CN104282323B - Storage device and manufacturing method thereof - Google Patents

Abstract

The present invention discloses a storage device and a manufacturing method thereof. The storage device includes a storage element and an assembly. The storage element has a body and a first pad group and a second pad group exposed on opposite sides of the body. The assembly has a first terminal group and a second terminal group electrically connected to each other. The storage element is detachably assembled to the assembly. The first terminal group is electrically connected to the first pad group. The second terminal group is located between the first pad group and the second pad group. The second terminal group and the second pad group form a connection interface for the storage device to be electrically connected to an external device.

Description

Storage device and manufacturing method thereof

technical field

The invention relates to a storage device and a manufacturing method thereof.

Background technique

With the development of multimedia technology, the digital files produced become larger and larger. Although the traditional 1.44MB floppy disk is easy to carry, its capacity can no longer meet the current demand. In addition, although a hard disk with a traditional disk structure can provide a large storage space, it is inconvenient for users to carry it because of its large size. Because the rewritable non-volatile memory has the characteristics of non-volatility of data, power saving, small size and no mechanical structure, it is suitable for portable applications and is most suitable for use in such portable products powered by batteries . A flash drive is a storage device using NAND flash memory (FlashMemory) as a storage medium.

Generally, the flash drive includes a circuit board, electronic components, and several elastic terminals and metal conductive sheets (also called connectors or connection interfaces) for connecting with the host. Although the size of the flash drive can be appropriately reduced by miniaturizing the circuit board, it is quite difficult to further miniaturize the flash drive due to the size of the metal shell of the connector. Therefore, how to simplify the assembly structure and process of the flash drive, so as to reduce the volume of the flash drive and increase its convenience in use, has become a problem that those skilled in the art are working hard to solve.

Contents of the invention

The object of the present invention is to provide a storage device, which can effectively reduce the volume through a simple structural configuration, and at the same time improve the convenience and applicability during use.

Another object of the present invention is to provide a method for manufacturing a storage device, which has a simplified manufacturing process.

To achieve the above purpose, the present invention provides a storage device, including a storage element and an assembly. The memory element has a body and a first pad set and a second pad set exposed on opposite sides of the body. The assembly has a first terminal group and a second terminal group electrically connected to each other. The storage element is detachably assembled in the assembly, wherein the first terminal group is electrically connected to the first pad group, the second terminal group is located between the first pad group and the second pad group, and the second terminal group is connected to the first pad group. The two pad groups form a connection interface for the storage device to be electrically connected to an external device, wherein the assembly part is a U-shaped structure, and the assembly part has a transfer part and a bearing part located on opposite sides of the U-shaped structure. The body is located between the transfer portion and the carrying portion, so that the storage element is configured in a U-shaped structure, and the first terminal group and the second terminal group are formed in the transfer portion and extend away from each other.

The present invention also proposes a manufacturing method of the above-mentioned storage device, including: assembling the storage element into an assembly, wherein the first terminal group is electrically connected to the first pad group, and the second terminal group is located between the first pad group and the second pad group. Between the pad groups, the second terminal group and the second pad group form a connection interface for the storage device to be electrically connected to an external device.

In an exemplary embodiment of the present invention, the above-mentioned memory element further has a third pad group located between the first pad group and the second pad group.

In an exemplary embodiment of the present invention, the aforementioned third pad set is electrically connected to the first pad set.

In an exemplary embodiment of the present invention, the orthographic projection area of the transfer portion on the main body is smaller than the orthographic projection area of the bearing portion on the main body.

In an exemplary embodiment of the present invention, the above-mentioned assembly part further has a first stop part disposed on the bearing part and located at the first end of the U-shaped structure. The storage element is carried on the carrying portion and abuts against the first stop portion.

In an exemplary embodiment of the present invention, the orthographic area of the transition portion on the main body is greater than the orthographic area of the bearing portion on the main body.

In an exemplary embodiment of the present invention, the storage device further includes a casing, which is sleeved on the fitting and abutted against the transfer portion and the bearing portion, and the storage element is accommodated in the casing. The casing has a convex shell structure and opposite first openings and second openings, and the assembly part also has a sealing part located at the second end of the U-shaped structure and adjacent to the transfer part and the bearing part. The fitting and the storage element assembled therein are assembled to the casing from the first opening, so that the sealing part seals the first opening, and the bearing part and the convex structure are supported on the same side of the storage element.

In an exemplary embodiment of the present invention, the above-mentioned casing further has a third stopper located at the second opening. The storage element is assembled into the housing along with the fitting and abuts against the third stopper.

In an exemplary embodiment of the present invention, the transition portion of the assembly part and the storage element form an accommodating space. The first terminal group and the first pad group electrically connected to each other are located in the accommodating space, and the second terminal group and the second pad group are located outside the accommodating space.

In an exemplary embodiment of the present invention, the storage device further includes a casing, which is sleeved on the fitting and abutted against the transfer portion and the bearing portion, and the storage element is accommodated in the casing.

In an exemplary embodiment of the present invention, the above-mentioned housing has a first opening and a second opening opposite to each other, and the assembly part further has a sealing part located at the sealing end of the U-shaped structure and adjacent to the transfer part and the bearing part. The fitting and the storage element assembled therein are assembled to the casing from the first opening, so that the sealing portion seals the first opening.

In an exemplary embodiment of the present invention, the above-mentioned second pad group is a connection interface conforming to the Universal Serial Bus 2.0 (USB 2.0) specification.

In an exemplary embodiment of the present invention, the above-mentioned second terminal group and the second pad group form a connection interface conforming to the Universal Serial Bus 3.0 (USB 3.0) specification.

In an exemplary embodiment of the present invention, the above-mentioned first terminal group is an elastic structure.

In an exemplary embodiment of the present invention, the above-mentioned assembly is a U-shaped structure with a second end and a first end, and the assembly has a transfer portion and a load-bearing portion located on opposite sides of the U-shaped structure. The manufacturing method of the storage device further includes assembling the storage element into the U-shaped structure from the first end toward the second end, so that the body is disposed between the transfer portion and the bearing portion.

In an exemplary embodiment of the present invention, the above-mentioned assembly is a U-shaped structure with a second end and a first end, and the assembly has a transfer portion and a load-bearing portion located on opposite sides of the U-shaped structure. The manufacturing method of the storage device further includes assembling the storage element into the U-shaped structure from the side opening between the second end and the first end, so that the body is disposed between the transfer portion and the bearing portion.

In an exemplary embodiment of the present invention, the above-mentioned housing has a first opening and a second opening opposite to each other. The assembly is a U-shaped structure with a second end and a first end, and the assembly has a transfer portion and a bearing portion located on opposite sides of the U-shaped structure, and a sealing portion located at the second end. The sealing part is adjacent to the transfer part and the bearing part. The manufacturing method of the storage device further includes, inserting the assembly part to the casing along the first opening, and sealing the first opening with the sealing part.

In an exemplary embodiment of the present invention, the above-mentioned housing further has a third stopper located at the second opening. The manufacturing method of the storage device further includes that the storage element moves into the housing from the first opening toward the second opening and abuts against the third stopper.

In an exemplary embodiment of the present invention, before assembling the storage element in the assembly, the assembly is manufactured by integral molding technology.

In the above exemplary embodiments of the present invention, the memory device is simply constituted by the memory element and the assembly, wherein the memory element is provided with the first pad group and the second pad group, and the assembly is provided with the first terminal group and the second pad group. Two terminal groups, so that when the two are combined, the first terminal group is electrically connected to the first pad group, and the second terminal group and the second pad group form an interface connected to an external electronic device. Accordingly, with the memory elements and assembly parts stacked on each other, and the corresponding relationship between the terminal group and the pad group, the volume and occupied space of the combined memory device can be further reduced. Furthermore, the storage element is combined with the assembly in a detachable manner, so users can properly replace and repair the two according to their needs, without being limited to the existing fixing methods such as welding, etc., so, The application range and convenience of the storage device can be further improved.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

Description of drawings

FIG. 1 is a schematic diagram of a storage device according to an exemplary embodiment of the present invention;

FIG. 2 and FIG. 3 respectively illustrate some components of the storage device in FIG. 1 from different perspectives;

Fig. 4 is an exploded view of the storage device of Fig. 1;

FIG. 5 is a flow chart of manufacturing a storage device according to an exemplary embodiment of the present invention;

FIG. 6 is an exploded view of a storage device according to another exemplary embodiment of the present invention;

Fig. 7 is a schematic diagram after combining some components of Fig. 6;

FIG. 8 is a combined schematic diagram of the storage device of FIG. 6;

FIG. 9 is a cross-sectional view of the memory device of FIG. 8 .

Symbol Description

100, 200: storage device

110: storage element

112: Ontology

114: The first pad group

116: Second pad group

118: The third pad group

120, 220: assembly parts

121, 221: transfer part

121a: groove

121b: guide part

122: The first terminal group

123, 223: carrying part

124: Second terminal group

125: first stopper

127: Sealing Department

128: second stopper

130, 230: shell

131: tongue

132, 232: first opening

134, 234: second opening

231: Convex Hull Structure

235: The third stop

E1, E4: first end

E2, E5: the second end

E3, E6: side opening

L1, L2, L3, L4: paths

R1: storage space

S1: first surface

S2: second surface

detailed description

FIG. 1 is a schematic diagram of a storage device according to an exemplary embodiment of the present invention. FIG. 2 and FIG. 3 respectively illustrate some components of the storage device in FIG. 1 from different perspectives. FIG. 4 is an exploded view of the storage device of FIG. 1 . Please refer to FIG. 1 to FIG. 4 at the same time. In this exemplary embodiment, the storage device 100, such as a flash drive, includes a storage element 110, an assembly 120 and a housing 130, wherein the storage element 110 is detachably assembled to the assembly. 120 , while the casing 130 is sleeved on the fitting 120 and accommodates the storage element 110 therein. In order to facilitate the description of related components, a rectangular coordinate system will be introduced in the following exemplary embodiments and drawings, and the storage device 100 is located on the X-Y plane as a reference for subsequent descriptions.

In this exemplary embodiment, the memory element 110 has a body 112 and a first pad set 114 and a second pad set 116 exposed on opposite sides of the body 112 . Here, the storage element 110 is, for example, a system-in-package (SiP) technology that uses different types of electronic components such as storage units (such as flash memories, etc.), control circuits, etc., through plastic, metal, ceramic materials or epoxy resin. It constitutes a package mode for system integration to protect the electronic components within the package structure. The first pad group 114 and the second pad group 116 serve as the connection interface for the storage element 110 to be electrically connected to the outside world, wherein the second pad group 116 conforms to the Universal Serial Bus 2.0 (Universal Serial Bus 2.0, USB 2.0) specification connection interface.

The assembly 120 has a first terminal group 122 and a second terminal group 124 electrically connected to each other, and further, the assembly 120 is a U-shaped structure, which has a first end E1 and a second end E2, as shown in FIG. 4 The assembly part 120 is in an open state at the first end E1, which is suitable as an access for disassembling the storage element 110, and is in a closed state at the second end E2. In this exemplary embodiment, the assembly part 120 also has an adapter part 121 and a bearing part 123, which are respectively located on opposite sides of the U-shaped structure, and the adapter part 121 and the bearing part 123 are up and down along the Z axis. configuration (wherein the bearing part 123 can be regarded as being located on the X-Y plane). In addition, the first terminal group 122 and the second terminal group 124 are arranged on the transfer portion 121 and connected to each other in a one-to-one correspondence, wherein the terminals of the first terminal group 122 and the second terminal group 124 are connected to each other as a whole structure, and are molded in the transfer portion 121 through an in-mold injection manufacturing process and have structural features extending away from each other. In other words, the transfer part 121 and the bearing part 123 of the assembly part 120 are a U-shaped structure manufactured by integral molding technology, and the first terminal group 122 and the second terminal group 124 are molded on the transfer part 121 During the process, it is embedded inside and becomes a part of the structure of the assembly part 120 .

In this exemplary embodiment, the fitting 120 also has a first stopper portion 125 and a sealing portion 127, wherein the sealing portion 127 is located at the second end E2 of the U-shaped structure and adjacent to the transfer portion 121 and the bearing portion 123, and the first The stop portion 125 is located at the first end E1 of the U-shaped structure and connected to the bearing portion 123 . Correspondingly, the housing 130 has a first opening 132 and a second opening 134 opposite to each other, and the first opening 132 abuts with the fitting 120 , and the sealing portion 127 closes the first opening 132 .

Please refer to FIG. 2 to FIG. 4 again. When the storage element 110 is assembled in the assembly 120, the opposite surfaces S1 and S2 of the body 112 of the storage element 110 abut against the carrying portion 123 and the transfer portion 121 respectively, that is, the body 112. The first surface S1 is carried on the bearing part 123 , and the transfer part 121 abuts against the second surface S2 of the body 112 , so that the storage element 110 is clamped in the U-shaped structure. Simultaneously, the first stop portion 125 erected on the carrying portion 123 also abuts against the front edge of the storage element 110, while the rear edge of the storage element 110 also abuts against the second stop portion 128 of the U-shaped structure (in Here, the front and rear edges of the storage element 110 refer to the extension along the Y axis). Accordingly, in addition to clamping the storage element 110 up and down along the Z axis with the transfer portion 121 and the bearing portion 123, the assembly 120 also utilizes the first stopper portion 125 and the second stopper portion 128 to provide the storage element along the Y axis. 110 positioning and fixed effects.

Moreover, when the housing 130 and the assembly part 120 are docked with each other, the housing 130 will also abut against the transfer part 121 and the carrying part 123 of the assembly part 120, so as to improve the Z-axis of the transfer part 121 and the carrying part 123. The clamping and fixing effect of the axis on the storage element 110 , meanwhile, the housing 130 also provides a clamping force along the X-axis direction on the storage element 110 and the fitting 120 .

On the other hand, the shell 130 also has a tongue 131, which is, for example, stamped on the surface of the shell 130 to form an elastic protruding structure extending toward the inside of the shell 130, and the transition part 121 of the assembly part 120 also has a concave The groove 121 a and the guide portion 121 b correspond to the tongue 131 . Therefore, when the assembly part 120 and the housing 130 are assembled together, the tongue 131 will first follow the guide portion 121b and be bent by being pressed by it, and then be correspondingly locked in the groove 121a due to its elastic restoring force. , used to make the fitting 120 firmly fastened to the housing 130 and avoid falling off.

Accordingly, the main body 112 of the storage element 110 is carried on the carrying portion 123 , which means that the storage element 110 abuts against one side of the U-shaped structure. Furthermore, the memory element 110 only abuts against a part of the transfer portion 121, thereby forming an accommodating space R1 therebetween, and the above-mentioned first terminal group 122 and the first pad group 114 are electrically connected to each other. It is accommodated in the space R1. Here, the first terminal group 122 is an elastic structure, for example, it is formed by bending a metal piece, of course, it can also be formed from an object having both conductivity and elasticity adopted in the prior art, so that the first terminal group When contacting the first pad set 114 , 122 can effectively absorb the amount of interference between the two objects due to its elasticity, so as to avoid damage to both objects.

In addition, the second terminal set 124 extending away from the first terminal set 122 is located outside the accommodating space R1 , and further forms a connection interface with the second pad set 116 also outside the accommodating space R1 . This connection interface becomes the connection interface for the storage device 100 to be electrically connected to an external device (not shown), and in this exemplary embodiment, the second terminal group 124 and the second pad group 116 are formed to conform to a general serial The connection interface of the bus 3.0 (Universal Serial Bus 3.0, USB 3.0) specification.

Based on the above, the storage element 110 of this exemplary embodiment is detachably assembled on the assembly part 120, so that the assembly part 120 and the storage element 110 to form an electrical connection, so that the second terminal group 124 and the second pad group 116 of the storage element 110 form a connection interface for connecting the storage device 100 to the outside. This not only effectively reduces the volume of the storage device 100 with a simple stacking structure, but also enables the relevant terminal groups and pad groups to be positioned smoothly through the aforementioned combination structure, and the detachable structure also allows storage The device 100 has better applicability, that is, the user can conveniently replace or repair the assembly part 120 or the storage element 110 according to needs, so as to meet various needs.

In addition, the storage element 110 also has a third pad group 118 disposed on the second surface S2 and located between the first pad group 114 and the second pad group 116 , and the pads in the third pad group 118 The arrangement direction is parallel to the arrangement direction of the pads in the first pad group 114 . The third pad group 118 and the second terminal group 124 are arranged in a one-to-one arrangement with each other, and a gap is maintained between the corresponding pads and terminals. In this exemplary embodiment, the third pad group 118 is a dummy pad group, which is not electrically connected to the internal electronic components of the storage element 110 . Accordingly, when the storage device 100 is docked with other electronic devices, the second terminal group 124 will be bent due to pressure and abut against the second surface S2. The abutting bearing structure can thus prevent the second terminal group 124 from directly abutting against the second surface S2 to damage the body of the memory element 100 at the second surface S2 , and even the electronic components therein. However, in another exemplary embodiment of the present invention, the third pad set 118 may also be electrically connected to the first pad set 114 , in other words, when the second terminal set 124 directly abuts against the third pad set 118 It can also form a connection interface conforming to the Universal Serial Bus 3.0 (Universal Serial Bus 3.0, USB 3.0) specification with the second pad group 116, which can further prevent the aging of the first terminal group 122 and cause contact with the first pad group 114. The problem of a poor electrical connection that loses its function.

FIG. 5 is a flow chart of manufacturing a storage device according to an exemplary embodiment of the present invention. Please refer to FIG. 4 and FIG. 5 at the same time. In this exemplary embodiment, the structural features of the storage device 100 are as described above. Accordingly, in step S510, firstly, the assembly part 120 is produced by integral molding technology to form the above-mentioned transfer part 121, bearing part 123, and the first terminal group 122 and the second terminal group fitted in the transfer part 123. 124. Next, in step S520, the memory element 110 is assembled in the assembly 120, so that the first terminal group 122 and the second terminal group 124 are located on the body 112 of the memory element 110, wherein the first terminal group 122 abuts against the first on the pad set 114, and the second terminal set 124 is located between the first pad set 114 and the second pad set 116, and the second terminal set 124 and the second pad set 116 form the memory device 100 for communicating with the outside The connection interface to which the device is electrically connected. Next, in step S520 , the casing 130 is further sleeved on the fitting 120 to receive the storage element 110 therein, wherein the sealing portion 127 of the fitting 120 abuts and seals the first opening 132 of the casing 130 .

Furthermore, in the assembly part 120 of this exemplary embodiment, the orthographic projection area of the transfer part 121 on the body 112 of the storage element 110 is smaller than the orthographic projection area of the bearing part 123 of the assembly part 120 on the body 112, and also That is, as shown in FIG. 4 , the orthographic projection of the adapter portion 121 on the X-Y plane is smaller than the orthographic projection of the bearing portion 123 on the X-Y plane, so that the assembly 120 presents a structural feature that the bearing portion 123 is larger than the adapter portion 121 .

Furthermore, due to the structure of the first stopper 125 erected on the carrying portion 123, the storage element 110 must be assembled into the U-shaped structure along the path L1, that is, one end of the storage element 110 needs to be removed from the carrying portion 123 first. The top of the U-shaped structure is moved obliquely (that is, the memory element 110 is located above the X-Y plane and forms an angle with respect to the X-Y plane) into the first end E1 of the U-shaped structure, and then the end of the memory element 110 is moved from the first end E1 moves horizontally towards the second end E2 (ie parallel to the X-Y plane) to assemble into the U-shaped structure.

In another non-illustrated exemplary embodiment, due to the material properties of the bearing part and its thinner thickness, it is flexible, so the bearing part can be bent downwards relative to the X-Y plane during the assembly process (in order to 4), so that the storage element is assembled into the assembly along the Y axis and parallel to the X-Y plane.

In addition, the storage element 110 can also move along the path L2 or the path L3, that is, from the lateral opening E3 between the first end E1 and the second end E2 (that is, the storage element 110 can be moved along the X axis, only shown here One of the sides is open) and horizontally moved into the U-shaped structure relative to the X-Y plane, which can also achieve the assembly effect.

On the other hand, in another non-illustrated exemplary embodiment of the present invention, the above-mentioned first stopper structure does not exist in the assembly, so the storage element can be directly positioned horizontally along the Y-axis (that is, parallel to the X-Y plane). Move into a U-shaped structure.

FIG. 6 is an exploded view of a storage device according to another exemplary embodiment of the present invention. FIG. 7 is a schematic view of some components in FIG. 6 combined. Please refer to FIG. 6 and FIG. 7 at the same time. What is different from the above-mentioned exemplary embodiment is that in the storage device 200 of this exemplary embodiment, the orthographic projection area of the transfer portion 221 of the assembly part 220 on the body 112 of the storage element 110 is larger than that of the storage device 200. The orthographic projection area of the carrying portion 223 of the accessory 220 on the main body 112 , that is, the asymmetrical U-shaped structural feature that the connecting portion 221 is larger than the carrying portion 223 as shown in the drawings. Accordingly, the memory element 110 only needs to be assembled into the assembly part 220 along the path L4 , that is, to be assembled with the assembly part 220 horizontally along the Y axis along the parallel X-Y plane.

Certainly, similar to the foregoing exemplary embodiments, the storage element 110 of this exemplary embodiment can also be assembled into the fitting 220 along the lateral opening E6 between the first end E4 and the second end E5. It should be noted here that when the storage element 110 is assembled into the U-shaped structure of the assembly part 220, it is the same as the previous exemplary embodiment, the storage element 110 abuts against the bearing part 223 with its first surface S1, and the transfer part 221 abuts against the second surface S2 of the storage element 110 .

In addition, the housing 230 of this exemplary embodiment has a third stopper 235 located at the second opening 234 thereof, which is formed by partially bending the bottom of the housing 230 (as shown in FIG. 6 ). When the assembly part 220 and the storage element 110 assembled thereon are inserted into the housing 230 through the first opening 232, the storage element 110 will move along the Y-axis until it abuts against the third stopper 235, so that the storage element 110 is The Y-axis is clamped and fixed by the third stop portion 235 of the housing 230 and the assembly part 220 at the same time.

FIG. 8 is a combined schematic view of the storage device in FIG. 6 , where the bottom of the housing 230 in FIG. 6 is shown in FIG. 8 to clearly describe the structural features of the housing 230 at the bottom. FIG. 9 is a cross-sectional view of the memory device of FIG. 8 . Please refer to FIG. 8 and FIG. 9 at the same time. In this exemplary embodiment, the casing 230 also has a convex structure 231 at the bottom. As shown in FIG. 9 , since the area of the orthographic projection of the carrying portion 223 on the body 112 of the storage element 110 of this exemplary embodiment is smaller than that of the transfer portion 221 , the storage element 110 can be supported by the convex structure 231 of the housing 230 The part not supported by the bearing part 223 , that is, the convex structure 231 and the bearing part 223 support the same side of the storage element at the same time, so that the storage element 110 can obtain sufficient support and clamping effect from the housing 230 .

To sum up, in the above exemplary embodiments of the present invention, the storage device is simply constituted by the storage element and the assembly, and the first terminal group and the second terminal group electrically connected to each other on the assembly are matched with the memory element. The first pad group and the second pad group, so that the first pad group can use the second terminal group as part of its output terminals through the mutual electrical connection relationship with the first terminal group, so that the second The pad set and the second terminal set form a connection interface for the memory device to be electrically connected to an external device. This can not only effectively reduce the volume of the storage device, but also allow users to replace the assembly or storage element according to their needs through the detachable combination of the assembly and the storage element, thereby improving the storage device. applicability and convenience.

Although the present invention has been disclosed in conjunction with the above embodiments, it is not intended to limit the present invention. Those skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims (19)

1. a kind of storage device, including：

Memory element, the first connection pad group and the second connection pad group with body with the opposite sides for exposing to the body；And

Assembly parts, with the first end subgroup being electrically connected to each other and Second terminal group, the memory element is removably assembled in this Assembly parts, wherein the first end subgroup are electrically connected with the first connection pad group, and the Second terminal group is located at the first connection pad group and is somebody's turn to do Between second connection pad group, and the Second terminal group forms the storage device to electrically connect with external device (ED) with the second connection pad group Linkage interface,

Wherein the assembly parts are a U-shaped structure, and the assembly parts have switching part and the carrying positioned at the U-shaped structure opposite side Portion, the body is located between the switching part and the supporting part so that the memory element is configured in the U-shaped structure, and this One terminal group is formed in the switching part and is connected to each other with the Second terminal group, and the switching part of the wherein assembly parts is deposited with this Storage element forms an accommodation space, and the first end subgroup being electrically connected to each other is located in the accommodation space with the first connection pad group, And the Second terminal group is located at outside the accommodation space with the second connection pad group.

2. storage device as claimed in claim 1, the wherein memory element also have the 3rd connection pad group, positioned at first connection pad Between group and the second connection pad group.

3. storage device as claimed in claim 2, wherein the 3rd connection pad group is electrically connected with the first connection pad group.

4. storage device as claimed in claim 1, wherein frontal projected area of the switching part on the body is less than the carrying Frontal projected area of the portion on the body.

5. storage device as claimed in claim 4, the wherein assembly parts also have the first stopper section, be arranged at the supporting part and Positioned at the first end of the U-shaped structure, the memory element is carried on the supporting part and is connected to first stopper section.

6. storage device as claimed in claim 1, wherein frontal projected area of the switching part on the body is more than the carrying Frontal projected area of the portion on the body.

7. storage device as claimed in claim 6, also includes：

Housing, is socketed the assembly parts and is connected to the switching part and the supporting part, and the memory element is contained in the housing, its In the housing there is convex closure structure and relative first opening and the second opening, and the assembly parts also have sealing, positioned at the U Second end of shape structure and adjoin the switching part and the supporting part, the assembly parts and assembling memory element therein from this first Opening is assembled to the housing, makes the both seals first openings, and the supporting part and the convex closure structure are supported in storage unit The same side of part.

8. storage device as claimed in claim 7, the wherein housing also have the 3rd stopper section, positioned at second opening, should Memory element is as the assembly parts are assembled into the housing and are connected to the 3rd stopper section.

9. storage device as claimed in claim 1, also includes：

Housing, is socketed the assembly parts and is connected to the switching part and the supporting part, and the memory element is contained in the housing.

10. storage device as claimed in claim 9, the wherein housing have the first relative opening and the second opening, and are somebody's turn to do Assembly parts also have a sealing, positioned at the second end of the U-shaped structure and adjoin the switching part and the supporting part, the assembly parts with The assembling memory element therein is assembled to the housing from first opening, and makes the both seals first openings.

11. storage devices as claimed in claim 1, wherein the second connection pad group meet the specification of USB 2.0 Linkage interface.

12. storage devices as claimed in claim 1, wherein the Second terminal group are formed with the second connection pad group and meet general string The linkage interface of the specification of row bus 3.0.

13. storage devices as claimed in claim 1, wherein the first end subgroup are elastic construction.

A kind of 14. preparation methods of storage device as claimed in claim 1, including：

The memory element is assembled in the assembly parts, the wherein first end subgroup is electrically connected with the first connection pad group, the Second terminal Group is located between the first connection pad group and the second connection pad group, and the Second terminal group forms the storage dress with the second connection pad group The linkage interface to electrically connect with external device (ED) is put, wherein the assembly parts have the switching part, being formed with the memory element should Accommodation space, first end subgroup being electrically connected to each other is located in the accommodation space with the first connection pad group, and the Second terminal Group is located at outside the accommodation space with the second connection pad group；And

A housing is socketed in the assembly parts, the memory element is accommodated wherein.

The preparation method of 15. storage devices as claimed in claim 14, the wherein assembly parts have the second end and first end, should The preparation method of storage device also includes：

The memory element is assembled into the U-shaped structure from the first end towards second end, so that the body is configured in the switching Between portion and the supporting part.

The preparation method of 16. storage devices as claimed in claim 14, the wherein assembly parts have the second end and first end, should The preparation method of storage device also includes：

The memory element is assembled into the U-shaped structure from the lateral openings between second end and the first end, so that the body It is configured between the switching part and the supporting part.

The preparation method of 17. storage devices as claimed in claim 14, the wherein housing have relative first opening and the Two openings, the assembly parts have the second end and first end, and the assembly parts have the sealing positioned at second end, the sealing Portion adjoins the switching part and the supporting part, and the preparation method of the storage device also includes：

Along first opening assembly parts are socketed to the housing, and with the both seals first opening.

The preparation method of 18. storage devices as claimed in claim 17, the wherein housing also have at second opening The 3rd stopper section, the preparation method of the storage device also includes：

The memory element is moved in the housing and abutted to the 3rd stopper section from first opening towards second opening.

The preparation method of 19. storage devices as claimed in claim 14, also includes：

The memory element is being assembled before the assembly parts, with integral molding techniques the assembly parts are being produced.