CN104134063B - Fingerprint recognition detection components and its electronic installation - Google Patents

Abstract

Present invention is disclosed a kind of fingerprint recognition detection components and its electronic installation, fingerprint recognition detection components include：Cover plate, has the first face and second face relative with first face, and the second face of the cover plate is provided with a groove；With fingerprint sensing module, in the groove of the cover plate, the fingerprint sensing module recognition detection operates in the fingerprint of the induction region corresponding to the fingerprint sensing module in the first face of the cover plate；Wherein, the fingerprint sensing module includes：Fingerprint detection element, positioned at the bottom of the groove of the cover plate；And fingerprint recognition chip, it is electrically connected with the fingerprint detection element, the fingerprint detection element is located between bottom and the fingerprint recognition chip of the groove of the cover plate.The groove for the cover plate that the present invention passes through accommodating fingerprint sensing module on the cover board, cover plate and the integral thickness of fingerprint sensing module are reduced, is advantageous to the slimming of the electronic installation such as portable terminal, the mobile phone for no entity HOME keys that are particularly suitable for use in.

Description

Fingerprint identification detection component and its electronic device

technical field

The invention relates to the field of fingerprint identification, in particular to a fingerprint identification detection component and an electronic device with the fingerprint identification detection component.

Background technique

With the wide application of portable terminals in people's daily life, the functions of the current portable terminals are becoming more and more powerful, and such diversified functions are convenient for users. However, while the portable terminal provides more convenience for the user, it carries too much private information. If the portable terminal is lost or stolen, the information is easily leaked because there is no relevant protection. cause inconvenience to users. Therefore, it is very necessary to do some security settings on the portable terminal. In addition, compared with keypad locks and passwords, it is more confidential and convenient to use fingerprint recognition to keep secret.

A portable terminal with a fingerprint recognition and detection component is shown in FIG. 1 . The portable terminal is a mobile phone 1 , and the fingerprint recognition and detection component is arranged in the S area of the mobile phone 1 . The structure of fingerprint identification and detection components is shown in Figure 2. The fingerprint identification and detection assembly includes a cover plate 11 , leads 12 , a fingerprint detection element 13 , a fingerprint identification chip 16 , a protective layer 17 and a printed circuit board 19 . The cover plate 11 has a first surface a and a second surface b corresponding to the first surface. The fingerprint detection element 13 is disposed on the first surface a of the cover plate. The protection layer 17 covers the fingerprint detection element 13 to protect the fingerprint detection element 13 . The fingerprint identification chip 16 is disposed on the second surface b of the cover plate 11 . The printed circuit board 19 is also disposed on the second surface b of the cover plate 11 . The fingerprint detection element 13 , the fingerprint identification chip 16 and the printed circuit board 19 are electrically connected by a wire 12 .

The thickness H of this portable terminal with fingerprint identification and detection components is increased compared with the thickness h of the original cover plate 11 , which is difficult to meet the thinning requirements of modern portable terminals.

In addition, for another portable terminal with a fingerprint identification and detection component, it arranges the fingerprint detection element and the fingerprint identification chip under the cover, so that the distance between the user's finger and the fingerprint detection element is relatively long, so that the fingerprint of the user's finger The final imaging effect is poor. The thickness of the portable terminal with the fingerprint recognition and detection component is also increased compared with the thickness of the original cover plate. Similarly, it is difficult to meet the thinning requirements of modern portable terminals.

Contents of the invention

The object of the present invention is to provide a fingerprint recognition detection component and an electronic device with the fingerprint recognition detection component, which is beneficial to improve the imaging effect of user fingerprints and realize thinning of electronic devices such as portable terminals.

According to one aspect of the present invention, there is provided a fingerprint identification and detection component, comprising: a cover plate having a first surface and a second surface opposite to the first surface, and a groove is provided on the second surface of the cover plate; and a fingerprint sensing module, located in the groove of the cover, the fingerprint sensing module recognizes and detects the fingerprint corresponding to the sensing area of the fingerprint sensing module operating on the first surface of the cover; wherein , the fingerprint sensor module includes: a fingerprint detection element, located at the bottom of the groove of the cover; and a fingerprint recognition chip, electrically connected to the fingerprint detection element, and the fingerprint detection element is located at the bottom of the cover plate between the bottom of the groove and the fingerprint recognition chip.

According to the above-mentioned fingerprint identification and detection assembly, the fingerprint sensing module further includes: a flexible circuit film, and the fingerprint detection element and the fingerprint identification chip are formed on the flexible circuit film.

According to the above-mentioned fingerprint identification detection component, the fingerprint identification chip is electrically connected to the flexible circuit film in a flip-chip manner.

According to the above-mentioned fingerprint recognition and detection assembly, it further includes: a support member, which is at least partially wrapped by the fingerprint sensing module.

According to the above-mentioned fingerprint identification detection assembly, the support member has a groove for accommodating the fingerprint identification chip.

According to the above-mentioned fingerprint identification and detection assembly, the support member is at least partially bonded to the flexible circuit film through an adhesive.

According to the above-mentioned fingerprint identification and detection component, the adhesive includes PSA glue and thermosetting glue.

According to the above-mentioned fingerprint identification detection assembly, it further includes a color layer, and the color layer is located between the fingerprint detection element and the bottom of the groove of the cover plate.

According to the above-mentioned fingerprint recognition and detection component, the color layer includes an ink layer.

According to the above fingerprint identification and detection assembly, it further includes a printed circuit board, and the printed circuit board is electrically connected to the fingerprint sensing module.

According to the above-mentioned fingerprint identification and detection assembly, the printed circuit board is located on the second surface of the cover plate and at least covers the opening end of the groove of the cover plate.

According to the above-mentioned fingerprint identification and detection assembly, it further includes encapsulation glue, and the encapsulation glue is at least filled between the fingerprint sensing module and the printed circuit board.

According to the above-mentioned fingerprint identification and detection assembly, the cover is a ceramic cover, a tempered glass cover, a tempered glass cover, a polycarbonate cover or a sapphire cover.

According to the above-mentioned fingerprint recognition and detection assembly, the thickness between the bottom of the groove of the cover plate and the first surface of the cover plate is 10 to 500 microns.

According to another aspect of the present invention, an electronic device with a fingerprint identification and detection function includes any one of the fingerprint identification and detection components described above.

According to the above-mentioned electronic device with fingerprint recognition and detection functions, the cover is a cover of a touch screen, and the fingerprint detection element is arranged in a non-display area of the touch screen.

The technical solution disclosed in the present invention can realize fingerprint identification on electronic devices such as portable terminals, and does not need to use physical buttons, but performs fingerprint identification on the cover of the non-display area such as the display screen, expanding the scope of fingerprint identification. practical application. Further, the overall thickness of the cover plate and the fingerprint sensing module is reduced through the groove for accommodating the fingerprint sensing module on the cover plate, which is beneficial to the thinning of electronic devices such as portable terminals. At the same time, the distance between the user's finger and the fingerprint detection element is reduced to improve the final imaging effect of the user's fingerprint. The invention is especially suitable for mobile phones and the like without a physical HOME key.

Description of drawings

The above and other features and advantages of the present invention will become more apparent by describing in detail example embodiments thereof with reference to the accompanying drawings.

Fig. 1 is a kind of electronic device with fingerprint identification detection function;

Fig. 2 is a sectional view of the S region in Fig. 1;

FIG. 3A is an electronic device with a fingerprint identification and detection function provided by the present invention;

3B is a cross-sectional view of the S region in FIG. 3A of the first embodiment of the present invention;

4 is a cross-sectional view of the S region in FIG. 3A of the second embodiment of the present invention;

5 is a cross-sectional view of the S region in FIG. 3A of the third embodiment of the present invention;

6 is a cross-sectional view of region S in FIG. 3A of a fourth embodiment of the present invention;

FIG. 7 is a cross-sectional view of region S in FIG. 3A of a fifth embodiment of the present invention; and

FIG. 8 is a schematic circuit diagram of a fingerprint detection element in an embodiment of the present invention.

Wherein, the reference signs are explained as follows:

1, 2 Portable terminal

S non-display area

200 fingerprint sensor module

201 support

202 adhesive

203 flexible circuit board

20 flex circuit film

11, 21 cover plate

a first side

b second side

c groove

c1 bottom

12 leads

13, 23 Fingerprint detection element

230 drive circuit

231 Sensing electrode

232 drive electrodes

235 detection gap

24 solder balls

25 color layers

16, 26 Fingerprint recognition chip

27 protective layer

28 Encapsulation glue

19, 29 printed circuit board

detailed description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals denote the same or similar structures in the drawings, and thus their repeated descriptions will be omitted.

The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the invention. However, those skilled in the art will appreciate that the technical solutions of the present invention may be practiced without one or more of the specific details, or with other methods, components, materials, and the like. In some instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring the invention.

The accompanying drawings of the present invention are only used to illustrate the relative positional relationship and electrical connection relationship. The layer thickness of some parts is drawn in an exaggerated way for easy understanding. The layer thickness in the drawings does not represent the proportional relationship of the actual layer thickness.

Example 1

Referring to FIG. 3A and FIG. 3B , the fingerprint identification and detection assembly according to the first embodiment of the present invention includes a cover plate 21 , a fingerprint sensing module and a printed circuit board 29 .

The cover plate 21 has a first surface a and a second surface b corresponding to the first surface. The second surface b is provided with a groove c. The cover plate 21 may be a cover plate made of strengthened glass, tempered glass, polycarbonate, polycarbonate, ceramic or sapphire. The cover plate 21 is preferably made of high-strength material to effectively protect the lower components. The fingerprint sensor module includes a fingerprint detection element 23 . The fingerprint detection element 23 is accommodated in the groove c of the cover plate 21 . The printed circuit board 29 is electrically connected to the fingerprint detection element 23 . The printed circuit board 29 is located on the second surface b of the cover plate 21 .

In this embodiment, the fingerprint sensor module includes a fingerprint detection element 23 and a fingerprint recognition chip. The fingerprint detection element 23 is accommodated in the groove c. The fingerprint identification chip can be integrated on the printed circuit board 29 or located on the lower side of the printed circuit board 29 .

Since the fingerprint detection element 23 is accommodated in the groove c of the cover plate 21, the fingerprint detection element 23 is closer to the touch surface of the cover plate 21, which reduces the distance between the user's finger and the fingerprint detection element 23, which is conducive to improving the user's comfort. The final imaging effect of the fingerprint.

Example 2

Referring to FIG. 3A and FIG. 4 , the fingerprint identification and detection assembly according to the second embodiment of the present invention includes a cover plate 21 , a fingerprint sensor module, a color layer 25 , an encapsulant 28 and a printed circuit board 29 .

Like the cover plate 21 of the first embodiment, the cover plate 21 has a first surface a and a second surface b corresponding to the first surface. The second surface b is provided with a groove c.

The color layer 25 is located at the bottom c1 of the groove c for color decoration. The color layer 25 includes an ink layer. The ink layer can be a black ink layer, a gray ink layer, a white ink layer or other color ink layers. In some embodiments, color layer 25 may include multiple layers of ink. For example, the color layer 25 includes a black ink layer and a white ink layer. For another example, the color layer 25 includes multiple ink layers with the same color. Specifically, the display effect of the cover can be improved by using the combination of different ink layers. For example, the combination of the black ink layer with through holes and the semi-permeable ink layer makes the projected light more uniform and softer, thereby making the display effect of the cover plate more uniform and soft.

The fingerprint sensor module includes a fingerprint detection element 23 and a fingerprint recognition chip 26 . Both the fingerprint detection element 23 and the fingerprint recognition chip 26 are accommodated in the groove c. The fingerprint detection element 23 is electrically connected to the fingerprint recognition chip 26 , for example, may be electrically connected through wires, solder balls or other means. The fingerprint detection element 23 and the fingerprint identification chip 26 are located in the groove c of the cover plate 21 . The fingerprint detection element 23 is located on the side of the color layer 25 away from the bottom c1 of the groove c, and the fingerprint recognition chip 26 is located on the side of the fingerprint detection element 23 away from the color layer 25, that is, the fingerprint detection element 23 is located between the color layer 25 and the fingerprint. Between identification chips 26. Therefore, since the fingerprint detection element 23 is accommodated in the groove c of the cover plate 21, the fingerprint detection element 23 is closer to the touch surface of the cover plate 21, which reduces the distance between the user's finger and the fingerprint detection element 23, which is beneficial to improve The final imaging effect of the user's fingerprint.

The fingerprint detection element 23 can detect fingerprints operated on the cover plate 21 by pressing, swiping, or active capacitive methods. Specifically, in order to enable the fingerprint detection element 23 to detect the fingerprint corresponding to the sensing area of the fingerprint detection element 23 operated on the first surface a of the cover plate 21, the bottom c1 of the groove c is in contact with the first surface a of the cover plate 21. a between 10 and 500 microns in thickness. In order to enable the fingerprint detection element 23 to more sensitively detect fingerprints operating on the cover 21 , the thickness between the bottom c1 of the groove c and the first surface a of the cover 21 is preferably 30 to 300 microns.

Through the electrical connection between the fingerprint detection element 23 and the fingerprint identification chip 26, the fingerprint detection element 23 transmits the detected data to the fingerprint identification chip 26 for processing. Specifically, the fingerprint detection element 23 detects the fingerprint ridges and fingerprint valleys to generate capacitance signal changes and transmits them to the fingerprint recognition chip 26 . The fingerprint identification chip 26 provides a fingerprint image through the change of the capacitance signal detected by the fingerprint detection element 23 . Further, the acquired fingerprint image is a grayscale image containing more noise. Therefore, it is also necessary to preprocess the fingerprint image to improve the quality of the fingerprint image, enhance the contrast of fingerprint ridges and fingerprint valleys, and turn it into a clear point-line map for feature extraction. The preprocessing of the fingerprint image includes normalization, image segmentation, enhancement, binarization and thinning, which will not be repeated here.

The printed circuit board 29 is located on the second surface b of the cover plate 21 and is electrically connected to the fingerprint sensing module. The printed circuit board 29 is electrically connected to the fingerprint sensing module to acquire the fingerprint identified by the fingerprint identification chip 26 and perform corresponding operations according to the acquired fingerprint. In this embodiment, both the fingerprint detection element 23 and the fingerprint identification chip 26 are accommodated in the groove c, so that the printed circuit board 29 can cover the opening of the groove c and seal the groove c. Further, in order to stabilize the devices in the groove c, at least an encapsulation glue can be filled between the fingerprint sensing module and the printed circuit board. The printed circuit board 29 is electrically connected to the fingerprint detection element 23 through a plurality of solder balls 24 . In a variation, the printed circuit board 29 is electrically connected to the fingerprint identification chip 26 through a plurality of solder balls 24 . In yet another variation, the printed circuit board 29 may be electrically connected to the fingerprint detection element 23 or the fingerprint identification chip 26 through wires.

Example 3

Referring to FIG. 5 , the fingerprint identification and detection assembly according to the third embodiment of the present invention includes a cover plate 21 , a fingerprint sensor module, a color layer 25 , an encapsulant 28 and a printed circuit board 29 . Its structure is substantially the same as that of the second embodiment, the only difference being that a flexible circuit board 203 is provided on the side of the printed circuit board 29 away from the fingerprint sensing module. The flexible circuit board 203 is preferably electrically connected to the printed circuit board 29 through solder paste. In this embodiment, the printed circuit board 29 conducts electricity on both sides.

Example 4

Referring to FIG. 6 , the fingerprint identification and detection assembly according to the fourth embodiment of the present invention includes: a cover plate 21 and a fingerprint sensing module 200 . The fingerprint sensing module 200 is accommodated in the groove c on the second surface b of the cover plate 21 . The fingerprint sensor module 200 includes: a flexible circuit film 20 and a fingerprint detection element 23 and a fingerprint identification chip 26 formed on the flexible circuit film 20 .

The flexible circuit film 20 may be, for example, a polyimide film (PI film), as shown in the figure, may be composed of two layers of polyimide resin (Polyimide resin, PI resin).

The fingerprint detection element 23 may be formed on the flexible circuit film 20 . At least one sensing element is included to sense the ridges and valleys of the user's finger to identify the user's fingerprint. The fingerprint detection element 23 can be a one-dimensional structure or a two-dimensional structure, and the present invention is not limited thereto.

The fingerprint detection element 23 in the present invention can be a wipe-type fingerprint detection element distributed in a strip shape, or a push-type fingerprint detection element distributed in an array, and the present invention is not limited thereto. In addition, the fingerprint detection element 23 may also work in combination or in combination with elements that perform optical sensing, infrared sensing, or other sensing of the user's fingerprint, which themselves may be coupled to the epidermis of the user's finger, subcutaneous of the user's finger part, or some other feature representing the user's fingerprint.

Referring again to FIG. 6 , the fingerprint recognition chip 26 is electrically connected to the flexible circuit film 20 by, for example, flip chip technology. The fingerprint identification chip 26 is facing down to the flexible circuit film 20 without wire bonding, and a certain number of metal balls (such as tin balls) are used to connect the fingerprint identification chip 26 to the flexible circuit film 20 electrically and mechanically. Using flip-chip technology, because it does not require wire bonding, it can form the shortest circuit and reduce resistance; in addition, by using metal ball connections, the package size is reduced and the electrical performance is improved.

The fingerprint identification chip 26 is electrically connected to the fingerprint detection element 23 through the flexible circuit film 20, so that the signal of the fingerprint detection element 23 is transmitted to the fingerprint identification chip 26 for processing.

In some embodiments, when the fingerprint sensing module 200 is attached to a bottom plate (not shown in the figure), for example, through pressure-sensitive adhesive bonding, a space can be dug out on the top surface of the bottom plate to form a The groove is for accommodating the fingerprint recognition chip 26 .

In addition, the fingerprint identification and detection assembly further includes: a flexible circuit board (not shown in the figure), and the fingerprint sensing module 200 is bonded to the flexible circuit board through the connection part (not shown in the figure) on the flexible circuit film 20 . The flexible circuit film 20 and the flexible circuit board are electrically connected by laminating ACF (Anisotropic Conductive Adhesive or Anisotropic Conductive Adhesive) on the connecting portion, and then bonding with the flexible circuit board.

The fingerprint identification and detection component is electrically connected to an external circuit (for example, a processing circuit of a smart phone or a tablet computer) through a flexible circuit board.

In addition, the flexible circuit board also includes at least one passive component, such as a resistor or a capacitor.

Example 5

FIG. 7 is a cross-sectional view of area S in FIG. 3A according to a fifth embodiment of the present invention. It should be noted that this figure is a cross-sectional exploded schematic diagram of the structure of the fingerprint recognition and detection component. In order to more clearly illustrate the structure of the fingerprint recognition and detection component, the components in the figure are not directly connected, and it cannot be used to limit the fingerprint of the present invention. Identify the connections between components of the detection component.

As shown in FIG. 7 , the fingerprint identification and detection assembly includes: a cover plate 21 , a fingerprint sensor module 200 , and a support member 201 . The fingerprint sensing module 200 and the supporting member 201 are accommodated in the groove c on the second surface b of the cover plate 21 . The fingerprint sensor module 200 includes: a flexible circuit film 20 and a fingerprint detection element 23 and a fingerprint identification chip 26 formed on the flexible circuit film 20 .

The descriptions of the flexible circuit film 20 , the fingerprint detection element 23 and the fingerprint identification chip 26 are the same as those of the flexible circuit film 20 and the fingerprint detection element 23 in the fourth embodiment, and will not be repeated here.

As shown in FIG. 7 , the support 201 is wrapped by the fingerprint sensing module 200 , and the fingerprint sensing module 200 wraps four sides of the support 201 . The fingerprint sensor module 200 can wrap the support member 201 in a closed manner, that is, there can be no gap between the two sides at the interface of the fingerprint sensor module 200, or it can wrap the support member 201 in an unclosed manner, that is, as shown in the figure, the fingerprint There is a gap between the two sides at the interface of the sensing module 200, and the present invention is not limited thereto.

The flexible circuit film 20 and the supporting member 201 are bonded at least partially through the adhesive 202 to fix the fingerprint sensing module 200 and the supporting member 201 . For example, as shown in the figure, the adhesive 202 can be used to join only on the horizontal plane, and the adhesive 202 can also be used to join on any surface where the support 201 is in contact with the fingerprint sensing module 200. limit. The adhesive 202 is, for example, pressure sensitive adhesive (PSA) or thermosetting adhesive.

In order to accommodate the fingerprint identification chip 26 , a part is dug out on one surface of the support member 201 to form a groove for accommodating the fingerprint identification chip 26 . In some embodiments, in order to avoid damage to the fingerprint identification chip 26 due to the user's finger pressing the fingerprint identification detection component, the height of the dug-out part on the support member 201 can be slightly higher than the fingerprint identification chip 26, so that when pressed, the fingerprint identification chip 26 can be supported. The piece 201 will not touch the fingerprint identification chip, thereby avoiding damage to the fingerprint identification chip 26.

The protection layer 27 is formed on at least a part of the fingerprint sensing module 200 and located on the fingerprint detection element 23 . The color layer 25 is coated on the fingerprint detection element 23 and located between the protective layer 27 and the flexible circuit film 20 .

Refer to FIG. 8 for a circuit implementation of the fingerprint detection element 23 in the above-mentioned first to fifth embodiments.

At least a part of the electrode wiring pattern in the fingerprint detection element 23 is constituted by a conductive mesh. The fingerprint detection element 23 includes a sensing electrode 231 and a plurality of driving electrodes 232 . A plurality of driving electrodes 232 are arranged side by side and spaced apart from each other, and the plurality of driving electrodes 232 are spaced apart from each other and opposite to the sensing electrodes 231 to form a plurality of detection gaps 235 . The driving electrodes 232 are substantially parallel to each other and connected to the driving circuit 230 . The sensing electrodes 231 are substantially arranged perpendicular to the driving electrodes 232 . Each driving electrode 232 is separated from the sensing electrode 231 by a detection gap 235 . Therefore, the fingerprint detection element 23 includes a detection gap 235 arranged linearly between each driving electrode 232 and sensing electrode 231 .

When the user moves or swipes a finger in a direction perpendicular to the sensing electrodes 231 (for example, sliding the finger along the H direction), the driving circuit 230 sequentially excites the driving electrodes 232 with a driving signal. When the fingerprint ridges and valleys of the fingerprint pass over the detection gap 235 , the driving signal applied to the driving electrode 232 is capacitively coupled to the sensing electrode 231 according to the capacitance of a single detection gap 235 . The capacitance varies according to the fingerprint ridges and fingerprint valleys across the detection gap 235 . The capacitively coupled driving signal is coupled to the sensing electrode 231 and detected by a sensing circuit to provide a row of fingerprint images. A complete fingerprint image can be formed by combining multiple pieces of fingerprint graphics.

Referring to the above-mentioned first to fifth embodiments, the present invention reduces the thickness of the entire fingerprint identification and detection assembly by accommodating the fingerprint sensing module in the groove c on the second surface b of the cover plate 21 . Moreover, in order to enable the fingerprint sensing module to detect the fingerprints operating on the first surface a of the cover plate 21 corresponding to the sensing area of the fingerprint detection element 23, the bottom of the groove c and the first surface a of the cover plate 21 are also placed between the bottom of the groove c and the first surface a of the cover plate 21. The thickness is controlled between 10 and 500 microns. In addition, the groove c also has the advantages of protecting the conductive material in the groove c from falling off due to external force, reducing the defective rate, and the like.

Continuing to refer to FIG. 3A to FIG. 7 , according to another aspect of the present invention, an electronic device (such as a mobile phone, ipad, etc. portable terminal or access control device) for fingerprint recognition and detection is provided, including the above-mentioned fingerprint recognition and detection component. The cover plate 21 is a cover plate of the touch display screen. The first surface a of the cover plate 21 is for users to operate. A groove c is formed on the second surface b of the cover plate 21 for accommodating the fingerprint detection element 23 and the fingerprint identification chip 26 . Specifically, the groove c is arranged in the non-display area of the touch screen for the fingerprint detection element 23 to detect the fingerprint operating on the non-display area of the touch screen. The signal of the fingerprint detection element 23 is transmitted to the fingerprint identification chip 26 through the electrical connection with the fingerprint identification chip 26 . The color layer 25 is printed between the fingerprint detection element 23 and the bottom of the groove c to cover the color of the fingerprint detection element 23 . A touch screen component (not shown in the figure) is disposed on the display area of the second surface b of the cover plate 21 . The electronic device may also include a rear cover to cover the back of the electronic device. The electronic device can carry out fingerprint identification on the transparent cover of the display screen, and the implementation principle is the same as before, so it will not be repeated here.

In summary, the fingerprint identification detection component and its electronic device of the present invention can realize fingerprint identification on electronic devices such as portable terminals, and do not need to use physical buttons, but perform fingerprint identification on a transparent cover such as a display screen , extending the practical application of fingerprint recognition. Further, the present invention reduces the overall thickness of the cover plate and the fingerprint sensing module by providing the groove on the cover plate for accommodating the fingerprint sensing module, which is beneficial to the thinning of electronic devices such as portable terminals. At the same time, the distance between the user's finger and the fingerprint detection element is reduced to improve the final imaging effect of the user's fingerprint. The invention is especially suitable for mobile phones and the like without a physical HOME key.

Exemplary embodiments of the present invention have been specifically shown and described above. It should be understood that the invention is not limited to the disclosed embodiments, but on the contrary, the invention is intended to cover various modifications and equivalents included within the scope of the appended claims.

Claims (12)

1. A fingerprint recognition detection assembly, characterized in that, comprising: a cover plate having a first surface and a second surface opposite to the first surface, the second surface of the cover plate is provided with a groove; The fingerprint sensing module is located in the groove of the cover plate and does not exceed the top surface of the groove. The fingerprint of the sensing area of the sensing module; Wherein, the fingerprint sensor module includes: a fingerprint detection element located at the bottom of the groove of the cover; and The fingerprint identification chip is located in the groove of the cover plate and is electrically connected with the fingerprint detection element, and the fingerprint detection element is located at the bottom of the groove of the cover plate and the between the fingerprint identification chips, A printed circuit board, the printed circuit board is electrically connected to the fingerprint sensor module, the printed circuit board is located on the second surface of the cover plate, covers and closes the opening end of the groove of the cover plate; a support, which is closed or not closed by the fingerprint sensor module, the fingerprint sensor module at least partially covers the groove opening of the support, and the support is located in the groove of the cover plate , the supporting member has a groove opening toward the second surface of the cover to accommodate the fingerprint recognition chip, the depth of the groove of the supporting member is greater than the height of the fingerprint recognition chip, and the fingerprint recognition There is a space between the top surface of the chip and the groove of the supporting member. 2. The fingerprint identification and detection assembly according to claim 1, wherein the fingerprint sensing module further comprises: a flexible circuit film, the fingerprint detection element and the fingerprint identification chip are formed on the flexible circuit film . 3. The fingerprint recognition detection component according to claim 2, wherein the fingerprint recognition chip is electrically connected to the flexible circuit film in a flip-chip manner. 4. The fingerprint identification and detection assembly according to claim 2, wherein the support member is at least partially attached to the flexible circuit film through an adhesive. 5. The fingerprint recognition detection assembly according to claim 4, wherein the adhesive comprises PSA glue and thermosetting glue. 6. The fingerprint identification detection component according to claim 1, further comprising a color layer, the color layer is located between the fingerprint detection element and the bottom of the groove of the cover plate. 7. The fingerprint identification and detection assembly according to claim 6, wherein the color layer comprises an ink layer. 8 . The fingerprint identification and detection component according to claim 1 , further comprising encapsulation glue, and the encapsulation glue is at least filled between the fingerprint sensing module and the printed circuit board. 9. The fingerprint identification and detection assembly according to claim 1, wherein the cover is a ceramic cover, a tempered glass cover, a tempered glass cover, a polycarbonate cover or a sapphire cover. 10 . The fingerprint identification and detection assembly according to claim 1 , wherein the thickness between the bottom of the groove of the cover and the first surface of the cover is 10 to 500 microns. 11 . 11. An electronic device with a fingerprint recognition and detection function, comprising the fingerprint recognition and detection component according to any one of claims 1 to 10. 12. The electronic device with fingerprint identification and detection function according to claim 11, characterized in that: the cover is a cover of a touch screen, and the fingerprint detection element is arranged in a non-display area of the touch screen .