CN104115044A - Connector and system - Google Patents
Connector and system Download PDFInfo
- Publication number
- CN104115044A CN104115044A CN201080042034.7A CN201080042034A CN104115044A CN 104115044 A CN104115044 A CN 104115044A CN 201080042034 A CN201080042034 A CN 201080042034A CN 104115044 A CN104115044 A CN 104115044A
- Authority
- CN
- China
- Prior art keywords
- connector
- optical element
- pcb
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 45
- 239000013307 optical fiber Substances 0.000 claims description 14
- 239000000835 fiber Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention relates to a connector for optically connecting an integrated circuit with an optical element to a printed circuit board with an optical element, comprising a housing at least one optical inlet and at least one optical outlet, wherein the optical inlet is connectable to the optical element of the integrated circuit and the outlet is connectable to the optical element of the printed circuit board, wherein the optical inlet is connected via at least one optical light guiding means through the housing to the optical outlet, and at least one diffractive element for guiding light from and/or to the optical light guiding means and a corresponding system.
Description
Technical field
The present invention relates to connector, for the integrated circuit with optical element is connected to the P.e.c. with optical element optically.
Background technology
Connector in data communication field comprises various dissimilar connectors.
Optical conenctor will be connected to other optical instrument or other fiber optic cables as laser diode, photodiode etc. such as optical fiber or optical element conventionally.
Electric power connector, particularly so-called connector is connected to basic printed circuit board (PCB) by the processor of computing machine, to guarantee and being electrically connected to of processor and printed circuit board (PCB).These connectors are disposed on printing panel surface, and are connected to the circuit of printed circuit board (PCB).Known electronic connector for the treatment of the specific type of device is suitable for the processor of for example so-called grid array (LGA) or ball grid array (BGA) type to be connected to printed circuit board (PCB).Yet these style connectors have the finite data rate capacities of maximum 40 gigabits per second.
In order to increase the bandwidth of electronic processors, need larger pin array.Yet for electronic processors, this causes more spaces and multipotency more, and next the temperature increase of electronic processors causes data communication reliability to reduce.
Therefore, need connector between processor and the printed circuit board (PCB) on basis, to realize data communication rates that strengthen and reliable, and do not increase the space of connector.
Summary of the invention
Therefore, the object of this invention is to provide a kind of connector, it has overcome above-mentioned shortcoming, and a kind of connector connecting for the treatment of the enhancing data rate between device and printed panel is namely provided especially.
Above-mentioned and other object reaching in the present invention is that significantly it points to a kind of connector for those skilled in the art, and for having the integrated circuit of optical element, particularly large-scale processor is connected to the printed circuit board (PCB) with optical element optically.
Described connector comprises at least one optics entrance and the outlet of at least one optics, wherein said optics entrance can be connected to the optical element of integrated circuit, and described outlet can be connected to the optical element of printed circuit board (PCB), wherein said optics entrance is connected to optics outlet via at least one light guide, and at least one for from and/or to light guide guiding diffraction of light element.
Such connector has advantage: described connector is realized the exchanges data speed increasing, particularly between CPU (central processing unit) and the printed circuit board (PCB) on basis.According to another advantage of the connector of claim 1, be: its can by easily and cost effectively manufacture.This connector is realized the exchanges data speed that for example reaches 50TWords per second, and this exchanges data speed depends on the available light frequency amount of the data transmission between integrated circuit and printed circuit board (PCB).
Certainly, processor and/or printed circuit board (PCB) can comprise for each optical element being connected to the device of the electronic circuit of processor and/or printed circuit board (PCB).
According to another preferred embodiment of the invention, diffraction element is arranged near the exit portion of light path.This makes the manufacture of diffraction element easier.
According to another preferred embodiment, diffraction element is diffraction lens or prism.This lens or prism can advantageously be manufactured more easily and be arranged in connector.In addition, can easily implement the maintenance of diffraction element and/or clean.
According to another advantageous embodiment of the present invention, the light guide that is connected to diffraction element is extending to entrance from diffraction element in the radial direction.The layout of this light guide is enhanced the coupling from light guide to diffraction element, and further a plurality of light guides is connected to single diffraction element, thereby light is for example coupled to an only outlet from different entrances.This has strengthened the dirigibility of connector.
According to another preferred embodiment of the invention, light guide forms to be provided for reception and radiative two passages like this.This realizes bidirectional information or exchanges data, and has further increased the data volume that at every turn can transmit between processor and printed circuit board (PCB).In addition, light guide and/or optical element can be sensitive for different wavelength, to provide and to transmit and receive simultaneously.
According to another advantageous embodiment of the present invention, this connector comprises shell, and it is that insulating material is made, particularly polymkeric substance and/or pottery.This has reduced the short-circuit risks between the processor of integrated circuit-particularly and the conductor of printed circuit board (PCB).
In order to reduce, manufacture the cost of connector and in order more easily to manufacture, advantageously, described light guide is optical fiber.
According to another advantageous embodiment of the present invention, diffraction element is removable in connector.For example, if moving up and down of diffraction element is provided, diffraction element can be used like this, in receiving cable, does not transmit, but transmits in transmission channel.This allows the higher manufacturing tolerance of light guide, because can overcome by movement the counter productive of manufacturing tolerance.For example, the light guide with the optical fiber form of special diameter may change the about 10% of its diameter due to manufacture, and does not lose the reliable optical coupled between diffraction element and light guide.For example, the movement of diffraction element can provide by piezo-electric device, and described piezo-electric device is correspondingly arranged in connector.
According to a second aspect of the invention, a kind of system is provided, described system comprise at least one there is the integrated circuit of at least one optical element, according to the connector of claim 1-9 any one, there is the printed circuit board (PCB) of at least one optical element, wherein said connector by the optical element optical of the optical element of printed circuit board (PCB) and integrated circuit be connected.
According to another advantageous embodiment of system of the present invention, described system further comprises the fiber optic cables of optical element and the light source, particularly laser diode that are connected to printed circuit board (PCB).This realizes in optical system cost effective and easy information and/or exchanges data.
Accompanying drawing explanation
Feature of the present invention and element characteristic of the present invention can be further appreciated by reference to the accompanying drawings.These figure are the object for illustrating just.The present invention itself can be able to reference to the detailed description providing below in conjunction with accompanying drawing best understanding, wherein,
Fig. 1 is according to the schematic diagram of previously known connector;
Fig. 2 is the schematic diagram according to the preferred embodiment of the invention with the system of connector.
Embodiment
Figure 1 illustrates the schematic diagram for the system of the known connector in this area.Fig. 1 shows basic printed circuit board (PCB) 1, and it has for the contact 1a of corresponding contact (contact) that is placed on the ball grid array 2a of the connector 2 on printed circuit board (PCB) 1.Described connector 2 is coupled to the CPU (central processing unit) 3 of (die) 3 ' that have kernel.For the heat radiation of kernel 3 ', on the kernel 3 ' of CPU (central processing unit), arrange heating radiator 4.
Fig. 2 shows the schematic diagram of the system according to the preferred embodiment of the invention with connector.Described printed circuit board (PCB) 1 comprises optical element 1 ', and the joints of optical fibre 7 of optical fiber F are coupled to optical element 1 '.Described optical fiber F itself is connected to light source Q, as laser diode etc., for photophase ground data transmission.The optical element 1 ' of printed circuit board (PCB) 1 is coupled to the diffraction element D of the connector 2 that comprises shell 2a.From the diffraction element D of diffraction lens form, radially extend, optical fiber 5a, 5b, 5c are provided, optical fiber 5a, 5b, 5c extend in the direction to CPU (central processing unit) 3 in the radial direction from the curved surface of lens D.CPU (central processing unit) 3 comprises optical element 6a, 6b, 6c, and it is coupled to corresponding optical fiber 5a, 5b, 5c.
Be coupled to the kernel 3 ' thermal conductance of CPU (central processing unit) 3 heating radiator 4 on kernel 3 '.
The joints of optical fibre 7 are for being coupled to optical fiber F reliably the optical element 1 ' of printed circuit board (PCB) 1.The light guide of optical fiber 5a, 5b, 5c form is manufactured by the change of the pressure and temperature of for example polymkeric substance.Another selection by fiber arrangement in connector 2 is by fiber arrangement is filled up to hollow shell in hollow shell and with pottery.
Connector 2 can be coupled to printed circuit board (PCB) 1, for example, by gluing or by screw, connector 2 is attached to printed circuit board (PCB) 1 movably and reliably.
The light guide of optical fiber 5a, 5b, 5c form also can be divided into only for receiving and radiative light guide.Although described especially the present invention in conjunction with certain preferred embodiment, clearly, according to description above, many replacements, modification and change it will be apparent to those skilled in the art that.Therefore expect that claims will comprise such replacement, modification and change dropping among true scope of the present invention and spirit arbitrarily.
Claims (12)
1. a connector (2), for thering is the integrated circuit (3) of optical element (6a, 6b, 6c), particularly large-scale processor is connected to the printed circuit board (PCB) (1) with optical element (1 ') optically, and it comprises at least one optics entrance (I
1, I
2, I
3) and at least one optics outlet (O
1), wherein said optics entrance (I
1, I
2, I
3) can be connected to the optical element (6a, 6b, 6c) of integrated circuit (3) and described outlet (O
1) can be connected to the optical element (1 ') of printed circuit board (PCB) (1),
Wherein said optics entrance (I
1, I
2, I
3) via at least one light guide (5a, 5b, 5c), be connected to optics outlet (O
1), and
At least one for from and/or to light guide (5a, 5b, 5c) guiding diffraction of light element (D).
2. according to the connector of claim 1, wherein said diffraction element (D) is arranged in the outlet (O of light path
1) near part.
3. according to the connector of claim 1-2 any one, wherein said diffraction element (D) is diffraction lens or prism.
4. according to the connector of claim 1-3 any one, the light guide (5a, 5b, 5c) that is wherein connected to diffraction element (D) is extending to entrance (I from diffraction element (D) in the radial direction
1, I
2, I
3).
5. according to the connector of claim 1-4 any one, wherein said light guide (5a, 5b, 5c) forms to be provided for reception and radiative two passages like this.
6. according to the connector of claim 1-5 any one, wherein said connector (2) comprises shell (2a), and it is that insulating material is made, particularly polymkeric substance and/or pottery.
7. according to the connector of claim 1-6 any one, wherein said light guide (5a, 5b, 5c) is optical fiber.
8. according to the connector of claim 1-7 any one, wherein said diffraction element (D) is removable in connector, particularly removable in the surperficial direction perpendicular to described printed circuit board (PCB).
9. according to the connector of claim 1-8 any one, the diameter that wherein said connector (2) is less than light guide (5a, 5b, 5c) in a side and the distance between a side of integrated circuit (3) of printed circuit board (PCB) (1).
10. a system, comprise at least one there is the large-scale processor of the integrated circuit (3) of at least one optical element (6a, 6b, 6c)-particularly, according to the connector of claim 1-9 any one (2), there is the printed circuit board (PCB) (1) of at least one optical element (1 '), wherein said connector (2) is connected the optical element (1 ') of printed circuit board (PCB) (1) with optical element (6a, 6b, the 6c) optics of integrated circuit (3).
11. according to the system of claim 10, further comprises and is connected to the fiber optic cables of laser diode (F) of the optical element (1 ') of printed circuit board (PCB) (1) and light source (Q)-particularly.
Use, particularly lens or the prism of 12. 1 kinds of diffraction elements (D), for from or to outlet (O
1) at least one light guide (5a, 5b, 5c) guiding light, a plurality of light guides (5a, 5b, 5c) in connector (2) particularly, described connector is for being connected to optically printed circuit board (PCB) (1) by the integrated circuit (3) with optical element (6a, 6b, 6c).
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09170613 | 2009-09-17 | ||
| EP09170609 | 2009-09-17 | ||
| EP09170596 | 2009-09-17 | ||
| PCT/EP2010/063655 WO2011033043A2 (en) | 2009-09-17 | 2010-09-16 | Connector and system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104115044A true CN104115044A (en) | 2014-10-22 |
Family
ID=43759094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080042034.7A Pending CN104115044A (en) | 2009-09-17 | 2010-09-16 | Connector and system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104115044A (en) |
| WO (1) | WO2011033043A2 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002048763A1 (en) * | 2000-12-13 | 2002-06-20 | Teraconnect, Inc. | A packaging system for two-dimensional optoelectronic arrays |
| US6736552B2 (en) * | 2001-07-03 | 2004-05-18 | Intel Corporation | Optically interconnecting integrated circuit chips |
| JP3553403B2 (en) * | 1998-12-03 | 2004-08-11 | 日本電信電話株式会社 | High-speed signal processor |
| CN1610852A (en) * | 2001-09-12 | 2005-04-27 | 英特尔公司 | Optical/electrical interconnects and package for high speed signaling |
| CN1993639A (en) * | 2004-09-29 | 2007-07-04 | 日立化成工业株式会社 | Photoelectric integrated circuit element and transmission apparatus using the same |
| CN101180562A (en) * | 2004-12-07 | 2008-05-14 | 里夫莱克斯光子公司 | Optically enabled hybrid semiconductor package |
-
2010
- 2010-09-16 WO PCT/EP2010/063655 patent/WO2011033043A2/en active Application Filing
- 2010-09-16 CN CN201080042034.7A patent/CN104115044A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3553403B2 (en) * | 1998-12-03 | 2004-08-11 | 日本電信電話株式会社 | High-speed signal processor |
| WO2002048763A1 (en) * | 2000-12-13 | 2002-06-20 | Teraconnect, Inc. | A packaging system for two-dimensional optoelectronic arrays |
| US6736552B2 (en) * | 2001-07-03 | 2004-05-18 | Intel Corporation | Optically interconnecting integrated circuit chips |
| CN1610852A (en) * | 2001-09-12 | 2005-04-27 | 英特尔公司 | Optical/electrical interconnects and package for high speed signaling |
| CN1993639A (en) * | 2004-09-29 | 2007-07-04 | 日立化成工业株式会社 | Photoelectric integrated circuit element and transmission apparatus using the same |
| CN101180562A (en) * | 2004-12-07 | 2008-05-14 | 里夫莱克斯光子公司 | Optically enabled hybrid semiconductor package |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011033043A2 (en) | 2011-03-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141022 |