CN104156713A - Fingerprint recognition device and terminal device - Google Patents
Fingerprint recognition device and terminal device Download PDFInfo
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- CN104156713A CN104156713A CN201410425230.2A CN201410425230A CN104156713A CN 104156713 A CN104156713 A CN 104156713A CN 201410425230 A CN201410425230 A CN 201410425230A CN 104156713 A CN104156713 A CN 104156713A
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Abstract
The invention discloses a fingerprint recognition device and a terminal device. The fingerprint recognition device comprises a fingerprint recognition assembly, a supporting piece, a protection layer and a base ring, wherein the fingerprint recognition assembly comprises a flexible circuit film, sensors and a control chip, the sensors and the control chip are formed on the flexible circuit film, and the sensors are electrically connected with the control chip; the supporting piece comprises an upper part and a lower part, the upper part protrudes relative to the lower part, the supporting piece is shaped like inverted T and partially wrapped in the fingerprint recognition assembly, and the sensors are located on the top surface of the upper part; the protection layer is formed above at least part of the fingerprint recognition assembly and located above the sensors; the base ring is provided with a top opening and placed on part of the supporting piece, and at least part of the fingerprint recognition assembly is contained in the base ring; the upper part of the protection layer is exposed through the top opening of the base ring.
Description
Technical field
The present invention relates to field of biological recognition, the terminal device that relates in particular to a kind of fingerprint identification device and comprise it.
Background technology
In recent years, along with the development of memory technology, terminal device stores the capsule information such as a large amount of personal information as smart mobile phone, panel computer etc., and its security becomes even more important.At present, realize the cryptoguard to its terminal device by the form such as password, figure.
But for the cipher mode such as password, figure, user need remember password and/or the figure set; In addition, in public, the danger that also exists password to reveal.And in order to improve security, often needing to increase the complexity of password and figure, the difficulty that this has further increased user's memory undoubtedly, causes conflicting between safe and easy-to-use.
Fingerprint is made up of the rough lines of finger surface skin, is the unique feature of human body, and its complexity can be provided for enough features of identification.Fingerprint recognition is to utilize the feature of fingerprint uniqueness and stability to realize identification, and remembers without user.
Capacitance type fingerprint identification sensor forms conducting channel on base material substrate, and in the time that finger contacts with sensor, fingerprint pattern is surveyed and formed to the different capacitances that produce by the projection of fingerprint ridge and the depression of fingerprint paddy.
But, along with fingerprint identification technology is used widely, run into some problems, be mainly that fingerprint identification device is while being applied in electronic equipment, to the requirement of its size and height.Along with being widely used of hand-held electronic equipment, the deviser of electronic equipment or slip-stick artist constantly pursue electronic equipment integrated and ease for use the largelyst on the one hand, reduce again on the other hand the size of the integrated package in electronic equipment and reduce its cost.Typically, these electronic equipments have only comprised I/O element necessary for Core Feature, for example screen and limited button.
Therefore, need to realize a kind of encapsulation of the fingerprint identification device that is integrated in hand-held electronic equipment, to overcome the problems of the prior art.
Summary of the invention
In view of this, the invention provides a kind of terminal device that is integrated in the fingerprint identification device in terminal device and comprises it.
Additional aspect of the present invention and advantage will partly be set forth in the following description, and partly will from describe, become obviously, or can the acquistion by practice of the present invention.
One aspect of the present invention discloses a kind of fingerprint identification device, comprising: fingerprint recognition assembly, comprising: flexible circuit film and be formed at sensor and the control chip on described flexible circuit film, wherein said sensor and the electrical connection of described control chip; Support member, comprise part and lower part, wherein said top is divided with respect to described lower part and is convex, thereby described support member has inverted T-shaped, described support member by described fingerprint recognition components wrap up, and described sensor is positioned at the top surface of described upper part; Protective seam, is formed at least part of described fingerprint recognition assembly and is positioned at described sensor top; And basic ring, there is top opening, be placed on the described support member of part, within described fingerprint recognition assembly is placed in described basic ring at least in part; Wherein, described protective seam exposes upper part by the top opening of described basic ring.
In an embodiment, described sensor and described control chip are arranged at the homonymy of described flexible circuit film discretely, and are connected with described flexible circuit thin-film electro respectively.
In another embodiment, described sensor and described control chip are arranged at respectively the not homonymy of described support member.
In an embodiment again, described control chip is electrically connected on described flexible circuit film in the mode of flip-chip.
In an embodiment again, the center of described support member and the center of described sensor are in the same plane perpendicular to described support member top surface.
In an embodiment again, described fingerprint recognition assembly wraps up the part top surface of the lower part of the top surface of the upper part of described support member, a side surface and described support member, a side surface.
In an embodiment again, described fingerprint recognition assembly wraps up the part top surface of the lower part of the top surface of the upper part of described support member, a side surface and described support member, side surface and basal surface.
In an embodiment again, described support member has groove, with accommodating described control chip.
In an embodiment again, described depth of groove is greater than the thickness of described control chip.
In an embodiment again, the top surface of described basic ring is higher than the top surface of described protective seam.
In an embodiment again, the top surface of described basic ring has the chamfering towards center, or the top surface of described basic ring is circular arc towards center one side.
In an embodiment again, described basic ring comprises sidepiece and is connected in the protuberance of described sidepiece, and the basal surface of described protuberance contacts described protection.
In an embodiment again, the difference in height of the top surface of described basic ring and the top surface of described protective seam is H, and the bee-line between described basic ring and described sensor sensing region is L, and H/L is 1/5～2/3.
In an embodiment again, H/L is 1/4～1/2.
In an embodiment again, the top surface of described basic ring is concordant with the top surface of described protective seam.
In an embodiment again, described support member is film adhered by bonding agent and described flexible circuit at least in part.
In an embodiment again, described bonding agent comprises PSA glue and/or hot-setting adhesive.
In an embodiment again, described fingerprint identification device also comprises: color layers, and it is coated on the top of described sensor, and between described protective seam and described fingerprint recognition assembly.
In an embodiment again, described color layers comprises ink layer.
In an embodiment again, described protective layer material comprises organic film, glass, pottery, sapphire, quartz, resin hard layer or diamond like carbon coating.
In an embodiment again, described fingerprint identification device also comprises: flexible PCB; Wherein said flexible circuit film is electrically connected described flexible PCB by ACF glue.
In an embodiment again, described fingerprint identification device also comprises: at least one passive element, it is formed on described flexible PCB.
In an embodiment again, described fingerprint identification device also comprises: base plate; The described flexible circuit film-shaped wherein having wrapped up after described support member is formed on described base plate, and described sensor place plane is away from described base plate.
In an embodiment again, described base plate has a through hole, or the side of described base plate has a gap, so that a junction of described flexible circuit film is passed to described base plate.
In an embodiment again, described base plate has groove, with accommodating described control chip.
The present invention discloses a kind of terminal device on the other hand, comprises the fingerprint identification device described in above-mentioned any one.
In an embodiment, described terminal device also comprises pressure-active element, is arranged on the below of described fingerprint identification device.
The fingerprint identification device 1 that the embodiment of the present invention provides, packaging technology is simple, has less structure, can meet the lightening demand of terminal device for its integrated package, and be easy to be arranged in terminal device, has effectively promoted production yield and efficiency.
Brief description of the drawings
By describe its example embodiment in detail with reference to accompanying drawing, above-mentioned and further feature of the present invention and advantage will become more obvious.
Fig. 1 is the structural representation of fingerprint identification device of the present invention.
The explosive view that Fig. 2 A to Fig. 2 C is fingerprint identification device of the present invention.
Fig. 3 A is the decomposing schematic representation that the fingerprint recognition module of the embodiment of the present invention one is cut open along A-A ' in Fig. 1.
Fig. 3 B is fingerprint recognition module in the fingerprint identification device of the embodiment of the present invention and the connection diagram of flexible PCB.
Fig. 4 is the decomposing schematic representation that the fingerprint recognition module of the embodiment of the present invention two is cut open along A-A ' in Fig. 1.
Fig. 5 is the decomposing schematic representation that the fingerprint recognition module of the embodiment of the present invention three is cut open along A-A ' in Fig. 1.
Fig. 6 is the decomposing schematic representation that the fingerprint recognition module of the embodiment of the present invention four is cut open along A-A ' in Fig. 1.
Fig. 7 is the basic ring structural representation in the embodiment of the present invention.
Fig. 8 is the explosive view of the terminal device of the embodiment of the present invention.
Embodiment
Referring now to accompanying drawing, example embodiment is more fully described.But example embodiment can be implemented in a variety of forms, and should not be understood to be limited to embodiment set forth herein; On the contrary, provide these embodiments to make the present invention by comprehensive and complete, and the design of example embodiment is conveyed to those skilled in the art all sidedly.Identical in the drawings Reference numeral represents same or similar structure.
Described feature or structure can be combined in one or more embodiments in any suitable manner.In the following description, thus provide many details to provide fully understanding embodiments of the present invention.But, one of ordinary skill in the art would recognize that there is no one or more in described specific detail, or adopt other structure, constituent element etc., also can put into practice technical scheme of the present invention.In other cases, be not shown specifically or describe known features or operation to avoid fuzzy the present invention.
Terminal device is configured to comprise conventionally: display screen, touch-screen, cover-plate glass, storage, SOC (system on a chip) (system on chip), CPU, GPU, internal memory, Wi-Fi connection, bluetooth connection, USB connection, battery, external power supply, computer-readable media and software etc.
In addition, the display screen of terminal device or terminal device can be configured to comprise such as, a button or a kind of physical appearance (form factor) for user interactions (machine open/close, volume adjustment etc.).Button can be integrated in the shell of terminal device, also can be included in the screen of terminal device.The size of physical appearance can be less than or equal to 900mm
2, can be less than or equal to 400mm
2, can be less than or equal to 225mm
2, can be less than or equal to 100mm
2, can be less than or equal to 75mm
2, can be less than or equal to 50mm
2, can be less than or equal to 25mm
2, can be less than or equal to 10mm
2, or can be less than or equal to 5mm
2.In certain embodiments, the thickness of physical appearance is less than or equal to 2mm, is preferably less than or equal to 1.5mm, further, can also be less than or equal to 1mm.
Fingerprint identification device for example can comprise: fingerprint sensor, speed pickup and be electrically connected on fingerprint sensor and the control circuit of speed pickup.The electrode of fingerprint sensor and speed pickup is formed at the top surface of substrate by modes such as etchings.Protective seam is formed on fingerprint sensor and speed pickup, thinks that sensor provides electrical isolation and mechanical protection.Alternatively, the electrode of fingerprint sensor also can be formed at the basal surface of substrate, and wherein substrate can be used as protective seam, and on the top surface of substrate, forms further one deck hard conating (hard coating).
Fingerprint identification device disclosed by the invention is integrated in the screen or shell of terminal device, and be positioned on the screen of terminal device or the top surface of shell, so that when the top surface of user's finger contact terminal device, the distance of fingerprint sensor and finger is in 300 μ m.In configuring at least in part, fingerprint identification device can be configured in the time of the top surface of user's finger contact terminal device, and fingerprint sensor wherein and the distance of finger are in 200 μ m, preferably in 150 μ m, more preferably in 100 μ m, what is more can be in 50 μ m.
In certain embodiments, can provide an one chip to control at least function of one of them of display screen, touch-screen and fingerprint identification device.In addition, the top surface of the terminal device that comprises fingerprint sensor in the present invention is smooth or roughly smooth.Display screen and fingerprint identification device are configured to integrate and have identical mode of operation, or are configured to the single component that terminal device comprises.
Fig. 1 is the structural representation of fingerprint identification device of the present invention.Fingerprint identification device 1 shown in Fig. 1 for example can be applicable to the mobile terminal such as smart mobile phone, panel computer, also can be applicable to the terminal device of bank as ATM etc., but the present invention is not as limit.
Provide the region for fingerprint recognition at the top surface of fingerprint identification device 1 for user, user can or be placed in this region by finger by scratching on this region, to read its fingerprint image.
The user interface housing that fingerprint identification device 1 shown in Fig. 1 is terminal device, for example, be a button in terminal device, is integrated in terminal device, for example smart mobile phone.Its size can design adaptively because of the difference of terminal device.Adaptive two-dimensional, for example square or rectangular, can be 4mm × 1mm, 4mm × 4mm, 5mm × 15mm, 10mm × 10mm or 10mm × 15mm etc.Adaptive diameter, for example, be circular or oval, can be 4mm, 5mm, 6mm, 7mm, 8mm, 9mm or 10mm etc.The above-mentioned size of enumerating is only example, and the present invention is not as limit.In addition, the size of fingerprint identification device 1 is also that one dimension sensor or dimension sensor are relevant with sensor wherein.
The shape of fingerprint identification device 1 can be any physical form, comprising: circle, ellipse, square, rectangle, trapezoidal, triangle etc., the present invention is not as limit.Smart mobile phone or panel computer use the substrate with high gloss as its cover plate conventionally.The material of these cover plates is generally glass, tempered glass, transparent plastic, sapphire, pottery or has the material of any high-gloss surface.In order to adapt in such terminal device, the top surface of the housing of fingerprint identification device 1 also needs to have the surface of high gloss, to be mated with surface around.The material of the top surface of the housing of fingerprint identification device 1 can be for example glass, plastics, pottery, resinous coat, sapphire etc.
In at least part of configuration, fingerprint identification device 1 can obtain outward appearance and the sense of touch with the housing effect same of terminal device.And due to the protective seam 40 being placed on fingerprint recognition module 10, make the sensor in fingerprint recognition module 10 can directly not contact user's finger with color layers 30, thereby make fingerprint identification device 1 durable.
In certain embodiments, the fingerprint sensor in fingerprint identification device 1 can also with the touch sensor of terminal device (touch sensor) collaborative work.Use same control chip control touch sensor circuit and fingerprint sensor circuit.This difunctional controller can be integrated in fingerprint identification device 1, or is electrically connected with fingerprint identification device 1 by flexible PCB.
Fig. 2 A is the explosive view of fingerprint identification device of the present invention.As shown in Fig. 1 and Fig. 2 A, fingerprint identification device 1 comprises: fingerprint recognition module 10 and protective seam 40.
Wherein protective seam 40 is formed at the top of fingerprint recognition module 10, with to fingerprint recognition module 10, especially sensor 1002 is protected.Protective seam 40 is by spraying technology or printing technology or vacuum evaporation technology formation; its material for example comprises UV curing type PMMA glue (ultraviolet curing transparent glue), thermohardening type PMMA glue or diamond like carbon (Diamond-like Carbon; DLC), wherein DLC adopts plated film mode to form protective seam.In certain embodiments; protective seam 40 can also be formed by the material of glass, pottery, sapphire, quartz or other durables, the organic films such as such as polymethylmethacrylate (PMMA), polyethylene terephthalate (PET), polyimide (PI).Protective seam 40 is for example a hard conating (hard coating).In addition, protective seam 40 can be directly also the cover plate (such as glass or pottery etc.) of terminal device.
In certain embodiments, fingerprint identification device 1 also comprises color layers 30, is formed between fingerprint recognition module 10 and protective seam 40, invisible to user to ensure the fingerprint recognition module 10 under it, beautifies fingerprint identification device; There is in addition the effect of synchronizeing with the housing outward appearance of terminal device, if for example terminal device under it is white, can make fingerprint identification device 1 present white by color layers 30, if and its affiliated terminal device is black, make fingerprint identification device 1 present black by color layers 30.Color layers 30 is for example an ink layer, or is the coating that is formed or formed by other special techniques by deposition technique.Conventionally, color layers 30 can be shown as white, black etc., but the present invention is not as limit.In addition, at protective seam 40 or under protective seam 40 and color layers 30, can also comprise other layers, the present invention is not as limit.
In certain embodiments, fingerprint identification device 1 also comprises base plate 50.Wherein, fingerprint recognition module 10 fits on base plate 50, for example, undertaken bonding by pressure sensitive adhesive (Pressure-Sensitive Adhesive, PSA).
As shown in Fig. 1 and Fig. 2 A, fingerprint recognition module 10 comprises a junction E, for fingerprint recognition module 10 is electrically connected with a flexible PCB (FPC).In the time of encapsulation, as shown in Figure 2 B, can, by the mode of Durchgangshohle on base plate 50, form a through hole H, and this connecting portion E is passed from the bottom of base plate 50; Or, can also as shown in Figure 2 C, a fritter be cut away in the side of base plate 50, form a gap B, so that this connecting portion E is passed from the bottom of base plate 50.It should be noted that, in Fig. 2 B, in through hole H and Fig. 2 C, the position of gap B, size, shape etc. are only the use of signal, are not in order to limit the present invention.
In certain embodiments, fingerprint identification device 1 also comprises basic ring (bezel) 20.Basic ring 20 has top opening, cover be formed with protective seam 40 or be formed with color layers 30 and the fingerprint recognition module 10 of protective seam 40 on, at least in part fingerprint recognition module 10 is placed in one, be used to form the exterior contour of fingerprint identification device 1.The material of basic ring 20 is for example metal, plastics or PEEK (polyetheretherketone, polyether-ether-ketone resin) material, and it has the features such as wear-resisting, high temperature resistant, corrosion-resistant.The shape of basic ring 20 depends on the global shape of fingerprint identification device 1, can be annulus, elliptical ring, Q-RING etc.
In certain embodiments, in the time that the sensor for sensing user fingerprint in fingerprint recognition module 10 adopts active fingerprint Identification sensor, basic ring 20 is now necessary for conductive material, and now it is also for modulating the voltage of user's finger, so that better electric capacity to be provided, promote sensing precision.In addition, basic ring 20 can also be used to shield galvanomagnetic effect, with Capacitor apart being provided or reducing the effect of other electromagnetic effects.
In further embodiments, basic ring 20 also can be only used as to decorate.
The top surface of basic ring 20 can be concordant with the end face of protective seam 40, also can be if Fig. 7 (a) be to as shown in Fig. 7 (d), and the top surface of basic ring 20 is higher than protective seam 40.As shown in Fig. 7 (a), basic ring 20, towards its center, can be right angle towards the drift angle of fingerprint recognition module 10; Or as shown in Fig. 7 (b), the top surface of basic ring 20 has towards its center, towards the chamfering of fingerprint recognition module 10; Or as shown in Fig. 7 (c), basic ring 20, towards its center, is circular arc towards the drift angle of fingerprint recognition module 10; Again or, as shown in Fig. 7 (d), basic ring 20 comprises sidepiece and is connected in the protuberance of sidepiece, the basal surface of protuberance contacts with protective seam 40; Again or, as shown in Fig. 7 (e), the top surface of protuberance has towards its center, towards the chamfering of fingerprint recognition module 10; In addition, protuberance also can be circular arc towards the drift angle at its center, and the present invention is not as limit.
As shown in Fig. 7 (a) or Fig. 7 (d); the top surface of basic ring 20 is higher than the top surface of protective seam 40; for example difference in height is between the two H; in the time that user's finger carries out fingerprint recognition; if the spacing L between fingerprint recognition assembly 100 and basic ring is 0 o'clock; in the part near basic ring 20, finger will not reach fingerprint recognition assembly 100, thereby cannot identify exactly the fingerprint of user's finger.
And as shown in Fig. 7 (b), Fig. 7 (c) or Fig. 7 (e), although because basic ring 20 has chamfering or is circular arc towards the drift angle of core, finger contact is less than less than the area of fingerprint recognition assembly 100 situation that the drift angle towards core as shown in Fig. 7 (a) or Fig. 7 (d) is right angle, but also need L to be greater than 0, to guarantee to carry out exactly fingerprint recognition.
Find under study for action, between spacing L and height H, have certain proportionate relationship, when the ratio of H and L, H/L is 1/5～2/3 o'clock, can guarantee that fingerprint recognition ground accurately carries out.Preferably, H/L is 1/4～1/2.Based on this, in the time that the induction region of fingerprint sensor is set, avoid induction region to be arranged in the scope of this blind area (be finger contact less than region) as far as possible.
In Fig. 1 and Fig. 2 A, the upper part that basic ring 20 protrudes, taking rectangle as illustrating meaning, can also be all square, circular, oval etc., and depending on the design requirement of affiliated terminal device, the present invention is not as limit.In addition, in certain embodiments, basic ring also can only comprise the upper part that the basic ring 20 shown in Fig. 2 A protrudes.
Fig. 3 A is the decomposing schematic representation that the fingerprint recognition module of the embodiment of the present invention one is cut open along A-A ' in Fig. 1.It should be noted that, this figure is the decomposing schematic representation of fingerprint recognition modular structure, in order more clearly to illustrate the structure of fingerprint recognition module, in figure, between each assembly, directly do not join, it can not be used for limiting the annexation between the each assembly of fingerprint recognition module of the present invention; In addition,, in order to simplify accompanying drawing, in figure, basic ring 20 is for only comprising the structure of the upper part of basic ring in Fig. 2 A.Above-mentioned explanation is applicable to Fig. 4 to Fig. 6 too.
As shown in Figure 3A, fingerprint recognition module 11 comprises: fingerprint recognition assembly 100 and support member 102.Fingerprint recognition assembly 100 comprises: flexible circuit film 1000 and be formed at sensor 1002 and the control chip 1004 on flexible circuit film 1000.
Flexible circuit film 1000 can be for example Kapton (Polyimide film, PI film), as shown in FIG., can be made up of two layers of polyimide resin (Polyimide resin, PI resin); Also can be that one deck is PI base material, the protective seam resin that another layer is other materials, the present invention is not as limit.
Sensor 1002 is formed on flexible circuit film 1000.Comprise at least one sensing element, with ridge and the paddy of sensing user finger, thereby user's fingerprint is identified.Sensor 1002 can be also double-deck (i.e. two dimension) structure for individual layer (being one dimension) structure, and the present invention is not as limit.
The scratching formula sensor that sensor 1002 in the present invention can distribute for being strip type, the push type sensor that also can distribute for being array, the present invention is not as limit.In addition, sensor 1002 can also or be worked in combination with the combination of elements of optics sensing, infrared sensing or other sensings of the fingerprint of execution to user, and these elements itself can be coupled to certain other features of epidermis, the subcutaneous part of user's finger or expression user's the fingerprint of user's finger.
Control chip 1004 is for example electrically connected with flexible circuit film 1000 by flip-chip (flip chip) technology.The face down of control chip 1004, towards flexible circuit film 1000, without Bonding, is adopted to the Metal Ball (for example tin ball) of some, make control chip 1004 on electric and be mechanically connected in flexible circuit film 1000.Adopt flip chip technology (fct), because it is without Bonding, can form the shortest circuit, reduced resistance; In addition, by adopting Metal Ball to connect, dwindle package dimension, improved electrical performance.
Control chip 1004 and the non-integral type encapsulating structure being packaged in same chip of sensor 1002, but be arranged at independently of one another, discretely the homonymy of flexible circuit film 1000, and be electrically connected with flexible circuit film 1000 respectively.Control chip 1004 is electrically connected with sensor 1002 by flexible circuit film 1000, processes thereby the signal of sensor 1002 is transferred in control chip 1004.
As shown in Figure 3A, support member 102 comprises part and lower part, and its middle and upper part phase-splitting is convex for lower part, thereby support member 102 has inverted T-shaped.Preferably, upper part is in the central protuberance of lower part.In the xsect of support member 102 as shown in Figure 3A, the shape of upper part is for example rectangle, square or trapezoidal etc., and the present invention is not as limit.
Support member 102 is partly wrapped up by fingerprint recognition assembly 100, and wherein sensor 1002 is covered on described support member 102 top surface of part.Flexible circuit film 1000 in fingerprint recognition assembly 100 has wrapped up part top surface and a side of top surface, a side and the lower part of part on support member 102.
In addition, the center of support member 102 center and sensor 1002 is in a plane perpendicular to support member 102 top surfaces.
Between flexible circuit film 1000 and support member 102, engage (not shown) by bonding agent at least in part, to fix fingerprint recognition assembly 100 and support member 102.For example, can only on surface level, use adhesive bond, on any surface that also can contact with fingerprint recognition assembly 100 at support member 102, use adhesive bond, the present invention is not as limit.Bonding agent is for example pressure sensitive adhesive (PSA) or hot-setting adhesive.
In the time that fingerprint recognition module 11 is fitted in to base plate 50 (not shown), for example the flexible circuit film 1000 that is formed with control chip 1004 parts can be bent to 90 degree to the basic ring 20 on right side in figure, on the top surface of base plate 50, a corresponding region is dug up in relevant position again, form a groove, with accommodating control chip 1004.In addition, can also on base plate 50, bore a hole, make control chip 1004 through after base plate 50, then bend 90 degree, and a corresponding region be dug up in relevant position on the basal surface of base plate 50, forms a groove, accommodating control chip 1004.
Basic ring 20 covers and is forming protective seam 40 or forming on the sensor 1002 of color layers 30 and protective seam 40; be placed in partly on support member 102;, on the top that is placed in support member 102 projections is divided, the top that top surface has been covered to the support member 102 of sensor 1002 is placed within basic ring 20.
Protective seam 40 is formed at least part of fingerprint recognition assembly 100, and is positioned at sensor 1002 tops.The top opening of basic ring 20 exposes protective seam 40.
Color layers 30 is coated on sensor 1002, between protective seam 40 and flexible circuit film 1000.
For better fixing basic ring 20 and fingerprint recognition module 11, between basic ring 20 and fingerprint recognition module 11, also can engage (not shown) by for example pressure sensitive adhesive or hot-setting adhesive, but the present invention is not as limit.
In addition, as shown in Figure 3 B, fingerprint identification device 1 also comprises: flexible PCB 60, fingerprint recognition module 11 engages with flexible PCB 60 by the connecting portion E on flexible circuit film 1000.By the ACF that fits (anisotropic conductive or anisotropic conducting rubber), then carry out crimping (bonding) with flexible PCB 60 on connecting portion E, to be electrically connected flexible circuit film 1000 and flexible PCB 60.
Fingerprint identification device 1 for example, is electrically connected by flexible PCB 60 and external circuit (, the treatment circuit of smart mobile phone or panel computer etc.).
In addition, on flexible PCB 60, also comprise at least one passive element 610, such as resistance or electric capacity etc.
Fig. 4 is the decomposing schematic representation that the fingerprint recognition module of the embodiment of the present invention two is cut open along A-A ' in Fig. 1.The fingerprint recognition module 12 of embodiment bis-shown in Fig. 4 is with the difference of the fingerprint recognition module 11 of the embodiment mono-shown in Fig. 3 A: the fingerprint recognition assembly 100 in fingerprint recognition module 12 has also wrapped up the basal surface of 103 times parts of support member.
In addition, for accommodating control chip 1004, on a surface of support member 103, dig up a part, form a groove, with accommodating control chip 1004.In certain embodiments, for fear of make control chip 1004 produce the phenomenon of damage because of user's finger presses fingerprint identification device 1, the height of diging up part on support member 103 can a little higher than control chip 1004, while making to press, support member 103 can not touch control chip, thereby avoids the destruction to control chip 1004.
In embodiment bis-, with content identical in embodiment mono-, will repeat no more at this.
Fig. 5 is the decomposing schematic representation that the fingerprint recognition module of the embodiment of the present invention three is cut open along A-A ' in Fig. 1.The difference of the fingerprint recognition module 11 of the embodiment mono-shown in fingerprint recognition module 13 and Fig. 3 A of the embodiment tri-shown in Fig. 5 is: the parcel mode between fingerprint recognition assembly 100 and support member 104 in fingerprint recognition module 13, and the shape of support member 104.
As shown in Figure 5, flexible circuit film 1000 in fingerprint recognition module 13 is shorter than the flexible circuit film 1000 in fingerprint recognition module 11, flexible circuit film 1000 in fingerprint recognition module 13 is no more than the side surface of 104 times parts of support member, further simplify the structure of fingerprint recognition module 13, saved the material of flexible circuit film.
For accommodating control chip 1004, can on the side surface being wrapped up by flexible circuit film 1000 of 104 times parts of support member, dig up a part, form a groove.
In embodiment tri-, with content identical in embodiment mono-, will repeat no more at this.
Fig. 6 is the decomposing schematic representation that the fingerprint recognition module of the embodiment of the present invention four is cut open along A-A ' in Fig. 1.The difference of the fingerprint recognition module 11 of the embodiment mono-shown in fingerprint recognition module 14 and Fig. 3 A of the embodiment tetra-shown in Fig. 6 is: the parcel mode between fingerprint recognition assembly 100 and support member 104 in fingerprint recognition module 14, and the shape of support member 104.
As shown in Figure 6, flexible circuit film 1000 in fingerprint recognition module 14 is shorter than the flexible circuit film 1000 in fingerprint recognition module 11, flexible circuit film 1000 in fingerprint recognition module 14 is no more than the side surface of 104 times parts of support member, further simplify the structure of fingerprint recognition module 14, saved the material of flexible circuit film.
For accommodating control chip 1004, can on the part top surface being wrapped up by flexible circuit film 1000 of 104 times parts of support member, dig up a part, form a groove.
In embodiment tetra-, with content identical in embodiment mono-, will repeat no more at this.
The thickness of the protective seam 40 in the fingerprint identification device 1 of the embodiment of the present invention is for example 0.015mm; the thickness of color layers 30 is for example 0.01mm; the thickness of the bonding agent between color layers 30 and fingerprint recognition module 10 is for example 0.008mm, and the thickness that is formed with the flexible circuit film 1000 of sensor 1002 and control chip 1004 is for example 0.05mm.Therefore, the fingerprint identification device 1 of the embodiment of the present invention can provide very thin thickness, to meet terminal device to the lightening demand of its integrated package.Above-mentioned size is only for example, and unrestricted the present invention.
Taking embodiment mono-as example, the manufacture craft of the fingerprint identification device 1 of the embodiment of the present invention roughly comprises: first the flexible circuit film that is formed with sensor 1002 and control chip 1,004 1000 that is cut into single is carried out to pressing with support member 102, its pressing order is followed successively by sensor 1002 pressings, control chip 1004 pressings and edge pressing, in the time of pressing, between flexible circuit film 1000 and support member 102, undertaken by bonding agent at least in part bonding, with fixing flexible circuit film 1000 and support member 102; Then, the flexible circuit film 1000 that has wrapped up support member 102 is fitted on base plate 50, for example fit by pressure sensitive adhesive (PSA) or hot-setting adhesive, in addition need to be on base plate 50 by Durchgangshohle the mode to form through hole (as shown in Figure 2 B) or edge to be cut away to a fritter and forms gap (as shown in Figure 2 C), connecting portion E on flexible circuit film 1000 is passed to base plate 50, to be electrically connected with flexible PCB 60; Afterwards, after base plate has been assembled, be cured (Base Post Cure); On sensor 1002, tint (Color Coating), form color layers 30; After tinting, carry out baking-curing (Post Color Cure); Afterwards, upper UV glue, to form protective seam 40, and is cured processing (UV Cure) again; Again then, add basic ring 20, and undertaken bonding by PSA; Again carry out baking-curing (Post Housing Cure) for the assembly having added after basic ring 20; After solidifying, carrying out electricity slurry and clean, is mainly the cleaning for connecting portion E position, to pass through ACF glue bond flexible PCB 60; After electricity slurry cleans, at the position of connecting portion E laminating ACF glue, and through ACF pressing (ACF bonding), flexible circuit film 1000 is electrically connected with flexible PCB 60, ACF particle in ACF glue can break in the time of high-temperature laminating, and conduct, the position of not pressing can not conduct; Finally, as needs, fingerprint identification device is carried out to manual testing.
In addition, manufacture craft can also be: first by sensor of 1002 correspondences tinting with induction region finger contact, after upper UV glue, then fit with support member 102; Afterwards, then fit with base plate 50, and connecting portion E is stretched out to base plate 50; Then cover basic ring 20; Finally utilize ACF that connecting portion E and flexible PCB 60 are fitted, to be electrically connected.
Or, can also be: first flexible circuit film 1000 and support member 102 are fitted; Afterwards, 1002 correspondences tint with induction region finger contact at sensor, on UV glue; Fit with base plate 50 again, and connecting portion E is stretched out to base plate; Then cover basic ring 20; Finally utilize ACF that connecting portion E and flexible PCB 60 are fitted, to be electrically connected.
Fig. 8 is the explosive view of the terminal device of the embodiment of the present invention.The fingerprint identification device 22 of the embodiment of the present invention can be integrated in the touch-screen or housing of terminal device 2 such as smart mobile phone, panel computer etc.For example, can use with the control knob of terminal device 2 or on-off element combination, also can be directly embedded into cover-plate glass or the interior use separately of housing of terminal device 2.In a word, can, according to the situation of terminal device 2, carry out adaptive adjustment, with user-friendly.In the time that the control knob of fingerprint identification device 22 and terminal device 2 or on-off element combination are used, fingerprint identification device 22 is installed in the button hole 210 on the cover-plate glass 20 of terminal device 2, below fingerprint identification device 22, also need to be provided with pressure-active element 24, to respond to the pressing operation of user in the time operating this control knob or on-off element.It should be noted that, the shape of the pressure-active element 24 shown in figure is only the use of signal explanation, and unrestricted the present invention.
The fingerprint identification device 1 that the embodiment of the present invention provides, packaging technology is simple, has less structure, can meet the lightening demand of terminal device for its integrated package, and be easy to be arranged in terminal device, has effectively promoted production yield and efficiency.
Below illustrate particularly and described illustrative embodiments of the present invention.Should be appreciated that, the invention is not restricted to disclosed embodiment, on the contrary, the invention is intended to contain the various amendments and the equivalent replacement that comprise within the scope of the appended claims.
Claims (27)
1. a fingerprint identification device, is characterized in that, comprising:
Fingerprint recognition assembly, comprising: flexible circuit film and be formed at sensor and the control chip on described flexible circuit film, wherein said sensor and the electrical connection of described control chip;
Support member, comprise part and lower part, wherein said top is divided with respect to described lower part and is convex, thereby described support member has inverted T-shaped, described support member by described fingerprint recognition components wrap up, and described sensor is positioned at the top surface of described upper part;
Protective seam, is formed at least part of described fingerprint recognition assembly and is positioned at described sensor top; And
Basic ring, has top opening, is placed on the described support member of part, within described fingerprint recognition assembly is placed in described basic ring at least in part;
Wherein, described protective seam exposes upper part by the top opening of described basic ring.
2. fingerprint identification device according to claim 1, is characterized in that, described sensor and described control chip are arranged at the homonymy of described flexible circuit film discretely, and is connected with described flexible circuit thin-film electro respectively.
3. fingerprint identification device according to claim 2, described sensor and described control chip are arranged at respectively the not homonymy of described support member.
4. fingerprint identification device according to claim 2, is characterized in that, described control chip is electrically connected on described flexible circuit film in the mode of flip-chip.
5. fingerprint identification device according to claim 1, is characterized in that, the center of described support member and the center of described sensor are in the same plane perpendicular to described support member top surface.
6. fingerprint identification device according to claim 1, is characterized in that, described fingerprint recognition assembly wraps up the part top surface of the lower part of the top surface of the upper part of described support member, a side surface and described support member, a side surface.
7. fingerprint identification device according to claim 1, is characterized in that, described fingerprint recognition assembly wraps up the part top surface of the lower part of the top surface of the upper part of described support member, a side surface and described support member, side surface and basal surface.
8. according to the fingerprint identification device described in claim 6 or 7, it is characterized in that, described support member has groove, with accommodating described control chip.
9. fingerprint identification device according to claim 8, is characterized in that, described depth of groove is greater than the thickness of described control chip.
10. fingerprint identification device according to claim 1, is characterized in that, the top surface of described basic ring is higher than the top surface of described protective seam.
11. fingerprint identification devices according to claim 10, is characterized in that, the top surface of described basic ring has the chamfering towards center, or the top surface of described basic ring is circular arc towards center one side.
12. fingerprint identification devices according to claim 10, is characterized in that, described basic ring comprises sidepiece and the protuberance that is connected in described sidepiece, and the basal surface of described protuberance contacts described protection.
13. fingerprint identification devices according to claim 10, is characterized in that, the difference in height of the top surface of described basic ring and the top surface of described protective seam is H, and the bee-line between described basic ring and described sensor sensing region is L, and H/L is 1/5～2/3.
14. fingerprint identification devices according to claim 13, is characterized in that, H/L is 1/4～1/2.
15. fingerprint identification devices according to claim 1, is characterized in that, the top surface of described basic ring is concordant with the top surface of described protective seam.
16. fingerprint identification devices according to claim 1, is characterized in that, described support member is film adhered by bonding agent and described flexible circuit at least in part.
17. fingerprint identification devices according to claim 16, is characterized in that, described bonding agent comprises PSA glue and/or hot-setting adhesive.
18. fingerprint identification devices according to claim 1, is characterized in that, also comprise: color layers, and it is coated on the top of described sensor, and between described protective seam and described fingerprint recognition assembly.
19. fingerprint identification devices according to claim 18, is characterized in that, described color layers comprises ink layer.
20. fingerprint identification devices according to claim 1, is characterized in that, described protective layer material comprises organic film, glass, pottery, sapphire, quartz, resin hard layer or diamond like carbon coating.
21. fingerprint identification devices according to claim 1, is characterized in that, also comprise: flexible PCB; Wherein said flexible circuit film is electrically connected described flexible PCB by ACF glue.
22. fingerprint identification devices according to claim 21, is characterized in that, also comprise: at least one passive element, it is formed on described flexible PCB.
23. fingerprint identification devices according to claim 1, is characterized in that, also comprise: base plate; The described flexible circuit film-shaped wherein having wrapped up after described support member is formed on described base plate, and described sensor place plane is away from described base plate.
24. fingerprint identification devices according to claim 23, is characterized in that, described base plate has a through hole, or the side of described base plate has a gap, so that a junction of described flexible circuit film is passed to described base plate.
25. fingerprint identification devices according to claim 23, is characterized in that, described base plate has groove, with accommodating described control chip.
26. 1 kinds of terminal devices, is characterized in that, comprise the fingerprint identification device described in claim 1-25 any one.
27. terminal devices according to claim 26, is characterized in that, also comprise pressure-active element, are arranged on the below of described fingerprint identification device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410425230.2A CN104156713A (en) | 2014-08-26 | 2014-08-26 | Fingerprint recognition device and terminal device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410425230.2A CN104156713A (en) | 2014-08-26 | 2014-08-26 | Fingerprint recognition device and terminal device |
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| CN104156713A true CN104156713A (en) | 2014-11-19 |
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| CN201410425230.2A Pending CN104156713A (en) | 2014-08-26 | 2014-08-26 | Fingerprint recognition device and terminal device |
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| CN104751133A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
| CN105303186A (en) * | 2015-11-30 | 2016-02-03 | 信利光电股份有限公司 | Fingerprint detection module and manufacturing method therefor, and electronic equipment |
| CN106156703A (en) * | 2015-04-02 | 2016-11-23 | 神盾股份有限公司 | fingerprint sensing device and sensing method thereof |
| CN106295606A (en) * | 2016-08-19 | 2017-01-04 | 维沃移动通信有限公司 | A kind of fingerprint recognition assembly, fingerprint recognition module and mobile terminal |
| CN106339662A (en) * | 2015-07-09 | 2017-01-18 | 金佶科技股份有限公司 | Fingerprint identification module |
| WO2017067077A1 (en) * | 2015-10-20 | 2017-04-27 | 乐视移动智能信息技术（北京）有限公司 | Glass coating structure, fingerprint detection device and mobile terminal |
| CN106845433A (en) * | 2017-02-08 | 2017-06-13 | 捷开通讯(深圳)有限公司 | Fingerprint recognition module and electronic equipment |
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| CN106156703A (en) * | 2015-04-02 | 2016-11-23 | 神盾股份有限公司 | fingerprint sensing device and sensing method thereof |
| CN106339662A (en) * | 2015-07-09 | 2017-01-18 | 金佶科技股份有限公司 | Fingerprint identification module |
| CN106339662B (en) * | 2015-07-09 | 2020-11-06 | 金佶科技股份有限公司 | Fingerprint identification module |
| WO2017067077A1 (en) * | 2015-10-20 | 2017-04-27 | 乐视移动智能信息技术（北京）有限公司 | Glass coating structure, fingerprint detection device and mobile terminal |
| CN105303186A (en) * | 2015-11-30 | 2016-02-03 | 信利光电股份有限公司 | Fingerprint detection module and manufacturing method therefor, and electronic equipment |
| CN106295606A (en) * | 2016-08-19 | 2017-01-04 | 维沃移动通信有限公司 | A kind of fingerprint recognition assembly, fingerprint recognition module and mobile terminal |
| US10089517B2 (en) * | 2016-12-20 | 2018-10-02 | Primax Electronics Ltd. | Fingerprint identifying module |
| CN108205650A (en) * | 2016-12-20 | 2018-06-26 | 致伸科技股份有限公司 | Fingerprint identification module |
| US20180173931A1 (en) * | 2016-12-20 | 2018-06-21 | Primax Electronics Ltd. | Fingerprint identifying module |
| CN108205650B (en) * | 2016-12-20 | 2021-11-30 | 致伸科技股份有限公司 | Fingerprint identification module |
| CN106845433A (en) * | 2017-02-08 | 2017-06-13 | 捷开通讯(深圳)有限公司 | Fingerprint recognition module and electronic equipment |
| CN106845433B (en) * | 2017-02-08 | 2021-04-20 | 捷开通讯(深圳)有限公司 | Fingerprint identification module and electronic equipment |
| CN111079592A (en) * | 2019-12-04 | 2020-04-28 | 清华大学 | Ceramic fingerprint image generation and extraction method and device |
| CN111079592B (en) * | 2019-12-04 | 2020-10-27 | 清华大学 | Ceramic fingerprint image generating and extracting method and device |
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