CN104157774A - Fluorescent powder encapsulation structure used for light-mixed LED - Google Patents

Abstract

The invention discloses a fluorescent powder encapsulation structure used for a light-mixed LED. The structure comprises an LED chip and a metal substrate. The LED chip is disposed on an upper surface of the metal substrate. An insulating layer is disposed on the metal substrate. A circuit layer is disposed on the insulating layer. An encapsulation adhesive limiting layer made of an insulating material is disposed on the circuit layer. A fluorescent adhesive limiting layer made of the insulating material is disposed on the encapsulation adhesive limiting layer. The encapsulation adhesive is filled into the encapsulation adhesive limiting layer, the fluorescent adhesive limiting layer is filled with fluorescent adhesive. Beneficial effect of the structure is that problems of color drifting and brightness decay of the LED device caused by reduction of fluorescent powder conversion efficiency are solved.

Description

Phosphor powder packaging structure for mixed light LED

technical field

The invention relates to the field of optoelectronic technology, in particular to a fluorescent powder packaging structure for mixed-light LEDs.

Background technique

The existing mixed-light LED preparation method is to coat the phosphor powder on the surface of the excitable phosphor chip or wrap the chip in fluorescent glue, use the chip to excite the phosphor powder, and make the phosphor powder emit light and mix with the light emitted by the chip body to prepare a mixed light LED. For LED devices, when the chip passes current, the PN junction will generate high temperature due to the electro-optical conversion relationship. Since the phosphor powder is directly coated or wrapped on the chip, the phosphor powder will directly contact the chip, causing the temperature generated by the chip to be directly transmitted to the phosphor powder. , The thermal effect of high temperature leads to the attenuation of the phosphor powder, which leads to the light decay and color drift of the LED device.

Contents of the invention

In order to solve the above-mentioned technical problems, the object of the present invention is to provide a fluorescent powder packaging structure for mixed-light LEDs, which can solve the problems of brightness attenuation and color temperature drift caused by phosphor attenuation. the

In order to achieve the above object, the technical solution of the present invention is as follows: a fluorescent powder packaging structure for a light-mixing LED, including an LED chip and a metal substrate, the LED chip is arranged on the upper surface of the metal substrate, and the metal substrate is laid A layer of insulating layer, a circuit layer is arranged above the insulating layer, an encapsulating glue limiting layer made of insulating material is laid on the above said circuit layer, and a fluorescent light made of insulating material is arranged on the encapsulating glue limiting layer. Glue limiting layer; the encapsulating glue limiting layer is filled with encapsulating glue, and the fluorescent glue limiting layer is filled with fluorescent glue.

Preferably, the positive and negative leads of the metal substrate are welded on the circuit layer.

Preferably, the fluorescent glue is fluorescent powder plus glue.

Preferably, the packaging glue is silica gel.

The beneficial effect of adopting the above technical scheme is that since the encapsulation adhesive layer is provided, the direct contact between the fluorescent adhesive and the chip is avoided, and the conversion efficiency of the phosphor powder caused by the thermal effect of the heat emitted by the chip itself on the phosphor powder is reduced, thereby The problem of color drift and brightness attenuation of LED devices caused by the reduction of phosphor powder conversion efficiency is solved.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the technical description of the embodiments. Obviously, the accompanying drawings in the following description are only some implementations of the present invention For example, those of ordinary skill in the art can also obtain other drawings based on these drawings on the premise of not paying creative efforts.

FIG. 1 is a schematic structural view of a fluorescent powder packaging structure for a light-mixing LED according to the present invention.

The corresponding part names indicated by the numbers in the figure:

1. Metal substrate 2. Insulation layer 3. Circuit layer 4. Packaging glue limiting layer 5. Fluorescent glue limiting layer.

the

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

Example

As shown in FIG. 1 , a fluorescent powder packaging structure for a mixed-light LED includes an LED chip and a metal substrate 1, the LED chip is arranged on the upper surface of the metal substrate 1, and an insulating layer 2 is laid on the metal substrate 1. A line layer 3 is arranged above the insulating layer 2, and an encapsulating glue limiting layer 4 made of insulating material is laid above the line layer to measure the usage amount of the encapsulating glue and protect the chip with the encapsulating glue. The limiting layer 4 is provided with a fluorescent glue limiting layer 5 made of insulating material to measure the amount of fluorescent glue used; the sealing glue limiting layer 4 is filled with packaging glue, and the fluorescent glue limiting layer 4 Fluorescent glue is poured into the layer 4, wherein the encapsulation glue is made of silica gel, and the fluorescent glue is fluorescent powder plus glue.

The specific packaging process is as follows:

1. Customize or purchase the bracket of the existing male model according to the power and shape of the produced product;

2. On the substrate layer of the bracket, according to the actual production power ratio, fix the metal substrate with die-bonding glue;

3. After fixing the metal substrate, according to the actual arrangement of chips on the metal substrate, solder the positive and negative electrode leads of the metal substrate to the circuit layer respectively, so as to facilitate the connection between the chip and the external power pin of the bracket;

4. For the semi-finished product after the wire welding is completed, pour the packaging glue into the packaging glue limiting layer, and the upper limit of the packaging glue is limited to be parallel to the packaging glue limiting layer, and make it solidify;

5. For the cured semi-finished product, pour fluorescent glue into the fluorescent glue limit layer, the upper limit of the fluorescent glue is limited to not overflow the fluorescent glue limit layer, and let it cure.

Due to the encapsulation glue layer, the direct contact between the fluorescent glue and the chip is avoided, and the heat emitted by the chip itself when it is lit has a thermal effect on the phosphor powder, resulting in a decrease in the conversion efficiency of the phosphor powder, thus solving the problem caused by the reduction in the conversion efficiency of the phosphor powder. The problem of color drift and brightness attenuation of LED devices.

The above description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (4)

1. a mixed light LED fluorescent powder packaging structure, comprise LED chip and metal substrate, described LED chip is located at the upper surface of described metal substrate, it is characterized in that, on described metal substrate, lay one deck insulating barrier, above described insulating barrier, line layer is set, above described line layer, is equipped with the spacing layer of packaging plastic that insulating material is made, on the spacing layer of described packaging plastic, be provided with again the spacing layer of fluorescent glue that insulating material is made; In the spacing layer of described packaging plastic, pour into packaging plastic, in the spacing layer of described fluorescent glue, pour into fluorescent glue.

2. mixed light LED fluorescent powder packaging structure according to claim 1, is characterized in that, the positive and negative lead wires of described metal substrate is welded on described line layer.

3. mixed light LED fluorescent powder packaging structure according to claim 1, is characterized in that, described fluorescent glue is that fluorescent material adds glue.

4. mixed light LED fluorescent powder packaging structure according to claim 1, is characterized in that, described packaging plastic is silica gel.