CN104315368A - Clamping and fixing type LED lamp - Google Patents
Clamping and fixing type LED lamp Download PDFInfo
- Publication number
- CN104315368A CN104315368A CN201410469462.8A CN201410469462A CN104315368A CN 104315368 A CN104315368 A CN 104315368A CN 201410469462 A CN201410469462 A CN 201410469462A CN 104315368 A CN104315368 A CN 104315368A
- Authority
- CN
- China
- Prior art keywords
- heat sink
- lampshade
- type led
- burner
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 35
- 239000004411 aluminium Substances 0.000 claims description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 34
- 229910045601 alloy Inorganic materials 0.000 claims description 32
- 239000000956 alloy Substances 0.000 claims description 32
- 239000011777 magnesium Substances 0.000 claims description 29
- 239000011701 zinc Substances 0.000 claims description 28
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 27
- 229910052749 magnesium Inorganic materials 0.000 claims description 26
- 239000011135 tin Substances 0.000 claims description 26
- 229910052718 tin Inorganic materials 0.000 claims description 25
- 229910052725 zinc Inorganic materials 0.000 claims description 25
- 239000010949 copper Substances 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 20
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 20
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 17
- 229910018594 Si-Cu Inorganic materials 0.000 claims description 15
- 229910008465 Si—Cu Inorganic materials 0.000 claims description 15
- 230000032683 aging Effects 0.000 claims description 15
- 238000007670 refining Methods 0.000 claims description 15
- 229910052742 iron Inorganic materials 0.000 claims description 14
- 239000000470 constituent Substances 0.000 claims description 12
- 239000011133 lead Substances 0.000 claims description 11
- 239000000243 solution Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000012535 impurity Substances 0.000 claims description 10
- 239000000155 melt Substances 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 239000011265 semifinished product Substances 0.000 claims description 10
- 239000010936 titanium Substances 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 229910052726 zirconium Inorganic materials 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 238000004512 die casting Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 239000006104 solid solution Substances 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 claims description 7
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 229910052745 lead Inorganic materials 0.000 claims description 6
- 229910001017 Alperm Inorganic materials 0.000 claims description 5
- 229910000632 Alusil Inorganic materials 0.000 claims description 5
- 229910000978 Pb alloy Inorganic materials 0.000 claims description 5
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 5
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 5
- 229910001093 Zr alloy Inorganic materials 0.000 claims description 5
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 229910052748 manganese Inorganic materials 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 5
- 239000000047 product Substances 0.000 claims description 5
- 238000007493 shaping process Methods 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- ZBZJXHCVGLJWFG-UHFFFAOYSA-N trichloromethyl(.) Chemical group Cl[C](Cl)Cl ZBZJXHCVGLJWFG-UHFFFAOYSA-N 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 8
- 238000005286 illumination Methods 0.000 abstract description 3
- 238000013461 design Methods 0.000 abstract description 2
- 238000000926 separation method Methods 0.000 abstract 3
- -1 aluminum-silicon-copper Chemical compound 0.000 abstract 1
- 238000009434 installation Methods 0.000 description 14
- 238000003483 aging Methods 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 238000010791 quenching Methods 0.000 description 6
- 230000000171 quenching effect Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910018569 Al—Zn—Mg—Cu Inorganic materials 0.000 description 1
- 229910018565 CuAl Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910015372 FeAl Inorganic materials 0.000 description 1
- 229910017706 MgZn Inorganic materials 0.000 description 1
- 229910016583 MnAl Inorganic materials 0.000 description 1
- 229910007880 ZrAl Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
- F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/02—Alloys based on aluminium with silicon as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
- C22F1/043—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention relates to a clamping and fixing type LED (Light-Emitting Diode) lamp, and belongs to the technical field of illumination. The clamping and fixing type LED lamp comprises a lamp cap, a light source board and a lamp housing for connecting the lamp cap and the light source board, wherein the lamp cap is in the shape of a cylinder and is hollowed form an inner cavity, a driving board and a circuit board are vertically mounted in the inner cavity, a plurality of mounting bases are fixedly connected to the side wall of the inner cavity, two mounting holes are formed in the top end of the lamp cap, and plugs are respectively arranged inside the two mounting holes; the lamp housing comprises an outer lamp housing, a fixed ring and an inner lamp housing, the fixed ring is connected with the outer lamp housing, a separation board for dividing the inner lamp housing into two parts is arranged on the inner lamp housing, a radiating hole and a plurality of threaded holes are formed in the separation board, the light source board is connected with the lower end face of the separation board, a plurality of radiating boards are uniformly and annularly arranged on the side wall of the inner lamp housing facing the light source board, and the radiating boards are made of aluminum-silicon-copper based cast aluminum alloy. The LED lamp disclosed by the invention is good in mounting stability, and the radiating effect is promoted through reasonable design of the radiating boards.
Description
Technical field
The invention belongs to lighting technical field, relate to a kind of buckle type LED.
Background technology
LED refers to that a kind of can be the solid-state semiconductor device of visible ray by electric energy conversion, can be directly light electric energy conversion, the critical piece of LED is the wafer of a semiconductor, one end of wafer is attached on a support, one end is negative pole, the other end connects the positive pole of power supply, and whole wafer is got up by epoxy encapsulation.Semiconductor wafer P-type semiconductor and N-type semiconductor two parts composition, when electric current acts on this wafer by wire time, wafer will send energy with the form of photon.
LED illumination is most of for industrial lighting and commercial lighting on the market at present.The advantages such as brightness is high although LED lamp has, long service life, energy-conserving and environment-protective, but its price is at least three or four times of ordinary lamp and lantern, and the LED illumination lamp individuality of commercial and industrial is larger, weight is also large, and dismounting is inconvenient, and does not accomplish the theory being applicable to luminosity at home and economize on electricity, service time and limited amount in family, energy-conservation value can not be embodied completely, economically, not calculate.And due to family's utilization rate low, therefore be use the light fixture of design also less at home, result in family's use to be restricted, between each parts of LED, major part adopts and is threaded, ensure that although be threaded LED parts connect stable, but be threaded in the process of installing and keep in repair and extend the working time, reduce operating efficiency.
Summary of the invention
The object of the invention is to there are the problems referred to above for existing technology, propose the buckle type LED that a kind of structure is simple, stable connection is good.
Object of the present invention realizes by following technical proposal: a kind of buckle type LED, comprises the crown top of burner, light source board and the lampshade for connecting the crown top of burner and light source board;
The shape of the described crown top of burner is cylindric and the inside hollow out of the crown top of burner is formed with inner chamber, the drive plate and wiring board that are parallel to each other is vertically installed with in inner chamber, the sidewall of inner chamber is fixed with some mount pads, offer two installing holes on the top of the crown top of burner, in two installing holes, be all arranged with plug;
Described lampshade comprises outer lampshade, retainer plate and is arranged on the interior lampshade between outer lampshade and retainer plate, described retainer plate is connected with outer lampshade, interior lampshade is provided with the division board be divided into two by interior lampshade, division board offers the screwed hole that louvre and some and above-mentioned mount pad match, described light source board is connected with the lower surface of division board, and the sidewall facing light source board at interior lampshade is evenly surrounded with some heat sinks;
Wherein, described heat sink is obtained by Al-Si-Cu-based Birmasil, described Al-Si-Cu-based Birmasil is grouped into by the one-tenth of following mass percent: Si:9.50%-11.50%, Mg:0.10%-0.25%, Cu:2.00%-3.50%, Fe:0.60%-1.00%, Mn:0.30%-0.50%, Zn:0.30%-0.80%, Ni:0.20%-0.40%, Ti:0.12%-0.16%, Pb :≤0.08%, Sn:0.08%-0.20%, Zr :≤0.03%, individual event impurity content≤0.03% in other impurity elements, impurity element total content≤0.1%, surplus is aluminium.
In the Al-Si-Cu-based Birmasil that above-mentioned heat sink is used, Mg, Cu, Zn solid solubility in Al is comparatively large, and they can be dissolved in αsolidsolution the complex structure making solid solution on the one hand, can generate hardening constituent CuAl in the alloy on the other hand
2, Mg
2si etc., play the effect of solution strengthening, thus put forward heavy alloyed intensity.And Mg obviously can also improve tensile strength and the corrosion resistance of alloy.Not only can improve the adding of Zn Cu dissolution velocity in the alloy and solubility, thus put forward heavy alloyed plasticity, and hardening constituent MgZn can be formed with Mg
2compound, also Al-Zn-Mg-Cu hardening constituent can be formed with Al, Mg, Cu, thus play obvious invigoration effect, significantly improve tensile strength and the surrender hardness of alloy, but in order to prevent the stress corrosion cracking tendency increasing alloy, the consumption of Zn is too much unsuitable, and the Zn content in the aluminium alloy that therefore LED heat sink of the present invention is used controls at 0.30%-0.80%.Si is added in aluminium alloy, not only can put forward heavy alloyed mobility, and low-alloyed linear shrinkage ratio can be fallen, thus reduce its hot tendentiousness, make alloy have more excellent comprehensive casting character, also can carry heavy alloyed tensile strength and resistance to corrosion simultaneously.
Fe is generally with FeAl
3, Fe
2al
7, Fe
2si
2al
2be present in alloy etc. the metallic compound of needle-like or sheet, matrix produced and isolates effect, very easily produce stress concentration phenomenon and greatly fall low-alloyed mechanical performance, also can fall low-alloyed mobility simultaneously, increase its hot crackability.But in order to reduce in casting process, aluminium alloy is to the adhesion of mould, and it is necessary for there is a small amount of Fe in alloy, therefore adds the ferro element of 0.60%-1.00% in the alloy.Simultaneously, add a small amount of Mn and Ni in the alloy, play neutralization, the sheet or the acicular constituent that make to be rich in aluminium alloy Fe become the fine and closely woven texture such as Chinese character shape, herring-bone form, to reduce the adverse effect of the relative alloy of Fe, thus improve the mechanical performance of alloy.And Mn can form MnAl with Al
6compound, on the one hand can refinement recrystal grain, on the other hand can dissolved impurity Fe, thus reduces the adverse effect of Fe.Ni also can put forward heavy alloyed intensity and hardness and corrosion resistance.
In addition, a small amount of Ti add can crystal grain thinning, put forward heavy alloyed mechanical performance and corrosivity, low-alloyed hot cracking tendency can also fall.The solid solubility of Sn and Pb in Al is little, can improve the cutting ability of alloy.But they also can fall low-alloyed intensity, so consumption is too much unsuitable, in the aluminium alloy that LED heat sink of the present invention is used, Sn is controlled at 0.08%-0.20%, Pb in 0.08% scope.Zr forms ZrAl with Al in aluminium alloy
3compound, on the one hand can hinder recrystallization process, on the other hand can refinement recrystal grain, refinement cast sturcture.
In sum, the heat sink of buckle type LED of the present invention adopts Al-Si-Cu-based Birmasil to obtain, on the bases such as essential element Si, Mg, Cu, also added the elements such as Zn, Mn, Fe, Ti, Sn, Pb, Zr, by the reasonable compatibility of these elements, produce synergy, the combination property improving aluminium alloy is strong, be applied on heat sink, extended the service life of heat sink further.
Wherein, the processing technology of described heat sink comprises the steps:
S1, melting: according to constituent and the mass percent batching thereof of above-mentioned heat sink Al-Si-Cu-based Birmasil used, first add the aluminium ingot of half, magnesium, zinc, copper, tin and remaining aluminium ingot is added after aluminium ingot melts completely at 710-750 DEG C, until after magnesium, zinc, copper, tin melts completely, then add intermediate alloy and stir;
S2, die casting: the aluminium liquid after above-mentioned melting is successively carried out remove the gred, refinery by de-gassing, simultaneously first by mould and die preheating to 260-320 DEG C, at 680-700 DEG C, aluminium hydraulic pressure to be cast onto in mold cavity again, and under the high pressure of 65-75MPa after pressurize 10-16s, shaping heat sink semi-finished product;
S3, heat treatment: heat-treat above-mentioned heat sink semi-finished product, heat treatment comprises solution treatment and Ageing Treatment, wherein solid solution temperature is 535-550 DEG C, insulation 5-10 hour, artificial aging treatment temperature is 165-185 DEG C, and insulation 8-12 hour, cools to obtain heat sink finished product.
Wherein, magnesium described in step S1 is pure magnesium, and zinc is pure zinc, and tin is pure tin, copper is cathode copper; The alfer that the alumal that the alusil alloy of described intermediate alloy to be silicone content be 15-20%, Fe content are 10-15%, iron content are 8-12%, Ti content are the aluminum titanium alloy of 8-10%, lead content is the Al-Pb alloy of 5-10%, and zirconium content is the aluminium zircaloy of 5-8%.
Refining temperature described in step S2 is 700-740 DEG C, and refining time is 10-16min, and refining agent is carbon trichloride.
Extrusion process described in step S2 is first carry out slow shot with the speed of 0.18-0.28m/s, when injection stroke is 320-400mm, then carries out fast shot with the speed of 2.2-3.2m/s, thus is cast onto in mold cavity by aluminium hydraulic pressure.
The main purpose of solution treatment described in step S3 improves plasticity and the toughness of alloy, for follow-up age-hardening process is ready.The temperature and time of solution treatment must strictly control, and to ensure to make solute atoms be solidly soluted in solid solution to greatest extent, alloy can not be made again to melt simultaneously.In order to obtain maximum supersaturation solubility, to ensure the abundant solid solution of hardening constituent, the temperature and time of solution treatment is relatively longer, but temperature is too high can make it melt on the contrary, so the temperature of the solution treatment of the present invention's heat sink used is 535-550 DEG C, temperature retention time is 5-10 hour.And described Ageing Treatment essence to be Segregation solute atom form the result of harden zone, to eliminate the residual stress of alloy after quenching process, with play strengthening effect and prevent alloy from deforming, the phenomenon such as cracking.And key factor is aging temp and time in Ageing Treatment, the aging temperature preparing heat sink, in order to ensure strengthening effect, controls at 165-185 DEG C by the present invention, and temperature retention time is 8-12 hour.Wherein, after solution treatment, also comprise chilling Quenching Treatment before Ageing Treatment, the water temperature of Quenching Treatment is 80-90 DEG C, and the time is 3-4min.
In above-mentioned a kind of buckle type LED, the sidewall of the described crown top of burner is provided with projection and on interior lampshade, is provided with the groove matched with projection, and described projection is fastened in groove.
In above-mentioned a kind of buckle type LED, the heat sink of interior lampshade is provided with a location-plate, and on light source board, correspondence offers detent, and described location-plate is plugged on detent.
In above-mentioned a kind of buckle type LED, outer lampshade is provided with some snap-fit grooves, retainer plate is provided with some buckle projections, each buckle projection one_to_one corresponding is fastened in the snap-fit grooves on outer lampshade.
In above-mentioned a kind of buckle type LED, be also provided with two support nails in the crown top of burner, one end of two support nails is all resisted against on the inwall of the crown top of burner, and the other end is all against in the circuit board.
In above-mentioned a kind of buckle type LED, described drive plate is connected with division board.
Compared with prior art, the present invention includes the crown top of burner, light source board and lampshade, lampshade comprises interior lampshade, outer lampshade and retainer plate, be threaded by mount pad between the crown top of burner with interior lampshade, retainer plate is connected with outer lampshade buckle-type, interior lampshade is between outer lampshade and retainer plate, and light source board is between interior lampshade and retainer plate, progressive annexation is adopted between LED parts and parts, ensure that the stability connected between each parts of LED, do not need whole for LED dismounting when LED is damaged, facilitate LED and change parts, simultaneously LED have be equipped with between the parts of matching relationship guide locating device provided, this device ensure that the stability of the installation of LED, improve installation effectiveness.And the heat sink of buckle type LED of the present invention adopts Al-Si-Cu-based Birmasil to obtain, the heat sink obtained has good combination property, especially there is higher intensity, good corrosion resistance, and the perfect heat-dissipating of aluminium alloy of the present invention, be applied in LED and can be extended its service life.
Accompanying drawing explanation
Fig. 1 is exploded perspective view of the present invention.
Fig. 2 is sectional view of the present invention.
Fig. 3 is the structural representation of interior lampshade in a preferred embodiment of the present invention.
Fig. 4 is the structural representation at interior another visual angle of lampshade shown in Fig. 3.
Fig. 5 is the structural representation of outer lampshade in a preferred embodiment of the present invention.
In figure, 100, the crown top of burner; 110, drive plate; 120, wiring board; 130, mount pad; 140, installing hole; 150, plug; 160, projection; 170, groove; 180, support nail; 200, lampshade; 210, interior lampshade; 211, division board; 212, louvre; 213, screwed hole; 214, heat sink; 215, location-plate; 220, outer lampshade; 221, detent; 222, locating piece; 223, locating slot; 224, buckle projection; 225, snap-fit grooves; 230, retainer plate; 300, light source board; 310, lens; 320, wick plate.
Detailed description of the invention
Be below specific embodiments of the invention and by reference to the accompanying drawings, technical scheme of the present invention is further described, but the present invention be not limited to these embodiments.
As shown in Figures 1 to 5, this buckle type LED comprises the crown top of burner 100, light source board 300 and the lampshade 200 for connecting the crown top of burner 100 and light source board 300; The shape of the crown top of burner 100 is cylindric and the inside hollow out of the crown top of burner 100 is formed with inner chamber, the drive plate 110 and wiring board 120 that are parallel to each other is vertically installed with in inner chamber, the sidewall of inner chamber is fixed with multiple mount pad 130, two installing holes 140 are offered on the top of the crown top of burner 100, in two installing holes 140, be all arranged with plug 150, two plugs 150 are respectively used to the both positive and negative polarity connecting power supply; The interior lampshade 210 that lampshade 200 comprises outer lampshade 220, retainer plate 230 and is arranged between outer lampshade 220 and retainer plate 230, retainer plate 230 is connected with outer lampshade 220, interior lampshade 210 is provided with the division board 211 be divided into two by interior lampshade 210, division board 211 offers louvre 212 and multiple screwed hole 213, multiple screwed hole 213 and one to one mount pad 130 match, light source board 300 is connected mutually with the lower surface of division board 211, and the sidewall facing light source board 300 of interior lampshade 210 is evenly surrounded with multiple heat sink 214.
Above-mentioned plug 150 is fastened in the installing hole 140 on the crown top of burner 100, ensure that LED is installing the stability be connected with the crown top of burner 100 with plug 150 in the process used, not easily depart from, also offer connecting through hole at the middle part of plug 150 and the diameter at close plug 150 two ends of connecting through hole be all greater than middle part diameter, in the process that reality uses, the electric wire of the both positive and negative polarity of power supply is connected with the wiring board 120 in the crown top of burner 100 through connecting through hole, the setting that the diameter at plug 150 two ends is greater than mid diameter ensure that the damage of electric wire in LED transport and the process of installing reduces.
Preferably, drive plate 110 and wiring board 120 at right angle setting and be parallel to each other, avoid the crown top of burner 100 diameter that lateral arrangement causes too large, the aesthetic measure of LED outward appearance is caused to decline, save the installing space of wiring board 120 and drive plate 110, the width of wiring board 120 and drive plate 110 is all less than or equal to the width of the crown top of burner 100, thus can not laterally offset be there is when being arranged in the crown top of burner 100 in drive plate 110 and wiring board 120, ensure that the stability of the installation of drive plate 110 and wiring board 120, and one end of drive plate 110 and wiring board 120 is all resisted against on the division board 211 of interior lampshade 210.
Further, support nail 180 is also provided with in the crown top of burner 100, one end of support nail 180 is resisted against on the inwall of the crown top of burner 100, the other end is resisted against on wiring board 120, in the process of LED at installation and transportation, one end drive plate 110 of wiring board 120 and drive plate 110 is resisted against on the division board 211 of interior lampshade 210, the other end is just resisted against by support nail 180 on the inwall of the crown top of burner 100, thus wiring board 120 and drive plate 110 are installed in the crown top of burner 100, also the skew of position can not be there is in the process of installation and transportation, avoid because wiring board 120 and drive plate 110 position offset the damage of the LED caused, ensure that the stability of the installation of wiring board 120 and drive plate 110, improve the service life of LED.
The crown top of burner 100 of LED is threaded with interior lampshade 210, inwall in the crown top of burner 100 is fixed with three mount pads 130, three mount pads 130 are arranged in interior lampshade 210 in isosceles triangle, and be provided with on the division board 211 of interior lampshade 210 and three screwed holes 213 that mount pad 130 matches, mount pad 130 is arranged in screwed hole 213 by dowel screw, ensure that the stability that the crown top of burner 100 is connected with interior lampshade 210, LED also can not be damaged in the process of installing and transport, improve the service life of LED.
Further, contact with the light source board 300 of LED in the interior lower surface of lampshade 210 division board 211, sidewall is fixed with the heat sink 214 that the winding of some surrounding uniform ring is put, make LED in the process used, face can be passed on lampshade 200 by heat sink 214 by the heat that light source board 300 distributes, then distribute heat in air and go, ensure that the heat that LED discharges under the state of normal work can discharge, avoid light source board 300 and cause unnecessary damage because heat is too high, improve the service life of light source board 300.
Preferably, division board 211 also offers louvre 212, the UNICOM space of the crown top of burner 100 and interior lampshade 210, louvre 212 offer the thermal release produced that light source board 300 normally can better be worked, heat is distributed in the crown top of burner 100 of middle part hollow out by louvre 212 by the heat that light source board 300 produces, expand the heat-dissipating space of lampshade 200, avoid light source board 300 and can not get at heat normally discharging the damage caused.
Interior lampshade 210 is arranged in outer lampshade 220, lower surface is connected with retainer plate 230, retainer plate 230 and outer lampshade 220 adopt buckle to arrange, outer lampshade 220 is provided with snap-fit grooves 225, and on retainer plate 230, be provided with some projections of buckle one to one 224, each buckle projection 224 one_to_one corresponding is fastened in the snap-fit grooves 225 on outer lampshade 220, retainer plate 230 is also provided with locating slot 223, outer lampshade is also provided with corresponding locating piece 222, retainer plate 230 is arranged on assigned address by the matching relationship of locating slot 223 and locating piece 222 by retainer plate 230 fast, improve installation effectiveness, only the buckle projection 224 on retainer plate 230 need be aligned by locating slot 223 and locating piece 222 with the position of buckle when mounted, then firmly being pushed hard to outer lampshade 220 side by retainer plate 230 makes buckle projection 224 be fastened in snap-fit grooves 225, when light source board 300 changed by needs, only just light source board 300 need can be taken off by the step contrary with installation and change, compared with traditional retainer plate 230 adopts and is threaded, buckle-type fixed form, the set-up time of LED is in turn saved while ensureing the stability that LED installs, improve the efficiency of installation.
Preferably, the sidewall of the crown top of burner 100 is provided with projection 160 and on interior lampshade 210, is provided with the groove 170 matched, projection 160 is fastened in groove 170, in the process of LED assembling, the projection 160 on the crown top of burner 100 and the groove 170 be arranged on interior lampshade 210 sidewall is only needed to align mutually, then the projection 160 of the crown top of burner 100 is plugged in groove 170, this completes the installation of the crown top of burner 100 and interior lampshade 210, be arranged on interior lampshade 210 upper screwed hole 213 also to align with the mount pad 130 on the crown top of burner 100 simultaneously, tighten the dowel screw installed and just complete being connected of nut and interior lampshade 210, such setting ensure that the accuracy of installation, avoid in the process of installing because the connection of inaccurate the caused LED of installation site is unstable, cause the generation of the accident that can avoid, turn improve the efficiency of installation simultaneously.
Further, compare other the length of heat sink 214 of wherein one block of heat sink 214 on interior lampshade 210 is protruded, this heat sink 214 is light source board 300 being arranged on the location-plate 215 in interior lampshade 210, on light source board 300, opposite position offers detent 221, location-plate 215 is plugged on detent 221, in installation process, as long as the detent 221 on light source board 300 is matched with location-plate 215, just light source board 300 and interior lampshade 210 location is between the two completed, detent 221 on light source board 300 matches with location-plate 215 and ensure that positioning precision, simultaneously location-plate 215 is fastened on detent 221 and makes LED in the course of the work, light source board 300 can not be moved, avoid light source board 300 and cause damage when being subjected to displacement, the normal use of LED is caused to be broken down, add the service life of LED.
Further; light source board 300 comprises lens 310 and wick plate 320; lens 310 are arranged on the lower surface of wick plate 320; the light-transmissive lens 310 that lens 310 can make wick plate 320 send under the normal state used; and lens 310 can also the wick of protection setting on wick plate 320; ensure that the process of the installation and transportation used in LED can not cause damage, cause LED normally not use, improve the service life of LED.
Wherein said heat sink is obtained by Al-Si-Cu-based Birmasil, described Al-Si-Cu-based Birmasil is grouped into by the one-tenth of following mass percent: Si:9.50%-11.50%, Mg:0.10%-0.25%, Cu:2.00%-3.50%, Fe:0.60%-1.00%, Mn:0.30%-0.50%, Zn:0.30%-0.80%, Ni:0.20%-0.40%, Ti:0.12%-0.16%, Pb :≤0.08%, Sn:0.08%-0.20%, Zr :≤0.03%, individual event impurity content≤0.03% in other impurity elements, impurity element total content≤0.1%, surplus is aluminium.
Table 1: embodiment 1-3 is for the preparation of the constituent of tooth heat sink and mass percent
Embodiment 1
Melting: according to constituent and the mass percent batching thereof of the Al-Si-Cu-based Birmasil used of heat sink described in table 1 embodiment 1, first add the aluminium ingot of half, magnesium, zinc, copper, tin and remaining aluminium ingot is added after aluminium ingot melts completely at 710 DEG C, until after magnesium, zinc, copper, tin melts completely, then add intermediate alloy and stir; Wherein said magnesium is pure magnesium, and zinc is pure zinc, and tin is pure tin, copper is cathode copper; The alfer that the alumal that the alusil alloy of described intermediate alloy to be silicone content be 15-20%, Fe content are 10-15%, iron content are 8-12%, Ti content are the aluminum titanium alloy of 8-10%, lead content is the Al-Pb alloy of 5-10%, and zirconium content is the aluminium zircaloy of 5-8%.
Die casting: the aluminium liquid after above-mentioned melting is successively carried out remove the gred, refinery by de-gassing, wherein refining temperature is 700 DEG C, refining time is 10min, refining agent is carbon trichloride, simultaneously first by mould and die preheating to 260 DEG C, more first aluminium liquid is carried out slow shot with the speed of 0.18m/s at 680 DEG C, when injection stroke is 320mm, fast shot die casting is carried out in mold cavity again, and under the high pressure of 65MPa after pressurize 10s, shaping heat sink semi-finished product with the speed of 2.2m/s.
Heat treatment: above-mentioned heat sink semi-finished product are heat-treated, heat treatment comprises solution treatment and Ageing Treatment, wherein solid solution temperature is 535 DEG C, be incubated and in the water temperature of 80 DEG C, carry out Quenching Treatment 3min after 6 hours, artificial aging treatment temperature is 165 DEG C, be incubated 8 hours, naturally cool to obtain heat sink finished product.
Embodiment 2
Melting: according to constituent and the mass percent batching thereof of the Al-Si-Cu-based Birmasil used of heat sink described in table 1 embodiment 2, first add the aluminium ingot of half, magnesium, zinc, copper, tin and remaining aluminium ingot is added after aluminium ingot melts completely at 720 DEG C, until after magnesium, zinc, copper, tin melts completely, then add intermediate alloy and stir; Wherein said magnesium is pure magnesium, and zinc is pure zinc, and tin is pure tin, copper is cathode copper; The alfer that the alumal that the alusil alloy of described intermediate alloy to be silicone content be 15-20%, Fe content are 10-15%, iron content are 8-12%, Ti content are the aluminum titanium alloy of 8-10%, lead content is the Al-Pb alloy of 5-10%, and zirconium content is the aluminium zircaloy of 5-8%.
Die casting: the aluminium liquid after above-mentioned melting is successively carried out remove the gred, refinery by de-gassing, wherein refining temperature is 720 DEG C, refining time is 13min, refining agent is carbon trichloride, simultaneously first by mould and die preheating to 280 DEG C, more first aluminium liquid is carried out slow shot with the speed of 0.23m/s at 690 DEG C, when injection stroke is 360mm, fast shot die casting is carried out in mold cavity again, and under the high pressure of 70MPa after pressurize 13s, shaping heat sink semi-finished product with the speed of 2.8m/s.
Heat treatment: above-mentioned heat sink semi-finished product are heat-treated, heat treatment comprises solution treatment and Ageing Treatment, wherein solid solution temperature is 540 DEG C, be incubated and in the water temperature of 85 DEG C, carry out Quenching Treatment 3.5min after 8 hours, artificial aging treatment temperature is 170 DEG C, be incubated 10 hours, naturally cool to obtain heat sink finished product.
Embodiment 3
Melting: according to constituent and the mass percent batching thereof of the Al-Si-Cu-based Birmasil used of heat sink described in table 1 embodiment 3, first add the aluminium ingot of half, magnesium, zinc, copper, tin and remaining aluminium ingot is added after aluminium ingot melts completely at 740 DEG C, until after magnesium, zinc, copper, tin melts completely, then add intermediate alloy and stir; Wherein said magnesium is pure magnesium, and zinc is pure zinc, and tin is pure tin, copper is cathode copper; The alfer that the alumal that the alusil alloy of described intermediate alloy to be silicone content be 15-20%, Fe content are 10-15%, iron content are 8-12%, Ti content are the aluminum titanium alloy of 8-10%, lead content is the Al-Pb alloy of 5-10%, and zirconium content is the aluminium zircaloy of 5-8%.
Die casting: the aluminium liquid after above-mentioned melting is successively carried out remove the gred, refinery by de-gassing, wherein refining temperature is 730 DEG C, refining time is 15min, refining agent is carbon trichloride, simultaneously first by mould and die preheating to 300 DEG C, more first aluminium liquid is carried out slow shot with the speed of 0.26m/s at 700 DEG C, when injection stroke is 380mm, fast shot die casting is carried out in mold cavity again, and under the high pressure of 75MPa after pressurize 16s, shaping heat sink semi-finished product with the speed of 3.0m/s.
Heat treatment: above-mentioned heat sink semi-finished product are heat-treated, heat treatment comprises solution treatment and Ageing Treatment, wherein solid solution temperature is 545 DEG C, be incubated and in the water temperature of 90 DEG C, carry out Quenching Treatment 4min after 10 hours, artificial aging treatment temperature is 180 DEG C, be incubated 10 hours, naturally cool to obtain heat sink finished product.
Heat sink obtained in embodiment 1-3 is carried out performance test, and test result is as shown in table 2 and table 3.
The heat sink that table 2: embodiment of the present invention 1-3 obtains the performance test results at room temperature
The heat sink that table 3: embodiment of the present invention 1-3 obtains the performance test results at high temperature
Comparative example is the heat sink that common ADC12 aluminium alloy obtains.
In sum, the heat sink of buckle type LED of the present invention adopts Al-Si-Cu-based Birmasil to obtain, by the reasonable compatibility between simple technique and each constituent, mechanical property, the mechanical performance of the heat sink obtained are all better, corrosion resistance, thermal diffusivity are good, be applied in LED, extended the service life of LED.
Specific embodiment described herein is only to the explanation for example of the present invention's spirit.Those skilled in the art can make various amendment or supplement or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present invention or surmount the scope that appended claims defines.
Claims (10)
1. a buckle type LED, comprise the crown top of burner, light source board and the lampshade for connecting the crown top of burner and light source board, it is characterized in that, the shape of the described crown top of burner is cylindric and the inside hollow out of the crown top of burner is formed with inner chamber, the drive plate and wiring board that are parallel to each other is vertically installed with in inner chamber, the sidewall of inner chamber is fixed with some mount pads, offers two installing holes on the top of the crown top of burner, in two installing holes, be all arranged with plug, described lampshade comprises outer lampshade, retainer plate and is arranged on the interior lampshade between outer lampshade and retainer plate, described retainer plate is connected with outer lampshade, interior lampshade is provided with the division board be divided into two by interior lampshade, division board offers the screwed hole that louvre and some and above-mentioned mount pad match, described light source board is connected with the lower surface of division board, and the sidewall facing light source board at interior lampshade is evenly surrounded with some heat sinks, wherein, described heat sink is obtained by Al-Si-Cu-based Birmasil, described Al-Si-Cu-based Birmasil is grouped into by the one-tenth of following mass percent: Si:9.50%-11.50%, Mg:0.10%-0.25%, Cu:2.00%-3.50%, Fe:0.60%-1.00%, Mn:0.30%-0.50%, Zn:0.30%-0.80%, Ni:0.20%-0.40%, Ti:0.12%-0.16%, Pb :≤0.08%, Sn:0.08%-0.20%, Zr :≤0.03%, individual event impurity content≤0.03% in other impurity elements, impurity element total content≤0.1%, surplus is aluminium.
2. buckle type LED according to claim 1, is characterized in that, the processing technology of described heat sink comprises the steps:
S1, melting: according to constituent and the mass percent batching thereof of the Al-Si-Cu-based Birmasil used of heat sink in claim 1, first add the aluminium ingot of half, magnesium, zinc, copper, tin and remaining aluminium ingot is added after aluminium ingot melts completely at 710-750 DEG C, until after magnesium, zinc, copper, tin melts completely, then add intermediate alloy and stir;
S2, die casting: the aluminium liquid after above-mentioned melting is successively carried out remove the gred, refinery by de-gassing, simultaneously first by mould and die preheating to 260-320 DEG C, at 680-700 DEG C, aluminium hydraulic pressure to be cast onto in mold cavity again, and under 65-75MPa after pressurize 10-16s, shaping heat sink semi-finished product;
S3, heat treatment: heat-treat above-mentioned heat sink semi-finished product, heat treatment comprises solution treatment and Ageing Treatment, wherein solid solution temperature is 535-550 DEG C, insulation 5-10 hour, artificial aging treatment temperature is 165-185 DEG C, and insulation 8-12 hour, cools to obtain heat sink finished product.
3. buckle type LED according to claim 2, is characterized in that, magnesium described in the step S1 of heat sink processing technology is pure magnesium, and zinc is pure zinc, and tin is pure tin, copper is cathode copper; The alfer that the alumal that the alusil alloy of described intermediate alloy to be silicone content be 15-20%, Fe content are 10-15%, iron content are 8-12%, Ti content are the aluminum titanium alloy of 8-10%, lead content is the Al-Pb alloy of 5-10%, and zirconium content is the aluminium zircaloy of 5-8%.
4. buckle type LED according to claim 2, is characterized in that, the refining temperature described in the step S2 of heat sink processing technology is 700-740 DEG C, and refining time is 10-16min, and refining agent is carbon trichloride.
5. buckle type LED according to claim 2, it is characterized in that, extrusion process described in the step S2 of heat sink processing technology first carries out injection with the speed of 0.18-0.28m/s, when injection stroke is 320-400mm, then carries out injection with the speed of 2.2-3.2m/s.
6. buckle type LED according to claim 1, is characterized in that, the sidewall of the described crown top of burner is provided with projection and on interior lampshade, is provided with the groove matched with projection, and described projection is fastened in groove.
7. the buckle type LED according to claim 1 or 6, is characterized in that, the heat sink of described interior lampshade is provided with a location-plate, and on light source board, correspondence offers detent, and described location-plate is plugged on detent.
8. buckle type LED according to claim 1, is characterized in that, described outer lampshade is provided with some snap-fit grooves, and retainer plate is provided with some buckle projections, and each buckle projection one_to_one corresponding is fastened in the snap-fit grooves on outer lampshade.
9. buckle type LED according to claim 6, is characterized in that, is also provided with two support nails in the described crown top of burner, and one end of two support nails is all resisted against on the inwall of the crown top of burner, and the other end is all against in the circuit board.
10. buckle type LED according to claim 1, is characterized in that, described drive plate is connected with division board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410469462.8A CN104315368B (en) | 2014-09-15 | A kind of buckle type LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410469462.8A CN104315368B (en) | 2014-09-15 | A kind of buckle type LED |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104315368A true CN104315368A (en) | 2015-01-28 |
| CN104315368B CN104315368B (en) | 2017-01-04 |
Family
ID=
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017135463A1 (en) * | 2016-02-05 | 2017-08-10 | 学校法人芝浦工業大学 | Aluminum alloy for casting, aluminum alloy member and method for producing aluminum alloy member |
| CN108149040A (en) * | 2017-12-04 | 2018-06-12 | 东南大学 | The ingredient of evacuated die-casting process aluminium silicon magnesium-manganese alloy and optimization of Heat Treatment Process method |
| WO2018176738A1 (en) * | 2017-04-01 | 2018-10-04 | 杭州安得电子有限公司 | Led lamp |
| CN112877574A (en) * | 2020-12-29 | 2021-06-01 | 安徽将煜电子科技有限公司 | Corrosion-resistant material for LED street lamp and preparation method of street lamp |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101376937A (en) * | 2008-10-08 | 2009-03-04 | 华南理工大学 | Squeeze casting Al-Si-Cu alloy material |
| WO2011136640A2 (en) * | 2010-04-29 | 2011-11-03 | Bever Innovations B.V. | Roof lighting suitable for lighting from above a terrain under a roof |
| JP2011233469A (en) * | 2010-04-30 | 2011-11-17 | Excel Kk | Led lamp and lighting device using the same |
| CN103883908A (en) * | 2014-03-14 | 2014-06-25 | 浙江生辉照明有限公司 | Directional lighting led lamp |
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101376937A (en) * | 2008-10-08 | 2009-03-04 | 华南理工大学 | Squeeze casting Al-Si-Cu alloy material |
| WO2011136640A2 (en) * | 2010-04-29 | 2011-11-03 | Bever Innovations B.V. | Roof lighting suitable for lighting from above a terrain under a roof |
| JP2011233469A (en) * | 2010-04-30 | 2011-11-17 | Excel Kk | Led lamp and lighting device using the same |
| CN103883908A (en) * | 2014-03-14 | 2014-06-25 | 浙江生辉照明有限公司 | Directional lighting led lamp |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017135463A1 (en) * | 2016-02-05 | 2017-08-10 | 学校法人芝浦工業大学 | Aluminum alloy for casting, aluminum alloy member and method for producing aluminum alloy member |
| WO2018176738A1 (en) * | 2017-04-01 | 2018-10-04 | 杭州安得电子有限公司 | Led lamp |
| CN108149040A (en) * | 2017-12-04 | 2018-06-12 | 东南大学 | The ingredient of evacuated die-casting process aluminium silicon magnesium-manganese alloy and optimization of Heat Treatment Process method |
| CN112877574A (en) * | 2020-12-29 | 2021-06-01 | 安徽将煜电子科技有限公司 | Corrosion-resistant material for LED street lamp and preparation method of street lamp |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202001885U (en) | Light emitting diode (LED) light source module of LED lamp | |
| CN201196356Y (en) | High-power LED road lamp | |
| CN104315369A (en) | LED lamp | |
| CN104315368A (en) | Clamping and fixing type LED lamp | |
| CN104315368B (en) | A kind of buckle type LED | |
| CN101576241A (en) | Radiating method of LED radiator and radiator for implementing same | |
| CN101907250A (en) | A street light device and its fixing structure | |
| CN209569625U (en) | A kind of easy-to-dismount LED module | |
| CN105526536A (en) | LED spot lamp | |
| CN203628355U (en) | Airflow heat dissipation type LED (Light Emitting Diode) lamp | |
| CN203115909U (en) | Integrated LED (Light Emitting Diode) radiator | |
| CN205640331U (en) | Novel light -emitting diode (LED) bulb | |
| CN106940003A (en) | A kind of LED shell | |
| CN211059880U (en) | High heat conduction L ED tunnel lamp of intelligence | |
| CN203784876U (en) | Improved LED (Light-Emitting Diode) lamp cup and forming mold thereof | |
| CN208204944U (en) | LED lamp heat sink | |
| CN201854098U (en) | Motor die-casting stator component | |
| CN105003868A (en) | LED streetlamp module | |
| CN211600366U (en) | Split type module projecting lamp | |
| CN102628569B (en) | Straight-down negative LED bay light | |
| CN203823571U (en) | High-power LED waterborne fish attraction lamp structure | |
| CN210877477U (en) | Die fixing base structure of zinc alloy rapid forming machine | |
| CN204806208U (en) | LED driving lamp between daytime | |
| CN204005853U (en) | LED lamp radiator | |
| CN203024109U (en) | Active fast heat-conduction radiating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170104 Termination date: 20170915 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |