CN104114011A - An Apparatus - Google Patents
An Apparatus Download PDFInfo
- Publication number
- CN104114011A CN104114011A CN201410157793.8A CN201410157793A CN104114011A CN 104114011 A CN104114011 A CN 104114011A CN 201410157793 A CN201410157793 A CN 201410157793A CN 104114011 A CN104114011 A CN 104114011A
- Authority
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- China
- Prior art keywords
- substrate
- pipeline
- transfer element
- fluid
- heat transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 103
- 239000012530 fluid Substances 0.000 claims abstract description 34
- 238000001816 cooling Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- LVGUZGTVOIAKKC-UHFFFAOYSA-N 1,1,1,2-tetrafluoroethane Chemical compound FCC(F)(F)F LVGUZGTVOIAKKC-UHFFFAOYSA-N 0.000 description 1
- 101150108992 RHOV gene Proteins 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000010349 pulsation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/02—Tubular elements of cross-section which is non-circular
- F28F1/022—Tubular elements of cross-section which is non-circular with multiple channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明涉及一种装置（1），其包括：管道（2，3），其具有将管道分隔成通道的内部纵向壁（4）；用于提供管道的通道之间的流动路径的第一和第二连接件（5，6）；第一传热元件（11），其包括具有第一表面（8）的基板（7，7’），第一表面（8）用于接收来自一个或更多个电器部件（10）的热负荷，并且用于将热负荷传递至流体；以及第二传热元件。为了获得有效的装置，位于电器部件（10）的位置处的管道（3）通过基板的第二表面（9）至少部分地嵌入基板（7）内，而不在电器部件（10）的位置处的管道（2）则不嵌入基板内。
The invention relates to a device (1) comprising: ducts (2, 3) having inner longitudinal walls (4) dividing the ducts into channels; first and A second connecting piece (5, 6); a first heat transfer element (11) comprising a substrate (7, 7') having a first surface (8) for receiving heat from one or more heat load of a plurality of electrical components (10) and for transferring the heat load to the fluid; and a second heat transfer element. In order to obtain an efficient arrangement, the duct (3) at the location of the electrical component (10) is at least partially embedded in the substrate (7) through the second surface (9) of the substrate, and not at the location of the electrical component (10) The pipe (2) is not embedded in the substrate.
Description
Technical field
The present invention relates to a kind of device, this device has for receiving from the heat load of electric component and heat load being delivered to the first heat transfer element and second heat transfer element of surrounding environment.
Background technology
Known a kind of cooling element with the first heat transfer element before, the first heat transfer element has the substrate receiving from the heat load of electric component.Having the pipeline that pipeline is separated into the longitudinal wall in inside of fluid passage embeds in substrate at least in part, so that the boiler channel in the embedded part of pipeline to be provided, boiler channel receives from the heat load of substrate and is delivered in the fluid in boiler channel.
The fluid of heating is passed to the second heat transfer element, and the second heat transfer element has for cooling fluid and makes cooling liquid be back to the condenser passages of boiler channel.Condenser passages comprises ducted those passages in the substrate that does not embed the first heat transfer element.
The problem of this known arrangement is, heat conventionally and is unevenly distributed to substrate from electric component.Therefore, only have those boiler channel of the most close electric component to work best.Embed the boiler channel of other pipelines in substrate and can not be effectively provide cooling for electric component and substrate.
For fear of excessive intensification in suc scheme, substrate needs relatively thick and volume is larger thus.Thick and large substrate has ensured that the distribution of heat in boiler channel is than more balanced in the situation that of thin substrate.But thick and large substrate has other defect, the weight of for example substrate is large and expensive.In addition, be complicated with the manufacture of the cooling element of large substrates.
Summary of the invention
The object of the invention is to solve above-mentioned deficiency and provide a kind of to there is improved performance and be easier to the device of manufacturing.Above-mentioned purpose of the present invention and other objects realize by device as described below.
This device comprises: pipeline, and it has the longitudinal wall in inside that pipeline is separated into passage; The first connector, it is attached to the first end of pipeline, for the flow path between the passage of pipeline is provided; The second connector, it is attached to the second end of pipeline, for the flow path between the passage of pipeline is provided; The first heat transfer element, it comprises substrate, and substrate has first surface, and first surface is for receiving from the heat load of one or more electric component and for heat load is passed to fluid; And second heat transfer element, it is for receiving the fluid from the first heat transfer element, and for transmitting the heat load from fluid.The second surface that the device for cleaning pipeline that is positioned at the position of electric component is crossed substrate embeds substrate at least in part, and does not embed in substrate at the pipeline of the position of electric component.Passage in the embedded part that is positioned at corresponding pipeline of the pipeline embedding is at least in part boiler channel, boiler channel will receive from the heat load of one or more electric component to the fluid in boiler channel, and fluid is delivered to the second heat transfer element.Other passages of pipeline are condenser passages.
The scheme that the pipeline that is not positioned at the position of electric component does not embed substrate can improve the efficiency of device and the structure of simplification device and manufacture.In this scheme, the passage that is not positioned at the pipeline of the position of one or more electric component can be used as condenser passages effectively.
In a preferred embodiment, the distance that its whole passages are between the adjacent channel of condenser passages is greater than the distance between the adjacent channel embedding at least in part in substrate or second substrate.Like this, more boiler channel can be positioned in the place that needs most them, in other words, is positioned at the position of one or more electric component, and it is cooling to obtain the best of one or more electric component.
Preferred embodiment of the present invention is open in the following areas.
According to device of the present invention aspect, the first heat transfer element comprises second substrate, and second substrate has for receiving the first surface from the heat load of one or more electric component; The second surface that the device for cleaning pipeline that is positioned at the position of electric component is crossed second substrate embeds second substrate at least in part, and does not embed in second substrate at the pipeline of the position of electric component; Passage in the embedded part that is positioned at corresponding pipeline of the pipeline embedding is at least in part boiler channel, boiler channel will receive from the heat load of one or more electric component to the fluid in boiler channel, and fluid is delivered to the second heat transfer element; And other passages of pipeline are condenser passages.
According to another aspect of device of the present invention, between position in one or more pipeline embeds substrate or second substrate at least in part, have one or more pipeline not embedding in substrate or second substrate, and the passage of described one or more pipeline is condenser passages.
According to another aspect of device of the present invention, exist by substrate or second substrate and do not embed substrate or second substrate in the gap that separates of pipeline.
According to another aspect of device of the present invention, the second heat transfer element comprises fin, and fin extends to be delivered to surrounding environment by the heat of the fluid in fin self cooling condenser passage in future between the wall of condenser passages.
According to an also aspect of device of the present invention, do not embed distance between the adjacent channel in substrate or second substrate and be greater than the distance between the adjacent channel embedding at least in part in substrate or second substrate.
According to another aspect of device of the present invention, at least some in the passage of pipeline have capillary dimensions.
Brief description of the drawings
Below will and be described in greater detail with reference to the attached drawings the present invention by example, wherein
Fig. 1 to Fig. 3 illustrates the first embodiment of device, and
Fig. 4 illustrates the second embodiment of device.
Embodiment
Fig. 1 illustrates the front view of cooling device 1, and Fig. 2 illustrates the end view of cooling device 1, and Fig. 3 illustrates along the substrate of line A-A in Fig. 1 and the profile of pipeline.Fig. 3 illustrates partial enlarged drawing in addition, and this partial enlarged drawing illustrates the relative position of pipeline and substrate.For the sake of simplicity, the first connector 5 is not illustrated in Fig. 3.
Device 1 comprises pipeline 2 and pipeline 3, and pipeline 2 and pipeline 3 have the longitudinal wall 4 in inside that pipeline 2 and pipeline 3 is separated into passage.The first connector 5 is attached to the first end of pipeline 2 and pipeline 3, and for the flow path between the passage of pipeline is provided, the second connector 6 is attached to the second end of pipeline 2 and pipeline 3, for the flow path between the passage of pipeline is provided.
The first heat transfer element 11 comprises substrate 7, and substrate 7 has first surface 8 for holding one or more electric component 10 and for being delivered to the relative second surface 9 of fluid of the passage of pipeline from the heat load of electric component.For example, electric component can be motor driver for controlling the high power components to motor power supply.
The second heat transfer element 12 receives the hot fluid that adds from the first heat transfer element 11 by pipeline, and heat is delivered to surrounding environment from fluid.In an illustrated embodiment, suppose that by way of example the second heat transfer element comprises fin 13, fin 13 extends in the second end of device between pipeline 2 and pipeline 3, makes heat be delivered to surrounding air by fin 13.Fan can be used to promote to pass through the Air Flow of fin 13 and promote heat from the fluid transmission of environment towards periphery.
From Fig. 2 and Fig. 3, can find out, the pipeline 3 that is positioned at the position of electric component 10 is embedded into substrate 7 at least in part via the second surface 9 of substrate.Be not embedded in substrate at the pipeline 2 of the position of electric component 10.Passage in the embedded part that is positioned at corresponding pipeline of embedding pipeline 3 is boiler channel 14, and boiler channel 14 receives from the heat load of one or more electric component and will add hot fluid and is delivered to the second heat transfer element 12.Other passages of pipeline 2 and pipeline 3 are condenser passages 15.
Can find out from Fig. 1 and Fig. 3, embed at least in part between the position in substrate at one or more pipeline 3, have at least one or the more pipeline 2 that do not embed in substrate.All passages of these pipelines 2 are all condenser passages 15.Those pipelines 2 that gap 16 can be whole passages condenser passages 15 separate with substrate 7.This gap makes to minimize to the direct heat transmission that fluid-cooled condenser passages 15 occurs from substrate 7.
In Fig. 1 to Fig. 3, suppose by way of example the whole length setting of fin 13 along pipeline, between condenser passages from the first connector 5 to second connectors 6.But, all so essential in not all embodiment.For example, in alternative embodiment, fin 13 can only be arranged on the top of device, and making does not have fin in the position of substrate 7.
For example, pipeline 2 and pipeline 3 can be the MPE(multiport extruding of manufacturing by extruded aluminium) pipe.In the embodiment shown, substrate 7 is only provided with compared with thickness portion in the position of electric component 10.In this part of substrate 7, be formed with groove, and the pipeline 3 partly embedding in substrate is arranged in these grooves.This scheme makes to obtain not too large-scale substrate, because only need these compared with thickness portion in several positions, and other parts of substrate can be thinner.Once pipeline is in place in groove, pipeline and substrate may be arranged on high-temperature area, in this high-temperature area, may melt for the scolder that pipeline is attached to substrate.
In Fig. 1 and Fig. 2, device 1 is depicted as in stand up position, utilizes the temperature difference and gravity that fluid is circulated in pipeline.In the first heat transfer element 7, the fluid of heating is for example because evaporation upwards advances to the second heat transfer element 12 and the second connector 6 by boiler channel 14.Once fluid cools down, it turns back to the first connector 5 downwards by condenser passages 15, and the stepping of going forward side by side enters in boiler channel 14, to carry out new circulation.
For promote the circulation of fluid and guarantee when device in shown in also there is correct circulation when another location outside stand up position, some in passage 14 or the passage 15 of pipeline 2 and pipeline 3 can have capillary dimensions.In this case, if the passage that makes fluid be back to the first connector 5 from the second connector 6 has capillary dimensions, so when device in shown in when another location outside stand up position, also can there is fluid flowing from the second connector 6 to the first connector 5.In this context, " capillary dimensions " refers to the passage of capillary dimensions, in this case, passage has enough little size, make it possible to uniquely along the longitudinal direction (in other words, along the flow direction relative with radial direction) produce foam, and produce pulsation effect by promoting liquid thus.In this example, because passage is capillary dimensions, therefore do not need on wall, to have other capillary structure therein.The diameter that is regarded as passage capillaceous depends on its inner fluid that uses (boiling).For example,, formula can be for estimating suitable diameter:
D=(sigma/(g*(rhol-rhov)))^0.5，
Wherein, sigma is surface tension, and g is acceleration of gravity, and rhov is vapour density, and rhol is fluid density.For the R134a(HFC-134a of fluid as being applicable to the device shown in figure), R145fa and R1234ze(tetrafluoeopropene) for, above-mentioned formula is from the value of 1mm to 3mm.
Fig. 4 illustrates the second embodiment of device.The device of Fig. 4 is with 1 to 3 illustrated device is closely similar by reference to the accompanying drawings, and therefore the embodiment of Fig. 4 is by main by pointing out that the difference between these embodiment describes below.
Pipeline 2 and 3, the first connector 5 and the second connector 6 and the second heat transfer element in Fig. 4 with implement similarly about the mode described in accompanying drawing 1 to 3.But, substituting an only substrate, this device has first substrate 7 ', second substrate 17 ' and the 3rd substrate 27 '.Each in first substrate 7 ', second substrate 17 ' and the 3rd substrate 27 ' has the first surface 8 receiving from the heat load of one or more electric component 10.
With previous embodiment similarly, the pipeline 3 that is arranged in the position of electric component 10 embeds first substrate 7 ', second substrate 17 ' and the 3rd substrate 27 ' at least in part by the second surface of substrate, does not embed in first substrate 7 ', second substrate 17 ' and the 3rd substrate 27 ' at the pipeline 2 of the position of electric component 10.
Use more than one substrate to have following advantage, substrate can more accurately be manufactured according to actual needs.There is no need to have the only single large and heavy substrate for all electric components, on the contrary, each parts can have according to actual needs and set the substrate of size.But naturally, one or more in substrate can comprise more than one electric component.In addition, in this case, the result producing is that total weight and the volume of under any circumstance substrate can be minimized according to actual needs.
Be understandable that, foregoing description and accompanying drawing are only intended to set forth the present invention.Be apparent that to those skilled in the art, the present invention can be changed without departing from the scope of the invention or improve.
Claims (7)
1. a device (1,1 '), comprising:
Pipeline (2,3), described pipeline (2,3) has the longitudinal wall in inside (4) that described pipeline is separated into passage,
The first connector (5), described the first connector (5) is attached to the first end of described pipeline (2,3), for the flow path between the described passage of described pipeline is provided,
The second connector (6), described the second connector (6) is attached to the second end of described pipeline, for the flow path between the described passage of described pipeline is provided, and
The first heat transfer element (11,11 '), described the first heat transfer element (11,11 ') comprise substrate (7,7 '), described substrate (7,7 ') has first surface (8), described first surface (8) for receive from the heat load of one or more electric component (10) and for described heat load is passed to fluid, and
The second heat transfer element (12), described the second heat transfer element (12) is the fluid from described the first heat transfer element (11,11 ') for reception, and for transmitting the heat load from described fluid, it is characterized in that
The pipeline (3) that is positioned at the position of electric component (10) embeds in described substrate (7,7 ') at least in part by the second surface (9) of described substrate, and does not embed in described substrate at the pipeline (2) of the position of electric component (10),
Passage in the embedded part that is positioned at corresponding pipeline of the pipeline (3) embedding is at least in part boiler channel (14), described boiler channel (14) will receive to the described fluid in described boiler channel (14) from the described heat load of described one or more electric component (10), and described fluid is delivered to described the second heat transfer element (12), and
Other passages of described pipeline (2,3) are condenser passages (15).
2. device according to claim 1, is characterized in that,
Described the first heat transfer element (11,11 ') comprises second substrate (17 '), and described second substrate (17 ') has for receiving the first surface (8) from the heat load of one or more electric component (10),
The described pipeline (3) that is positioned at the position of electric component (10) embeds described second substrate (17 ') at least in part by the second surface (9) of described second substrate (17 '), and do not embed in described second substrate (17 ') at the pipeline (2) of the position of electric component (10), and
Passage in the embedded part that is positioned at corresponding pipeline of the pipeline (3) embedding is at least in part boiler channel (15), described boiler channel (15) will receive to the fluid in described boiler channel (15) from the described heat load of described one or more electric component (10), and described fluid is delivered to described the second heat transfer element (12), and
Other passages of described pipeline are condenser passages (14).
3. device according to claim 1, it is characterized in that, embed at least in part described substrate (7 at one or more pipeline (3), 7 ') between the position or in described second substrate (17 '), exist and do not embed described substrate (7,7 ') one or more pipeline (2) or in described second substrate (17 '), and the passage of described one or more pipeline (2) is condenser passages (14).
4. device according to claim 1, is characterized in that, exists described substrate (7,7 ') or described second substrate (17 ') and does not embed the gap (16) that the pipeline (2) in described substrate or described second substrate separates.
5. device according to claim 1, it is characterized in that, described the second heat transfer element (12) comprises fin (13), and described fin (13) extends to the heat of the described fluid from described condenser passages (14) is delivered to surrounding environment by described fin (13) between the wall of described condenser passages (14).
6. device according to claim 1, it is characterized in that, do not embed distance between the adjacent channel (2) in described substrate or described second substrate and be greater than the distance between the adjacent channel (3) embedding at least in part in described substrate (7,7 ') or described second substrate (17 ').
7. device according to claim 1, is characterized in that, at least some in the described passage of described pipeline (2,3) have capillary dimensions.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13164229.0A EP2793261B1 (en) | 2013-04-18 | 2013-04-18 | An apparatus |
| EP13164229.0 | 2013-04-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104114011A true CN104114011A (en) | 2014-10-22 |
| CN104114011B CN104114011B (en) | 2017-04-12 |
Family
ID=48141790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410157793.8A Active CN104114011B (en) | 2013-04-18 | 2014-04-18 | Heat transmission apparatus |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9392729B2 (en) |
| EP (1) | EP2793261B1 (en) |
| CN (1) | CN104114011B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106912181A (en) * | 2015-12-22 | 2017-06-30 | Abb技术有限公司 | Cooling device |
| CN106954366A (en) * | 2016-01-07 | 2017-07-14 | Abb瑞士股份有限公司 | Heat exchangers for power electronics components |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2793261B1 (en) | 2016-04-13 |
| US9392729B2 (en) | 2016-07-12 |
| US20140313672A1 (en) | 2014-10-23 |
| EP2793261A1 (en) | 2014-10-22 |
| CN104114011B (en) | 2017-04-12 |
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