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CN104300070A - Bendable LED lamp filament and bulb structure thereof - Google Patents

Bendable LED lamp filament and bulb structure thereof Download PDF

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Publication number
CN104300070A
CN104300070A CN201410521305.7A CN201410521305A CN104300070A CN 104300070 A CN104300070 A CN 104300070A CN 201410521305 A CN201410521305 A CN 201410521305A CN 104300070 A CN104300070 A CN 104300070A
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Prior art keywords
led
glass substrate
transparent glass
chip
led chip
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秦会斌
龚三三
刘丹
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Hangzhou Dianzi University
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Hangzhou Dianzi University
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Priority to CN201410521305.7A priority Critical patent/CN104300070A/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开一种可弯折的LED灯丝及其灯泡结构。该LED灯丝包括透明玻璃基板、LED芯片、荧光粉胶层、两个设于透明玻璃基板外内弧面上的电极、透明玻璃基板两端的电极引出线、金线;LED芯片包括多个芯片单元,每个芯片单元由三个蓝光LED芯片与一个红光LED芯片构成;蓝光LED芯片与红光LED芯片均为倒装芯片,芯片按P-N结顺序设置电极上。一种LED灯由多个LED灯丝、泡壳、螺旋灯头、散热保护气体组成;多个上述的LED灯丝采用两串两并的方式连接密封在泡壳内。本发明通过将透明玻璃基板设置成弧形,有效的增大出光角度和提高出光效率;设置蓝光芯片间隔红光芯片,有效的提高了LED灯丝的显色指数。

The invention discloses a bendable LED filament and a bulb structure thereof. The LED filament includes a transparent glass substrate, an LED chip, a fluorescent powder glue layer, two electrodes arranged on the outer and inner curved surfaces of the transparent glass substrate, electrode lead wires at both ends of the transparent glass substrate, and gold wires; the LED chip includes a plurality of chip units , each chip unit is composed of three blue LED chips and one red LED chip; the blue LED chip and the red LED chip are both flip chips, and the chips are arranged on the electrodes in the order of PN junctions. An LED lamp is composed of a plurality of LED filaments, a bulb shell, a spiral lamp cap, and a heat-dissipating protective gas; the plurality of LED filaments are connected and sealed in the bulb shell in the form of two strings and two parallels. The invention effectively increases the light output angle and improves the light output efficiency by arranging the transparent glass substrate in an arc shape; arranging the blue light chip and the red light chip at intervals effectively improves the color rendering index of the LED filament.

Description

一种可弯折的LED灯丝及其灯泡结构A bendable LED filament and its bulb structure

技术领域 technical field

本发明涉及LED封装及其照明领域,尤其是指一种可弯折的LED灯丝及其灯泡结构。 The invention relates to the field of LED packaging and lighting thereof, in particular to a bendable LED filament and a bulb structure thereof.

背景技术 Background technique

随着科技的发展,LED灯逐步取代了传统照明灯具。现有LED灯一般包括LED灯丝、设置在LED支架两侧的LED芯片以及包裹住LED芯片的荧光胶。现有的LED灯一般是采用蓝光芯片与荧光粉激发白光,其显色指数较低。此外,现有LED支架一般采用的是铜、铝等金属材料注入PPA构成,由于材料本身的不透光性,其出光角度最多能够在其设置芯片的一侧实现180°,而且PPA材料随着时间的推移易于老化和黄化变色,影响其出光效率。 With the development of science and technology, LED lights have gradually replaced traditional lighting fixtures. Existing LED lamps generally include LED filaments, LED chips arranged on both sides of the LED bracket, and fluorescent glue that wraps the LED chips. Existing LED lamps generally use blue light chips and phosphors to excite white light, and their color rendering index is low. In addition, the existing LED brackets are generally composed of metal materials such as copper and aluminum injected into PPA. Due to the opacity of the material itself, the light output angle can be at most 180° on the side where the chip is installed, and the PPA material will be used as the Over time, it is prone to aging and yellowing and discoloration, which affects its light extraction efficiency.

发明内容 Contents of the invention

本发明的一个目的是针对现有技术的不足,提供一种可弯折的LED灯丝,该LED灯丝克服LED灯显色指数低、出光效率低、蓝光泄露灯等缺点。 An object of the present invention is to provide a bendable LED filament to overcome the shortcomings of the prior art, which overcomes the disadvantages of low color rendering index, low light extraction efficiency, and blue light leakage of LED lamps.

本发明LED灯丝包括透明玻璃基板、LED芯片、荧光粉胶层、两个设于透明玻璃基板外内弧面上的电极、透明玻璃基板两端的电极引出线、金线;所述的透明玻璃基板为弧形条状;所述的LED芯片包括多个芯片单元,每个芯片单元由三个蓝光LED芯片与一个红光LED芯片构成;所述的蓝光LED芯片与红光LED芯片均为倒装芯片,芯片按P-N结顺序设置在透明玻璃基板外内弧面的电极上;透明玻璃基板外内弧面上的电极通过金线与透明玻璃基板两端的电极引出线电连接;透明玻璃基板、LED芯片采用灌胶技术包裹有荧光粉胶层。 The LED filament of the present invention includes a transparent glass substrate, an LED chip, a fluorescent powder adhesive layer, two electrodes arranged on the outer and inner arc surfaces of the transparent glass substrate, electrode lead wires and gold wires at both ends of the transparent glass substrate; the transparent glass substrate The LED chip is arc-shaped; the LED chip includes a plurality of chip units, and each chip unit is composed of three blue LED chips and one red LED chip; the blue LED chip and the red LED chip are flip-chip Chip, the chip is set on the electrodes on the outer and inner curved surfaces of the transparent glass substrate in the order of P-N junction; the electrodes on the outer and inner curved surfaces of the transparent glass substrate are electrically connected to the electrode leads at both ends of the transparent glass substrate through gold wires; the transparent glass substrate, LED The chip is wrapped with a fluorescent powder glue layer by glue filling technology.

所述的透明玻璃基板的弧形长度为30.0mm~35.0mm,宽度为0.8mm~1.0mm,厚度为0.2~0.4mm; The arc length of the transparent glass substrate is 30.0mm-35.0mm, the width is 0.8mm-1.0mm, and the thickness is 0.2-0.4mm;

所述的荧光粉胶层的材质为荧光粉与硅胶的混合材料; The material of the fluorescent powder adhesive layer is a mixed material of fluorescent powder and silica gel;

本发明LED灯丝采用弧形透明玻璃作为封装基板(即透明玻璃基板),增大了球形灯泡光源的辐射出光面,进而增大了其光通量,提高了出光效率,采用蓝光LED芯片和红光LED芯片混合封装方式,有效的增加了LED灯丝的显色指数,更加真实的显示物体在灯光下的真实属性。 The LED filament of the present invention uses arc-shaped transparent glass as the packaging substrate (that is, a transparent glass substrate), which increases the radiation surface of the spherical bulb light source, thereby increasing its luminous flux and improving the light efficiency. Blue LED chips and red LED chips are used The chip hybrid packaging method effectively increases the color rendering index of the LED filament, and more realistically displays the real attributes of the object under the light.

本发明的另一个目的是提供了一种LED灯,由多个上述的LED灯丝、泡壳、螺旋灯头、散热保护气体组成;泡壳与螺旋灯头固定连接,多个上述的LED灯丝采用两串两并的方式连接密封在泡壳内,且泡壳内填充有散热保护气体; Another object of the present invention is to provide an LED lamp, which is composed of a plurality of the above-mentioned LED filaments, a bulb, a spiral lamp cap, and a heat-dissipating protection gas; The two are connected and sealed in the bulb, and the bulb is filled with heat dissipation protection gas;

所述的散热保护气体为氦气、氢气、氦氢混合气体、氮气或氖气等惰性气体。 The heat dissipation protection gas is an inert gas such as helium, hydrogen, helium-hydrogen mixed gas, nitrogen or neon.

本发明通过将透明玻璃基板设置成弧形构成LED灯丝的主体;所述的基板材料采用透明玻璃基板,有效的增大了出光角度和提高了出光效率;在所述的基板的两侧设置蓝光芯片间隔红光芯片,有效的提高了LED灯丝的显色指数,采用360°molding 灌胶方式点胶,荧光粉胶完全包裹住LED灯丝,有效避免了LED炫光和蓝光泄露等缺点。 In the present invention, the main body of the LED filament is formed by arranging the transparent glass substrate in an arc shape; the substrate material adopts a transparent glass substrate, which effectively increases the light output angle and improves the light output efficiency; blue light is arranged on both sides of the substrate The red light chip is spaced between the chips, which effectively improves the color rendering index of the LED filament. The 360°molding glue dispensing method is used. The phosphor powder glue completely wraps the LED filament, effectively avoiding the shortcomings of LED glare and blue light leakage.

附图说明 Description of drawings

图1为本发明的LED灯丝示意图; Fig. 1 is the schematic diagram of LED filament of the present invention;

图2为本发明的LED灯结构示意图; Fig. 2 is a schematic structural view of the LED lamp of the present invention;

其中1-1为透明玻璃基板、1-2为蓝光LED芯片、1-3为红光LED芯片、1-4为荧光粉胶层、1-5为电极、1-6为电极引出线、1-7金线、1为LED灯丝、2为泡壳、3为螺旋灯头、4为散热保护气体。 Among them, 1-1 is a transparent glass substrate, 1-2 is a blue LED chip, 1-3 is a red LED chip, 1-4 is a fluorescent powder adhesive layer, 1-5 is an electrode, 1-6 is an electrode lead wire, 1 -7 gold wires, 1 for LED filament, 2 for bulb, 3 for spiral lamp cap, 4 for heat dissipation protection gas.

具体实施方式 Detailed ways

下面结合附图和实施例对本发明进一步说明。 The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

如图1所示,本发明LED灯丝1包括透明玻璃基板1-1、LED芯片、荧光粉胶层1-4、两个设于透明玻璃基板1-1外内弧面上的电极1-5、透明玻璃基板1-1两端的电极引出线1-6、金线1-7;所述的透明玻璃基板1-1为弧形条状;所述的LED芯片包括多个芯片单元,每个芯片单元由三个蓝光LED芯片1-2与一个红光LED芯片1-3构成;所述的蓝光LED芯片1-2与红光LED芯片1-3均为倒装芯片,芯片按P-N结顺序设置在透明玻璃基板1-1外内弧面的电极1-5上;透明玻璃基板1-1外内弧面上的电极1-5通过金线1-7与透明玻璃基板1-1两端的电极引出线1-6电连接;透明玻璃基板1-1、LED芯片采用灌胶技术包裹有荧光粉胶层1-4。 As shown in Figure 1, the LED filament 1 of the present invention includes a transparent glass substrate 1-1, an LED chip, a fluorescent powder glue layer 1-4, and two electrodes 1-5 arranged on the outer and inner curved surfaces of the transparent glass substrate 1-1. 1. Electrode leads 1-6 and gold wires 1-7 at both ends of the transparent glass substrate 1-1; the transparent glass substrate 1-1 is arc-shaped; the LED chip includes a plurality of chip units, each The chip unit is composed of three blue LED chips 1-2 and one red LED chip 1-3; the blue LED chips 1-2 and the red LED chips 1-3 are flip chips, and the chips are in the order of P-N junction It is arranged on the electrodes 1-5 on the outer and inner curved surfaces of the transparent glass substrate 1-1; the electrodes 1-5 on the outer and inner curved surfaces of the transparent glass substrate 1-1 pass through the gold wires 1-7 and the two ends of the transparent glass substrate 1-1. The electrode lead wires 1-6 are electrically connected; the transparent glass substrate 1-1, and the LED chip are wrapped with a fluorescent powder glue layer 1-4 by using glue pouring technology.

所述的透明玻璃基板1-1的弧形长度为30.0mm~35.0mm,宽度为0.8mm~1.0mm,厚度为0.2~0.4mm; The arc length of the transparent glass substrate 1-1 is 30.0mm-35.0mm, the width is 0.8mm-1.0mm, and the thickness is 0.2-0.4mm;

所述的荧光粉胶层1-4的材质为荧光粉与硅胶的混合材料; The material of the fluorescent powder adhesive layer 1-4 is a mixed material of fluorescent powder and silica gel;

本发明LED灯丝1采用弧形透明玻璃作为封装基板(即透明玻璃基板1-1),增大了球形灯泡光源的辐射出光面,进而增大了其光通量,提高了出光效率,采用蓝光LED芯片和红光LED芯片混合封装方式,有效的增加了LED灯丝的显色指数,更加真实的显示物体在灯光下的真实属性。 The LED filament 1 of the present invention adopts arc-shaped transparent glass as the packaging substrate (that is, the transparent glass substrate 1-1), which increases the radiation surface of the spherical bulb light source, thereby increasing its luminous flux and improving the light efficiency. The blue LED chip is used The mixed packaging method with the red LED chip effectively increases the color rendering index of the LED filament, and more realistically displays the real attributes of the object under the light.

如图2所示,一种LED灯由多个上述的LED灯丝1、泡壳2、螺旋灯头3、散热保护气体4组成;泡壳2与螺旋灯头3固定连接,多个上述的LED灯丝1采用两串两并的方式连接密封在泡壳2 内,且泡壳2内填充有散热保护气体4; As shown in Figure 2, an LED lamp is composed of a plurality of the above-mentioned LED filaments 1, a bulb shell 2, a spiral lamp cap 3, and a heat-dissipating protective gas 4; Two strings and two parallels are used to connect and seal in the bulb 2, and the bulb 2 is filled with heat dissipation protection gas 4;

所述的散热保护气体4为氦气、氢气、氦氢混合气体、氮气或氖气等惰性气体。 The heat dissipation protection gas 4 is an inert gas such as helium, hydrogen, helium-hydrogen mixed gas, nitrogen or neon.

上述实施例并非是对于本发明的限制,本发明并非仅限于上述实施例,只要符合本发明要求,均属于本发明的保护范围。 The above embodiments do not limit the present invention, and the present invention is not limited to the above embodiments, as long as the requirements of the present invention are met, they all belong to the protection scope of the present invention.

Claims (2)

1. bent LED silk and a bulb structure thereof, is characterized in that comprising transparent glass substrate, LED chip, fluorescent material glue-line, two electrode, the electrode outlet line at transparent glass substrate two ends, gold threads be located on the outer intrados of transparent glass substrate; Described transparent glass substrate is arc strip; Described LED chip comprises multiple chip unit, and each chip unit is made up of three blue-light LED chips and a red LED chip; Described blue-light LED chip and red LED chip are flip-chip, and chip is set in sequence on the electrode of the outer intrados of transparent glass substrate by P-N junction; Electrode on the outer intrados of transparent glass substrate is electrically connected by the electrode outlet line of gold thread with transparent glass substrate two ends; Transparent glass substrate, LED chip adopt encapsulating technology parcel fluorescent material glue-line;
The arc length of described transparent glass substrate is 30.0mm ~ 35.0mm, and width is 0.8mm ~ 1.0mm, and thickness is 0.2 ~ 0.4mm.
2. a LED, is characterized in that by multiple LED silk as claimed in claim 1, cell-shell, lamp screw base, heat radiation protection gas composition; Cell-shell is fixedly connected with lamp screw base, and multiple LED silk as claimed in claim 1 adopts two strings two mode also to connect and is sealed in cell-shell, and is filled with heat radiation protection gas in cell-shell;
Described heat radiation protection gas is inert gas.
CN201410521305.7A 2014-09-30 2014-09-30 Bendable LED lamp filament and bulb structure thereof Pending CN104300070A (en)

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CN106555942A (en) * 2015-09-29 2017-04-05 上海德士电器有限公司 LED light source module and the bubble shape lamp including which
CN109661858A (en) * 2016-09-05 2019-04-19 昕诺飞控股有限公司 LED and including LED lighting devices
CN113048410A (en) * 2021-05-11 2021-06-29 史杰 LED light source device and mood bulb

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CN203744086U (en) * 2013-12-26 2014-07-30 上海顿格电子贸易有限公司 Bulb with light emitting diode flexible lamp filament
CN103904197A (en) * 2014-03-24 2014-07-02 东莞市雷明灯照明科技有限公司 LED lamp filament piece, manufacturing method of LED lamp filament piece and LED lamp filament piece bulb
CN204088373U (en) * 2014-09-30 2015-01-07 杭州电子科技大学 Bent LED silk and bulb structure thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106555942A (en) * 2015-09-29 2017-04-05 上海德士电器有限公司 LED light source module and the bubble shape lamp including which
CN109661858A (en) * 2016-09-05 2019-04-19 昕诺飞控股有限公司 LED and including LED lighting devices
CN113048410A (en) * 2021-05-11 2021-06-29 史杰 LED light source device and mood bulb

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Application publication date: 20150121