CN104385122A - Grinding machine with radiating structure - Google Patents
Grinding machine with radiating structure Download PDFInfo
- Publication number
- CN104385122A CN104385122A CN201410610912.0A CN201410610912A CN104385122A CN 104385122 A CN104385122 A CN 104385122A CN 201410610912 A CN201410610912 A CN 201410610912A CN 104385122 A CN104385122 A CN 104385122A
- Authority
- CN
- China
- Prior art keywords
- fixed underpan
- grinding
- grinder
- milling bar
- briquetting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000227 grinding Methods 0.000 title claims abstract description 20
- 238000012546 transfer Methods 0.000 claims abstract description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 5
- 239000010703 silicon Substances 0.000 claims abstract description 5
- 238000003801 milling Methods 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract 1
- 238000003754 machining Methods 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a grinding machine with a radiating structure. The grinding machine comprises a fixed chassis, wherein a rotating shaft is arranged on the fixed chassis; the bottom end of the rotating shaft is connected with the output of a driving motor in a driving way; a grinding cushion is arranged on the top surface of the fixed chassis; a grinding rod is arranged on one side of the surface of the fixed chassis; a pressing block is arranged at the bottom of the grinding rod; a grinding groove is formed in the pressing block; a silicon wafer is arranged in the grinding groove; the top surface of the fixed chassis is a heat transfer plate; the bottom surface of the fixed chassis is a radiating plate; a plurality of radiating fins are arranged on the side surface of the fixed chassis; the two ends of the radiating fins are respectively connected with the heat transfer plate and the radiating plate. Due to the fact that the radiating structure consists of the heat transfer plate and the radiating plate, the radiation efficiency is improved.
Description
Technical field
The present invention relates to chemical machinery field, specifically, be related specifically to a kind of grinder with radiator structure.
Background technology
Grinder is the grinding machine ground surface of the work with the lap tool coating or embed abrasive material.Be mainly used in the high precision plane in grinding work-piece, inside and outside circle cylinder, taper seat, sphere, flank and other profiles.The main Types of grinder has disc grinder, rotary shaft grinder and various special grinder.
Existing grinder exists that working (machining) efficiency is low, processing cost is high, machining accuracy and the shortcoming such as crudy is unstable, and this seriously constrains development and the popularization of grinder.In addition, grinder can produce a large amount of heats at work, if leave not in time, then likely damages whole device.
Summary of the invention
The object of the invention is to for deficiency of the prior art, provide a kind of grinder with radiator structure, to solve the problem.
Technical problem solved by the invention can realize by the following technical solutions:
A kind of grinder with radiator structure, comprise fixed underpan, described fixed underpan is provided with rotating shaft, the bottom of described rotating shaft and the output of drive motors are in transmission connection, the end face of fixed underpan is provided with grinding pad, is provided with milling bar in the side on the surface of fixed underpan, the bottom of described milling bar is provided with briquetting, briquetting is provided with grinding groove, in described grinding groove, silicon wafer is installed; The end face of described fixed underpan is heat transfer plate, and the bottom surface of fixed underpan is heat sink, and the side of fixed underpan is provided with some fin, and the two ends of described fin connect heat transfer plate and heat sink respectively.
Preferably, described briquetting is installed on milling bar by the through hole that intermediate position is offered, and is provided with elastic washer on the inner walls of the via, and described briquetting is moved by the friction of elastic washer and milling bar and fixed on milling bar.
Preferably, the top of described fixing rotating disk is provided with mozzle, and this mozzle is used for end face lapping liquid being delivered to fixing rotating disk.
Compared with prior art, beneficial effect of the present invention is as follows:
Structure is simple, designs ingenious, by arranging the radiator structure of heat transfer plate and heat sink composition, improves radiating efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of grinder of the present invention.
Fig. 2 is the profile of radiator structure of the present invention.
Number in the figure illustrates: fixed underpan 1, rotating shaft 2, grinding pad 3, milling bar 4, briquetting 5, silicon wafer 6, fin 7, heat transfer plate 8, heat sink 9.
Detailed description of the invention
The technological means realized for making the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with detailed description of the invention, setting forth the present invention further.
See Fig. 1, a kind of grinder with radiator structure of the present invention, comprise fixed underpan 1, described fixed underpan 1 is provided with rotating shaft 2, and the described bottom of rotating shaft 2 and the output of drive motors are in transmission connection, and the end face of fixed underpan 1 is provided with grinding pad 3, milling bar 4 is provided with in the side on the surface of fixed underpan 1, the bottom of described milling bar 4 is provided with briquetting 5, and briquetting 5 is provided with grinding groove, is provided with silicon wafer 6 in described grinding groove.
See Fig. 2, the end face of described fixed underpan 1 is heat transfer plate 8, and the bottom surface of fixed underpan 1 is heat sink 9, and the side of fixed underpan 1 is provided with some fin 7, and the two ends of described fin 7 connect heat transfer plate 8 and heat sink 9 respectively.
It is to be noted, described briquetting 5 is installed on milling bar 4 by the through hole that intermediate position is offered, be provided with elastic washer on the inner walls of the via, described briquetting 5 is moved by the friction of elastic washer and milling bar 4 and is fixed on milling bar 4, the top of described fixing rotating disk is provided with mozzle, and this mozzle is used for end face lapping liquid being delivered to fixing rotating disk.
More than show and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (3)
1. one kind has the grinder of radiator structure, comprise fixed underpan, described fixed underpan is provided with rotating shaft, the bottom of described rotating shaft and the output of drive motors are in transmission connection, the end face of fixed underpan is provided with grinding pad, is provided with milling bar in the side on the surface of fixed underpan, the bottom of described milling bar is provided with briquetting, briquetting is provided with grinding groove, in described grinding groove, silicon wafer is installed; It is characterized in that: the end face of described fixed underpan is heat transfer plate, the bottom surface of fixed underpan is heat sink, and the side of fixed underpan is provided with some fin, and the two ends of described fin connect heat transfer plate and heat sink respectively.
2. the grinder with radiator structure according to claim 1, it is characterized in that: described briquetting is installed on milling bar by the through hole that intermediate position is offered, be provided with elastic washer on the inner walls of the via, described briquetting is moved by the friction of elastic washer and milling bar and is fixed on milling bar.
3. the grinder with radiator structure according to claim 1, is characterized in that: the top of described fixing rotating disk is provided with mozzle, and this mozzle is used for end face lapping liquid being delivered to fixing rotating disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410610912.0A CN104385122A (en) | 2014-11-04 | 2014-11-04 | Grinding machine with radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410610912.0A CN104385122A (en) | 2014-11-04 | 2014-11-04 | Grinding machine with radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104385122A true CN104385122A (en) | 2015-03-04 |
Family
ID=52603128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410610912.0A Pending CN104385122A (en) | 2014-11-04 | 2014-11-04 | Grinding machine with radiating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104385122A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105397596A (en) * | 2015-10-21 | 2016-03-16 | 无锡清杨机械制造有限公司 | Mechanical grinding equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100317263A1 (en) * | 2008-03-12 | 2010-12-16 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US20110104994A1 (en) * | 2009-10-30 | 2011-05-05 | Jonas Bankaitis | Semiconductor wafer re-use using chemical mechanical polishing |
| JP2011194509A (en) * | 2010-03-19 | 2011-10-06 | Nitta Haas Inc | Polishing apparatus, polishing pad, and polishing information management system |
| CN103302587A (en) * | 2012-03-16 | 2013-09-18 | 中芯国际集成电路制造(上海)有限公司 | Chemical mechanical polishing (CMP) device and system |
| CN204321826U (en) * | 2014-11-04 | 2015-05-13 | 无锡市华明化工有限公司 | A kind of grinder with radiator structure |
-
2014
- 2014-11-04 CN CN201410610912.0A patent/CN104385122A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100317263A1 (en) * | 2008-03-12 | 2010-12-16 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US20110104994A1 (en) * | 2009-10-30 | 2011-05-05 | Jonas Bankaitis | Semiconductor wafer re-use using chemical mechanical polishing |
| JP2011194509A (en) * | 2010-03-19 | 2011-10-06 | Nitta Haas Inc | Polishing apparatus, polishing pad, and polishing information management system |
| CN103302587A (en) * | 2012-03-16 | 2013-09-18 | 中芯国际集成电路制造(上海)有限公司 | Chemical mechanical polishing (CMP) device and system |
| CN204321826U (en) * | 2014-11-04 | 2015-05-13 | 无锡市华明化工有限公司 | A kind of grinder with radiator structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105397596A (en) * | 2015-10-21 | 2016-03-16 | 无锡清杨机械制造有限公司 | Mechanical grinding equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150304 |