CN104049321A - Optical communication apparatus and manufacture method thereof - Google Patents

Abstract

Disclosed is an optical communication apparatus. The optical communication apparatus comprises a light-emitting component, a first controller, a processor, a light-receiving component, a second controller, a memory body and a planar optical waveguide. The optical communication apparatus further comprises two reflection components, a first covering component, a light transmitting material and a second covering component. The first covering component covers the light-emitting component, the first controller, the processor, the light-receiving component, the second controller and the memory body. The planar optical waveguide is arranged on the first covering component. Two light transmitting holes are respectively arranged at positions, which are corresponding to the light-emitting component and the light-receiving component, of the first covering component. Two through holes are respectively arranged at positions, which are corresponding to the two light transmitting holes, of the planar optical waveguide. Two reflection components are respectively correspondingly accommodated in the through holes. The light transmitting holes and the through holes are filled with the light transmitting material. The second covering component covers the planar optical waveguide, the two reflection components and the light transmitting material. The optical communication apparatus is small in volume.

Description

Optical communication device and manufacturing method thereof

technical field

The present invention relates to the field of optical communication, in particular to an optical communication device.

Background technique

Existing optical communication devices generally include a circuit board, a light emitting element, a light receiving element, a planar light wave circuit (PLC) and two optical coupling housings. The light-emitting element and the light-receiving element are arranged on the circuit board at intervals. The planar optical waveguide is formed on the circuit board and arranged between the light-emitting element and the light-receiving element. Two optical coupling shells cover the light-emitting element and the light-receiving element respectively, one of which is coupled with one end of the light-emitting element and the planar optical waveguide, and the other optical coupling shell is coupled with the other end of the light-receiving element and the planar optical waveguide coupling. However, since the two optical coupling shells cover the light-emitting element and the light-receiving element, the planar optical waveguide usually needs to be thicker or a cushion layer is provided between the planar optical waveguide and the circuit board, such as the planar optical waveguide to be compatible with the two optical The coupling shell performs optical coupling, which increases the volume of the optical communication device. In addition, the volume of the optical coupling housing is generally large, which also increases the volume of the optical communication device, which is not conducive to miniaturization.

Contents of the invention

In view of this, it is necessary to provide an optical communication device that can reduce the volume.

An optical communication device includes a light-emitting element, a first controller, a processor, a light-receiving element, a second controller, a memory, and a planar optical waveguide. The first controller is electrically connected to the light emitting element and the processor. The second controller is electrically connected to the light receiving element and the memory. The light-emitting element includes a light-emitting surface, and the light-receiving element includes a light-receiving surface. The optical communication device further includes two reflective elements, a first covering element, a light-transmitting material, and a second covering element. The first covering element covers the light emitting element, the first controller, the processor, the light receiving element, the second controller and the memory. The planar optical waveguide is disposed on the first cladding element. The first covering element is respectively provided with two light holes corresponding to the light-emitting surface and the light-receiving surface. The planar optical waveguide is respectively provided with two through holes corresponding to the two light through holes. The two reflective elements are correspondingly accommodated in one of the through holes. The light-transmitting material is filled in the light-through hole and the through-hole. The second wrapping element wraps the planar optical waveguide, the two reflective elements and the light-transmitting material.

A method of manufacturing an optical communication device as described above, comprising the following steps:

The first controller is electrically connected to the light-emitting element and the processor, the second controller is electrically connected to the light-receiving element and the memory, and the first covering element Covering the light-emitting element, the first controller, the processor, the light-receiving element, the second controller, and the memory by injection molding;

The planar optical waveguide is arranged on the first cladding element, two through holes are opened in the planar optical waveguide by laser lift-off, and two through holes are respectively opened in the first cladding element by laser lift-off. The light-through holes running through the bearing surface, the two light-through holes respectively correspond to the light-emitting surface and the light-receiving surface;

accommodating both the first reflective element and the second reflective element in the through hole;

filling the two through-holes and the two through-holes with a light-transmitting material by way of injection molding;

The second cladding element covers the planar light waveguide, the first reflective element, the second reflective element and the light-transmitting material by injection molding, and the second cladding element and the The first covering element is fixedly connected.

Compared with the prior art, the first covering element covers the light emitting element, the first controller, the processor, the light receiving element, the second controller and the memory. The second cladding element covers the planar optical waveguide, the two reflective elements and the light-transmitting material, instead of providing an optical coupling housing that covers the light-emitting element and the light-receiving element respectively. Therefore, The optical communication device of the invention can greatly reduce the volume and is beneficial to miniaturization.

Description of drawings

FIG. 1 is a schematic diagram of an optical communication device provided by an embodiment of the present invention.

FIG. 2 is a flowchart of a method for manufacturing an optical communication device provided by an embodiment of the present invention.

3-6 are process diagrams of the manufacturing method of the optical communication device in FIG. 2 .

Description of main component symbols

optical communication device 100 Light emitting element 10 first controller 20 processor 30 Light receiving element 40 second controller 50 Memory 60 first cladding element 70 planar light guide 80 Second wrapping element 90 luminous surface 101 First Concentrator 102 receiving surface 401 The second concentrator 402 Bearing surface 71 Clear hole 710 through hole 81 first reflective element 85 second reflective element 86 colloid 810 first slope 851 second slope 861 Light-transmitting material 87

The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

Detailed ways

As shown in FIG. 1 , an optical communication device 100 provided in an embodiment of the present invention includes a light emitting element 10 , a first controller 20 , a processor 30 , a light receiving element 40 , and a second controller 50 , a memory 60 , a first cladding element 70 , a planar optical waveguide 80 , two reflective elements and a second cladding element 90 .

The light emitting element 10 includes a light emitting surface 101 on which a hemispherical first light collecting portion 102 is formed. The first light collecting part 102 is formed by dropping colloid on the light emitting surface 101 . In other implementation manners, the first light concentrating portion 102 can also be obtained by molding, and then bonded to the light emitting surface 101 . The light emitting element 10 is a laser diode (laser diode, LD).

The first controller 20 is disposed between the light emitting element 10 and the processor 30 , and is electrically connected to the light emitting element 10 and the processor 30 .

The light receiving element 40 includes a light receiving surface 401 on which a hemispherical second light collecting portion 402 is formed. The second light collecting portion 402 is formed by dropping glue on the light receiving surface 401 . In other implementation manners, the second light concentrating portion 402 can also be obtained by molding, and then bonded to the light receiving surface 401 . The light receiving element 40 is a photodiode (photo diode, PD).

The second controller 50 is disposed between the light receiving element 40 and the memory 60 , and is electrically connected to the light receiving element 40 and the memory 60 .

The first covering element 70 covers the light emitting element 10 , the first controller 20 , the processor 30 , the light receiving element 40 , the second controller 50 , and the memory 60 . In this embodiment, the first covering element 70 is made of silicon material. The first covering element 70 includes a bearing surface 71 . The first covering element 70 defines two light through holes 710 penetrating through the carrying surface 71 corresponding to the first light concentrating portion 102 and the second light concentrating portion 402 respectively.

The planar optical waveguide 80 is disposed on the bearing surface 71 of the first cladding element 70 . The planar optical waveguide 80 defines two through holes 81 . The two through holes 81 communicate with a light through hole 710 respectively.

The two reflective elements are respectively a first reflective element 85 and a second reflective element 86 . Both the first reflective element 85 and the second reflective element 86 are accommodated in the through hole 81 , and are fixed on the supporting surface 71 of the first covering element 70 by glue 810 . The first reflective element 85 includes a first inclined surface 851 inclined relative to the supporting surface 71 . The second reflective element 86 includes a second inclined surface 861 inclined relative to the supporting surface 71 . The light emitting surface 101 of the light emitting element 10 faces the first slope 851 , and the first light collecting portion 102 is opposite to the first slope 851 . The central axis of the first light collecting portion 102 forms an angle of 45 degrees with the first slope 851 . The light receiving surface 401 of the light receiving element 40 faces the second slope 861 , and the second light collecting portion 402 is opposite to the second slope 861 . The central axis of the second light collecting portion 402 forms an angle of 45 degrees with the second slope 861 .

The optical communication device 100 further includes a transparent material 87 . The light-transmitting material 87 is filled in the two light-through holes 710 and the two through-holes 81 . In this embodiment, the light-transmitting material 87 is an optical fiber coating material.

The second covering element 90 covers the planar optical waveguide 80 , the first reflective element 85 , the second reflective element 86 and the light-transmitting material 87 . The second covering element 90 is glued to the first covering element 70 . In this embodiment, the second cladding element 90 is also made of silicon material.

When in use, the processor 30 sends an excitation signal to the first controller 20, and the first controller 20 generates a corresponding driving signal after receiving the excitation signal and controls the light-emitting element 10 to start from the light-emitting surface 101. glow. The light emitted by the light-emitting element 10 is converged by the first light-concentrating part 102 and then passes through the light-transmitting material 87 to the first slope 851, and then enters the planar optical waveguide 80. After the light waveguide 80 passes through the light-transmitting material 87, it is projected to the second inclined surface 861, and then reflected to the second light concentrating part 402 through the second inclined surface 861, and finally the second light concentrating part 402 converging and projecting the light receiving surface 401, the light receiving element 40 converts the light signal into an electrical signal and sends it to the second controller 50 for amplification processing, and the memory 60 stores the 50 processed electrical signals.

In other embodiments, the first light concentrating part 102 and the second light concentrating part 402 may not be provided.

Please refer to FIG. 2, which is a flow chart of the manufacturing method of the optical communication device 100, which includes the following steps:

Please refer to FIG. 3, S101: First, the first controller 20 is arranged between the light emitting element 10 and the processor 30, and is electrically connected to the light emitting element 10 and the processor 30, so The second controller 50 is disposed between the light receiving element 40 and the memory 60, and is electrically connected to the light receiving element 40 and the memory 60, and the first covering element 70 passes through Coating the light-emitting element 10, the first controller 20, the processor 30, the light-receiving element 40, the second controller 50, and the memory 60 by injection molding;

Please refer to FIG. 4, S102: the planar optical waveguide 80 is disposed on the bearing surface 71 of the first cladding element 70, and two through holes 81 are opened in the planar optical waveguide 80 by laser lift-off, and at the same time In the laser lift-off method, two light-through holes 710 penetrating through the bearing surface 71 are provided on the first cladding element 70 respectively, and the two light-through holes 710 correspond to the light-emitting surface 101 and the light-receiving surface 401 respectively;

Please refer to FIG. 5 , S103: accommodate the first reflective element 85 and the second reflective element 86 in the through hole 81 , and fix them on the supporting surface 71 of the first covering element 70 through glue 810 ;

Please refer to FIG. 6 , S104: fill the two through-holes 710 and the two through-holes 81 with a light-transmitting material 87 by means of injection molding;

S105: The second covering element 90 covers the planar optical waveguide 80, the first reflective element 85, the second reflective element 86, and the light-transmitting material 87 by injection molding. The covering element 90 is glued to the carrier surface 71 of the first covering element 70 .

Compared with the prior art, the first covering element covers the light emitting element, the first controller, the processor, the light receiving element, the second controller and the memory. The second cladding element covers the planar optical waveguide, the two reflective elements and the light-transmitting material, instead of providing an optical coupling housing that covers the light-emitting element and the light-receiving element respectively. Therefore, The optical communication device of the invention can greatly reduce the volume and is beneficial to miniaturization.

It can be understood that those skilled in the art can make various other corresponding changes and modifications according to the technical concept of the present invention, and all these changes and modifications should belong to the protection scope of the claims of the present invention.

Claims (10)

1. An optical communication device comprising a light emitting element, a first controller, a processor, a light receiving element, a second controller, a memory, and a planar optical waveguide, the first controller Electrically connected to the light-emitting element and the processor, the second controller is electrically connected to the light-receiving element and the memory, the light-emitting element includes a light-emitting surface, and the light-receiving element includes A light-receiving surface, characterized in that: the optical communication device further includes two reflective elements, a first covering element, a light-transmitting material, and a second covering element, and the first covering element covers the The light-emitting element, the first controller, the processor, the light-receiving element, the second controller, and the memory, the planar optical waveguide is arranged on the first cladding element, and the first cladding element corresponds to the The light-emitting surface and the light-receiving surface are respectively provided with two light-through holes, and the planar optical waveguide is respectively provided with two through-holes corresponding to the two light-through holes, and the two reflective elements are respectively accommodated in a In the through-hole, the light-transmitting material is filled in the light-through hole and the through-hole, and the second cladding element covers the planar light waveguide, the two reflective elements and the transparent light material. 2. The optical communication device according to claim 1, wherein the first covering element comprises a carrying surface for carrying the second covering element, and the carrying surface and the second covering The elements are glued together, and the two reflective elements are respectively a first reflective element and a second reflective element. Both the first reflective element and the second reflective element are accommodated in the through hole and are fixed on the through hole by colloid. The load-bearing surface of the first covering element. 3. The optical communication device according to claim 2, wherein a hemispherical first light-gathering portion is formed on the light-emitting surface, and a hemispherical second light-gathering portion is formed on the light-receiving surface, and the The first reflective element includes a first inclined surface inclined relative to the bearing surface, the second reflective element includes a second inclined surface inclined relative to the bearing surface, the light-emitting surface of the light emitting element faces the first inclined surface, The first light collecting part is directly opposite to the first slope, the light receiving surface of the light receiving element faces the second slope, and the second light collecting part is directly opposite to the second slope. 4. The optical communication device according to claim 3, characterized in that: the central axis of the first light concentrating part forms an angle of 45 degrees with the first slope, and the central axis of the second light concentrating part forms an angle with the first inclined plane. The second inclined plane forms an angle of 45 degrees. 5. The optical communication device according to claim 1, wherein the light-transmitting material is an optical fiber coating material. 6. The optical communication device as claimed in claim 1, wherein the light-emitting element is a laser diode, and the light-receiving element is a photodiode. 7. The optical communication device according to claim 1, wherein the first and second cladding elements are both made of silicon material. 8. A method of manufacturing an optical communication device according to any one of claims 1-7, comprising the following steps: The first controller is electrically connected to the light-emitting element and the processor, the second controller is electrically connected to the light-receiving element and the memory, and the first covering element Covering the light-emitting element, the first controller, the processor, the light-receiving element, the second controller, and the memory by injection molding; The planar optical waveguide is arranged on the first cladding element, two through holes are opened in the planar optical waveguide by laser lift-off, and two through holes are respectively opened in the first cladding element by laser lift-off. The light-through holes running through the bearing surface, the two light-through holes respectively correspond to the light-emitting surface and the light-receiving surface; accommodating both the first reflective element and the second reflective element in the through hole; filling the two through-holes and the two through-holes with a light-transmitting material by way of injection molding; The second cladding element covers the planar light waveguide, the first reflective element, the second reflective element and the light-transmitting material by injection molding, and the second cladding element and the The first covering element is fixedly connected. 9 . The manufacturing method of the optical communication device according to claim 8 , wherein the first reflective element and the second reflective element are fixed on the bearing surface of the first covering element by glue. 10 . 10 . The manufacturing method of an optical communication device according to claim 8 , wherein the second covering element is fixedly connected to the first covering element by gluing. 11 .