CN104185689A - Element containing thermally stable polycrystalline diamond material and methods and assemblies for formation thereof - Google Patents

Abstract

This invention provides a superhard abrasive element comprising a substantially catalyst-free, thermally stable polycrystalline diamond (TSP) body (the TSP body having pores and contact surfaces), a substrate adjacent to the contact surfaces of the TSP body, and an impregnating material impregnated in the substrate and in the pores of the contact surfaces of the TSP body. The invention also provides earth drilling bits and other devices incorporating such superhard abrasive elements. Furthermore, the invention provides a method and mold assembly for forming such superhard abrasive elements by impregnation and hot pressing.

Description

Components comprising thermally stable polycrystalline diamond material and methods and assemblies for forming the same

technical field

The present invention relates to superabrasive elements comprising superabrasive bodies, such as thermally stable polycrystalline diamond (TSP) bodies, bonded to a substrate by an infiltrant material. In more specific embodiments, the TSP body may be substantially free of infiltrant material, with only a small amount of infiltrant material present near the surface of the TSP body in contact with the substrate. In some embodiments, the infiltrant material may also infiltrate the substrate, where it functions as a binder. The invention also relates to a method of forming a superabrasive element comprising a TSP body bonded to a substrate using an infiltrant material. In particular embodiments, the method can include forming the superabrasive element by forming the substrate in the presence of an infiltrant material in a mold that also includes the TSP.

background

Components of various industrial installations are often used in extreme conditions, such as high-impact contact with abrasive surfaces. For example, such extreme conditions are commonly encountered during underground drilling for the purpose of oil extraction or extraction. Diamond's unrivaled wear resistance makes it the most effective material for earth drilling and similar activities that expose components to extreme conditions. Diamond is extremely hard, can transfer heat away from the point of contact with the abrasive surface, and can provide other advantages in this situation.

Polycrystalline forms of diamond have increased toughness compared to single crystal diamond due to the random distribution of polycrystalline diamond crystals, which avoids the specific cutting planes found in single crystal diamond crystals. Therefore, polycrystalline diamond is often the preferred form of diamond in many drilling applications or other extreme conditions. Device elements have a longer service life under these conditions if their surface layers are made of diamond, especially in the form of polycrystalline diamond (PCD) compacts, or other superabrasive materials.

Components for harsh conditions may contain a PCD layer bonded to a substrate. The traditional PCD production process is very strict and extremely expensive. The process is known as "growing" polycrystalline diamond directly on a carbide substrate to form a polycrystalline diamond composite compact. The process involves placing cemented carbide flakes and diamond particles mixed with a catalyst binder in an extruder vessel and subjecting it to a pressure cycle of ultra-high pressure and temperature conditions. Ultra-high temperatures and pressures are required to be applied to small diamond grains to form an integrated polycrystalline diamond body. The resulting polycrystalline diamond body is also intimately bonded to the carbide sheet, resulting in a composite compact in the form of a layer of polycrystalline diamond tightly bonded to the carbide substrate.

The problem with PCD arises from the process of using cobalt or other metal catalyst/binder systems to facilitate the growth of polycrystalline diamond. The catalyst/binder remains in the pores of the polycrystalline diamond body after crystal growth is complete. Because cobalt or other metal catalysts/binders have a higher coefficient of thermal expansion than diamond, when the composite compact is heated, for example in a brazing process (by which carbide parts are joined to other materials) or in practical applications, The metal catalyst/binder will have a higher expansion rate than diamond. As a result, when temperatures above a critical level are applied to the PCD, the expanding catalyst/binder can cause cracks throughout the polycrystalline diamond structure. These cracks weaken the PCD and can eventually cause damage or failure.

Because of these effects or others, one often removes the catalyst from a portion of the PCD layer, especially near the working surface. The most common process for catalyst removal is the use of strong acid baths, although other processes using alternative acids or electrolysis and liquid metal techniques also exist. Typically, the use of an acid method to remove the catalyst from the PCD layer is called leaching. Acid leaching usually first occurs on the outer surface of the PCD layer and extends inward. Conventional elements comprising a leached PCD layer are therefore often characterized by leaching to a certain depth from their surface. The PCD (the region containing the PCD layer) where most of the catalyst is leached is called thermally stable PCD (TSP). Examples of existing leaching methods are provided in U.S. 4,224,380; U.S. 7,712,553; U.S. 6,544,308; U.S. 20060060392 and related patents or applications.

Acid leaching must also be controlled to avoid contact between the substrate or the surface between the substrate and the diamond layer and the acid used for leaching. Acids sufficient to leach polycrystalline diamond can cause severe degradation of much less resistant substrates. Damage to the substrate compromises the physical integrity of the PCD element and may cause cracks, disintegration, or other physical failure during use, which may also cause other damage.

Components comprising PCD layers require carefully controlled leaching, which adds significantly to the complexity, time and expense in PCD production. Additionally, leaching is typically performed on batches of PCD elements. Testing to ensure proper leaching is destructive and must be performed on representative components from each lot. The need to perform such destructive testing further increases the production cost of the PCD element.

Attempts have been made to avoid the problems of leaching fully formed components by leaching the PCD layer separately and then attaching it to the substrate. However, these attempts have not produced usable components. Specifically, the method of connecting the PCD layer to the substrate failed in actual use, causing the PCD layer to slide or detach. In particular, using soldering methods such as those described in U.S. 4,850,523; U.S. 7,487,849 and related patents or applications, or using mechanical locking methods such as those described in U.S. 7,533,740 or U.S. 4,629,373 and related patents or applications ) produced components prone to failure.

Other methods of bonding a PCD layer to a preformed substrate are described in U.S. 7,845,438, but these methods require melting materials already present in the substrate and allowing these materials to infiltrate the PCD layer.

In other methods, the leached PCD layer is directly attached to the gage area of the bit by impregnating the entire bit and at least a portion of the PCD layer with an adhesive material. While these methods are suitable for attaching PCD to wheel base areas where it does not need to be removed over the life of the bit, they are not suitable for placing the PCD layer in the cutting area of the bit where it needs to be removed. Replace or rotate the PCD to provide normal bit life.

Other methods are also used to incorporate PCD elements (often referred to as geosets) to the exterior of the drill bit. The geometrical components are usually coated with a metal such as nickel (Ni). Geometry coatings can provide benefits such as protection of the diamond at higher temperatures and increased bond strength to the bit matrix.

Therefore, there is a need for elements (including rotatable or replaceable elements) that have a leached PCD layer, such as a TSP body, that is sufficiently well bonded to the base or substrate so that the element can Used under high temperature conditions including, for example, those experienced by cutting elements of earth-boring drill bits.

overview

According to one embodiment, the present invention provides a superabrasive element comprising a substantially catalyst-free body of thermally stable polycrystalline diamond (TSP) (the TSP body having pores and contact surfaces) in contact with the a substrate adjacent to the contact surface of the TSP body; and an infiltrant material that infiltrates the substrate and into the pores on the TSP body contact surface.

According to another embodiment, the present invention provides an earth-boring drill bit comprising such a superabrasive element in the form of a cutting body.

According to another embodiment, the present invention provides an assembly for forming a superabrasive element, the assembly comprising a bottomed mold, a body of thermally stable polycrystalline diamond (TSP) having a contact surface and positioned within the bottom of the mold , a matrix powder placed in the mold adjacent to the contact surface and over the TSP body, and an infiltrant material placed in the mold over the matrix powder.

According to another embodiment, the present invention provides an assembly for forming a superabrasive element, the assembly comprising a mold, a body of thermally stable polycrystalline diamond (TSP) having a contact surface and positioned in the mold, placed in the mold A matrix powder in and adjacent to the contact surface, and an infiltrant material or binder material placed in the mold in the matrix powder.

The present invention also provides a method of forming a superabrasive, the method comprising assembling an assembly comprising a mold having a bottom, a thermally stable polycrystalline diamond (TSP ) body, a matrix powder placed in the mold adjacent to the contact surface and over the TSP body, and an infiltrant material placed in the mold over the matrix powder. The method also includes heating the assembly to a temperature and for a period of time sufficient for the infiltrant material to infiltrate the matrix powder and pores of the TSP body, and cooling the assembly to form a super Hard abrasive elements.

The present invention also provides another method of forming a superabrasive element, the method comprising assembling an assembly comprising a mold, a thermally stable polycrystalline diamond (TSP) body having a bore and a contact surface and positioned in the mold, A matrix powder disposed in the mold adjacent the contact surface, and an infiltrant or binder material disposed in the matrix powder. The method also includes heating the assembly to a temperature and pressure for a period of time sufficient to infiltrate the matrix powder with the infiltrant material or binder material to form a substrate bonded to the TSP body.

Brief description of the drawings

A more complete understanding of embodiments of the invention and advantages thereof should refer to the following description taken in conjunction with the accompanying drawings, which illustrate embodiments of the invention, like numerals indicating like parts, in which:

1 is a cross-sectional side view of an infiltration process assembly for forming a superabrasive element comprising a body of TSP bonded to a substrate by an infiltrant material;

Fig. 2 is the enlarged cross-sectional schematic diagram of superabrasive element;

Figure 3 is a cross-sectional side view of a thermocompression process assembly used to form a superabrasive element comprising a body of TSP bonded to a substrate by an infiltrant material;

Figure 4 is a side view of a TSP body used in one embodiment of the invention;

5A and 5B are top and side views of a superabrasive element;

Figure 6 is a side view of a carbide casting reinforcement used in one embodiment of the invention;

Figure 7 is a side view of a superabrasive element with a dovetail lock;

Figure 8 is a side view of a superabrasive element with lateral lock; and

Figure 9 is a side view of a superabrasive element for a dovetail lock and a transverse lock.

Detailed description of the invention

The present invention relates to superabrasive elements comprising superabrasive bodies, such as thermally stable polycrystalline diamond (TSP) bodies, bonded to a substrate by an infiltrant material. The invention also relates to tools comprising such superabrasive elements, and methods of producing such superabrasive elements. In general, the superabrasive properties of the superabrasive body (eg, TSP body) may remain substantially unchanged or not deteriorate during the method of producing a superabrasive element.

Although in the example embodiments described herein, the superabrasive elements are generally cylindrical with flat surfaces, they may be in any shape suitable for the end use, for example in some embodiments conical, cylindrical variants, Or even horned. Additionally, in some embodiments, the surface of the superabrasive element can be concave, convex, or irregularly shaped.

As shown in FIG. 1 , an assembly 10 may be provided for forming superabrasive elements by infiltration. Assembly 10 may include a mold 20 for receiving the components of the superabrasive element as they are being formed. TSP body 30 may be placed within mold 20 . TSP body 30 may be substantially free of catalysts used to form the TSP body. For example, at least 85% of the catalyst can be removed from the TSP body. Matrix powder 40 may also be placed within mold 20 on top of TSP body 30 . Finally, infiltrant material 50 may be placed within mold 20 on top of matrix powder 40 .

To form the superabrasive element, a forming process may be applied to the assembly 10 during which the matrix powder 40 is infiltrated with an infiltrant material 50 that functions as a binder and ultimately forms the substrate. The infiltrant material 50 wets the surface of the TSP body 30 in contact with the matrix powder 40 and fills the pores in the TSP body 30 at the surface, connecting the TSP body 30 to the substrate. FIG. 2 shows an enlarged cross-sectional view of a superabrasive element 60 that may be formed. Superabrasive element 60 includes TSP body 30 bonded to substrate 70 formed from matrix powder 40 . In particular embodiments, the infiltrant material 50 may be dispersed within the substrate 70 to act as a binder and also infiltrate the pores in the contact surface 100 of the TSP body 30 that is in contact with the substrate 70 to depth D to form region 80 comprising infiltrant material. The remainder of TSP body 30 is substantially free of binder and may form region 90 free of infiltrant. Pores can be engineered to create a micromechanical bond, rather than just a metallurgical bond, between the substrate and TSP.

According to another embodiment (not shown), the infiltrant material 50 and the matrix powder 40 may be intermixed prior to the forming process. In such an embodiment, the infiltrant material still infiltrates the matrix powder 40, and wets the surface of the TSP body 30, will also fill in the pores on the surface, so that the substrate formed by the matrix powder 40 70 is connected to TSP body 30.

According to another embodiment illustrated in FIG. 3, a superabrasive element 60 of the type shown in FIG. 2 may be formed using assembly 10a and heat pressing. Assembly 10a may include a mold 20a for receiving the component of the superabrasive element as it is formed. TSP body 30 may be placed within mold 20a. Matrix powder 40a may also be placed within mold 20a. Typically when hot pressing is used, the infiltrant material and matrix powder are intermixed before hot pressing. Accordingly, the matrix powder 40a may also contain a binder material intermixed therewith. The binder material may be an infiltrant material, or it may be a material that cannot impregnate the TSP body 30 . In the case where the binder material does not impregnate the TSP body 30, or the binder material does not impregnate the TSP body 30 to an extent sufficient to fully bond the TSP body to the substrate 70 after forming the superabrasive element, the TSP body 30 The connection with the base 70 may be mainly by mechanical force generated by using heat pressing. In other hot-pressed embodiments, a disc of infiltrant material 50 may be placed on matrix powder 40 and used to infiltrate the matrix powder, eg, at lower pressure.

In alternative embodiments, other infiltration methods, such as hot isostatic pressing, may be used to infiltrate the matrix powder with an infiltrant material.

Mold 20 used in assembly 10 may be made of any material suitable to withstand the forming process and enable removal of the formed superabrasive elements. According to certain embodiments, the mold 20 may comprise a ceramic material. Although the mold 20 is shown as having a flat bottom, in some embodiments (not shown), it can be shaped to allow the infiltrant material 50 to flow around the edges of the TSP body 30, helping the TSP body 30 to bond with the substrate 70. form a mechanical connection. Mold 20a may be any mold suitable for withstanding heat and pressure cycles.

TSP body 30 may be any shape suitable for use with superabrasive element 60 . In some embodiments, it may be in the form of a disc as shown in FIG. 4 . TSP body 30 may have a substantially planar contact surface (not shown). However, as shown in FIG. 4 , the TSP body 30 may have features that mechanically enhance the connection of the TSP body to the substrate 70 in the superabrasive element 60 . In particular, the TSP body 30 may have an uneven contact surface 100 as shown in FIG. 4 . The uneven contact surface 100 may include uneven features such as grooves 110 . The grooves 110 can help prevent the TSP body 30 from sliding from the substrate 70 when forces are applied to the grooves in a perpendicular direction. The uneven contact surface 100 may have angled regions, such as the angled walls 120 of the groove 110 . These angled walls 120 may improve the mechanical connection between the TSP body 30 and base 70 by interlocking the two components.

Other configurations that increase the mechanical connection of TSP body 30 to substrate 70 may also be used. Two examples of such configurations are shown in Figures 5A and 5B. Other mechanical attachment mechanisms may include pre-mechanical TSP attachment mechanisms, which may prove inadequate when used alone, may be appropriate when used in conjunction with attachment through infiltrant material 50, and may actually improve the connection between TSP body 30 and Integral connection of the base 70. Exemplary mechanisms include those found in U.S. 7,533,740 or U.S. 4,629,373 (herein incorporated by reference). 7, 8 and 9 show other configurations that can increase the mechanical connection of TSP body 30 to substrate 70. As shown in FIG. Some such configurations, such as that shown in Figure 9, can apply compressive forces to the TSP body, especially in use.

The particular mechanical configuration of TSP body 30 may be used when TSP body 30 is mechanically attached to substrate 70 by thermoforming rather than by an infiltrant material.

As a supplement or alternative to mechanically enhancing the connection of the TSP body 30 to the substrate 70, the characteristics of the contact surface 100 may also increase the contact area with the matrix powder 40 before forming the superabrasive element 60, or after forming the superabrasive element 60 The contact area with the substrate 70 is then increased. In particular, an uneven contact surface 100 can increase the contact area. A larger contact area can improve the bonding of the TSP body 30 to the substrate 70 during the forming process by infiltrating more pores adjacent to the matrix powder 40 with the infiltrant material 50 or by otherwise increasing The surface wetted by the infiltrant material 50 is achieved.

In some embodiments, the number or volume of pores in interface 100 can also help improve the connection of TSP body 30 to substrate 70 by providing more surface area for infiltrant material 50 for wetting and bonding. accomplish.

TSP body 30 can be any PCD that is well leached, thermally stable. At temperatures suitable for the infiltrant material 50 to infiltrate the matrix powder 40 and wet and infiltrate the contact surface 100 or for some hot-pressing techniques, remaining insufficiently leached catalyst in the PCD material can cause the PCD The graphitization of the material turns into carbon, weakening it, making it unsuitable for use in superabrasive elements, and possibly even causing disintegration. Leaching of the TSP body may be performed prior to placement of the TSP body in assembly 10 or 10a and prior to forming superabrasive element 60 . TSP body 30 may be formed using standard techniques for forming PCD layers. In particular, PCD attached to or detached from any substrate can be formed by mixing particles of natural or synthetic diamond crystals with a catalyst and applying high temperature and pressure to the mixture. The PCD may comprise an interstitial matrix containing a catalyst and a matrix of diamond bodies. According to a particular embodiment, the catalyst may comprise a Group VIII metal, in particular cobalt (Co).

The PCD can then be leached by any process capable of removing the catalyst from the interstitial matrix. The leaching process can also remove substrate (if any substrate is present). In some embodiments, at least a portion of the substrate may be removed, eg, by grinding, prior to leaching. In particular embodiments, PCD can be leached using acids. The leaching process can differ from conventional leaching processes because there is no need to protect any substrate or boundary areas from leaching. For example, the PCD or PCD/substrate combination can simply be placed in an acid bath without any commonly employed protective components. Even the design of the acid bath can be different from traditional acid baths. In many of the processes used in the present invention, simple acid tanks can be used.

Alternative leaching methods using Lewis acid leaching reagents may also be used. In this method, the catalyst-containing PCD can be placed in a Lewis acid leaching reagent until the desired amount of catalyst is removed. This method can be performed at lower temperatures and pressures than traditional leaching methods. Lewis acid leaching reagents may include ferric chloride (FeCl ₃ ), copper chloride (CuCl ₂ ), and optionally hydrochloric acid (HCl), or nitric acid (HNO ₃ ), solutions thereof, and combinations thereof. An example of this leaching method can be found in US 13/168,733, filed June 24, 2011 by Ram Ladi et al., entitled "CHEMICAL AGENTS FOR LEACHING POLYCRYSTALLINE DIAMOND ELEMENTS )", incorporated herein by reference in its entirety.

When the catalyst is removed from the interstitial matrix, the pores where the catalyst was once placed remain. The percent PCD leaching of the present invention can be characterized as the overall percent of catalyst that is removed to leave pores. Although there may be some gradient in the degree of leaching from the surface of the PCD inwards as described above, an average value of PCD leaching can be determined. According to certain embodiments of the invention, TSP body 30 may comprise PCD substantially free of catalyst. More specifically, the TSP body can comprise PCD with an average of at least 85%, at least 90%, at least 95%, or at least 99% catalyst leached.

In some embodiments, the TSP body 30 may have a uniform diamond grain size, but in other embodiments, the grain size may be within the TSP body. For example, in some embodiments, the TSP body 30 may contain larger diamond particles near the interface 100, thereby creating more pores or pores of greater volume, thereby providing a greater surface area for contact with the infiltrant material. 50 contacts. In certain embodiments, these larger diamond particles may form a tie layer (not shown) in TSP body 30 . In other embodiments, the diamond density may be less in the tie layer. The difficulty of diamond wetting poses a challenge to the connection of the TSP body 30 to the substrate 70 , so a lower diamond density can help the connection by improving the wetting of the interface 100 .

In other embodiments, the TSP body 30 may comprise a tie layer of a different material, such as a carbide former, especially _W2C , or a material that contains only a small amount of diamond compared to the TSP body. In one embodiment, such tie layers may be placed on the TSP body prior to forming the superabrasive elements. Due to the destructive tendency of leaching, such a tie layer may be placed on the TSP body 30 after leaching. In another embodiment, the tie layer may be formed by a separate layer of material between the matrix powder 40 and the TSP body 30 during the formation of the superabrasive element. In either embodiment, the tie layer can be sufficiently bonded to the body of the TSP to remain unchanged during use of the superabrasive element, but can provide enhanced bond to the substrate 70 . For example, the tie layer may be more easily wetted by the infiltrant material 50, or the bond formed with the infiltrant material 50 may be stronger than the bond formed by the TSP.

Matrix powder 40 or 40a may be a powder, or any other material suitable for forming substrate 70 after infiltration with infiltrant material 50 (which may function as a binder). In particular embodiments, the matrix powder 40 or 40a may be a material commonly used to form the substrates of conventional PCD elements. Matrix powder 40 or 40a may also provide substrate 70 with advantageous properties such as rigidity, erosion resistance, toughness, and connection to TSP body 30 respectively. For example, it may be a carbide-containing powder or a carbide-forming powder. The infiltrant material 50 content of the substrate 70 can generally be higher than conventional PCD element substrates containing similar materials. As a result, the erosion resistance of substrate 70 may be lower than conventional substrates. A certain powder mixture can be used as matrix powder 40 to increase the erosion resistance of substrate 70 . In particular embodiments, the powder mixture may comprise carbides, tungsten (W), tungsten carbide (WC or _W2C ), synthetic diamond, natural diamond, chromium (Cr), iron (Fe), nickel (Ni), Or other materials suitable for increasing the erosion resistance of the substrate 70 . The powder mix may also contain copper (Cu), manganese (Mn), phosphorus (P), oxygen (O), zinc (Zn), tin (Sn), cadmium (Cd), lead (Pb), bismuth (Bi) or Tellurium (Te). The matrix powder may comprise any combination or mixture of the materials described above.

In some embodiments, matrix powder 40 or 40a may have a substantially uniform particle size. However, in other embodiments, the particle size of matrix powder 40 or 40a may vary depending on the desired properties of substrate 70 or to facilitate attachment of substrate 70 to TSP body 30 by infiltration or mechanical means. For example, a layer of matrix powder 40 having a smaller particle size may be placed adjacent to TSP body 30 such as those infiltration methods using assembly 10 . The smaller particle size allows more of the infiltrant material 50 to reach the contact surface 100, thereby allowing the infiltrant material 50 to form a stronger connection. Typically the particles of matrix powder 40 or 40a will be microscale or nanoscale. For example, the average particle size may be greater than or equal to 5 μm, such as 5-6 μm. The average particle size can be much higher, eg 100 μm. These particle sizes may represent the average particle size found in the portion of substrate 70 extending from TSP body 30 to half of the total length of substrate 70 . In general, the particle size of the matrix powder 40 or 40a can be significantly larger than the allowable particle size in the pre-formed substrate.

Although suitable materials are generally in powder form, in some embodiments, matrix powder 40 or 40a may be replaced with a non-powder material that is sufficient to be infiltrated by infiltrant material 50, form substrate 70, and bond with the TSP body. The contact surfaces 100 of the 30 are basically the same.

The infiltrant material 50 may include any material capable of infiltrating the matrix powder 40 or 40 a to form the base 70 . In hot pressing methods such as those using assembly 10a, infiltrant material 50 may be mixed with matrix powder 40a prior to hot pressing. In those infiltration methods such as those using the assembly 10, and possible but not necessary, also in some hot pressing methods, the infiltrant material 50 may also wet the contact surface 100 and infiltrate at least a sufficient number of The pores on the contact surface 100 of the TSP body 30 form a bond between the TSP body 30 and the substrate 70 through the infiltrant material 50 . In particular embodiments, the infiltrant material 50 may be a material that has an affinity for diamond such that it tends to wet the contact surface 100, or tends to be drawn into the pores by capillary or similar attraction. In more particular embodiments, infiltrant material 50 may comprise a material suitable for use as a catalyst in PCD formation, such as a Group VIII metal such as manganese (Mn) or chromium (Cr). The infiltrant material 50 may also be a carbide or a material used in forming a carbide, such as an alloy of titanium (Ti) with copper (Cu) or silver (Ag). In certain embodiments, the infiltrant material 50 may be a different material than is used as a catalyst during PCD formation and then leached to form the TSP body. This makes it easy to detect the separation of the catalyst from the binder. However, in other embodiments, the infiltrant material and catalyst can be the same.

In particular embodiments, infiltrant material 50 may be an alloy, such as a nickel (Ni) alloy or other metal alloy such as a Group VIII metal alloy. Even when this alloy is unsuitable for use as a catalyst material in PCD formation, the advantage of the melting temperature can make the alloy suitable for use as an infiltrant material.

After superabrasive element 60 is formed, infiltrant material 50 may be found in substrate 70 where it may function as a binder. Infiltrant material 50 may also be found in filled pores in TSP body 30 near interface 100 . In some embodiments, infiltrant material 50 may be substantially confined within contact surface 100 and pores open to the contact surface. However, in other embodiments, the infiltrant material 50 may enter pores near the contact surface 100 as well. The portion of TSP body 30 that includes infiltrant material 50 may form region 80 that includes infiltrant material, while the remainder of TSP body 30 that is substantially free of binder may form region 90 that does not contain infiltrant. According to a particular embodiment, infiltrant material 50 penetrates into TSP body 30 from interface 100 to a depth D, which may be any average depth sufficient to bond TSP body 30 to substrate 70 . In a particular embodiment, it may be no greater than 100 μm. In other specific embodiments, it may be not greater than 4 times the particle size, not greater than 2 times the particle size, not greater than 1 time the particle size, not greater than half the particle size, not greater than a quarter of the particle size, wherein the particle size is for Diamond particles on or near the contact surface 100. In other embodiments, the infiltrant material 50 may infiltrate only the spaces of the exposed pores on the contact surface 100 .

The infiltrant material 50 may impart properties to the TSP body 30 that are similar to those imparted by the catalyst to PCD. Specifically, the infiltrant material 50 may reduce the wear resistance and thermal stability found in the TSP bulk region. In an example embodiment, in order to minimize the negative impact of infiltrant material 50 on wear resistance and thermal stability, the depth D of region 80 containing infiltrant material is reduced or minimized enough to reduce the TSP The amount of body 30 bonded to substrate 70 is advantageous.

Without being limited by the mechanism by which infiltrant material 50 bonds, according to certain embodiments, the manner in which infiltrant material 50 bonds TSP body 30 to substrate 70 may include forming an infiltrant material between TSP body 30 and substrate 70. Physically continuous matrix.

Matrix powder 40 or 40a may be formed into substrate 70 using any suitable forming process. In certain embodiments, the forming process can provide one-step substrate forming and joining without requiring separate forming and joining steps like some prior art processes.

In one embodiment, the forming process may be a one-step infiltration process. Typically, in such a process (as in any hot-pressing process that relies on infiltrating the TSP body 30 through the infiltrant material 50 to bond it to the substrate 70), any material other than diamond on the contact surface 100 The material may interfere with the wetting and bonding of the infiltrant material 50 , so in some embodiments, the contact surface 100 of the TSP body 30 may be cleaned prior to incorporation into the assembly 10 . The assembly 10 may be assembled as described above, then placed in a furnace and heated to a temperature for a period of time sufficient to allow the infiltrant material 50 to infiltrate the matrix powder 40 and the TSP body 30 and to infiltrate the matrix powder 40 and the TSP body 30. 40 is cast into base 70 . In particular, the furnace may be heated to the infiltration temperature of the infiltrant material 50 or higher. The lowest temperature at which the infiltrant material 50 can be infiltrated may be referred to as the infiltration temperature. The time spent at the infiltration temperature or higher may be the minimum time required to infiltrate matrix powder 40 to form base 70 and connect base 70 to TSP body 30 . In certain embodiments, the time spent at the infiltration temperature or higher may be 60 seconds or less. In order to prevent oxidation reaction or contamination of the infiltrant material 50 or the matrix powder 40 during the forming process, the process is performed in a vacuum or an oxygen-free atmosphere such as a reducing atmosphere or an inert atmosphere.

According to a particular embodiment, infiltrant material 50 may pass through matrix powder 40 due to attractive forces, such as capillary action. Upon reaching the contact surface 100 of the TSP body 30, the infiltrant material 50 may wet and bond the surface. In a particular embodiment, infiltrant material 50 enters the open pores and fills them to form filled pores. The infiltrant material 50 may be drawn into the pores by attractive forces such as capillary action. This is especially true if the infiltrant material 50 is chosen to have an affinity for diamond.

After heating, assembly 10 may be removed from the furnace and cooled to a temperature below the infiltration temperature. In certain embodiments, cooling can be carefully controlled to reduce or minimize any damage to the connection of substrate 70 to TSP body 30 . For example, control can be performed such that any residual stresses are reduced or minimized. Finally, superabrasive element 60 may be removed from mold 20 .

According to another embodiment, assembly 10a may be used to form superabrasive element 60 by a one-step hot pressing process. As noted above, in some embodiments, the force generated by thermocompression can provide sufficient mechanical connection of TSP body 30 to substrate 70, with no or minimal effect of connection through an infiltrating material. In such embodiments, TSP body 30 may be shaped to facilitate this mechanical connection. For example, it may have a shape as shown in FIGS. 4 and 5 . In other embodiments, the attachment of TSP body 30 to substrate 70 may rely in part or substantially on infiltration of TSP body 30 with infiltrant material 50, even when thermal compression is used. In such an embodiment, any non-diamond material on the contact surface 100 would interfere with the wetting and bonding of the infiltrant material 50, so that the contact surface 100 of the TSP body 30 could be pretreated prior to incorporation into the assembly 10a. clean.

After cleaning (if cleaning is performed), TSP body 30 may be placed into hot press mold 20a and then packed with matrix powder 40a, which may contain matrix material and impregnating material or binder. The mold may then be closed and hot pressed at a temperature and pressure sufficient to melt the infiltrant material or binder and form it into substrate 70 . In embodiments where the infiltrant material infiltrates the TSP body 30, the temperature and pressure are also sufficient to allow such infiltration to occur. In certain embodiments, heat pressing can include cycling of varying temperature and pressure over time.

According to certain embodiments, hot pressing may be performed in an inert atmosphere or a reducing atmosphere to prevent or reduce damage to the TSP body 30 . Alternatively, the temperature can be carefully controlled to prevent oxidation of the TSP body 30 .

Hot pressing may be used to form a single superabrasive element 60, or multiple assemblies 10a may be processed at the same time to form multiple superabrasive elements 60 simultaneously. In any event, the individual superabrasive elements may be removed from mold 20a after hot pressing is complete.

In any infiltration process, the temperature and pressure used can be outside the stable range of traditional diamond. The temperatures and pressures at which PCD degrades to graphite are known in the art and described in the literature. For example, the range of diamond stability can be determined by referring to the following documents: Bundy et al., "Diamond-Graphite Equilibrium Line from Growth and Graphitization of Diamond (diamond-graphite equilibrium curve of diamond growth and graphitization)" J.of Chemical Physics, 35 (2):383-391(1961), Kennedy and Kennedy, "the Equilibrium Boundary Between Graphite and Diamond" J.of Geophysical Res.,81(14):2467-2470(1976 ) and Bundy et al., "The Pressure-Temperature Phase and Transformation Diagram for Carbon; Updated through 1994" Carbon 34(2):141-153 (1996), each by reference Incorporated into the Materials section of this article. The high stability characteristics of TSP allow it to withstand temperatures and pressures outside the stable range of diamond for the time required to form superabrasive element 60 . For example, the temperature can be as high as 1100°C or 1200°C at the pressures used in the infiltration process.

Often, if the pressure is carefully controlled, an infiltrant with a higher melting temperature can be used, thereby reducing the likelihood of the infiltrant melting under downhole conditions or other severe conditions.

Although it is possible to use temperatures and pressures outside the diamond stable range, in many embodiments, such as in some hot pressing methods, the temperature and pressure can be within the diamond stable range. For example, some hot pressing techniques may use temperatures in the range of 850°C to 900°C, especially 870°C.

In addition to causing a reduction in erosion resistance as described above, the presence of other infiltrant materials 50 in substrate 70 contributes to a lower hardness of substrate 70 than conventional substrates compared to similar amounts of catalyst or binder in conventional PCD element substrates. . This may cause increased bending stress on TSP body 30 during use of superabrasive element 60 . To increase the hardness of the base 70, the base 70 may include a carbide insert 140 as shown in FIG. The carbide insert 140 may be made of binder-free or near-binder-free carbide and may be resistant to infiltration by the infiltrant material 50 . Carbide insert 140 may be placed within matrix powder 40 in assembly 10 . After the superabrasive element 60 is formed, the carbide insert 140 present in the substrate 70 may have substantially the same configuration as the carbide insert 140 when placed in the matrix powder 40 . In addition to increasing the hardness of the substrate 70, the carbide insert 140 can be exposed to the non-TSP body end of the superabrasive element 60 after grinding, and can then be used as a connection point in a brazing process or rotation or replacement of the superabrasive element the bootstrap. In another embodiment, the insert may be made of other suitable materials than carbide, such as ceramic.

The superabrasive elements of the present invention can be any element form that would benefit from a TSP surface. In particular embodiments, it may be a cutting body of an earth-boring drill bit or a component of an industrial tool. Embodiments of the invention also include tools comprising the superabrasive elements of the invention. Particular embodiments include industrial tools and earth drilling bits, such as fixed cutter bits. Other particular embodiments include wear-resistant elements, bearings, or nozzles for high-pressure fluid.

Due to the ability to leach the TSP body 30, when combined with a substrate, more than one PCD layer can typically be leached, so the superstructure of the present invention can be used where multiple components with conventionally leached PCD layers cannot be used. Hard abrasive body. For example, superabrasive elements can be used at higher temperatures than similar elements with conventionally leached PCD layers.

When the superabrasive element of the present invention is used as a cutting body for an earth drilling bit, it can be used to replace any conventional leached PCD cutting body. In many embodiments, it can be connected to the drill bit through the base 70 . For example, the substrate 70 may be connected to the cavity in the drill bit by brazing.

When used in the cutting portion of a drill, the working surface of the cutting body will wear faster than the rest of the TSP body 30 . When using a circular cutting body as shown in Figure 2, the cutting body can be rotated to dislodge worn TSP from the work surface and move unused TSP to the work surface. The circular cutting body according to the invention can be rotated in this way at least twice, often three times, before the cutting body becomes unusable due to excessive wear. The method of connection and rotation may be any method employed in the case of conventionally leached PCD cutting bodies or otherwise. Similarly, the non-circular cutting body may be indexable so that it moves to replace a worn working surface rather than replacing the entire cutting body.

In embodiments using inserts of the shape shown in FIG. 6 or other suitable shapes, the inserts can be used as guides to align the working surface so that during use of the superabrasive elements the working surface is also subjected to stress from the Additional support for plugins. For example, when using an insert as shown in Figure 6, the components can be aligned so that their working surface is substantially along one arm of the insert and not between two arms.

In addition to being able to rotate, conventional PCD cutting bodies can also be removed from the drill bit. This enables a worn or damaged cutting body to be replaced, or a different cutting body which is more preferable for the rock formation being drilled. The ability to replace the cutting body significantly extends the overall life of the earth drilling bit and enables it to be used in different rock formations. Cutting bodies formed using superabrasive elements according to the present invention may also be removed and replaced by any of the methods used for conventional leached PCD cutting bodies.

In certain other embodiments, the superabrasive elements of the present invention may be used to direct fluid flow or for corrosion control in earth drilling drill bits. For example, it may be used in place of the abrasive structures described in U.S. 7,730,976; U.S. 6,510,906; or U.S. 6,843,333, each incorporated by reference in the Materials section.

Although only exemplary embodiments of the present invention have been described in detail above, it should be understood that modifications and changes can be made to these examples without departing from the spirit and intended protection scope of the present invention. For example, while superabrasive elements are discussed in detail, other elements comprising similar components, such as leached cubic boron nitride, and similar methods of forming such elements may be used.

Claims (58)

1. A superabrasive element, said element comprising: A thermally stable polycrystalline diamond (TSP) body substantially free of catalyst, the diamond (TSP) body comprising pores and contact surfaces; a substrate adjacent to the contact surface of the TSP body; and A non-catalyst alloy infiltrant material that infiltrates the pores at the interface of the substrate and the TSP body. 2. The superabrasive element of claim 1, wherein the substantially catalyst-free TSP body comprises polycrystalline diamond (PCD), at least 85% of the catalyst has been removed from the polycrystalline diamond (PCD) removed to form holes. 3. The superabrasive element of claim 1, wherein the substantially catalyst-free thermally stable polycrystalline diamond TSP body comprises acid-leached TSP body. 4. The superabrasive element of claim 3, wherein the acid-leached TSP body comprises _FeCl3 -acid-leached TSP body. 5. The superabrasive element of claim 1 , wherein the TSP body comprises diamond particles having an average particle size, and the infiltrant material is infiltrated to a depth in the pores of the TSP body , the depth is equal to or less than twice the average particle size from the contact surface. 6. The superabrasive element of claim 1, wherein the contact surface is an uneven surface. 7. The superabrasive element of claim 1, wherein the substrate comprises a material selected from the group consisting of carbide, tungsten, tungsten carbide, synthetic diamond, natural diamond, or nickel, chromium, iron, Copper, manganese, phosphorus, oxygen, zinc, tin, cadmium, lead, bismuth, tellurium and any combination thereof. 8. The superabrasive element of claim 1, further comprising a carbide insert disposed in the substrate. 9. The superabrasive element of claim 1, wherein the non-catalyst alloy infiltrant material comprises a Group VIII metal alloy. 10. The superabrasive element of claim 1, wherein the superabrasive element is in the form of a cutting body for an earth drilling bit. 11. A superabrasive element comprising: a substantially catalyst-free thermally stable polycrystalline diamond (TSP) body having pores, contact surfaces, and diamond particles having an average particle size; a substrate adjacent to the contact surface of the TSP body; and an infiltrant material that impregnates the substrate and into the pores of the TSP body interface to a depth equal to or less than two times the average particle size from the interface. times. 12. The superabrasive element of claim 11 , wherein the substantially catalyst-free TSP body comprises polycrystalline diamond (PCD) from which at least 85% of the catalyst has been removed to form hole. 13. The superabrasive element of claim 11, wherein the substantially catalyst-free thermally stable polycrystalline diamond TSP body comprises an acid-leached TSP body. 14. The superabrasive element of claim 13, wherein the acid-leached TSP body comprises _FeCl3 -acid-leached TSP body. 15. The superabrasive element of claim 11, wherein the contact surface is an uneven surface. 16. The superabrasive element of claim 11 , wherein the substrate comprises a material selected from the group consisting of carbide, tungsten, tungsten carbide, synthetic diamond, natural diamond, or nickel, chromium, iron , copper, manganese, phosphorus, oxygen, zinc, tin, cadmium, lead, bismuth, tellurium and any combination thereof. 17. The superabrasive element of claim 11, further comprising a carbide insert disposed in the substrate. 18. The superabrasive element of claim 11, wherein the infiltrant material comprises a Group VIII metal. 19. The superabrasive element of claim 11, wherein the superabrasive element is in the form of a cutting body for an earth drilling bit. 20. An earth drilling bit comprising a cutting body comprising a superabrasive element comprising: A thermally stable polycrystalline diamond (TSP) body substantially free of catalyst, the diamond (TSP) body comprising pores and contact surfaces; a substrate adjacent to the contact surface of the TSP body; and A non-catalyst alloy infiltrant material that infiltrates into the substrate and into the pores at the TSP body interface. 21. The earth-boring drill bit of claim 20, wherein the substantially catalyst-free TSP body comprises polycrystalline diamond (PCD) from which at least 85% of the catalyst has been removed to form pores . 22. The earth-boring drill bit of claim 20, wherein the substantially catalyst-free thermally stable polycrystalline diamond TSP body comprises an acid-leached TSP body. 23. The earth-boring drill bit of claim 22, wherein the acid-leached TSP body comprises _FeCl3 -acid-leached TSP body. 24. The earth drilling bit of claim 20, wherein the TSP body comprises diamond particles having an average grain size, and the infiltrant material is infiltrated into the pores of the TSP body to a depth, The depth is equal to or less than twice the average particle size from the contact surface. 25. The earth-boring bit of claim 20, wherein the contact surface is an uneven surface. 26. The earth drilling bit of claim 20, wherein the substrate comprises a material selected from the group consisting of carbide, tungsten, tungsten carbide, synthetic diamond, natural diamond, or nickel, chromium, iron, Copper, manganese, phosphorus, oxygen, zinc, tin, cadmium, lead, bismuth, tellurium and any combination thereof. 27. The earth drilling bit of claim 20, wherein the superabrasive element further comprises a carbide insert disposed in the substrate. 28. The earth drilling bit of claim 20, wherein the non-catalyst alloy infiltrant material comprises a Group VIII metal alloy. 29. The earth drilling bit of claim 20, wherein the bit is a fixed cutting body bit. 30. The earth-boring drill bit of claim 20, wherein the cutting body comprises a rotatable and displaceable cutting body. 31. An earth drilling bit comprising a cutting body comprising a superabrasive element comprising: a substantially catalyst-free thermally stable polycrystalline diamond (TSP) body having pores, contact surfaces, and diamond particles having an average particle size; a substrate adjacent to the contact surface of the TSP body; and an infiltrant material that impregnates the substrate and into the pores at the TSP body interface to a depth equal to or less than an average particle size from the interface twice as much. 32. The earth drilling bit of claim 31 , wherein the substantially catalyst-free TSP body comprises polycrystalline diamond (PCD) from which at least 85% of the catalyst has been removed to form pores . 33. The earth-boring drill bit of claim 31, wherein the substantially catalyst-free thermally stable polycrystalline diamond TSP body comprises an acid-leached TSP body. 34. The earth-boring drill bit of claim 33, wherein the acid-leached TSP body comprises _FeCl3 -acid-leached TSP body. 35. The earth-boring bit of claim 31, wherein the contact surface is an uneven surface. 36. The earth drilling bit of claim 31 , wherein the substrate comprises a material selected from the group consisting of carbide, tungsten, tungsten carbide, synthetic diamond, natural diamond, or nickel, chromium, iron, Copper, manganese, phosphorus, oxygen, zinc, tin, cadmium, lead, bismuth, tellurium and any combination thereof. 37. The earth-boring drill bit of claim 31, wherein the superabrasive element further comprises a carbide insert disposed in the substrate. 38. The earth well drilling bit of claim 31, wherein the infiltrant material comprises a Group VIII metal. 39. The earth drilling bit of claim 31, wherein the bit is a fixed cutting body bit. 40. The earth-boring drill bit of claim 31, wherein the cutting body comprises a rotatable and displaceable cutting body. 41. A method of forming a superabrasive element, the method comprising: Assemble the components including: a mold having a bottom; a thermally stable polycrystalline diamond (TSP) body having holes and contact surfaces and located within the bottom of the mold; a matrix powder positioned adjacent to the interface and above the TSP body within the mold; and an infiltrant material placed over the matrix powder in the mold; heating the assembly under a pressure condition to a temperature and for a time sufficient to infiltrate the pores of the matrix powder and TSP body with an infiltrant material; and The assembly is cooled to form a superabrasive element. 42. The method of claim 41, further comprising forming the TSP body prior to assembling the components. 43. The method of claim 41 , wherein the step of forming the TSP body comprises leaching a polycrystalline diamond compact (PCD) to remove catalyst from the interstitial matrix and form pores, the polycrystalline diamond The compact consists of a diamond matrix and an interstitial matrix containing catalyst. 44. The method of claim 43, wherein said leaching comprises leaching with an acid leaching reagent comprising _FeCl3 . 45. The method of claim 43, further comprising removing at least 85% of the catalyst from the PCD. 46. The method of claim 41, further comprising infiltrating at least the exposed pores of the interface with an infiltrant material. 47. The method of claim 41, wherein the step of assembling the component further comprises placing a carbide insert in the matrix powder. 48. The method of claim 41, further comprising cleaning contact surfaces of the TSP body prior to assembling the assembly. 49. The method of claim 41, further comprising cooling the assembly from the bottom. 50. A method of forming a superabrasive element, the method comprising: Assemble the components including: a mold having a bottom; a thermally stable polycrystalline diamond (TSP) body having holes and contact surfaces and located within the bottom of the mold; a matrix powder positioned adjacent to the interface and over the TSP body within the mold; and an infiltrant material placed within the matrix powder in the mould; heating the assembly under a pressure condition to a temperature and for a time sufficient to infiltrate the matrix powder and pores of the TSP body with an infiltrant material; and The assembly is cooled to form a superabrasive element. 51. The method of claim 50, further comprising forming the TSP body prior to assembling the components. 52. The method of claim 50, wherein the step of forming the TSP body comprises leaching a polycrystalline diamond compact (PCD) to remove catalyst from the interstitial matrix and form pores, the compact comprising diamond Substrate and interstitial substrate containing catalyst. 53. The method of claim 52, wherein said leaching comprises leaching with an acid leaching reagent comprising _FeCl3 . 54. The method of claim 52, further comprising removing at least 85% of the catalyst from the PCD. 55. The method of claim 50, further comprising infiltrating at least the exposed pores of the interface with an infiltrant material. 56. The method of claim 50, further comprising placing a carbide insert in the matrix powder. 57. The method of claim 50, further comprising cleaning contact surfaces of the TSP body prior to assembling the assembly. 58. The method of claim 50, further comprising cooling the assembly from the bottom.