CN104342581A - Cu-co-si-based copper alloy strip and method of manufacturing same - Google Patents
Cu-co-si-based copper alloy strip and method of manufacturing same Download PDFInfo
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- CN104342581A CN104342581A CN201410362021.8A CN201410362021A CN104342581A CN 104342581 A CN104342581 A CN 104342581A CN 201410362021 A CN201410362021 A CN 201410362021A CN 104342581 A CN104342581 A CN 104342581A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
- B21B2003/005—Copper or its alloys
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Abstract
本发明提供维持电导率、强度且加工性优异的Cu-Co-Si系铜合金条及其制造方法以及使用了该铜合金板的大电流用电子部件和散热用电子部件。Cu-Co-Si系铜合金条，其含有Co：0.5~3.0质量%、Si：0.1~1.0质量%，Co/Si的质量比：3.0~5.0，剩余部分由铜和不可避免的杂质组成，兰克福特值r为0.9以上（其中，将试样沿相对于轧制平行方向为0度、45度、90度的方向进行拉伸试验而得到的r值分别记作r0、r45、r90时，r=（r0＋2×r45＋r90）/4）。The present invention provides a Cu-Co-Si-based copper alloy strip excellent in workability while maintaining electrical conductivity and strength, a method for producing the same, and electronic components for large currents and electronic components for heat dissipation using the copper alloy sheet. A Cu-Co-Si-based copper alloy strip containing Co: 0.5 to 3.0% by mass, Si: 0.1 to 1.0% by mass, a mass ratio of Co/Si: 3.0 to 5.0, and the remainder consisting of copper and unavoidable impurities, When the Lankford value r is 0.9 or more (wherein, the r values obtained by carrying out the tensile test on the sample along the direction of 0 degree, 45 degree and 90 degree relative to the rolling direction are respectively denoted as r0, r45 and r90 , r=(r0+2×r45+r90)/4).
Description
Technical field
The present invention relates to the Cu-Co-Si series copper alloy plate that can be suitable for manufacturing the electronic unit such as electronic material and energising with or heat transmission electronic unit, especially relate to the starting material as the electronic unit such as terminal, junctor, rly., switch, socket, bus, lead frame, heating panel carried in motor electronic instrument, automobile etc. and the Cu-Co-Si series copper alloy plate that uses and the electronic unit employing this copper alloy plate.Wherein, relate to the Cu-Co-Si series copper alloy plate of the purposes of the heat transmission electronic units such as the liquid crystal frame used in the purposes of the big current electronic units such as the big current junctor being suitable for using in electromobile, hybrid vehicle etc. or terminal or smart mobile phone or panel computer and employ the electronic unit of this copper alloy plate.
Background technology
As electronic machine terminal, junctor, switch, socket, rly., bus, lead frame, heating panel etc. for conducting electricity or the material of heat conduction, widely use the copper alloy bar of intensity and specific conductivity excellence.Herein, there is proportionlity in electroconductibility and thermal conductivity.But in recent years, for the junctor of electronic machine, high electric currentization advances, think and need that there is good bendability, the specific conductivity of more than 55%IACS, the yield strength of more than 550MPa.In addition, in order to ensure tin-welding, good plating, solder wettability are required to connector material.
On the other hand, in the liquid crystal of smart mobile phone, panel computer, such as use the thermal component being called as liquid crystal frame.Even if for the copper alloy plate of this heat radiation purposes, high thermal conductivity coefficientization advances, think and need that there is good bendability, high strength.Therefore, even if for the copper alloy plate of heat radiation purposes, think and also need to have the specific conductivity of more than 55%IACS, the yield strength of more than 550MPa.
But be difficult to the specific conductivity being realized more than 60%IACS by Ni-Si series copper alloy, the exploitation of Co-Si series copper alloy advances.Comprise Co in the copper alloy of Co-Si
2the solid solution capacity of Si is few, therefore compared with Ni-Si series copper alloy, can improve specific conductivity.
As this Co-Si series copper alloy, disclose a kind of by making the size of inclusion be less than the 2 μm copper alloys (patent documentation 1) reducing the plating excellent adhesion that thick precipitate obtains.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2008-056977 publication.
Summary of the invention
The problem that invention will solve
But, the specific conductivity of Co-Si series copper alloy, excellent strength, but the processing being not suitable for drawing, the convex shaping of drum (Zhang り goes out) and so on, add easily crack man-hour, shape defect.Therefore there is following unfavorable condition: when Co-Si series copper alloy being applicable to the junctor, heating panel etc. of electronic machine, be difficult to carry out fabrication design, or necessary function cannot be obtained being difficult to add other alloy of using man-hour specific conductivity (thermal conductivity) not enough.
That is, the present invention carries out to solve above-mentioned problem, its object is to provide maintain specific conductivity, intensity and the Cu-Co-Si series copper alloy strip of excellent in workability and manufacture method thereof.And then, the object of the invention is to, the manufacture method of this copper alloy plate is provided and is suitable for the electronic unit of big current purposes or heat radiation purposes.
For the means of dealing with problems
Cu-Co-Si series copper alloy strip of the present invention contains Co:0.5 ~ 3.0 quality %, Si:0.1 ~ 1.0 quality %, the mass ratio of Co/Si: 3.0 ~ 5.0, remainder is made up of copper and inevitable impurity, Lankford value r is more than 0.9 (wherein, sample is carried out r value that tension test obtains along the direction that is 0 degree, 45 degree, 90 degree relative to rolling parallel direction when being denoted as r0, r45, r90 respectively, r=(r0+2 × r45+r90)/4).
For Cu-Co-Si series copper alloy strip of the present invention, preferably, when the elongation relative to rolling parallel direction being 0 degree, 45 degree, 90 degree is denoted as E1, E45, E90 respectively, E1, E45, E90 are more than 5%.
Less than 0.95 is preferably by the yield ratio that (yield strength/tensile strength) represents.Wherein, yield ratio is obtained using MPa as the unit of yield strength and tensile strength.
More than a kind that is selected from Ni, Cr, Mg, Mn, Ag, P, Sn, Zn, As, Sb, Be, B, Ti, Zr, Al and Fe preferably containing total 0.001 ~ 2.5 quality %.
The manufacture method of Cu-Co-Si series copper alloy strip of the present invention is the manufacture method of aforementioned Cu-Co-Si series copper alloy strip, wherein, carry out hot rolling successively, the first annealing, degree of finish be more than 10% first cold rolling, solution treatment, ageing treatment, and aforementioned first annealing and aforementioned first are cold rollingly repeated more than 2 times, aforementioned first annealing is set to the condition of the tensile strength minimizing 10 ~ 40% before and after annealing.
Another side of the present invention is the big current electronic unit employing above-mentioned Cu-Co-Si series copper alloy strip.
Another side of the present invention is the heat transmission electronic unit employing above-mentioned Cu-Co-Si series copper alloy strip.
According to the present invention, can provide and maintain specific conductivity, intensity and the Cu-Co-Si series copper alloy strip of excellent in workability and manufacture method thereof and be suitable for the electronic unit of big current purposes or heat radiation purposes.This copper alloy plate can be suitable as the starting material of the electronic units such as terminal, junctor, switch, socket, rly., bus, lead frame, in particular as the starting material of the electronic unit of circulation big current or the starting material of the electronic unit that spreads large heat useful.
Embodiment
Below, the Cu-Co-Si series copper alloy strip for embodiments of the present invention is described.It should be noted that, in the present invention, % represents quality % in case of no particular description.
First, the restriction reason for the composition of copper alloy bar is described.
< Co and Si >
Co and Si is by carrying out ageing treatment, Co and Si is formed with fine Co
2si is the precipitate particle of main intermetallic compound, and the intensity of alloy is significantly increased.In addition, along with the Co by ageing treatment
2the precipitation of Si, electroconductibility improves.Wherein, when Co concentration is less than 0.5%, or Si concentration is less than 1/5 of 0.1(Co%) % time, even if add other composition also can not get expect intensity.In addition, when Co concentration is more than 3.0%, or Si concentration is more than 1/3 of 1.0(Co%) % time, although sufficient intensity can be obtained, but electroconductibility step-down, and then in parent phase, generate thick Co-Si system particle (crystallisate and precipitate) that can not contribute to improving intensity, the reduction of bendability, etching and plating can be caused.Therefore, the content of Co is set to 0.5 ~ 3.0 quality %.Preferably the content of Co is set to 1.0 ~ 2.0 quality %.Similarly, the content of Si is set to 0.1 ~ 1.0 quality %.Preferably the content of Si is set to 0.2 ~ 0.7 quality %.
When the mass ratio of Co/Si is set to 3.0 ~ 5.0, the intensity after precipitation-hardening and specific conductivity can be improved in the lump.When the mass ratio of Co/Si is less than 3.0, can not with Co
2the concentration of the Si of the form precipitation of Si becomes many, and specific conductivity reduces.When the mass ratio of Co/Si is more than 5, can not with Co
2the concentration of the Co of the form precipitation of Si becomes many, and specific conductivity reduces.
And then, more than a kind that is selected from Ni, Cr, Mg, Mn, Ag, P, Sn, Zn, As, Sb, Be, B, Ti, Zr, Al and Fe preferably containing total 0.001 ~ 2.5 quality %.These elements contribute to by solution strengthening, precipitation strength etc. improving intensity.When the total amount of these elements is less than 0.001 quality %, sometimes cannot obtain above-mentioned effect.In addition, when the total amount of these elements is more than 2.5 quality %, specific conductivity reduces or breaks because of hot rolling sometimes.
The thickness of Cu-Co-Si series copper alloy strip of the present invention is not particularly limited, such as, can be set to 0.03 ~ 0.6mm.
< Lankford value r >
Then, the regulation for the feature becoming copper alloy bar is described.The present inventor etc. are known: by manufacturing Cu-Co-Si series copper alloy strip with specific condition, can obtain the alloy that Lankford value r reaches more than 0.9.Can think, this is because by repeating annealing and rolling with following condition, the grain shape in rolling direction and thickness of slab direction, the lead-in mode of deformation can become even, and the minimizing in thickness of slab direction during distortion can be inhibited.
Herein, r represents that r is larger, and then deep drawability is more excellent easily along the plastic deformation value of the which direction distortion in thickness of slab direction and plate width direction.
In theory, r is obtained by following formula.
r=ln（Wo/W）/ln（to/t）
Wherein, Wo, W are that the plate before distortion, after distortion is wide, and to, t are the thicknesss of slab before distortion, after distortion.Wherein, r changes because taking out the position of test film, therefore in the present invention,
Through type 1:r=(r0+2 × r45+r90)/4 and obtain r.
(wherein, sample is carried out the r value that tension test obtains along the direction that is 0 degree, 45 degree, 90 degree relative to rolling parallel direction and is designated as r0, r45, r90 respectively).
And, as the condition manufacturing Cu-Co-Si series copper alloy strip, hot rolling is carried out successively to ingot casting, the first annealing, degree of finish be more than 10% first cold rolling, solution treatment, ageing treatment, and the first annealing and first are cold rollingly repeated more than 2 times, when the first annealing tensile strength be set to before and after annealing is reduced by the condition of 20 ~ 40%, the alloy bar of r >=0.9 can be obtained.
It should be noted that, can carry out finally cold rolling between solution treatment and ageing treatment.
Can think, by carrying out the first annealing and first cold rolling with above-mentioned condition, as mentioned above, grain shape, the deformation lead-in mode of rolling direction and thickness of slab direction and plate width direction become even, and the minimizing in thickness of slab direction during distortion is inhibited.
First annealing with the first cold rolling multiplicity less than 2 times time, cannot obtain above-mentioned effect, r is less than 0.9.
In the first annealing, when the minimizing of the tensile strength before and after annealing is less than 20%, cannot obtain above-mentioned effect, r is less than 0.9.On the other hand, annealing before and after tensile strength reduce by more than 40% time, crystallization particle diameter becomes excessive, and r is less than 0.9.The first annealing tensile strength be preferably set to before and after annealing reduces by the condition of 15 ~ 30%.
When first cold rolling degree of finish is less than 10%, cannot obtain above-mentioned effect, r is less than 0.9.It should be noted that, the upper limit of the first cold rolling degree of finish is such as 97%.When degree of finish is more than 97%, the 2nd cold rolling degree of finish is less than 10%.First cold rolling degree of finish is preferably 15 ~ 50%.
Hot rolling and first can be carried out cold rolling (initially cold rolling) between annealing, and its degree of finish can be 0 ~ 98%.
Other condition can be equal with the manufacturing condition of common Cu-Co-Si series copper alloy strip.
When E1, E45, E90 are more than 5%, r can be made to be positively more than 0.9, the processibility of copper alloy bar improves, thus preferably.
When being less than 0.95 by the yield ratio that (yield strength/tensile strength) represents, (Specifications Shen び Collar territory, uniform elongation region can be obtained, the region that deformation increases with the increase puted forth effort) load region become large, good forming shape can be obtained, thus preferably.
Embodiment
Take electrolytic copper as raw material, use air calciner to found the copper alloy of composition shown in table 1, table 2, casting ingot casting.With 850 ~ 1000 DEG C, hot rolling is carried out to this ingot casting, carries out suitable face and cut, thus make the thickness of 10mm.Thereafter, carry out initially cold rolling (aliquot does not carry out initially cold rolling) according to condition shown in table 1, table 2.
Then, according to condition shown in table 1, table 2, first annealing and first are cold rollingly repeated 2 times or 3 times respectively.And then, carry out the solution treatment of 5 ~ 100 seconds with 850 ~ 1000 DEG C, then carry out degree of finish be 0 ~ 20% finally cold rolling, and then carry out ageing treatment (carrying out 5 hours at the temperature that intensity reaches maximum), manufacturing thickness is the sample of 0.2mm.
For each sample, carry out following evaluation.
< tensile strength (TS) >
Utilize tensile testing machine, according to JIS-Z2241, measure the tensile strength (TS) in the direction parallel with rolling direction.
< 0.2% yield strength (YS) >
Utilize tensile testing machine, according to JIS-Z2241, measure 0.2% yield strength (YS) in the direction parallel with rolling direction.0.2% yield strength (YS) is denoted as yield strength.
< elongation at break >
Utilize tensile testing machine, according to JIS-Z2241, stretch along the direction relative to rolling parallel direction being 0 degree, 45 degree, 90 degree, between punctuate during test film fracture, the difference of length L and the gauge length L0 before testing is obtained with the form of %.The elongation at break relative to rolling parallel direction being 0 degree, 45 degree, 90 degree is denoted as E1, E45, E90 respectively.
< r value >
Utilize tensile testing machine, according to JIS-Z2241, stretch along the direction being respectively 0 degree, 45 degree, 90 degree relative to rolling parallel direction.Measure the wide and length of the plate of elongation when being 5% (being 2.5% when elongation at break is less than 5%), be denoted as W respectively by wide for the plate before and after tension test
0, W, the length before and after tension test is denoted as L respectively
0, L, by r value=ln(Wo/W)/ln(WL/W
0lo) r value is calculated.
The r value relative to rolling parallel direction being 0 degree, 45 degree, 90 degree is denoted as r0, r45, r90, respectively by r=(r0+2 × r45+r90)/4 to calculate.
< yield ratio >
Obtained by the ratio of above-mentioned YS/TS.
< specific conductivity (%IACS) >
The specific conductivity (%IACS) of gained sample is measured by quadripolar mesh procedure.
< drawing processibility >
By the Erichsen test method based on JIS-Z2247, being that the sample of more than 3mm is designated as drawing processibility zero (well) by entering the degree of depth to the signature produced be full of cracks in sample, giving as security and being designated as drawing processibility × (bad) into the degree of depth less than the sample of 3mm.
Acquired results is shown in table 1.It should be noted that, in each embodiment, TS is more than 550MPa, specific conductivity is more than 55%IACS.
[table 1]
[table 2]
By table 1, table 2 can be clear and definite, by the first annealing and degree of finish be more than 10% first cold rollingly repeat more than 2 times, and by first annealing be set to annealing before and after tensile strength reduce 20 ~ 40% condition and manufacture each embodiment when, r is more than 0.9, drawing processibility improve.
On the other hand, manufacture in the mode reducing by more than 40% of tensile strength before and after the annealing of the first annealing comparative example 1 ~ 4 when, r less than 0.9, drawing poor in processability.
By first annealing and first cold rolling only repetition 1 time comparative example 5 when, r also less than 0.9, drawing poor in processability.
When not carrying out the first annealing and first cold rolling comparative example 6, r also less than 0.9, drawing poor in processability.
First cold rolling degree of finish less than 10% comparative example 7 when, r also less than 0.9, drawing poor in processability.
Claims (7)
1.Cu-Co-Si series copper alloy strip, it contains the mass ratio of Co:0.5 ~ 3.0 quality %, Si:0.1 ~ 1.0 quality %, Co/Si: 3.0 ~ 5.0, and remainder is made up of copper and inevitable impurity,
Lankford value r is more than 0.9, wherein, sample is carried out r value that tension test obtains along the direction that is 0 degree, 45 degree, 90 degree relative to rolling parallel direction when being denoted as r0, r45, r90 respectively, r=(r0+2 × r45+r90)/4.
2. Cu-Co-Si series copper alloy strip according to claim 1, wherein, when the elongation relative to rolling parallel direction being 0 degree, 45 degree, 90 degree is denoted as E1, E45, E90 respectively, E1, E45, E90 are more than 5%.
3. Cu-Co-Si series copper alloy strip according to claim 1 and 2, wherein, the yield ratio represented by yield strength/tensile strength is less than 0.95.
4. Cu-Co-Si series copper alloy strip according to claim 1 and 2, wherein, more than a kind that is selected from Ni, Cr, Mg, Mn, Ag, P, Sn, Zn, As, Sb, Be, B, Ti, Zr, Al and Fe containing total 0.001 ~ 2.5 quality %.
The manufacture method of 5.Cu-Co-Si series copper alloy strip, the manufacture method of its Cu-Co-Si series copper alloy strip according to any one of claim 1 ~ 4, wherein,
Carry out hot rolling successively, the first annealing, degree of finish be more than 10% first cold rolling, solution treatment, ageing treatment, and described first annealing and described first are cold rollingly repeated more than 2 times,
The described first annealing tensile strength be set to before and after annealing reduces by the condition of 10 ~ 40%.
6. big current electronic unit, it uses the Cu-Co-Si series copper alloy strip according to any one of claim 1 ~ 4.
7. heat transmission electronic unit, it uses the Cu-Co-Si series copper alloy strip according to any one of claim 1 ~ 4.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2013158462A JP5437519B1 (en) | 2013-07-31 | 2013-07-31 | Cu-Co-Si-based copper alloy strip and method for producing the same |
| JP2013-158462 | 2013-07-31 |
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| CN104342581A true CN104342581A (en) | 2015-02-11 |
| CN104342581B CN104342581B (en) | 2017-08-04 |
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| JP (1) | JP5437519B1 (en) |
| KR (1) | KR101612185B1 (en) |
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| TW (1) | TWI550107B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104912626A (en) * | 2015-05-20 | 2015-09-16 | 黄钦生 | Automobile ultra-low emission device |
| CN108118186A (en) * | 2018-02-06 | 2018-06-05 | 重庆熵臻科技有限公司 | A kind of transformer durable copper alloy type Materials And Manufacturing Processes of environment-friendly type high-melting-point |
| CN108350531A (en) * | 2015-11-03 | 2018-07-31 | 株式会社神户制钢所 | Heat dissipation element copper alloy plate |
| CN110462091A (en) * | 2017-02-04 | 2019-11-15 | 美题隆公司 | Method for producing copper-nickel-tin alloy |
| CN112789359A (en) * | 2018-12-13 | 2021-05-11 | 古河电气工业株式会社 | Copper alloy sheet material, method for producing same, drawn product, member for electric/electronic component, electromagnetic wave shielding material, and heat dissipating member |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6879971B2 (en) * | 2018-03-30 | 2021-06-02 | Ｊｘ金属株式会社 | Manufacturing method of copper alloy material, electronic parts, electronic equipment and copper alloy material |
| JP6816056B2 (en) * | 2018-03-30 | 2021-01-20 | Ｊｘ金属株式会社 | Manufacturing method of copper alloy material, electronic parts, electronic equipment and copper alloy material |
| JP7311651B1 (en) * | 2022-02-01 | 2023-07-19 | Ｊｘ金属株式会社 | Copper alloys for electronic materials and electronic parts |
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| CN102844452A (en) * | 2010-04-14 | 2012-12-26 | Jx日矿日石金属株式会社 | Cu-si-co alloy for electronic materials, and method for producing same |
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| JP4708497B1 (en) | 2010-06-03 | 2011-06-22 | Ｊｘ日鉱日石金属株式会社 | Cu-Co-Si alloy plate and method for producing the same |
| JP2013104082A (en) * | 2011-11-11 | 2013-05-30 | Jx Nippon Mining & Metals Corp | Cu-Co-Si-BASED ALLOY AND METHOD FOR PRODUCING THE SAME |
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Patent Citations (2)
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| CN102844452A (en) * | 2010-04-14 | 2012-12-26 | Jx日矿日石金属株式会社 | Cu-si-co alloy for electronic materials, and method for producing same |
| CN103052728A (en) * | 2010-08-24 | 2013-04-17 | Jx日矿日石金属株式会社 | Copper-cobalt-silicon alloy for electrode material |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104912626A (en) * | 2015-05-20 | 2015-09-16 | 黄钦生 | Automobile ultra-low emission device |
| CN104912626B (en) * | 2015-05-20 | 2017-09-29 | 黄钦生 | A kind of automobile ultralow emission device |
| CN108350531A (en) * | 2015-11-03 | 2018-07-31 | 株式会社神户制钢所 | Heat dissipation element copper alloy plate |
| CN110462091A (en) * | 2017-02-04 | 2019-11-15 | 美题隆公司 | Method for producing copper-nickel-tin alloy |
| CN110462091B (en) * | 2017-02-04 | 2022-06-14 | 美题隆公司 | Method for producing copper-nickel-tin alloy |
| CN108118186A (en) * | 2018-02-06 | 2018-06-05 | 重庆熵臻科技有限公司 | A kind of transformer durable copper alloy type Materials And Manufacturing Processes of environment-friendly type high-melting-point |
| CN112789359A (en) * | 2018-12-13 | 2021-05-11 | 古河电气工业株式会社 | Copper alloy sheet material, method for producing same, drawn product, member for electric/electronic component, electromagnetic wave shielding material, and heat dissipating member |
| CN112789359B (en) * | 2018-12-13 | 2022-05-03 | 古河电气工业株式会社 | Copper alloy sheet material, method for producing same, and drawn product |
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| Publication number | Publication date |
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| KR20150015367A (en) | 2015-02-10 |
| CN104342581B (en) | 2017-08-04 |
| JP2015028201A (en) | 2015-02-12 |
| KR101612185B1 (en) | 2016-04-12 |
| TWI550107B (en) | 2016-09-21 |
| TW201518520A (en) | 2015-05-16 |
| JP5437519B1 (en) | 2014-03-12 |
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