CN104155563B - A kind of measurement jig of circuit board - Google Patents
A kind of measurement jig of circuit board Download PDFInfo
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- CN104155563B CN104155563B CN201410424762.4A CN201410424762A CN104155563B CN 104155563 B CN104155563 B CN 104155563B CN 201410424762 A CN201410424762 A CN 201410424762A CN 104155563 B CN104155563 B CN 104155563B
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- probe
- circuit board
- under casing
- pressure bar
- measurement jig
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Abstract
The invention discloses a kind of measurement jig of circuit board, belong to tool equipment technical field, low to solve traditional debugging circuit board method detection efficiency, labor intensity is big, easily error, the problems such as accuracy is low and design.The measurement jig of circuit board includes being arranged on the upper die component above under casing and the lower mold assemblies being arranged under casing top panel, under elevating mechanism and XY axles the governor motion effect of upper die component, probe on upper die component is adjusted to through the probe aperture on lower mold assemblies probe card, probe is contacted with the test product on product support plate for testing solder skip and situations such as opening short circuit of circuit such as circuit board main components.The present invention is simple to operate, and automaticity is high, simplifies manual operation, reduces labor intensity, improves operating efficiency and testing precision.
Description
Technical field
The present invention relates to a kind of tool, more particularly to a kind of measurement jig of circuit board.
Background technology
With the progress of science and technology, electronics industry development is advanced by leaps and bounds, and electronic system becomes increasingly complex, electronic system
Reliability and maintainability requires also more and more higher.Circuit board as electronic system development and production in important component,
The quality of its quality directly affects the quality of whole equipment, and production cycle length influences whether machine debugging progress and delivery time.
Therefore, debugging circuit board is the important step for the quality and production cycle for being related to electronic system.
Traditional debugging circuit board method is mainly that the solder skip of the main components of circuit board is examined using human eye
And situations such as opening short circuit of circuit, but not only detection efficiency is low for this method, labor intensity is big, easily error, and accuracy is low, and
And the substantive issue in circuit board can not be found out.
The content of the invention
The purpose of the present invention is to propose to a kind of simple to operate, automaticity is high, and operating efficiency is high, the high circuit of accuracy
The measurement jig of plate.
To use following technical scheme up to this purpose, the present invention：
The invention provides a kind of measurement jig of circuit board, including it is arranged on the upper die component above under casing and is arranged on
Lower mold assemblies under casing top panel, the upper die component include elevating mechanism, XY axles governor motion and probe, the lift
Structure is used to drive the probe to move up and down, and the XY axles governor motion is used to drive the probe in the horizontal plane along Y-axis side
To and/or X-direction movement；
The lower mold assemblies include product support plate and pressure bar module, and probe module is provided with the product support plate, described
Pressure bar module includes pressure bar and pressure bar lower air cylinder, and the probe module includes probe card, probe is provided with the probe card
Hole, when the probe test product, the pressure bar is pressed in the presence of pressure bar lower air cylinder on product support plate, the probe
Contacted through the probe aperture with test product, the probe connecting test unit transmits test data to the under casing
In interface plate.
Preferably, the pressure bar module also includes Y-axis governor motion, for driving the pressure bar to be moved along Y direction.
Preferably, the XY axles governor motion includes Y-axis governor motion and several X-axis micro-adjusting mechanisms, the Y-axis regulation
Mechanism is connected with the cantilever of the elevating mechanism and the X-axis micro-adjusting mechanism respectively, and each X-axis micro-adjusting mechanism passes through one
Axle device is connected with a probe.
Preferably, the probe module also includes being arranged on the under casing top panel bottom and the spy in the under casing
Top gas cylinder in needle mould group, when the probe test product, top gas cylinder drives the probe card to push up upwards on the probe module
Rise.
Preferably, the under casing top panel bottom is provided with the vacuum cup for fixing test product, and the vacuum is inhaled
Disk is connected with vacuum generator.
Preferably, line slideway is provided with the under casing top panel, the line slideway is set parallel to Y direction,
The pressure bar can slide into the surface of the product support plate along the line slideway.
Preferably, it is provided with PLC in the under casing.
Preferably, the rear of the under casing is provided with air inlet, the air inlet by tracheae respectively with outside air pump and
Cylinders are pushed up on the probe module.
Preferably, it is additionally provided with heat abstractor in the under casing.
Preferably, the bottom of the under casing is provided with buphthalmos wheel.
Beneficial effects of the present invention are：
(1) the invention provides a kind of measurement jig of circuit board, machine is adjusted in the elevating mechanism and XY axles of upper die component
Under structure effect, the probe on upper die component is adjusted to through the probe aperture on lower mold assemblies probe card, probe is carried with product
Test product on plate is contacted for testing solder skip and situations such as opening short circuit of circuit such as circuit board main components.The present invention
Simple to operate, automaticity is high, simplifies manual operation, reduces labor intensity, improves operating efficiency and test is accurate
Degree.
(2) under casing top panel bottom is provided with vacuum cup, and test product is held by vacuum cup, realizes tested production
Product circuit board is fixedly positioning, and enhances the reliability and stability and accuracy of test.
(3) bottom of under casing, which is provided with, rolls flexible buphthalmos wheel, the measurement jig is extremely flexibly slid, drops
The low labor intensity of worker, facilitates operating personnel and is used in different workshops, expand use range.
Brief description of the drawings
Fig. 1 is the stereogram of the test device for the circuit board that the embodiment of the present invention one provides；
Fig. 2 is the partial enlarged drawing at A in Fig. 1；
Fig. 3 is the structural representation for the upper membrane module that the embodiment of the present invention one provides；
Fig. 4 is the structural representation of the product support plate that the embodiment of the present invention one provides and probe module；
Fig. 5 is the structural representation for the under casing top panel bottom that the embodiment of the present invention one provides；
Fig. 6 is the partial enlarged drawing at B in Fig. 5；
Fig. 7 is the rearview of the test device for the circuit board that the embodiment of the present invention one provides.
In figure, 1, under casing；21st, elevating mechanism；211st, cantilever；22nd, XY axles governor motion；221st, Y-axis governor motion；222、
X-axis micro-adjusting mechanism；223rd, shaft coupling；23rd, probe；31st, product support plate；311st, locating slot；32nd, pressure bar module；321st, pressure bar；
322nd, pressure bar lower air cylinder；323rd, Y-axis governor motion；33rd, probe module；331st, probe card；332nd, probe aperture；333rd, probe mould
Top gas cylinder in group；4th, vacuum cup；5th, PLC；6th, air inlet；7th, heat abstractor；8th, buphthalmos wheel.
Embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by embodiment.
Embodiment one：
Present embodiments provide a kind of measurement jig of circuit board, structure such as Fig. 1-Fig. 7 of the measurement jig of the circuit board
Shown, it includes the lower mold assemblies for being arranged on the upper die component of the top of under casing 1 and being arranged under casing top panel.Upper die component bag
Include four groups that four groups of elevating mechanisms, 21, four groups of XY axles governor motions 22 and corresponding elevating mechanism 21 and XY axles governor motion 22 are set
Probe 23, every group of probe 23 include three probes 23.Elevating mechanism 21 is used to drive probe 23 to move up and down.Every group of XY axles regulation
Mechanism 22 includes a Y-axis governor motion 221 and three X-axis micro-adjusting mechanisms 222, Y-axis governor motion 221 respectively with elevating mechanism 21
Cantilever 211 be connected with X-axis micro-adjusting mechanism 222, each X-axis micro-adjusting mechanism 222 passes through a shaft coupling 223 and the phase of a probe 23
Even.Y-axis governor motion 221 is used to drive probe 23 (as shown in Figure 1) mobile along Y direction in the horizontal plane, X-axis micro-adjusting mechanism
222 are used to drive probe 23 (as shown in Figure 1) mobile along X-direction in the horizontal plane.
Lower mold assemblies include product support plate 31, pressure bar module 32 and probe module 33.Wherein, the upper surface of product support plate 31
Formed with the locating slot 311 for fixing circuit board under test, bottom and the under casing top panel bottom of the locating slot 311 set true
The sucker mouth of suction disk 4 is connected, and vacuum cup 4 is connected by tracheae with vacuum generator.It is so designed that, is inhaled by vacuum
Circuit board under test is secured firmly on product support plate 31 by the suction-operated of vacuum in disk 4, realizes the positioning of circuit board under test,
Enhance the reliability and stability and accuracy of test.
Probe module 33 includes top gas cylinder 333 on probe card 331 and probe module, and probe aperture is provided with probe card 331
332, top gas cylinder 333 is arranged under casing top panel bottom and under casing on probe module.When 23 test product of probe, visit
Top gas cylinder 333 drives probe card 331 to jack up upwards in needle mould group.
Pressure bar module 32 includes pressure bar 321, the pressure bar lower air cylinder 322 being connected with pressure bar 321 and Y-axis governor motion 323,
Pressure bar 321 is arranged on the top of under casing top panel, and the line slideway set parallel to Y direction is provided with casing top panel,
Pressure bar lower air cylinder 322 is arranged on the lower section of under casing top panel and under casing 1, and pressure bar 321 passes through Y-axis governor motion 323
It can be slid back and forth along line slideway.When probe 23 tests circuit board under test, driving of the pressure bar 321 in pressure bar lower air cylinder 322
Lower slider is acted on to the surface of product support plate 31, and is pressed on product support plate 31, probe 23 is through probe aperture 332 with being tested electricity
Road plate is in contact, and the connecting test unit of probe 23 transmits test data to the interface plate under casing 1.
PLC 5 is provided with casing 1, the probe that can control upper die component by PLC passes through lower module
Probe aperture on part probe card contacts with test product, so as to realize as circuit board main components solder skip and circuit open it is short
The accurate test of situations such as road.
The rear of under casing 1 is provided with air inlet 6, and air inlet 6 is by tracheae respectively with being pushed up on outside air pump and probe module
Cylinder 333 is connected.
In order to avoid the measurement jig causes the damage of tool due to overheating in the process of running, it is provided with casing 1
Heat abstractor 7, the heat abstractor 7 are preferably fan, can effectively remove caused heat in running, extend equipment
Service life.
The bottom of under casing 1 is provided with buphthalmos wheel 8, and the buphthalmos wheel rolls flexibly, can make the measurement jig extremely flexibly
Sliding, reduces the labor intensity of worker, facilitates operating personnel and used in different workshops, expand use range.
Specific test process is as follows：
First, circuit-under-test plate is placed in the locating slot 311 of lower mold assemblies product support plate 31, then opens measurement jig
Power switch, the pressure bars 321 of lower mold assemblies is by Y-axis governor motion 323 along the line slideway set parallel to Y direction
Forward slip, until sliding into the surface of product support plate 31, product support plate is pressed under the driving by pressure bar lower air cylinder 322
On 31, meanwhile, the probe 23 of upper die component is in elevating mechanism 21, Y-axis governor motion 221 and the collective effect of X-axis micro-adjusting mechanism 222
Under be moved to the probe aperture 332 on alignment probe card 331, until probe 23 passes through probe aperture 332, and the bottom of probe 23 is with treating
The component to be measured of slowdown monitoring circuit plate is in contact, and then completes solder skip and situations such as the opening short circuit of circuit of circuit board main components
Test.
Test when, probe utilize the input of operational amplifier two between virtual earth principle so that with circuit board under test
After the connected component both ends of component to be measured are with current potential, measured after isolation, ensure that the accuracy of measurement.
The quantity of the elevating mechanism of upper die component, XY axles governor motion and probe is not limited to above-mentioned four in the present embodiment
Group, it can need arbitrarily to be set according to actual test.The quantity of the product support plates of lower mold assemblies, pressure bar module and probe module
It is corresponding with the elevating mechanism of upper die component and the quantity of XY axle governor motions, it can be determined according to their setting quantity.
The present invention is simple to operate, and automaticity is high, simplifies manual operation, reduces labor intensity, improves work
Efficiency and testing precision.
The technical principle of the present invention is described above in association with specific embodiment.These descriptions are intended merely to explain the present invention's
Principle, and limiting the scope of the invention can not be construed in any way.Based on explanation herein, people in the art
Member, which need not pay creative work, can associate other embodiments of the present invention, and these modes fall within this hair
Within bright protection domain.
Claims (8)
- A kind of 1. measurement jig of circuit board, it is characterised in that：Including the upper die component being arranged on above under casing (1) and it is arranged on Lower mold assemblies under casing top panel, the upper die component include elevating mechanism (21), XY axles governor motion (22) and probe (23), the elevating mechanism (21) is used to drive the probe (23) to move up and down, and the XY axles governor motion (22) is used for band The probe (23) is moved to move along Y direction and/or X-direction in the horizontal plane；The lower mold assemblies include product support plate (31) and pressure bar module (32), and probe mould is provided with the product support plate (31) Group (33), the pressure bar module (32) include pressure bar (321) and pressure bar lower air cylinder (322), and the probe module (33) includes Probe card (331), probe aperture (332) is provided with the probe card (331), it is described when the probe (23) test product Pressure bar (321) is pressed in the presence of pressure bar lower air cylinder (322) on product support plate (31), and the probe (23) passes through the spy Pin hole (332) contacts with test product, and probe (23) the connecting test unit transmits test data to the under casing (1) Interface plate on；The pressure bar module also includes Y-axis governor motion (323), for driving the pressure bar (321) to be moved along Y direction；The XY axles governor motion (22) includes Y-axis governor motion (221) and several X-axis micro-adjusting mechanisms (222), the Y-axis Governor motion is connected with the cantilever (211) and the X-axis micro-adjusting mechanism (222) of the elevating mechanism (21) respectively, each X Axle micro-adjusting mechanism (222) is connected by a shaft coupling (223) with a probe (23).
- A kind of 2. measurement jig of circuit board according to claim 1, it is characterised in that：The probe module (33) is also wrapped Include and be arranged on the under casing top panel bottom and the top gas cylinder (333) on the probe module in the under casing, when the probe (23) during test product, top gas cylinder (333) drives the probe card (331) to jack up upwards on the probe module.
- A kind of 3. measurement jig of circuit board according to claim 1, it is characterised in that：The under casing top panel bottom is set The vacuum cup (4) for fixing test product is equipped with, the vacuum cup (4) is connected with vacuum generator.
- A kind of 4. measurement jig of circuit board according to claim 1, it is characterised in that：Set on the under casing top panel There is line slideway, the line slideway is set parallel to Y direction, and the pressure bar (321) can slide into along the line slideway The surface of the product support plate (31).
- A kind of 5. measurement jig of circuit board according to claim 1, it is characterised in that：It is provided with the under casing (1) PLC (5).
- A kind of 6. measurement jig of circuit board according to claim 2, it is characterised in that：The rear of the under casing (1) is set Be equipped with air inlet (6), the air inlet (6) by tracheae respectively with top gas cylinder (333) on outside air pump and the probe module It is connected.
- A kind of 7. measurement jig of circuit board according to claim 5, it is characterised in that：Also set up in the under casing (1) There is heat abstractor (7).
- A kind of 8. measurement jig of circuit board according to claim 1, it is characterised in that：The bottom of the under casing (1) is set It is equipped with buphthalmos wheel (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410424762.4A CN104155563B (en) | 2014-08-26 | 2014-08-26 | A kind of measurement jig of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410424762.4A CN104155563B (en) | 2014-08-26 | 2014-08-26 | A kind of measurement jig of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104155563A CN104155563A (en) | 2014-11-19 |
| CN104155563B true CN104155563B (en) | 2018-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410424762.4A Active CN104155563B (en) | 2014-08-26 | 2014-08-26 | A kind of measurement jig of circuit board |
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