CN104091901A - A kind of OLED preparation method - Google Patents

Abstract

The invention relates to the technical field of display, and discloses an OLED preparation method. The OLED preparation method comprises steps as follows: multiple layers of organic films are evaporated sequentially, wherein particle defect information on a substrate is detected after one layer of organic film is evaporated and before a next layer of organic film is evaporated; and a particle defect is repaired by a defect repair process when detected. According to the OLED preparation method, a process link of detecting particle defect information on the substrate after one layer of organic film is evaporated and before a next layer of organic film is evaporated is added, the particle defect is immediately repaired when detected and can be found and repaired timely in the forming process of the multiple layers of organic films, so that the waste of organic materials is reduced.

Description

A kind of OLED preparation method

technical field

The invention relates to the field of display technology, in particular to an OLED preparation method.

Background technique

At present, the hole injection layer (HIL), hole transport layer (HTL), light emitting layer (EML), electron transport layer (ETL) and cathode (Cathode) in the pixel area of color OLED display devices are all vacuum evaporated. process to form a film. Although the evaporation chamber is first vacuumed before evaporation, it is still impossible to achieve 100% cleanliness of the evaporation chamber. During the evaporation process, if particles fall on the organic film, defects will appear. Due to the existence of particles, it may cause a short circuit and lead to the appearance of black spots, which reduces the life and efficiency of the device; and, due to the existence of particles, the subsequent evaporation film will have bumps and a tip discharge phenomenon. , resulting in reduced device lifetime and efficiency.

In the manufacturing process of the existing display device, during the vacuum evaporation process of each layer of organic material, the problem of particle defects is not detected. Therefore, only when the OLED display device is defective, particle defects can be found through defective analysis. However, at this time, the particles have been deeply buried in the film, and it can no longer be repaired. The organic film deposited on the glass substrate can only be cleaned with a cleaning solution, and the vacuum evaporation process of the organic material is carried out again. This restoration method results in a waste of organic material.

Contents of the invention

The invention provides an OLED preparation method, which can avoid the waste of organic materials.

To achieve the above object, the present invention provides the following technical solutions:

A kind of OLED preparation method, comprises the following steps:

Sequentially vapor-deposit multi-layer organic films, in which:

After evaporating one layer of organic film and before evaporating the next layer of organic film, including:

Detect particle defect information on the substrate;

When the presence of particle defects is detected, the particle defects are repaired through a defect repair process.

In the above OLED preparation method, after evaporating one layer of organic film and before evaporating the next layer of organic film, the process link of detecting particle defect information on the substrate is added. When particle defects are detected, they can be repaired immediately, which can Particle defects are detected and repaired in time during the formation of multilayer organic thin films, thereby reducing the waste of organic materials.

In a preferred embodiment,

When the particles at the particle defect are located on the surface of the organic film, the defect repair process is to use a laser process to remove the particles in the particle defect;

When the particles at the particle defects are partially embedded in the organic film, the defect repair process is:

using a laser process to remove particles in the particle defects;

Flatten the surface of the organic film by grinding;

Alternatively, the defect repair process is:

using a laser process to remove particles in the particle defects;

Dropping molten organic material at particle defects and allowing the molten organic material to cool;

Flatten the surface of the organic film by grinding;

When the particles at particle defects are all embedded in the organic film, the defect repair process is:

using a laser process to remove particles in the particle defects;

Dropping molten organic material at particle defects and allowing the molten organic material to cool;

The surface of the organic thin film is made flat by grinding.

In a preferred embodiment, when the defect repairing process includes dropping molten organic material at the particle defect, the organic material in the molten organic material dropped at the particle defect and the vapor-deposited organic film The material is the same.

In a preferred embodiment, when the particle defect repairing process includes dropping molten organic material at the defect, the dropping of the molten organic material at the particle defect specifically includes:

Look through the microscope and move the nozzle over the particle defect area, then drop the molten organic material.

In a preferred embodiment, when the defect repairing process includes smoothing the surface of the organic film by grinding, the smoothing of the surface of the organic film by grinding specifically includes:

Observe through a microscope and move the grinding head to the particle defect area, and then grind the organic material until the surface of the organic film is flat.

In a preferred embodiment, the detection of particle defect information on the substrate specifically includes:

The substrate is observed through a microscope to determine particle defect information on the substrate.

In a preferred embodiment, before said sequentially vapor-depositing multi-layer organic thin films, further steps are included:

The substrate substrate is cleaned and plasma treated.

In a preferred embodiment, after the sequential vapor deposition of multi-layer organic films, further steps are included:

Detect particle defect information on the substrate;

When the presence of particle defects is detected, the particle defects are repaired through a defect repair process.

In a preferred embodiment, after sequentially evaporating multiple layers of organic thin films and detecting particle defect information on the substrate, further steps are included:

Forming a metal cathode layer and forming a metal cathode pattern through a patterning process;

forming a light extraction layer on the metal cathode layer;

package substrate.

Description of drawings

Fig. 1 is a flow chart of an OLED preparation method provided by an embodiment of the present invention;

Fig. 2a is a schematic diagram of a substrate structure in which particles are located on the surface of an organic thin film in an OLED preparation method provided by an embodiment of the present invention;

Fig. 2b is a schematic diagram of the structure of the substrate after removing particles by laser technology in an OLED preparation method provided by an embodiment of the present invention;

Fig. 3a is a schematic diagram of a substrate structure in which particles are partially embedded in the surface of an organic thin film in another OLED preparation method provided by an embodiment of the present invention;

Fig. 3b is a schematic diagram of the substrate structure after particle removal by laser process in another OLED preparation method provided by the embodiment of the present invention;

Fig. 3c is a schematic diagram of the structure of the substrate after dropping molten organic materials in another OLED preparation method provided by the embodiment of the present invention;

Fig. 3d is a schematic diagram of the substrate structure after grinding in another OLED preparation method provided by the embodiment of the present invention;

Fig. 4a is a schematic diagram of a substrate structure in which all particles are embedded in an organic thin film in another OLED preparation method provided by an embodiment of the present invention;

Fig. 4b is a schematic diagram of the substrate structure after particle removal by laser process in another OLED preparation method provided by the embodiment of the present invention;

Fig. 4c is a schematic diagram of the substrate structure after dropping molten organic materials in another OLED preparation method provided by the embodiment of the present invention;

Fig. 4d is a schematic diagram of a substrate structure after grinding in another OLED manufacturing method provided by an embodiment of the present invention.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Please refer to Figure 1, Figure 2a and Figure 2b.

As shown in Figure 1, the OLED preparation method provided by the embodiment of the present invention includes the following steps:

Sequentially vapor-deposit multi-layer organic films, in which:

Taking step S101 and step S104 shown in Figure 1 as an example, both step S101 and step S104 are to vapor-deposit an organic thin film, and after vapor-depositing an organic thin film in step S101 and in step S104, vapor-deposit the next layer of organic thin film. Before film, include:

Step S102, detecting particle defect information on the substrate;

Step S103, when it is detected that the particle defect exists, the particle defect is repaired through a defect repairing process.

As shown in Figure 2a and Figure 2b, after evaporating the organic film 12 in step S101 and before evaporating the next layer of organic film in step S104, step S102 is to detect the particle defect 13 information on the substrate, step S103, when When the particle defect 13 is detected, the particle defect 13 is repaired through a defect repair process.

In the above OLED preparation method, step S102 is added to detect particle defect 13 information on the substrate after vapor-depositing one layer of organic film 12 in step S101 and before vapor-depositing the next layer of organic film in step S104. After step S101 is carried out When there is no particle defect 13 on the substrate, proceed directly to step S104 to vapor-deposit the next layer of organic thin film; when step S102 detects the presence of particle defect 13 on the substrate, perform step S103 to repair the particle defect 13.

Therefore, in the above-mentioned OLED preparation method, particle defects 13 can be found and repaired in time during the formation of multilayer organic thin films. Compared with the above-mentioned background technology, it can reduce the phenomenon that the OLED must be re-evaporated to repair the organic thin film. , thereby reducing the waste of organic materials.

Please refer to Figure 1, Figure 2a, Figure 2b, Figure 3a, Figure 3b, Figure 3c, Figure 3d, Figure 4a, Figure 4b, Figure 4c, Figure 4d below.

As shown in Figure 1, Figure 2a, Figure 2b, Figure 3a, Figure 3b, Figure 3c, Figure 3d, Figure 4a, Figure 4b, Figure 4c, Figure 4d.

In a specific embodiment, step S103 has the following several implementation modes:

Method 1, observe through a high-power microscope, when the particles at the particle defect 13 are located on the surface of the organic film 12, as shown in Figure 2a, the defect repair process in step S103 is to directly use the laser to destroy the particles, so that the organic film 12 The surface is flat and the repair is complete, as shown in Figure 2b. Wherein, the organic thin film 12 can be directly arranged on the substrate 11, and the substrate 11 can be made of transparent materials such as glass, quartz, sapphire, plastic; or, the organic thin film 12 can be indirectly arranged on the substrate 11, that is, the organic thin film Other structural film layers may also be formed between 12 and the base substrate 11, which is not limited in the present invention.

The second way is to observe through a high-power microscope. When the particles at the particle defect 23 are partially embedded in the organic film 22, as shown in FIG. A groove 231 will appear at 23 places, as shown in Figure 3b; if the groove 231 appearing at the particle defect 23 place is very shallow, then directly make the surface of the organic film 22 flat by grinding to complete the repair; if the groove appearing at the particle defect 23 place 231 is very deep, then first drop molten organic material into the groove 231 at the particle defect 23, as shown in Figure 3c, this organic material is the same substance as the organic material used for evaporation; then, after the organic material is cooled, Grinding is performed to make the surface of the organic thin film 22 flat, and the restoration is completed, as shown in FIG. 3d. Wherein, the organic thin film 22 can be directly arranged on the base substrate 21, and the base substrate 21 can be selected from transparent materials such as glass, quartz, sapphire, plastic; or, the organic thin film 22 can be indirectly arranged on the base substrate 21, that is, the organic thin film Other structural film layers may also be formed between 22 and the base substrate 21, which is not limited in the present invention.

Method 3: Observe through a high-power microscope. When all the particles at the particle defect 33 are embedded in the organic film 32, as shown in FIG. A deep groove 331 will appear at the defect 33, as shown in Figure 4b; then, molten organic material is dripped into the groove 331 at the particle defect 33, as shown in Figure 4c, this organic material is the same as the organic material used for evaporation. The material is the same substance; after the organic material is cooled, it is ground to make the surface of the organic film 32 flat, and the restoration is completed, as shown in FIG. 4d. Wherein, the organic thin film 32 can be directly arranged on the base substrate 31, and the base substrate 31 can be selected from transparent materials such as glass, quartz, sapphire, plastic; or, the organic thin film 32 can be indirectly arranged on the base substrate 31, that is, the organic thin film Other structural film layers may also be formed between 32 and the base substrate 31, which is not limited in the present invention.

On the basis of method 2 or method 3 of the above-mentioned embodiment, in a specific embodiment, in the defect repair process of step S103, the specific process of dropping molten organic material at the particle defect is as follows: observe through a high-power microscope and align the lens Move the nozzle over the particle defect area and drop in the molten organic material. Taking the third method in the above-mentioned embodiment as an example, as shown in FIG. 3 b , observe through a high-power microscope and align the lens and move the nozzle to the area above the particle defect 33 , and then drop molten organic material.

On the basis of the foregoing embodiments, in a specific embodiment, the surface of the organic film is made flat by grinding, and the specific process is:

Use a high-power microscope to align the lens to observe and move the grinding head to the particle defect area, and then grind the organic material until the surface of the organic film is flat. Taking the third method in the above embodiment as an example, as shown in Fig. 3c, the high power microscope is used to align the lens to observe and move the grinding head to the particle defect 33 area, and then grind the organic material until the surface of the organic thin film 32 is flat.

On the basis of the above-mentioned embodiments, in a specific embodiment, before sequentially evaporating the multi-layer organic thin films, a step is further included: cleaning and plasma treating the base substrate. That is, cleaning and plasma treatment are performed on the base substrate before any layer of organic thin film evaporation is performed on the base substrate.

On the basis of the above-mentioned embodiments, in a specific embodiment, after successively evaporating multiple layers of organic thin films, further steps are included:

Detect particle defect information on the substrate;

When the presence of particle defects is detected, the particle defects are repaired through a defect repair process.

On the basis of the above-mentioned embodiments, in a specific embodiment, after sequentially evaporating multiple layers of organic thin films and detecting particle defect information on the substrate, further steps are included:

Forming a metal cathode layer and forming a metal cathode pattern through a patterning process;

forming a light extraction layer on the metal cathode layer;

package substrate.

Apparently, those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.

Claims (9)

1. A kind of OLED preparation method is characterized in that, comprises the following steps: Sequentially vapor-deposit multi-layer organic films, in which: After evaporating one layer of organic film and before evaporating the next layer of organic film, including: Detect particle defect information on the substrate; When the presence of particle defects is detected, the particle defects are repaired through a defect repair process. 2. OLED preparation method according to claim 1, is characterized in that, When the particles at the particle defect are located on the surface of the organic film, the defect repair process is to use a laser process to remove the particles in the particle defect; When the particles at the particle defects are partially embedded in the organic film, the defect repair process is: using a laser process to remove particles in the particle defects; Flatten the surface of the organic film by grinding; Alternatively, the defect repair process is: using a laser process to remove particles in the particle defects; Dropping molten organic material at particle defects and allowing the molten organic material to cool; Flatten the surface of the organic film by grinding; When the particles at particle defects are all embedded in the organic film, the defect repair process is: using a laser process to remove particles in the particle defects; Dropping molten organic material at particle defects and allowing the molten organic material to cool; The surface of the organic thin film is made flat by grinding. 3. The OLED preparation method according to claim 2, wherein when the defect repairing process includes dropping molten organic material at the particle defect, the dropping of the molten organic material at the particle defect The organic material is the same as that of the vapor-deposited organic film. 4. The OLED preparation method according to claim 2, wherein when the defect repairing process includes dropping molten organic material at the particle defect, the dropping of the molten organic material at the particle defect, Specifically include: Look through the microscope and move the nozzle over the particle defect area, then drop the molten organic material. 5. The OLED preparation method according to claim 2, characterized in that, when the defect repairing process includes grinding the surface of the organic film to be flat, the grinding to make the surface of the organic film is flat includes: Observe through a microscope and move the grinding head to the defect area, and then grind the organic material until the surface of the organic film is flat. 6. The OLED preparation method according to claim 1, wherein the detecting particle defect information on the substrate specifically comprises: The substrate is observed through a microscope to determine particle defect information on the substrate. 7. The OLED preparation method according to any one of claims 1 to 6, characterized in that, before the sequential deposition of multi-layer organic thin films, further comprising the steps of: The substrate substrate is cleaned and plasma treated. 8. The OLED preparation method according to any one of claims 1 to 6, characterized in that, after the sequential evaporation of multiple layers of organic thin films, further comprising the steps of: Detect particle defect information on the substrate; When the presence of particle defects is detected, the particle defects are repaired through a defect repair process. 9. The OLED preparation method according to claim 8, characterized in that, after said sequentially vapor-depositing multilayer organic films and detecting particle defect information on the substrate, further comprising the steps of: Forming a metal cathode layer and forming a metal cathode pattern through a patterning process; forming a light extraction layer on the metal cathode layer; package substrate.