CN104231619A - Polyamide resin composition and forming body - Google Patents
Polyamide resin composition and forming body Download PDFInfo
- Publication number
- CN104231619A CN104231619A CN201410232707.5A CN201410232707A CN104231619A CN 104231619 A CN104231619 A CN 104231619A CN 201410232707 A CN201410232707 A CN 201410232707A CN 104231619 A CN104231619 A CN 104231619A
- Authority
- CN
- China
- Prior art keywords
- polyamide resin
- resin composition
- polyamide
- ratio
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 173
- 239000011342 resin composition Substances 0.000 title claims abstract description 103
- 239000003365 glass fiber Substances 0.000 claims abstract description 60
- 239000000835 fiber Substances 0.000 claims abstract description 28
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 9
- 125000004433 nitrogen atom Chemical group N* 0.000 claims abstract description 9
- 239000000178 monomer Substances 0.000 claims description 37
- 239000004952 Polyamide Substances 0.000 claims description 35
- 229920002647 polyamide Polymers 0.000 claims description 35
- 239000003795 chemical substances by application Substances 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 14
- 239000006229 carbon black Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 239000000454 talc Substances 0.000 claims description 11
- 235000012222 talc Nutrition 0.000 claims description 11
- 229910052623 talc Inorganic materials 0.000 claims description 11
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 10
- 229910052582 BN Inorganic materials 0.000 claims description 9
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 9
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 7
- 229920000572 Nylon 6/12 Polymers 0.000 claims description 7
- 150000001340 alkali metals Chemical class 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 7
- 239000005995 Aluminium silicate Substances 0.000 claims description 5
- 229910052783 alkali metal Inorganic materials 0.000 claims description 5
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 5
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 5
- 235000012211 aluminium silicate Nutrition 0.000 claims description 5
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 5
- 239000004927 clay Substances 0.000 claims description 5
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 5
- 239000010445 mica Substances 0.000 claims description 5
- 229910052618 mica group Inorganic materials 0.000 claims description 5
- 229920006152 PA1010 Polymers 0.000 claims description 4
- 150000001408 amides Chemical class 0.000 claims description 4
- 229910052570 clay Inorganic materials 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims 4
- 210000004899 c-terminal region Anatomy 0.000 claims 2
- 239000011324 bead Substances 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 239000012765 fibrous filler Substances 0.000 abstract description 33
- 239000002245 particle Substances 0.000 abstract description 25
- 239000004953 Aliphatic polyamide Substances 0.000 abstract description 15
- 229920003231 aliphatic polyamide Polymers 0.000 abstract description 15
- -1 aliphatic diamines Chemical class 0.000 description 35
- 238000000034 method Methods 0.000 description 24
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 24
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 22
- 229920001577 copolymer Polymers 0.000 description 22
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 21
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 16
- 238000004513 sizing Methods 0.000 description 16
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 15
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 15
- 150000001875 compounds Chemical class 0.000 description 15
- 150000001879 copper Chemical class 0.000 description 15
- 239000010949 copper Substances 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 15
- 238000011144 upstream manufacturing Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 235000019241 carbon black Nutrition 0.000 description 11
- 150000004820 halides Chemical class 0.000 description 11
- 229920005749 polyurethane resin Polymers 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000000470 constituent Substances 0.000 description 10
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 10
- 239000008188 pellet Substances 0.000 description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 8
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000002994 raw material Substances 0.000 description 8
- 230000004580 weight loss Effects 0.000 description 8
- 150000004985 diamines Chemical class 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 229910052736 halogen Inorganic materials 0.000 description 7
- 150000002367 halogens Chemical class 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 6
- 239000005977 Ethylene Substances 0.000 description 6
- 229920002302 Nylon 6,6 Polymers 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 230000032683 aging Effects 0.000 description 6
- 229910001615 alkaline earth metal halide Inorganic materials 0.000 description 6
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 6
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 239000006087 Silane Coupling Agent Substances 0.000 description 5
- 229910001508 alkali metal halide Inorganic materials 0.000 description 5
- 239000001110 calcium chloride Substances 0.000 description 5
- 229910001628 calcium chloride Inorganic materials 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 239000012760 heat stabilizer Substances 0.000 description 5
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 5
- 229920001519 homopolymer Polymers 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 238000004898 kneading Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000011164 primary particle Substances 0.000 description 5
- 235000002639 sodium chloride Nutrition 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 4
- 235000010216 calcium carbonate Nutrition 0.000 description 4
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 4
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 4
- ILRSCQWREDREME-UHFFFAOYSA-N dodecanamide Chemical compound CCCCCCCCCCCC(N)=O ILRSCQWREDREME-UHFFFAOYSA-N 0.000 description 4
- 230000007062 hydrolysis Effects 0.000 description 4
- 238000006460 hydrolysis reaction Methods 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 150000003951 lactams Chemical class 0.000 description 4
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 4
- 239000012756 surface treatment agent Substances 0.000 description 4
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 4
- 229920000571 Nylon 11 Polymers 0.000 description 3
- 229920000299 Nylon 12 Polymers 0.000 description 3
- 229920002292 Nylon 6 Polymers 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 150000008045 alkali metal halides Chemical class 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000012770 industrial material Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 3
- 229920006396 polyamide 1012 Polymers 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 3
- 238000003878 thermal aging Methods 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 2
- LNETULKMXZVUST-UHFFFAOYSA-N 1-naphthoic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1 LNETULKMXZVUST-UHFFFAOYSA-N 0.000 description 2
- DCTOHCCUXLBQMS-UHFFFAOYSA-N 1-undecene Chemical compound CCCCCCCCCC=C DCTOHCCUXLBQMS-UHFFFAOYSA-N 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- BDVFBLBNLVKMSH-UHFFFAOYSA-N 2-ethylhexane-1,6-diamine Chemical compound CCC(CN)CCCCN BDVFBLBNLVKMSH-UHFFFAOYSA-N 0.000 description 2
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 2
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 2
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 2
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920001007 Nylon 4 Polymers 0.000 description 2
- 229920003189 Nylon 4,6 Polymers 0.000 description 2
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000002528 anti-freeze Effects 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 235000019445 benzyl alcohol Nutrition 0.000 description 2
- ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical compound Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 description 2
- YEOCHZFPBYUXMC-UHFFFAOYSA-L copper benzoate Chemical compound [Cu+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 YEOCHZFPBYUXMC-UHFFFAOYSA-L 0.000 description 2
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 2
- NKNDPYCGAZPOFS-UHFFFAOYSA-M copper(i) bromide Chemical compound Br[Cu] NKNDPYCGAZPOFS-UHFFFAOYSA-M 0.000 description 2
- 229940045803 cuprous chloride Drugs 0.000 description 2
- YMHQVDAATAEZLO-UHFFFAOYSA-N cyclohexane-1,1-diamine Chemical compound NC1(N)CCCCC1 YMHQVDAATAEZLO-UHFFFAOYSA-N 0.000 description 2
- NZNMSOFKMUBTKW-UHFFFAOYSA-N cyclohexanecarboxylic acid Chemical compound OC(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-N 0.000 description 2
- GHAUROKXNSHBAG-UHFFFAOYSA-N cyclopentane-1,1-diamine Chemical compound NC1(N)CCCC1 GHAUROKXNSHBAG-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 2
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- VAMFXQBUQXONLZ-UHFFFAOYSA-N icos-1-ene Chemical compound CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 description 2
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- ZWLPBLYKEWSWPD-UHFFFAOYSA-N o-toluic acid Chemical compound CC1=CC=CC=C1C(O)=O ZWLPBLYKEWSWPD-UHFFFAOYSA-N 0.000 description 2
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical class S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 2
- 238000004448 titration Methods 0.000 description 2
- SZHOJFHSIKHZHA-UHFFFAOYSA-N tridecanoic acid Chemical compound CCCCCCCCCCCCC(O)=O SZHOJFHSIKHZHA-UHFFFAOYSA-N 0.000 description 2
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 2
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1 -dodecene Natural products CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 1
- NWTHEINZPHPDES-UHFFFAOYSA-N 18-oxahexacyclo[12.9.0.03,12.05,10.016,22.017,19]tricosa-1,3,5,7,9,11,13,15,20,22-decaene Chemical compound C1=CC=C2C=C(C=C3C(C=C4C=CC5OC5C4=C3)=C3)C3=CC2=C1 NWTHEINZPHPDES-UHFFFAOYSA-N 0.000 description 1
- WKRCUUPMCASSBN-UHFFFAOYSA-N 2,2-diethylbutanedioic acid Chemical compound CCC(CC)(C(O)=O)CC(O)=O WKRCUUPMCASSBN-UHFFFAOYSA-N 0.000 description 1
- BTUDGPVTCYNYLK-UHFFFAOYSA-N 2,2-dimethylglutaric acid Chemical compound OC(=O)C(C)(C)CCC(O)=O BTUDGPVTCYNYLK-UHFFFAOYSA-N 0.000 description 1
- VUSYFNXNYLAECV-UHFFFAOYSA-N 2,3-bis(chloromethyl)oxirane Chemical compound ClCC1OC1CCl VUSYFNXNYLAECV-UHFFFAOYSA-N 0.000 description 1
- LIFLRQVHKGGNSG-UHFFFAOYSA-N 2,3-dichlorobuta-1,3-diene Chemical compound ClC(=C)C(Cl)=C LIFLRQVHKGGNSG-UHFFFAOYSA-N 0.000 description 1
- NQFUSWIGRKFAHK-UHFFFAOYSA-N 2,3-epoxypinane Chemical compound CC12OC1CC1C(C)(C)C2C1 NQFUSWIGRKFAHK-UHFFFAOYSA-N 0.000 description 1
- HFUODXIIBUADCY-UHFFFAOYSA-N 2-(1-chloropropan-2-yl)oxirane Chemical compound ClCC(C)C1CO1 HFUODXIIBUADCY-UHFFFAOYSA-N 0.000 description 1
- NKWKILGNDJEIOC-UHFFFAOYSA-N 2-(2-chloroethyl)oxirane Chemical compound ClCCC1CO1 NKWKILGNDJEIOC-UHFFFAOYSA-N 0.000 description 1
- YVMKRPGFBQGEBF-UHFFFAOYSA-N 2-(3-chlorophenyl)oxirane Chemical compound ClC1=CC=CC(C2OC2)=C1 YVMKRPGFBQGEBF-UHFFFAOYSA-N 0.000 description 1
- JZUMVFMLJGSMRF-UHFFFAOYSA-N 2-Methyladipic acid Chemical compound OC(=O)C(C)CCCC(O)=O JZUMVFMLJGSMRF-UHFFFAOYSA-N 0.000 description 1
- ZVMAGJJPTALGQB-UHFFFAOYSA-N 2-[3-(carboxymethoxy)phenoxy]acetic acid Chemical compound OC(=O)COC1=CC=CC(OCC(O)=O)=C1 ZVMAGJJPTALGQB-UHFFFAOYSA-N 0.000 description 1
- DNXOCFKTVLHUMU-UHFFFAOYSA-N 2-[4-(carboxymethoxy)phenoxy]acetic acid Chemical compound OC(=O)COC1=CC=C(OCC(O)=O)C=C1 DNXOCFKTVLHUMU-UHFFFAOYSA-N 0.000 description 1
- WHNBDXQTMPYBAT-UHFFFAOYSA-N 2-butyloxirane Chemical compound CCCCC1CO1 WHNBDXQTMPYBAT-UHFFFAOYSA-N 0.000 description 1
- GXOYTMXAKFMIRK-UHFFFAOYSA-N 2-heptyloxirane Chemical compound CCCCCCCC1CO1 GXOYTMXAKFMIRK-UHFFFAOYSA-N 0.000 description 1
- NJWSNNWLBMSXQR-UHFFFAOYSA-N 2-hexyloxirane Chemical compound CCCCCCC1CO1 NJWSNNWLBMSXQR-UHFFFAOYSA-N 0.000 description 1
- ZSPDYGICHBLYSD-UHFFFAOYSA-N 2-methylnaphthalene-1-carboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C)=CC=C21 ZSPDYGICHBLYSD-UHFFFAOYSA-N 0.000 description 1
- UOBYKYZJUGYBDK-UHFFFAOYSA-N 2-naphthoic acid Chemical compound C1=CC=CC2=CC(C(=O)O)=CC=C21 UOBYKYZJUGYBDK-UHFFFAOYSA-N 0.000 description 1
- NMOFYYYCFRVWBK-UHFFFAOYSA-N 2-pentyloxirane Chemical compound CCCCCC1CO1 NMOFYYYCFRVWBK-UHFFFAOYSA-N 0.000 description 1
- SYURNNNQIFDVCA-UHFFFAOYSA-N 2-propyloxirane Chemical compound CCCC1CO1 SYURNNNQIFDVCA-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 1
- VTDMBRAUHKUOON-UHFFFAOYSA-N 4-[(4-carboxyphenyl)methyl]benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C=C1 VTDMBRAUHKUOON-UHFFFAOYSA-N 0.000 description 1
- XAYDWGMOPRHLEP-UHFFFAOYSA-N 6-ethenyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1CCCC2OC21C=C XAYDWGMOPRHLEP-UHFFFAOYSA-N 0.000 description 1
- FIEKVYPYFQSFTP-UHFFFAOYSA-N 6-methyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1CCCC2OC21C FIEKVYPYFQSFTP-UHFFFAOYSA-N 0.000 description 1
- GJEZBVHHZQAEDB-UHFFFAOYSA-N 6-oxabicyclo[3.1.0]hexane Chemical compound C1CCC2OC21 GJEZBVHHZQAEDB-UHFFFAOYSA-N 0.000 description 1
- JXSRRBVHLUJJFC-UHFFFAOYSA-N 7-amino-2-methylsulfanyl-[1,2,4]triazolo[1,5-a]pyrimidine-6-carbonitrile Chemical compound N1=CC(C#N)=C(N)N2N=C(SC)N=C21 JXSRRBVHLUJJFC-UHFFFAOYSA-N 0.000 description 1
- MLOZFLXCWGERSM-UHFFFAOYSA-N 8-oxabicyclo[5.1.0]octane Chemical compound C1CCCCC2OC21 MLOZFLXCWGERSM-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- XBPCUCUWBYBCDP-UHFFFAOYSA-N Dicyclohexylamine Chemical compound C1CCCCC1NC1CCCCC1 XBPCUCUWBYBCDP-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 1
- 229910000503 Na-aluminosilicate Inorganic materials 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229910052586 apatite Inorganic materials 0.000 description 1
- QFNNDGVVMCZKEY-UHFFFAOYSA-N azacyclododecan-2-one Chemical compound O=C1CCCCCCCCCCN1 QFNNDGVVMCZKEY-UHFFFAOYSA-N 0.000 description 1
- KCLGATRJYMEERW-UHFFFAOYSA-N benzene-1,3-dicarboxylic acid;copper Chemical compound [Cu].OC(=O)C1=CC=CC(C(O)=O)=C1 KCLGATRJYMEERW-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- FUFJGUQYACFECW-UHFFFAOYSA-L calcium hydrogenphosphate Chemical compound [Ca+2].OP([O-])([O-])=O FUFJGUQYACFECW-UHFFFAOYSA-L 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- 235000012241 calcium silicate Nutrition 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910001902 chlorine oxide Inorganic materials 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 150000004699 copper complex Chemical class 0.000 description 1
- CMRVDFLZXRTMTH-UHFFFAOYSA-L copper;2-carboxyphenolate Chemical compound [Cu+2].OC1=CC=CC=C1C([O-])=O.OC1=CC=CC=C1C([O-])=O CMRVDFLZXRTMTH-UHFFFAOYSA-L 0.000 description 1
- ZCXLQZOQWCXFNN-UHFFFAOYSA-N copper;hexanedioic acid Chemical compound [Cu].OC(=O)CCCCC(O)=O ZCXLQZOQWCXFNN-UHFFFAOYSA-N 0.000 description 1
- LZJJVTQGPPWQFS-UHFFFAOYSA-L copper;propanoate Chemical compound [Cu+2].CCC([O-])=O.CCC([O-])=O LZJJVTQGPPWQFS-UHFFFAOYSA-L 0.000 description 1
- KTMJZMQYZGNYBQ-UHFFFAOYSA-L copper;pyridine-3-carboxylate Chemical compound [Cu+2].[O-]C(=O)C1=CC=CN=C1.[O-]C(=O)C1=CC=CN=C1 KTMJZMQYZGNYBQ-UHFFFAOYSA-L 0.000 description 1
- ZISLUDLMVNEAHK-UHFFFAOYSA-L copper;terephthalate Chemical compound [Cu+2].[O-]C(=O)C1=CC=C(C([O-])=O)C=C1 ZISLUDLMVNEAHK-UHFFFAOYSA-L 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- VZFUCHSFHOYXIS-UHFFFAOYSA-N cycloheptane carboxylic acid Natural products OC(=O)C1CCCCCC1 VZFUCHSFHOYXIS-UHFFFAOYSA-N 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- QBJOHGAEIAUULA-UHFFFAOYSA-N cyclohexen-1-ylmethanol Chemical compound OCC1=CCCCC1 QBJOHGAEIAUULA-UHFFFAOYSA-N 0.000 description 1
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 1
- FWFSEYBSWVRWGL-UHFFFAOYSA-N cyclohexene oxide Natural products O=C1CCCC=C1 FWFSEYBSWVRWGL-UHFFFAOYSA-N 0.000 description 1
- KQWGXHWJMSMDJJ-UHFFFAOYSA-N cyclohexyl isocyanate Chemical compound O=C=NC1CCCCC1 KQWGXHWJMSMDJJ-UHFFFAOYSA-N 0.000 description 1
- XHMWGEWUBYMZDB-UHFFFAOYSA-N cyclooctane-1,1-diamine Chemical compound NC1(N)CCCCCCC1 XHMWGEWUBYMZDB-UHFFFAOYSA-N 0.000 description 1
- DRTWGLDIOYISRH-UHFFFAOYSA-N cyclooctyloxycyclooctane Chemical compound C1CCCCCCC1OC1CCCCCCC1 DRTWGLDIOYISRH-UHFFFAOYSA-N 0.000 description 1
- VDBXLXRWMYNMHL-UHFFFAOYSA-N decanediamide Chemical compound NC(=O)CCCCCCCCC(N)=O VDBXLXRWMYNMHL-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- 235000019700 dicalcium phosphate Nutrition 0.000 description 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- OREAFAJWWJHCOT-UHFFFAOYSA-N dimethylmalonic acid Chemical compound OC(=O)C(C)(C)C(O)=O OREAFAJWWJHCOT-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 238000007380 fibre production Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 229940083124 ganglion-blocking antiadrenergic secondary and tertiary amines Drugs 0.000 description 1
- 239000000156 glass melt Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- IZKZIDXHCDIZKY-UHFFFAOYSA-N heptane-1,1-diamine Chemical compound CCCCCCC(N)N IZKZIDXHCDIZKY-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 229940116335 lauramide Drugs 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 235000012245 magnesium oxide Nutrition 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- WTQUVYBGJUBJSW-UHFFFAOYSA-N oxacycloundecane Chemical compound C1CCCCCOCCCC1 WTQUVYBGJUBJSW-UHFFFAOYSA-N 0.000 description 1
- VSIIXMUUUJUKCM-UHFFFAOYSA-D pentacalcium;fluoride;triphosphate Chemical compound [F-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O VSIIXMUUUJUKCM-UHFFFAOYSA-D 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- FCJSHPDYVMKCHI-UHFFFAOYSA-N phenyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OC1=CC=CC=C1 FCJSHPDYVMKCHI-UHFFFAOYSA-N 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000001782 photodegradation Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006123 polyhexamethylene isophthalamide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000429 sodium aluminium silicate Substances 0.000 description 1
- 235000012217 sodium aluminium silicate Nutrition 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- LVBXEMGDVWVTGY-UHFFFAOYSA-N trans-2-octenal Natural products CCCCCC=CC=O LVBXEMGDVWVTGY-UHFFFAOYSA-N 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 235000014692 zinc oxide Nutrition 0.000 description 1
Classifications
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08K2201/00—Specific properties of additives
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- C08K2201/003—Additives being defined by their diameter
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- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Chemical & Material Sciences (AREA)
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- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
本发明涉及聚酰胺树脂组合物及成形体。本发明的目的在于提供能够得到尺寸精度优良并且外观也优良的成形体的聚酰胺树脂组合物以及含有该聚酰胺树脂组合物的成形体。一种聚酰胺树脂组合物,其含有(A)聚酰胺树脂、(B)玻璃纤维和(C)非纤维状填充材料,所述(A)聚酰胺树脂中的50质量%以上为碳原子数/氮原子数之比(C/N比)为7以上的脂肪族聚酰胺,所述(B)玻璃纤维的数均纤维直径x(μm)与所述(C)非纤维状填充材料的数均粒径y(μm)满足下式:x≥5、y≥3、0.8x+y≥11。The present invention relates to a polyamide resin composition and a molded article. An object of the present invention is to provide a polyamide resin composition capable of obtaining a molded article having excellent dimensional accuracy and excellent appearance, and a molded article containing the polyamide resin composition. A polyamide resin composition comprising (A) a polyamide resin, (B) glass fibers, and (C) a non-fibrous filler, wherein 50% by mass or more of the (A) polyamide resin is carbon atoms In an aliphatic polyamide having a ratio of nitrogen atoms (C/N ratio) of 7 or more, the number average fiber diameter x (μm) of the (B) glass fiber and the number of the (C) non-fibrous filler The average particle size y (μm) satisfies the following formula: x≥5, y≥3, 0.8x+y≥11.
Description
技术领域technical field
本发明涉及聚酰胺树脂组合物及成形体。The present invention relates to a polyamide resin composition and a molded article.
背景技术Background technique
聚酰胺树脂具有优良的机械特性(机械强度、刚性、耐冲击性等)、韧性、耐热性和耐化学品性,因此在衣料、产业材料、汽车、电气和电子部件以及其它工业制品等各种产业领域中使用。特别是聚酰胺树脂的耐热老化性比其它树脂优良。因此,用作汽车发动机室内等带有非常高的热量的部位的部件用材料。Polyamide resin has excellent mechanical properties (mechanical strength, rigidity, impact resistance, etc.), toughness, heat resistance, and chemical resistance, so it is used in various fields such as clothing materials, industrial materials, automobiles, electrical and electronic components, and other industrial products. used in the industrial field. In particular, polyamide resins are superior to other resins in heat aging resistance. Therefore, it is used as a material for components in places with very high heat, such as the engine room of an automobile.
对于汽车发动机室中使用的材料而言,近来设想在寒冷地区使用,更高度地要求对作为防冻剂的氯化钙的树脂劣化的抑制(耐氯化钙性)、在冷却系统部件中作为不冻液的长效冷冻液(LLC)造成的树脂的劣化的抑制(耐水解性)等。在用于与汽车发动机室相关的部件时,也要求聚酰胺树脂具有上述的耐氯化钙性和耐水解性。For materials used in the engine room of automobiles, use in cold regions is envisaged recently, and the suppression of resin deterioration (calcium chloride resistance) of calcium chloride as an antifreeze is more highly required, and it is used as an antifreeze in cooling system components. Inhibition of resin deterioration (hydrolysis resistance) due to long-term cooling liquid (LLC) of freezing liquid, etc. Polyamide resins are also required to have the above-mentioned calcium chloride resistance and hydrolysis resistance when used in parts related to automobile engine compartments.
作为提高聚酰胺树脂的耐氯化钙性和耐水解性的技术,以往已知碳链长的聚酰胺(长链型聚酰胺;亚甲基链相对于酰胺键的比例高的聚酰胺)。Polyamides having long carbon chains (long-chain polyamides; polyamides having a high ratio of methylene chains to amide bonds) are conventionally known as techniques for improving the calcium chloride resistance and hydrolysis resistance of polyamide resins.
关于长链型聚酰胺之一的聚酰胺610,公开了配合玻璃纤维、成核剂、热稳定剂等的技术(例如,参见专利文献1、专利文献2)。Regarding polyamide 610, which is one of long-chain polyamides, techniques for blending glass fibers, nucleating agents, heat stabilizers, and the like are disclosed (see, for example, Patent Document 1 and Patent Document 2).
现有技术文献prior art literature
专利文献patent documents
专利文献1:日本特表2010-522259号公报Patent Document 1: Japanese PCT Publication No. 2010-522259
专利文献2:日本特开2009-215514号公报Patent Document 2: Japanese Patent Laid-Open No. 2009-215514
发明内容Contents of the invention
发明所要解决的问题The problem to be solved by the invention
但是,长链型聚酰胺虽然耐氯化钙性和耐水解性优良,但是与一般的聚酰胺66、聚酰胺6等相比,结晶速度慢,因此成形时的脱模性、脱模后的尺寸精度等不足。另一方面,为了提高脱模性而使结晶速度过快时,成形体的外观受损。However, long-chain polyamides have excellent calcium chloride resistance and hydrolysis resistance, but their crystallization speed is slower than general polyamide 66, polyamide 6, etc. Insufficient dimensional accuracy, etc. On the other hand, when the crystallization rate is too fast for improving mold releasability, the appearance of the molded article is impaired.
另外,在将所得到的聚酰胺树脂组合物用作汽车发动机室用的部件、电气和电子部件等的材料时,要求具有比以往更优良的尺寸精度的聚酰胺树脂组合物,而现有的聚酰胺树脂组合物的尺寸精度不足。In addition, when the obtained polyamide resin composition is used as a material for automobile engine compartment parts, electric and electronic parts, etc., a polyamide resin composition with better dimensional accuracy than conventional ones is required, and existing The dimensional accuracy of the polyamide resin composition is insufficient.
因此,本发明鉴于上述问题而作出,其目的在于提供能够得到尺寸精度优良并且外观也优良的成形体的聚酰胺树脂组合物以及含有该聚酰胺树脂组合物的成形体。Therefore, the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a polyamide resin composition capable of obtaining a molded article having excellent dimensional accuracy and excellent appearance, and a molded article containing the polyamide resin composition.
用于解决问题的手段means of solving problems
本发明人为了解决上述问题进行了广泛深入的研究。结果发现,含有规定量的规定的脂肪族聚酰胺、玻璃纤维的平均纤维直径x(μm)与非纤维状填充材料的平均粒径y(μm)满足规定的关系的聚酰胺树脂组合物能够解决上述问题,从而完成了本发明。The inventors of the present invention have conducted extensive and intensive studies in order to solve the above-mentioned problems. As a result, it was found that a polyamide resin composition containing a specified amount of specified aliphatic polyamide, the average fiber diameter x (μm) of the glass fiber and the average particle size y (μm) of the non-fibrous filler satisfying the specified relationship can solve the problem. The above problems have been solved, and the present invention has been accomplished.
即,本发明如下所述。That is, the present invention is as follows.
[1]一种聚酰胺树脂组合物,其含有(A)聚酰胺树脂、(B)玻璃纤维和(C)非纤维状填充材料,[1] A polyamide resin composition comprising (A) a polyamide resin, (B) glass fibers and (C) a non-fibrous filler,
所述(A)聚酰胺树脂中的50质量%以上为碳原子数/氮原子数之比(C/N比)为7以上的脂肪族聚酰胺,50% by mass or more of the (A) polyamide resin is an aliphatic polyamide having a carbon number/nitrogen number ratio (C/N ratio) of 7 or more,
所述(B)玻璃纤维的数均纤维直径x(μm)与所述(C)非纤维状填充材料的数均粒径y(μm)满足下式:The number average fiber diameter x (μm) of the (B) glass fiber and the number average particle size y (μm) of the (C) non-fibrous filler material satisfy the following formula:
x≥5x≥5
y≥3y≥3
0.8x+y≥11。0.8x+y≥11.
[2]如前项[1]所述的聚酰胺树脂组合物,其中,所述(A)聚酰胺树脂中的碳原子数/氮原子数之比(C/N比)为7以上的所述脂肪族聚酰胺为选自由聚酰胺610、聚酰胺612、聚酰胺11、聚酰胺12、聚酰胺1010和聚酰胺1012组成的组中的一种以上。[2] The polyamide resin composition according to the above item [1], wherein the (A) ratio of the number of carbon atoms/number of nitrogen atoms in the polyamide resin (C/N ratio) is 7 or more The aliphatic polyamide is at least one selected from the group consisting of polyamide 610, polyamide 612, polyamide 11, polyamide 12, polyamide 1010, and polyamide 1012.
[3]如前项[1]或[2]所述的聚酰胺树脂组合物,其中,所述(C)非纤维状填充材料为选自由玻璃鳞片、滑石、高岭土、云母、碳酸钙、粘土和氮化硅组成的组中的一种以上。[3] The polyamide resin composition as described in [1] or [2] above, wherein the (C) non-fibrous filler is selected from glass flakes, talc, kaolin, mica, calcium carbonate, clay and one or more of the group consisting of silicon nitride.
[4]如前项[1]~[3]中任一项所述的聚酰胺树脂组合物,其中,所述(B)玻璃纤维为利用含有共聚物的集束剂进行处理后的玻璃纤维,所述共聚物含有含羧酸酐不饱和乙烯基单体和除该含羧酸酐不饱和乙烯基单体以外的不饱和乙烯基单体作为构成单元。[4] The polyamide resin composition according to any one of [1] to [3] above, wherein the (B) glass fibers are glass fibers treated with a sizing agent containing a copolymer, The copolymer contains a carboxylic anhydride-containing unsaturated vinyl monomer and an unsaturated vinyl monomer other than the carboxylic anhydride-containing unsaturated vinyl monomer as constituent units.
[5]如前项[1]~[4]中任一项所述的聚酰胺树脂组合物,其中,所述(A)聚酰胺树脂含有碳原子数/氮原子数之比(C/N)比小于7的脂肪族聚酰胺,[5] The polyamide resin composition according to any one of [1] to [4] above, wherein the (A) polyamide resin has a ratio of carbon atoms/nitrogen atoms (C/N ) ratio of less than 7 aliphatic polyamides,
该脂肪族聚酰胺的含量相对于所述(A)聚酰胺树脂的总量100质量%为50质量%以下。The content of the aliphatic polyamide is 50% by mass or less with respect to 100% by mass of the total amount of the (A) polyamide resin.
[6]如前项[1]~[5]中任一项所述的聚酰胺树脂组合物,其中,所述(A)聚酰胺树脂含有氨基末端量相对于氨基末端量与羧基末端量的总量之比[氨基末端量/(氨基末端量+羧基末端量)]为0.3以上且小于1.0的聚酰胺树脂。[6] The polyamide resin composition according to any one of [1] to [5] above, wherein the (A) polyamide resin contains an amount of amino terminals relative to the amount of amino terminals and the amount of carboxyl terminals. A polyamide resin having a total ratio [amount of amino terminals/(amount of amino terminals+amount of carboxyl terminals)] of 0.3 or more and less than 1.0.
[7]如前项[1]~[6]中任一项所述的聚酰胺树脂组合物,其中,相对于聚酰胺树脂组合物100质量%,含有25~84质量%的所述(A)聚酰胺树脂,15~74质量%的所述(B)玻璃纤维,和1~20质量%的所述(C)非纤维状填充材料。[7] The polyamide resin composition according to any one of [1] to [6] above, which contains 25 to 84% by mass of the (A ) polyamide resin, 15 to 74% by mass of the (B) glass fiber, and 1 to 20% by mass of the (C) non-fibrous filler.
[8]如前项[1]~[7]中任一项所述的聚酰胺树脂组合物,其中,还含有(D)铜盐与碱金属的卤化物和/或碱土金属的卤化物的混合物。[8] The polyamide resin composition according to any one of [1] to [7] above, further comprising (D) a mixture of a copper salt and an alkali metal halide and/or an alkaline earth metal halide mixture.
[9]如前项[1]~[8]中任一项所述的聚酰胺树脂组合物,其中,还含有(E)氮化硼和/或炭黑。[9] The polyamide resin composition according to any one of [1] to [8] above, further comprising (E) boron nitride and/or carbon black.
[10]一种成形体,其含有前项[1]~[9]中任一项所述的聚酰胺树脂组合物。[10] A molded article comprising the polyamide resin composition according to any one of [1] to [9].
[11]如前项[10]所述的成形体,其具有圆筒形状部。[11] The molded article according to the above item [10], which has a cylindrical portion.
[12]如前项[11]所述的成形体,其中,所述圆筒形状部包括强制取出的底切部。[12] The molded body according to the preceding item [11], wherein the cylindrical shape portion includes an undercut portion that is forcibly taken out.
发明效果Invention effect
根据本发明,可以提供能够得到尺寸精度优良并且外观也优良的成形体的聚酰胺树脂组合物以及包含该聚酰胺树脂组合物的成形体。According to the present invention, there can be provided a polyamide resin composition capable of obtaining a molded article having excellent dimensional accuracy and excellent appearance, and a molded article comprising the polyamide resin composition.
具体实施方式Detailed ways
以下,对于用于实施本发明的方式(以下称为“本实施方式”)进行详细说明。另外,本发明不限于以下的实施方式,可以在其要旨的范围内进行各种变形后实施。Hereinafter, a mode for implementing the present invention (hereinafter referred to as "the present embodiment") will be described in detail. In addition, this invention is not limited to the following embodiment, It can implement various deformation|transformation within the range of the summary.
[聚酰胺树脂组合物][Polyamide resin composition]
本实施方式的聚酰胺树脂组合物,其含有(A)聚酰胺树脂、(B)玻璃纤维和(C)非纤维状填充材料,The polyamide resin composition of this embodiment contains (A) polyamide resin, (B) glass fiber and (C) non-fibrous filler,
所述(A)聚酰胺树脂中的50质量%以上为碳原子数/氮原子数之比(C/N比)为7以上的脂肪族聚酰胺,50% by mass or more of the (A) polyamide resin is an aliphatic polyamide having a carbon number/nitrogen number ratio (C/N ratio) of 7 or more,
所述(B)玻璃纤维的数均纤维直径x(μm)与所述(C)非纤维状填充材料的数均粒径y(μm)满足下式:The number average fiber diameter x (μm) of the (B) glass fiber and the number average particle size y (μm) of the (C) non-fibrous filler material satisfy the following formula:
x≥5x≥5
y≥3y≥3
0.8x+y≥11。0.8x+y≥11.
以下,对于前述聚酰胺树脂组合物的各构成要素进行详细说明。Hereinafter, each constituent element of the aforementioned polyamide resin composition will be described in detail.
[(A)聚酰胺树脂][(A) polyamide resin]
“聚酰胺树脂”是指主链上具有-CO-NH-(酰胺)键的高分子化合物。作为本实施方式中使用的(A)聚酰胺树脂,没有特别限制,可以列举例如:(a)通过内酰胺的开环聚合而得到的聚酰胺树脂、(b)通过ω-氨基羧酸的自缩合而得到的聚酰胺树脂、(c)通过将二元胺与二元羧酸缩合而得到的聚酰胺树脂、以及它们的共聚物。(A)聚酰胺树脂可以使用一种,也可以作为两种以上的混合物使用。以下,对于本实施方式的(A)聚酰胺树脂的原料进行说明。"Polyamide resin" refers to a polymer compound having a -CO-NH-(amide) bond in the main chain. The (A) polyamide resin used in this embodiment is not particularly limited, and examples thereof include: (a) a polyamide resin obtained by ring-opening polymerization of a lactam, (b) a polyamide resin obtained by A polyamide resin obtained by condensation, (c) a polyamide resin obtained by condensing a diamine and a dicarboxylic acid, and a copolymer thereof. (A) The polyamide resin may be used singly or as a mixture of two or more kinds. Hereinafter, the raw material of (A) polyamide resin of this embodiment is demonstrated.
作为上述(a)聚酰胺树脂的原料的内酰胺,没有特别限制,可以列举例如:吡咯烷酮、己内酰胺、十一内酰胺以及十二内酰胺等。The lactam as a raw material of the polyamide resin (a) is not particularly limited, and examples thereof include pyrrolidone, caprolactam, undecalactam, and laurolactam.
另外,作为上述(b)聚酰胺树脂的原料的ω-氨基羧酸,没有特别限制,可以列举例如:作为上述内酰胺利用水得到的开环化合物的ω-氨基脂肪酸等。另外,上述(a)聚酰胺和(b)聚酰胺各自可以为组合使用两种以上的内酰胺或ω-氨基羧酸进行缩合而得到的聚酰胺。In addition, the ω-aminocarboxylic acid used as a raw material of the above (b) polyamide resin is not particularly limited, and examples thereof include ω-amino fatty acid, which is a ring-opened compound obtained from the above-mentioned lactam with water. In addition, each of the above-mentioned (a) polyamide and (b) polyamide may be a polyamide obtained by condensing two or more lactams or ω-aminocarboxylic acids in combination.
其次,作为上述(c)聚酰胺树脂的原料的二元胺(单体),没有特别限制,可以列举例如:六亚甲基二胺、五亚甲基二胺等直链脂肪族二元胺;2-甲基戊二胺、2-乙基六亚甲基二胺等支链型脂肪族二元胺;对苯二胺、间苯二胺等芳香族二元胺;环己烷二胺、环戊烷二胺、环辛烷二胺等脂环式二元胺等。Next, the diamine (monomer) used as the raw material of the above (c) polyamide resin is not particularly limited, and examples thereof include linear aliphatic diamines such as hexamethylenediamine and pentamethylenediamine. ; 2-methylpentamethylenediamine, 2-ethylhexamethylenediamine and other branched aliphatic diamines; p-phenylenediamine, m-phenylenediamine and other aromatic diamines; cyclohexanediamine , cyclopentanediamine, cyclooctanediamine and other alicyclic diamines.
另一方面,作为上述(c)聚酰胺树脂的原料的二元羧酸(单体),没有特别限制,可以列举例如:己二酸、庚二胺、癸二酸等脂肪族二元羧酸;邻苯二甲酸、间苯二甲酸等芳香族二元羧酸;环己烷二甲酸等脂环式二元羧酸等。On the other hand, the dicarboxylic acid (monomer) used as the raw material of the above (c) polyamide resin is not particularly limited, and examples thereof include aliphatic dicarboxylic acids such as adipic acid, heptanediamine, and sebacic acid. ; Aromatic dicarboxylic acids such as phthalic acid and isophthalic acid; Alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid, etc.
上述(c)聚酰胺可以为将二元胺及二元羧酸各自单独一种或者两种以上组合使用进行缩合而得到的聚酰胺。The above (c) polyamide may be a polyamide obtained by condensing a diamine and a dicarboxylic acid alone or in combination of two or more.
作为(A)聚酰胺树脂,没有特别限制,可以列举例如:聚酰胺4(聚α-吡咯烷酮)、聚酰胺6(聚己酰胺)、聚酰胺11(聚十一酰胺)、聚酰胺12(聚十二酰胺)、聚酰胺46(聚己二酰丁二胺)、聚酰胺56(聚己二酰戊二胺)、聚酰胺66(聚己二酰己二胺)、聚酰胺610(聚癸二酰己二胺)、聚酰胺612(聚十二酰己二胺)、聚酰胺1010(聚癸二酰癸二胺)、聚酰胺1012(聚十二酰癸二胺)、聚酰胺6T(聚对苯二甲酰己二胺)、聚酰胺9T(聚对苯二甲酰壬二胺)和聚酰胺6I(聚间苯二甲酰己二胺)、以及含有它们作为构成成分的共聚聚酰胺等。The (A) polyamide resin is not particularly limited, and examples thereof include polyamide 4 (polyα-pyrrolidone), polyamide 6 (polycaproamide), polyamide 11 (polyundecamide), polyamide 12 (polyamide Lauramide), polyamide 46 (polybutylene adipamide), polyamide 56 (polypentamethylene adipamide), polyamide 66 (polyhexamethylene adipamide), polyamide 610 (polydecane Hexamethylene diamide), polyamide 612 (polyhexamethylene dodecamide), polyamide 1010 (polydecanediamide sebacamide), polyamide 1012 (polydecanediamide dodecamide), polyamide 6T ( Polyhexamethylene terephthalamide), polyamide 9T (polynonanediamide terephthalamide), polyamide 6I (polyhexamethylene isophthalamide), and copolymers containing them as constituents amides etc.
本实施方式中使用的(A)聚酰胺树脂为(A)聚酰胺树脂中的50质量%以上为碳原子数/氮原子数之比(C/N比)为7以上的脂肪族聚酰胺。通过含有这样的脂肪族聚酰胺,所得到的成形体具有尺寸精度和外观更加优良的倾向。上述脂肪族聚酰胺的碳原子数/氮原子数之比(C/N比)为7以上,优选8以上。另外,碳原子数/氮原子数之比(C/N比)的上限没有特别限制,优选15以下,更优选12以下,进一步优选10以下。通过碳原子数/氮原子数之比在上述范围内,所得到的成形体具有尺寸精度和外观更加优良的倾向。另外,关于共聚聚酰胺的C/N比,可以求出由共聚比例的摩尔比率计算的平均值作为C/N比。The (A) polyamide resin used in this embodiment is an aliphatic polyamide having a carbon number/nitrogen number ratio (C/N ratio) of 7 or more in the (A) polyamide resin in an amount of 50% by mass or more. By containing such an aliphatic polyamide, the obtained molded article tends to be more excellent in dimensional accuracy and appearance. The ratio of the number of carbon atoms to the number of nitrogen atoms (C/N ratio) of the aliphatic polyamide is 7 or more, preferably 8 or more. In addition, the upper limit of the ratio of carbon atoms/nitrogen atoms (C/N ratio) is not particularly limited, but is preferably 15 or less, more preferably 12 or less, and still more preferably 10 or less. When the ratio of the number of carbon atoms/number of nitrogen atoms is within the above-mentioned range, the molded article obtained tends to have better dimensional accuracy and appearance. In addition, regarding the C/N ratio of the copolymerized polyamide, the average value calculated from the molar ratio of the copolymerization ratio can be obtained as the C/N ratio.
另外,碳原子数/氮原子数之比(C/N比)为7以上的脂肪族聚酰胺的含量为50质量%以上,优选60质量%以上,更优选80质量%以上。通过含量在上述范围内,所得到的成形体具有尺寸精度和外观更加优良的倾向。In addition, the content of the aliphatic polyamide having a carbon number/nitrogen number ratio (C/N ratio) of 7 or more is 50% by mass or more, preferably 60% by mass or more, more preferably 80% by mass or more. When the content is within the above range, the obtained molded article tends to have better dimensional accuracy and appearance.
另外,本实施方式中的“脂肪族聚酰胺”是指构成聚酰胺的单元(由二元胺与二元羧酸构成的情况下,将一对二元胺和二元羧酸作为一个单元)的50质量%以上由脂肪族单元构成的聚酰胺。In addition, the "aliphatic polyamide" in the present embodiment refers to a unit constituting a polyamide (when composed of a diamine and a dicarboxylic acid, a pair of diamine and a dicarboxylic acid are regarded as one unit) More than 50% by mass of polyamides are composed of aliphatic units.
作为碳原子数/氮原子数之比(C/N比)为7以上的脂肪族聚酰胺,没有特别限制,可以列举例如:选自由聚酰胺610、聚酰胺612、聚酰胺11、聚酰胺12、聚酰胺1010、聚酰胺1012以及含有它们作为构成成分的共聚聚酰胺组成的组中的一种以上。The aliphatic polyamide having a carbon number/nitrogen number ratio (C/N ratio) of 7 or more is not particularly limited, and examples thereof include polyamide 610, polyamide 612, polyamide 11, and polyamide 12. , polyamide 1010, polyamide 1012, and the group consisting of copolyamides containing these as constituent components.
本实施方式的聚酰胺树脂组合物优选含有C/N之比小于7的聚酰胺作为其它聚酰胺树脂。作为C/N之比小于7的聚酰胺,没有特别限制,可以列举例如:选自由聚酰胺4、聚酰胺6、聚酰胺46、聚酰胺56、聚酰胺66、以及含有它们作为构成成分的共聚聚酰胺组成的组中的一种以上。其中,更优选以聚酰胺6、聚酰胺66作为主要构成成分的C/N之比小于7的聚酰胺,进一步优选C/N之比小于7的脂肪族聚酰胺。通过含有这样的聚酰胺,具有所得到的成形体的机械强度、受热时的刚性更加优良的倾向。The polyamide resin composition of this embodiment preferably contains a polyamide having a C/N ratio of less than 7 as another polyamide resin. The polyamide having a C/N ratio of less than 7 is not particularly limited, and examples thereof include polyamides selected from polyamide 4, polyamide 6, polyamide 46, polyamide 56, polyamide 66, and copolymers containing these as constituents. One or more types from the group consisting of polyamides. Among them, polyamides having a C/N ratio of less than 7 are more preferred, and aliphatic polyamides having a C/N ratio of less than 7 are more preferred. By containing such a polyamide, the obtained molded article tends to be more excellent in mechanical strength and rigidity when heated.
C/N之比小于7的聚酰胺的含量优选0~50质量%,更优选0~40质量%,进一步优选5~20质量%。通过含量在上述范围内,具有机械强度、受热时的刚性更加优良而不损害所得到的成形体的尺寸精度和外观的倾向。The content of the polyamide having a C/N ratio of less than 7 is preferably 0 to 50% by mass, more preferably 0 to 40% by mass, and still more preferably 5 to 20% by mass. When the content is within the above range, the mechanical strength and the rigidity when heated tend to be more excellent without impairing the dimensional accuracy and appearance of the molded body obtained.
另外,本实施方式的聚酰胺树脂组合物优选含有C/N之比为7以上的半芳香族聚酰胺作为其它聚酰胺树脂。作为C/N之比为7以上的半芳香族聚酰胺,没有特别限制,可以列举例如:聚酰胺6T、聚酰胺9T及聚酰胺6I等。通过含有这样的半芳香族聚酰胺,具有受热时的刚性更加优良的倾向。在此,“半芳香族聚酰胺”是指由二元胺或二元羧酸中的一方为脂肪族化合物、另一方为具有芳香族结构的化合物的组合而构成的聚酰胺以及含有它们作为构成成分的共聚聚酰胺,共聚聚酰胺的情况下,构成单元中超过50质量%的单元为半芳香族单元时称为半芳香族聚酰胺。In addition, the polyamide resin composition of the present embodiment preferably contains a semi-aromatic polyamide having a C/N ratio of 7 or more as another polyamide resin. The semi-aromatic polyamide having a C/N ratio of 7 or more is not particularly limited, and examples thereof include polyamide 6T, polyamide 9T, and polyamide 6I. By containing such a semi-aromatic polyamide, the rigidity at the time of heating tends to be more excellent. Here, "semi-aromatic polyamide" refers to a polyamide composed of a combination of a diamine or a dicarboxylic acid, one of which is an aliphatic compound and the other is a compound having an aromatic structure, and polyamides containing these as constituents. The component copolyamide, in the case of a copolyamide, is called a semiaromatic polyamide when more than 50% by mass of the constituent units is a semiaromatic unit.
C/N之比为7以上的半芳香族聚酰胺的含量优选为0~50质量%,更优选0~40质量%,进一步优选5~20质量%。通过含量在上述范围内,具有受热时的刚性更加优良而不损害所得到的成形体的尺寸精度和外观的倾向。The content of the semi-aromatic polyamide having a C/N ratio of 7 or more is preferably 0 to 50% by mass, more preferably 0 to 40% by mass, and still more preferably 5 to 20% by mass. When the content is within the above range, the rigidity at the time of heating tends to be more excellent without impairing the dimensional accuracy and appearance of the molded body obtained.
作为本实施方式中使用的(A)聚酰胺树脂的末端基,没有特别限制,一般存在氨基或羧基。本实施方式中使用的(A)聚酰胺树脂中的氨基末端量相对于氨基末端量与羧基末端量的总量之比[氨基末端量/(氨基末端量+羧基末端量)]优选为0.3以上且小于1.0,更优选0.3以上且0.8以下,进一步优选0.3以上且0.6以下。通过末端基量之比在上述范围内,具有由聚酰胺树脂组合物得到的成形体的色调、机械强度以及耐振动疲劳特性更加优良的倾向。The (A) terminal group of the polyamide resin used in this embodiment is not particularly limited, and amino or carboxyl groups generally exist. The ratio of the amount of amino terminals in the (A) polyamide resin used in this embodiment to the total amount of amino terminals and carboxyl terminals [amino terminal amount / (amino terminal amount + carboxy terminal amount)] is preferably 0.3 or more and less than 1.0, more preferably 0.3 to 0.8, still more preferably 0.3 to 0.6. When the ratio of the amount of terminal groups is within the above range, the molded article obtained from the polyamide resin composition tends to be more excellent in color tone, mechanical strength, and vibration fatigue resistance.
(A)聚酰胺树脂的氨基末端量优选为10~100微摩尔/克,更优选为15~80微摩尔/克,进一步优选为30~80微摩尔/克。通过氨基末端量在上述范围内,具有聚酰胺树脂组合物的机械强度更加优良的倾向。(A) The amino terminal amount of the polyamide resin is preferably 10 to 100 micromol/g, more preferably 15 to 80 micromol/g, and still more preferably 30 to 80 micromol/g. There exists a tendency for the mechanical strength of a polyamide resin composition to become more excellent when the amount of amino terminal exists in the said range.
在此,作为本说明书中的氨基末端量和羧基末端量的测定方法的例子,可以列举1H-NMR法、滴定法。在1H-NMR法中,通过对应于各末端基的特征信号的积分值来求出。在滴定法中,对于氨基末端,可以列举用0.1N盐酸滴定聚酰胺树脂的苯酚溶液的方法,对于羧基末端,可以列举用0.1N氢氧化钠滴定聚酰胺树脂的苄醇溶液的方法。更具体地可以通过实施例中记载的方法测定。Here, examples of methods for measuring the amount of amino-terminals and carboxy-terminals in the present specification include 1 H-NMR and titration. In the 1 H-NMR method, it is obtained from the integral value of the characteristic signal corresponding to each terminal group. The titration method includes titrating a phenol solution of polyamide resin with 0.1N hydrochloric acid for the amino terminal, and titrating a benzyl alcohol solution of polyamide resin with 0.1N sodium hydroxide for the carboxyl terminal. More specifically, it can be measured by the method described in the Example.
另外,作为本实施方式中使用的(A)聚酰胺树脂的末端基的浓度的调节方法,可以使用公知的方法。作为调节方法,没有特别限制,可以列举例如:使用末端调节剂的方法。作为具体例,可以列举在聚酰胺树脂的聚合时添加选自由一元胺化合物、二元胺化合物、一元羧酸化合物以及二元羧酸化合物组成的组中的一种以上的末端调节剂使得达到规定的末端浓度的方法。关于末端调节剂在溶剂中的添加时期,只要发挥作为末端调节剂的本来的功能则没有特别限制,例如,可以在向溶剂中添加上述聚酰胺树脂的原料时添加。In addition, as a method of adjusting the concentration of the terminal group of (A) polyamide resin used in this embodiment, a known method can be used. The adjustment method is not particularly limited, and examples thereof include a method using a terminal adjuster. As a specific example, adding one or more terminal regulators selected from the group consisting of monoamine compounds, diamine compounds, monocarboxylic acid compounds, and dicarboxylic acid compounds during the polymerization of polyamide resins to achieve the specified method of the end concentration. The timing of adding the terminal regulator to the solvent is not particularly limited as long as it exhibits its original function as the terminal regulator. For example, it may be added when adding the raw material of the above-mentioned polyamide resin to the solvent.
作为上述一元胺化合物,没有特别限制,可以列举例如:甲胺、乙胺、丙胺、丁胺、己胺、辛胺、癸胺、硬脂胺、二甲胺、二乙胺、二丙胺和二丁胺等脂肪族一元胺;环己胺和二环己胺等脂环式一元胺;苯胺、甲苯胺、二苯胺和萘胺等芳香族一元胺;以及它们的任意混合物等。其中,从反应性、沸点、封端的稳定性、价格等观点考虑,优选丁胺、己胺、辛胺、癸胺、硬脂胺、环己胺和苯胺。这些物质可以单独使用一种,也可以组合使用两种以上。The above-mentioned monoamine compound is not particularly limited, and examples thereof include methylamine, ethylamine, propylamine, butylamine, hexylamine, octylamine, decylamine, stearylamine, dimethylamine, diethylamine, dipropylamine, and diethylamine. Aliphatic monoamines such as butylamine; alicyclic monoamines such as cyclohexylamine and dicyclohexylamine; aromatic monoamines such as aniline, toluidine, diphenylamine, and naphthylamine; and arbitrary mixtures thereof. Among them, butylamine, hexylamine, octylamine, decylamine, stearylamine, cyclohexylamine, and aniline are preferable from the viewpoints of reactivity, boiling point, stability of blocking, price, and the like. These substances may be used alone or in combination of two or more.
上述二胺化合物没有特别限制,可以列举例如:六亚甲基二胺、五亚甲基二胺等直链脂肪族二元胺;2-甲基戊二胺、2-乙基六亚甲基二胺等支链型脂肪族二元胺;对苯二胺、间苯二胺等芳香族二元胺;环己烷二胺、环戊烷二胺、环辛烷二胺等脂环式二元胺等。这些化合物可以单独使用一种,也可以组合使用两种以上。The above-mentioned diamine compounds are not particularly limited, and examples thereof include straight-chain aliphatic diamines such as hexamethylenediamine and pentamethylenediamine; 2-methylpentamethylenediamine, 2-ethylhexamethylenediamine; Branched-chain aliphatic diamines such as diamine; aromatic diamines such as p-phenylenediamine and m-phenylenediamine; alicyclic diamines such as cyclohexanediamine, cyclopentanediamine and cyclooctanediamine amines, etc. These compounds may be used alone or in combination of two or more.
作为上述一元羧酸化合物,没有特别限制,可以列举例如:乙酸、丙酸、丁酸、戊酸、己酸、辛酸、月桂酸、十三酸、肉豆蔻酸、棕榈酸、硬脂酸、特戊酸和异丁酸等脂肪族一元羧酸;环己烷甲酸等脂环式一元羧酸;苯甲酸、甲基苯甲酸、α-萘甲酸、β-萘甲酸、甲基萘甲酸和苯基乙酸等芳香族一元羧酸等。本实施方式中,这些羧酸化合物可以单独使用一种,也可以组合使用两种以上。The above-mentioned monocarboxylic acid compound is not particularly limited, and examples thereof include acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, Aliphatic monocarboxylic acids such as pentanoic acid and isobutyric acid; aliphatic monocarboxylic acids such as cyclohexanecarboxylic acid; benzoic acid, methylbenzoic acid, alpha-naphthoic acid, beta-naphthoic acid, methylnaphthoic acid and phenyl Aromatic monocarboxylic acids such as acetic acid, etc. In this embodiment, these carboxylic acid compounds may be used alone or in combination of two or more.
作为上述二元羧酸化合物,没有特别限制,可以列举例如:由丙二酸、二甲基丙二酸、琥珀酸、戊二酸、己二酸、2-甲基己二酸、三甲基己二酸、庚二酸、2,2-二甲基戊二酸、3,3-二乙基琥珀酸、壬二酸、癸二酸和辛二酸等脂肪族二元羧酸;1,3-环戊烷二甲酸和1,4-环己烷二甲酸等脂环式二元羧酸;间苯二甲酸、2,6-萘二甲酸、2,7-萘二甲酸、1,4-萘二甲酸、1,4-亚苯基二氧二乙酸、1,3-亚苯基二氧二乙酸、联苯甲酸、二苯基甲烷-4,4’-二甲酸、二苯砜-4,4’-二甲酸和4,4’-联苯二甲酸等芳香族二元羧酸衍生的单元(unit)。这些化合物可以单独使用一种,也可以组合使用两种以上。The above-mentioned dicarboxylic acid compound is not particularly limited, and examples thereof include: malonic acid, dimethylmalonic acid, succinic acid, glutaric acid, adipic acid, 2-methyladipic acid, trimethyl Aliphatic dicarboxylic acids such as adipic acid, pimelic acid, 2,2-dimethylglutaric acid, 3,3-diethylsuccinic acid, azelaic acid, sebacic acid and suberic acid; 1, Alicyclic dicarboxylic acids such as 3-cyclopentane dicarboxylic acid and 1,4-cyclohexane dicarboxylic acid; isophthalic acid, 2,6-naphthalene dicarboxylic acid, 2,7-naphthalene dicarboxylic acid, 1,4 -Naphthalene dicarboxylic acid, 1,4-phenylenedioxydiacetic acid, 1,3-phenylenedioxydiacetic acid, diphenylcarboxylic acid, diphenylmethane-4,4'-dicarboxylic acid, diphenylsulfone- Units derived from aromatic dicarboxylic acids such as 4,4'-dicarboxylic acid and 4,4'-biphenyldicarboxylic acid. These compounds may be used alone or in combination of two or more.
(A)聚酰胺树脂的硫酸相对粘度优选为1.0~6.0,更优选1.5~5.0,进一步优选2.0~4.0。通过硫酸相对粘度在上述范围内,具有流动性与机械强度的平衡更加优良的倾向。另外,硫酸相对粘度可以通过实施例中记载的方法测定。(A) The sulfuric acid relative viscosity of the polyamide resin is preferably 1.0 to 6.0, more preferably 1.5 to 5.0, still more preferably 2.0 to 4.0. When the relative viscosity of sulfuric acid is within the above range, the balance between fluidity and mechanical strength tends to be more excellent. In addition, the relative viscosity of sulfuric acid can be measured by the method described in the Examples.
本实施方式中,聚酰胺树脂组合物中聚酰胺树脂的含量相对于聚酰胺树脂组合物100质量%优选为25~84质量%,更优选为35~74质量%,进一步优选为40~74质量%。通过含量在上述范围内,具有聚酰胺树脂组合物的流动性以及所得到的成形体的机械强度和外观更加优良的倾向。In this embodiment, the content of the polyamide resin in the polyamide resin composition is preferably 25 to 84% by mass, more preferably 35 to 74% by mass, and even more preferably 40 to 74% by mass relative to 100% by mass of the polyamide resin composition. %. When the content is within the above range, the fluidity of the polyamide resin composition and the mechanical strength and appearance of the molded article obtained tend to be more excellent.
[(B)玻璃纤维][(B) glass fiber]
本实施方式的聚酰胺树脂组合物含有数均纤维直径为5μm以上的(B)玻璃纤维。(B)玻璃纤维的数均纤维直径为5μm以上,优选7μm以上。通过(B)玻璃纤维的数均纤维直径为5μm以上,可以进一步提高聚酰胺树脂组合物的机械强度、刚性。另外,(B)玻璃纤维的数均纤维直径优选为25μm以下,更优选20μm以下。通过将数均纤维直径设定在上述范围内,具有可以在以高水平保持由聚酰胺树脂组合物得到的成形体的机械强度、刚性的同时更进一步提高外观等的倾向。The polyamide resin composition of this embodiment contains (B) glass fiber whose number average fiber diameter is 5 micrometers or more. (B) The glass fiber has a number average fiber diameter of 5 μm or more, preferably 7 μm or more. When the number average fiber diameter of (B) glass fiber is 5 micrometers or more, the mechanical strength and rigidity of a polyamide resin composition can be improved further. In addition, the number average fiber diameter of (B) glass fiber is preferably 25 μm or less, more preferably 20 μm or less. By setting the number-average fiber diameter within the above-mentioned range, there is a tendency that the appearance and the like can be further improved while maintaining the mechanical strength and rigidity of the molded article obtained from the polyamide resin composition at a high level.
(B)玻璃纤维的数均纤维直径可以通过实施例中记载的方法测定。(B) The number average fiber diameter of a glass fiber can be measured by the method described in an Example.
(B)玻璃纤维可以利用硅烷偶联剂等表面处理剂进行表面处理。作为硅烷偶联剂,没有特别限制,可以列举例如:γ-氨基丙基三乙氧基硅烷、γ-氨基丙基三甲氧基硅烷、N-β-(氨基乙基)-γ-氨基丙基甲基二甲氧基硅烷等氨基硅烷类;γ-巯基丙基三甲氧基硅、γ-巯基丙基三乙氧基硅烷等巯基硅烷类;环氧硅烷类;乙烯基硅烷类。其中,更优选上述氨基硅烷类。上述表面处理剂可以单独使用一种,也可以两种以上组合使用。(B) Glass fiber can be surface-treated with a surface treatment agent such as a silane coupling agent. The silane coupling agent is not particularly limited, and examples include: γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, N-β-(aminoethyl)-γ-aminopropyl Aminosilanes such as methyldimethoxysilane; mercaptosilanes such as γ-mercaptopropyltrimethoxysilane and γ-mercaptopropyltriethoxysilane; epoxysilanes; vinylsilanes. Among them, the above-mentioned aminosilanes are more preferable. The above-mentioned surface treatment agents may be used alone or in combination of two or more.
另外,(B)玻璃纤维优选利用集束剂进行处理。作为这样的集束剂,没有特别限制,可以列举例如:含有含羧酸酐不饱和乙烯基单体和除该含羧酸酐不饱和乙烯基单体以外的不饱和乙烯基单体作为构成单元的共聚物、环氧化合物、聚氨酯树脂、丙烯酸的均聚物、丙烯酸与其它可共聚单体的共聚物、以及丙烯酸的均聚物或共聚物与伯胺、仲胺及叔胺的盐等。这些物质可以单独使用一种,也可以两种以上组合使用。其中,优选含有含羧酸酐不饱和乙烯基单体和除该含羧酸酐不饱和乙烯基单体以外的不饱和乙烯基单体作为构成单元的共聚物、环氧化合物或聚氨酯树脂、或者它们的组合,更优选含有含羧酸酐不饱和乙烯基单体和除该含羧酸酐不饱和乙烯基单体以外的不饱和乙烯基单体作为构成单元的共聚物或聚氨酯树脂、或者它们的组合。通过使用利用这样的集束剂处理后的(B)玻璃纤维,具有由聚酰胺树脂组合物得到的成形体的机械强度更加优良的倾向。In addition, (B) glass fibers are preferably treated with a sizing agent. Such a sizing agent is not particularly limited, and for example, a copolymer containing a carboxylic anhydride-containing unsaturated vinyl monomer and an unsaturated vinyl monomer other than the carboxylic anhydride-containing unsaturated vinyl monomer as constituent units , epoxy compounds, polyurethane resins, homopolymers of acrylic acid, copolymers of acrylic acid and other copolymerizable monomers, and salts of homopolymers or copolymers of acrylic acid and primary, secondary and tertiary amines. These substances may be used alone or in combination of two or more. Among them, a copolymer containing a carboxylic acid anhydride-containing unsaturated vinyl monomer and an unsaturated vinyl monomer other than the carboxylic anhydride-containing unsaturated vinyl monomer as a constituent unit, an epoxy compound or a polyurethane resin, or a combination thereof is preferable. The combination is more preferably a copolymer or a polyurethane resin containing a carboxylic anhydride-containing unsaturated vinyl monomer and an unsaturated vinyl monomer other than the carboxylic anhydride-containing unsaturated vinyl monomer as constituent units, or a combination thereof. By using (B) glass fibers treated with such a sizing agent, the mechanical strength of the molded article obtained from the polyamide resin composition tends to be more excellent.
作为上述含羧酸酐不饱和乙烯基单体,没有特别限制,可以列举例如:马来酸酐、衣康酸酐、柠康酸酐。其中,优选马来酸酐。It does not specifically limit as said carboxylic acid anhydride containing unsaturated vinyl monomer, For example, maleic anhydride, itaconic anhydride, citraconic anhydride are mentioned. Among them, maleic anhydride is preferred.
作为上述除含羧酸酐不饱和乙烯基单体以外的不饱和乙烯基单体,只要是与上述含羧酸酐不饱和乙烯基单体不同的不饱和乙烯基单体则没有特别限制,可以列举例如:苯乙烯、α-甲基苯乙烯、乙烯、丙烯、丁二烯、异戊二烯、氯丁二烯、2,3-二氯丁二烯、1,3-戊二烯、环辛二烯、甲基丙烯酸甲酯、丙烯酸甲酯、丙烯酸乙酯、甲基丙烯酸乙酯。其中,优选苯乙烯、丁二烯。The above-mentioned unsaturated vinyl monomer other than the carboxylic anhydride-containing unsaturated vinyl monomer is not particularly limited as long as it is an unsaturated vinyl monomer different from the above-mentioned carboxylic anhydride-containing unsaturated vinyl monomer, and examples thereof include : Styrene, α-methylstyrene, ethylene, propylene, butadiene, isoprene, chloroprene, 2,3-dichlorobutadiene, 1,3-pentadiene, cyclooctadiene alkene, methyl methacrylate, methyl acrylate, ethyl acrylate, ethyl methacrylate. Among them, styrene and butadiene are preferable.
含羧酸酐不饱和乙烯基单体与除该含羧酸酐不饱和乙烯基单体以外的不饱和乙烯基单体的组合中,更优选马来酸酐与丁二烯的共聚物、马来酸酐与乙烯的共聚物、马来酸酐与苯乙烯的共聚物、以及它们的混合物。Among the combinations of unsaturated vinyl monomers containing carboxylic anhydride and unsaturated vinyl monomers other than the unsaturated vinyl monomers containing carboxylic anhydride, copolymers of maleic anhydride and butadiene, maleic anhydride and Copolymers of ethylene, copolymers of maleic anhydride and styrene, and mixtures thereof.
另外,含羧酸酐不饱和乙烯基单体与除该含羧酸酐不饱和乙烯基单体以外的不饱和乙烯基单体的共聚物的重均分子量优选2000以上,更优选2000~1000000,进一步优选5000~500000。通过重均分子量在上述范围内,具有玻璃纤维增强聚酰胺树脂组合物的流动性进一步提高的倾向。另外,本说明书中的重均分子量为利用凝胶渗透色谱法(GPC)测定的值。In addition, the weight-average molecular weight of the copolymer of unsaturated vinyl monomers containing carboxylic anhydride-containing unsaturated vinyl monomers and unsaturated vinyl monomers other than the unsaturated vinyl monomers containing carboxylic acid anhydrides is preferably 2,000 or more, more preferably 2,000 to 1,000,000, and even more preferably 5000~500000. When the weight average molecular weight is within the above range, the fluidity of the glass fiber-reinforced polyamide resin composition tends to be further improved. In addition, the weight average molecular weight in this specification is the value measured by the gel permeation chromatography (GPC).
作为上述环氧化合物,没有特别限制,可以列举例如:环氧乙烷、环氧丙烷、氧化丁烯、氧化戊烯、氧化己烯、氧化庚烯、氧化辛烯、氧化壬烯、氧化癸烯、氧化十一烯、氧化十二烯、氧化十五烯以及氧化二十烯等脂肪族环氧化合物;缩水甘油、环氧戊醇、1-氯-3,4-环氧丁烷、1-氯-2-甲基-3,4-环氧丁烷、1,4-二氯-2,3-环氧丁烷、氧化环戊烯、氧化环己烯、氧化环庚烯、氧化环辛烯、氧化甲基环己烯、氧化乙烯基环己烯以及环氧化环己烯甲醇等脂环族环氧化合物;蒎烯氧化物等萜烯类环氧化合物;氧化苯乙烯、氧化对氯苯乙烯以及氧化间氯苯乙烯等芳香族环氧化合物;环氧化大豆油;以及环氧化亚麻油。The epoxy compound is not particularly limited, and examples thereof include ethylene oxide, propylene oxide, butylene oxide, pentene oxide, hexene oxide, heptene oxide, octene oxide, nonene oxide, and decylene oxide. , undecene oxide, dodecene oxide, pentacene oxide and eicosene oxide and other aliphatic epoxy compounds; glycidol, epoxy amyl alcohol, 1-chloro-3,4-epoxybutane, 1- Chloro-2-methyl-3,4-epoxybutane, 1,4-dichloro-2,3-epoxybutane, cyclopentene oxide, cyclohexene oxide, cycloheptene oxide, cyclooctyl oxide Cycloaliphatic epoxy compounds such as alkene, methylcyclohexene oxide, vinylcyclohexene oxide, and epoxidized cyclohexene methanol; terpene epoxy compounds such as pinene oxide; styrene oxide, p-chlorine oxide Aromatic epoxy compounds such as styrene and m-chlorostyrene oxide; epoxidized soybean oil; and epoxidized linseed oil.
作为上述聚氨酯树脂,只要是一般作为(B)玻璃纤维的集束剂使用的聚氨酯树脂则没有特别限制,可以优选使用例如:由间苯二亚甲基二异氰酸酯(XDI)、4,4’-亚甲基双(环己基异氰酸酯)(HMDI)或异佛尔酮二异氰酸酯(IPDI)等异氰酸酯与聚酯型或聚醚型二元醇合成的聚氨酯树脂。The above-mentioned polyurethane resin is not particularly limited as long as it is generally used as a sizing agent for (B) glass fibers, and can be preferably used. Polyurethane resin synthesized from isocyanate such as methyl bis(cyclohexyl isocyanate) (HMDI) or isophorone diisocyanate (IPDI) and polyester or polyether diol.
上述丙烯酸的均聚物的重均分子量优选为1000~90000,更优选1000~25000。The weight average molecular weight of the homopolymer of the said acrylic acid becomes like this. Preferably it is 1,000-90,000, More preferably, it is 1,000-25,000.
作为构成丙烯酸与其它可共聚单体的共聚物的可共聚单体,没有特别限制,可以列举例如:具有羟基和/或羧基的单体、酯类单体。作为这样的可共聚单体,没有特别限制,可以列举例如:选自由丙烯酸、马来酸、甲基丙烯酸、乙酸乙烯酯、巴豆酸、异巴豆酸、富马酸、衣康酸、柠康酸、中康酸以及它们的酯化合物组成的组中的一种以上(其中,不包括仅仅丙烯酸的情况)。优选具有一种以上上述单体中的酯类单体。The copolymerizable monomer constituting the copolymer of acrylic acid and other copolymerizable monomers is not particularly limited, and examples thereof include monomers having a hydroxyl group and/or carboxyl group, and ester monomers. Such a copolymerizable monomer is not particularly limited, and examples thereof include: , mesaconic acid and their ester compounds consisting of one or more species (except for acrylic acid alone). It is preferable to have one or more ester monomers among the above-mentioned monomers.
作为构成丙烯酸的均聚物和/或共聚物与伯胺、仲胺及叔胺的盐的胺,没有特别限制,可以列举例如:三乙胺、三乙醇胺、甘氨酸等。从提高与其它并用的化学试剂(硅烷偶联剂等)的混合溶液的稳定性、减少胺臭的观点考虑,中和度优选为20~90%,更优选40~60%。The amine constituting the salt of a homopolymer and/or copolymer of acrylic acid and a primary, secondary, or tertiary amine is not particularly limited, and examples thereof include triethylamine, triethanolamine, and glycine. The degree of neutralization is preferably 20 to 90%, more preferably 40 to 60%, from the viewpoint of improving the stability of a mixed solution with other chemical reagents (silane coupling agent, etc.) used in combination and reducing amine odor.
形成盐的丙烯酸的均聚物或共聚物的重均分子量没有特别限制,优选为3000~50000。通过重均分子量为3000以上,具有(B)玻璃纤维的集束性进一步提高的倾向。另外,通过重均分子量为50000以下,具有由聚酰胺树脂组合物得到的成形体的机械特性进一步提高的倾向。Although the weight average molecular weight of the homopolymer or copolymer of the acrylic acid which forms a salt is not specifically limited, Preferably it is 3000-50000. When the weight average molecular weight is 3000 or more, there exists a tendency for the bundling property of (B) glass fiber to improve more. In addition, when the weight average molecular weight is 50,000 or less, there is a tendency that the mechanical properties of the molded article obtained from the polyamide resin composition are further improved.
作为(B)玻璃纤维的处理方法,没有特别限制,例如,可以通过在公知的玻璃纤维的制造工序中,使用辊型涂布器等公知的方法将上述集束剂施加到玻璃纤维上而制造纤维束,并将制造的纤维束干燥,由此连续地进行反应而得到。The treatment method of (B) glass fiber is not particularly limited. For example, the above-mentioned sizing agent can be applied to the glass fiber by a known method such as a roll coater in a known glass fiber production process. bundles, and drying the manufactured fiber bundles, thereby continuously reacting to obtain.
另外,(B)玻璃纤维的状态没有特别限制,可以将上述纤维束以粗纱的形式直接使用,也可以再经切断工序,以短切玻璃原丝的形式使用。另外,纤维束的干燥可以在切断工序后进行,或者可以将纤维束干燥后进行切断。In addition, the state of the (B) glass fiber is not particularly limited, and the above-mentioned fiber bundle may be used directly as a roving, or may be used as chopped glass strands after a cutting process. In addition, the fiber bundle may be dried after the cutting step, or may be cut after drying the fiber bundle.
所述表面处理剂和/或集束剂的添加量相对于(B)玻璃纤维的100质量%以固相分数计优选为0.2~3质量%,更优选0.3~2质量%,进一步优选0.3~1质量%。通过集束剂的添加量为0.2质量%以上,具有可以进一步保持玻璃纤维的集束的倾向。另一方面,通过集束剂的添加剂为3质量%以下,具有可以进一步提高聚酰胺树脂组合物的热稳定性的倾向。The added amount of the surface treatment agent and/or sizing agent is preferably 0.2 to 3% by mass, more preferably 0.3 to 2% by mass, more preferably 0.3 to 1 quality%. When the added amount of the sizing agent is 0.2% by mass or more, it tends to be possible to further maintain the sizing of the glass fibers. On the other hand, when the additive of the sizing agent is 3% by mass or less, the thermal stability of the polyamide resin composition tends to be further improved.
本实施方式中,聚酰胺树脂组合物中的(B)玻璃纤维的含量相对于聚酰胺树脂组合物100质量%优选为15~74质量%,更优选25~64质量%。通过(B)玻璃纤维的含量在上述范围内,可以进一步提高聚酰胺树脂组合物的流动性、所得到的成形体的机械强度、刚性、尺寸精度和外观。In the present embodiment, the content of (B) glass fibers in the polyamide resin composition is preferably 15 to 74 mass %, more preferably 25 to 64 mass %, based on 100 mass % of the polyamide resin composition. When the content of (B) glass fibers is within the above range, the fluidity of the polyamide resin composition and the mechanical strength, rigidity, dimensional accuracy and appearance of the molded article obtained can be further improved.
[(C)非纤维状填充材料][(C) Non-fibrous filler material]
本实施方式中,聚酰胺树脂组合物含有数均粒径3μm以上的(C)非纤维状填充材料。(C)非纤维状填充材料的数均粒径为3μm以上,优选4μm以上,更优选5μm以上,进一步优选7μm以上。通过(C)非纤维状填充材料的数均粒径为3μm以上,可以在能够进一步提高由聚酰胺树脂组合物得到的成形体的机械强度、刚性的同时进一步提高所得到的成形体的尺寸精度。另外,(C)非纤维状填充材料的数均粒径优选为50μm以下,更优选30μm以下,进一步优选20μm以下。通过数均粒径在上述范围内,可以在以高水平保持由聚酰胺树脂组合物得到的成形体的机械强度、刚性的同时进一步提高所得到的成形体的尺寸精度、外观等。另外,“纤维状”是指例如将纤维切断而制作的形状,“非纤维状”是指例如纤维状以外的形状。In the present embodiment, the polyamide resin composition contains (C) a non-fibrous filler having a number average particle diameter of 3 μm or more. (C) The number average particle diameter of the non-fibrous filler is 3 μm or more, preferably 4 μm or more, more preferably 5 μm or more, further preferably 7 μm or more. (C) When the number average particle diameter of the non-fibrous filler is 3 μm or more, the mechanical strength and rigidity of the molded article obtained from the polyamide resin composition can be further improved, and the dimensional accuracy of the molded article obtained can be further improved. . In addition, the number average particle diameter of the (C) non-fibrous filler is preferably 50 μm or less, more preferably 30 μm or less, further preferably 20 μm or less. When the number average particle diameter is within the above range, the dimensional accuracy, appearance, etc. of the molded article obtained from the polyamide resin composition can be further improved while maintaining the mechanical strength and rigidity of the molded article obtained from the polyamide resin composition at a high level. In addition, "fibrous" means, for example, a shape produced by cutting fibers, and "non-fibrous" means, for example, a shape other than fibrous.
(C)非纤维状填充材料的数均粒径可以通过实施例中记载的方法测定。(C) The number average particle diameter of the non-fibrous filler can be measured by the method described in the examples.
作为(C)非纤维状填充材料,没有特别限制,可以列举例如:玻璃鳞片、滑石、高岭土、云母、水滑石、碳酸钙、碳酸锌、氧化锌、磷酸一氢钙、硅灰石、二氧化硅、沸石、氧化铝、勃姆石、氢氧化铝、氧化钛、氧化硅、氧化镁、硅酸钙、铝硅酸钠、硅酸镁、科琴炭黑、乙炔黑、炉黑、石墨、黄铜、铜、银、铝、镍、铁、氟化钙、粘土和磷灰石。(C) The non-fibrous filler is not particularly limited, and examples thereof include glass flakes, talc, kaolin, mica, hydrotalcite, calcium carbonate, zinc carbonate, zinc oxide, calcium monohydrogen phosphate, wollastonite, Silicon, zeolite, alumina, boehmite, aluminum hydroxide, titanium oxide, silicon oxide, magnesium oxide, calcium silicate, sodium aluminosilicate, magnesium silicate, Ketjen black, acetylene black, furnace black, graphite, Brass, copper, silver, aluminum, nickel, iron, calcium fluoride, clay, and apatite.
其中,优选玻璃鳞片、滑石、高岭土、云母、碳酸钙、粘土及氮化硅,更优选玻璃鳞片、滑石、云母、高岭土、碳酸钙和粘土。上述(C)非纤维状填充材料可以单独使用一种,也可以两种以上组合使用。通过使用这样的(C)非纤维状填充材料,具有由聚酰胺树脂组合物得到的成形体的尺寸精度和外观更加优良的倾向。Among them, glass flake, talc, kaolin, mica, calcium carbonate, clay, and silicon nitride are preferable, and glass flake, talc, mica, kaolin, calcium carbonate, and clay are more preferable. The aforementioned (C) non-fibrous fillers may be used alone or in combination of two or more. By using such a (C) non-fibrous filler, there exists a tendency for the dimensional accuracy and appearance of the molded object obtained from a polyamide resin composition to become more excellent.
上述(C)非纤维状填充材料可以利用硅烷偶联剂等进行表面处理。作为上述硅烷偶联剂,没有特别限制,可以列举例如:γ-氨基丙基三乙氧基硅烷、γ-氨基丙基三甲氧基硅烷、N-β-(氨基乙基)-γ-氨基丙基甲基二甲氧基硅烷等氨基硅烷类;γ-巯基丙基三甲氧基硅、γ-巯基丙基三乙氧基硅烷等巯基硅烷类;环氧硅烷类;乙烯基硅烷类。其中,更优选氨基硅烷类。上述表面处理剂可以单独使用一种,也可以两种以上组合使用。The above (C) non-fibrous filler may be surface-treated with a silane coupling agent or the like. The above-mentioned silane coupling agent is not particularly limited, and examples thereof include: γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, N-β-(aminoethyl)-γ-aminopropyl Aminosilanes such as methyldimethoxysilane; mercaptosilanes such as γ-mercaptopropyltrimethoxysilane and γ-mercaptopropyltriethoxysilane; epoxysilanes; vinylsilanes. Among them, aminosilanes are more preferable. The above-mentioned surface treatment agents may be used alone or in combination of two or more.
本实施方式中,聚酰胺树脂组合物中(C)非纤维状填充材料的含量相对于聚酰胺树脂组合物100质量%优选为1~20质量%,更优选1~10质量%,进一步优选2~8质量%。通过(C)非纤维状填充材料的含量在上述范围内,具有由聚酰胺树脂组合物得到的成形体的机械强度、刚性、尺寸精度和外观更加优良的倾向。In this embodiment, the content of the (C) non-fibrous filler in the polyamide resin composition is preferably 1 to 20% by mass, more preferably 1 to 10% by mass, and even more preferably 2% to 100% by mass of the polyamide resin composition. ~8% by mass. When the content of the (C) non-fibrous filler is within the above range, the molded article obtained from the polyamide resin composition tends to be more excellent in mechanical strength, rigidity, dimensional accuracy, and appearance.
本实施方式中,(B)玻璃纤维的数均纤维直径x(μm)与(C)非纤维状填充材料的数均粒径y(μm)满足下式(1)的关系。由此,成形体表面的凹凸变小,结果,由聚酰胺树脂组合物得到的成形体的尺寸精度和外观更加优良。In the present embodiment, the number average fiber diameter x (μm) of (B) glass fiber and the number average particle size y (μm) of (C) non-fibrous filler satisfy the relationship of the following formula (1). As a result, the unevenness on the surface of the molded article becomes smaller, and as a result, the molded article obtained from the polyamide resin composition is more excellent in dimensional accuracy and appearance.
0.8x+y≥11……(1)。0.8x+y≥11...(1).
“0.8x+y”的值小于11时,具有所得到的成形体的各向异性增大或者翘曲量增大、或者尺寸精度下降,并且外观也下降的倾向。另一方面,“0.8x+y”的值为11以上,优选11以上且30以下,更优选14以上且26以下,进一步优选17以上且26以下。通过“0.8x+y”的值在上述范围内,不仅所得到的成形体的尺寸精度和外观更加优良,而且可以以高水平保持成形体的机械强度。When the value of "0.8x+y" is less than 11, the obtained molded article tends to have increased anisotropy, increased warpage, decreased dimensional accuracy, and also decreased appearance. On the other hand, the value of "0.8x+y" is 11 or more, preferably 11 or more and 30 or less, more preferably 14 or more and 26 or less, still more preferably 17 or more and 26 or less. When the value of "0.8x+y" is within the above range, not only the dimensional accuracy and appearance of the obtained molded body are more excellent, but also the mechanical strength of the molded body can be maintained at a high level.
[(D)铜盐、碱金属的卤化物和/或碱土金属的卤化物][(D) Copper salts, halides of alkali metals and/or halides of alkaline earth metals]
本实施方式的聚酰胺树脂组合物可以还含有铜盐、碱金属的卤化物和/或碱土金属的卤化物(以下简称为“卤化物”)、或者包含铜盐与卤化物的混合物。The polyamide resin composition of the present embodiment may further contain a copper salt, an alkali metal halide and/or an alkaline earth metal halide (hereinafter simply referred to as a "halide"), or a mixture of a copper salt and a halide.
<铜盐><copper salt>
作为上述铜盐,没有特别限制,可以列举例如:卤化铜(碘化铜、溴化亚铜、溴化铜、氯化亚铜等)、醋酸铜、丙酸铜、苯甲酸铜、己二酸铜、对苯二甲酸铜、间苯二甲酸铜、水杨酸铜、烟酸铜及硬脂酸铜,以及乙二胺及乙二胺四乙酸等螯合剂与铜配位而形成的铜络盐。这些物质可以单独使用一种,也可以两种以上组合使用。The above-mentioned copper salt is not particularly limited, and examples include copper halides (copper iodide, cuprous bromide, copper bromide, cuprous chloride, etc.), copper acetate, copper propionate, copper benzoate, adipic acid Copper, copper terephthalate, copper isophthalate, copper salicylate, copper nicotinate and copper stearate, and copper complex formed by coordination of chelating agents such as ethylenediamine and ethylenediaminetetraacetic acid with copper Salt. These substances may be used alone or in combination of two or more.
上述列举的铜盐中,优选为选自由碘化铜、溴化亚铜、溴化铜、氯化亚铜和醋酸铜组成的组中的一种以上,更优选碘化铜和/或醋酸铜。通过使用上述铜盐,具有可以得到耐热老化性优良,并且可以抑制挤出时的螺杆或料筒部的金属腐蚀(以下简称为“金属腐蚀”)的聚酰胺树脂组合物的倾向。Among the copper salts listed above, preferably one or more selected from the group consisting of copper iodide, cuprous bromide, copper bromide, cuprous chloride and copper acetate, more preferably copper iodide and/or copper acetate . Use of the above-mentioned copper salt tends to provide a polyamide resin composition that is excellent in heat aging resistance and can suppress metal corrosion of the screw or barrel portion during extrusion (hereinafter simply referred to as "metal corrosion").
使用铜盐的情况下,聚酰胺组合物中铜盐的含量相对于聚酰胺树脂组合物100质量%优选为0.01~0.2质量%,更优选0.01~0.1质量%。通过铜盐的含量在上述范围内,具有可以进一步提高聚酰胺树脂组合物的耐热老化性并且可以抑制铜的析出和金属腐蚀的倾向。When a copper salt is used, the content of the copper salt in the polyamide composition is preferably 0.01 to 0.2 mass%, more preferably 0.01 to 0.1 mass%, based on 100 mass% of the polyamide resin composition. When the content of the copper salt is within the above-mentioned range, the thermal aging resistance of the polyamide resin composition can be further improved, and copper precipitation and metal corrosion tend to be suppressed.
另外,相对于聚酰胺组合物总量,铜元素的含有浓度优选为20~1000ppm,更优选30~500ppm,进一步优选50~300ppm。通过铜元素的含有浓度在上述范围内,具有可以进一步提高聚酰胺树脂组合物的耐热老化性并且可以抑制铜的析出和金属腐蚀的倾向。In addition, the content concentration of the copper element is preferably 20 to 1000 ppm, more preferably 30 to 500 ppm, and still more preferably 50 to 300 ppm based on the total amount of the polyamide composition. When the content concentration of the copper element is within the above-mentioned range, the thermal aging resistance of the polyamide resin composition can be further improved, and the precipitation of copper and metal corrosion tend to be suppressed.
<碱金属的卤化物和/或碱土金属的卤化物><Halides of alkali metals and/or halides of alkaline earth metals>
作为碱金属的卤化物和/或碱土金属的卤化物,没有特别限制,可以列举例如:碘化钾、溴化钾、氯化钾、碘化钠和氯化钠、以及它们的混合物。其中,优选碘化钾及溴化钾以及它们的混合物,更优选碘化钾。通过使用这样的卤化物,具有可以进一步提高聚酰胺树脂组合物的耐热老化性,可以进一步抑制金属腐蚀的倾向。另外,卤化物可以单独使用一种,也可以两种以上组合使用。The alkali metal halide and/or the alkaline earth metal halide is not particularly limited, and examples thereof include potassium iodide, potassium bromide, potassium chloride, sodium iodide, sodium chloride, and mixtures thereof. Among them, potassium iodide, potassium bromide, and mixtures thereof are preferred, and potassium iodide is more preferred. Use of such a halide tends to further improve the heat aging resistance of the polyamide resin composition and further suppress metal corrosion. In addition, one kind of halide may be used alone, or two or more kinds may be used in combination.
聚酰胺树脂组合物中碱金属和/或碱土金属的卤化物的含量相对于聚酰胺树脂组合物100质量%优选为0.05~5质量%,更优选0.05~2质量%,进一步优选0.05~1质量%。通过卤化物的含量在上述范围内,具有可以进一步提高聚酰胺树脂组合物的耐热老化性并且可以进一步抑制铜的析出和金属腐蚀的倾向。The content of alkali metal and/or alkaline earth metal halides in the polyamide resin composition is preferably 0.05 to 5% by mass, more preferably 0.05 to 2% by mass, and even more preferably 0.05 to 1% by mass relative to 100% by mass of the polyamide resin composition %. When the content of the halide is within the above range, the thermal aging resistance of the polyamide resin composition can be further improved, and the deposition of copper and metal corrosion tend to be further suppressed.
上述说明的铜盐、碱金属和/或碱土金属的卤化物的成分各自可以单独使用一种,也可以两种以上组合使用,其中,从耐热老化性的观点考虑,优选使用铜盐与碱金属和/或碱土金属的卤化物的混合物。The components of the copper salts, alkali metals, and/or alkaline earth metal halides described above may be used alone or in combination of two or more. Among them, copper salts and alkalis are preferably used from the viewpoint of heat aging resistance. Mixtures of halides of metals and/or alkaline earth metals.
混合物中的卤素与铜的摩尔比(卤素/铜)优选为2~50,更优选5~30,进一步优选5~20。通过摩尔比在上述范围内,具有可以进一步提高聚酰胺树脂组合物的耐热老化性的倾向。另外,在此所说的“卤素”,在使用卤化铜作为铜盐的情况下,是指来源于卤化铜的卤素与来源于碱金属及碱土金属的卤化物的卤素的合计。通过卤素与铜的摩尔比为2以上,具有可以进一步抑制铜的析出和金属腐蚀的倾向。另一方面,通过卤素与铜的摩尔比为50以下,具有可以进一步防止成形机的螺杆等的腐蚀而几乎不损害耐热性、韧性等机械物性的倾向。The molar ratio (halogen/copper) of the halogen to copper in the mixture is preferably 2-50, more preferably 5-30, still more preferably 5-20. When the molar ratio is within the above-mentioned range, there is a tendency that the heat aging resistance of the polyamide resin composition can be further improved. In addition, the "halogen" here refers to the total of the halogen derived from the copper halide and the halogen derived from the halides of alkali metals and alkaline earth metals when copper halide is used as the copper salt. When the molar ratio of the halogen to copper is 2 or more, the deposition of copper and the corrosion of metal tend to be further suppressed. On the other hand, when the molar ratio of the halogen to copper is 50 or less, it tends to be possible to further prevent corrosion of the screw of the molding machine, etc. without impairing mechanical properties such as heat resistance and toughness.
聚酰胺树脂组合物中铜盐与碱金属和/或碱土金属的卤化物的混合物的含量相对于聚酰胺树脂组合物100质量%优选为0.01~1质量%,更优选0.05~1质量%。通过含量在上述范围内,具有可以进一步提高聚酰胺树脂组合物的耐热老化性的倾向。The content of the mixture of copper salt and alkali metal and/or alkaline earth metal halide in the polyamide resin composition is preferably 0.01 to 1% by mass, more preferably 0.05 to 1% by mass based on 100% by mass of the polyamide resin composition. When the content is within the above range, the heat aging resistance of the polyamide resin composition tends to be further improved.
[(E)氮化硼和/或炭黑][(E) boron nitride and/or carbon black]
本实施方式的聚酰胺树脂组合物可以还含有氮化硼和/或炭黑。通过含有氮化硼、炭黑,具有可以提高聚酰胺树脂(A)的结晶速度、提高聚酰胺树脂组合物的成形时的脱模性,或者可以缩短注射成形的冷却时间的倾向。The polyamide resin composition of this embodiment may further contain boron nitride and/or carbon black. By containing boron nitride and carbon black, there is a tendency that the crystallization rate of the polyamide resin (A) can be increased, the releasability of the polyamide resin composition during molding can be improved, or the cooling time of injection molding can be shortened.
聚酰胺树脂组合物中氮化硼和/或炭黑的含量相对于聚酰胺树脂组合物100质量%优选为0.01~1质量%,更优选0.03~0.8质量%,进一步优选0.05~0.6质量%。通过含量在上述范围内,具有可以进一步提高聚酰胺树脂组合物的成形性而不损害由聚酰胺树脂组合物得到的成形体的机械强度的倾向。The content of boron nitride and/or carbon black in the polyamide resin composition is preferably 0.01 to 1% by mass, more preferably 0.03 to 0.8% by mass, and even more preferably 0.05 to 0.6% by mass relative to 100% by mass of the polyamide resin composition. When the content is within the above range, the moldability of the polyamide resin composition tends to be further improved without impairing the mechanical strength of a molded article obtained from the polyamide resin composition.
作为氮化硼,一次粒子的形状等没有限制,可以使用公知的氮化硼。氮化硼的平均一次粒径没有特别限制,优选1~20μm,更优选3~20μm。As boron nitride, the shape of the primary particles is not limited, and known boron nitride can be used. The average primary particle size of boron nitride is not particularly limited, but is preferably 1 to 20 μm, more preferably 3 to 20 μm.
作为炭黑,没有特别限制,可以使用公知的炭黑。作为炭黑的平均一次粒径,没有特别限制,优选10~100nm,更优选10~50nm,进一步优选10~20nm。通过平均一次粒径在上述范围内,具有可以进一步提高聚酰胺树脂组合物的成形性而不损害由聚酰胺树脂组合物得到的成形体的机械强度的倾向。另外,炭黑的平均一次粒径可以通过透射型电子显微镜测定。The carbon black is not particularly limited, and known carbon blacks can be used. The average primary particle diameter of carbon black is not particularly limited, but is preferably 10 to 100 nm, more preferably 10 to 50 nm, and still more preferably 10 to 20 nm. When the average primary particle diameter is within the above range, the formability of the polyamide resin composition tends to be further improved without impairing the mechanical strength of a molded article obtained from the polyamide resin composition. In addition, the average primary particle diameter of carbon black can be measured with a transmission electron microscope.
[聚酰胺树脂组合物中可以含有的其它成分][Other components that may be contained in the polyamide resin composition]
除了上述成分以外,在不损害本实施方式的效果的范围内,根据需要可以进一步添加其它成分。作为这样的其它成分,没有特别限制,可以添加例如:酚类热稳定剂、含磷热稳定剂、胺类热稳定剂、含硫热稳定剂、紫外线吸收剂、光劣化防止剂、增塑剂、润滑剂、结晶成核剂、脱模剂、阻燃剂、着色剂、染色剂、颜料等,也可以混合其它热塑性树脂。在此,上述其它成分各自的性质差异大,因此对于各成分的适当含有率也是多种多样的。而且,本领域技术人员能够容易地设定上述其它成分各自的适当含有率。In addition to the above-mentioned components, other components may be further added as necessary within the range not impairing the effect of the present embodiment. Such other components are not particularly limited, and for example, phenolic heat stabilizers, phosphorus-containing heat stabilizers, amine-based heat stabilizers, sulfur-containing heat stabilizers, ultraviolet absorbers, photodegradation inhibitors, and plasticizers can be added. , Lubricants, crystal nucleating agents, mold release agents, flame retardants, colorants, dyes, pigments, etc., can also be mixed with other thermoplastic resins. Here, since the properties of each of the above-mentioned other components are largely different, the appropriate content rate of each component also varies. Furthermore, those skilled in the art can easily set the respective appropriate content rates of the above-mentioned other components.
[聚酰胺树脂组合物的制造方法][Manufacturing method of polyamide resin composition]
作为制造本实施方式的聚酰胺树脂组合物的方法,没有特别限制,可以使用通过单螺杆或多螺杆挤出机在使聚酰胺树脂熔融的状态下进行混炼的方法。优选使用例如:使用具有上游侧供料口和下游侧供料口的双螺杆挤出机,从上游侧供料口供给聚酰胺树脂、稳定剂并使其熔融后,从下游侧供料口供给玻璃纤维并进行熔融混炼的方法。另外,使用玻璃纤维的粗纱的情况下,也可以通过公知的方法进行复合。The method of producing the polyamide resin composition of the present embodiment is not particularly limited, and a method of kneading the polyamide resin in a molten state with a single-screw or multi-screw extruder can be used. For example, it is preferable to use a twin-screw extruder having an upstream feed port and a downstream feed port, supply the polyamide resin and the stabilizer from the upstream feed port and melt them, and then supply them from the downstream feed port. Glass fiber and melt kneading method. Moreover, when using the roving of glass fiber, it can also compound by a well-known method.
[聚酰胺树脂组合物的成形体][Molded article of polyamide resin composition]
本实施方式的成形体含有聚酰胺树脂组合物。聚酰胺树脂组合物没有特别限制,可以作为利用注射成形、吹塑成形、片材成形等得到的各种部件的成形体使用。其中,从得到真圆度优良的成形体的观点考虑,优选成形体具有圆筒形状部。另外,圆筒形状部优选包括强制取出的底切部。The molded article of this embodiment contains a polyamide resin composition. The polyamide resin composition is not particularly limited, and can be used as a molded product of various parts obtained by injection molding, blow molding, sheet molding, or the like. Among them, it is preferable that the molded body has a cylindrical portion from the viewpoint of obtaining a molded body having excellent roundness. In addition, the cylindrical shape portion preferably includes an undercut portion that is forcibly taken out.
这些各种部件没有特别限制,例如,可以适合作为汽车用、机械工业用、电气和电子用、产业材料用、工业材料用、日用以及家庭用品用来使用。These various parts are not particularly limited, and for example, they can be suitably used for automobiles, machinery industry, electric and electronic products, industrial materials, industrial materials, daily and household products.
由本实施方式的聚酰胺树脂组合物得到的成形体的尺寸精度、外观优良,因此可以适合用于进气歧管、中间冷却器进气管、排气管罩、内套管(インナーブッシュ)、轴承衬、引擎架、发动机缸顶盖、消声器、以及节流阀体、护链罩、节温器壳、排出管、散热器水箱、交流发电机以及送水管等汽车发动机室的部件等。The molded article obtained from the polyamide resin composition of this embodiment is excellent in dimensional accuracy and appearance, so it can be suitably used in intake manifolds, intercooler intake pipes, exhaust pipe covers, inner sleeves, bearings Lining, engine frame, engine cylinder head, muffler, and throttle body, chain guard, thermostat shell, discharge pipe, radiator tank, alternator, and water pipes, etc.
实施例Example
以下,通过实施例和比较例更具体地进行说明本实施方式,但是本实施方式不仅限于这些实施例。Hereinafter, although an Example and a comparative example demonstrate this embodiment more concretely, this embodiment is not limited to these Examples.
首先,实施例和比较例中使用的测定方法、评价方法、原料如下所述。First, the measurement methods, evaluation methods, and raw materials used in Examples and Comparative Examples are as follows.
[测定方法][test methods]
<聚酰胺树脂的硫酸相对粘度的测定方法><Measurement method of sulfuric acid relative viscosity of polyamide resin>
根据JIS-K6920测定聚酰胺树脂硫酸相对粘度。具体而言,使用98%硫酸,制作1%浓度的溶解液((聚酰胺树脂1g)/(98%硫酸100mL)的比例),在25℃的温度条件下测定硫酸相对粘度。The sulfuric acid relative viscosity of the polyamide resin was measured according to JIS-K6920. Specifically, 98% sulfuric acid was used to prepare a solution having a concentration of 1% (ratio of (1 g of polyamide resin)/(100 mL of 98% sulfuric acid)), and the relative viscosity of sulfuric acid was measured at a temperature of 25°C.
<聚酰胺树脂的氨基末端量以及羧基末端量的测定方法><Measuring method of amino terminal amount and carboxyl terminal amount of polyamide resin>
通过用0.1N盐酸滴定聚酰胺树脂的苯酚溶液测定聚酰胺树脂的氨基末端的数量(微摩尔/克)。另外,通过用0.1N氢氧化钠滴定聚酰胺树脂的苄醇溶液测定聚酰胺树脂的羧基末端的数量(微摩尔/克)。The amount (micromoles/g) of the amino terminals of the polyamide resin was determined by titrating a phenol solution of the polyamide resin with 0.1N hydrochloric acid. In addition, the number (micromoles/g) of carboxyl terminals of the polyamide resin was determined by titrating a benzyl alcohol solution of the polyamide resin with 0.1 N sodium hydroxide.
<玻璃纤维的强热失重的测定方法><Measuring method of thermal weight loss of glass fiber>
精确称量10g实施例和比较例中使用的玻璃纤维,利用650℃的电炉加热2小时进行焚烧处理,将质量减少量作为玻璃纤维的强热失重。10 g of the glass fibers used in Examples and Comparative Examples were accurately weighed, heated in an electric furnace at 650° C. for 2 hours for incineration treatment, and the amount of mass loss was taken as the intense thermal weight loss of the glass fibers.
<玻璃纤维的数均纤维直径的测定方法><Measuring method of number average fiber diameter of glass fiber>
将实施例和比较例中使用的玻璃纤维利用650℃的电炉加热2小时进行焚烧处理,从残渣成分中任选100根玻璃纤维,使用1000倍的倍率的SEM照片测定纤维直径,由此求出玻璃纤维的数均纤维直径。The glass fibers used in Examples and Comparative Examples were heated in an electric furnace at 650°C for 2 hours and incinerated, and 100 glass fibers were randomly selected from the residue components, and the fiber diameter was measured using a SEM photograph with a magnification of 1000 times, thereby obtaining Number average fiber diameter of glass fibers.
<非纤维状填充材料的数均粒径的测定方法><Measuring method of number average particle diameter of non-fibrous filler>
使实施例和比较例中使用的非纤维状填充材料分散到1%的肥皂水中,利用激光粒度计测定粒径分布,求出非纤维状填充材料的数均粒径。The non-fibrous fillers used in Examples and Comparative Examples were dispersed in 1% soapy water, and the particle size distribution was measured with a laser particle size analyzer to obtain the number average particle size of the non-fibrous fillers.
[评价方法][Evaluation method]
<拉伸强度><tensile strength>
使用注射成形机(PS-40E:日精树脂株式会社制造),根据ISO3167,将实施例和比较例中得到的聚酰胺树脂组合物的颗粒成形为多用途试验片A型的成形片。此时,注射和保压时间设定为25秒,冷却时间设定为15秒,模具温度设定为80℃,熔融树脂温度设定为290℃。使用所得到的多用途试验片(A型),根据ISO527以5mm/分钟的拉伸速度进行拉伸试验,测定拉伸强度。拉伸强度越高,则表示机械强度越优良。Using an injection molding machine (PS-40E: manufactured by Nissei Plastics Co., Ltd.), the pellets of the polyamide resin compositions obtained in Examples and Comparative Examples were molded into multipurpose test piece A-type molded pieces according to ISO3167. At this time, the injection and holding time were set to 25 seconds, the cooling time was set to 15 seconds, the mold temperature was set to 80°C, and the molten resin temperature was set to 290°C. Using the obtained multipurpose test piece (Type A), a tensile test was performed at a tensile speed of 5 mm/min according to ISO527 to measure tensile strength. The higher the tensile strength, the better the mechanical strength.
<夏比冲击强度><Charpy Impact Strength>
将由上述得到的多用途试验片(A型)切削为宽度10mm×长度80mm×厚度4mm,根据ISO179/1eA,进行带缺口夏比冲击试验,测定夏比冲击强度。夏比冲击强度越高,则表示耐冲击特性越优良。The multi-purpose test piece (type A) obtained above was cut into width 10 mm x length 80 mm x thickness 4 mm, and a notched Charpy impact test was performed according to ISO179/1eA to measure the Charpy impact strength. The higher the Charpy impact strength, the better the impact resistance.
<尺寸精度><Dimensional accuracy>
(各向异性)(anisotropy)
使用注射成形机(FN-3000:日精树脂株式会社制造),将实施例和比较例中得到的聚酰胺树脂组合物的颗粒成形为宽度100mm×长度100mm×厚度2mm的成形片。此时,注射和保压时间设定为10秒,冷却时间设定为15秒,模具温度设定为80℃,熔融树脂温度设定为290℃。将所得到的成形片在23℃、50%RH的状态下静置24小时后,分别测定MD方向(流动方向)和TD方向(与流动方向垂直的方向)的长度,计算成形收缩率(%)。成形收缩率通过(100mm-24小时后的成形片的尺寸)/100mm×100求出。然后,计算成形收缩率的MD/TD比。MD/TD比越接近1,则表示各向异性越小,尺寸精度越优良。Using an injection molding machine (FN-3000: manufactured by Nissei Plastics Co., Ltd.), the pellets of the polyamide resin compositions obtained in Examples and Comparative Examples were molded into a molded sheet having a width of 100 mm x a length of 100 mm x a thickness of 2 mm. At this time, the injection and holding time were set at 10 seconds, the cooling time was set at 15 seconds, the mold temperature was set at 80°C, and the molten resin temperature was set at 290°C. After the obtained molded sheet was left to stand at 23°C and 50% RH for 24 hours, the lengths in the MD direction (flow direction) and the TD direction (direction perpendicular to the flow direction) were measured respectively, and the molding shrinkage rate (% ). The molding shrinkage rate was determined by (100 mm-dimension of molded piece after 24 hours)/100 mm×100. Then, the MD/TD ratio of molding shrinkage was calculated. The closer the MD/TD ratio is to 1, the smaller the anisotropy and the better the dimensional accuracy.
(翘曲量)(warpage amount)
另外,准备与各向异性尺寸精度试验中使用的同样的成形片,将该成形片的任意角固定在平滑的台上,求出其对角的角从台浮起的高度作为翘曲量。翘曲量的测定分别对不同的两个对角的组合进行测定。将其平均值作为翘曲量。翘曲量越小,则表示尺寸精度越优良。In addition, the same molded piece as used in the anisotropic dimensional accuracy test was prepared, an arbitrary corner of the molded piece was fixed on a smooth table, and the height at which the diagonal corner rose from the table was obtained as the amount of warpage. The measurement of the warpage amount was measured for each combination of different two diagonal corners. Let the average value be the amount of warpage. The smaller the amount of warpage, the better the dimensional accuracy.
(真圆度)(roundness)
使用注射成形机(FN-3000:日精树脂株式会社制造),将实施例和比较例中得到的聚酰胺树脂组合物的颗粒成形为内径30mm×长度60mm×厚度1.5mm的圆筒形成形片。另外,作为模具,使用在成形片的圆筒部单端的外侧设置有浇口,在与浇口相反侧的端部配置有强制取出的底切部,在圆筒形状的外侧配置有强制取出用的突起的模具。注射和保压时间设定为20秒,冷却时间设定为15秒,模具温度设定为80℃,熔融树脂温度设定为290℃。将所得到的成形片在23℃、50%RH的状态下静置24小时后,沿与浇口的朝向相同的方向以及其垂直方向测定成形片的浇口相反侧的内径,计算出它们的比作为真圆度。真圆度越接近1,则表示尺寸精度越优良。Using an injection molding machine (FN-3000: manufactured by Nissei Plastics Co., Ltd.), the pellets of the polyamide resin compositions obtained in Examples and Comparative Examples were molded into cylindrical pellets with an inner diameter of 30 mm x a length of 60 mm x a thickness of 1.5 mm. In addition, as the mold, a gate is provided on the outer side of one end of the cylindrical part of the molded sheet, an undercut for forced extraction is arranged on the end opposite to the gate, and an undercut for forced extraction is arranged on the outer side of the cylindrical shape. of protruding stencils. The injection and holding time were set at 20 seconds, the cooling time was set at 15 seconds, the mold temperature was set at 80°C, and the molten resin temperature was set at 290°C. After leaving the obtained molded piece at 23° C. and 50% RH for 24 hours, measure the inner diameter of the molded piece opposite to the gate in the same direction as the direction of the gate and in the direction perpendicular to it, and calculate their Compared to true roundness. The closer the roundness is to 1, the better the dimensional accuracy.
<外观><Appearance>
观察上述真圆度的评价方法中使用的成形片的带有强制取出用的突起部的底部的外观。外观的评价以下述的基准进行。The appearance of the bottom portion with the protrusion for forced removal of the molded sheet used in the evaluation method of the above-mentioned roundness was observed. The evaluation of the appearance was performed on the basis of the following criteria.
+++:观察20个成形片,任何一个成形片均没有褶皱状的形态,外观良好+++: 20 formed pieces were observed, none of the formed pieces had a wrinkled shape, and the appearance was good
++:观察20个成形片,1个以上且5个以下的成形片观察到褶皱状的形态++: 20 molded pieces were observed, and a wrinkled form was observed in 1 or more and 5 or less molded pieces
+:观察20个成形片,超过5个成形片观察到褶皱状的形态+: 20 formed pieces were observed, and a wrinkled shape was observed in more than 5 formed pieces
[原料][raw material]
(1)聚酰胺树脂(1) Polyamide resin
1-1.聚酰胺610树脂(以下简称为“PA610”)1-1. Polyamide 610 resin (hereinafter referred to as "PA610")
C/N比:8C/N ratio: 8
98%硫酸相对粘度(ηr):2.598% sulfuric acid relative viscosity (ηr): 2.5
氨基末端量:42微摩尔/克N-terminal amount: 42 micromol/g
羧基末端量:65微摩尔/克Carboxyl terminal amount: 65 micromol/g
[氨基末端量/(氨基末端量+羧基末端量)]=0.39[Amount of amino terminal / (amount of amino terminal + amount of carboxyl terminal)] = 0.39
1-2.聚酰胺612树脂(以下简称为“PA612”)1-2. Polyamide 612 resin (hereinafter referred to as "PA612")
C/N比:9C/N ratio: 9
98%硫酸相对粘度(ηr):2.498% sulfuric acid relative viscosity (ηr): 2.4
氨基末端量:45微摩尔/克N-terminal amount: 45 micromol/g
羧基末端量:70微摩尔/克Carboxyl terminal amount: 70 micromol/g
[氨基末端量/(氨基末端量+羧基末端量)]=0.31[Amount of amino terminal/(Amount of amino terminal+Amount of carboxyl terminal)]=0.31
1-3.聚酰胺66树脂(以下简称为“PA66”)1-3. Polyamide 66 resin (hereinafter referred to as "PA66")
C/N比:6C/N ratio: 6
98%硫酸相对粘度(ηr):2.898% sulfuric acid relative viscosity (ηr): 2.8
氨基末端量:46微摩尔/克N-terminal amount: 46 micromol/g
羧基末端量:60微摩尔/克Carboxyl terminal amount: 60 micromol/g
[氨基末端量/(氨基末端量+羧基末端量)]=0.43[Amount of amino terminal/(Amount of amino terminal+Amount of carboxy terminal)]=0.43
(2)玻璃纤维(2) Glass fiber
2-1.通过包含马来酸酐与乙烯的共聚物和聚氨酯树脂的集束剂处理后的、平均纤维直径6μm的玻璃纤维(以下简称为“GF-1”)2-1. Glass fibers with an average fiber diameter of 6 μm treated with a sizing agent containing a copolymer of maleic anhydride and ethylene and a polyurethane resin (hereinafter referred to as "GF-1")
强热失重:0.42%Strong thermal weight loss: 0.42%
2-2.通过包含马来酸酐与乙烯的共聚物和聚氨酯树脂的集束剂处理后的、平均纤维直径8μm的玻璃纤维(以下简称为“GF-2”)2-2. Glass fibers with an average fiber diameter of 8 μm treated with a sizing agent containing a copolymer of maleic anhydride and ethylene and a polyurethane resin (hereinafter referred to as "GF-2")
强热失重:0.41%Strong thermal weight loss: 0.41%
2-3.通过包含马来酸酐与乙烯的共聚物和聚氨酯树脂的集束剂处理后的、平均纤维直径10μm的玻璃纤维(以下简称为“GF-3”)2-3. Glass fibers with an average fiber diameter of 10 μm treated with a sizing agent containing a copolymer of maleic anhydride and ethylene and a polyurethane resin (hereinafter referred to as "GF-3")
强热失重:0.43%Strong thermal weight loss: 0.43%
2-4.通过包含马来酸酐与乙烯的共聚物和聚氨酯树脂的集束剂处理后的、平均纤维直径13μm的玻璃纤维(以下简称为“GF-4”)2-4. Glass fibers with an average fiber diameter of 13 μm treated with a sizing agent containing a copolymer of maleic anhydride and ethylene and polyurethane resin (hereinafter referred to as "GF-4")
强热失重:0.42%Strong thermal weight loss: 0.42%
2-5.通过包含马来酸酐与乙烯的共聚物和聚氨酯树脂的集束剂处理后的、平均纤维直径17μm的玻璃纤维(以下简称为“GF-5”)2-5. Glass fibers with an average fiber diameter of 17 μm treated with a sizing agent containing a copolymer of maleic anhydride and ethylene and a polyurethane resin (hereinafter referred to as "GF-5")
强热失重:0.40%Strong thermal weight loss: 0.40%
2-6.通过包含聚氨酯树脂的集束剂处理后的、平均纤维直径10μm的玻璃纤维(以下简称为“GF-6”)2-6. Glass fibers with an average fiber diameter of 10 μm treated with a sizing agent containing polyurethane resin (hereinafter abbreviated as "GF-6")
强热失重:0.28%Strong thermal weight loss: 0.28%
(3)非纤维状填充材料(3) Non-fibrous filler material
3-1.平均粒径1.5μm的滑石(以下简称为“T-1”)3-1. Talc with an average particle diameter of 1.5 μm (hereinafter referred to as “T-1”)
3-2.平均粒径3.3μm的滑石(以下简称为“T-2”)3-2. Talc with an average particle diameter of 3.3 μm (hereinafter referred to as “T-2”)
3-3.平均粒径5.0μm的滑石(以下简称为“T-3”)3-3. Talc with an average particle diameter of 5.0 μm (hereinafter referred to as “T-3”)
3-4.平均粒径8.0μm的滑石(以下简称为“T-4”)3-4. Talc with an average particle diameter of 8.0 μm (hereinafter referred to as “T-4”)
3-5.平均粒径13μm的滑石(以下简称为“T-5”)3-5. Talc with an average particle diameter of 13 μm (hereinafter referred to as “T-5”)
3-6.平均粒径19μm的滑石(以下简称为“T-6”)3-6. Talc with an average particle diameter of 19 μm (hereinafter referred to as “T-6”)
(4)碘化铜(以下简称为“CuI”)(和光纯药工业公司制造)(4) Copper iodide (hereinafter referred to as "CuI") (manufactured by Wako Pure Chemical Industries, Ltd.)
(5)碘化钾(以下简称为“KI”)(和光纯药工业公司制造)(5) Potassium iodide (hereinafter referred to as "KI") (manufactured by Wako Pure Chemical Industries, Ltd.)
(6)炭黑(以下简称为“CB”)(6) Carbon black (hereinafter referred to as "CB")
商品名:三菱(注册商标)炭黑#980,平均粒径16nm(三菱化学公司制造)Product name: Mitsubishi (registered trademark) carbon black #980, average particle diameter 16nm (manufactured by Mitsubishi Chemical Corporation)
[实施例1~20、比较例1~4][Examples 1-20, Comparative Examples 1-4]
使用在从挤出机的上游侧起第一个料筒上具有上游侧供料口并且在第九个料筒上具有下游侧供料口的、L/D(挤出机的料筒的长度/挤出机的料筒直径)=48(料筒数:12)的双螺杆挤出机“ZSK-26MC:コベリオン公司制造(德国)”。在上述双螺杆挤出机中,从上游侧供料口到模头设定为290℃、螺杆转速设定为300rpm以及排出量设定为25kg/小时。在所述条件下,从上游侧供料口分别供给上述的聚酰胺树脂(PA)、非纤维状填充材料(T)、CuI、KI和CB,从下游侧供料口供给玻璃纤维(GF),以得到下表1的上部记载的比例。然后,通过将它们熔融混炼而制备聚酰胺树脂组合物的颗粒。进行干燥使得所得到的聚酰胺树脂组合物的颗粒的水分为800ppm以下后,在熔融树脂温度290℃、模具温度80℃下进行成形,评价拉伸强度、各向异性、翘曲量、真圆度以及外观。这些评价(计数)结果等如下表1所示。Use L/D (the length of the barrel of the extruder) having the upstream side feed port on the first barrel from the upstream side of the extruder and the downstream side feed port on the ninth barrel /Cylinder diameter of the extruder) = 48 (the number of barrels: 12) twin-screw extruder "ZSK-26MC: made by Kobelion (Germany)". In the above-mentioned twin-screw extruder, from the feed port on the upstream side to the die was set at 290° C., the screw rotation speed was set at 300 rpm, and the discharge amount was set at 25 kg/hour. Under the above conditions, the above-mentioned polyamide resin (PA), non-fibrous filler (T), CuI, KI and CB are respectively supplied from the upstream side feed port, and the glass fiber (GF) is supplied from the downstream side feed port. , to obtain the ratios recorded in the upper part of Table 1 below. Then, pellets of the polyamide resin composition were prepared by melt-kneading them. After drying so that the water content of the pellets of the obtained polyamide resin composition was 800 ppm or less, molding was carried out at a molten resin temperature of 290°C and a mold temperature of 80°C, and the tensile strength, anisotropy, warpage, and true roundness were evaluated. degree and appearance. These evaluation (count) results and the like are shown in Table 1 below.
由表1可知,当玻璃纤维的平均纤维直径x(μm)、非纤维状填充材料的平均粒径y(μm)满足x≥5、y≥3、0.8x+y≥11时,平板状成形片的各向异性和翘曲量小,另外,圆筒状成形片的真圆度高,尺寸精度优良。另外可知,底切部的褶皱等外观不良少,外观优良。另外可知,满足17≤0.8x+y≤26时,夏比冲击强度也优良。It can be seen from Table 1 that when the average fiber diameter x (μm) of the glass fiber and the average particle size y (μm) of the non-fibrous filler satisfy x≥5, y≥3, and 0.8x+y≥11, the flat plate shape The anisotropy and warpage of the sheet are small, and the cylindrical molded sheet has high roundness and excellent dimensional accuracy. In addition, it can be seen that there are few appearance defects such as wrinkles in the undercut portion, and the appearance is excellent. It was also found that when 17≦0.8x+y≦26 is satisfied, the Charpy impact strength is also excellent.
[实施例21~28、比较例5~7][Examples 21-28, Comparative Examples 5-7]
使用在从挤出机的上游侧起第一个料筒上具有上游侧供料口并且在第六个料筒上具有下游侧第一供料口、在第九个料筒上具有下游侧第二供料口的、L/D(挤出机的料筒的长度/挤出机的料筒直径)=48(料筒数:12)的双螺杆挤出机“ZSK-26MC:コベリオン公司制造(德国)”。在上述双螺杆挤出机中,从上游侧供料口到模头设定为290℃、螺杆转速设定为300rpm以及排出量设定为25kg/小时。在所述条件下,从上游侧供料口分别供给上述的聚酰胺树脂(PA)、CuI、KI和CB,从下游侧第一供料口供给非纤维状填充材料(T)、从下游侧第二供料口供给玻璃纤维(GF),以得到下表2的上部记载的比例。然后,通过将它们熔融混炼而制备聚酰胺树脂组合物的颗粒。进行干燥使得所得到的聚酰胺树脂组合物的颗粒的水分为800ppm以下后,在熔融树脂温度290℃、模具温度80℃下进行成形,评价拉伸强度、各向异性、翘曲量、真圆度以及外观。这些评价(计数)结果等如下表2所示。Use on the first barrel from the upstream side of the extruder with the upstream side feed port and the downstream side first feed port on the sixth barrel, and the downstream side first feed port on the ninth barrel Twin-screw extruder "ZSK-26MC" with two feeding ports, L/D (length of barrel of extruder/diameter of barrel of extruder) = 48 (number of barrels: 12): manufactured by Koberion Co., Ltd. (Germany)". In the above-mentioned twin-screw extruder, from the feed port on the upstream side to the die was set at 290° C., the screw rotation speed was set at 300 rpm, and the discharge amount was set at 25 kg/hour. Under the said conditions, the above-mentioned polyamide resin (PA), CuI, KI and CB are respectively supplied from the upstream feed port, the non-fibrous filler (T) is supplied from the first feed port on the downstream side, and the non-fibrous filler (T) is supplied from the downstream feed port. The second feed port supplied glass fibers (GF) so as to obtain the ratios described in the upper part of Table 2 below. Then, pellets of the polyamide resin composition were prepared by melt-kneading them. After drying so that the water content of the pellets of the obtained polyamide resin composition was 800 ppm or less, molding was carried out at a molten resin temperature of 290°C and a mold temperature of 80°C, and the tensile strength, anisotropy, warpage, and true roundness were evaluated. degree and appearance. These evaluation (count) results and the like are shown in Table 2 below.
【表2】【Table 2】
由表2可知,即使是使用PA612的情况下,当玻璃纤维的平均纤维直径x(μm)、非纤维状填充材料的平均粒径y(μm)满足x≥5、y≥3、0.8x+y≥11时,尺寸精度和外观也优良。It can be seen from Table 2 that even in the case of using PA612, when the average fiber diameter x (μm) of the glass fiber and the average particle size y (μm) of the non-fibrous filler satisfy x≥5, y≥3, 0.8x+ When y≥11, the dimensional accuracy and appearance are also excellent.
[实施例29~34、比较例8~12][Examples 29-34, Comparative Examples 8-12]
使用在从挤出机的上游侧起第一个料筒上具有上游侧供料口并且在第六个料筒上具有下游侧第一供料口、在第九个料筒上具有下游侧第二供料口的、L/D(挤出机的料筒的长度/挤出机的料筒直径)=48(料筒数:12)的双螺杆挤出机“ZSK-26MC:コベリオン公司制造(德国)”。在上述双螺杆挤出机中,从上游侧供料口到模头设定为290℃、螺杆转速设定为300rpm以及排出量设定为25kg/小时。在所述条件下,从上游侧供料口分别供给上述的聚酰胺树脂(PA)、CuI和KI,从下游侧第一供料口供给非纤维状填充材料(T)、从下游侧第二供料口供给玻璃纤维(GF),以得到下表3的上部记载的比例。然后,通过将它们熔融混炼而制备聚酰胺树脂组合物的颗粒。进行干燥使得所得到的聚酰胺树脂组合物的颗粒的水分为800ppm以下后,在熔融树脂温度290℃、模具温度80℃下进行成形,评价真圆度以及外观。这些评价(计数)结果等如下表3所示。Use on the first barrel from the upstream side of the extruder with the upstream side feed port and the downstream side first feed port on the sixth barrel, and the downstream side first feed port on the ninth barrel Twin-screw extruder "ZSK-26MC" with two feeding ports, L/D (length of barrel of extruder/diameter of barrel of extruder) = 48 (number of barrels: 12): manufactured by Koberion Co., Ltd. (Germany)". In the above-mentioned twin-screw extruder, from the feed port on the upstream side to the die was set at 290° C., the screw rotation speed was set at 300 rpm, and the discharge amount was set at 25 kg/hour. Under the above conditions, the above-mentioned polyamide resin (PA), CuI, and KI are respectively supplied from the upstream feed port, the non-fibrous filler (T) is supplied from the first feed port on the downstream side, and the second feed port from the downstream side. The feed port supplied glass fibers (GF) so as to obtain the ratios described in the upper part of Table 3 below. Then, pellets of the polyamide resin composition were prepared by melt-kneading them. After drying so that the water content of the pellets of the obtained polyamide resin composition was 800 ppm or less, molding was performed at a molten resin temperature of 290° C. and a mold temperature of 80° C., and roundness and appearance were evaluated. These evaluation (count) results and the like are shown in Table 3 below.
【表3】【table 3】
由表3可知,当玻璃纤维的平均纤维直径x(μm)与非纤维状填充材料的平均粒径y(μm)满足x≥5、y≥3、0.8x+y≥11时,尺寸精度和外观优良。另一方面,将实施例30和实施例31与比较例10~12相比可知,聚酰胺的C/N比为7以上的脂肪族聚酰胺为聚酰胺中的50质量%以上时,尺寸精度和外观显著优良。It can be seen from Table 3 that when the average fiber diameter x (μm) of the glass fiber and the average particle size y (μm) of the non-fibrous filler satisfy x≥5, y≥3, 0.8x+y≥11, the dimensional accuracy and Good appearance. On the other hand, comparing Example 30 and Example 31 with Comparative Examples 10 to 12, it can be seen that when the aliphatic polyamide having a polyamide C/N ratio of 7 or more is 50% by mass or more in the polyamide, the dimensional accuracy is lower. And the appearance is remarkably fine.
由上述内容可知,本实施方式的聚酰胺树脂组合物可以显著提高所得到的成形体的尺寸精度和外观,可以得到能够适合用于汽车部件和各种电子部件等的尺寸精度高的成形体。As can be seen from the above, the polyamide resin composition of the present embodiment can significantly improve the dimensional accuracy and appearance of the obtained molded article, and can obtain a molded article with high dimensional accuracy suitable for use in automobile parts and various electronic parts.
产业实用性Industrial applicability
由本发明的聚酰胺树脂组合物得到的成形体的尺寸精度以及外观优良,因此具有作为汽车部件等要求高水平的尺寸精度的成形体的产业实用性。The molded article obtained from the polyamide resin composition of the present invention has excellent dimensional accuracy and appearance, and thus has industrial applicability as a molded article requiring a high level of dimensional accuracy such as automobile parts.
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