CN104218138A - A WFCOB light source - Google Patents
A WFCOB light source Download PDFInfo
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- CN104218138A CN104218138A CN201410019771.5A CN201410019771A CN104218138A CN 104218138 A CN104218138 A CN 104218138A CN 201410019771 A CN201410019771 A CN 201410019771A CN 104218138 A CN104218138 A CN 104218138A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
Description
技术领域: Technical field:
本发明涉及一种LED光源,尤其涉及一种COB集成光源,确切说是一种采用沟槽(W)与氟胶管(FR)构架制造的COB光源,简称WFCOB光源。 The present invention relates to an LED light source, in particular to a COB integrated light source, to be precise, a COB light source manufactured by using a groove (W) and a fluorine rubber tube (FR) framework, referred to as a WFCOB light source. the
背景技术: Background technique:
LED封装技术是上游芯片和下游灯具的中间纽带,LED光源的品质和价格很大一部分取决于封装构架,亦即封装支架的设计及相关辅料的选用起到承前启后、引领全局之作用,业界有实力的众多设计师都在努力寻求利用封装支架解决LED的散热、光效、寿命、成本这一课题,于是市场出现了五花八门、千姿百态的封装支架,从直插-单颗-SMD-COB琳琅满目、层出不穷,目前LED封装支架研究滞后快速发展的市场需要,国内外还没有一种被大家公认的标准架,COB集成光源因为它在散热、配光、成本等比单颗和SMD等光源有明显优势,业界普遍认为是未来发展的必然趋势,COB光源的基本技术要求是:一是要设围坝结构,挡住荧光混合胶不使其外溢,二是要将芯片电极与支架电极通过打线联接到外界驱动电源联接,所有支架设计都要围绕遵守这两项基本要求,目前广为流行的集成光源支架和铝(铜)基板COB支架均存有一定缺点:采用塑料注塑集成光源支架由于塑料PPA在高温和紫外线照射下会变黄粉化,造成透气进水,失效率很高;而采用铝或铜基板COB支架都要依赖PCB做线路联接,采用FR4纤维压合工艺而成,其夹层含有绝缘胶,这不仅增大光源热阻,而且不易打线和焊接,高温运行会翘皮脱落,这种基板表面反光效果很差这是影响出光强度,系统光效不高的主要原因。 LED packaging technology is the middle link between upstream chips and downstream lamps. The quality and price of LED light sources largely depend on the packaging structure, that is, the design of packaging brackets and the selection of related auxiliary materials play a role in linking the past and the future and leading the overall situation. The industry has strength Many designers in the world are trying to use package brackets to solve the problems of heat dissipation, light efficiency, lifespan and cost of LEDs, so there are various package brackets in the market, from direct plug-in-single-SMD-COB. At present, the research on LED packaging brackets lags behind the rapid development of market needs. There is no standard bracket recognized by everyone at home and abroad. COB integrated light sources have obvious advantages over single and SMD light sources in heat dissipation, light distribution, and cost. The industry generally believes that it is an inevitable trend of future development. The basic technical requirements of COB light sources are: first, to set up a dam structure to block the fluorescent mixed glue from overflowing, and second, to connect the chip electrode and the bracket electrode to the outside world through wire bonding Drive power connection, all bracket design must comply with these two basic requirements. At present, the widely popular integrated light source bracket and aluminum (copper) substrate COB bracket have certain shortcomings: the use of plastic injection molding integrated light source bracket due to the high temperature of plastic PPA It will turn yellow and chalky under ultraviolet light, causing air permeability and water ingress, and the failure rate is very high; while the COB bracket with aluminum or copper substrate must rely on PCB for line connection, it is made of FR4 fiber lamination process, and its interlayer contains insulating glue. This not only increases the thermal resistance of the light source, but also makes it difficult to wire and solder, and the skin will warp and fall off when running at high temperature. The reflective effect of the substrate surface is poor, which is the main reason for affecting the light intensity and the low light efficiency of the system. the
发明内容: Invention content:
本发明的目的旨在提供一种结构简单、易于生产、制造成本低,并能实现LED高光效、低光衰、耐高温、长寿命以克服现在有技术之不足。 The purpose of the present invention is to provide an LED with simple structure, easy production, low manufacturing cost, and can realize high light efficiency, low light decay, high temperature resistance and long life to overcome the deficiencies of the existing technology. the
为实现上述目的本发明所采用的技术方案是: The technical scheme that the present invention adopts for realizing the above object is:
一种WFCOB光源,包括金属基板,其特征在于:所述金属基板沿y坐标轴冲有N个凹槽,形成多个沟槽碗杯,在碗杯中设有N棵LED芯片通过粘胶加温固封,在所述沟槽两端设有电极板并套上绝缘胶管,金属基板设卷边将其包裹并绝缘,LED芯片的电极通过金线串联后引到电极板正负两端成为并联电路从金属基板四角引出与外电源连接。 A WFCOB light source, including a metal substrate, is characterized in that: the metal substrate is punched with N grooves along the y-coordinate axis to form a plurality of grooved bowl cups, and N LED chips are arranged in the bowl cups by adding glue. The two ends of the groove are equipped with electrode plates and covered with insulating rubber tubes, and the metal substrate is curled to wrap and insulate it. The electrodes of the LED chips are connected in series with gold wires and then connected to the positive and negative ends of the electrode plate to become The parallel circuit is drawn from the four corners of the metal substrate to connect with the external power supply. the
所述金属基板冲有N个沟槽碗杯,沟槽斜边呈60-±10度斜角,槽底宽度1-5MM,槽深0.5-0.8mm,将荧光粉混合胶涂在沟槽碗杯中并将LED芯片和金线覆盖,通过加温而固封,材料为高导热的铜或铝板,这里优选高反光镜面铝板,厚度在0.3-3mm,其形状是方形、圆形、长条形或多边形其中任意一种形状,周边设安装孔。 The metal substrate is punched with N grooved bowl cups, the beveled edge of the groove is at an angle of 60-±10 degrees, the width of the groove bottom is 1-5MM, and the groove depth is 0.5-0.8mm. Apply the phosphor powder mixture to the grooved bowl Cover the LED chip and gold wire in the cup, and seal it by heating. The material is copper or aluminum plate with high thermal conductivity. Here, the high-reflective mirror aluminum plate is preferred, with a thickness of 0.3-3mm. Its shape is square, round, and long. Any shape of shape or polygon, with mounting holes around it. the
所述绝缘胶管材料为硅或氟胶管,这里优选耐高温的铁氟龙管,壁厚0.1-0.5mm,内径1-5mm,其中间在对应沟槽碗杯部位冲有电极打线豁口,LED芯片的电极与电极板在豁口内完成键合。 The material of the insulating rubber hose is silicon or fluorine rubber hose. Here, the high-temperature-resistant Teflon tube is preferred, with a wall thickness of 0.1-0.5mm and an inner diameter of 1-5mm. There is an electrode wiring gap punched in the middle of the corresponding groove bowl and cup, and the LED The electrode of the chip is bonded to the electrode plate in the gap. the
所述电极板是宽为1-5mm厚O.1-0.5mm铜板或扁铜线,表面经镀银处理。 The electrode plate is a copper plate or flat copper wire with a width of 1-5mm and a thickness of 0.1-0.5mm, and the surface is treated with silver plating. the
附图说明: Description of drawings:
下面结合附图和具体实施方式对本发明作进一步详细说明: Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:
图1为本发明一种WFCOB光源平面结构示意图。 Fig. 1 is a schematic diagram of the planar structure of a WFCOB light source according to the present invention. the
图2为本发明一种WFCOB光源左剖视图。 Fig. 2 is a left sectional view of a WFCOB light source of the present invention. the
图3为本发明一种WFCOB光源右剖视图。 Fig. 3 is a right sectional view of a WFCOB light source of the present invention. the
图4为本发明一种WFCOB光源相互串联示意图。 Fig. 4 is a schematic diagram of a WFCOB light source connected in series according to the present invention. the
图5为本发明一种WFCOB光源相互并联示意图。 Fig. 5 is a schematic diagram of parallel connection of WFCOB light sources according to the present invention. the
图6为本发明一种WFCOB光源装有长条软胶透镜示意图。 Fig. 6 is a schematic diagram of a WFCOB light source of the present invention equipped with a strip of soft rubber lens. the
其中:金属基板1、LED芯片2、银胶3、绝缘胶管4、电极板5、金属线6、荧光粉混合胶7、软胶透镜8。 Among them: metal substrate 1, LED chip 2, silver glue 3, insulating rubber tube 4, electrode plate 5, metal wire 6, fluorescent powder mixing glue 7, soft rubber lens 8. the
具体实施方式: Detailed ways:
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图和实施例对本发明做进一步说明,应当理解以下描述的实施例仅用于解释本发明,并不限定本发明。 In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. It should be understood that the embodiments described below are only for explaining the present invention and not limiting the present invention. the
实施例1:见附图1-3, Embodiment 1: see accompanying drawing 1-3,
一种WFCOB光源,包括金属基板1,其特征在于:所述金属基板1沿y坐标轴冲有N个凹槽,形成多个沟槽碗杯,在碗杯中设有N棵LED芯片2通过粘胶3加温固封,在所述沟槽两端设有电极板5并套上绝缘胶管4,金属基板1设卷边将其包裹并绝缘,LED芯片2的电极通过金线6串联后引到电极板5正负两端成为并联电路从金属基板1四角引出与外电源连接,最后在沟槽碗杯中点荧光胶7将LED芯片2包裹加温固化。 A WFCOB light source, comprising a metal substrate 1, characterized in that: the metal substrate 1 is punched with N grooves along the y-coordinate axis to form a plurality of grooved bowl cups, and N LED chips 2 are arranged in the bowl cups to pass through The viscose 3 is heated and sealed, electrode plates 5 are provided at both ends of the groove and insulating rubber tubes 4 are put on, the metal substrate 1 is wrapped and insulated by crimping, and the electrodes of the LED chips 2 are connected in series through gold wires 6 Lead to the positive and negative ends of the electrode plate 5 to form a parallel circuit from the four corners of the metal substrate 1 to connect with the external power supply, and finally put fluorescent glue 7 in the groove bowl cup to wrap the LED chip 2 and heat it to cure. the
所述金属基板1材料是高导热的铜或铝板,周边设安装孔,这里优选反光率高的镜面铝板,反光率高达98%以上,不仅提高了出光效率,也彻底免除了金属镀银工艺带来的高成本、易硫化等诸多弊端,镜面铝材厚度在0.3-3mm,其形状是方形、圆形、长条形或多边形其中任意一种形状。 The material of the metal base plate 1 is a copper or aluminum plate with high thermal conductivity, and there are mounting holes around it. Here, a mirror-faced aluminum plate with a high reflectivity is preferred, and the reflectivity is as high as 98%, which not only improves the light extraction efficiency, but also completely eliminates the metal silver plating process. There are many disadvantages such as high cost and easy vulcanization. The thickness of the mirror aluminum material is 0.3-3mm, and its shape is any one of square, round, long strip or polygon. the
所述金属基板1冲有N个凹槽,沟槽斜边呈60-±10度斜角,呈反光环形状,由于高反射率反光环有聚光可提高LED光效5-10%。 The metal substrate 1 is punched with N grooves, the beveled sides of the grooves are at an angle of 60-±10 degrees, and are in the shape of a reflective ring. Due to the high reflectivity, the reflective ring gathers light and can increase the light efficiency of the LED by 5-10%. the
采用高反光率的镜面铝板,不仅彻底革除了塑集成光源支架由于塑料PPA在高温和紫外线照射下会变黄粉化,造成透气进水而失效,也革除了铝(铜)基板COB对FR4纤维压合工艺的依赖,彻底解决了铝基板不易打线焊接,高温运行会翘皮脱落技术难题。 The mirror aluminum plate with high reflectivity not only completely eliminates the plastic integrated light source bracket because the plastic PPA will turn yellow and powder under high temperature and ultraviolet radiation, resulting in air permeability and water ingress, but also eliminates the pressure of the aluminum (copper) substrate COB on the FR4 fiber. Relying on the combination process, it completely solves the technical problems that the aluminum substrate is not easy to wire and weld, and the skin will peel off when it is operated at high temperature. the
所述金属基板1冲有N个沟槽碗杯,杯深0.5-0.8mm,这里优选0.6mm,比常规的集成光源杯深降低约60%,可大大节省荧光粉和封装胶成本。 The metal substrate 1 is punched with N grooved cups with a depth of 0.5-0.8mm, preferably 0.6mm, which is about 60% lower than the depth of conventional integrated light source cups, which can greatly save the cost of phosphor powder and packaging glue. the
所述电极板5置于杯底侧边用氟胶管6将其套住与金属其板1绝缘,其材料为宽1-5mm厚0.1-0.5mm铜板或扁铜线,并经电镀处理。 The electrode plate 5 is placed on the bottom side of the cup and covered with a fluorine rubber tube 6 to insulate it from the metal plate 1. The material is a copper plate or flat copper wire with a width of 1-5mm and a thickness of 0.1-0.5mm, and is electroplated. the
所述绝缘胶管4材料为硅或氟,这里优选铁氟龙胶管,其耐温在200度以上,确保光源长期高温不会老化,提高了光源的耐温性能。 The insulating rubber tube 4 is made of silicon or fluorine, preferably Teflon rubber tube, whose temperature resistance is above 200 degrees, which ensures that the light source will not age at high temperature for a long time, and improves the temperature resistance of the light source. the
所述荧光粉混合硅胶7是将高透光率、高折光率的硅胶与荧光粉按一定比例混合后填充到基扳碗杯内,将LED芯片2和金线6覆盖,通过高温烘烤固化。 The fluorescent powder mixed silica gel 7 is made by mixing silica gel with high light transmittance and high refractive index and fluorescent powder in a certain proportion and then filling it into the base bowl cup, covering the LED chip 2 and the gold wire 6, and curing by high temperature baking . the
实施例2:见附图3 Embodiment 2: see accompanying drawing 3
本实施例是在实施例1基础上一种长条串联模组排列形式,在图3图和图4中将多个光源正负电极首尾串联连接,可组成不同功率、不同电压的连排模组,如LED日光管灯、洗墙灯等。 This embodiment is an arrangement of long series modules on the basis of Embodiment 1. In Figure 3 and Figure 4, the positive and negative electrodes of multiple light sources are connected in series end to end, which can form a series of modules with different powers and different voltages. Groups, such as LED fluorescent tube lights, wall washers, etc. the
实施例3:见附图4: Embodiment 3: see accompanying drawing 4:
本实施例是在实施例2基础上另一种长条并联模组排列形式,在图4中将多个光源正负电极相互并连,可组成不同功率的连排模组,可实现更大功率的组合模块,主要用于大功率照明场合,如大功率吸顶灯,投光灯等。 This embodiment is another arrangement of long parallel modules on the basis of Embodiment 2. In Figure 4, the positive and negative electrodes of multiple light sources are connected in parallel to form a series of modules with different powers, which can realize larger The combination module of power is mainly used in high-power lighting occasions, such as high-power ceiling lamps, spotlights, etc. the
实施例4: Example 4:
本实施例是在实施例1基础上增加了一组长条软胶透镜8,所述软胶透镜8是将 一种高透光率、高折射率双组硅胶注入条形沟槽模具中加温成型,切成所需长度,与荧光粉混合硅胶7紧贴粘固,由于软胶透镜8具有聚光和光折射作用,,不仅提高了光源光效,也革除了荧光胶混合工艺,彻底摆脱了配粉、搅匀、抽真空,灌胶、点胶、测试等繁琐制做工艺,大大降低了人工成本,这无疑将是改变封装格局一项技术革命。 In this embodiment, a set of long strip soft rubber lenses 8 is added on the basis of Embodiment 1. The soft rubber lenses 8 are made by injecting a double group of silica gel with high light transmittance and high refractive index into the strip groove mould. Warm molding, cut into the required length, and glued with fluorescent powder mixed with silica gel 7, because the soft rubber lens 8 has the functions of light concentrating and light refraction, it not only improves the light efficiency of the light source, but also eliminates the fluorescent glue mixing process, completely getting rid of It eliminates the cumbersome manufacturing processes such as powder mixing, mixing, vacuuming, glue pouring, dispensing, and testing, which greatly reduces labor costs. This will undoubtedly be a technological revolution that changes the packaging pattern. the
本发明一种WFCOB光源与现有COB集成光源相比明显优点是: Compared with the existing COB integrated light source, the obvious advantages of a WFCOB light source of the present invention are:
1.采用金属一体化结构,革除了集成光源注塑工艺,彻底解决了PPA因高温和紫外线照射下会变黄、粉化、透气而造成产品失效,提高了光源的耐温特性。 1. The metal integrated structure is adopted, and the injection molding process of the integrated light source is eliminated, which completely solves the product failure caused by PPA's yellowing, pulverization, and air permeability due to high temperature and ultraviolet radiation, and improves the temperature resistance of the light source. the
2.采用高耐温绝缘材料紧包电极板技术,革除了COB光源对铝(铜)基板压合工艺依赖,彻底解决了铝(铜)基板高热阻、不易打线和焊接、高温运行翘皮脱落等诸多弊端,提高了光源的耐温特性。 2. The technology of tightly wrapping the electrode plate with high temperature-resistant insulating material eliminates the dependence of the COB light source on the lamination process of the aluminum (copper) substrate, and completely solves the problem of high thermal resistance of the aluminum (copper) substrate, difficulty in wiring and welding, and warped skin during high-temperature operation There are many disadvantages such as falling off, which improves the temperature resistance of the light source. the
3.采用高反光镜面铝材,革除了基板镀银工艺,彻底克服了镀银工艺带来的高成本、易硫化等弊端。 3. The use of high-reflective mirror aluminum material eliminates the silver-plating process of the substrate, and completely overcomes the disadvantages of high cost and easy vulcanization caused by the silver-plating process. the
4.采用胶柱透镜,不仅提高了光源光效,也革除了荧光胶混合工艺,彻底摆脱了配粉、搅匀、抽真空,灌胶、点胶、测试等繁琐制做工艺,大大降低了人工成本,这无疑将是改变封装格局一项技术革命。 4. The use of rubber column lenses not only improves the light efficiency of the light source, but also eliminates the mixing process of fluorescent glue, completely getting rid of the tedious manufacturing processes such as powder mixing, mixing, vacuuming, glue filling, dispensing, and testing, which greatly reduces Labor costs, this will undoubtedly be a technological revolution that changes the packaging pattern. the
5.采用沟槽技术,不仅减少60%荧光胶的用量,同时也提高了10%光效。 5. Using groove technology, not only reduces the amount of fluorescent glue by 60%, but also improves the light efficiency by 10%. the
6.采用连排结构技术,可方便截取支架不同长短宽窄改变排例组合,有利于实现系统模块化,功率任意化。 6. Adopting row-by-row structure technology, it is convenient to intercept brackets with different lengths, widths, and narrows to change the arrangement and combination, which is conducive to the realization of system modularization and arbitrary power. the
7.与集成光源或铝基板COB光源相比,结构简单,支架成本降低了约80%,荧光粉与封装胶也降低了约70%。大幅降低了制造成本。 7. Compared with the integrated light source or aluminum substrate COB light source, the structure is simple, the bracket cost is reduced by about 80%, and the phosphor and packaging glue are also reduced by about 70%. Significantly reduced manufacturing costs. the
基于上述原理特征,本发明一种WFCOB光源之实施例仅为优选实施例而已,实 际应用还可以延伸到更多结构细节和更广泛应用实例,凡在本发明权利要求实施范围之内的任何修改、等同或替换均应落入本发明的权利要求范围之内。 Based on the above-mentioned principle features, the embodiment of a WFCOB light source of the present invention is only a preferred embodiment, and the practical application can also be extended to more structural details and wider application examples. Modifications, equivalents or replacements should all fall within the scope of the claims of the present invention. the
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2016127524A1 (en) * | 2015-02-11 | 2016-08-18 | 深圳市西德利集团有限公司 | Led illuminating device and led lamp |
CN108538997A (en) * | 2018-03-29 | 2018-09-14 | 开发晶照明(厦门)有限公司 | Surface attaching type holder and multi-chip photoelectric device |
CN109899709A (en) * | 2017-12-11 | 2019-06-18 | 广州爱宇森照明科技有限公司 | A kind of wall lamp |
CN112786759A (en) * | 2019-11-08 | 2021-05-11 | 宁波安芯美半导体有限公司 | Light-emitting diode substrate, preparation method and light-emitting diode bulb |
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2014
- 2014-01-06 CN CN201410019771.5A patent/CN104218138A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016127524A1 (en) * | 2015-02-11 | 2016-08-18 | 深圳市西德利集团有限公司 | Led illuminating device and led lamp |
CN109899709A (en) * | 2017-12-11 | 2019-06-18 | 广州爱宇森照明科技有限公司 | A kind of wall lamp |
CN108538997A (en) * | 2018-03-29 | 2018-09-14 | 开发晶照明(厦门)有限公司 | Surface attaching type holder and multi-chip photoelectric device |
CN108538997B (en) * | 2018-03-29 | 2020-05-05 | 开发晶照明(厦门)有限公司 | Surface Mount Standoffs and Multichip Optoelectronics |
CN112786759A (en) * | 2019-11-08 | 2021-05-11 | 宁波安芯美半导体有限公司 | Light-emitting diode substrate, preparation method and light-emitting diode bulb |
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