[go: up one dir, main page]

CN104327291A - Polyimide composite film preparation method - Google Patents

Polyimide composite film preparation method Download PDF

Info

Publication number
CN104327291A
CN104327291A CN201410488760.1A CN201410488760A CN104327291A CN 104327291 A CN104327291 A CN 104327291A CN 201410488760 A CN201410488760 A CN 201410488760A CN 104327291 A CN104327291 A CN 104327291A
Authority
CN
China
Prior art keywords
composite film
solution
polyimide composite
quadrol
oda
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410488760.1A
Other languages
Chinese (zh)
Inventor
苏建丽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Wenchuang Technology Co Ltd
Original Assignee
Qingdao Wenchuang Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Wenchuang Technology Co Ltd filed Critical Qingdao Wenchuang Technology Co Ltd
Priority to CN201410488760.1A priority Critical patent/CN104327291A/en
Publication of CN104327291A publication Critical patent/CN104327291A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

The invention discloses a polyimide composite film preparation method which comprises the following steps: (1) adding solvents ethylenediamine, ODA (octyl decyl adipate)and PMDA (pyromellitic dianhydride) into a container to generate a polyamic acid solution A; (2) adding solvents ethylenediamine, ODA and ODPA (oxydiphthalicanhydride) into a container to generate a polyamic acid solution B; (3) mixing the A solution and B solution; and (4) coating a glass plate with the solution and scraping to smooth, removing the solvent ethylenediamine in an ordinary oven, and placing in a vacuum oven for complete imide- amination of polyamic acid to obtain a polyimide composite film. The preparation method can improve the polyimide toughness, and enlarges scope of application.

Description

A kind of preparation method of polyimide composite film
technical field
The present invention relates to a kind of preparation method of polyimide composite film, belong to material processing field.
technical background
In prior art, polyimide effectively insulating sound absorption light material high-low temperature resistant, density is little, nontoxic, smokeless, convenient construction safety, sound absorbing capabilities are good, is the splendid selection of the field thermal insulation and sound-absorbing materials such as boats and ships naval vessels, aerospace, bullet train.But Kapton is under the condition that some is comparatively extreme, as repeatedly bent, winding etc., there is defect that is more crisp, easy fracture in the Kapton of unitary system.
Summary of the invention
The object of this invention is to provide a kind of preparation method of polyimide composite film, the toughness of polyimide can be improved, expand its range of application.
For realizing above object, the preparation method of a kind of polyimide composite film of the present invention, step is: (1) adds solvent quadrol and 4 in container, 4'-dioctyl diphenylamine (ODA), stirring makes it dissolve, dissolving is placed in ice bath, evenly adds pyromellitic acid anhydride (PMDA) while stirring, and reaction 4h generates polyamic acid solution A; The mass ratio of described PMDA and ODA is 1:0.5; (2) in container, solvent quadrol and 4 are added, 4'-dioctyl diphenylamine (ODA), stirs and makes it dissolve, and dissolves and is placed in ice bath, evenly add phenyl ether tetracarboxylic dianhydride (ODPA) while stirring, reaction 4h generates polyamic acid solution B; The mass ratio of ODPA and ODA is 1:1.5; (3) by above-mentioned solution A and B solution mixing, stirred at ambient temperature 4h, obtains the thick liquid of clear, yellowish; (4) above-mentioned solution carried out plastic film mulch on a glass and strike off, except desolventizing quadrol in a conventional oven, then being positioned in vacuum drying oven, making polyamic acid imidization complete, thus the type polyimide composite film that is enhanced.
Further, the solid-liquid ratio of described PMDA and solvent quadrol is 1 g:20-30ml.
Further, the solid-liquid ratio of described ODPA and solvent quadrol is 1 g:20-30ml.
Further, the volume ratio of described solution A and B solution is 1:3-3:1.
Further, described in described step (3), the temperature of vacuum drying oven is 300-400 DEG C, and drying time is 3h.
The beneficial effect that the present invention produces is that the method that the present invention adopts polyamic acid blended, two kinds of polyamic acid solutions have good intermiscibility, effectively improve the elongation at break of laminated film.
Embodiment
Embodiment 1:
Polyimide composite film is prepared by following methods:
(1) in container, 4000ml solvent quadrol and 50g4 is added, 4'-dioctyl diphenylamine (ODA), stirring makes it dissolve, dissolving is placed in ice bath, evenly add 100g pyromellitic acid anhydride (PMDA) while stirring, reaction 4h generates polyamic acid solution A; (2) in container, 4000ml solvent quadrol and 150g 4 is added, 4'-dioctyl diphenylamine (ODA), stirring makes it dissolve, dissolving is placed in ice bath, evenly add 100g phenyl ether tetracarboxylic dianhydride (ODPA) while stirring, reaction 4h generates polyamic acid solution B; (3) be 1:2 mixing by volume by above-mentioned solution A and B solution, stirred at ambient temperature 4h, obtains the thick liquid of clear, yellowish; (4) above-mentioned solution carried out plastic film mulch on a glass and strike off, except desolventizing quadrol in a conventional oven, then being positioned in 300 DEG C of vacuum drying ovens and drying 3h, make polyamic acid imidization complete, thus obtain polyimide composite film.
The Young's modulus of the polyimide composite film prepared is 4.42GPa, tensile strength 382MPa, elongation at break 78%.
Embodiment 2:
Polyimide composite film is prepared by following methods:
(1) in container, 5000ml solvent quadrol and 50g4 is added, 4'-dioctyl diphenylamine (ODA), stirring makes it dissolve, dissolving is placed in ice bath, evenly add 100g pyromellitic acid anhydride (PMDA) while stirring, reaction 4h generates polyamic acid solution A; (2) in container, 5000ml solvent quadrol and 150g 4 is added, 4'-dioctyl diphenylamine (ODA), stirring makes it dissolve, dissolving is placed in ice bath, evenly add 100g phenyl ether tetracarboxylic dianhydride (ODPA) while stirring, reaction 4h generates polyamic acid solution B; (3) be 1:1 mixing by volume by above-mentioned solution A and B solution, stirred at ambient temperature 4h, obtains the thick liquid of clear, yellowish; (4) above-mentioned solution carried out plastic film mulch on a glass and strike off, except desolventizing quadrol in a conventional oven, then being positioned in 350 DEG C of vacuum drying ovens and drying 3h, make polyamic acid imidization complete, thus obtain polyimide composite film.
The Young's modulus of the polyimide composite film prepared is 4.86GPa, tensile strength 395MPa, elongation at break 76%.
Embodiment 3:
Polyimide composite film is prepared by following methods:
(1) in container, 6000ml solvent quadrol and 120g4 is added, 4'-dioctyl diphenylamine (ODA), stirring makes it dissolve, dissolving is placed in ice bath, evenly add 50g pyromellitic acid anhydride (PMDA) while stirring, reaction 4h generates polyamic acid solution A; (2) in container, 6000ml solvent quadrol and 150g 4 is added, 4'-dioctyl diphenylamine (ODA), stirring makes it dissolve, dissolving is placed in ice bath, evenly add 100g phenyl ether tetracarboxylic dianhydride (ODPA) while stirring, reaction 4h generates polyamic acid solution B; (3) be 1:2 mixing by volume by above-mentioned solution A and B solution, stirred at ambient temperature 4h, obtains the thick liquid of clear, yellowish; (4) above-mentioned solution carried out plastic film mulch on a glass and strike off, except desolventizing quadrol in a conventional oven, then being positioned in 400 DEG C of vacuum drying ovens and drying 3h, make polyamic acid imidization complete, thus obtain polyimide composite film.
The Young's modulus of the polyimide composite film prepared is 3.76GPa, tensile strength 399MPa, elongation at break 72%.

Claims (5)

1. a preparation method for polyimide composite film, is characterized in that: step is:
(1) in container, add solvent quadrol and ODA, stir and make it dissolve, dissolve and be placed in ice bath, evenly add PMDA while stirring, reaction 4h generates polyamic acid solution A; The mass ratio of described PMDA and ODA is 1:0.5;
(2) in container, add solvent quadrol and ODA, stir and make it dissolve, dissolve and be placed in ice bath, evenly add ODPA while stirring, reaction 4h generates polyamic acid solution B; The mass ratio of described ODPA and ODA is 1:1.5;
(3) by above-mentioned solution A and B solution mixing, stirred at ambient temperature 4h, obtains the thick liquid of clear, yellowish;
(4) above-mentioned solution carried out plastic film mulch on a glass and strike off, except desolventizing quadrol in a conventional oven, then being positioned in vacuum drying oven, making polyamic acid imidization complete, obtain polyimide composite film.
2. the preparation method of a kind of polyimide composite film according to claim 1, is characterized in that: the solid-liquid ratio of described PMDA and solvent quadrol is 1 g:20-30ml.
3. the preparation method of a kind of polyimide composite film according to claim 1, is characterized in that: the solid-liquid ratio of described ODPA and solvent quadrol is 1 g:20-30ml.
4. the preparation method of a kind of polyimide composite film according to claim 1, is characterized in that: the volume ratio of described solution A and B solution is 1:3-3:1.
5. the preparation method of a kind of polyimide composite film according to claim 1, is characterized in that: described in described step (3), the temperature of vacuum drying oven is 300-400 DEG C, and drying time is 3h.
CN201410488760.1A 2014-09-23 2014-09-23 Polyimide composite film preparation method Pending CN104327291A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410488760.1A CN104327291A (en) 2014-09-23 2014-09-23 Polyimide composite film preparation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410488760.1A CN104327291A (en) 2014-09-23 2014-09-23 Polyimide composite film preparation method

Publications (1)

Publication Number Publication Date
CN104327291A true CN104327291A (en) 2015-02-04

Family

ID=52402102

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410488760.1A Pending CN104327291A (en) 2014-09-23 2014-09-23 Polyimide composite film preparation method

Country Status (1)

Country Link
CN (1) CN104327291A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109666170A (en) * 2017-10-17 2019-04-23 中国石油化工股份有限公司 The preparation method of uniform high-performance polyimide film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109666170A (en) * 2017-10-17 2019-04-23 中国石油化工股份有限公司 The preparation method of uniform high-performance polyimide film
CN109666170B (en) * 2017-10-17 2021-09-03 中国石油化工股份有限公司 Preparation method of uniform high-performance polyimide film

Similar Documents

Publication Publication Date Title
CN103739840A (en) Preparation method of fullerene-polyimide conductive film
JP6476469B2 (en) Polyamic acid composition and polyimide composition
CN108117654B (en) Dimensionally stable polyimide film and preparation method thereof
WO2015186814A1 (en) Electrode manufacturing method
KR20130029805A (en) Process for production of polyimide film laminate, and polyimide film laminate
JP2014078416A (en) Electrode binder resin composition, electrode mixture paste, and electrode
JP7242157B2 (en) Polyimide precursor composition and method for producing insulating coating layer using the same
CN102884135A (en) Resin composition for printed circuit board
CN102993447B (en) A kind of preparation method of Kapton
CN104177639B (en) A kind of effectively insulating Kapton and preparation method thereof
CN104327291A (en) Polyimide composite film preparation method
CN104262661A (en) Method for controlling performance of polyimide film through imidization degree
CN109517341A (en) Biology base citric acid composition epoxy resin and its curing method and application
CN104211974B (en) A kind of preparation method of colored Kapton
CN105646915A (en) Synthesis of carbon material-polyimide composite film
CN103694487A (en) Preparation method of carbon fiber-polyimide composite film
JP2019099697A (en) Solution for coating on glass substrate
JP5009670B2 (en) Polyesterimide precursor and polyesterimide
CN103694486B (en) A kind of preparation method of enhanced polyimide composite film
CN104311849A (en) Preparing method of bi-component polyimide composite film
JP4780548B2 (en) Polyimide film, method for producing the same, and flexible circuit board
CN104327505A (en) Preparation method of graphene-blending polyimide conductive film
JPH0694509B2 (en) Polyimide resin ring
CN110845846B (en) A kind of white polyimide composite film and preparation method thereof
JP2009091441A (en) Polyimide precursor and polyimide

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150204