CN104317016A - In-line type optical assembly with storage function - Google Patents
In-line type optical assembly with storage function Download PDFInfo
- Publication number
- CN104317016A CN104317016A CN201410587563.5A CN201410587563A CN104317016A CN 104317016 A CN104317016 A CN 104317016A CN 201410587563 A CN201410587563 A CN 201410587563A CN 104317016 A CN104317016 A CN 104317016A
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- China
- Prior art keywords
- pcb board
- optical assembly
- supports
- pin
- pcb
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 title claims abstract description 69
- 239000013307 optical fiber Substances 0.000 claims description 12
- 238000003780 insertion Methods 0.000 claims description 11
- 230000037431 insertion Effects 0.000 claims description 11
- 230000006386 memory function Effects 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 2
- 230000006870 function Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000007423 decrease Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention relates to the field of optical modules, in particular to an in-line type optical assembly with a storage function. The in-line type optical assembly comprises a BOSA, an E2PROM, a header and a PCB. The two faces of the PCB can be welded, the BOSA comprises an LD, a PD, a pigtail bundle and a six-face machine base, the LD and the pigtail bundle are arranged on the two opposite faces of the six-face machine base respectively, and the PD is arranged on any one of the other four faces of the machine base. The in-line type optical assembly with the storage function is characterized in that the PCB is fixed to one face, opposite to the face provided with the PD, of the six-face machine base, the face, fixed to the six-face machine base, of the PCB is arranged to be the front of the PCB, the other face is arranged to be the back of the PCB, the E2PROM is welded to the front of the PCB, and the PCB is higher than the six-face machine base. The header is welded to the back of the PCB and particularly to the side edge of the six-face machine base, and is perpendicular to the PCB. The in-line type optical assembly with the storage function is reasonable in structural design, reduces the cost to the largest extent, and has high economic benefits.
Description
Technical field
The present invention relates to optical module field, specifically a kind of direct insertion optical assembly with memory function.
Background technology
Tradition optical module composition structure generally have: BOSA(optical device), laser driver limiting amplifier, controller, E
2pROM(storer), pcb board and shell, by by laser driver, limiting amplifier, controller, E
2pROM and BOSA is welded on the upper surface of pcb board, at the lower surface also row's of being welded with pin of pcb board, and the pin correspondence of row's pin and E
2the pin of PROM is connected, and its mode connected is embodied by the printed wire on pcb board, then outside pcb board, arranges shell fix encapsulation, by row's pin of arranging thus the connection of realization and peripheral hardware.Wherein, BOSA(optical device) by LD(laser diode), PD(photodiode), the assembling such as filter plate, filter plate base, pedestal, pencil tail optical fiber base forms, its application refers to that an optical fiber realizes a transmitting and a reception of light.
Along with technology in the sector constantly develops and improvement, usually adopt laser driver, limiting amplifier, the controller in new main control chip (calling in the following text " three-in-one chip ") replacement optical module at present, this three-in-one chip has data receiver, transmission and monitoring function.The appearance of three-in-one chip facilitates the development of optical module, reduces the production cost of optical module to a certain extent, and that also correspondingly can reduce pcb board takies volume.But because the production of traditional optical module will require according to the light power requirements amount of client and performance index the batch production carrying out optical module, and the different performance index request of current each client is embodied in E
2the difference of the test data stored in PROM, so when producing in batches, except E
2pROM other assembly outer be do not have vicissitudinous; In addition, the function had due to three-in-one chip is also known in the sector field, this is for optical module those of skill in the art, three-in-one chip in optical module can design separately, the production efficiency of optical module can be improved like this, also illustrate that three-in-one chip can be carried out the production of batch by client, the production cost of covert minimizing optical module manufacturer simultaneously.
For above-mentioned situation, client only needs when buying a large amount of optical modules to buy with the corresponding optical assembly storing data in fact, is connected the function that just can realize traditional optical module and have by corresponding connected mode with mass-produced three-in-one chip in advance.In addition, when considering the production cost of optical module, also to focus on it is considered that form the cost of optical module structure, such as: reduce the cost of pcb board, again plan to the position of welded structure on pcb board the size etc. reducing pcb board, to form the area taken large for the structure of existing optical module, the size of the pcb board used neither be rationalized most, optical device BOSA is the side being arranged on pcb board, and this connected mode also increases the volume of shell, too increases cost accordingly.
Summary of the invention
The object of the invention is the defect for existing in background technology, a kind of direct insertion optical assembly with memory function is provided, can realize being connected with the three-in-one chip designed separately, effectively can reduce the production cost of optical module, improve the production efficiency of optical module.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is: a kind of direct insertion optical assembly with memory function, comprises BOSA, E
2pROM, row pin, pcb board, described pcb board can weld on two sides, described BOSA comprises LD, PD, pencil tail optical fiber and six supports, LD and pencil tail optical fiber are separately positioned on two opposites of six supports, and PD is arranged on any one side at all the other four sides, it is characterized in that, described pcb board is fixed on PD in the one side of six vertical supports, the one side of fixing with six supports is set to the front of pcb board, and its another side is the back side of pcb board, described E
2pROM is welded on the front of pcb board; The height of described pcb board is higher than the height of six supports, and described row's pin is welded on the back side of pcb board, is specifically welded on the side higher than six supports, and row's pin is vertical with pcb board.
Preferred: the difference in height of described pcb board and six supports equals the height arranging pin base.
Preferred: described E
2pROM adopts the AT24C08 of the TSSOP8 encapsulation of atmel corp.
Another is preferred: described E
2pROM adopts TSSOP8 or UDFN of Giantec company.
Preferred: described E
2the placement direction of pin on pcb board of PROM is parallel with pencil tail optical fiber.
Preferred in addition: six described supports are provided with shell.
The invention has the beneficial effects as follows: this optical assembly can be connected with the three-in-one chip separately established, and can realize all functions and the effect of existing optical module, the application of alternative existing optical module; This optical assembly is the improvement to existing optical module composition structure, compared with existing optical module, under it takies volume, this is because pcb board in structure of the present invention is arranged on the seat surface of BOSA optical device, and BOSA optical device of the prior art is fixed on the side on pcb board, the former is layered relationship, and the latter is parallel expansion relation, so the size of the raw material of pcb board in the present invention is less than the size of pcb board of the prior art, decrease cost.
Moreover be that pcb board of the present invention has only welded E
2pROM and row's pin, compared with prior art, decrease the welding of three-in-one chip, this not only decreases produces the workload of optical module, improves production efficiency, and for the cost of producer, the cost of this optical assembly is the cost well below existing optical module, the price difference of its cost does not wait with the cost of three-in-one chip, and thus, the improvement of composition structure of the present invention decreases cost.
In addition, existing optical module all comprises a shell, and its Main Function is protection, insulation; because structure installment position of the present invention is overlapped way; the expansion mode parallel compared to prior art, the volume of its shell used also will reduce a lot, reduce the cost of shell.
Accompanying drawing explanation
Fig. 1, the structural representation of prior art optical module;
Fig. 2, optical assembly structural representation of the present invention.
Embodiment
Below in conjunction with accompanying drawing 1, Fig. 2 and preferred scheme, the specific embodiment of the present invention is described in further detail.
As described in Figure 1, be the structural representation of existing optical module, this optical module specifically comprises: BOSA 1, pcb board 2, E
2pROM 3, three-in-one chip 4, row pin 5, pencil tail optical fiber 6, outer cover 7 and base 8.Define the pros and cons of pcb board 2 in this instructions: the one side of fixing with six supports is set to the front of pcb board, its another side is the back side of pcb board, described E
2pROM 3 and three-in-one chip 4 weld (normally welding side by side) in the front of pcb board 2, described row's pin 5 is welded on the back side of pcb board 2, and described BOSA 1 is welded on the edge of pcb board 2 by the pin of PD11 and the pin of LD12, described pencil tail optical fiber 6 is connected on BOSA 1.After good according to above-mentioned composition anatomical connectivity, encapsulated by outer cover 7 and base 8 pairs of pcb boards 2.
As shown in Figure 2, be structural representation of the present invention, specifically a kind of direct insertion optical assembly with memory function, this optical assembly is the further improvement to existing optical module structure (structure namely in accompanying drawing 1), and this optical assembly comprises: BOSA 1, E
2pROM 3, row pin 5, pcb board 2.Described BOSA 1 comprises LD12, PD11, pencil tail optical fiber 6 and six supports 13.Described pcb board 2 can two sides welding.Up, down, left, right, front, rear side is defined as respectively according to the direction of the support of six shown in Fig. 2 13, according to this definition, described LD12 and pencil tail optical fiber 6 are separately positioned on two opposites of six supports, are the left side, the right side respectively, after PD11 is arranged on, described E
2pROM 3 is welded on the front of pcb board 2; Described pcb board to be fixed on PD11 on before six vertical supports 13, the height of described pcb board is higher than the height of six supports 13, embodiment is in fig. 2, pcb board 2 is higher than before six supports 13, described row's pin 5 is welded on the back side of pcb board 2, specifically be welded on the side higher than six supports 13, row's pin 5 is vertical with pcb board 2, the base of row's pin 5 and fitting above of six supports 13.
Embodiment: be connected with three-in-one chip by optical assembly of the present invention, namely can be used as optical module and uses, this optical assembly can be applied in the EPON in FTTX, be specifically applied on the ONT equipment in EPON and complete photoelectric converting function.This application process can be divided into two parts: be first the function pin correspondence in optical assembly of the present invention be connected with three-in-one chip 4, specifically pin LD-(laser instrument negative pole), LD+/PD-(laser instrument positive pole/backlight monitors photosensitive diode cathode common pin) on LD12 are connected with the laser driver in three-in-one chip 4, pin PD+ (backlight monitors photosensitive diode cathode) is connected with the controller in three-in-one chip 4, empty for CASE pin is connect metal shell; Pin Isource(power input monitoring pin by PD11) be connected with the controller in three-in-one chip 4, by VCC(voltage pin) be connected with power supply, OUT-(output signal negative pole), OUT+ (output signal positive pole) are connected with the limiting amplifier in three-in-one chip 4, by GND pin ground connection; And the E2PROM 3 on optical assembly is connected with the controller in three-in-one chip 4; Last again the optical assembly connected with three-in-one chip 4 is connected on ONT equipment, just can realizes the photoelectric converting function of EPON.
Optical assembly structure of the present invention is the improvement of the optical module structure to prior art, optical assembly after improvement is combined all functions that can replace optical module with three-in-one chip 4, for the manufacturer of present optical module, their cost of labor can be reduced, can enhance productivity, covert minimizing cost.
Claims (6)
1. the direct insertion optical assembly with memory function, comprises BOSA(1), E
2pROM(3), pin (5), pcb board (2) is arranged, described pcb board can weld on two sides, described BOSA(1) comprise LD(12), PD(11), pencil tail optical fiber (6) and six supports (13), LD(12) and pencil tail optical fiber (6) be separately positioned on two opposites of six supports (13), PD(11) any one side at six supports (13) all the other four sides upper is arranged on, it is characterized in that: described pcb board (2) is fixed on and PD(11) in the one side of six vertical supports, described E
2pROM(3) front of pcb board (2) is welded on; The height of described pcb board (2) is higher than the height of six supports (13), and described row's pin (5) is welded on the back side of pcb board (2), is specifically welded on the side higher than six supports, and row's pin (5) is vertical with pcb board (2).
2. the direct insertion optical assembly of band memory function according to claim 1, is characterized in that: described pcb board (2) equals with the difference in height of six supports (13) height arranging pin (5) base.
3. the direct insertion optical assembly of band memory function according to claim 1, is characterized in that: described E
2pROM(3) adopt be atmel corp TSSOP8 encapsulation AT24C08.
4. the direct insertion optical assembly of band memory function according to claim 1, is characterized in that: described E
2that PROM(3) adopt is TSSOP8 or UDFN of Giantec company.
5. the direct insertion optical assembly of band memory function according to claim 1, is characterized in that: described E
2pROM(3) placement direction of pin on pcb board (2) is parallel with pencil tail optical fiber (6).
6. the direct insertion optical assembly of band memory function according to claim 1, is characterized in that: six described supports (13) are provided with shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410587563.5A CN104317016A (en) | 2014-10-29 | 2014-10-29 | In-line type optical assembly with storage function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410587563.5A CN104317016A (en) | 2014-10-29 | 2014-10-29 | In-line type optical assembly with storage function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104317016A true CN104317016A (en) | 2015-01-28 |
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ID=52372267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410587563.5A Pending CN104317016A (en) | 2014-10-29 | 2014-10-29 | In-line type optical assembly with storage function |
Country Status (1)
| Country | Link |
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| CN (1) | CN104317016A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109557623A (en) * | 2019-02-22 | 2019-04-02 | 深圳海荻威光电科技有限公司 | A kind of optical fiber receiver-transmitter module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050036730A1 (en) * | 2003-08-15 | 2005-02-17 | Radiantech, Inc. | COB package type bi-directional transceiver module |
| US7396166B1 (en) * | 2007-03-07 | 2008-07-08 | Optomedia Technology Inc. | Optical transceiver module |
| CN201429715Y (en) * | 2009-07-09 | 2010-03-24 | 飞康技术(深圳)有限公司 | Single fiber bidirectional dual-port component |
| CN202189170U (en) * | 2011-08-29 | 2012-04-11 | 青岛海信宽带多媒体技术有限公司 | Low-cost plug-in optical module |
| CN204178015U (en) * | 2014-10-29 | 2015-02-25 | 无锡科尔华电子有限公司 | A kind of direct insertion optical assembly with memory function |
-
2014
- 2014-10-29 CN CN201410587563.5A patent/CN104317016A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050036730A1 (en) * | 2003-08-15 | 2005-02-17 | Radiantech, Inc. | COB package type bi-directional transceiver module |
| US7396166B1 (en) * | 2007-03-07 | 2008-07-08 | Optomedia Technology Inc. | Optical transceiver module |
| CN201429715Y (en) * | 2009-07-09 | 2010-03-24 | 飞康技术(深圳)有限公司 | Single fiber bidirectional dual-port component |
| CN202189170U (en) * | 2011-08-29 | 2012-04-11 | 青岛海信宽带多媒体技术有限公司 | Low-cost plug-in optical module |
| CN204178015U (en) * | 2014-10-29 | 2015-02-25 | 无锡科尔华电子有限公司 | A kind of direct insertion optical assembly with memory function |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109557623A (en) * | 2019-02-22 | 2019-04-02 | 深圳海荻威光电科技有限公司 | A kind of optical fiber receiver-transmitter module |
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Effective date of registration: 20160720 Address after: 214028 B22-A block, national high tech Industrial Development Zone, Jiangsu, Wuxi, China (B1) Applicant after: Wuxi Electronics & Instruments Industry Co., Ltd. Address before: Wuxi City, Jiangsu province Ximeilu 214112 District No. 43 Applicant before: Wuxi KEH Electronics Co., Ltd. |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150128 |
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| RJ01 | Rejection of invention patent application after publication |