CN104302158A - Machine case capable of dissipating heat through method of liquid cooling - Google Patents
Machine case capable of dissipating heat through method of liquid cooling Download PDFInfo
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- CN104302158A CN104302158A CN201410561232.4A CN201410561232A CN104302158A CN 104302158 A CN104302158 A CN 104302158A CN 201410561232 A CN201410561232 A CN 201410561232A CN 104302158 A CN104302158 A CN 104302158A
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Abstract
The invention relates to the field of electrical cabinets, in particular to a machine case capable of dissipating heat through a method of liquid cooling. The machine case capable of dissipating heat through the method of liquid cooling comprises a case body, wherein electrical elements are installed inside the case body, the case body is airtight and is provided with a refrigerant inlet and a refrigerant outlet, the refrigerant inlet is connected with atomizers, and the atomizers are located inside the case body. When the machine case capable of dissipating heat through the method of liquid cooling is used, cooling liquid entering the case body from the refrigerant inlet is firstly atomized before arriving at the electrical elements, the atomized liquid is still poured on the heating electrical elements as small liquid drops, when making contact with the heating electrical elements, the small liquid drops are instantaneously gasified, and therefore heat dissipated by the electrical elements is taken away. The machine case capable of dissipating heat through the method of liquid cooling realizes direct liquid cooling of the electrical elements, and solves the problem of low heat dissipation efficiency of high heating flux electronic equipment based on the phase change principle.
Description
Technical field
The present invention relates to electric distribution cabinet field, particularly relate to a kind of liquid cools cooling cabinet.
Background technology
At present, various electronics and power equipment are all just towards high-frequency, high-power and miniaturized future development, and in the process of development, heat dissipation problem is one of the most key problem always.The quality of heat dispersion directly affects the height of respective electric equipment performance.
The cooling of electronics and electrical device mainly contains three kinds of modes, i.e. gas cooled, liquid cools and hot pipe conducting cooling.Gas cooled comprises free convection cooling and forced exhaust cooling, and the structure of gas quench system is simple and cost is lower.But because heat flux density is lower, even adopt the cooling of helium forced exhaust, be also difficult to obtain higher heat flux density, radiating effect is often unsatisfactory.Whether liquid cools is the main cooling means that current high heating power electronic equipment realizes heat radiation, contact with heater members according to coolant, and liquid cools can be divided into Indirect liquid to cool and direct liquid cools.The liquid cools mainly Indirect liquid cooling of current electronic equipment, the radiating efficiency of this cooling means, by the impact of the many factors such as laminating degree, coolant guiding channel form of coolant, cold drawing material, heater members and cold drawing, causes its heat-sinking capability to have certain limitation.Along with the development of electronic technology, the density of heat flow rate of electronic equipment is increasing, and every square centimeter can reach a few hectowatt and even to go up kilowatt, and Indirect liquid cooling can not meet radiating requirements.Hot pipe conducting cooling structure is complicated, and cost is higher, applies less, no longer describe in detail herein in the cabinet equipment of miniaturization.
Summary of the invention
The object of the present invention is to provide a kind of liquid cools cooling cabinet, to solve the direct liquid cools realized electric component in cabinet, solve the inefficient problem of existing cabinet equipment cooling.
In order to solve the problem, liquid cools cooling cabinet of the present invention is by the following technical solutions: liquid cools cooling cabinet, comprise casing, in casing, electric component is installed, described casing is containment housing, casing is provided with refrigerant import and refrigerant exit, and refrigerant import is connected with atomizer, and atomizer is arranged in casing.
Described atomizer is arranged in groups, and the atomizer of same group is assemblied on corresponding liquid separatnig plate, is provided with the public passage communicated with each atomizer on it, the refrigerant inlet communication of described public passage and casing in liquid separatnig plate.
Described atomizer has at least two groups, and the refrigerant import of casing is communicated with each public passage by liquid-separating block.
The refrigerant import and export place of described casing is respectively equipped with fluid connector.
Described electric component comprises at least one layer circuit board and upper set device thereof.
Casing is also provided with the electric connector be electrically connected with described electric component.
Casing due to liquid cools cooling cabinet of the present invention is containment housing, casing is provided with refrigerant import and refrigerant exit, and refrigerant import is connected with atomizer, atomizer is arranged in casing, therefore, in the process used, first the cooling liquid entering to casing through refrigerant import can be atomized between arrival electric component, liquid after atomization remains and drenches on the electric component of heating with the state of droplet, and after droplet contacts with the electric component of heating, it is by transient evaporation, thus take away the heat that electric component distributes, present invention achieves the direct liquid cools of electric component, the low problem of the radiating efficiency of high heat flux electronic equipment is solved by Transformation Principle.
Further, liquid separatnig plate setting party to the assembling of atomizer and layout.
Accompanying drawing explanation
Fig. 1 is the structural representation (band perspective) of the embodiment of liquid cools cooling cabinet;
Fig. 2 is the movable route schematic diagram of refrigerant in the embodiment of liquid cools cooling cabinet;
Fig. 3 is the exploded view of casing;
Fig. 4 is the structural representation of liquid-separating block and tube connector;
Fig. 5 is the structural representation of liquid separatnig plate and atomizer.
Embodiment
The embodiment of liquid cools cooling cabinet, as Figure 1-5, this liquid cools cooling cabinet comprises casing, is provided with electric component in casing.
Casing is containment housing, it panel comprising box frame 11 and be assemblied on box frame, wherein front panel 12, rear board 13 are split-type structural with other panel, and the two is provided with sealing gasket 14 respectively and between box frame 11, ensures the airtight of casing with this.The top panel of casing is provided with refrigerant import and refrigerant exit, refrigerant import department is provided with inlet fluid connector 15, exit is provided with outlet fluid connection 16, refrigerant import is connected with atomizer 17, atomizer 17 is arranged in casing, in the present embodiment, atomizer 17 is divided into two groups of settings, two groups of atomizers are oppositely arranged, the atomizer of same group is assemblied on corresponding liquid separatnig plate 18, liquid separatnig plate 18 is bolted on the corresponding side in casing, wherein be provided with the public passage communicated with each atomizer on it, public passage is by the refrigerant inlet communication of the import 101 on liquid separatnig plate 18 with casing, in the present embodiment, the refrigerant import of casing is by liquid-separating block 19(three-way connection) and be communicated with corresponding public passage to the tube connector 20 that liquid-separating block connects.
Electric component comprises the circuit board 21 of multilayer and upper set device 22 thereof, and in the present embodiment, the both sides up and down of every layer circuit board are equipped with described atomizer.The conveniently connection of electric component and external equipment, casing is also provided with the electric connector 23 be electrically connected with electric component.
Claims (6)
1. liquid cools cooling cabinet, comprises casing, is provided with electric component in casing, it is characterized in that, described casing is containment housing, and casing is provided with refrigerant import and refrigerant exit, and refrigerant import is connected with atomizer, and atomizer is arranged in casing.
2. liquid cools cooling cabinet according to claim 1, it is characterized in that, described atomizer is arranged in groups, the atomizer of same group is assemblied on corresponding liquid separatnig plate, the public passage communicated with each atomizer on it is provided with, the refrigerant inlet communication of described public passage and casing in liquid separatnig plate.
3. liquid cools cooling cabinet according to claim 2, is characterized in that, described atomizer has at least two groups, and the refrigerant import of casing is communicated with each public passage by liquid-separating block.
4. liquid cools cooling cabinet according to claim 1, is characterized in that, the refrigerant import and export place of described casing is respectively equipped with fluid connector.
5. the liquid cools cooling cabinet according to any one of claim 1-4, is characterized in that, described electric component comprises at least one layer circuit board and upper set device thereof.
6. the liquid cools cooling cabinet according to any one of claim 1-4, is characterized in that, casing is also provided with the electric connector be electrically connected with described electric component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410561232.4A CN104302158A (en) | 2014-10-21 | 2014-10-21 | Machine case capable of dissipating heat through method of liquid cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410561232.4A CN104302158A (en) | 2014-10-21 | 2014-10-21 | Machine case capable of dissipating heat through method of liquid cooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104302158A true CN104302158A (en) | 2015-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410561232.4A Pending CN104302158A (en) | 2014-10-21 | 2014-10-21 | Machine case capable of dissipating heat through method of liquid cooling |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105658037A (en) * | 2016-03-18 | 2016-06-08 | 苏州大景能源科技有限公司 | Integrated liquid-cooling heat dissipation case |
| CN105652993A (en) * | 2016-03-18 | 2016-06-08 | 苏州大景能源科技有限公司 | Integrated liquid-cooled heat dissipation computer case |
| CN107203253A (en) * | 2017-06-30 | 2017-09-26 | 广东合新材料研究院有限公司 | A kind of contact active Phase cooling structure and passive Phase cooling structure |
| WO2017215161A1 (en) * | 2016-06-16 | 2017-12-21 | 广东合一新材料研究院有限公司 | Cooling system of working medium contact type for heat dissipation of computer and data centre |
| CN108664091A (en) * | 2018-03-22 | 2018-10-16 | 苏州晨霞美合智能科技有限公司 | A kind of computer cabinet of good heat dissipation effect |
| CN110112112A (en) * | 2019-04-12 | 2019-08-09 | 中国电子科技集团公司第三十八研究所 | Misting cooling formula cold plate |
| CN114501945A (en) * | 2022-01-26 | 2022-05-13 | 华南理工大学 | A kind of spray liquid cooling phase change module for server, control method and manufacturing method thereof |
-
2014
- 2014-10-21 CN CN201410561232.4A patent/CN104302158A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105658037A (en) * | 2016-03-18 | 2016-06-08 | 苏州大景能源科技有限公司 | Integrated liquid-cooling heat dissipation case |
| CN105652993A (en) * | 2016-03-18 | 2016-06-08 | 苏州大景能源科技有限公司 | Integrated liquid-cooled heat dissipation computer case |
| WO2017215161A1 (en) * | 2016-06-16 | 2017-12-21 | 广东合一新材料研究院有限公司 | Cooling system of working medium contact type for heat dissipation of computer and data centre |
| CN107203253A (en) * | 2017-06-30 | 2017-09-26 | 广东合新材料研究院有限公司 | A kind of contact active Phase cooling structure and passive Phase cooling structure |
| CN108664091A (en) * | 2018-03-22 | 2018-10-16 | 苏州晨霞美合智能科技有限公司 | A kind of computer cabinet of good heat dissipation effect |
| CN110112112A (en) * | 2019-04-12 | 2019-08-09 | 中国电子科技集团公司第三十八研究所 | Misting cooling formula cold plate |
| CN114501945A (en) * | 2022-01-26 | 2022-05-13 | 华南理工大学 | A kind of spray liquid cooling phase change module for server, control method and manufacturing method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150121 |