CN104157792A - OLED (organic light emitting diode) packaging structure and method - Google Patents
OLED (organic light emitting diode) packaging structure and method Download PDFInfo
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- CN104157792A CN104157792A CN201410387544.8A CN201410387544A CN104157792A CN 104157792 A CN104157792 A CN 104157792A CN 201410387544 A CN201410387544 A CN 201410387544A CN 104157792 A CN104157792 A CN 104157792A
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 238000005452 bending Methods 0.000 claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- 239000004020 conductor Substances 0.000 claims description 68
- 238000012856 packing Methods 0.000 claims description 16
- 239000011521 glass Substances 0.000 claims description 15
- 150000002739 metals Chemical class 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 210000004877 mucosa Anatomy 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 230000002463 transducing effect Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 230000004888 barrier function Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- CSSYLTMKCUORDA-UHFFFAOYSA-N barium(2+);oxygen(2-) Chemical compound [O-2].[Ba+2] CSSYLTMKCUORDA-UHFFFAOYSA-N 0.000 description 2
- 229960004643 cupric oxide Drugs 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 239000005385 borate glass Substances 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- FZFYOUJTOSBFPQ-UHFFFAOYSA-M dipotassium;hydroxide Chemical compound [OH-].[K+].[K+] FZFYOUJTOSBFPQ-UHFFFAOYSA-M 0.000 description 1
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- ZPPSOOVFTBGHBI-UHFFFAOYSA-N lead(2+);oxido(oxo)borane Chemical compound [Pb+2].[O-]B=O.[O-]B=O ZPPSOOVFTBGHBI-UHFFFAOYSA-N 0.000 description 1
- 229910001947 lithium oxide Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- SJLOMQIUPFZJAN-UHFFFAOYSA-N oxorhodium Chemical compound [Rh]=O SJLOMQIUPFZJAN-UHFFFAOYSA-N 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- 229910003450 rhodium oxide Inorganic materials 0.000 description 1
- CWBWCLMMHLCMAM-UHFFFAOYSA-M rubidium(1+);hydroxide Chemical compound [OH-].[Rb+].[Rb+] CWBWCLMMHLCMAM-UHFFFAOYSA-M 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- LAJZODKXOMJMPK-UHFFFAOYSA-N tellurium dioxide Chemical compound O=[Te]=O LAJZODKXOMJMPK-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- QUBMWJKTLKIJNN-UHFFFAOYSA-B tin(4+);tetraphosphate Chemical compound [Sn+4].[Sn+4].[Sn+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QUBMWJKTLKIJNN-UHFFFAOYSA-B 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten trioxide Chemical compound O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 description 1
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides an OLED (organic light emitting diode) packaging structure and method. The OLED packaging structure comprises a first substrate, a second substrate, frit and at least one metal conducting wire, wherein the first substrate and the second substrate are bonded by the frit, the at least one metal conducting wire is located on the first substrate and provided with a bending part, and the bending part is located below the frit and contacted with the frit, so that the contact area of the at least one metal conducting wire and frit is increased. According to the OLED packaging structure and method, the linear metal conducting wire contacted with frit is changed into a bending shape, so that the contact area between the metal conducting wire and frit can be increased, the condition of frit falling or stripping due to insufficient adhesive force is prevented, and the packaging reliability is improved.
Description
Technical field
The present invention relates in Organic Light Emitting Diode (OLED) Display Technique field, particularly a kind of OLED encapsulating structure and method for packing.
Background technology
Organic electroluminescent LED (OLED) is a kind of all solid state, active illuminating, high brightness, high-contrast, ultra-thin and ultra-light, low-power consumption, without the characteristic such as angle limitations, operating temperature range be wide, be considered to the emerging application technology of follow-on flat-panel screens.Yet, electrode and Organic Light Emitting Diode that the part-structure of OLED display is especially positioned at are wherein extremely responsive for external environmental factors such as oxygen and steam, need in actual use device to be encapsulated and make device and water vapour and oxygen isolated to extend the useful life of OLED.
A kind of method encapsulating for OLED is at present after adopting dissimilar epoxy resin, inorganic material and/or passing through ultraviolet light polymerization, to form the organic material of sealing.Although this encapsulating method can provide good mechanical strength conventionally, under a lot of environment, these sealings fail to provide enough obstructing capacities to water vapour and oxygen.The common method that another kind is used for sealing OLED device is the thin-film package that adopts the mode of organic material inorganic material alternating deposit, but this sealed in unit costliness and complex process.
Adopting the sealing of welding glass material is the method for packing of another OLED device, and the method has excellent sealing property, can under 85 ℃, 85% relative humidity condition, in 7000 hours, keep sealing property, is far longer than the resin-sealed performance of existing UV.
The welding glass material encapsulating structure of typical case's active matrix organic light-emitting diode (AMOLED) as shown in Figure 1, wherein drive district 101 to be positioned at the outside of packed substrate, viewing area 102 is positioned at the medium position of packed substrate, the closed loop shape of frit F for rounding along packed substrate.
Because viewing area 102 need to be by driving district 101 to drive, conventionally between viewing area 102 and driving district 101, be connected with many strip metals wire, these plain conductors were laid on substrate before frit F deposition, after frit F deposition, at some regional metal wire and frit F, there will be staggered or partly overlap.Fig. 2 is the partial enlarged drawing of position shown in circle in Fig. 1, it is the perspective view of traditional glass material and plain conductor overlapping, as shown in Figure 2, there are two strip metal wires 103 frit F below, plain conductor 103 sides are insulating barrier, this two strip metals wire 103 is type directly contacting with frit F linearly all, and the bonding between frit F and packed substrate mainly relies on the adherence of frit F and plain conductor 103 to keep.
But there are some problems in the encapsulating structure of prior art, because the width of plain conductor 103 has certain restriction, the contact area of itself and frit F is also limited to, thereby can cause the adherence between frit F and plain conductor 103 not enough, even can cause encapsulating structure to lose efficacy.
Summary of the invention
Object of the present invention is exactly the shortcoming existing for prior art, increases the contact area between itself and frit, and then improve the adherence between frit and substrate by changing the shape of plain conductor, improves the reliability of encapsulation.
On the one hand, the invention provides a kind of OLED encapsulating structure, comprising:
First substrate;
Second substrate;
Frit, described frit bond described first substrate and described second substrate; And
At least one plain conductor, is positioned on described first substrate,
Wherein, described at least one plain conductor has a bending shape part, and described bending shape is partly positioned at described frit below and contacts with described frit, to increase the contact area of described at least one plain conductor and described frit.
In an execution mode of OLED encapsulating structure of the present invention, described bending shape is partly zigzag (zigzag).
In another execution mode of OLED encapsulating structure of the present invention, described first substrate comprises a driving district and a viewing area, and described at least one plain conductor connects described driving district and described viewing area.
In another execution mode of OLED encapsulating structure of the present invention, described at least one plain conductor comprises touch signal line, transducing signal line, clock cable, power line or ground wire.
In another execution mode of OLED encapsulating structure of the present invention, described at least one plain conductor comprises many strip metals wire, and described many strip metals wire comprises a plurality of described bending shape parts, and described a plurality of bending shapes are partly of similar shape.
On the other hand, the invention provides a kind of OLED method for packing, comprising:
On first substrate, form at least one strip metal wire, described at least one plain conductor has a bending shape part;
Frit is deposited on to the packaging area of described first substrate, and make described frit cover the described bending shape part of described at least one plain conductor, and described frit directly contacts with the described bending shape part of described at least one plain conductor, to increase the contact area of described at least one plain conductor and described frit;
Described frit is preheated;
By second substrate and described first substrate pressing; And
Heat described frit, make to form packaged glass after described frit melting, the region that the packaging area of described first substrate is surrounded seals.
In an execution mode of OLED method for packing of the present invention, described bending shape is partly zigzag.
In another execution mode of OLED method for packing of the present invention, adopt packaging area described in Ear Mucosa Treated by He Ne Laser Irradiation, so that form packaged glass after described frit melting.
In another execution mode of OLED method for packing of the present invention, form at least one comprise the plain conductor of bending shape part before, be also included in and on described first substrate, form a driving district and a viewing area.
In another execution mode of OLED method for packing of the present invention, described at least one plain conductor connects described driving district and described viewing area.
OLED encapsulating structure of the present invention is changed into bending shape by the shape of the plain conductor contacting with frit by linear pattern with method for packing, can increase the contact area between plain conductor and frit, the situation of avoiding frit to occur adhesion strength deficiency and coming off or peel off, thus the reliability of encapsulation improved.
Accompanying drawing explanation
Fig. 1 is the profile of frit encapsulating structure;
Fig. 2 is the perspective view of traditional glass material and plain conductor overlapping;
Fig. 3 is the frit of an execution mode of OLED encapsulating structure of the present invention and the perspective view of plain conductor overlapping;
Fig. 4 is along the partial cross section figure of B-B ' in Fig. 3.
Wherein, description of reference numerals is as follows:
101: drive district
102: have viewing area
103: plain conductor
F: frit
201: first substrate
202: insulating barrier
203: plain conductor
204: second substrate
Embodiment
According to specific embodiment, technical scheme of the present invention is described further below.Protection scope of the present invention is not limited to following examples, enumerates these examples and only for exemplary purpose, does not limit the present invention in any way.
The invention provides a kind of OLED encapsulating structure, comprising:
First substrate;
Second substrate;
Frit, frit bonding first substrate and second substrate; And
At least one plain conductor, be positioned on first substrate, wherein, this is stated at least one plain conductor and has a bending shape part, this bending shape is partly positioned at frit below and contacts with frit, to increase the contact area of this at least one plain conductor and frit.
First substrate is typically used as the substrate of OLED device, can comprise rigidity or flexible material, and opaque or transparent material, for example plastics, glass and/or foil.
Second substrate is typically used as the cover plate of OLED device, glass cover-plate for example, but be not limited to this.
The frit material that is used for bonding first substrate and second substrate and forms package strip is referred to as " frit ", and it comprises tiny glass particle.Glass particle comprises one or more in following material: magnesium oxide (MgO), calcium oxide (CaO), barium monoxide (BaO), lithia (Li
2o), sodium oxide molybdena (Na
2o), potassium oxide (K
2o), boron oxide (B
2o
3), vanadium oxide (V
2o
5), zinc oxide (ZnO), tellurium oxide (TeO
2), aluminium oxide (A1
2o
3), silicon dioxide (SiO
2), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P
2o
5), ruthenium-oxide (Ru
2o), rubidium oxide (Rb
2o), rhodium oxide (Rh
2o), iron oxide (Fe
2o
3), cupric oxide (CuO), titanium oxide (TiO
2), tungsten oxide (WO
3), bismuth oxide (Bi
2o
3), antimony oxide (Sb
2o
3), lead-borate glass, tin-phosphate glass, vanadate glass and borosilicate etc.
For guaranteeing the reliability of sealing, frit is around first substrate around whole circle, and the position conventionally frit being covered is called packaging area.
Plain conductor is not directly formed on first substrate conventionally, and an insulating barrier can be set on first substrate, on this insulating barrier, forms plain conductor, other structure can be set as required yet, and the present invention is not restricted this.
At least one plain conductor comprises a bending shape part, refers to that the part that at least one plain conductor is positioned at frit below comprises bending shape.A plain conductor part is positioned at the below of frit, it can be entirely bending shape by the part that frit covered, it is for example zigzag, also can be a part of straight line and the shape of another part bending, also can comprise shaped form, but consider the degree of difficulty of technique, be generally the bending shape that the segment link of many different directions forms.
First substrate can comprise a driving district and a viewing area, drives district to be positioned at the outside of packaging area, and viewing area is positioned at the inside of packaging area, and this at least one plain conductor connects driving district and viewing area.
This at least one plain conductor can be touch signal line, transducing signal line, clock cable, power line or ground wire, but is not limited to this.
At least one plain conductor in OLED encapsulating structure of the present invention can comprise many strip metals wire, many strip metals wire comprises a plurality of bending shape parts, these bending shape parts can be of similar shape, the zigzag cabling for example with identical bending angle, such setting can not change the distance between original plain conductor, thereby can not bring the difficulty in manufacturing process.
In the situation that in frit of the same area region and the width of plain conductor identical, than linear plain conductor, comprise that the plain conductor of bending shape and the contact area of frit are larger, the ratio that its area increases depends on the length of bending angle and bending shape plain conductor.
In addition, conventionally adopt laser to make curing molding after frit melting, when carrying out Ear Mucosa Treated by He Ne Laser Irradiation, because plain conductor is positioned at the below of frit, plain conductor can be frit and certain energy reflection is provided and promotes it to solidify.The contact area of plain conductor and frit is larger, and plain conductor can provide stronger energy reflection to frit, thereby it is better that frit is solidified.
Fig. 3 is the frit of an execution mode of OLED encapsulating structure of the present invention and the perspective view of plain conductor overlapping, as shown in Figure 3, two strip metal wires 203 are identical bending shape, phase mutual edge distance between two strip metal wires 203 is constant, and identical with the distance between the linear pattern plain conductor of prior art, frit F is covered on two strip metal wires 203.
Fig. 4 is along the partial cross section figure of B-B ' in Fig. 3, as shown in Figure 4, encapsulating structure comprises first substrate 201, is positioned at the insulating barrier 202 on first substrate 201, be positioned at two strip metal wires 203 on insulating barrier 202, be positioned at the frit F of two strip metal wire 203 tops, and the second substrate 204 that is positioned at frit F top.Wherein frit F is coated two strip metal wires 203 completely and is in direct contact with it, and between two strip metal wires 203, frit F directly contacts with insulating barrier 202.
The present invention also provides a kind of OLED method for packing, comprising:
On first substrate, form at least one strip metal wire, described at least one plain conductor has a bending shape part;
Frit is deposited on to the packaging area of first substrate, and make frit cover the bending shape part of at least one strip metal wire, and frit directly contacts with the bending shape part of at least one plain conductor, to increase the contact area of this at least one plain conductor and frit;
Frit is preheated;
By second substrate and first substrate pressing; And
Heating frit, makes to form packaged glass after frit melting, and the region that the packaging area of first substrate is surrounded seals.
The bending shape part of the plain conductor forming on first substrate can be entirely bending shape, for example, be zigzag, also can be a part of straight line and the shape of another part bending.
Conventionally first on first substrate, form a driving district and a viewing area, drive district to be positioned at the outside of packaging area, viewing area is positioned at the inside of packaging area, then forms above-mentioned plain conductor, plain conductor is connected and drive district and viewing area.
Can adopt the method for a glue or silk screen printing frit to be deposited to the packaging area of first substrate, but be not limited to this.
For the heating of frit, can adopt Ear Mucosa Treated by He Ne Laser Irradiation packaging area, so that solidify to form packaged glass after frit melting, now plain conductor can be frit provides certain energy reflection and promotes it to solidify.
In sum, OLED encapsulating structure of the present invention is changed into bending shape by the shape of the plain conductor contacting with frit by linear pattern with method for packing, can increase the contact area between plain conductor and frit, the situation of avoiding frit to occur adhesion strength deficiency and coming off or peel off, thus the reliability of encapsulation improved.
Those skilled in the art it should be noted in the discussion above that execution mode described in the invention is only exemplary, can make within the scope of the invention various other replacements, changes and improvements.Thereby, the invention is not restricted to above-mentioned execution mode, and be only defined by the claims.
Claims (10)
1. an OLED encapsulating structure, comprising:
First substrate;
Second substrate;
Frit, described frit bond described first substrate and described second substrate; And
At least one plain conductor, is positioned on described first substrate,
Wherein, described at least one plain conductor has a bending shape part, and described bending shape is partly positioned at described frit below and contacts with described frit, to increase the contact area of described at least one plain conductor and described frit.
2. according to the OLED encapsulating structure of claim 1, wherein said bending shape is partly zigzag.
3. according to the OLED encapsulating structure of claim 1, wherein said first substrate comprises a driving district and a viewing area, and described at least one plain conductor connects described driving district and described viewing area.
4. according to the OLED encapsulating structure of claim 1, wherein said at least one plain conductor comprises touch signal line, transducing signal line, clock cable, power line or ground wire.
5. according to the OLED encapsulating structure of claim 1, described at least one plain conductor comprises many strip metals wire, and described many strip metals wire comprises a plurality of described bending shape parts, and described a plurality of bending shapes are partly of similar shape.
6. an OLED method for packing, comprising:
On first substrate, form at least one strip metal wire, described at least one plain conductor has a bending shape part;
Frit is deposited on to the packaging area of described first substrate, and make described frit cover the described bending shape part of described at least one plain conductor, and described frit directly contacts with the described bending shape part of described at least one plain conductor, to increase the contact area of described at least one plain conductor and described frit;
Described frit is preheated;
By second substrate and described first substrate pressing; And
Heat described frit, make to form packaged glass after described frit melting, the region that the packaging area of described first substrate is surrounded seals.
7. according to the method for packing of claim 6, wherein said bending shape is partly zigzag.
8. according to the method for packing of claim 6, wherein adopt packaging area described in Ear Mucosa Treated by He Ne Laser Irradiation, so that form packaged glass after described frit melting.
9. according to the method for packing of claim 6, wherein form at least one comprise the plain conductor of bending shape part before, be also included in and on described first substrate, form a driving district and a viewing area.
10. according to the method for packing of claim 9, wherein said at least one plain conductor connects described driving district and described viewing area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410387544.8A CN104157792A (en) | 2014-08-08 | 2014-08-08 | OLED (organic light emitting diode) packaging structure and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410387544.8A CN104157792A (en) | 2014-08-08 | 2014-08-08 | OLED (organic light emitting diode) packaging structure and method |
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| Publication Number | Publication Date |
|---|---|
| CN104157792A true CN104157792A (en) | 2014-11-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410387544.8A Pending CN104157792A (en) | 2014-08-08 | 2014-08-08 | OLED (organic light emitting diode) packaging structure and method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104882566A (en) * | 2015-05-21 | 2015-09-02 | 京东方科技集团股份有限公司 | Packaging structure and packaging method for light emitting diode |
| CN105185810A (en) * | 2015-08-07 | 2015-12-23 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method, display panel and display apparatus |
| CN107785392A (en) * | 2016-08-26 | 2018-03-09 | 乐金显示有限公司 | Display device |
| WO2019140948A1 (en) * | 2018-01-19 | 2019-07-25 | 昆山国显光电有限公司 | Encapsulation structure |
| US10756296B2 (en) | 2018-01-19 | 2020-08-25 | Kunshan Go-Visionox Opto-Electronics Co., Ltd. | Packaging structure |
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Application publication date: 20141119 |