CN104280834A - Optical communication device - Google Patents

Abstract

The invention relates to an optical communication device. The optical communication device comprises a connector, a first substrate, a first driver chip, a light-emitting element, a second driver chip, a light receiving element, a coupling lens set and an optical waveguide. The first substrate is borne by the connector and electrically connected with the connector. The first substrate comprises a bottom face arranged opposite to the first substrate and a bearing face far away from the bottom face. The light-emitting element and the light receiving element are contained in the first substrate. The first driver chip is borne by the bearing face and eclectically connected with the first substrate and the light-emitting element. The second driver chip is borne by the bearing face and eclectically connected with the first substrate and the light receiving element. The coupling lens set is connected to the first driver chip and the second driver chip in a pluggable and bridging mode, and the optical waveguide is arranged on the coupling lens set in a pluggable mode.

Description

optical communication device

technical field

The invention relates to a communication device, in particular to an optical communication device.

Background technique

In optical communication devices, information is transmitted in the form of optical signals, and calculated and processed in the form of electrical signals. Existing optical communication devices generally include a circuit board, a photoelectric element that converts optical signals into electrical signals or converts electrical signals into optical signals, a driver chip for driving the photoelectric element, and an optical fiber for transmitting optical signals. and a coupling lens for optically coupling the photoelectric element and the optical fiber. In existing optical communication devices, UV glue is used to fix the coupling lens on the circuit board, and UV glue is also used to fix the optical fiber to the coupling lens, which makes disassembly and assembly difficult.

Contents of the invention

In view of this, it is necessary to provide an optical communication device that is easy to disassemble and assemble.

An optical communication device includes a connector, a first substrate, a first driving chip, a light emitting element, a second driving chip, a light receiving element, a coupling lens group and an optical waveguide. The first substrate is carried on the connector and electrically connected with the connector. The first substrate includes a bottom surface opposite to the first substrate, and a carrying surface away from the bottom surface. Both the light-emitting element and the light-receiving element are housed in the first substrate. The first driving chip is carried on the carrying surface and is electrically connected to the first substrate and the light emitting element. The second driving chip is carried on the carrying surface and is electrically connected to the first substrate and the light receiving element. The coupling lens group is pluggably connected across the first driving chip and the second driving chip, and the optical waveguide is pluggably arranged in the coupling lens group.

Compared with the prior art, the coupling lens group is pluggably connected across the first driver chip and the second driver chip, and the optical waveguide is pluggably arranged on the coupling lens group, which is convenient for disassembly. solution and assembly.

Description of drawings

FIG. 1 is a schematic diagram of an optical communication device according to an embodiment of the present invention.

Description of main component symbols

Optical communication device 100

connector 10

First Substrate 20

The first driver chip 30

Light emitting element 40

The second driver chip 45

Light receiving element 50

Second Substrate 60

Coupling lens group 70

Transparent support frame 80

Optical waveguide 90

connection surface 11

First pad 111

Bottom 21

Bearing surface 22

Second pad 210

First Bump 112

Containment Tank 220

Second pad 222

Third pad 223

first surface 31

second surface 32

Fourth pad 311

Fifth pad 312

Second solder ball 313

First positioning hole 320

Shiny side 41

First Concentrator 42

Sixth pad 411

Seventh pad 412

Third Bump 314

Second positioning hole 4520

third surface 451

Fourth surface 452

Eighth pad 453

Ninth pad 454

Fourth Bump 4530

Shiny side 51

Second Concentrator 52

Tenth pad 511

Eleventh pad 512

Fifth Bump 513

Lower face 61

Upper face 62

Twelfth welding pad 612

The thirteenth welding pad 613

Sixth Bump 614

Seventh Bump 615

First light hole 55

Second light hole 65

lower surface 71

upper surface 72

First positioning post 710

Coupling lens 711

The third positioning hole 720

Fifth Surface 81

Sixth Surface 82

Second positioning post 810

The fourth positioning hole 820

Light guide 91

Fixed part 92

The third positioning column 920

The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

Detailed ways

The present invention will be described in detail below in conjunction with the accompanying drawings.

As shown in FIG. 1 , an optical communication device 100 provided in an embodiment of the present invention includes a connector 10 , a first substrate 20 , a first driver chip 30 , a light emitting element 40 , and a second driver chip 45 , a light receiving element 50 , a second substrate 60 , a coupling lens group 70 , a transparent support frame 80 , and an optical waveguide 90 .

The connector 10 includes a connecting surface 11 . The connection surface 11 is provided with a plurality of first pads 111 .

The first substrate 20 is carried on the connection surface 11 and electrically connected with the connector 10 . Specifically, the first substrate 20 includes a bottom surface 21 opposite to the connection surface 11 and a bearing surface 22 facing away from the bottom surface 21 . The bottom surface 21 is provided with a plurality of second welding pads 210 corresponding to the plurality of first welding pads 111 . There is a one-to-one correspondence between the plurality of second welding pads 210 and the plurality of first welding pads 111 . The plurality of second solder pads 210 are electrically connected to the plurality of first solder pads 111 through a plurality of first solder balls 112 . A receiving groove 220 is defined on the bearing surface 22 of the first substrate 20 . The bearing surface 22 is provided with a second welding pad 222 and a third welding pad 223 . The second welding pad 222 and the third welding pad 223 are distributed on two sides of the receiving groove 220 .

The first driver chip 30 is carried on the carrying surface 22 and electrically connected to the first substrate 20 . Specifically, the first driving chip 30 includes a first surface 31 opposite to the carrying surface 22 and a second surface 32 away from the first surface 31 . A fourth welding pad 311 and a fifth welding pad 312 are disposed on the first surface 31 . The fourth solder pad 311 is electrically connected to the second solder pad 222 through a second solder ball 313 . The first driving chip 30 is supported on the carrying surface 22 through the second solder balls 313 . A first positioning hole 320 is defined on the second surface 32 .

The light emitting element 40 includes a light emitting surface 41 on which a hemispherical first light collecting portion 42 is formed. The first light collecting part 42 is formed by dropping colloid on the light emitting surface 41 . In other implementations, the first light concentrating portion 42 can also be obtained by molding, and then bonded to the light emitting surface 41 . A sixth welding pad 411 and a seventh welding pad 412 are disposed on the light emitting surface 41 . The sixth welding pad 411 and the seventh welding pad 412 are disposed around the first light collecting portion 42 . The light emitting element 40 is a laser diode (laser diode, LD). The light emitting element 40 is accommodated in the receiving groove 220 , and the sixth pad 411 is electrically connected to the fifth pad 312 of the first driving chip 30 through a third solder ball 314 . A second positioning hole 4520 is defined on the fourth surface 452 .

The second driver chip 45 is carried on the carrying surface 22 and electrically connected to the first substrate 20 . Specifically, the second driving chip 45 includes a third surface 451 opposite to the carrying surface 22 and a fourth surface 452 away from the third surface 451 . An eighth welding pad 453 and a ninth welding pad 454 are disposed on the third surface 451 . The eighth soldering pad 453 is electrically connected to the third soldering pad 223 of the first substrate 20 through a fourth soldering ball 4530 . The second driving chip 45 is supported on the carrying surface 22 through the fourth solder balls 4530 at the same time.

The light receiving element 50 includes a light receiving surface 51 on which a hemispherical second light collecting portion 52 is formed. The second light collecting portion 52 is formed by dropping colloid on the light receiving surface 51 . In other embodiments, the second light collecting portion 52 can also be obtained by molding, and then bonded to the light receiving surface 51 . A tenth welding pad 511 and an eleventh welding pad 512 are disposed on the light receiving surface 51 . The tenth welding pad 511 and the eleventh welding pad 512 are disposed around the second light collecting portion 52 . The light receiving element 50 is a photodiode (photo diode, PD). The light receiving element 50 is also accommodated in the receiving groove 220 , and the tenth solder pad 511 is electrically connected to the ninth solder pad 454 of the second driving chip 45 through a fifth solder ball 513 .

Both the light-emitting element 40 and the light-receiving element 50 are accommodated in the receiving groove 220 , which can reduce the overall volume of the optical communication device 100 .

The second substrate 60 is disposed between the first driving chip 30 and the second driving chip 45 . The second substrate 60 includes a lower end surface 61 opposite to the light emitting element 40 and the light receiving element 50 and an upper end surface 62 away from the lower end surface 61 . A twelfth welding pad 612 and a thirteenth welding pad 613 are disposed on the lower end surface 61 . The twelfth welding pad 612 is electrically connected to the seventh welding pad 412 of the light emitting element 40 through a sixth welding ball 614 . The thirteenth welding pad 613 is electrically connected to the eleventh welding pad 512 of the light receiving element 50 through a seventh welding ball 615 .

The second substrate 60 is spaced apart from the first driver chip 30 and the second driver chip 45 . Therefore, a first light through hole 55 is formed between the second substrate 60 and the first driving chip 30 , and the first light through hole 55 is opposite to the first light collecting portion 42 . A second light through hole 65 is formed between the second substrate 60 and the second driver chip 45 , and the second light through hole 65 is opposite to the second light collecting portion 52 .

The coupling lens group 70 is straddled between the first driving chip 30 and the second driving chip 45 . Specifically, the coupling lens group 70 includes a lower surface 71 opposite to the first driver chip 30 and the second driver chip 45 , and an upper surface 72 away from the lower surface 71 . The upper surface 72 is opposite to the transparent support frame 80 . Two first positioning columns 710 extend vertically from the lower surface 71 corresponding to the position of the first positioning hole 320 of the first driving chip 30 and the position of the second positioning hole 4520 of the second driving chip 45 . The two first positioning posts 710 are respectively inserted into the first positioning hole 320 and the second positioning hole 4520, so that the coupling lens group 70 is pluggably disposed on the first driving chip 30 and the second positioning hole 4520. between the second driver chips 45 . In this embodiment, the two first positioning posts 710 are respectively fixed in the first positioning hole 320 and the second positioning hole 4520 by way of interference fit. The lower surface 71 is also formed with two coupling lenses 711 . Among the two coupling lenses 711 , one of the coupling lenses 711 is opposite to both the first light through hole 55 and the first light collecting portion 42 . Wherein the other coupling lens 711 is opposite to the second light through hole 65 and the second light collecting portion 52 . The upper surface 72 defines two third positioning holes 720 .

The transparent support frame 80 is made of transparent glass or transparent rubber. In this embodiment, the transparent support frame 80 is made of glass. The transparent support frame 80 is pluggably disposed on the coupling lens group 70 . Specifically, the transparent support frame 80 includes a fifth surface 81 opposite to the coupling lens group 70 and the upper end surface 62 , and a sixth surface 82 away from the fifth surface 81 . The sixth surface 82 is opposite to the optical waveguide 90 . Two second positioning posts 810 are vertically extended on the fifth surface 81 corresponding to the positions of the two third positioning holes 720 of the coupling lens group 70 . The two second positioning posts 810 are respectively inserted into the two third positioning holes 720 , so that the transparent support frame 80 is pluggably disposed on the upper surface 72 of the coupling lens group 70 . In this embodiment, the two second positioning posts 810 are respectively fixed in the two third positioning holes 720 by way of interference fit. The sixth surface 82 defines two fourth positioning holes 820 .

The optical waveguide 90 includes a light guiding portion 91 and a fixing portion 92 surrounding the light guiding portion 91 . The fixing portion 92 is detachably disposed on the transparent support frame 80 . Specifically, the fixing portion 92 is provided with two third positioning posts 920 corresponding to the two fourth positioning holes 820 of the transparent support frame 80 . The two third positioning posts 920 are respectively inserted into the two fourth positioning holes 820 , so that the optical waveguide 90 is pluggably disposed on the transparent support frame 80 . In this embodiment, the two third positioning posts 920 are respectively fixed in the two fourth positioning holes 820 through interference fit.

In use, the first driving chip 30 sends a driving signal, and the light emitting element 40 emits light after receiving the driving signal. The light emitted by the light-emitting element 40 is converged by the first light-collecting portion 42 , passes through the first light-passing hole 55 , is irradiated to the coupling lens 711 , and then passes through the transparent support frame 80 into the The light guide portion 91 of the optical waveguide 90 . The process of receiving light signals by the light receiving element 50 is opposite to that of the light emitting element 40 .

In other embodiments, the first light collecting part 42 and the second light collecting part 52 may not be provided.

In other implementation manners, the transparent support frame 80 may not be provided, and the optical waveguide 90 is directly positioned on the upper surface 72 of the coupling lens group 70 .

In other implementation manners, the coupling lens group 70 can also be connected across the first driving chip 30 and the second driving chip 45 in a pluggable manner by buckling or other means.

In other implementation manners, the transparent support frame 80 can be pluggably arranged on the coupling lens group 70 by other means such as buckle.

In other implementation manners, the optical waveguide 90 can be pluggably arranged on the transparent support frame 80 by other means such as buckle.

The coupling lens group 70 is pluggably connected across the first driver chip 30 and the second driver chip 45, and the optical waveguide 90 is pluggably arranged on the coupling lens group 70 for easy disassembly. and assembly.

It can be understood that those skilled in the art can make various other corresponding changes and modifications according to the technical concept of the present invention, and all these changes and modifications should belong to the protection scope of the claims of the present invention.

Claims (10)

1. an optical communication device, comprise a connector, one first substrate, one first driving chip, one light-emitting component, one second driving chip, one receives optical element, one coupled lens group and an optical waveguide, described first substrate is carried on described connector and is electrically connected with described connector, described first substrate comprises a bottom surface be oppositely arranged with described first substrate, and the loading end that deviates from described bottom surface, described light-emitting component and described receipts optical element are all contained in described first substrate, described first driving chip is carried on described loading end, and be all electrically connected with described first substrate and described light-emitting component, described second driving chip is carried on described loading end, and be all electrically connected with described first substrate and described receipts optical element, described coupled lens group is connected across described first driving chip and described second driving chip pluggablely, described optical waveguide is arranged at described coupled lens group pluggablely.

2. optical communication device as claimed in claim 1, it is characterized in that: described connector comprises a joint face, described first substrate is carried on described joint face, described joint face is provided with multiple first weld pad, corresponding multiple described first weld pad in described bottom surface of described first substrate is provided with multiple second weld pad, one_to_one corresponding between multiple described second weld pad and multiple described first weld pad, is electrically connected by multiple first soldered ball between multiple described second weld pad and multiple described first weld pad.

3. optical communication device as claimed in claim 1, it is characterized in that: the loading end of described first substrate offers an accepting groove, described light-emitting component and described receipts optical element are all contained in described accepting groove.

4. optical communication device as claimed in claim 1, it is characterized in that: described loading end is provided with one second weld pad and one the 3rd weld pad, described first driving chip comprises a first surface be oppositely arranged with described loading end, described first surface is provided with one the 4th weld pad and one the 5th weld pad, be electrically connected by one second soldered ball between described 4th weld pad and described second weld pad, described light-emitting component comprises a light-emitting area, described light-emitting area is provided with one the 6th weld pad and one the 7th weld pad, described 6th weld pad is electrically connected by the 5th weld pad of one the 3rd soldered ball and described first driving chip, described second driving chip comprises the 3rd surface be oppositely arranged with described loading end, described 3rd is provided with one the 8th weld pad and one the 9th weld pad on the surface, be electrically connected by one the 4th soldered ball between described 8th weld pad and the 3rd weld pad of described first substrate, described receipts optical element comprises a light-emitting area, described receipts light face is provided with 1 the tenth weld pad and 1 the 11 weld pad, described tenth weld pad is electrically connected by the 9th weld pad of one the 5th soldered ball and described second driving chip, described optical communication device comprises a second substrate further, described second substrate is arranged between described first driving chip and described second driving chip, described second substrate comprises a lower surface be all oppositely arranged with described light-emitting component and described receipts optical element, described lower surface is provided with 1 the 12 weld pad and 1 the 13 weld pad, described 12 weld pad is electrically connected by described 7th weld pad of one the 6th soldered ball and described light-emitting component, described 13 weld pad is electrically connected by described 11 weld pad of one the 7th soldered ball and described receipts optical element.

5. optical communication device as claimed in claim 1, it is characterized in that: described first driving chip comprises one away from the second surface of described loading end, described second driving chip comprises the 4th surface away from described loading end, described second surface offers one first pilot hole, described 4th offers one second pilot hole on the surface, described coupled lens group comprises a lower surface be all oppositely arranged with described first driving chip and described second driving chip, first position of positioning hole of corresponding described first driving chip of described lower surface, and the second position of positioning hole of described second driving chip is extended with two the first reference columns, described two the first reference columns insert in described first pilot hole and described second pilot hole respectively, with make described coupled lens group pluggable be arranged between described first driving chip and described second driving chip.

6. optical communication device as claimed in claim 5, is characterized in that: described two the first reference columns are individually fixed in described first pilot hole and described second pilot hole by the mode of interference fit.

7. optical communication device as claimed in claim 1, it is characterized in that: described coupled lens group comprises a upper surface be oppositely arranged with described transparent support frame, described upper surface offers two the 3rd pilot holes, described transparent support frame comprises the 5th surface be oppositely arranged with described coupled lens group, two the 3rd position of positioning hole of the described 5th corresponding described coupled lens group in surface are extended with two the second reference columns, described two the second reference columns insert in described two the 3rd pilot holes respectively, with make described transparent support frame pluggable be arranged at the described upper surface of described coupled lens group.

8. optical communication device as claimed in claim 1, is characterized in that: described two the second reference columns are individually fixed in described two the 3rd pilot holes by the mode of interference fit.

9. optical communication device as claimed in claim 1, it is characterized in that: described transparent support frame comprises the 6th surface be oppositely arranged with described optical waveguide, described 6th surface offers two the 4th pilot holes, two the 4th position of positioning hole of the corresponding described transparent support frame of described fixed part are provided with two the 3rd reference columns, described two the 3rd reference columns insert in described two the 4th pilot holes respectively, with make described optical waveguide pluggable be arranged at described transparent support frame.

10. optical communication device as claimed in claim 9, is characterized in that: described two the 3rd reference columns are individually fixed in described two the 4th pilot holes by the mode of interference fit.