CN104290407B - Double-sided transparent conductive film and touch panel - Google Patents
Double-sided transparent conductive film and touch panel Download PDFInfo
- Publication number
- CN104290407B CN104290407B CN201410216363.9A CN201410216363A CN104290407B CN 104290407 B CN104290407 B CN 104290407B CN 201410216363 A CN201410216363 A CN 201410216363A CN 104290407 B CN104290407 B CN 104290407B
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- Prior art keywords
- layer
- transparent conductive
- conductive film
- optical adjustment
- side transparent
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- 239000002245 particle Substances 0.000 claims abstract description 115
- 230000003287 optical effect Effects 0.000 claims abstract description 104
- 239000000463 material Substances 0.000 claims abstract description 65
- 230000000903 blocking effect Effects 0.000 claims description 94
- 229920005989 resin Polymers 0.000 claims description 58
- 239000011347 resin Substances 0.000 claims description 58
- 239000003595 mist Substances 0.000 claims description 13
- 238000002310 reflectometry Methods 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 5
- 238000009738 saturating Methods 0.000 claims description 2
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 150000002430 hydrocarbons Chemical class 0.000 claims 1
- 239000010410 layer Substances 0.000 description 287
- 238000000034 method Methods 0.000 description 30
- 239000002904 solvent Substances 0.000 description 21
- 238000000576 coating method Methods 0.000 description 20
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 18
- 239000008199 coating composition Substances 0.000 description 18
- 239000000203 mixture Substances 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 15
- 239000003292 glue Substances 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 12
- 239000000126 substance Substances 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 9
- 238000001723 curing Methods 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- 230000000007 visual effect Effects 0.000 description 8
- 239000000654 additive Substances 0.000 description 7
- 239000012084 conversion product Substances 0.000 description 7
- 239000012528 membrane Substances 0.000 description 7
- 239000002105 nanoparticle Substances 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000012530 fluid Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 229910001887 tin oxide Inorganic materials 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- -1 polycyclic alkene Chemical class 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 239000005416 organic matter Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000013008 thixotropic agent Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- 210000004276 hyalin Anatomy 0.000 description 2
- 238000010191 image analysis Methods 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 231100000241 scar Toxicity 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 229910020187 CeF3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910002319 LaF3 Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 240000000233 Melia azedarach Species 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 150000002168 ethanoic acid esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- VDGJOQCBCPGFFD-UHFFFAOYSA-N oxygen(2-) silicon(4+) titanium(4+) Chemical compound [Si+4].[O-2].[O-2].[Ti+4] VDGJOQCBCPGFFD-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000003909 pattern recognition Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- DLRJIFUOBPOJNS-UHFFFAOYSA-N phenetole Chemical compound CCOC1=CC=CC=C1 DLRJIFUOBPOJNS-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000636 poly(norbornene) polymer Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- BYMUNNMMXKDFEZ-UHFFFAOYSA-K trifluorolanthanum Chemical compound F[La](F)F BYMUNNMMXKDFEZ-UHFFFAOYSA-K 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/002—Auxiliary arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T428/24364—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] with transparent or protective coating
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Provided are a double-sided transparent conductive film which is good in appearance even when its transparent conductive layers are patterned, and has anti-blocking property, thereby being producible at low costs; a wound body thereof; and a touch panel. The double-sided transparent conductive film includes a base material film, and a base material film, and an optical adjusting layer and a transparent conductive layer which are formed in this order on each of both sides of the base material film, wherein an anti-blocking layer containing particles is formed at least one of: a location between the base material film and one optical adjusting layer; and a location between the base material film and the other optical adjusting layer, the anti-blocking layer has a flat portion and protrusion portions caused by the particles, and a value obtained by subtracting a thickness of the flat portion of the anti-blocking layer from a mode diameter of the particles is larger than a thickness of the optical adjusting layer.
Description
Technical field
The present invention relates to two-side transparent conductive film and contact panel.
Background technology
In recent years, due to projection type electrostatic capacity type contact panel, matrix type resistance membrane type contact panel energy Random seismic field
(multi-point touch), therefore operability is excellent, its demand rapidly rises.As the electrode member of such contact panel, it is proposed that
The two-side transparent conductive film of transparent conducting film is formed with the two sides of transparent film base material.
In contact panel as above, using the two-side transparent conductive film with the transparency conducting layer for having patterned.Though
So indium-tin composite oxides (ITO) are widely used from from the viewpoint of transmission of visible light as the material of transparency conducting layer, but
Due to its refractive index height, therefore when by the pattern for transparent conductive layer containing ITO, in transparency conducting layer the part of pattern is formed
(pattern forming portion) and eliminate transparency conducting layer part (pattern openings portion) produce pattern visual difference, sometimes from
Deteriorated appearance or generation tone during external observation pattern.In order to not make such pattern noticeable, it is proposed that following technologies：
In the two-sided two-side transparent conductive film for being provided with transparency conducting layer, optics is set between film base material and transparency conducting layer and is adjusted
Flood (patent document 1).
Prior art literature
Patent document
Patent document 1：International Publication No. 2011/065032
The content of the invention
The invention problem to be solved
In the above-described techniques, although the dry processes such as sputtering are employed in the formation of optical adjustment layer, but rolls up right from utilizing
The continuous production of volume method (ロ ー Le ト ゥ ー ロ ー Le modes) be possibly realized and can with cost of implementation reduce from the viewpoint of,
It is preferred that wet coating method.But, the film overlapped if volume to volume method is closely sealed each other and become to be not easily stripped (so-called adhesion), root
There is fracture according to situation film or produce scar and there is a possibility that productivity ratio is reduced.
On the other hand, in order to suppress adhesion, can adopt and be formed in the countermeasure that surface forms irregular resist blocking and that layer.But
It is that, if forming optical adjustment layer with wet coating method, due to coating fluid, the protuberance of resist blocking and that layer disappears, it is impossible to play anti-stick
Lian Xing, sticks together sometimes.
In view of above-mentioned viewpoint, it is an object of the invention to provide two-side transparent conductive film and its coiling body and touch-control
Panel, even if the two-side transparent conductive film is by pattern for transparent conductive layer, outward appearance is also good, and with resistance to blocking, by
This can be with low cost manufacture.
The means to solve the problem
The present inventor concentrates on studies to solve the problem, as a result finds, by by the grain of the particle of resist blocking and that layer
The thickness of footpath and optical adjustment layer is set to specific relation and can reach above-mentioned purpose, so as to complete the present invention.
That is, the present invention provides a kind of two-side transparent conductive film, wherein, it is sequentially formed with optics on the two sides of base material film and adjusts
Flood and transparency conducting layer, between the base material film and the optical adjustment layer of side and the base material film and opposite side
At least one party between the optical adjustment layer is formed with the resist blocking and that layer containing particle, and the resist blocking and that layer has flat part
With the protrusion due to the particle, deduct from the most frequency particle diameter of the particle flat part of the resist blocking and that layer thickness and
The value for obtaining is bigger than the thickness of the optical adjustment layer.
In the two-side transparent conductive film, with can be with the relation with the transparency conducting layer formed on the two sides of base material film
The mode for carrying out optical design respectively is provided with optical adjustment layer between base material film and each transparency conducting layer, even if therefore inciting somebody to action
Also it is difficult to make pattern noticeable in the case of pattern for transparent conductive layer, the generation of tone can be suppressed and reach good outer
See.Further, since the most frequency particle diameter of contained particle from resist blocking and that layer to be deducted the thickness of the flat part of the resist blocking and that layer
Value afterwards be set to it is bigger than the thickness of the optical adjustment layer, even if therefore in the feelings by wet formation optical adjustment layer
The protrusion of resist blocking and that layer also will not disappear under condition, in other words, become to there is also in optical adjustment layer due to the anti-of lower floor
The protuberance of the protrusion of adhering layer, as a result, excellent resistance to blocking can be played.Further, even if due to by wet type
The two-side transparent conductive film can also maintain resistance to blocking in the case that coating forms optical adjustment layer, therefore including pH effect
The continuous production of volume to volume method can be realized in being formed in of layer, so as to low cost possibility is created.
Preferred 50nm～the 300nm of thickness of the optical adjustment layer.Thus, even if by the feelings of pattern for transparent conductive layer
Under condition pattern can also be difficult noticeable, outward appearance can be made good.
The layer that the optical adjustment layer is formed preferably by wet.Thus, the utilization volume to volume of optical adjustment layer
Method is formed into possibility, can aid in reduction manufacturing cost.
It is worth obtained by the thickness of the flat part that the resist blocking and that layer is deducted from the height of the protrusion of the resist blocking and that layer excellent
Choosing is bigger than the thickness of the optical adjustment layer.By using such composition, preventing from forming optics tune by wet
The disappearance of the protrusion of resist blocking and that layer during flood, can give play to resistance to blocking required during the production using volume to volume method.
The mist degree of two-side transparent conductive film preferably less than 5%.Thus, it is possible to given play to high transparent, guarantee it is good
It is visual.
It is preferred that the transparency conducting layer is patterned, for the two-side transparent conductive film, the transparency conducting layer is preferred
The pattern forming portion of pattern and the pattern openings portion of the transparency conducting layer is eliminated with being formed.By the way that transparency conducting layer is concrete
Pattern, can be applied to electrostatic capacity type contact panel with particularly suitable.
By the pattern for transparent conductive layer of the two-side transparent conductive film, when being had an X-rayed with top view to it, the figure on two sides
The reflectivity in the double-side pattern region that case forming portion is overlapped and face are pattern forming portion and another face is pattern openings portion
The absolute value of difference of reflectivity of one side area of the pattern be preferably less than 1%.Thus, based on the presence or absence of pattern cause it is visual
Property difference pattern observation be suppressed, it is possible to obtain the more preferable two-side transparent conductive film of outward appearance.
The reflection tone b in the double-side pattern region*It is preferred that meeting -10≤b*≤0.Thus, it is possible to effectively suppress two-sided
The generation of the tone (particularly yellow hue) in bright conductive film.
The base material film preferably comprises cyclic olefine resin.Thus, it is possible to make the transparency of the two-side transparent conductive film
Further improve, realize good outward appearance.
In the present invention, the long body of the two-side transparent conductive film also includes that the two-side transparent for being wound as drum is led
Electrical film coiling body.
In the present invention, also including the contact panel for possessing the two-side transparent conductive film.
Description of the drawings
Fig. 1 is the generalized section of the two-side transparent conductive film involved by an embodiment of the invention.
Fig. 2 is the generalized section of the two-side transparent conductive film involved by the other embodiment of the present invention.
Fig. 3 is the fragmentary perspective top view of of the pattern for schematically showing transparency conducting layer.
Symbol description
1 base material film
2a, 2b resist blocking and that layer
3a, 3b optical adjustment layer
4a, 4b transparency conducting layer
5 particles
10 two-side transparent conductive films
21 flat parts
22 protrusions
31 flat parts
32 protrusions
O pattern openings portions
P pattern forming portions
TAThe thickness of resist blocking and that layer
TOThe thickness of optical adjustment layer
X double-side patterns region
Y1, Y2 one side area of the pattern
Specific embodiment
For an embodiment of the invention, it is described with reference to as follows.It should be noted that the shape shown in accompanying drawing
State not actual size ratio, for convenience of description, there is partial enlargement or the position for reducing to show.In addition, representing this specification
In up and down, the term of the position relationship such as positive and negative be only intended to the term being easy to illustrate, all do not limit actual concrete
The intention of the position relationship of composition.
<Two-side transparent conductive film>
Fig. 1 is the profile of an embodiment of the two-side transparent conductive film for schematically showing the present invention.It is two-sided
In transparent and electrically conductive film 10, it is sequentially formed with resist blocking and that layer 2a, 2b containing particle 5 on the two sides of base material film 1 and (below, also will
Both are referred to as " resist blocking and that layer 2 ".), optical adjustment layer 3a, 3b (below, is also referred to as both " optical adjustment layer 3 ".) and
Transparency conducting layer 4a, 4b (below, are also referred to as both " transparency conducting layer 4 ".).Although in the two sides shape of base material film 1 in Fig. 1
Into having resist blocking and that layer 2a, 2b, but it is also possible to which either side forms resist blocking and that layer in side or following side only above the base material film 1.Need
It is noted that with regard to the composition of resist blocking and that layer 2, optical adjustment layer 3 and transparency conducting layer 4, due to can also be in another face
Side is using the composition same with the composition of a surface side of base material film 1 therefore main to side above the base material film 1 of Fig. 1 below
Composition illustrate.
Resist blocking and that layer 2a has flat part 21 and protrusion 22 on surface.Protrusion 22 is formed by particle 5.Herein, it is two-sided
In transparent and electrically conductive film 10, the thickness T of the flat part 21 of resist blocking and that layer 2a is deducted from the most frequency particle diameter d of particle 5AObtained by value ratio
The thickness T of optical adjustment layer 3aOGreatly.When forming optical adjustment layer 3a by wet, the quilt of flat part 21 of resist blocking and that layer 2a
Optical adjustment layer 3a is buried, the height relative reduction of protrusion 22, and sometimes resistance to blocking disappears.Two-side transparent conductive film 10
In, due to the most frequency particle diameter d of particle 5, the thickness T of flat part 21AAnd the thickness T of optical adjustment layer 3aOTo meet specific relation
Mode formed, therefore be also possible to prevent the protrusion 22 of resist blocking and that layer 2a when forming optical adjustment layer 3a by wet and disappear
Lose.As a result, produce can also the protuberance due to protrusion 22 on the surface of optical adjustment layer 3a, can play good
Resistance to blocking.It should be noted that in Fig. 1, although the particle 5 with most frequency particle diameter d is illustrated, but as long as not damaging this
Bright action effect, resist blocking and that layer 2a can just contain the particle 5 with the particle diameter beyond most frequency particle diameter d.
In two-side transparent conductive film 10, generally, the thickness of resist blocking and that layer 2a is set to into micron order, on the other hand, by light
The each thickness for learning adjustment layer 3a and transparency conducting layer 4a sets relatively thin, is nanoscale, therefore leads as the transparent of outmost surface layer
Electric layer 4a is followed the protuberance of optical adjustment layer 3a and becomes have protuberance.Side is similarly below base material film 1 in Fig. 1.
As long as excellent although the mist degree of two-side transparent conductive film can ensure that the required transparency is just not particularly limited
Select less than 5%, more preferably less than 4%, further preferred less than 3%.It should be noted that, although the lower limit of mist degree preferably 0%,
But the presence of the protrusion due to outmost surface layer etc. is general mostly to be more than 0.3%.
<Base material film>
As base material film 1, although be not particularly limited, but the various plastic foils with the transparency can be used.For example, make
For its material, polyester based resin, acetic acid esters system resin, polyether sulfone system resin, polycarbonate-based resin, polyamide-based tree can be enumerated
The polycyclic alkene system resins such as fat, polyimides system resins, polyolefin-based resins, polynorbornene system resin, (methyl) acrylic acid
It is resin, polyvinyl chloride resin, polyvinylidene chloride resin, polystyrene resin, polyvinyl alcohol resin, polyarylate
It is resin, polyphenylene sulfide system resin etc..It is preferred cyclic olefine resin among them, polyester based resin, polycarbonate-based resin, poly-
Olefin-based resin, particularly preferred cyclic olefine resin.
The thickness of base material film 1 is preferably in the range of 2～200 μm, in the range of more preferably 20～180 μm.If base material
The thickness of film 1 is less than 2 μm, then the mechanical strength of base material film 1 is not enough, is difficult to for film base material to make drum sometimes and continuous
Form the operation of optical adjustment layer 3 and transparency conducting layer 4.On the other hand, if thickness can not be realized sometimes more than 200 μm
The marresistance of bright conductive layer 4, as contact panel finger manipulation characteristic (getting characteristic ready) raising.
Sputtering, corona treatment, corona discharge, flame, ultraviolet photograph can in advance be implemented on surface to base material film 1
Penetrate, electron beam irradiation, chemical conversion, the etch processes such as oxidation, primary coat are processed so as to resist blocking and that layer, the light formed on film base material
The adaptation for learning adjustment layer etc. is improved.In addition, before resist blocking and that layer, optical adjustment layer is formed, can be as desired by solvent
Cleaning, ultrasonic wave cleaning etc. carry out dedusting to film base material surface, clean.
<Resist blocking and that layer>
Resist blocking and that layer 2 on surface as described above, have flat part 21 and protrusion 22.Protrusion 22 is by resist blocking and that layer 2
Contained particle 5 is formed.The highly preferred thickness T than optical adjustment layer 3 of protrusion 22OGreatly, specifically, with flat part 21
On the basis of, preferred less than more than 100nm and 3 μm, more preferably less than more than 200nm and 2 μm, further preferred more than 300nm and
Less than 1.5 μm.By the way that the height of protrusion 22 is set as into above range, can be to outmost surface layer (transparency conducting layer in Fig. 1
4) protrusion of regulation is given, as a result, it is possible to while the resistance to blocking of two-side transparent conductive film 10 is met, fully
Fluctuation (バ ラ Star キ) is reduced, and fully suppresses the rising of mist degree.
Although the thickness of the flat part 21 of resist blocking and that layer 2 be not particularly limited, but preferably less than more than 200nm and 30 μm,
More preferably less than more than 500nm and 10 μm, further preferred less than more than 800nm and 5 μm.If the thickness of the flat part of resist blocking and that layer
Spend little, then the low molecular weight compositions such as oligomer can not be suppressed to separate out from base material film, two-side transparent conductive film, used its
The visuality of contact panel has the tendency of deterioration.On the other hand, if the thickness of the flat part of resist blocking and that layer is excessive, due to saturating
During the crystallization of bright conductive layer, the assembling of contact panel when heating, two-side transparent conductive film have with resist blocking and that layer formed face
For the tendency being medially crimped.Therefore, when the thickness of the flat part of resist blocking and that layer is big, due to resistance to blocking, easy slip
Different other problemses, the operability of film has the tendency of variation.It should be noted that in this specification, resist blocking and that layer it is flat
The thickness in portion refers to the average thickness of the flat part of resist blocking and that layer.
The most frequency particle diameter of particle can consider the size of the protrusion of outmost surface layer and the flat part 21 of resist blocking and that layer 2
The appropriate setting such as the relation of thickness, be not particularly limited.It should be noted that from fully giving to two-side transparent conductive film
Resistance to blocking, and fully suppressing from the viewpoint of the rising of mist degree, the most frequency particle diameter of particle it is preferred more than 500nm and 30 μm with
Under, more preferably less than more than 800nm and 20 μm, further preferred more than 1 μm and less than 10 μm.It should be noted that this explanation
In book, " most frequency particle diameter (Frequency particles footpath) " particle diameter for representing the maximum that particle is distributed is referred to, by using flow-type particle
Image analysis apparatus (Sysmex company systems, ProductName " FPTA-3000S "), under prescribed conditions (sheath fluid：Ethyl acetate, determines
Pattern：HPF is determined, mensuration mode：Tale) determine to obtain.Determine sample to use：With ethyl acetate by dilute particles extremely
1.0 weight %, using supersonic wave cleaning machine its dispersed sample is made.
Particle can be any one of polydisperse particle and monodisperse particle, if but consider protrusion imparting it is easy
Property, anti-fluctuation, then preferred monodisperse particle.In the case of monodisperse particle, the particle diameter of particle and most frequency particle diameter can be considered as
It is substantially identical.
Relative to the weight portion of solid constituent 100 of resin combination, the content preferably 0.01～5 of the particle in resist blocking and that layer
Weight portion, more preferably 0.02～1 weight portion, further preferred 0.05～0.5 weight portion.If the content of the particle in resist blocking and that layer
Little, then the surface for having the tendency of to become to be difficult for resisting adhering layer gives resistance to blocking and forms sufficient protrusion.The opposing party
Face, if the content of particle is excessive, the mist degree for having two-side transparent conductive film due to the light scattering of particle is uprised, visual drop
Low tendency.If in addition, the content of particle is excessive, producing striped (during the coating of solution) in the formation of resist blocking and that layer, have
When visual impaired or conductive layer electrical characteristics become uneven.
(resin combination)
As the resin combination of resist blocking and that layer 2 is formed, as long as after the dispersion of particle being carried out, being formed as resist blocking and that layer
Envelope there is sufficient intensity, have the transparency, it is possible to use without particular limitation.As the resin for using, can enumerate
Thermosetting resin, thermoplastic resin, ultraviolet curing resin, electronic beam solidified resin, two liquid hybrid resins etc., but its
In, the curing process that preferably can be irradiated by using ultraviolet is effectively formed light diffusion layer with simple process operation
Ultraviolet curing resin.
As ultraviolet curing resin, Polyester, acrylic acid series, carbamate system, acid amides system, silicone can be enumerated
The various resins such as system, epoxy, including monomer, oligomer, the polymer of ultraviolet hardening etc..The ultraviolet for preferably using is consolidated
Change type resin can enumerate the resin of such as functional group with ultraviolet polymerizing, especially comprising with more than 2 senses
Group, the monomer, the resin of oligomer composition that are particularly the acrylic acid series with 3～6 functional groups.In addition, solid in ultraviolet
Ultraviolet polymerization initiator is combined with change type resin.
In the formation material of resin bed, in addition to the material, can also be using levelling agent, thixotropic agent, antistatic
The additives such as agent.If using thixotropic agent, being conducive to forming prominent particle in micro concavo-convex shape face.As thixotropic agent, can
Enumerate less than 0.1 μm silica, mica etc..The content of these additives is commonly angled relative to ultraviolet curing resin 100
Weight portion is suitably for left and right below 15 weight portions, is preferably set to 0.01～15 weight portion.
(particle)
As the particle contained in resist blocking and that layer 2, can use without particular limitation various metal oxides, glass,
The particle with the transparency such as plastics.Such as silica, aluminum oxide, titanium dioxide, zirconium oxide, calcium oxide etc. can be enumerated inorganic
It is particle；Comprising polymethyl methacrylate, polystyrene, polyurethane, acrylic resin, acrylic-styrene copolymer,
The crosslinking of the various polymer such as benzoguanamine, melamine, Merlon or uncrosslinked organic system particle, silicone-based particle
Deng.The particle can properly select a kind or two or more using, but preferably organic system particle.As organic system particle,
From from the viewpoint of refractive index, preferred acrylic resin.
(coating composition)
Coating composition for forming resist blocking and that layer includes above-mentioned resin, particle and solvent.In addition, coating composition
Various additives can be added as needed.As such additive, can enumerate antistatic additive, plasticizer, surfactant,
The conventional additive such as antioxidant and ultra-violet absorber.
Coating composition by by above-mentioned resin and particle and solvent as needed, additive, catalyst etc. mix come
Prepare.Solvent in coating composition is not particularly limited, it is considered to the resin for using, the material of the part of the substrate for becoming covering with paint
And the coating method of composition etc. is suitably selecting.As the concrete example of solvent, such as aromatic series such as toluene, dimethylbenzene can be enumerated
Series solvent；The ketone series solvents such as MEK, acetone, methyl iso-butyl ketone (MIBK), cyclohexanone；Diethyl ether, isopropyl ether, tetrahydrofuran, bis- Evil
Alkane, glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, propylene glycol monomethyl ether, benzene first
The ether series solvents such as ether, phenetole；The ester series solvents such as ethyl acetate, butyl acetate, isopropyl acetate, ethylene acetate；Two
The acid amides series solvents such as NMF, DEF, 1-METHYLPYRROLIDONE；Methyl cellosolve, ethyl cellosolve, butyl
The cellosolve series solvent such as cellosolve；The alcohol series solvents such as methyl alcohol, ethanol, propyl alcohol；The halogen-based solvents such as dichloromethane, chloroform；Deng.This
A little solvents can be used alone, or be used in combination of two or more.Among these solvents, ester series solvent, ether system are preferably used molten
Agent, alcohol series solvent and ketone series solvent.
In coating composition, preferably particle is disperseed in the solution.As particle dispersion method in the solution is made, can
To be added to tree using the method added particle in resin composition solution and mix, by the particle being pre-dispersed in solvent
The various known methods such as the method in oil/fat composition solution.
The solid component concentration of coating composition preferably 1 weight %～70 weight %, more preferably 2 weight %～50 weights
Amount %, most preferably 5 weight %～40 weight %.If solid component concentration becomes too low, drying process after coating sometimes
The fluctuation of the protrusion of middle resist blocking and that layer surface becomes big, and the protrusion of resist blocking and that layer surface becomes the mist degree of big part and rises.Separately
On the one hand, if solid component concentration becomes too much, easily cohesion is become containing composition, as a result, condensing part apparent sometimes
And damage the outward appearance of two-side transparent conductive film.
(coating and solidification)
Resist blocking and that layer is formed by being coated with above-mentioned coating composition on base material.In present embodiment, the two of base material
Face carries out the coating to the coating composition on base material film 1.It should be noted that coating composition can directly in base material film 1
On be coated, it is also possible to be coated on inter coat being formed on base material film 1 etc..
The coating process of coating composition can suitably be selected according to the situation of coating composition and covering with paint operation, Ke Yitong
Cross such as dip coating, air knife coating method, curtain coating, rolling method, bar rubbing method, gravure coating process, die slot rubbing method or extrusion
Rubbing method etc. is being coated with.
Curing of coating is made after coating composition is coated with, it is possible thereby to form resist blocking and that layer.Resin combination is photocuring
During property, irradiation light can be come by using the light source of the light for sending wavelength as needed so as to solidify.As the light of irradiation,
Such as light exposure 150mJ/cm can be used2Light above, preferred 200mJ/cm2～1000J/cm2Light.The other irradiation light
Wavelength is not particularly limited, but can use irradiation light of wavelength with such as below 380nm etc..It should be noted that can
To be heated when photocuring is processed or after photocuring is processed.
Adhering layer 2 can be resisted and implement sputtering, corona treatment, corona discharge, flame, ultraviolet photograph in advance on surface
Penetrate, electron beam irradiation, chemical conversion, the etch processes such as oxidation, primary coat are processed so as to the optical adjustment layer formed on resist blocking and that layer
Deng adaptation improve.In addition, before optical adjustment layer is formed, can clean as desired by solvent clean, ultrasonic wave etc.
Resist adhering layer surface dust, clean.
<Optical adjustment layer>
In the two-side transparent conductive film 10 of present embodiment, between resist blocking and that layer 2 and transparency conducting layer 4, for
Control the purpose of adaptation, the reflection characteristic of transparency conducting layer etc. and be provided with optical adjustment layer 3.Optical adjustment layer can be arranged
1 layer, it is also possible to arrange more than two-layer or two-layer.Optical adjustment layer can be with inorganic matter, organic matter or inorganic matter and organic matter
Mixture is formed.As the material for forming optical adjustment layer, NaF, Na can be enumerated3AlF6、LiF、MgF2、CaF2、SiO2、LaF3、
CeF3、Al2O3、TiO2、Ta2O5、ZrO2、ZnO、ZnS、SiOxInorganic matters such as (x are 1.5 less than 2)；Acrylic resin, ammonia
The organic matters such as carbamate resin, melmac, alkyd resin, siloxane-based polymers.It is excellent especially as organic matter
Choosing uses the thermosetting resin of the mixture comprising melmac, alkyd resin and organosilan condensation product.PH effect
Layer can use above-mentioned material, be formed by coating process such as gravure coating process, stick coating method etc..It is preferred that passing through coating process shape like this
Into at least 1 layer optical adjustment layer, but when forming two-layer above optical adjustment layer, in addition to above-mentioned coating process, it is also possible to logical
Cross vacuum vapour deposition, sputtering method, ion plating method etc. and form optical adjustment layer.
The thickness of optical adjustment layer 3 can consider reflection differences, tone of film of pattern forming portion and pattern openings portion etc.
Appropriate setting.Preferred 50nm～the 300nm of thickness of optical adjustment layer 3.Particularly the refractive index of optical adjustment layer is more than 1.58
And when less than 1.64, preferred more than the 50nm of thickness of optical adjustment layer and below 150nm, the refractive index of optical adjustment layer is 1.65
Above and when less than 1.7, preferred more than 80nm and below 300nm.In addition, when forming two-layer optical adjustment layer, base material film side
Preferred 10nm～the 60nm of thickness of the 1st optical adjustment layer, the thickness of the 2nd optical adjustment layer of transparency conducting layer (ito film) side is excellent
Select 10nm～60nm.Further, when forming two-layer optical adjustment layer, the refractive index preferably 1.6 of above-mentioned 1st optical adjustment layer～
1.8, the refractive index preferably 1.3～1.6 of above-mentioned 2nd optical adjustment layer.By the thickness and the refraction that consider optical adjustment layer
Rate, can effectively suppress reflection differences, the tone of film of pattern forming portion and pattern openings portion.If in addition, optical adjustment layer with
Such nano level thickness is formed, then the surface of the side of transparency conducting layer 4 of optical adjustment layer is generally maintained as its substrate
The projecting shape on the surface of resist blocking and that layer 2 of layer.And, the surface of transparency conducting layer 4 also maintains its projecting shape, therefore can make
Into the two-side transparent conductive film with resistance to blocking.
Optical adjustment layer can have nanoparticle of the average grain diameter for 1nm～500nm.Nanometer in optical adjustment layer is micro-
Content preferably 0.1 weight %～90 weight % of grain.The average grain diameter of nanoparticle used is as described above in optical adjustment layer
It is preferred that the scope of 1nm～500nm, more preferably 5nm～100nm.In addition, the content of the nanoparticle in optical adjustment layer is more preferably
10 weight %～80 weight %, further preferred 20 weight %～70 weight %.By micro- containing nanometer in optical adjustment layer
Grain, can be easily adjusted the refractive index of optical adjustment layer itself.
As the inorganic oxide for forming nanoparticle, such as silica (silica), hollow nano-silica can be enumerated
The particulate of SiClx, titanium oxide, aluminum oxide, zinc oxide, tin oxide, zirconium oxide etc..Among them, preferred silica (titanium dioxide
Silicon), titanium oxide, aluminum oxide, zinc oxide, tin oxide, zirconic particulate.They can be used alone, it is also possible to two kinds with
On be used in combination.
<Transparency conducting layer>
The constituent material of transparency conducting layer 4 is not particularly limited, can suitably using selected from indium, tin, zinc, gallium, antimony, titanium,
The metal oxide of at least a kind of metal in the group that silicon, zirconium, magnesium, aluminium, gold, silver, copper, palladium, tungsten are constituted.In the metal oxide,
As needed can further containing the metallic atom shown in above-mentioned group.Preferably use such as indium oxide containing tin oxide
(ITO), tin oxide containing antimony (ATO) etc..
The thickness of transparency conducting layer 4 is not particularly limited, in order to make its sheet resistance for 1 × 103The tool of Ω/below
There is the continuous overlay film of good electric conductivity, preferably make thickness be more than 10nm.When thickness is blocked up, transparency reduction etc. can be caused,
It is therefore preferable that for 15～35nm, more preferably in the range of 20～30nm.When the thickness of transparency conducting layer 4 is less than 15nm, film table
The resistance in face is uprised, and is difficult to become continuous overlay film.In addition, when the thickness of transparency conducting layer 4 is more than 35nm, causing sometimes
Transparency reduction etc..
As the refractive index of transparency conducting layer 4, when transparency conducting layer 4 is patterned, from except suppressing pattern forming portion P
With the reflection differences of pattern openings portion O (with reference to Fig. 2), and suppress from the viewpoint of the difference of both tones, transparency conducting layer 4
Refractive index preferably 1.85～2.1 or so.
The forming method of transparency conducting layer 4 is not particularly limited, and can adopt known method.Specifically, for example
The dry method such as vacuum vapour deposition, sputtering method, ion plating method can be exemplified.Alternatively, it is also possible to adopt suitable according to required thickness
Method.If it should be noted that transparency conducting layer 4 is formed by dry method such as sputtering methods, as shown in figure 1, transparency conducting layer 4
Surface be generally maintained as its bottom resist blocking and that layer 2a (and optical adjustment layer 3) surface flat part and the shape of protrusion
Shape.Therefore, in the case of optical adjustment layer 3 and transparency conducting layer 4 being formed with resist blocking and that layer 2, it is also possible to suitably to transparent
The surface of conductive layer 4 gives resistance to blocking.
As needed, transparency conducting layer 4 can implement heating anneal process (for example, under air atmosphere, 80～150
Carry out at DEG C 30～90 minutes or so) crystallized.By the way that transparency conducting layer is crystallized, transparency conducting layer low resistance is simultaneously
And the transparency and durability are improved.By the way that the thickness of resist blocking and that layer 2a in two-side transparent conductive film 10 is set to into above range,
The generation for crimping can also be suppressed during heating anneal process, treatability is excellent.
As seen in figures 2 and 3, transparency conducting layer 4 can be patterned by etching etc..Fig. 2 illustrates that transparency conducting layer 4 is schemed
Two-side transparent conductive film 10 after case.Wherein, for convenience of description, in fig. 2, grain contained in resist blocking and that layer 2 is omitted
Son and the protrusion caused by it, the thickness of each layer is different from the appearance shown in Fig. 1.Two-side transparent conductive film shown in Fig. 2
With transparency conducting layer 4 formed pattern pattern forming portion P and transparency conducting layer 4 be removed after pattern openings portion O.In electrostatic
In capacity formula contact panel, the contact panel of the resistance membrane type of matrix form in two-side transparent conductive film used, such as Fig. 3 institutes
Show, preferably clear conductive layer 4a, 4b is preferably formed as the mutually orthogonal gridiron pattern of transparency conducting layer 4a, 4b with striped design
Shape matrix pattern.It should be noted that in figure 3, it is illustrated that the width of width ratio pattern openings portion O of pattern forming portion P is big,
But the present invention is not limited to the form.
As seen in figures 2 and 3, when transparency conducting layer 4a, 4b of two-side transparent conductive film 10 is patterned, according to pattern shape
Shape, when having an X-rayed two-side transparent conductive film 10 with top view, occasionally there are the double-side pattern that the pattern forming portion on two sides is overlapped
Region X and a face are pattern forming portion and another face is the one side area of the pattern Y (Y1 and Y2) of pattern openings portion.Now,
The absolute value preferably less than 1% of the difference Δ R of the reflectivity of double-side pattern region X and the reflectivity of one side area of the pattern Y, more preferably
Less than 0.5%.In addition, the reflection tone b of double-side pattern region X*It is preferred that meeting -10≤b*≤ 0, more preferably meet -8≤b*≤
0, particularly preferably meet -5≤b*≤0.By by the absolute value of reflection differences Δ R, reflection tone b*It is set in above range, can
To suppress pattern observation and the generation of tone (particularly yellow hue), obtain the better transparent and electrically conductive film of outward appearance.
It should be noted that in this specification, " reflectivity " represents the visual sense reflectivity of the D65 light sources of CIE colour systems
Y.In addition, " tone " is L specified in JIS Z8729*a*b*The L of the D65 light sources in colour system*Value, a*Value, b*Value, " reflection
Tone " is the tone obtained by reflected light.
In general, transparency conducting layer is formed by metal oxide, therefore refractive index is high, and the reflectivity on surface is high.Therefore,
Reflection differences are produced between pattern forming portion P and pattern openings portion O, having the tendency of pattern becomes easily identification.On the other hand, originally
It is multiple by interface by being respectively provided with optical adjustment layer between the base material film 1 and transparency conducting layer 4 of positive and negative in invention
Reflection, by the reflected light of elimination of interference layer at transparent layer, the reflectance reduction of pattern forming portion P.Therefore, pattern is formed
Portion P is reduced with the reflection differences of pattern openings portion O, and pattern becomes to be difficult to recognize.
<Two-side transparent conductive film winds body>
In present embodiment, two-side transparent conductive film 10 can be made long body, can be made it with reel
The two-side transparent conductive film winding body of shape winding.The following shape of winding physical efficiency of the long size piece of two-side transparent conductive film
Into：Using the drum coiling body of long size piece as base material film, by above-mentioned resist blocking and that layer, optical adjustment layer and electrically conducting transparent
Layer is all formed by volume to volume method.When such coiling body is formed, can fit on the surface of two-side transparent conductive film
After possessing the diaphragm (partition) of weak adhesive layer, be wound into a roll tubular, but the two-side transparent conductive film of present embodiment due to
Resistance to blocking is improved, therefore does not use diaphragm also to form the winding of the long size piece of two-side transparent conductive film immediately
Body.That is, by imparting resistance to blocking, can suppress operate when film surface scar generation, while film is windability excellent
It is different, even if therefore not also being readily obtained the coiling body that long size piece is wound into a roll tubular in surface laminating diaphragm.Picture
So, the coiling body of long size piece is formed because the two-side transparent conductive film of present embodiment can not use diaphragm,
Workability during formation of the contact panel after thus be accordingly used in etc. is excellent.Further, since need not be used as the guarantor of operation component
Cuticula, therefore also can help to cost cutting, discarded object reduction.
<Contact panel>
Two-side transparent conductive film 10 may be suitably used to such as contact panel such as electrostatic capacity type, resistance membrane type.Especially
It is when transparency conducting layer is patterned, it is also possible to by pattern forming portion and the difference of the visuality of pattern openings portion, particularly instead
The difference for penetrating rate suppresses less, therefore may be suitably used to as the electricity of projection type electrostatic capacity type contact panel, energy Random seismic field
The contact panel of resistance membrane type like that, possesses the contact panel of the transparency conducting layer for being patterned as regulation shape.
In the formation of contact panel, the interarea in the one or both sides of two-side transparent conductive film can utilize transparent
Other base materials such as adhesive phase laminating glass, polymeric membrane etc..Transparent base can be made up of, or two 1 base film
Open the duplexer (duplexer being for example laminated using transparent adhesive phase) of the base film of the above.Alternatively, it is also possible to
The outer surface for fitting in the transparent base of two-side transparent conductive film arranges hard coat.
As adhesive phase used in the fitting of two-side transparent conductive film and base material, as long as having the transparency can
To use without particular limitation.Specifically, can suitably select for example to be polymerized with acrylic acid series polymeric compounds, silicone-based
Thing, polyester, polyurethane, polyamide, polyvingl ether, vinyl acetate/vinyl chloride copolymer, improved polyalkene, epoxy, fluorine
The material of polymer is using based on the polymer such as the rubber series such as system, natural rubber, synthetic rubber.Particularly from optical
Bright property is excellent, shows the also excellent side such as the adhesion characteristics such as appropriate wetability, coherency and cementability, weatherability, heat resistance
Face consideration, preferably uses acrylic adhesive.
When above-mentioned two-side transparent conductive film of the invention is used for into the formation of contact panel, when contact panel is formed
Treatability is excellent.Accordingly, it is capable to productivity ratio highland manufactures the contact panel of the transparency and visual excellence.
Embodiment
Hereinafter, the present invention is described in detail using embodiment, but as long as without departing from its main idea, the present invention is not just limited
In below example.In embodiment, unless otherwise specified, " part " refers to " weight portion ".
[embodiment 1]
Prepare the multiple monodisperse particles (Soken Chemical Company system, trade name " SX-130H ") containing most 1.3 μm of frequency particle diameter
With resin glue (DIC company systems, trade name " UNIDIC " RS29-120), and coating compositions with ethyl acetate as solvent
Thing.Relative to 100 parts of resin glue, the addition number of particle is 0.2 part.Then, using gravure coater in 100 μm of thickness
The two sides of the long sized substrate film of (Nippon Zeon Co., Ltd.'s system, trade name " Zeonor ") is with side that dried thickness is 1.0 μm
Formula is coated with coating composition, and by heating 1 minute at 80 DEG C dried coating film is made.Afterwards, by being accumulated with high voltage mercury lamp radiation
Light quantity 250mJ/cm2Ultraviolet, formed resist blocking and that layer.
Then, refractive index adjusters (JSR company systems, business are coated with the surface of two-sided resist blocking and that layer with gravure coater
The name of an article " Opstar Z7412 "), make dried coating film by heating 1 minute at 60 DEG C.Afterwards, by tired with high voltage mercury lamp radiation
Product light quantity 250mJ/cm2Ultraviolet implementing curing process, refractive index 1.62 is formed on two sides with thickness 100nm (0.1 μm)
Optical adjustment layer.
Afterwards, takeup type sputter equipment will be put into the long sized substrate of resist blocking and that layer and optical adjustment layer, on two sides
Optical adjustment layer surface be laminated thickness 26nm the indium tin oxide layer (0.4Pa being made up of argon gas 98% and oxygen 2%
Atmosphere in, used the sputtering of the sintered body being made up of weight % of 97 weight %- tin oxide of indium oxide 3) as electrically conducting transparent
Layer.Now, above-mentioned optical adjustment layer, the transparency conducting layer layer in the way of along the flat part of above-mentioned resist blocking and that layer and protrusion
It is folded.Thus two-side transparent conductive film has been made.
The stacking of the two-side transparent conductive film of gained is configured to transparency conducting layer/optical adjustment layer/resist blocking and that layer/base material
Film/resist blocking and that layer/optical adjustment layer/transparency conducting layer.In table 1, most frequency particle diameter d, the thickness of resist blocking and that layer of particle is shown
TA, optical adjustment layer thickness TO, deduct from the most frequency particle diameter d of particle the thickness T of resist blocking and that layerAValue (d-T afterwardsA).Later
The assay method of narration most frequency particle diameter and thickness.
[embodiment 2]
Made using the monodisperse particle (ponding chemical conversion product industrial group system, trade name " XX184AA ") of most 1.5 μm of frequency particle diameter
For particle, relative to resin glue, addition number is set to 0.3 part by 100 parts, in addition, is made similarly to Example 1
Two-side transparent conductive film.
[embodiment 3]
Using the monodisperse particle (Soken Chemical Company system, trade name " MX-180TA ") of most 1.9 μm of frequency particle diameter as grain
Son, relative to resin glue, addition number is set to 0.2 part by 100 parts, in addition, has made double similarly to Example 1
Face transparent and electrically conductive film.
[embodiment 4]
Made using the monodisperse particle (ponding chemical conversion product industrial group system, trade name " XX134AA ") of most 2.0 μm of frequency particle diameter
For particle, relative to resin glue, addition number is set to 0.2 part by 100 parts, in addition, is made similarly to Example 1
Two-side transparent conductive film.
[embodiment 5]
Using the monodisperse particle (Japanese catalyst company system, trade name " KEP-250 ") of most 2.5 μm of frequency particle diameter as grain
Son, relative to resin glue, addition number is set to 0.4 part by 100 parts, in addition, has made double similarly to Example 1
Face transparent and electrically conductive film.
[embodiment 6]
Made using the monodisperse particle (ponding chemical conversion product industrial group system, trade name " XX133AA ") of most 3.0 μm of frequency particle diameter
For particle, relative to resin glue, addition number is set to 0.08 part by 100 parts, in addition, is made similarly to Example 1
Two-side transparent conductive film.
[embodiment 7]
Resist blocking and that layer is formed in a face of base material film, then, is not added in the coating composition for coat another face
Plus particle, resist blocking and that layer is formed as hard coat, in addition, two-side transparent has been made similarly to Example 1 conductive
Property film.Gained two-side transparent conductive film stacking be configured to transparency conducting layer/optical adjustment layer/resist blocking and that layer/base material film/
Hard coat (without particle)/optical adjustment layer/transparency conducting layer.
[embodiment 8]
Made using the monodisperse particle (ponding chemical conversion product industrial group system, trade name " XX184AA ") of most 1.5 μm of frequency particle diameter
For the particle of resist blocking and that layer, relative to resin glue, addition number is set to 0.3 part by 100 parts, in addition, with embodiment
7 have similarly made two-side transparent conductive film.
[embodiment 9]
Using the monodisperse particle (Soken Chemical Company system, trade name " MX-180TA ") of most 1.9 μm of frequency particle diameter as anti-
The particle of adhering layer, relative to resin glue, addition number is set to 0.2 part by 100 parts, in addition, same with embodiment 7
Two-side transparent conductive film has been made sample.
[embodiment 10]
Made using the monodisperse particle (ponding chemical conversion product industrial group system, trade name " XX134AA ") of most 2.0 μm of frequency particle diameter
For the particle of resist blocking and that layer, relative to resin glue, addition number is set to 0.2 part by 100 parts, in addition, with embodiment
7 have similarly made two-side transparent conductive film.
[embodiment 11]
Using the monodisperse particle (Japanese catalyst company system, trade name " KEP-250 ") of most 2.5 μm of frequency particle diameter as anti-stick
Connect the particle of layer, addition number is set to 0.4 part by 100 parts relative to resin glue, in addition, similarly to Example 7
Made two-side transparent conductive film.
[embodiment 12]
Made using the monodisperse particle (ponding chemical conversion product industrial group system, trade name " XX133AA ") of most 3.0 μm of frequency particle diameter
For the particle of resist blocking and that layer, relative to resin glue, addition number is set to 0.08 part by 100 parts, in addition, with enforcement
Example 7 has similarly made two-side transparent conductive film.
[comparative example 1]
Using monodisperse particle (ponding chemical conversion product industrial group system, trade name " the BMSA ") conduct of most 0.8 μm of frequency particle diameter
Particle, relative to resin glue, addition number is set to 2 parts by 100 parts, in addition, has made double similarly to Example 1
Face transparent and electrically conductive film.
[comparative example 2]
When coating composition is prepared, without particle, using phase separation type resin (Japanese ippon company system, trade name
" NAB-010 ") as resin glue, in addition, two-side transparent conductive film has been made similarly to Example 1.
[comparative example 3]
When coating composition is prepared, without particle, using containing Nano particles of silicon dioxide, (average grain diameter is 100nm
Nano-particle and average grain diameter for the nano-particle of 10nm mixture) resin (catalyst is melted into company system, trade name
" ELCOM NT-1125HSC ") as resin glue, in addition, two-side transparent has been made similarly to Example 1 conductive
Property film.
[evaluation]
Each two-side transparent conductive film to obtaining in embodiment 1～12 and comparative example 1～3 has carried out following commenting
Valency.Each evaluation result is shown in into table 1.
<The refractive index of optical adjustment layer>
Prepare the coating fluid of above-mentioned optical adjustment layer formation, according to JIS K7105 the refractive index of its solidfied material is determined, will
Its refractive index as optical adjustment layer.Specifically, with bar coater untreated polyethylene terephthalate film (with
Under, referred to as PET film.) on be coated with formation coating fluid, make at 80 DEG C its be dried 60 minutes.Then, high voltage mercury lamp radiation is used
0.6J/cm2Ultraviolet, make curing of coating.The operation is repeated twice, the solidfied material that the cured film of two-layer is laminated is formed
Afterwards, solidfied material is peeled off from PET film.With Abbe refractometer, make measure light (sodium D-line) incident and at 25.0 ± 1.0 DEG C to gained
Solidfied material determine 4 times, using average refractive index nD25 as optical adjustment layer of measured value.
<The thickness of each layer>
The instantaneous multiple photometric system " MCPD2000 " (trade name) of Shi Yong great mound electronics (strain) systems, with the width side of film
To equally spaced 5 points determine obtained by interference spectrum waveform based on and calculate mean value, thus obtain resist blocking and that layer and
The thickness of hard coat.Carry out section observation to determine light by transmission electron microscope (Hitachi's system, HF-7650)
Learn the thickness of adjustment layer and transparency conducting layer.
<The most frequency particle diameter of particle>
Using flow-type particle image analysis device (Sysmex company systems, ProductName " FPTA-3000S "), in regulation bar
(sheath fluid under part：Ethyl acetate, mode determination：HPF is determined, mensuration mode：Tale) it is measured.With ethyl acetate by particle
1.0 weight % are diluted to, make its dispersed and formation determination sample with supersonic wave cleaning machine.
<Resistance to blocking>
When being manufactured by volume to volume method, whether confirmation there occurs the mutual attaching of film in any operation.To not send out
The situation of the mutual attaching of filming is evaluated as "○", and the situation that there occurs attaching is evaluated as into "×".Simultaneously, it is thus identified that Ren Hegong
To the presence or absence of damage of film in sequence.By not to film cause damage situation be evaluated as "○", by produce damage situation be evaluated as
“×”。
<Mist degree>
According to the mist degree (turbidity) of JIS K7136 (2000), with haze meter (color technical research institute company system type in village
Number " HM-150 ") determine making two-side transparent conductive film mist degree.
[table 1]
In the two-side transparent conductive film obtained by embodiment, resistance to blocking is good, while the mist degree of all of sample is all
For less than 3%, the transparency is also excellent.On the other hand, in the two-side transparent conductive film obtained by comparative example, although mist degree is low,
But there is the attaching of film in manufacturing process, damage, resistance to blocking is poor.Think that it is because, due to particle protrusion by
Disappear in the formation of optical adjustment layer, or do not form enough protrusions.
[embodiment 13～27]
For embodiment 13～25, (all it is JSR company systems, is commodity in table using the refractive index adjusters shown in table 2
Name) as refractive index adjusters, change the refractive index of optical adjustment layer, while the thickness of the optical adjustment layer being set to shown in table 2,
In addition, two-side transparent conductive film has been made similarly to Example 1.For embodiment 26 and 27, using shown in table 4
Refractive index adjusters (being all JSR company systems, be trade name in table), as refractive index adjusters, on two sides unilateral two-layer are formed
(base material film side is the 1st optical adjustment layer to optical adjustment layer, and ito film side is the 2nd optical adjustment layer.), while being set to shown in table 4
The thickness of optical adjustment layer, in addition, has made similarly to Example 1 two-side transparent conductive film.
Then, only the transparency conducting layer of a surface side of base material film is patterned, is defined with base material film
Two sides is formed with the double-side pattern region of transparency conducting layer and is only formed with the one side figure of transparency conducting layer in the one side of base material film
The two-side transparent conductive film in case region.Specifically, from the two-side transparent conductive film for making with 100mm × 100mm cuttings
Go out sample, to form pattern forming portion in the demifacet (50mm × 100mm) of the transparency conducting layer of a surface side of base material film, another
One demifacet forms the demifacet laminating glass tape of the mode in transparency conducting layer of pattern openings portion, in the electrically conducting transparent of another surface side
After the entire surface laminating glass tape of layer, 50 DEG C, the hydrochloric acid (hydrochloride aqueous solution) of 10 weight % 10 minutes are impregnated in, are carried out
The etching of transparency conducting layer.Afterwards, two-sided glass tape is removed, the heating of 90 minutes is carried out at 140 DEG C, make transparent leading
Electric layer is crystallized, and has made the two-side transparent conductive film that the transparency conducting layer of only one surface side has been patterned.
[evaluation]
Each two-side transparent conductive film to obtaining in embodiment 13～27 has carried out following evaluations.By each evaluation result
It is shown in table 2～5.
<Patterned appearance (reflection differences Δ R (Y value)) and reflection tone b*Evaluation>
, by the pattern for transparent conductive layer of a surface side and two-side transparent conductive film obtained by crystallization, adopt for only
The integrating sphere mode determination of the spectrophotometer " U-4100 " (trade name) of high and new technology company of Hitachi, determines spectral reflectivity
(specular reflectivity+scattered reflection rate), by calculating the total reflectivity (Y value) and reflection tone of obtaining D65 light source/2 ° visual field
b*.It should be noted that for determining, the acrylic resin of black of fitting on the surface of non-patterned transparency conducting layer
Plate and form light shield layer, almost without from the reflection at the most back side of sample, in the state of the incidence of the light of rear side
It is determined.Evaluation result is shown in into table 2 and 4.Further, as described above, in non-patterned transparency conducting layer side shape
Into after light shield layer, with bonding in the way of the pattern forming portion and pattern openings portion of the transparency conducting layer side after overlay pattern
Hyaline membrane (the day of agent (day east electrician company system, trade name " LUCIACS (registration mark) CS96217 ") 100 μm of thickness of having fitted
Ben Ruiweng company systems, trade name " Zeonor ") in the state of be determined.
Evaluation result is shown in into table 3 and 5.
[table 2]
[table 3]
[table 4]
[table 5]
According to the result of table 2, in the state of the transparency conducting layer for having patterned exposes, the refractive index of optical adjustment layer is
1.62nd, thickness is respectively reflection differences Δ R in the embodiment 17～22 of 100nm, 115nm, 125nm, 130nm, 135nm, 140nm
(Y value) and reflection tone b*Result it is all good.In addition, according to the result of table 3, it is known that：Covered with adhesive and hyaline membrane
In the state of the transparency conducting layer that lid has been patterned, the refractive index of optical adjustment layer is the embodiment that 1.655, thickness is 135nm
15th, the refractive index of optical adjustment layer be 1.62, thickness be respectively 80nm, 100nm, 115nm, 125nm, 130nm, 135nm,
The refractive index of the embodiment 16～22, optical adjustment layer of 140nm be 1.6, thickness be respectively 100nm, 120nm embodiment 24 and
25 reflection differences Δ R (Y value) and reflection tone b*Result it is all good.It can be seen from these results, the folding of optical adjustment layer
Penetrate rate for 1.61～1.65 when, from from the viewpoint of the suppression of the generation of the suppression and tone of pattern recognition and it is preferred that pH effect
The thickness of layer is 90～150nm or so.According to the result of table 4 and 5, it is known that：Formed respectively on the two sides of embodiment 26 and 27
In the state of two-layer optical adjustment layer, reflection differences Δ R (Y value) and reflection tone b*Result it is all good.If in addition, will be real
Apply example 26 and 27 to compare with the embodiment 16 or 23 of (total) thickness of their equal optical adjustment layers with having, then regardless of pattern
State is exposed or is capped, and optical adjustment layer is especially excellent in terms of reflection differences for the embodiment 26 and 27 of double-layer structure
It is different.Further, the epidemic situation comparison for exposing with the transparency conducting layer for having patterned, is being patterned with adhesive and transparent plastic mulching
Electrically conducting transparent layer state under, due to the pattern forming portion and pattern openings portion of having buried most top layer cause it is concavo-convex, therefore two
Reflection differences between person are also suppressed, and in extensive layer is constituted good result has been obtained.
Claims (11)
1. a kind of two-side transparent conductive film, wherein,
Optical adjustment layer and transparency conducting layer are sequentially formed with the two sides of base material film,
In the base material film and described in side between optical adjustment layer and the base material film and optical adjustment layer described in opposite side it
Between at least one party be formed with the resist blocking and that layer containing particle,
The resist blocking and that layer has flat part and the protrusion due to the particle,
It is worth than the pH effect obtained by the thickness of the flat part for deducting the resist blocking and that layer from the most frequency particle diameter of the particle
The thickness of layer is big.
2. two-side transparent conductive film according to claim 1, wherein, the thickness of the optical adjustment layer be 50nm～
300nm。
3. two-side transparent conductive film according to claim 1, wherein, the optical adjustment layer is by wet shape
Into layer.
4. two-side transparent conductive film according to claim 1, wherein, subtract from the height of the protrusion of the resist blocking and that layer
Go the resist blocking and that layer flat part thickness obtained by be worth it is bigger than the thickness of the optical adjustment layer.
5. two-side transparent conductive film according to claim 1, its mist degree is less than 5%.
6. two-side transparent conductive film according to claim 1, wherein, the transparency conducting layer is patterned, and this is saturating
Bright conductive layer has to be formed and the pattern forming portion of pattern and eliminates the pattern openings portion of the transparency conducting layer.
7. two-side transparent conductive film according to claim 6, wherein,
When being had an X-rayed with top view, the reflectivity in the double-side pattern region of the pattern forming portion overlap on two sides and a face are figure
Case forming portion and another face are less than 1% for the absolute value of the difference of the reflectivity of the one side area of the pattern of pattern openings portion.
8. two-side transparent conductive film according to claim 7, wherein, the reflection tone b in the double-side pattern region*It is full
- 10≤b of foot*≤0。
9. the two-side transparent conductive film according to any one of claim 1～8, wherein, the base material film contains cyclenes
Hydrocarbon system resin.
10. a kind of two-side transparent conductive film winds body, and it is to lead the two-side transparent any one of claim 1～9
Electrically the long body of film is wound as obtained from drum.
A kind of 11. contact panels, it possesses the two-side transparent conductive film any one of claim 1～9.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013107937 | 2013-05-22 | ||
| JP2013-107937 | 2013-05-22 | ||
| JP2014-084361 | 2014-04-16 | ||
| JP2014084361A JP6328984B2 (en) | 2013-05-22 | 2014-04-16 | Double-sided transparent conductive film and touch panel |
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| Publication Number | Publication Date |
|---|---|
| CN104290407A CN104290407A (en) | 2015-01-21 |
| CN104290407B true CN104290407B (en) | 2017-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410216363.9A Active CN104290407B (en) | 2013-05-22 | 2014-05-21 | Double-sided transparent conductive film and touch panel |
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| Country | Link |
|---|---|
| US (1) | US9607733B2 (en) |
| EP (1) | EP2806338A1 (en) |
| JP (1) | JP6328984B2 (en) |
| KR (1) | KR20140137318A (en) |
| CN (1) | CN104290407B (en) |
| TW (1) | TWI530839B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2015005272A (en) | 2015-01-08 |
| TW201506735A (en) | 2015-02-16 |
| US20140345917A1 (en) | 2014-11-27 |
| US9607733B2 (en) | 2017-03-28 |
| TWI530839B (en) | 2016-04-21 |
| KR20140137318A (en) | 2014-12-02 |
| EP2806338A1 (en) | 2014-11-26 |
| CN104290407A (en) | 2015-01-21 |
| JP6328984B2 (en) | 2018-05-23 |
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