowing agent is hydro carbons, Cellmic C 121, hydrazo-dicarbonamide, 4; 4 '-bis oxide sulfonyl hydrazide, 2-((4-oxyethyl group-6-methylamino-1; 3; 5-triazine-2-base) carbamoylamino alkylsulfonyl) methyl benzoate, dinitropentamethylenetetramine, 5-phenyltetrazole, p-toluene sulfonyl hydrazide, p-toluenesulfonyl Urea,amino-, azo-bis-isobutyl cyanide, disulfonyl hydrazide sulfobenzide; two benzene disulfohydrazides, one or more in benzene disulfohydrazide and hydrazo-dicarbonamide.
Preferably, described inorganic foaming agent is one or more in supercarbonate and Citric Acid, usp, Anhydrous Powder salt.
Preferably, core is the particle size range of organic blowing agent or inorganic foaming agent heat expansion microcapsule is 0.05 ~ 35 micron.
Preferably, core is the particle size range of organic blowing agent or inorganic foaming agent heat expansion microcapsule is 0.05 ~ 10 micron.
Preferably, the initial blowing temperature of described organic blowing agent or inorganic foaming agent is 60 DEG C ~ 160 DEG C.
Preferably, the initial blowing temperature of described organic blowing agent or inorganic foaming agent is 100 DEG C ~ 130 DEG C.
Preferably, described heat expansion microcapsule 3 account for 10% ~ 50% mass parts of parting agent dry weight.
The preparation method of ultralight peeling force antiadhesion barrier of the present invention, comprises the following steps:
Step one, joins dispersion mixing in container, obtained whipping agent dispersion liquid by heat expansion microcapsule, end group polyisobutene class hyper-dispersant, breaking-down agent, solvent and parting agent;
Step 2, by bridging agent and solvent mixing, obtained bridging agent diluent;
Step 3, mixes catalysts and solvents, obtained catalyst dilution liquid;
Step 4, mixes whipping agent dispersion liquid, bridging agent diluent, catalyst dilution liquid and solvent, leaves standstill, obtained compound parting agent coating agent;
Step 5, is coated in compound parting agent coating agent the substrate surface that surface free energy is not less than 52 dynes per centimeter;
Step 6, carries out precipitation, solidification and foaming by the base material being coated with compound parting agent in baking oven.
Specifically tell about ultralight peeling force antiadhesion barrier of the present invention and preparation method thereof below.
Embodiment 1
A kind of reality uses peeling force to be less than the ultralight peeling force antiadhesion barrier of 0.01N/25mm, by PET base material and the compound release layer be coated in described PET base material, described compound release layer is solidify to form by compound parting agent, and described compound parting agent comprises organosilicon parting agent Syl-Off
?sB 7458, Syl-Off
sB 7200, end group polyisobutene class hyper-dispersant, initial blowing temperature are 100 DEG C ~ 110 DEG C, particle diameter is 100nm heat expansion microcapsule, bridging agent Syl-Off
?7672, catalyst S yl-Off
?4000 and solvent toluene.
The preparation method of described ultralight peeling force antiadhesion barrier is:
First, in only clean stainless steel vessel, pour 3000g toluene into, then pour the Syl-Off of 100g into
?sB 7200, stirring and dissolving; To Syl-Off
?the heat expansion microcapsule that the initial blowing temperature of the end group polyisobutene class hyper-dispersant and 100g that slowly add 3g in SB 7200 toluene solution is 100 DEG C ~ 110 DEG C, particle diameter is 100nm, add the Syl-Off of 900g again after stirring 5min mix is even
?sB 7458, stirs 5min mix even, then disperses more than 15 minutes with shearing dispersion machine, dispersion effect microscopic, regulates dispersion intensity and jitter time, until be uniformly dispersed, obtains compound parting agent dispersion liquid; In compound parting agent dispersion liquid, 1% Syl-Off of 600g is added successively under whipped state
?1% Syl-Off of 7672 toluene solutions and 500g
?4000 toluene solutions, and add about 900g toluene, leave standstill 5min again after continuing to stir more than 10min, obtain compound parting agent coating agent.
By the compound parting agent coating agent release film coating machine prepared, the PET base material being not less than 52 dynes per centimeter at surface free energy is coated with, controlling wet film glue spread is 10g/m
2-20g/m
2between; Coating Speed is depending on baking oven length, and generally between 15m/min ~ 60m/min, oven temperature is 60 DEG C ~ 80 DEG C in precipitation section, and solidification-foaming section is at 120 DEG C ~ 150 DEG C; Require release layer completion of cure.
To be coated with and the dry silicon glue spread Xray fluorescence spectrometer of the ultralight peeling force antiadhesion barrier solidified detects, to control the dry silicon glue spread of parting agent at 0.5 g/m
2-1.0 g/m
2between; Detect the actual off-type force of ultralight peeling force antiadhesion barrier prepared by embodiment 1, test with the polyacrylate pressure-sensitive band that dry glue thickness is 0.015mm, actual peeling force is less than 0.01N/25mm.
Embodiment 2:
The actual ultralight peeling force antiadhesion barrier using peeling force to be less than 0.02N/25mm, is made up of PET base material and the compound release layer be coated in described PET base material; Described compound release layer is solidify to form by compound parting agent, and described compound parting agent comprises organosilicon parting agent Syl-off
?sB 7688, end group polyisobutene class hyper-dispersant, breaking-down agent Syl-off
?sB 297, initial blowing temperature are 100 DEG C ~ 110 DEG C, particle diameter is 100nm heat expansion microcapsule, bridging agent Syl-off
?sB 7672, catalyst S yl-off
?sB 4000 and solvent toluene.
The preparation method of described ultralight peeling force antiadhesion barrier is:
First, 3000g toluene is poured in only clean stainless steel vessel, the heat expansion microcapsule that the initial blowing temperature of the end group polyisobutene class hyper-dispersant and 100g that slowly add 3g is 100 DEG C ~ 110 DEG C, particle diameter is 100nm, add the Syl-Off of 3g more respectively after stirring 5min mix is even
?297 and the Syl-Off of 1000g
?sL 7688, stirs 5min mix even, then with shearing dispersion machine dispersion more than 15min, dispersion effect microscopic, regulating dispersion intensity and jitter time until be uniformly dispersed, obtaining compound parting agent dispersion liquid; In compound parting agent dispersion liquid, 1% Syl-Off of 600g is added successively under whipped state
?1% Syl-Off of 7672 toluene solutions, 500g
?4000 toluene solutions, and add about 900g toluene, leave standstill 5min again after continuing to stir more than 10min, obtain compound parting agent coating agent.
By the compound parting agent coating agent release film coating machine prepared, the PET base material being not less than 52 dynes per centimeter at surface free energy is coated with, controlling wet film glue spread is 10g/m
2-20g/m
2between; Coating Speed is depending on baking oven length, and generally between 15m/min ~ 60m/min, oven temperature is 60 DEG C ~ 80 DEG C in precipitation section, and solidification-foaming section is at 120 DEG C ~ 150 DEG C; Require release layer completion of cure.
To be coated with and the dry silicon glue spread Xray fluorescence spectrometer of the ultralight peeling force antiadhesion barrier solidified detects, to control the dry silicon glue spread of parting agent at 0.5g/m
2-1.0 g/m
2between; Detect the actual off-type force of ultralight peeling force antiadhesion barrier prepared by embodiment 2, test with the polyacrylate pressure-sensitive band that dry glue thickness is 0.015mm, actual peeling force is less than 0.02N/25mm.
Although embodiment of the present invention are open as above, but it is not restricted to listed in specification sheets and embodiment utilization, it can be applied to various applicable the field of the invention completely, for those skilled in the art, can easily realize other amendment, therefore do not deviating under the universal that claim and equivalency range limit, the present invention is not limited to specific details and illustrates here and the legend described.
Claims (10)
1. a ultralight peeling force antiadhesion barrier, it is characterized in that, comprise: base material and coating compound release layer on the substrate, described compound release layer is solidify to form by compound parting agent, and described compound parting agent comprises parting agent, accounts for the heat expansion microcapsule of parting agent dry weight 1% ~ 50% mass parts, dispersion agent, breaking-down agent, bridging agent, catalyzer and solvent.
2. ultralight peeling force antiadhesion barrier according to claim 1, is characterized in that: the core of described heat expansion microcapsule is one or more in organic blowing agent or inorganic foaming agent.
3. ultralight peeling force antiadhesion barrier according to claim 2; it is characterized in that: described organic blowing agent is hydro carbons, Cellmic C 121, hydrazo-dicarbonamide, 4; 4 '-bis oxide sulfonyl hydrazide, 2-((4-oxyethyl group-6-methylamino-1; 3; 5-triazine-2-base) carbamoylamino alkylsulfonyl) methyl benzoate, dinitropentamethylenetetramine, 5-phenyltetrazole, p-toluene sulfonyl hydrazide, p-toluenesulfonyl Urea,amino-, azo-bis-isobutyl cyanide, disulfonyl hydrazide sulfobenzide; two benzene disulfohydrazides, one or more in benzene disulfohydrazide and hydrazo-dicarbonamide.
4. ultralight peeling force antiadhesion barrier according to claim 2, is characterized in that: described inorganic foaming agent is one or more in supercarbonate and Citric Acid, usp, Anhydrous Powder salt.
5. ultralight peeling force antiadhesion barrier according to claim 2, is characterized in that: core is the particle size range of organic blowing agent or inorganic foaming agent heat expansion microcapsule is 0.05 ~ 35 micron.
6. ultralight peeling force antiadhesion barrier according to claim 1 or 5, is characterized in that: core is the particle size range of organic blowing agent or inorganic foaming agent heat expansion microcapsule is 0.05 ~ 10 micron.
7. ultralight peeling force antiadhesion barrier according to claim 2, is characterized in that: the initial blowing temperature of described organic blowing agent or inorganic foaming agent is 60 DEG C ~ 160 DEG C.
8. ultralight peeling force antiadhesion barrier according to claim 1, is characterized in that: the initial blowing temperature of described organic blowing agent or inorganic foaming agent is 100 DEG C ~ 130 DEG C.
9. ultralight peeling force antiadhesion barrier according to claim 1, is characterized in that: described heat expansion microcapsule account for 10% ~ 50% mass parts of parting agent dry weight.
10. the preparation method of the ultralight peeling force antiadhesion barrier according to any one of claim 1 ~ 9, is characterized in that, be made up of following step:
Step one, joins dispersion mixing in container, obtained whipping agent dispersion liquid by heat expansion microcapsule, end group polyisobutene class hyper-dispersant, breaking-down agent, solvent and parting agent;
Step 2, by bridging agent and solvent mixing, obtained bridging agent diluent;
Step 3, mixes catalysts and solvents, obtained catalyst dilution liquid;
Step 4, mixes whipping agent dispersion liquid, bridging agent diluent, catalyst dilution liquid and solvent, leaves standstill, obtained compound parting agent coating agent;
Step 5, is coated in compound parting agent coating agent the substrate surface that surface free energy is not less than 52 dynes per centimeter;
Step 6, carries out precipitation, solidification and foaming by the base material being coated with compound parting agent in baking oven.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410754826.7A CN104388006A (en) | 2014-12-11 | 2014-12-11 | Ultra-small stripping force anti-sticking film and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410754826.7A CN104388006A (en) | 2014-12-11 | 2014-12-11 | Ultra-small stripping force anti-sticking film and preparation method thereof |
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| CN104388006A true CN104388006A (en) | 2015-03-04 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105128469A (en) * | 2015-05-05 | 2015-12-09 | 东莞市鼎力薄膜科技有限公司 | Anti-static functional film with ultra-light release force |
| CN106497489A (en) * | 2016-10-26 | 2017-03-15 | 沈阳万合胶业股份有限公司 | A kind of porous type pressure sensitive adhesive and preparation method thereof |
| CN107078102A (en) * | 2015-09-16 | 2017-08-18 | 古河电气工业株式会社 | Semiconductor back surface film |
| CN109835002A (en) * | 2017-11-29 | 2019-06-04 | 宁波长阳科技股份有限公司 | Release film and preparation method thereof |
| CN110736763A (en) * | 2019-10-29 | 2020-01-31 | 东莞捷邦实业有限公司 | Silicon transfer rapid detection method for silicon-containing release films |
| JP2020097718A (en) * | 2018-12-13 | 2020-06-25 | 日東電工株式会社 | Adhesive composition and pressure sensitive adhesive sheet |
| CN111440576A (en) * | 2019-01-17 | 2020-07-24 | 中山荣思东数码科技有限公司 | Water-based repeatedly-removable pressure-sensitive adhesive containing microcapsules and preparation method thereof |
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