CN104114990B - Pressure sensor module - Google Patents
Pressure sensor module Download PDFInfo
- Publication number
- CN104114990B CN104114990B CN201380009546.7A CN201380009546A CN104114990B CN 104114990 B CN104114990 B CN 104114990B CN 201380009546 A CN201380009546 A CN 201380009546A CN 104114990 B CN104114990 B CN 104114990B
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- pressure
- wall portion
- upper wall
- atmospheric pressure
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- 230000008676 import Effects 0.000 claims abstract description 40
- 238000009434 installation Methods 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The present invention provides a kind of pressure sensor module that can positively imported to by atmospheric pressure in reference pressure chamber.Upper wall portions (11) in pressure sensor module (1) forms atmospheric pressure and imports path (27,29), and atmospheric pressure imports path (27,29) and is made up of the through hole (27a, 29a) in the through upper wall portions in the direction (11) left from the diapire component (15) as the 1st wall portion and groove portion (27b, 29b).Through hole (27a, 29a), make one end at the outside wall surface opening of the 2nd upper wall portion (11b) of upper wall portions (11), make the other end at the internal face opening of the 1st upper wall portion (11a) of upper wall portions (11), connect with reference pressure chamber (S2).Groove portion (27b, 29b) extends along the outside wall surface of the 2nd upper wall portion (11b), at this outside wall surface and the lateral opening of the 2nd upper wall portion (11b), and connects with the end of through hole (27a, 29a).
Description
Technical field
The present invention relates to pressure sensor module.
Background technology
As the pressure sensor module that the pressure measuring object is detected, it is known that to the air as reference pressure
Pressure carries out the pressure sensor module of the differential pressure type detected with the pressure differential measuring object pressure.At Japanese Unexamined Patent Publication 2000-81356
In Fig. 5 of number publication (patent documentation 1), disclosing a kind of existing pressure sensor module, this pressure sensor module is arranged
The mensuration pressure importing road becoming to make to have imported the pressure measuring object and the atmospheric pressure having imported atmospheric pressure import road and pass from pressure
The shell of sensor module extends to same direction.
In the existing pressure sensor module of Fig. 5 of patent documentation 1, import road and atmospheric pressure importing measuring pressure
Integrally provided with cylinder in the wall portion of the shell that road is through, this cylinder embeds 1 pipe, and this 1 pipe possesses and measures pressure importing
The prolongation stream that road is connected.Atmospheric pressure imports the road outside wall surface opening in the wall portion of shell.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2000-81356 publication (Fig. 5)
Summary of the invention
Invent problem to be solved
In the pressure sensor module of patent documentation 1, produce following problem, i.e. if water droplet, rubbish etc. are attached to air
Pressure imports the open end on road, then hinder the importing of atmospheric pressure because of water droplet, the rubbish of attachment, it is impossible to correctly to measuring object
Pressure be measured.
It addition, in this construction, in order to make all densifications, shorten and measure between pressure importing road and atmospheric pressure importing road
Distance.But, in the case of pipe or O being arranged on the cylinder being arranged at mensuration pressure importing road, can produce such as
Lower problem, i.e. if beyond filling in pipe or O necessarily, pipe or the end extended of O, the atmospheric pressure that will abut against imports
The end blocking on road, then make measurement accuracy be deteriorated.
It is an object of the invention to provide a kind of pressure transducer that positively can import atmospheric pressure to reference pressure chamber
Module.
In order to solve the means of problem
The object that the present invention is improvement with pressure sensor module, this pressure sensor module possesses housing and pressure sensitive portion；
This housing possesses the reference pressure chamber importing atmospheric pressure and the mensuration object pressure importing room importing mensuration object pressure；This is pressure-sensitive
Portion is arranged in housing in the way of importing between room in reference pressure chamber and mensuration object pressure, right with mensuration to atmospheric pressure
As the pressure differential of pressure detects.Housing possess with installation circuit board the 1st wall portion in opposite directions and the 1st wall portion in opposite directions the 2nd
Wall portion and the surrounding wall portion between the 1st wall portion and the 2nd wall portion.Formed right for mensuration object pressure importing mensuration in the 2nd wall portion
Import the atmospheric pressure of path and atmospheric pressure is imported reference pressure chamber more than 1 lead as pressure imports the object pressure that measures of room
Enter path.Housing has air will not import the gas being partially into reference pressure chamber beyond path from the atmospheric pressure of more than 1
Close structure.The most in the present invention, atmospheric pressure imports path by passing through in the through 2nd wall portion, direction left from the 1st wall portion
Through hole and the outside wall surface along the 2nd wall portion extend, at outside wall surface opening, and the groove of more than 1 connected with the end of through hole
Portion is constituted.If so constituted, even if then water droplet, rubbish are attached to the end of outside wall surface side that atmospheric pressure imports the through hole of path
Portion, the water droplet of attachment also is able to move along the groove portion of the outside wall surface being formed at the 2nd wall portion, even if it addition, the feelings adhered at rubbish
Under condition, it is possible to import pass by this groove portion to atmospheric pressure and lead air.Therefore, even if water droplet, rubbish are attached to atmospheric pressure and import
The end of the outside wall surface side of the through hole of path, produces atmospheric pressure importing path and is become not by the water droplet adhered to, rubbish blocking
Can be by air introduction reference pressure chamber, the probability also step-down of the problem that the accuracy of detection of pressure transducer deteriorates.
In concrete pressure sensor module, in the 2nd wall portion integrally provided with possessing the cylinder extending path in inside,
This prolongation path will measure object pressure and import extended passage.Measure object guiding pipe or O is entrenched in outside this cylinder
Side.In such pressure sensor module, when making mensuration object guiding pipe or O chimeric with cylinder, sometimes measure
Object guiding pipe or O be exceeded and fill in the 2nd wall portion necessarily, measure object guidings manage or O end from
Cylinder extends when observing laterally, and the end and the groove portion that are arranged at the through hole in the 2nd wall portion are managed or O shape by measuring object guiding
Ring covers.Therefore, preferably at least one party at cylinder and the 2nd wall portion is integrally provided the prevention mensuration object chimeric with cylinder and draws
Lead and use pipe or O to the retainer of the 2nd wall portion side shifting.Object guiding use is measured if it does, then limited by retainer
Manage or O is to the 2nd wall portion side shifting, so, the end of mensuration object guiding pipe or O are not over retainer.Cause
This, it is possible to prevent the end of through hole imported by atmospheric pressure and groove portion to be managed or O covering and quilt by measuring object guidings
Blocking, positively can import mensuration object pressure importing room by measuring object pressure.
According to the structure of pressure sensor module, sometimes measure object guiding pipe or O exceedes retainer, to the 2nd
Wall portion side shifting.Therefore, the end of the through hole of the atmospheric pressure importing path of more than 1 and the groove portion of more than 1, when from cylinder
Position in the outer part compared with retainer it is preferably located at during observation.If so constituted, even if then measuring object guiding pipe or O
Shape ring exceedes retainer to the 2nd wall portion side shifting, and the end of through hole and groove portion also will not be managed or O shape by measuring object guidings
Ring covers and blocked, so, more reliably can import to measure object pressure import measuring object pressure in room.
Groove portion is preferably at surrounding wall portion opening.If groove portion is at surrounding wall portion opening, even if then the outside wall surface in the 2nd wall portion is by measuring
Object guiding pipe or O integrally block, it is possible to positively imported by atmospheric pressure.
Above-mentioned pressure sensor module also can be arranged on installation circuit board, as by dielectric resin material by the present invention
The integrated circuit moulding installation circuit board is held.
Accompanying drawing explanation
Fig. 1 (A) is the top view of pressure sensor module of embodiments of the present invention, front view respectively to (D), looks up
Figure and right view.
Fig. 2 is the sectional view having cut off pressure sensor module with the II-II line of Fig. 1 (A), this pressure sensor module quilt
It is installed on installation circuit board, and is covered a part by waterproof resin together with installation circuit board.
Fig. 3 is to have cut off via O embedding at the mensuration object unloading part of determined equipment with the III-III line of Fig. 1 (A)
Close the sectional view of the pressure sensor module of Fig. 2 of cylinder.
Fig. 4 (A) is the top view of the pressure sensor module 101 of another embodiment of the present invention, and (B) is Fig. 4 (A)
V-V line sectional view.
Fig. 5 is the side view in partial cross-section of the pressure sensor module being mounted with pressure ingress pipe.
Detailed description of the invention
Hereinafter, an example of embodiments of the present invention is described in detail with reference to accompanying drawings.Fig. 1 (A) to Fig. 1 (D) is this respectively
The top view of pressure sensor module 1, front view, upward view and the right view of the embodiment of invention.Fig. 2 is to be installed in peace
Dress circuit board SB, and the pressure of the present embodiment of a part is covered together with installation circuit board by waterproof resin
The sectional view (pressure sensor module 1, the II-II line sectional view as Fig. 1 (A) represents) of sensor assembly 1.Present embodiment
Pressure sensor module 1 there is following structure, i.e. even if in order to improve water resistance, be installed in installation circuit board
SB (Fig. 2) is covered a part by waterproof insulating resin IR (Fig. 2) afterwards together with installation circuit board SB (Fig. 2), also can enter
The mensuration of row pressure.The conduct of the inside that pressure sensor module 1 possesses sensor housing 3, be arranged on sensor housing 3 is pressure-sensitive
The semiconductor pressure sensor element 5 in portion, cylinder 7,8 butt 9 and the not shown signal being connected with several of these terminals 9
The IC chip processed.It addition, in FIG, the state on the way having cut off terminal 9 is represented.Sensor housing 3 possesses in bottom surface
Side has the housing body 10 of peristome.Housing body 10 is made up of upper wall portions 11, surrounding wall portion 13 and diapire component 15.Upper wall portions
11 integrally provided with cylinder 7.One end of surrounding wall portion 13 is integrally provided with the peripheral part of upper wall portions 11, leaves to from upper wall portions 11
Direction extend.Diapire component 15, it is the most chimeric with the peristome surrounded by the other end of surrounding wall portion 13.This embodiment party
In formula, upper wall portions 11 constitutes the 2nd wall portion, and diapire component 15 constitutes the 1st wall portion.It addition, in Fig. 1 (C), in order to represent internal structure
Make, with the state representation that the diapire component 15 of sensor housing 3 is removed.
Upper wall portions 11 is made up of the 1st upper wall portion 11a, the 2nd upper wall portion 11b and the 3rd upper wall portion 11c.1st upper wall portions
The profile of point 11a is substantially quadrangle form.2nd upper wall portion 11b, it is integrally provided in the 1st upper wall portion 11a,
Contour shape is little compared with the 1st upper wall portion 11a, and profile is substantially quadrangle form.3rd upper wall portion 11c, it is by integratedly
Being arranged in the 2nd upper wall portion 11b, profile is round-shaped.Above-mentioned cylinder 7, it is integrally provided on the 3rd upper wall portion
On 11c.Contact path 17a and cylindrical space 17b is formed in the 3rd upper wall portion 11c.Contact path 17a, its with by cylinder
The prolongation path 7a connection of the inside of body 7, path 7a phase diameter group is little with extending.Cylindrical space 17b, its with contact path
17a connects, and path 17a phase diameter group is big with contacting.And, form square column in the 2nd upper wall portion 11b and the 1st upper wall portion 11a
Shape space 17c, the party cylindrical space 17c connect with cylindrical space 17b, and the profile of shape of cross section is tetragon, on the 1st
Wall part 11a forms the thin and planar space 17d, this space 17d of thickness and connects with flat column space 17c, the most universally with
Diapire component 15 is in opposite directions.On the internal face 17e of the 3rd upper wall portion 11c of the part surrounding flat column space 17c, engage
There is the supporting station 6 carrying out supporting for double conductor pressure sensor component 5.This supporting station 6 is by carrying out semiconductor substrate
Processing is formed.Supporting station 6 is formed the through hole 6A connected with cylindrical space 17b.It addition, in the present embodiment,
Constituted mensuration object pressure by contact path 17a and cylindrical space 17b and import room S1, by flat column space 17c and smooth
Space 17d constitutes reference pressure chamber S2.
Semiconductor pressure sensor element 5, is formed for substrate with Si semiconductor substrate, and possesses diaphragm portion 5a and barrier film props up
Bearing portion 5b.On diaphragm portion 5a, the resistance bridge circuit that is made up of not shown resistive element and constituted resistance by resistive element
Circuit is formed at surface.It is formed with the surface of this resistance bridge circuit etc., waterproof insulating resin IR covers.It addition, it is electric
The detailed structure of resistance circuit, owing to the main points with the present invention are unrelated, so omitting the description.Diaphragm support portion 5b and supporting station 6
Engage airtightly.Therefore, in the present embodiment, the fluid measuring object will not contact with the face forming diffusion resistance.
Surrounding wall portion 13 has 2 inner peripheral portion 13a in opposite directions and 13b and these inner peripheral portion 13a of connection and 13b in opposite directions
2 inner peripheral portion 13c of end and 13d.4 inner peripheral portion 13a to 13d are configured to the profile of surrounding wall portion substantially in four limits
Shape.In surrounding wall portion 13, in the end of the opposition side of side residing for upper wall portions 11 formed the 1st to the 3rd annular stepped portion 19～
23.Diapire component 15 is chimeric with the 1st annular stepped portion 19 in liquid-tight manner, so that the peristome 13e blocking of surrounding wall portion 13.If by pressure
Sensor assembly 1 is arranged in installation circuit board SB (Fig. 2), then diapire component 15 is with installation with circuit board in opposite directions.Described later
Atmospheric pressure imports the end of path from the 2nd annular stepped portion 21 opening.In the 3rd annular stepped portion 23, expose the one of 8 butt 9
The end 9a of side.
8 butt 9, are fixed in surrounding wall portion 13 by insert molding.The end 9a of one side of 8 butt 9, at sensor
Exposing in 3rd annular stepped portion 23 of housing 3, a part is by not shown closing line and semiconductor pressure sensor element 5
Electrical resistance ground, electrode portion connects.In the present embodiment, 8 butt 9 highlight from 2 inner peripheral portion 13a in opposite directions and 13b.
Upper wall portions 11 is also formed 2 atmospheric pressure and imports path 27,29.Atmospheric pressure imports path 27,29 by from work
It is that through hole 27a, 29a and groove portion 27b, 29b of the through upper wall portions in direction 11 that the diapire component 15 in the 1st wall portion leaves is constituted.
One end of through hole 27a, 29a, at the outside wall surface opening of the 2nd upper wall portion 11b of upper wall portions 11.Through hole 27a, 29a's is another
One end, at the internal face opening of the 1st upper wall portion 11a of upper wall portions 11, connects with reference pressure chamber S2.27b, 29b edge, groove portion
The outside wall surface of the 2nd upper wall portion 11b extends, at this outside wall surface and the lateral opening of the 2nd upper wall portion 11b, and and through hole
The end connection of 27a, 29a.According to present embodiment, even if water droplet is attached to the end of through hole 27a, 29a, because water droplet energy
Enough move along groove portion 27b, 29b, so, atmospheric pressure import path because of the most blocked probability of water droplet also can step-down, should
Through hole 27a, 29a are at the outside wall surface opening of the 2nd upper wall portion 11b of upper wall portions 11.Even if it addition, rubbish is attached to through hole
The end of 27a, 29a, because air is directed to through hole 27a, 29a along groove portion 27b, 29b, so, atmospheric pressure imports path
The probability fully blocked also can step-down.It addition, sensor housing has air tight construction, to avoid atmospheric pressure by from air
Pressure imports the inside importing to sensor housing 3 beyond path 27,29.
According to above structure, by the path 7a of cylinder 7 and the contact of the 3rd upper wall portion 11c of through upper wall portions 11
Path 17a and cylindrical space 17b, imports to the rear side of the diaphragm portion 5a of semiconductor pressure sensor element 5 and measures object
Pressure.And, the face side being imported the path 27, the 29 diaphragm portion 5a to semiconductor pressure sensor element 5 by atmospheric pressure is led
Entering atmospheric pressure, diaphragm portion 5a bends accordingly with the pressure differential of the amount of pressure with atmospheric pressure that measure object pressure.Its result, from half
The signal that conductor pressure sensor component 5 output is corresponding with pressure differential.
Fig. 3 is to represent the cylinder 7 of the pressure sensor module 1 of present embodiment via O 33 with determined
Equipment measure the state that object unloading part 31 is chimeric, along the III-III line of Fig. 1 (A) by the pressure sensing shown in Fig. 1 and Fig. 2
Device module 1 is formed as the sectional view that section is indicated.It addition, in figure 3, in order to easy to understand, the survey of cylinder 7 will be installed on
Determine object unloading part 31 and O 33 is formed as section and is indicated, omit the diagram of terminal 9.In the present embodiment, cylinder
The outside of the 3rd upper wall portion 11c of 7 prominent upper wall portions 11 constitutes retainer.Therefore, O 33 is in the 3rd with upper wall portions 11
Under the state that upper wall portion 11c abuts, it is clamped between the inner wall part measuring object unloading part 31 of determined equipment.
Fig. 4 (A) is the top view of the pressure sensor module 101 of another embodiment of the present invention, and Fig. 4 (B) is Fig. 4
(A) line B-B sectional view.Fig. 5 is the side view in partial cross-section of the pressure sensor module 101 being mounted with pressure ingress pipe 131.
In Figure 5, in order to easy to understand, represent pressure ingress pipe 131 with section.It addition, in Fig. 4 and Fig. 5, to at Fig. 1 to Fig. 3
The component that the embodiment of middle expression is same, mark by the reference of mark in Fig. 1 to Fig. 3 with 100 several be added after obtain
The reference of the number obtained, omits detailed description.As it is shown in figure 5, in the present embodiment, because being arranged on cylinder 107
As measure object guiding pipe pressure ingress pipe 131 formed by elastomeric material, so, it is ensured that pressure ingress pipe 131
Air-tightness with cylinder 107.In the present embodiment, the profile of upper wall portions 111 is by the 1st upper wall portion 111a, the 2nd upper wall portion
111b and the 3rd upper wall portion 111c are constituted.1st upper wall portion 111a is general square shape shape.2nd upper wall portion 111b is by one
Be arranged in the 1st upper wall portion 111a, be formed at the region of the substantially half of the 1st upper wall portion 111a, be positioned at cylinder 107
Downside.3rd upper wall portion 111c is integrally provided in the 2nd upper wall portion 111b, along the substantially half of the base portion of cylinder 107
Region extend.In the present embodiment, shape in the way of through whole 1st upper wall portion 111a to the 3rd upper wall portion 111c
Become through hole 127a and 129a, through hole 127a and 129a to constitute atmospheric pressure and import a part for path 127 and 129, groove portion
127b and 129b is formed at the 3rd upper wall portion 111c.
And, in the 2nd upper wall portion 111b and the 3rd upper wall portion 111c, form 4 extended along cylinder 107
The retainer 107b of individual square column shape.Therefore, when pressure ingress pipe 131 is arranged on cylinder 107, it is possible to pressure ingress pipe
The front end of 131 arrives and suppresses in the 3rd upper wall portion 111c.It addition, as in the present embodiment, logical atmospheric pressure is imported
Road 127 and 129 be formed at cylinder 107 close proximity in the case of, when pressure ingress pipe 131 is installed on cylinder 107,
Even if by mistake with energetically beyond being filled in by pressure ingress pipe 131 necessarily, the front end of pressure ingress pipe 131 is crossed retainer 107b and is arrived
Reaching the 3rd upper wall portion 111c, pressure ingress pipe 131 covers opening of through hole 127a, 129a of atmospheric pressure importing path 127,129
Mouth end, because groove portion 127b, 129b exist, so, it is also possible to by groove portion 127b, 129b by air introduction to reference pressure
Indoor.
In the above-described embodiment, although pressure-sensitive as what atmospheric pressure and the pressure differential measuring object pressure were detected
Portion employs semiconductor pressure sensor element, but also can be by the pressure sensor component beyond semiconductor pressure sensor element
As pressure sensitive portion.
Probability is utilized in industry
According to the present invention, atmospheric pressure import path by the through hole in through 2nd wall portion, the direction left from the 1st wall portion and
Along the 2nd wall portion outside wall surface extend more than 1 at outside wall surface opening and connect with the end of through hole groove portion composition,
So, even if water droplet is attached to the end of the outside wall surface side of the through hole of atmospheric pressure importing path, the water droplet of attachment also is able to edge
The groove portion of the outside wall surface being formed at the 2nd wall portion moves.Therefore, even if being attached to the outside wall surface side that atmospheric pressure imports the through hole of path
Water droplet, rubbish blocking atmospheric pressure import path a part, it is also possible to atmospheric pressure is positively imported in reference pressure chamber.
Symbol description:
1 pressure sensor module
3 sensor housings
5 semiconductor pressure sensor elements
5a diaphragm portion
5b diaphragm support portion
6 supporting stations
6A through hole
7 cylinders
7a extends path
7b retainer
9 terminals
9a end
10 housing body
11 upper wall portions
11a the 1st upper wall portion
11b the 2nd upper wall portion
11c the 3rd upper wall portion
13 surrounding wall portion
13a～13d inner peripheral portion
13e peristome
15 diapire components
17a contacts path
17b cylindrical space
17c flat column space
The space that 17d is smooth
17e internal face
19 the 1st annular stepped portions
21 the 2nd annular stepped portions
23 the 3rd annular stepped portions
25 closing lines
27 atmospheric pressure import path
29 atmospheric pressure import path
31 measure object unloading part
33 O
S1 measures object pressure and imports room
S2 reference pressure chamber.
Claims (2)
1. a pressure sensor module, possesses housing and pressure sensitive portion；This housing possess import atmospheric pressure reference pressure chamber and
Import the mensuration object pressure importing room measuring object pressure；This pressure sensitive portion is to be positioned at said reference pressure chamber and said determination pair
The mode imported between room as pressure is arranged in above-mentioned housing, the pressure differential to above-mentioned atmospheric pressure Yu said determination object pressure
Detect；This pressure sensor module is characterised by:
Above-mentioned housing possesses and installation circuit board the 1st wall portion in opposite directions and the 1st wall portion the 2nd wall portion in opposite directions and being positioned at
State the surrounding wall portion between the 1st wall portion and above-mentioned 2nd wall portion；
Formed in the above-mentioned 2nd wall portion of above-mentioned housing and said determination object pressure is imported said determination object pressure importing room
Measure object pressure import path and import logical by the atmospheric pressure of more than 1 of above-mentioned atmospheric pressure importing said reference pressure chamber
Road；
Above-mentioned housing has air and will not import from the atmospheric pressure of above-mentioned more than 1 and be partially into said reference pressure beyond path
The air tight construction of power room；
Above-mentioned atmospheric pressure imports path and possesses the groove portion of through hole and more than 1；This through hole is leaving from above-mentioned 1st wall portion
Through above-mentioned 2nd wall portion, direction；This groove portion of more than 1 extends along the outside wall surface in above-mentioned 2nd wall portion, opens in above-mentioned outside wall surface
Mouthful, and connect with the end of above-mentioned through hole；
In above-mentioned 2nd wall portion integrally provided with cylinder, this cylinder possess in inside by said determination object pressure importing path prolong
Long prolongation path, and measure object guidings and manage or O is embedded in the outside of this cylinder；
At least one party at above-mentioned cylinder and above-mentioned 2nd wall portion is integrally provided retainer, and this retainer stops and above-mentioned cylinder
Chimeric said determination object guiding pipe or O are to above-mentioned 2nd wall portion side shifting；
The end of the above-mentioned through hole of the atmospheric pressure importing path of above-mentioned more than 1 and the groove portion of above-mentioned more than 1, from above-mentioned cylinder
Position in the outer part compared with above-mentioned retainer it is positioned at during body observation；
Above-mentioned groove portion is at above-mentioned surrounding wall portion opening.
2. an integrated circuit, it is characterised in that: the pressure sensor module described in claim 1 is installed on above-mentioned installation electricity consumption
Road plate, above-mentioned installation circuit board is moulded by dielectric resin material.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-031643 | 2012-02-16 | ||
| JP2012031643 | 2012-02-16 | ||
| PCT/JP2013/053525 WO2013122141A1 (en) | 2012-02-16 | 2013-02-14 | Pressure sensor module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104114990A CN104114990A (en) | 2014-10-22 |
| CN104114990B true CN104114990B (en) | 2016-08-31 |
Family
ID=48984250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380009546.7A Expired - Fee Related CN104114990B (en) | 2012-02-16 | 2013-02-14 | Pressure sensor module |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5970485B2 (en) |
| KR (1) | KR102021804B1 (en) |
| CN (1) | CN104114990B (en) |
| WO (1) | WO2013122141A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6152230B2 (en) * | 2014-12-01 | 2017-06-21 | 北陸電気工業株式会社 | Semiconductor pressure sensor device |
| KR102613764B1 (en) * | 2018-02-15 | 2023-12-19 | 미쓰미덴기가부시기가이샤 | pressure sensor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1502039A (en) * | 2001-05-09 | 2004-06-02 | ������˹�ͺ�ɪ�����Ϲ�˾ | Device with moisture filter |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0469746U (en) * | 1990-10-26 | 1992-06-19 | ||
| JPH08240495A (en) * | 1995-03-03 | 1996-09-17 | Hitachi Ltd | Semiconductor pressure sensor |
| JPH09178596A (en) * | 1995-12-25 | 1997-07-11 | Matsushita Electric Works Ltd | Pressure sensor |
| JPH09178598A (en) * | 1995-12-25 | 1997-07-11 | Matsushita Electric Works Ltd | Temperature control method in temperature characteristics test for pressure sensor |
| JP4072973B2 (en) | 1998-09-07 | 2008-04-09 | 日本電産コパル電子株式会社 | Pressure transducer |
| EP1065488B1 (en) * | 1999-07-01 | 2007-02-28 | Endress + Hauser GmbH + Co. KG | Relative pressure sensor |
| JP3721903B2 (en) | 1999-11-30 | 2005-11-30 | 国産電機株式会社 | Control unit for internal combustion engine |
| JP2004279091A (en) * | 2003-03-13 | 2004-10-07 | Denso Corp | Pressure sensor |
| JP4564775B2 (en) * | 2004-04-26 | 2010-10-20 | 日立オートモティブシステムズ株式会社 | Pressure detector for liquid and gas |
| US7180132B2 (en) * | 2004-09-16 | 2007-02-20 | Fairchild Semiconductor Corporation | Enhanced RESURF HVPMOS device with stacked hetero-doping RIM and gradual drift region |
| JP5853171B2 (en) * | 2010-12-13 | 2016-02-09 | パナソニックＩｐマネジメント株式会社 | Semiconductor pressure sensor and manufacturing method thereof |
-
2013
- 2013-02-14 CN CN201380009546.7A patent/CN104114990B/en not_active Expired - Fee Related
- 2013-02-14 KR KR1020147022587A patent/KR102021804B1/en not_active Expired - Fee Related
- 2013-02-14 WO PCT/JP2013/053525 patent/WO2013122141A1/en active Application Filing
- 2013-02-14 JP JP2013558726A patent/JP5970485B2/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1502039A (en) * | 2001-05-09 | 2004-06-02 | ������˹�ͺ�ɪ�����Ϲ�˾ | Device with moisture filter |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140127823A (en) | 2014-11-04 |
| CN104114990A (en) | 2014-10-22 |
| JPWO2013122141A1 (en) | 2015-05-18 |
| JP5970485B2 (en) | 2016-08-17 |
| KR102021804B1 (en) | 2019-09-17 |
| WO2013122141A1 (en) | 2013-08-22 |
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