CN104290020A - Soluble solid soft abrasive polishing device based on cooling fins - Google Patents

Abstract

The invention discloses a soluble fixed soft abrasive polishing device based on a semiconductor refrigeration chip. The main body of the polishing device is a polishing disc coated with fine abrasive grains on the surface. The semiconductor refrigeration chip is installed on the back of the polishing disc. The temperature control belt is composed of semiconductor refrigeration sheets arranged in a ring; the cantilever guide rail equipped with a laser surface roughness measuring instrument is also installed above the polishing disc. The laser surface roughness measuring instrument is used to measure the surface roughness of the polishing disc to measure the distribution of fine abrasive Analyze the situation, and then adjust the surface flatness of the polishing disc by controlling the temperature of each lap of the temperature control belt. The invention uses a laser surface roughness measuring instrument to measure accurate data, which ensures that the abrasive grain layer is smoother, thereby ensuring higher processing precision; using semiconductor refrigeration chips to control the temperature, which is economical and convenient to control; changing the temperature of the fine abrasive grains Solubility, so that the whole device structure is simple and easy to control.

Description

A Soluble Fixed Soft Abrasive Polishing Device Based on Refrigerating Sheet

technical field

The invention relates to the field of grinding and polishing, in particular to a soluble fixed soft abrasive polishing device based on a semiconductor refrigeration chip. the

Background technique

In modern polishing technology, the flatness of the polishing disc plays a vital role. During the polishing process, the entire circumference of the polishing disc is evenly coated with multiple layers of fine abrasives. During polishing, the polishing liquid will be continuously sprayed on the fine abrasives. Above all, the role of the polishing liquid is to dissolve the fine abrasives to dissolve the abrasives that are not sharp enough to complete the polishing work, exposing the new abrasives with good sharpness in the lower layer to realize the self-renewal of the abrasives. However, because the polishing liquid is subjected to the centrifugal force generated when the polishing disc rotates, the polishing liquid will always move to the periphery of the polishing disc, which leads to extremely uneven distribution of the polishing liquid on the entire polishing disc, that is, the polishing liquid near the center of the polishing disc There is less polishing liquid on the periphery of the polishing disc, which leads to the renewal of the abrasive on the periphery of the polishing disc faster than the abrasive near the center of the circle after grinding, which leads to the insufficient level of abrasive in the entire polishing disc, that is, the periphery is lower than the center. affect the quality of polishing. the

In order to solve this problem, a polishing device based on semiconductor refrigeration chips is proposed. Since the solubility of fine abrasive grains is related to temperature, the higher the temperature, the higher the solubility. Therefore, a polishing device based on a semiconductor refrigerator is used to attach the semiconductor refrigerator to the back of the polishing disc. By controlling the current of the semiconductor refrigerator in different regions , changing the temperature of the semiconductor refrigeration sheet in different regions, so that the temperature of the surface of the polishing disc is different. Since the thickness of the polishing disc is not thick and the material used is not strong in thermal conductivity, it can be ensured that the semiconductor cooling chip will not have a great influence on the temperature of other regions while changing the temperature of its corresponding region. According to the specific requirements, the temperature of the semiconductor refrigeration chip is changed to ensure that the solubility of the fine abrasive grains in the central part of the surface of the polishing disc is high. This method ensures that the fine abrasive grains in the polishing disc can be kept level and flat, and the processing accuracy is guaranteed to be higher. the

Contents of the invention

The technical problem to be solved by the present invention is to solve the deficiencies of the prior art. It provides a method to control the solubility of the fine abrasive grains by changing the temperature of the semiconductor refrigeration chip so that the fine abrasive grains in the polishing disc can be kept level and smooth while improving the machining accuracy. A higher soluble fixed soft abrasive polishing device based on semiconductor refrigeration chips. the

In order to achieve the above object, the technical solution adopted in the present invention is: a soluble fixed soft abrasive polishing device based on a refrigeration sheet, the main body of the polishing device is a polishing disc coated with fine abrasive grains on the surface, and the back of the polishing disc is equipped with There are semiconductor cooling chips, and the bottom of the polishing disc is provided with at least three rings of temperature control belts composed of semiconductor cooling chips in a ring arrangement. The semiconductor cooling chips of each ring of temperature control belts are uniformly controlled, and the temperature control belts of each ring are independently controlled. A cantilever guide rail equipped with a laser surface roughness measuring instrument is also provided above the polishing disc, and the laser surface roughness measuring instrument is used to measure the surface roughness of the polishing disc so as to analyze the distribution of the fine abrasive particles, and then The surface flatness of the polishing disc is adjusted by controlling the temperature of the temperature control belt in each circle. the

Further, the fine abrasive particles are evenly applied on the surface of the polishing disc and can be dissolved in the cooling liquid, and its solubility is affected by temperature, and the higher the temperature, the higher the solubility. the

Further, the thickness of the polishing disk is moderate, and the thermal conductivity is moderate, which can ensure that when the semiconductor cooling chip is attached to its back, it will not affect the temperature of the surrounding region too much while affecting the temperature of the corresponding region. the

Further, the semiconductor cooling chip rotates following the polishing disc, and the semiconductor cooling chip is connected to a carbon brush provided under the polishing disc for powering the semiconductor cooling chip. the

Further, the cantilever guide rail is parallel to the surface of the polishing disc, and the laser surface roughness measuring instrument moves linearly along the cantilever guide rail parallel to the surface of the polishing disc. the

Further, the peltiers of each temperature control zone are connected in series through wires, and the peltiers of each temperature control zone are connected to wires through carbon brushes to form a loop. the

Compared with the prior art, the present invention has the following advantages: the structure of the present invention is simple and compact, and the production cost is low; the data measured by the laser surface roughness measuring instrument is accurate, and the abrasive grain layer is guaranteed to be smoother, thereby ensuring higher processing precision; The semiconductor cooling chip is used to control the temperature, which is economical and convenient; the solubility of the fine abrasive particles is changed by changing the temperature, so that the structure of the whole device is simple and easy to control. the

Description of drawings

Fig. 1 is a schematic structural view of the present invention. the

Fig. 2 is a bottom view of the structure of the polishing disk and the semiconductor refrigeration chip of the present invention. the

Fig. 3 is a schematic top view of the structure of the present invention. the

Detailed ways

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in combination with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are exemplary only, and are not intended to limit the scope of the present invention. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of the present invention. the

In conjunction with Fig. 1, Fig. 2 and Fig. 3, a kind of soluble fixed soft abrasive polishing device based on refrigeration sheet, its main structure is polishing disc 1, and laser surface roughness measuring instrument 7 is arranged on the top of polishing disc 1, in order to measure The flatness of the fine abrasive grains on the surface of the polishing disc is equipped with a semiconductor cooling chip 13 on the back side of the polishing disc 1. According to the data measured by the measuring instrument, the flatness of the fine abrasive grains on the polishing disc is known, thereby adjusting the current of the semiconductor cooling chip 13 The size affects the solubility of fine abrasive grains in each region. the

The whole device is divided into drive part, measurement part and temperature control part. The driving part is mainly connected with the polishing disc 1 by the rotating motor 6 through the shaft coupling 5. When the rotating motor rotates, the polishing disc is driven to rotate. A support 4 is installed below the polishing disc to support the polishing disc 1. the

A cantilever guide rail 8 and a laser surface roughness measuring instrument 7 are installed above the polishing disc 1, and a driving motor 10 is arranged between the laser surface roughness measuring instrument 7 and the cantilever guide rail 8 to drive the laser surface roughness measuring instrument 7 on the cantilever Movement on the guide rail 8. Cantilever guide rail is contained on the support 9. When the polishing disc starts to rotate, by moving the position of the laser surface roughness measuring instrument 7 on the cantilever guide rail 8, the surface roughness of different circular areas of the polishing disc can be measured, and the distribution of fine abrasive particles can be known. the

The semiconductor refrigeration chip 13 is installed on the back of the polishing disc 1, and the semiconductor refrigeration chip 13 is evenly distributed in the back of the polishing disc 1 in a ring shape. It communicates with the wire 3 on the outer wall 2 to form a loop. The semiconductor cooling chips 13 of each circle are connected to different wires 3 through the probe brushes 11. When the current of a certain circle of semiconductor cooling chips 13 needs to be changed, only the current of the corresponding wire 3 needs to be changed. the

The operating procedure of the whole device is as follows:

1. Apply fine abrasive grains evenly on the surface of the polishing disc 1, and start the rotating motor 6 to make the polishing disc 1 rotate normally. the

2. The workpiece starts to be polished on the polishing disc. At the same time, the coolant is sprayed. Due to the centrifugal force generated by the rotation of the polishing disc, the cooling liquid will be unevenly distributed, resulting in uneven layers of fine abrasive grains. the

3. Start the laser surface roughness measuring instrument 7 and move the laser surface roughness measuring instrument 7 under the drive of the drive motor 10 to measure the roughness of different annular areas on the surface of the polishing disc, and calculate the smoothness of the fine abrasive grains in the corresponding annular area. the

4. According to the measured results, calculate the suitable temperature for the corresponding area, so as to make the fine abrasive particles smoother. the

5. According to the required temperature, under the premise of considering the temperature loss, heat conduction and other factors, the current passing through the semiconductor cooling sheet 13 under the corresponding area is converted, and the current of the semiconductor cooling sheet 13 is controlled by controlling the current flowing through the wire 3 on the outer wall 2 size to achieve. Since each wire is connected to a semiconductor cooling chip 13 in an annular area, the temperature of an annular area can be controlled only by controlling the magnitude of the current passing through each wire. the

6. By controlling the temperature, the polishing disc forms a temperature field, which in turn affects the solubility of the fine abrasive particles. Generally speaking, the ideal solubility distribution effect to be achieved is: the solubility of the central area is higher than that of the edge area, and the solubility is from the center to the edge. Decrease gradually. the

It should be understood that the above specific embodiments of the present invention are only used to illustrate or explain the principles of the present invention, and not to limit the present invention. Therefore, any modification, equivalent replacement, improvement, etc. made without departing from the spirit and scope of the present invention shall fall within the protection scope of the present invention. Furthermore, it is intended that the appended claims of the present invention cover all changes and modifications that come within the scope and metes and bounds of the appended claims, or equivalents of such scope and metes and bounds. the

Claims (6)

1. the solubility set mild abrasives burnishing device based on cooling piece, it is characterized in that: described burnishing device main body is the polishing disk (1) that top layer scribbles fine abrasive grains, semiconductor chilling plate (13) is equipped with at described polishing disk (1) back side, described polishing disk (1) bottom is provided with at least three and encloses the temp. control belt be made up of semiconductor chilling plate (13) annular array, the semiconductor chilling plate (13) often enclosing described temp. control belt is unified to be controlled, and often encloses described temp. control belt and independently controls; Described polishing disk (1) top is also provided with the cantilevered rail (8) that laser surface roughness measuring instrument (7) are housed, described laser surface roughness measuring instrument (7) for measuring polishing disk (1) surface roughness thus analyzing described fine abrasive grains distribution situation, and then often encloses the temperature of described temp. control belt to adjust polishing disk (1) surface smoothness by control.

2. a kind of solubility set mild abrasives burnishing device based on cooling piece according to claim 1, it is characterized in that: described fine abrasive grains uniform application is in polishing disk (1) surface, and can be dissolved in cooling fluid, its solubility is subject to the impact of temperature, and its temperature more high-dissolvability is higher.

3. a kind of solubility set mild abrasives burnishing device based on cooling piece according to claim 1, it is characterized in that: described polishing disk (1) thickness is moderate, thermal conductivity is moderate, can ensure, when semiconductor chilling plate (13) is affixed on its back side, can not have much impact to neighboring area temperature again while affecting corresponding region temperature.

4. a kind of solubility set mild abrasives burnishing device based on cooling piece according to claim 1, it is characterized in that: described semiconductor chilling plate (13) is followed polishing disk (1) and rotated, described semiconductor chilling plate (13) connects the carbon brush (11) being located at polishing disk (1) below and being used for powering to semiconductor chilling plate (13).

5. a kind of solubility set mild abrasives burnishing device based on cooling piece according to claim 1, it is characterized in that: described cantilevered rail (8) is parallel to polishing disk (1) surface, and laser surface roughness measuring instrument (7) is parallel to polishing disk (1) surperficial moving linearly along cantilevered rail (8).

6. a kind of solubility set mild abrasives burnishing device based on cooling piece according to claim 1, it is characterized in that: the semiconductor chilling plate (13) of described each temp. control belt is cascaded by wire (3), the semiconductor chilling plate (13) of described each and every one temp. control belt every connects into loop by carbon brush (11) and wire (3).