CN104282821B - Light-emitting diode structure, metal support of light-emitting diode structure and bearing seat module - Google Patents

Abstract

The metal support of the light-emitting diode structure comprises two conducting frames arranged at intervals and a plurality of extension arms formed by extending the two conducting frames integrally. Each conductive frame has a front surface, a back surface, and a ring side surface connecting the peripheries of the front and back surfaces. The front surface of each conductive frame defines a sealing area and a bearing area which is approximately surrounded by the sealing area. Each conductive frame is concavely provided with at least one separation groove from the sealing area, and the separation groove is communicated with the side surface of the ring and forms two openings on the side surface of the ring, so that the separation groove of each conductive frame can separate at least one of the extension arms from the bearing area. Therefore, after the metal bracket is coated by the insulator through the separation groove, the combination of the metal bracket and the insulator is increased, and the invasion of moisture can be slowed down.

Description

Light-emitting diode structure, light-emitting diode structure metal bracket and bearing seat module

technical field

The invention relates to a light-emitting structure, and in particular to a light-emitting diode structure, a metal bracket of the light-emitting diode structure, and a bearing seat module for mounting multiple light-emitting diode chips.

Background technique

With the high wattage output of the traditional light-emitting diode structure, the thermoplastic (Thermoplastic) plastic used therein has been gradually replaced by thermoset (Thermoset) plastic. However, due to the relatively small contact area ratio between the metal frame and the plastic of the conventional light emitting diode structure, many problems arise, such as the bonding between the conductive frame and the plastic and the problem of moisture intrusion.

Therefore, the inventor felt that the above-mentioned defects could be improved, so Naite devoted himself to research and combined with the application of theories, and finally proposed an invention with a reasonable design and effectively improved the above-mentioned defects.

Contents of the invention

The object of the present invention is to provide a light emitting diode structure and its metal bracket, and the bearing module, which can be provided with a separation groove located in the sealing area (such as the separation groove connected to the side of the adjacent ring and located at the corners of the four sides of the conductive frame, or The ring-shaped separation groove surrounding the periphery of the carrying area increases the bonding between the metal support and the insulator and effectively slows down the intrusion of water vapor.

In order to achieve the above object, an embodiment of the present invention provides a light emitting diode structure, including: a metal bracket, which has two conductive frames arranged at intervals and a plurality of extension arms formed integrally extending from the two conductive frames, each conductive frame It has a front side, a back side, and a ring side connected to the front side and the back side, and the front side of each conductive frame defines a sealing area and a bearing area substantially surrounded by the sealing area; wherein, each conductive The frame is recessed from the sealing area on its front to form at least one separation groove, and the at least one separation groove communicates with the side of the ring and forms two openings on the side of the ring, so that the separation grooves of each conductive frame can be separated At least one of the extension arms and the carrying area; a light emitting diode chip installed on the carrying area of the metal support and electrically connected to the two conductive frames; and an insulator covering the metal support , and the back part areas of the two conductive frames and the end faces of the extension arms are exposed outside the insulator.

The present invention also provides a metal bracket with a light-emitting diode structure, including: two conductive frames, which are arranged at intervals, each conductive frame has a front face, a back face, and a ring side connected to the front face and the periphery of the back face, and The front side of each conductive frame defines a sealing area and a bearing area roughly surrounded by the sealing area; and a plurality of extension arms, which are formed integrally extending from the two conductive frames respectively; The sealing area is concavely formed with at least one separation groove, and the at least one separation groove communicates with the side of the ring and forms two openings on the side of the ring, so that the separation groove of each conductive frame can separate the extension arm. At least one of them is associated with the bearing area.

The present invention also provides a carrier module for mounting a plurality of light-emitting diode chips on it. frame and a plurality of extension arms formed integrally extending from the two conductive frames respectively, each conductive frame has a front, a back, and a ring side connected to the front and the periphery of the back, and the front of each conductive frame defines There is a sealing area and a bearing area roughly surrounded by the sealing area; wherein, each conductive frame is recessed from the sealing area on its front to form at least one separation groove, and the at least one separation groove is connected to the side of the ring and Two openings are formed on the side of the ring, so that the separation groove of each conductive frame can separate at least one of the extension arms from the bearing area; wherein, the two conductive frames of each metal bracket are respectively defined as a first conductive frame. Frame and a second conductive frame, any two adjacent metal brackets along a first direction are integrally connected to the second conductive frame of the other metal bracket through the first conductive frame extension arm of one of the metal brackets. An arm, and the oblique integrally connected extending arm substantially forms an acute angle with the first direction; and a plurality of insulating seats, which cover the outer edges of the metal brackets.

To sum up, the light-emitting diode structure, the metal bracket of the light-emitting diode structure, and the bearing module provided by the embodiments of the present invention, through the formation of separation grooves, the combination between the insulator and the front surface of the conductive frame is effectively improved. . Furthermore, the moisture infiltrated between the conductive frame and the insulator through the extension arm can be effectively isolated by the junction of the separation slot and the insulator. Moreover, by separating the distribution positions of the grooves, the effect of preventing moisture from invading the carrying area of the conductive frame is achieved.

In order to enable a further understanding of the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, but these descriptions and accompanying drawings are only for illustrating the present invention, rather than limiting the scope of claims of the present invention. any restrictions.

Description of drawings

FIG. 1 is a schematic perspective view of a bearing seat according to a first embodiment of the present invention.

FIG. 2 is a three-dimensional schematic diagram of another viewing angle of FIG. 1 .

FIG. 3 is a schematic perspective view of the metal bracket in FIG. 1 .

FIG. 4 is a schematic perspective view of another viewing angle of the metal bracket in FIG. 1 .

FIG. 5 is a schematic cross-sectional view along line A-A of FIG. 1 .

FIG. 6A is a schematic perspective view of another implementation of the bearing seat of the first embodiment of the present invention.

FIG. 6B is a schematic cross-sectional view along line B-B in FIG. 6A .

FIG. 6C is a partially enlarged schematic diagram of block C in FIG. 6B .

FIG. 7 is a three-dimensional schematic diagram of the structure of the light emitting diode according to the first embodiment of the present invention.

FIG. 8 is a schematic perspective view of another implementation of the light emitting diode structure of the first embodiment of the present invention.

FIG. 9 is a schematic perspective view of yet another implementation of the light emitting diode structure of the first embodiment of the present invention.

FIG. 10 is a schematic perspective view of the bearing module according to the first embodiment of the present invention.

FIG. 11 is a schematic perspective view of the metal bracket in FIG. 10 .

FIG. 12 is a schematic perspective view of another viewing angle of the metal bracket in FIG. 10 .

FIG. 13 is a schematic perspective view of FIG. 10 after cutting.

FIG. 14 is a schematic perspective view of a metal bracket according to a second embodiment of the present invention.

FIG. 15 is a schematic perspective view of another viewing angle of FIG. 14 .

FIG. 16 is a three-dimensional schematic view of the light emitting diode structure according to the second embodiment of the present invention.

FIG. 17 is a schematic perspective view of another implementation of the light emitting diode structure of the second embodiment of the present invention.

FIG. 18 is a schematic perspective view of another embodiment of the light emitting diode structure of the second embodiment of the present invention.

detailed description

[first embodiment]

Referring to FIG. 1 and FIG. 2 , a carrier 100 for a light emitting diode structure of a QFN (quad flat no-lead) process is provided. The supporting seat 100 includes a metal frame 1 and an insulating seat 2 . The metal frame 1 has two conductive frames 11 arranged at intervals and a plurality of extension arms 12 formed integrally extending from the two conductive frames 11 .

The insulating seat 2 can be made of thermosetting plastics, such as epoxy resin (Epoxy), silicone (Silicone), and the insulating seat 2 covers the two conductive frames 11 and the extension arm 12, and the two conductive frames 11 are covered by the insulating seat 2 Partial areas of the two conductive frames 11 (i.e., the carrying area 1112 and the welding area 1122 described later) and the end surface 121 of the extension arm 12 are exposed outside the insulating base 2, so that the surface of the welding area 1122 and the extension arm 12 The end face 121 is flush with the insulating seat 2 . The gap between the two conductive frames 11 is filled by the insulating seat 2 , and the portion of the insulating seat 2 filled between the two conductive frames 11 is defined as an insulating spacer 21 . It is worth noting that the material of the insulating seat 2 is not limited to the above-mentioned thermosetting plastics, and thermoplastic plastics, such as Poly1,4-cyclohexylene dimethyl terephthalate (Poly1,4-cyclohexylene dimethylene terephthalate, PCT for short).

Referring to FIG. 3 and referring to FIG. 1 in due course, the two conductive frames 11 are a convex first conductive frame 11 a and a concave second conductive frame 11 b in different shapes. Each of the two conductive frames 11 has the same predetermined thickness (T). Each conductive frame 11 defines a front 111 , a back 112 , and a ring side 113 connected to the periphery of the front 111 and the back 112 . The maximum distance between the front 111 and the back 112 of each conductive frame 11 is the predetermined thickness (T), and the front 111 of each conductive frame 11 defines a sealing area 1111 and a bearing area 1112 . The carrying area 1112 is roughly surrounded by the sealing area 1111 , and the carrying area 1112 is used for carrying (fixing) at least one LED chip or for wire bonding.

The sealing area 1111 is covered by the insulating seat 2, and the carrying area 1112 is exposed outside the insulating seat 2. The carrying area 1112 of the two conductive frames 11 is roughly located between the sealing areas 1111, and the front surfaces 111 and 111 of the two conductive frames 11 and The top surface of the insulating spacer 21 located between the two conductive frames 11 is substantially coplanar.

A substantially circular groove-shaped accommodation hole 22 is recessed in the center of the top surface of the insulating base 2, and the carrying area 1112 of the front surface 111 of each conductive frame 11 is exposed outside the insulating base 2 through the above-mentioned accommodation hole 22. . The accommodating hole 22 may be in the shape of a circular groove as shown in FIG. 1 , and in practical application, the accommodating hole 22 may also be formed in a square groove shape or the like.

Each conductive frame 11 is recessed (for example: etched) from the sealing area 1111 of its front surface 111 to form two roughly triangular-shaped separation grooves 1113, and each separation groove 1113 communicates with the above-mentioned ring side 113 and on the ring side 113 Two openings 1113a, 1113b with different sizes are formed on the top, so that each separation groove 1113 can separate at least one top surface of the extension arm 12 from the carrying area 1112 . Further, in each separation groove 1113, the smaller opening 1113a faces the inside of the conductive frame 11 and is formed at one corner of the triangular structure, while the larger opening 1113b faces the outside of the conductive frame 11 and forms On the opposite side of the corner, the hypotenuse of the triangular configuration extends approximately along the arc of the circular groove. Furthermore, the recessed depth of the separation groove 1113 is preferably 1/2 of the predetermined thickness (1/2T), but not limited thereto, the recessed depth of the above-mentioned separation groove 1113 may be approximately 1/4 of the predetermined thickness (1/2T). 1/4T) to three-quarters of the predetermined thickness (3/4T). It is worth noting that the distance between the separation groove 1113 and the circular groove-shaped receiving hole 22 is at least 100 microns, so that the insulating base 2 can sufficiently cover the two conductive frames 11 and the extension arm 12 .

The separation grooves 1113 of the two conductive frames 11 each form an unclosed triangular half-etching structure. These separation grooves 1113 are arranged around the accommodating hole 22 of the insulating base 2 and are located at the corners of the metal frame 1 . Thus, by forming the separation groove 1113 , the front surface 111 of the conductive frame 11 presents a structure with ups and downs, thereby effectively improving the combination between the insulating base 2 and the front surface 111 of the conductive frame 11 . Furthermore, the part where the separation groove 1113 and the insulating seat 2 are joined is higher in combination than the surroundings, so that the water vapor infiltrated between the conductive frame 11 and the insulating seat 2 through the extension arm 12 can be effectively absorbed. The part where the separation groove 1113 is connected with the insulating base 2 is isolated. Moreover, by separating the distribution positions of the grooves 1113 , the effect of preventing moisture from invading the carrying area 1112 of the conductive frame 11 is achieved.

In each conductive frame 11 , a slot 114 passing from the front side 111 to the back side 112 is formed on the side of the ring 113 corresponding to the smaller opening 1113 a of each separation slot 1113 . Therefore, in response to the design of the bearing seat 100, in order to obtain the maximum bonding area and heat dissipation area, the joint area between the conductive frame 11 and the insulating seat 2 is reduced, and the insulating seat 2 can extend through the angular shape combined with the slot 114. The edge material penetrates the structure to enhance the bonding force between the insulating base 2 and the conductive frame 11 .

Referring to FIG. 4 and referring to FIG. 2 in due course, the back surface 112 of each conductive frame 11 defines a cladding area 1121 and a soldering area 1122 . Wherein, the cladding region 1121 is a groove-shaped structure recessed (eg, etched) from the periphery of the back surface 112 (that is, the portion of the back surface 112 adjacent to the ring side surface 113 ). The covering area 1121 is covered by the insulating base 2 , while the soldering area 1122 is exposed outside the insulating base 2 . The soldering area 1122 of each conductive frame 11 is approximately located inside the covering area 1121 , and the soldering area 1122 of the two conductive frames 11 and the bottom surfaces of the insulating bases 2 connected to the two conductive frames 11 are substantially coplanar.

The thickness of the ring side 113 is approximately one-half of the predetermined thickness (1/2T), but not limited thereto, the thickness of the ring side 113 may be approximately one-quarter of the predetermined thickness (1/4T) to one-quarter Three predetermined thickness (3/4T).

The extension arms 12 are respectively integrally extended from the ring side 113 of each conductive frame 11 , and the thickness of the extension arms 12 is substantially equal to the thickness of the ring side 113 . That is, the thickness of the extension arm 12 is 1/4 of the predetermined thickness (1/4T) to 3/4 of the predetermined thickness (3/4T), and the thickness of the extension arm 12 is 1/2 of the present embodiment. Predetermined thickness (1/2T). From another point of view, the thickness of the extension arm 12 is substantially equal to the thickness of the portion of the conductive frame 11 where the separation groove 1113 is formed.

Please refer to Fig. 5 and refer to Fig. 3 and Fig. 4 in due course, the above-mentioned convex first conductive frame 11a is provided with a protruding portion 111a, and the concave-shaped second conductive frame 11b is provided with a corresponding A concave portion 111b of the exit portion 111a. Wherein, the lower surface of the protruding part 111a is the above-mentioned covered area 1121 in the shape of a groove, and the upper surface of the recessed part 111b is concavely provided with a groove 1111b, so that the plastic filled between the two conductive frames 11 appears up and down. Misalignment is used to strengthen the insulation isolation part 21, and the upper and lower sides have extended plastics to block the intrusion of water vapor, so as to strengthen the bonding force between the insulating seat 2 and the conductive frame 11.

The metal bracket 1 of the present invention uses a convex first conductive frame 11a and a concave second conductive frame 11b to achieve the effect of overcoming the lateral mechanical shear force through the concave-convex conductive frame 11, and then effectively solve the above-mentioned conductive frame 11a. The phenomenon that the frame 11 is separated from the insulating part 21.

As shown in Fig. 6A, the insulating spacer 21 is located at the position of the accommodating hole 22, which protrudes and is higher than the bearing areas 1112 of the first and second conductive frames 11a, 11b on both sides, thereby achieving the effect of reducing water vapor intrusion , and prevent the light emitted by the chip from leaking from the bottom. In more detail, as shown in FIG. 6B and FIG. 6C, the above-mentioned insulating spacer 21 is located at the position of the accommodation hole 22, which is compared with the carrying areas 1112 of the first and second conductive frames 11a and 11b on both sides. , preferably can protrude by 300-500 microns, and the cross-sectional width covered on the bearing area 1112 is preferably 300-500 microns, in addition to effectively blocking the intrusion of water vapor from the bottom surface of the bearing seat 100, it can also avoid the intrusion of the insulating part 21 blocks the light emitting angle of the chip and affects the light emitting brightness of the packaging structure.

Furthermore, the above-mentioned carrier 100 can be combined with other components to form a light emitting diode structure. Specifically, please refer to FIG. 7 , which is a light emitting diode structure, including the carrier 100, two light emitting diode chips 200 mounted on the carrier 100, and a light emitting diode arranged on the carrier 100 and sealed. The light-transmitting member 300 (such as a lens) of the chip 200 .

The type of the light emitting diode chip 200 can be a wire bonding type or a flip chip type. The LED chip 200 is located in the accommodating hole 22 of the insulating base 2 and mounted on the carrying area 1112 of the first conductive frame 11a. The LED chip 200 is electrically connected to the first conductive frame 11a and the second conductive frame 11a respectively by wire bonding. Conductive frame 11b. The light-transmitting member 300 is partially filled in the accommodating hole 22 of the insulating seat 2 to seal the LED chip 200, while the rest of the light-transmitting member 300 is exposed outside the top surface of the insulating seat 2 and forms a hemispherical structure. . In addition, the transparent member 300 can also be formed as shown in FIG. 8 , that is, the transparent member 300 is filled in the accommodating hole 22 , and the top surface of the transparent member 300 is coplanar with the top surface of the insulating base 2 .

The light emitting diode structure can also only be composed of the metal frame 1 , the light emitting diode chip 200 and the light-transmitting member 300 . As shown in FIG. 9 , the light-transmitting member 300 directly and integrally covers the conductive frame 11 and the LED chip 200 to form a LED structure. In other words, the light-emitting diode structure can also use the light-transmitting member 300 to replace the insulating seat 2 . Wherein, the welding areas 1122 of the back surfaces 112 of the two conductive frames 11 and the end surfaces 121 of the extension arms 12 are exposed outside the light-transmitting member 300 .

In summary, the LED structure of this embodiment is composed of the metal frame 1 , the LED chip 200 disposed on the metal frame 1 , and an insulator covering the metal frame 1 and the LED chip 200 .

Wherein, when the structure of the light emitting diode is as shown in FIG. 7 or 8 , the insulator includes a non-transparent insulating seat 2 and a light-transmitting member 300 . When the light emitting diode structure is as shown in FIG. 9 , the insulator is defined as the light-transmitting member 300 . However, no matter what the structure of the light emitting diode is, the welding area 1122 of the backside 112 of the two conductive frames 11 and the end surfaces 121 of the extension arms 12 must be exposed outside the insulator.

In addition, the single carrier 100 described in this embodiment is formed by cutting a carrier module 400 during manufacture (as shown in FIG. 10 ). Specifically, the carrying seat module 400 includes a plurality of carrying seats 100 connected as a whole for mounting a plurality of light emitting diode chips 200 thereon. For ease of description, only part of the bearing seat 100 is used in the drawings of this embodiment.

Before the bearing module 400 is formed, a plurality of metal brackets 1 integrally connected into a monolithic structure are formed (see FIG. 11 and FIG. 12 ). Wherein, if viewed from a first direction D1 , the first conductive frames 11 a of each metal bracket 1 are integrally connected with the first conductive frames 11 a on opposite sides thereof through respective extension arms 12 . The second conductive frame 11b of each metal support 1 is integrally connected with the second conductive frame 11b located on opposite sides thereof through respective extension arms 12, and the plurality of connected extension arms 12 are substantially parallel to the first Direction D1. If viewed from a second direction D2 perpendicular to the first direction D1, any two adjacent metal supports 1 pass through the first conductive frame 11a extension arm 12 of one of the metal supports 1 and the first conductive frame 11a of the other metal support 1. The extension arms 12 of the two conductive frames 11b are integrally connected, and the plurality of connected extension arms 12 are substantially parallel to the second direction D2.

In addition to the extension arm 12 that is substantially parallel to the first direction D1 or the second direction D2, when viewed from the first direction D1, any two adjacent metal brackets 1 pass through the first conductive frame 11a of one of the metal brackets 1 The extension arms 12 are obliquely integrally connected to the second conductive frame 11 b of the other metal bracket 1 , and these connected extension arms 12 generally form an acute angle with the first direction D1 . Thereby, the two adjacent metal brackets 1 pass through the extension arms 12 connected obliquely to enhance the stability between the two adjacent metal brackets 1, which is beneficial to improve the injection yield when the insulating seat 2 is subsequently formed, and Reduce the possibility of burrs caused by overflowing glue in subsequent processes.

When the outer edges of the plurality of connected metal supports 1 are formed with a plurality of connected insulating seats 2 to form a plurality of connected supporting seats 100, a cutting step is implemented to make these connected into one The integrated bearing seat 100 is cut into a plurality of bearing seats 100 separated from each other (as shown in FIG. 13 ).

Wherein, the thickness of the extension arm 12 is smaller than the predetermined thickness of the conductive frame 11 , for example, the thickness of the extension arm 12 is 1/4 of the predetermined thickness (1/4T) to 3/4 of the predetermined thickness (3/4T). Thereby, in the cutting step, the thickness of the extension arm 12 that needs to be cut by the tool can be reduced, thereby reducing the loss of the tool and reducing the probability of burrs, and can effectively avoid contact between the end surface 121 (cutting point) of the extension arm 12 and the insulating seat 2 The peeling phenomenon is generated to slow down the speed of moisture intrusion from the extension arm 12 .

[Second embodiment]

Referring to Fig. 14 to Fig. 18, it is the second embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, and the same parts will not be repeated. The difference between the two mainly lies in the separation groove 1113 on the conductive frame 11 , as detailed below.

As shown in Figure 14 and Figure 15, each conductive frame 11 is recessed (eg: etched) from the sealing area 1111 of its front 111 to form a roughly U-shaped structure and a separation groove 1113 with equal width, the above two U-shaped Shaped separation grooves 1113 are distributed along the outside of the accommodating hole 22 of the insulating base 2 to surround the carrying area 1112 . Furthermore, the separating slots 1113 of the two conductive frames 11 surround the carrying area 1112 and are located within the outer periphery of the metal frame 1 . That is, the inner edge of the separation groove 1113 of the two conductive frames 11 is greater than or equal to the outer edge of the bearing area 1112 , and the outer edge of the separation groove 1113 of the two conductive frames 11 is smaller than or equal to the outer edge of the metal support 1 .

Each separation groove 1113 communicates with the ring side faces 113 of the two conductive frames 11 facing each other, and the two ends of the U-shaped separation groove 1113 form two openings 1113a of approximately the same size on the ring side face 113 (that is, the two openings 1113a of the separation groove 1113 Two openings 1113 a are respectively formed at two ends of the U-shaped structure), so that each separation groove 1113 separates the carrying area 1112 from the top surfaces of all the extension arms 12 .

In this embodiment, the recessed depth of the separation groove 1113 is approximately half of the predetermined thickness (1/2T), and the width is less than or equal to 1T, but not limited thereto. The depression depth of the separation groove 1113 may be one quarter of the predetermined thickness (1/4T) to three quarters of the predetermined thickness (3/4T).

Furthermore, in each conductive frame 11 , a slot 114 penetrating from the front side 111 to the back side 112 is formed at the portion of the ring side 113 corresponding to the two openings 1113 a of each separation slot 1113 .

In addition, the LED structure described in this embodiment can also be formed as the structure shown in FIGS. 7 to 9 in the first embodiment. For example: FIG. 16 shows that the light emitting diode structure of this embodiment corresponds to the structure shown in FIG. 7 of the first embodiment; FIG. 17 shows that the light emitting diode structure of this embodiment corresponds to the structure shown in FIG. 8 of the first embodiment; FIG. 18 shows that the light emitting diode structure of this embodiment corresponds to the structure shown in FIG. 9 of the first embodiment.

[Possible efficacy of the embodiment of the present invention]

To sum up, the embodiments of the present invention form a separation groove to effectively improve the combination between the insulating base and the front of the conductive frame, and then make the water vapor infiltrated between the conductive frame and the insulating base through the extension arm , can be effectively isolated by the part where the separation groove and the insulating seat are joined. Moreover, by separating the distribution positions of the slots, the effect of preventing moisture from invading the carrying area of the conductive frame is achieved. In addition, the insulating seat can pass through the structure through the angular extension edge material combined with the notch, so as to improve the bonding force between the insulating seat and the conductive frame.

In more detail, in the first embodiment, the shape of the accommodating hole is a circular groove, and the separation groove corresponds to the circular groove-shaped accommodating hole, which is designed to be located at the four corners of the conductive frame and communicate with each other in a limited sealing area. The triangular half-etching structure on the side of the ring is used to increase the bonding force between the insulating seat and the conductive frame. In the second embodiment, the accommodating hole is in the shape of a square groove, and the separation groove corresponds to the accommodating hole in the shape of a square groove. The binding force of the frame.

The metal bracket provided by the embodiment of the present invention achieves the effect of overcoming the lateral mechanical shear force through the concave-convex matching of the two conductive frames, and effectively solves the above-mentioned phenomenon that the conductive frame is peeled off from the insulating isolation part. Furthermore, the lower surface of the protruding part is groove-shaped, and the upper surface of the concave part is provided with grooves, so that the plastic filled between the two conductive frames presents a vertical dislocation to strengthen the insulating isolation part, and through the upper and lower uniform There is an externally extended plastic to block the intrusion of water vapor, so as to strengthen the bonding force between the insulating seat and the conductive frame.

In the bearing seat module provided by the embodiment of the present invention, any two adjacent metal brackets are connected obliquely through the extension arms to enhance the stability between the two adjacent metal brackets, thereby facilitating the improvement of the subsequent forming of the insulating seat. Improve the injection yield and reduce the possibility of burrs caused by overflowing glue in the subsequent process. Furthermore, the thickness of the extension arm is less than the predetermined thickness of the conductive frame, thereby reducing the thickness of the extension arm that the tool needs to cut in the cutting step, thereby reducing tool loss and reducing the probability of burrs, and effectively avoiding the extension arm. The peeling phenomenon occurs between the end surface and the insulating seat, so as to slow down the speed of moisture intrusion from the extension arm.

The above description is only a preferred feasible embodiment of the present invention, and it is not intended to limit the patent scope of the present invention. Any changes and modifications made according to the scope of the claims of the present invention shall belong to the description of the present invention. within the claims.

Claims (9)

1. a kind of light emitting diode construction, it is characterised in that include：

One metallic support, there are two spaced conduction racks to extend shape from described two conduction racks one respectively with multiple for which Into adjutage, each conduction rack has a front, a back side and is connected in a ring side of the front and the back side periphery Face, and the front definition of each conduction rack has a seal area and a supporting region surrounded by the seal area；

Wherein, each conduction rack is formed with an at least separation trough, and at least one separation from its positive seal area is recessed Groove is communicated in the ring side and two openings is formed on the ring side, so that the separation trough of each conduction rack can be separated out At least one of the plurality of adjutage and the supporting region；

Wherein, the separation trough quantity of each conduction rack is for multiple, and each separation trough is in triangle columnar structure, Mei Yisuo The size for stating two openings of separation trough is different, and in each separation trough, its less opening is formed in the triangle columnar structure A wherein corner, and larger opening is then formed in the opposite side in the corner；

One light-emitting diode chip for backlight unit, is installed on the supporting region of the metallic support and is electrically connected at described two conduction racks；With And

One insulator, which is coated on the metallic support, and the back portion region of described two conduction racks and the plurality of prolongs The terminal surface of semi-girder is revealed in outside the insulator.

2. light emitting diode construction as claimed in claim 1, wherein, the insulator includes an insulating base, the insulating base bag The interval overlayed between described two conduction racks and the plurality of adjutage, and described two conduction racks is filled by the insulating base, So that described two conduction racks are separated by the insulating base, the front supporting region of described two conduction racks and back portion region with And the terminal surface of the plurality of adjutage is revealed in outside the insulating base.

3. light emitting diode construction as claimed in claim 2, wherein, the insulating base is filled in the portion between described two conduction racks Position is defined as one and is dielectrically separated from portion, and this is dielectrically separated from portion surface and stretches out and be covered in the front of described two conduction racks and holds Carry area.

4. light emitting diode construction as claimed in claim 2, wherein, the insulating base top surface is recessed to be formed with an accommodating hole, and Outside the positive supporting region of each conduction rack is exposed to the insulating base by the accommodating hole, the light-emitting diode chip for backlight unit position In the accommodating hole of the insulating base, the insulator also includes a transmission element, and the transmission element is at least partly filled in the insulating base Accommodating hole in, to seal the light-emitting diode chip for backlight unit.

5. light emitting diode construction as claimed in claim 1, wherein, the insulator is further defined to a transmission element, and this is saturating Light part integrally coats the metallic support and the light-emitting diode chip for backlight unit, and back portion region and the institute of described two conduction racks The terminal surface for stating multiple adjutages is revealed in outside the transmission element.

6. a kind of load bearing seat module, it is characterised in that with being mounted thereon for multiple light-emitting diode chip for backlight unit, the load bearing seat mould Block includes：

Multiple metallic supports, one body phase are linked to be monolithic construction, each metallic support include two conduction racks with it is multiple Extend the adjutage for being formed respectively from described two conduction racks one, each conduction rack has a front, a back side and phase It is connected in a ring side in the front and the back side periphery, and the front definition of each conduction rack has a seal area and by this The supporting region surrounded by seal area；

Wherein, each conduction rack is formed with an at least separation trough, and at least one separation from its positive seal area is recessed Groove is communicated in the ring side and two openings is formed on the ring side, so that the separation trough of each conduction rack can be separated out The adjutage at least one with the supporting region；

Wherein, the separation trough quantity of each conduction rack is for multiple, and each separation trough is in triangle columnar structure, Mei Yisuo The size for stating two openings of separation trough is different, and in each separation trough, its less opening is formed in the triangle columnar structure A wherein corner, and larger opening is then formed in the opposite side in the corner；

Wherein, two conduction racks of each metallic support are respectively defined as one first conduction rack and one second conduction rack, edge Any two adjacent metal support on one first direction passes through the first conduction rack adjutage of a wherein metallic support obliquely Integrally be connected in the second conduction rack adjutage of wherein another metallic support, and the adjutage that is connected of the oblique one with this first Direction mutually accompanies an acute angle；And

Multiple insulating bases, which is coated on the plurality of metallic support outer rim.

7. a kind of metallic support of light emitting diode construction, it is characterised in that include：

Two conduction racks, which is set in distance, each conduction rack have a front, a back side and be connected in the front with One ring side of the back side periphery, and the front definition of each conduction rack has a seal area to be surrounded by the seal area with one Supporting region；And

Multiple adjutages, which extends from described two conduction racks one respectively and is formed；

Wherein, each conduction rack is formed with an at least separation trough, and at least one separation from its positive seal area is recessed Groove is communicated in the ring side and two openings is formed on the ring side, so that described at least the one of each conduction rack separates Groove can separate open at least one of the plurality of adjutage and the supporting region；

Wherein, the separation trough quantity of each conduction rack is for multiple, and each separation trough is in triangle columnar structure, Mei Yisuo The size for stating two openings of separation trough is different, and in each separation trough, its less opening is formed in the triangle columnar structure A wherein corner, and larger opening is then formed in the opposite side in the corner.

8. the metallic support of light emitting diode construction as claimed in claim 7, wherein, in each conduction rack, the ring Side corresponds to the short slot of the position formation one by the front insertion to the back side of the smaller opening of each separation trough.

9. the metallic support of light emitting diode construction as claimed in claim 7, wherein, wherein the one of described two conduction racks lead Electric frame is in convex and to be provided with a protuberance, and another conduction rack it is concave and in should the position of protuberance be provided with corresponding to this One depressed part of protuberance, the lower surface of the protuberance form channel-shaped construction, and the upper surface of the depressed part is arranged with a groove.