CN104170013B - The manufacture method and information recording carrier of glass substrate for information recording medium - Google Patents
The manufacture method and information recording carrier of glass substrate for information recording medium Download PDFInfo
- Publication number
- CN104170013B CN104170013B CN201380011847.3A CN201380011847A CN104170013B CN 104170013 B CN104170013 B CN 104170013B CN 201380011847 A CN201380011847 A CN 201380011847A CN 104170013 B CN104170013 B CN 104170013B
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- Prior art keywords
- grinding
- glass substrate
- carrier
- retaining hole
- information recording
- Prior art date
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- 239000011521 glass Substances 0.000 title claims abstract description 179
- 239000000758 substrate Substances 0.000 title claims abstract description 164
- 238000000034 method Methods 0.000 title claims description 93
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 238000000227 grinding Methods 0.000 claims description 147
- 230000005291 magnetic effect Effects 0.000 claims description 36
- 239000010409 thin film Substances 0.000 claims description 24
- 239000012530 fluid Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 claims description 3
- 230000001050 lubricating effect Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 43
- 230000000052 comparative effect Effects 0.000 description 26
- 238000007517 polishing process Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 13
- 239000000126 substance Substances 0.000 description 12
- 238000012545 processing Methods 0.000 description 10
- 239000011241 protective layer Substances 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000314 lubricant Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 238000004441 surface measurement Methods 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 3
- 229910000943 NiAl Inorganic materials 0.000 description 3
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 239000005368 silicate glass Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910001149 41xx steel Inorganic materials 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- 229910001413 alkali metal ion Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000006121 base glass Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 229910019222 CoCrPt Inorganic materials 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910005335 FePt Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000006249 magnetic particle Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Magnetic Record Carriers (AREA)
Abstract
Carrier (500) has：Configure and run through retaining hole (520C) in one the 1st of near center location；Multiple 2 run through retaining hole (520P) through what retaining hole (520C) annularly configured with around the 1st, in the case where the diameter of glass substrate (1) to be set to Dmm and will be set to rmm to the distance of the 1st center (C2) for running through retaining hole (520C) from the center of carrier (500) (C1), the 1st of carrier (500) the is arranged on the opening position of the relational expression of satisfaction [(D/4)≤r≤(D/2)] through the center (C2) of retaining hole (520C).
Description
Technical field
The present invention relates to the manufacture method of glass substrate for information recording medium and information recording carrier, more particularly to
The manufacture method of the glass substrate for information recording medium used in the manufacture of information recording carrier and possess the information record Jie
The information recording carrier of matter glass substrate.
Background technology
The information recording carriers such as disk are equipped on computer etc. as hard disk.Information recording carrier is on the surface of substrate
Upper to form the magnetic thin film layer comprising recording layer to manufacture, the recording layer make use of magnetic, light or optomagnetic etc. property.Note
Record layer is magnetized by magnetic head, thus by defined information record in information recording carrier.
Information recording carrier is improving constantly packing density year by year.Accompany with this, for used in information recording carrier
The quality of substrate, also requires high quality.As the substrate of information recording carrier, all the time using aluminium base, still, with
The raising of packing density, gradually replace with the flatness of substrate surface and the glass substrate that intensity is more excellent than aluminium base.
In the manufacture method of the glass substrate of information recording carrier, have and be used to ensure higher surface configuration precision
Grinding process/grinding step.In order to realize the high-precision shape quality of glass substrate, employ working process ability not
Same slurry and grinding/grinding pad effectively combines, 2 grinding/grinding steps more than stage.Such as in Japan
There is the conventional technology related to the manufacture of glass substrate disclosed in JP 2007-015105 publications (patent document 1).
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2007-015105 publications
The content of the invention
The invention problem to be solved
For the glass substrate used as information recording carrier, multiple glass substrates are typically held in carrier
(carrier) grinding/grinding for running through retaining hole, carrying out glass substrate set on.In recent years, in order to cut down cost, exist
Such trend：Increase the glass substrate number on each carrier used in grinding/grinding.
In addition, in order to improve the packing density of each glass substrate, or even the end face to outer circumferential side by glass substrate
Neighbouring region is used as information recording area, and therefore, the shape finishing precision of the outer circumference side edge face of glass substrate also requires
Higher precision.
If set for carrier in a manner of most close through retaining hole, also it is placed with the near center location of carrier
Glass substrate.If glass substrate to be configured to the center of carrier, when double-sided grinding device is driven in grinding process, configuration
Center glass substrate be concentrated through in grinding pad platform inner circumferential near and platform periphery near among region (with
Under, referred to as Intermediate Gray region.) same position.
Glass substrate is concentrated through this case that the same position of grinding pad causing in grinding process, on grinding pad
, the part that glass substrate passes through produce grinding pad (bonded-abrasive) uneven wear, so as to grinding pad middle band
Domain produces the step (impression) that section is spill.
If producing step on grinding pad, easily produced on the surface of glass substrate and damage is ground as caused by the step
Hinder (cut).In addition, in order to eliminate the grinding damage, prolonged processing is needed in grinding step thereafter, and (larger goes
Except amount).But grinding using soft mostly in grinding step below, particularly final grinding step (precise finiss)
Mill pad, if the time of final grinding step is elongated, the end surface shape of glass substrate deteriorates.
The present invention be in view of above-mentioned problem and complete, there is provided a kind of manufacture method of glass substrate for information recording medium
And information recording carrier, in the grinding process of double-sided grinding device has been used, it can suppress to produce step on grinding pad.
The means used to solve the problem
In the manufacture method of the glass substrate for information recording medium based on the present invention, described information recording medium is in circle
Formed with magnetic thin film layer on the main surface of the glass substrate of disk shape, in the manufacturer of described information recording medium glass substrate
In method, there is surface grinding process, in the surface grinding process, using the double-sided grinding device for possessing planetary gears,
Water, grinding fluid or lubricating fluid are supplied while being ground the main surface of above-mentioned glass substrate.
Above-mentioned double-sided grinding device possesses：Upper mounting plate, it is located at the upside of above-mentioned glass substrate, and in the upper of the upper mounting plate
Stating glass substrate side has upside grinding pad；Lower platform, it is located at the downside of above-mentioned glass substrate, and in the above-mentioned of the lower platform
Glass substrate side has downside grinding pad；And discoid carrier, it, which is provided with, protects multiple running through for the above-mentioned glass substrates of holding
Hole is held, above-mentioned carrier is clipped by above-mentioned upside grinding pad and above-mentioned downside grinding pad, and enters by above-mentioned planetary gears
Rotary motion as defined in row.
It is above-mentioned to have through retaining hole：Be configured in the near center location of above-mentioned carrier one the 1st runs through retaining hole；
Multiple 2 run through retaining hole through what retaining hole annularly configured with around the above-mentioned 1st.
The diameter of above-mentioned glass substrate is being set to Dmm and protected running through from the center of above-mentioned carrier to the above-mentioned 1st
Hold the center in hole distance be set to rmm in the case of, the above-mentioned 1st is arranged on satisfaction through the center of retaining hole
The opening position of the relational expression of [(D/4)≤r≤(D/2)].
In another way, above-mentioned carrier, than annularly configured through retaining hole around the above-mentioned 1st above-mentioned the
2 opening position on the inside of radial direction of the retaining hole by above-mentioned carrier, also with diameter than above-mentioned through small auxiliary of retaining hole
Help through hole.
Possess in the information recording carrier based on the present invention：Glass substrate, it is by any one above-mentioned mode institute
What the manufacture method for the glass substrate for information recording medium stated obtained；And magnetic thin film layer, it is formed in above-mentioned glass substrate
On main surface.
Invention effect
In accordance with the invention it is possible to provide manufacture method and information record Jie of a kind of glass substrate for information recording medium
Matter, in the grinding process of double-sided grinding device has been used, it can suppress to produce step on grinding pad.
Brief description of the drawings
Fig. 1 is the stereogram for showing the glass substrate obtained by the manufacture method by the glass substrate in embodiment.
Fig. 2 is the disk for showing to possess the glass substrate obtained by the manufacture method by the glass substrate in embodiment
Stereogram.
Fig. 3 is the flow chart for the manufacture method for showing the glass substrate in embodiment.
Fig. 4 is the partial perspective view of the double-sided grinding device used in grinding process.
Fig. 5 is the top view for showing the carrier in embodiment.
Fig. 6 is the top view for the size relationship for showing the carrier in embodiment.
Fig. 7 is the top view of glass substrate.
Fig. 8 is the top view for showing to refer to the carrier in technology.
Fig. 9 is the top view of the downside grinding pad in the technology that refers to.
Figure 10 is the top view for showing the carrier in another embodiment.
Figure 11 be show embodiment 1-2, end surface shape in comparative example 1-2 evaluation result figure.
Embodiment
Below, referring to the drawings, to being illustrated based on embodiments of the present invention and embodiment.In embodiment and implementation
In the explanation of example, in the case where referring to number, amount etc., except in the case of having and especially recording, the scope of the present invention simultaneously differs
Fixed limit is due to the number, amount etc..In the explanation of embodiment and embodiment, such situation be present：For the same part and
Corresponding part, identical reference number is marked, and the explanation of repetition is not repeated.
[glass substrate/disk 10]
Referring to Figures 1 and 2, first, to the manufacture by the glass substrate for information recording medium based on present embodiment
Glass substrate 1 obtained by method and the disk 10 for possessing glass substrate 1 illustrate.Fig. 1 is shown in (the reference of disk 10
The stereogram of the glass substrate 1 used in Fig. 2).Fig. 2 is to be shown as information recording carrier, possess the disk of glass substrate 1
10 stereogram.
As shown in figure 1, the glass substrate 1 (glass substrate for information recording medium) used in disk 10 is in middle heart
The circular plate shape of Cheng Youkong 1H ring-type.The glass substrate 1 of disc-shape has the main surface 1A in front, back side major surface 1B, interior
All end face 1C and peripheral end face 1D.
The size of glass substrate 1 is not particularly limited, for example, external diameter is 0.8 inch, 1.0 inches, 1.8 inches, 2.5 English
It is very little or 3.5 inches etc..From the viewpoint of breakage is prevented, the thickness of glass substrate 1 is, for example, 0.30mm~2.2mm.This reality
Applying the size of the glass substrate 1 in mode is：External diameter is about 65mm, and internal diameter is about 20mm, and thickness is about 0.8mm.Glass
The thickness of glass substrate 1 is that the average of the value that is measured at any number of points by the point symmetry on glass substrate 1 calculates
Value.
As shown in Fig. 2 in disk 10, formed with magnetic film on the positive main surface 1A of above-mentioned glass substrate 1, from
And form the magnetic thin film layer 2 for including magnetic recording layer.In fig. 2, formed with magnetic thin film layer 2 only on the main surface 1A in front, but
Can be overleaf on main surface 1B formed with magnetic thin film layer 2.
Magnetic thin film layer 2 is main by the way that the thermosetting resin for being dispersed with magnetic particle to be spun on to the front of glass substrate 1
(spin-coating method) formed on the 1A of surface.Magnetic thin film layer 2 can also be formed at glass substrate by sputtering method or electroless plating method etc.
1 positive main surface 1A.
On the thickness of the magnetic thin film layer 2 formed on the positive main surface 1A of glass substrate 1, in the case of spin-coating method
It is about 0.3 μm~about 1.2 μm, is about 0.04 μm~about 0.08 μm in the case of sputtering method, in electroless plating method
In the case of be about 0.05 μm~about 0.1 μm.From the viewpoint of filming and densification, preferably pass through sputtering method or change
Plating method is learned to form magnetic thin film layer 2.
As the magnetic material for magnetic thin film layer 2, it is not particularly limited, known magnetic material can be used,
But in order to obtain high confining force, based on the Co higher by crystalline anisotropy and to adjust relict flux density as mesh
And to add Ni or Cr Co class alloys etc. proper.In addition, as the magnetic layer material suitable for thermal assisted recording, can
With using the material of FePt classes.
In addition, in order to improve the smoothness of magnetic recording head, lubricant can be thinly coated on the surface of magnetic thin film layer 2.
As lubricant, such as it can enumerate to be diluted as the PFPE (PFPE) of fluid lubricant by the use of the solvent of freon class etc. and obtain
The lubricant arrived.
Furthermore, it is also possible to it is arranged as required to basalis or protective layer.Basalis in disk 10 selects according to magnetic film
Select.As the material of basalis, such as it can enumerate what is selected from the nonmagnetic metal such as Cr, Mo, Ta, Ti, W, V, B, Al or Ni
Material more than at least one.
In addition, basalis is not limited to individual layer, the multilayer for being laminated identical type or different types of layer forms can also be set to
Structure.For example, the multi-layer substrates such as Cr/Cr, Cr/CrMo, Cr/CrV, NiAl/Cr, NiAl/CrMo or NiAl/CrV can be set to
Layer.
As the protective layer for abrasion and the corrosion for preventing magnetic thin film layer 2, such as Cr layers, Cr alloy-layers, carbon-coating, hydrogen can be enumerated
Change carbon-coating, zirconia layer or silicon dioxide layer etc..These protective layers can utilize in-line arrangement together with basalis, magnetic film etc.
Sputter equipment is continuously formed.In addition, these protective layers can be set to individual layer, or it is set to by identical type or variety classes
Layer form sandwich construction.
Other protective layers can be formed on above-mentioned protective layer, or substitutes above-mentioned protective layer and forms other protective layers.
For example, above-mentioned protective layer can be substituted, and on Cr layers, during the solvent dilution tetraalkoxysilane with alcohol type, point
Dissipate ground coating colloid silicon dioxide microparticle and be sintered, form silica (SiO2) layer.
[manufacture method of glass substrate]
Next, using the flow chart shown in Fig. 3, in present embodiment glass substrate for information recording medium (with
Under, referred to simply as glass substrate.) manufacture method illustrate.Fig. 3 is the manufacture for showing the glass substrate 1 in embodiment
The flow chart of method.
The manufacture method of glass substrate in present embodiment possesses glass blank preparatory process (step S10), glass base
Plate formation process (step S20), grinding/grinding step (step S30), chemical enhanced process (step S40) and matting
(step S50).The glass substrate that can be obtained to process chemical intensification treatment process (step S40) is (equivalent to the glass in Fig. 1
Substrate 1) implement magnetic thin film formation process (step S60).By magnetic thin film formation process (step S60), can obtain as letter
Cease the disk 10 of recording medium.
Hereinafter, in the description below illustrated successively to this each step S10~S60 details, do not record
The simplified cleaning suitably carried out between each step S10~S60.
(glass blank preparatory process)
In glass blank preparatory process (step S10) so that the glass material melting (step of glass substrate to be formed
S11).Glass material is for example with common alumina silicate glass.Alumina silicate glass contains 58% mass percent~75%
The SiO of mass percent2, the mass percent of 5% mass percent~23% Al2O3, the mass of 3% mass percent~10%
The Li of percentage2O, the Na of the mass percent of 4% mass percent~13%2O is as main component.The glass material of melting exists
After flowing on lower mould, punch forming (step S12) is carried out by upper die and lower die.Discoid glass is formd by punch forming
Glass blank (base glass material).
Glass blank, which can utilize, to be ground grinding tool and cuts out the foliated glass formed by pulling down (down draw) method or float glass process
(plate glass) and formed.In addition, glass material is not limited to alumina silicate glass, can be arbitrary material.
(glass substrate formation process)
Next, in glass substrate formation process (step S20), for the purpose of improving dimensional accuracy and form accuracy,
Implement the 1st friction process (step S21) in the main surface of two sides of the glass blank formed to punch forming.Two sides of glass blank
Main surface refer to main surface by each processing described later and as the positive main surface 1A in Fig. 1 and as the main table in the back side
Face 1B main surface (hereinafter referred to as two main surfaces).For example, by using granularity #400 alumina abrasive grain, (particle diameter is about
40~60 μm), surface roughness Rmax is finish-machined to as 6 μm or so.
After the 1st friction process, the diamond drill machine using cylindrical shape is first-class, implements coring to the central part of glass blank
(inner circumferential excision) handles (step S22).Handled by coring, can obtain opening up porose circular glass base in central part
Plate.Chamfer machining as defined in can also implementing to the hole of central part.
In addition, using brush by the peripheral end face of glass substrate and inner circumferential end surface grinding into mirror-like (step S22).As
Abrasive particle is ground, the slurry containing cerium oxide abrasive particle can be used.
(grinding/grinding step)
Next, in grinding/grinding step (step S30), the 2nd friction work is implemented to two main surfaces of glass substrate
Sequence (step S31).2nd friction process (step S31) is carried out using double-sided grinding device, and the double-sided grinding device make use of row
Star gear mechanism.Specifically, from two main surfaces that platform is pressed into glass blank up and down, by water, grinding fluid or lubrication
Liquid is supplied to two main surfaces, makes glass blank and friction platform relative movement, to carry out the 2nd friction process.
By the 2nd friction process (step S31), the depth of parallelism substantially, flatness and thickness of glass substrate etc. are entered
Row pre-adjustment, so as to obtain the base glass material on the main surface with general planar.In the 2nd friction process, produced to reduce
Polishing scratch, use the abrasive particle finer than the 1st friction process.It is for example, solid by installing diamond grinding pad etc. on platform
Determine abrasive particle, surface roughness Rmax will be refined on two faces of glass substrate as 2 μm or so.
Here, reference picture 4, is illustrated to the Sketch of double-sided grinding device 1000.Fig. 4 is in the 2nd friction process
The partial perspective view of the middle double-sided grinding device 1000 used.
Double-sided grinding device 1000 possesses：Upper mounting plate (upside grinding tool keeps platform) 300；(downside grinding tool is kept lower platform
Platform) 400；Upside is ground pad 310, and it is installed in the side (glass substrate side) relative with lower platform 400 of upper mounting plate 300
Lower surface on；And downside grinding pad 410, it is installed in the side (glass relative with upper mounting plate 300 of lower platform 400
Substrate-side) upper surface on.
It is to carry out grinding for two main surfaces to glass substrate 1 that upside, which is ground pad 310 and downside grinding pad 410,
Machining tool.Upper mounting plate 300 and lower platform 400 mutually rotate in the opposite direction relative to the revolution direction of carrier 500.In shape
Carrier 500 is configured with into the gap between upper mounting plate 300 and lower platform 400.The glass substrate 1 of multiple plate-likes is maintained at
On the carrier 500.In addition, the detailed construction of carrier 500 can be described afterwards.
The surface that upside grinding pad 310 and downside grinding pad 410 can be carried out in the 2nd friction process (step S31) is clear
Wash.Upside is ground pad 310 and the surface clean of downside grinding pad can be in any process in the 2nd friction process (step S31)
Middle progress, can also be carried out between any process in grinding/grinding step (step S30), or, can also grinding/
Grinding step (step S30) is carried out after terminating.
After one or many grindings are carried out to the main surface of the two of glass substrate 1, in double-sided grinding device 1000
The surface clean of grinding pad 310 and downside grinding pad 410 on the upside of middle progress.Upside is ground the table of pad 310 and downside grinding pad 410
Face can be periodically cleaned in the one or many grindings of every progress, or, can also aperiodically it be cleaned.
Next, as the 1st polishing process (rough lapping), remove and remain in glass in the 2nd friction process (step S31)
Cut on two main surfaces of substrate, while the warpage of glass substrate is corrected (step S33).In the 1st polishing process
In, use the double-side polishing apparatus that make use of planetary gears.For example, use hard velvet, polyurethane foam part or pitch
The grinding pads such as dipping suede are ground.As grinding agent, the slurry using common cerium oxide abrasive particle as main component is employed
Material.
In the 2nd polishing process (precise finiss), attrition process is again carried out to glass substrate, glass is remained in eliminate
(step S34) such as tiny flaws on two main surfaces of substrate.Two main surfaces of glass substrate are by being finish-machined to mirror
Planar, is formed as desired flatness, and the warpage of glass substrate is also eliminated.In the 2nd polishing process, using make use of row
The double-side polishing apparatus of star gear mechanism.For example, use the grinding as soft polisher using suede or velvet as material
Pad, is ground.As grinding agent, use with the common colloid finer than the cerium oxide used in the 1st polishing process
Silica is the slurry of main component.
(chemical enhanced process)
After glass substrate is cleaned, glass substrate is set to be impregnated in chemical intensification treatment liquid, thus the two of glass substrate
Individual main surface forms chemical enhanced layer (step S40).After glass substrate 1 is cleaned, glass substrate 1 is impregnated in and is heated to
30 minutes or so in the chemical intensification treatment liquid such as 300 DEG C of potassium nitrate (70%) and the mixing liquid of sodium nitrate (30%), thus
Carry out chemical enhanced.
The alkali metal ions such as the lithium ion that contains in glass substrate 1, sodium ion are by the big potassium of ratio of ionic radii these ions
The alkali metal ions such as ion replace (ion-exchange).
Due to because ionic radius is different and caused by deformation, producing compression in the region after having carried out ion exchange should
Power, so as to by two main surface peenings of glass substrate 1., can be from glass for example, on two main surfaces of glass substrate 1
The surface of glass substrate 1 forms chemical enhanced layer in the range of playing about 5 μm, so as to improve the rigidity of glass substrate 1.As described above
Like that, the glass substrate equivalent to the glass substrate 1 shown in Fig. 1 can be obtained.
The removal amount that can also further implement to glass substrate 1 on two main surfaces is more than 0.1 μm and less than 0.5 μm
Polishing., can by the way that the attachment that have passed through on the main surface that glass substrate 1 is remained in after chemical enhanced process is removed
To reduce the situation that head crash is produced on the disk produced using glass substrate 1.In addition, by by the two of polishing
Removal amount on individual main surface is set as more than 0.1 μm and less than 0.5 μm, will not occur on the surface because of chemical intensification treatment and
Caused stress inhomogeneous.The manufacture method of glass substrate in present embodiment is formed as described above.
It is strong alternatively, it is also possible to implement chemistry between the 1st polishing process (rough lapping) and the 2nd polishing process (precise finiss)
Chemical industry sequence.
(matting)
Next, glass substrate is cleaned (step S50).Using detergent, pure water, ozone, IPA (isopropanol),
Or UV (ultraviolet：Ultraviolet) ozone etc. cleans to two main surfaces of glass substrate, thus, it is attached to glass
Attachment on two main surfaces of substrate is removed.
Then, the attachment quantity on the surface of glass substrate 1 is checked using optical profile type flaw detection apparatus etc..
(magnetic thin film formation process)
Two main surfaces of the glass substrate (equivalent to the glass substrate 1 shown in Fig. 1) after chemical intensification treatment is completed
Magnetic film is formed on (or any one main surface), is consequently formed magnetic thin film layer 2.Magnetic thin film layer is by making layers below successively
Film forming and formed：It is brought into close contact layer, the soft ferromagnetic layer being made up of CoFeZr alloys by what Cr alloys were formed, taken by what Ru was formed
To control basalis, the perpendicular magnetic recording layer being made up of CoCrPt alloys, the protective layer being made up of C classes and the profit being made up of F classes
Slip layer.By forming magnetic thin film layer, the perpendicular magnetic recording disk equivalent to the disk 10 shown in Fig. 2 can be obtained.
Disk in present embodiment is an example of the vertical disk being made up of magnetic thin film layer.Disk can also be by magnetic
Property layer etc. is configured to disk in so-called face.
(carrier 500)
Next, reference picture 5 is to Fig. 7, it is two-sided to being used in the 2nd friction process in above-mentioned grinding/grinding process
The detailed construction of carrier 500 illustrates used by grinding attachment 1000.Fig. 5 is to show the carrier 500 in present embodiment
Top view, Fig. 6 is the top view for the size relationship for showing the carrier in present embodiment, and Fig. 7 is the vertical view of glass substrate 1
Figure.
Reference picture 5, the carrier 500 in present embodiment have the main body 510 of disc-shape, and its thickness is about 0.30mm
~2.2mm, select the thickness of the thickness of thin of the ratio glass substrate 1 to be kept.A diameter of about 430mm of carrier 500.Main body
510 can use aramid fiber, FRP (glass epoxy resin), PC (makrolon) etc..
Being provided with carrier 500 at 23 keeps glass substrate 1 to run through retaining hole 520.In the present embodiment, run through
Retaining hole 520 has：Run through retaining hole 520C for one the 1st, it is configured near the center C1 of carrier 500；With 22
Individual 2nd runs through retaining hole 520P, and they are annularly configured around the 1st through retaining hole 520C.In the present embodiment,
2 are arranged as double loop through retaining hole 520P, on interior ringed line r1, have been arranged at equal intervals 8 and have run through retaining hole
520P, on outer ringed line r2,14 have been arranged at equal intervals it and have run through retaining hole 520P.Through a diameter of big of retaining hole 520
About 66.5mm.
Here, reference picture 6, Dmm is being set to and by from the center C1 of carrier 500 to by the diameter of glass substrate 1
In the case that 1 distance for running through retaining hole 520C center C2 is set to rmm, the 1st runs through retaining hole 520C center
C2 is arranged on position (shadow region represented in figure with S) place of the relational expression of satisfaction [(D/4)≤r≤(D/2)].
In the present embodiment, the diameter D of glass substrate 1 is 65mm, therefore the 1st center for running through retaining hole 520C
C2 is arranged on the opening position for meeting 16.25mm≤r≤32.5mm.
Double-sided grinding device 1000 in present embodiment annularly configures 5 carriers 500 in upper mounting plate 300 with
Between platform 400.The outer peripheral face of carrier 500 is provided with gear, but eliminates the diagram of gear.In addition, the half of carrier 500
Footpath refers to the size in the case of being measured at the outside circle of gear.
Here, reference picture 8 and Fig. 9, are illustrated to the double-sided grinding device 1000 in the case of following：In carrier 500
Heart position C1 and the 1st overlaps through retaining hole 520C center C2, i.e. is arranged at carrier through retaining hole 520C by the 1st
500 center.Fig. 8 shows the carrier 500 run through the 1st in the case that retaining hole 520C is arranged at the center of carrier 500.
The two-sided mill of glass substrate 1 is being carried out using the carrier 500 shown in the Fig. 8 and using double-sided grinding device 1000
In the case of cutting, as shown in figure 9, when driving double-sided grinding device 1000, configure in the case where the glass substrate 1 at center is concentrated through
Side is ground same position, the i.e. Intermediate Gray region BL1 of pad 410.
Glass substrate 1 is concentrated through this case that the i.e. Intermediate Gray region BL1 of same position of downside grinding pad 410 causing
In grinding process, part on the downside grinding pad 410 as bonded-abrasive, glass substrate 1 passes through, produce downside and be ground
The uneven wear of pad 410, so as to produce step (pressure of the section for spill in the Intermediate Gray region BL1 of downside grinding pad 410
Trace).
If producing step on downside grinding pad 410, easily produce on the surface of glass substrate 1 and drawn by the step
The grinding damage (cut) risen.In addition, in order to eliminate the grinding damage, need to process for a long time in grinding step thereafter
(larger removal amount).But mostly using low in grinding step below, particularly final grinding step (precise finiss)
The grinding pad of hardness, if the time of final grinding step is elongated, the end surface shape of glass substrate deteriorates.This is not limited to down
Side is ground pad 410, and identical phenomenon can be also produced on upside grinding pad 410.
On the other hand, the carrier 500 in the present embodiment shown in Fig. 5 is configured to, and the 1st runs through in retaining hole 520C
Heart position C2 is in the position of relational expression deviateing from the center C1 of carrier 500, meeting [(D/4)≤r≤(D/2)]
(region represented in figure by S).
Thus, can also in the case of the double-side grinding of glass substrate 1 is carried out by double-sided grinding device 1000
Suppress to be ground pad 310 by upside through the glass substrate 1 that retaining hole 520C is kept by the 1st and downside is ground the identical of pad 410
The situation of position.
The result is that, it is suppressed that upside is ground the generation of the uneven wear of pad 310 and downside grinding pad 410, reduces
It is ground in upside on pad 310 and downside grinding pad 410 and produces situation of the section for the step (impression) of spill, so as to suppresses
Grinding damage (cut) is appeared on the surface of glass substrate 1 as caused by the step.
(embodiment)
Below, above- mentioned information recording medium is said with each embodiment and each comparative example of the manufacture method of glass substrate
It is bright.In each embodiment and each comparative example as shown below, untill " the glass substrate forming process " of the S20 shown in Fig. 3, such as
Above-mentioned explanation is implemented like that.The number of glass substrate is to amount to 115 for each condition.
(the 2nd friction process)
Then the process before implements the 2nd friction process.Conduct has been used in upside grinding pad and downside grinding pad
Bonded-abrasive, 9 μm of abrasive grain diameter diamond grinding pad.In embodiment 1 and embodiment 2, use from carrier 500
The carrier that heart position C1 to the 1st is 20mm through retaining hole 520C center C2 distance r.On the other hand, in comparative example 1
In, used by the 1st through retaining hole 520C center C2 be arranged at carrier 500 center C1 carrier, than
It is below 16.25mm i.e. 15mm carrier compared with r in example 2, has been used.
In addition, in example 2, as shown in Figure 10, such glass substrate 1 is used：Kept than running through around the 1st
The 2nd opening position on the inside of radial directions of the retaining hole 520p more by carrier 500 that hole 520C is annularly configured, has straight
Footpath is than through the small auxiliary through hole 520M of retaining hole 520.4 auxiliary through hole 520M are provided with the glass substrate.Auxiliary
Through hole 520M a diameter of 26mm, from the center C1 of carrier 500 to the distance of auxiliary through hole 520M center
For 50mm.
On auxiliary through hole 520M, only 1 the 1st is being arranged at from the center of carrier 500 through retaining hole 520C
In the case of the position that position C1 deviates, the position of centre of gravity of carrier 500 deviates, so as to which there may be change for carrier in grinding process
Shape, may be ground pad 310 to upside and downside grinding pad 410 causes to damage.Therefore, auxiliary through hole 520M can be arranged on
So that the position of centre of gravity of carrier 500 turns into the opening position of the center of carrier 500.Thereby, it is possible to suppress because carrier 500 deforms
Damage in upside grinding pad 310 caused by and and downside grinding pad 410 produces.
In addition, in each embodiment and each comparative example, it is advance using the double-sided grinding device used in the 2nd friction process
Prior processing has been carried out, the condition that upper and lower grinding pad shows inherent trend is implemented into the 2nd friction process after reunification, wherein,
The glass substrate outside the glass substrate used in this experiment has been used in the prior processing.Specifically, this is being carried out
Before experiment, using the carrier used in each embodiment and each comparative example, and the double-side grinding used in this experiment is utilized
Device, in a manner of accumulative process time respectively substantially amounts to 40 hours, prior glass substrate processing is carried out.Prior
In processing, used with according to glass substrate identical glass substrate made of the process untill above-mentioned S22 processes.Pass through thing
First process, can observe the embodiment/comparative example carrier abrasion intrinsic, to grinding pad.
(surface finish measurement)
After the 2nd friction process (S31) terminates, the glass substrate obtained by each embodiment and each comparative example is carried out
The measurement of surface roughness.Used in the measurement of surface roughness Co., Ltd.'s KEYENCE company systems, shape measure swashs
Light microscope VK9700.
Surface 1mm for measuring glass substrate2Resulting result, is all evaluated.In embodiment 1 and embodiment
In 2, compared with comparative example 1 and comparative example 2, the roughness on surface is relatively low, the negligible amounts damaged more deeply confirmed.
(the 1st polishing process (rough lapping))
The 1st polishing process (rough lapping) is implemented, until reaching adding for the grinding marks disappearance for thinking to observe on the surface
Untill work amount.In embodiment 1 and embodiment 2, compared with comparative example 1 and comparative example 2, required process time can be shortened.
Next, implement the 2nd polishing process (precise finiss).In each embodiment and each comparative example, make processing conditions
It is identical.Here, in each embodiment and each comparative example, the removal of grinding marks is mainly realized by the 1st polishing process, although
Make processing conditions identical in 2nd polishing process, but mainly using the 2nd polishing process adjustment processing capacity, even in removing grinding
In the case of trace, also process time can be shortened by same method.The grinding particularly used in the 2nd polishing process
In the case that the hardness of pad is lower than the grinding pad used in the 1st polishing process, in the 2nd polishing process, easily in glass base
Face is produced on plate to collapse angle, still, by with the present embodiment identical method, can expect to shorten process time and prevent that face from collapsing angle
Such effect.
(end surface measurement of glass substrate)
Figure 11 shows embodiment 1, embodiment 2 and comparative example 1, the evaluation result of comparative example 2.For passing through embodiment 1, reality
The glass substrate obtained by example 2 and comparative example 1, comparative example 2 is applied, using contact pin type profile meter, from the center of glass substrate
Towards at radial direction measurement R1 (22.25mm) this point, R2 (27.25mm) this point and R3 (31.25mm) this point
The height of glass substrate, as the shape of the end face part of glass substrate, using the line of the height connected at R1 and R2 as benchmark
Line, the relative shift of the height of R3 opening positions is analyzed.The analysis result is determined as the product within ± 0.18 μm
Certified products.
In addition, in embodiment 1,2 and comparative example 1,2, respectively 50 glass substrates are carried out with end surface measurement, investigation is qualified
The ratio of product, situation of more than 86% glass substrate within ± 0.18 μm is set as to evaluate " A ", and thinks qualified,
In the case of 86%, it is set as evaluating " C ", and think unqualified.
As shown in figure 11, for the result of end surface measurement, evaluated " A " in embodiment 1 and embodiment 2.Than
Compared with example 1 and comparative example 2 for evaluation " C ".
So, the result on end surface measurement, in comparative example 1 and comparative example 2, end surface shape is poor, and in embodiment 1
In embodiment 2, end surface shape is good.In comparative example 1 and comparative example 2, the process time phase of the 1st polishing process (rough lapping)
Increase than embodiment 1 and embodiment 2, thereby it is thinkable that with the increase of the process time, the end surface shape of glass substrate
Deteriorate.
For the grinding platform used in embodiment 1 and embodiment 2, upper and lower grinding pad is measured after formal processing
Average thickness.On to upside be ground pad and downside be ground pad thickness measure, near inner circumferential, Intermediate Gray region, periphery
Nearby amount to respectively at each measurement 2 at 6, and then obtained the average value of upside grinding pad and downside grinding pad.
As shown in figure 11, compared with Example 1 compared with example 2, upside grinding pad 310 and downside are ground pad 410
The average value of abrasion is smaller, is 20 μm or so.Because in the case of embodiment 2, through hole is aided in by setting
520M, the position of centre of gravity of carrier 500 is corrected to the center C1 of carrier 500, thus, the phase of carrier 500 with embodiment 1
Than the deformation of vertical direction caused by carrier 500 reduces, so as to inhibit in upside grinding pad 310 and downside grinding pad 410
Damage produce.
And then the glass substrate to being obtained by above-described embodiment 1-2 and comparative example 1-2 implements the chemistry shown in Fig. 3
Strengthen process (S40), matting (S50) and magnetic thin film formation process (S60), obtain information recording carrier.
The information recording carrier is loaded into hard disk drive, has carried out read-write experiment.Use and obtained by comparative example 1-2
The information recording carrier of glass substrate the area that can not be recorded is generated near the periphery of information recording carrier.On the other hand,
The information recording carrier by the obtained glass substrates of embodiment 1-2 has been used near the periphery of information recording carrier
Good record can be realized.
Embodiments of the present invention and embodiment are illustrated as described above, it should think this time disclosed and implement
Mode and embodiment are all to illustrate and unrestricted in all respects.The scope of the present invention by claims, without by above-mentioned
Illustrate to represent, it is intended to include being had altered in the meaning and scope equal with claim.
Label declaration
1A：The main surface in front；1B：Back side major surface；1C：Inner circumferential end face；1D：Peripheral end face；1H：Hole；2：Magnetic thin film layer；
10：Disk；300：Upper mounting plate；310：Upside grinding pad；310g、410g：Groove；400：Lower platform；410：Downside grinding pad；500：
Carrier；510：Main body；520：Through retaining hole；520C：1st runs through retaining hole；520P：2nd runs through retaining hole；520M：Auxiliary
Through hole；1000：Double-sided grinding device.
Claims (2)
1. a kind of manufacture method of glass substrate for information recording medium, glass base of the described information recording medium in disc-shape
Formed with magnetic thin film layer on the main surface of plate, in the manufacture method of described information recording medium glass substrate,
With surface grinding process, in the surface grinding process, using the double-sided grinding device for possessing planetary gears, one
Side supplies water, grinding fluid or lubricating fluid while being ground the main surface of the glass substrate,
The double-sided grinding device possesses：
Upper mounting plate, it is located at the upside of the glass substrate, and has upside grinding in the glass substrate side of the upper mounting plate
Pad；
Lower platform, it is located at the downside of the glass substrate, and has downside grinding in the glass substrate side of the lower platform
Pad；And
Discoid carrier, it runs through retaining hole provided with multiple holding glass substrates, and the carrier is by the upper side grinding
Cut pad and the downside grinding pad clip, and by the planetary gears carry out as defined in rotary motion,
It is described to have through retaining hole：Be configured in the near center location of the carrier unique one the 1st runs through holding
Hole；Multiple 2 run through retaining hole through what retaining hole annularly configured with around the described 1st,
The diameter of the glass substrate is being set to Dmm and retaining hole will be run through from the center of the carrier to the described 1st
Center distance be set to rmm in the case of, the described 1st is arranged on satisfaction [(D/4) through the center of retaining hole
≤ r≤(D/2)] relational expression opening position,
The carrier, than around the described 1st through retaining hole annularly configure the described 2nd through retaining hole by described
Opening position on the inside of the radial direction of carrier, also with diameter than the auxiliary through hole small through retaining hole.
2. a kind of grinding carrier, the grinding is used with carrier in the manufacture method of substrate for information recording medium, described
Information recording carrier on the main surface of the substrate of disc-shape formed with magnetic thin film layer, wherein,
The grinding runs through retaining hole with carrier provided with multiple holding substrates,
It is described to have through retaining hole：Unique one the 1st of near center location for being configured in the grinding carrier runs through
Retaining hole；Multiple 2 run through retaining hole through what retaining hole annularly configured with around the described 1st,
The diameter of the substrate is being set to Dmm and kept running through from the center of the grinding carrier to the described 1st
In the case that the distance of the center in hole is set to rmm, the described 1st is arranged on satisfaction [(D/ through the center of retaining hole
4)≤r≤(D/2)] relational expression opening position,
The grinding with carrier, than the described 2nd running through retaining hole through what retaining hole annularly configured around the described 1st
By the opening position on the inside of the radial direction of the grinding carrier, also run through with diameter than the auxiliary small through retaining hole
Hole.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-080465 | 2012-03-30 | ||
| JP2012080465 | 2012-03-30 | ||
| PCT/JP2013/056080 WO2013146133A1 (en) | 2012-03-30 | 2013-03-06 | Manufacturing method for glass substrate for information recording medium, and information recording medium |
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| Publication Number | Publication Date |
|---|---|
| CN104170013A CN104170013A (en) | 2014-11-26 |
| CN104170013B true CN104170013B (en) | 2018-02-27 |
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| CN201380011847.3A Active CN104170013B (en) | 2012-03-30 | 2013-03-06 | The manufacture method and information recording carrier of glass substrate for information recording medium |
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| Country | Link |
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| JP (1) | JP6138113B2 (en) |
| CN (1) | CN104170013B (en) |
| WO (1) | WO2013146133A1 (en) |
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| CN107263278A (en) * | 2017-07-03 | 2017-10-20 | 适新科技（苏州）有限公司 | Twin grinder and grinding technics |
| JP6939581B2 (en) * | 2018-01-10 | 2021-09-22 | Ａｇｃ株式会社 | Processing method and manufacturing method of curved glass substrate |
| JP2024088310A (en) * | 2022-12-20 | 2024-07-02 | 東洋鋼鈑株式会社 | Double-sided polishing machine |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102398213A (en) * | 2011-05-11 | 2012-04-04 | 上海双明光学科技有限公司 | Ultra-thin stainless steel carrier disc and device for polishing sapphire LED (light-emitting diode) substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5981057A (en) * | 1982-11-01 | 1984-05-10 | Hitachi Ltd | Double-sided polishing device |
| DE19756537A1 (en) * | 1997-12-18 | 1999-07-01 | Wacker Siltronic Halbleitermat | Process for achieving wear behavior that is as linear as possible and tool with wear behavior that is as linear as possible |
| JP2000153454A (en) * | 1998-11-17 | 2000-06-06 | Toraibo:Kk | Polishing carrier |
| JP2000288920A (en) * | 1999-03-31 | 2000-10-17 | Hoya Corp | Polishing carrier, polishing method, and manufacture of information recording medium substrate |
| JP2000288922A (en) * | 1999-03-31 | 2000-10-17 | Hoya Corp | Polishing carrier, polishing method and manufacture of information recording medium substrate |
| JP2000288919A (en) * | 1999-03-31 | 2000-10-17 | Hoya Corp | Polishing carrier, polishing method, and manufacture of information recording medium substrate |
| JP4149295B2 (en) * | 2003-03-26 | 2008-09-10 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | Lapping machine |
| JP2007301713A (en) * | 2006-04-10 | 2007-11-22 | Kemet Japan Co Ltd | Polishing implement |
| DE102006032455A1 (en) * | 2006-07-13 | 2008-04-10 | Siltronic Ag | Method for simultaneous double-sided grinding of a plurality of semiconductor wafers and semiconductor wafer with excellent flatness |
| JP2009039827A (en) * | 2007-08-09 | 2009-02-26 | Fujitsu Ltd | Polishing apparatus, substrate and method for manufacturing electronic apparatus |
| JP2009190159A (en) * | 2008-02-18 | 2009-08-27 | Seiko Instruments Inc | Carrier and wafer grinder |
| JP2010257562A (en) * | 2009-03-30 | 2010-11-11 | Hoya Corp | Substrate for magnetic disk and method for manufacturing the same |
| JP5407693B2 (en) * | 2009-09-17 | 2014-02-05 | 旭硝子株式会社 | Glass substrate manufacturing method, polishing method and polishing apparatus, and glass substrate |
| JP2012064295A (en) * | 2009-11-10 | 2012-03-29 | Showa Denko Kk | Method for manufacturing glass substrate for magnetic recording medium |
| JP2012033265A (en) * | 2011-11-14 | 2012-02-16 | Asahi Glass Co Ltd | Glass substrate for magnetic recording medium and manufacturing method thereof |
-
2013
- 2013-03-06 WO PCT/JP2013/056080 patent/WO2013146133A1/en active Application Filing
- 2013-03-06 JP JP2014507596A patent/JP6138113B2/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102398213A (en) * | 2011-05-11 | 2012-04-04 | 上海双明光学科技有限公司 | Ultra-thin stainless steel carrier disc and device for polishing sapphire LED (light-emitting diode) substrate |
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|---|---|
| JP6138113B2 (en) | 2017-05-31 |
| CN104170013A (en) | 2014-11-26 |
| JPWO2013146133A1 (en) | 2015-12-10 |
| WO2013146133A1 (en) | 2013-10-03 |
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