CN104031588A - Glue bonding material and preparation method thereof - Google Patents

Abstract

The invention discloses a glue bonding material and a preparation method thereof. The glue bonding material comprises the following components in parts by weight: 20-50 parts of alicyclic epoxy resin, 20-50 parts of polyurethane acrylate, 5-15 parts of acrylate diluter, 5-15 parts of vinyl ether diluter, 5-15 parts of adhesion promoter and 2.5-3 parts of photoinitiator. The glue bonding material can simultaneously be subjected to free radical-cationic polymerization mixed curing; since the polyurethane acrylate polymer has sufficient flexibility, the epoxy resin has sufficient hardness, and the diluter or polyester molecule is grafted in the middle of the two main resins to perform the functions of prolonging chain segment and buffering, thereby ensuring the glue bonding material to have the advantages of favorable flexibility, low tendency to cracking or embrittlement and short curing time. The invention also discloses a preparation method of the glue bonding material.

Description

Adhesive material and its preparation method

technical field

The invention relates to the field of electronic packaging materials, in particular to an adhesive bonding material and a preparation method thereof.

Background technique

In the field of electronic packaging, commonly used adhesive bonding materials are solvent-based products, and are divided into one-component bonding materials and two-component bonding materials. However, the one-component adhesive material may be stimulated by external conditions of heat and light during storage to produce a gel phenomenon. For two-component adhesive bonding materials, accurate volume or weight ratios and mixing and stirring operations are required before glue application, and there will also be problems with air bubbles. Therefore, there is an optional curing time for two-component adhesive bonding materials. The problem.

In general, photothermal curing adhesive materials are generally single-component, and the curing time is much shorter than that of common heat-curing adhesives. It only takes a few minutes or even more than ten seconds to achieve complete curing, and there is no For the ratio problem, it only needs to be stored away from light. Therefore, the photothermal curing adhesive bonding material is more suitable for large-scale electronic packaging automatic production lines.

There are two types of photothermal curing adhesive materials in the curing process: free radical polymerization and cationic polymerization. The reaction speed of free radical polymerization is faster than that of cationic polymerization, but it is easy to embrittle and crack. The volume shrinkage produced by cationic polymerization is small, and it is not easy to crack, but its curing time is longer. In the field of high-end electronic packaging, the volume shrinkage, chemical solvent resistance, moisture resistance and high and low temperature alternating resistance of adhesive bonding materials have a significant impact on the service life and stability of electronic devices.

Contents of the invention

Based on this, it is necessary to provide an adhesive bonding material with a short curing time and not easy to crack and a preparation method thereof.

A kind of adhesive bonding material, by weight, comprises the following components:

20-50 parts of cycloaliphatic epoxy resin, 20-50 parts of polyurethane acrylate, 5-15 parts of acrylate diluent, 5-15 parts of vinyl ether diluent, 5-15 parts of adhesion promoter and photoinitiator 2.5-3 servings.

In one embodiment, the following components are included:

30-35 parts of cycloaliphatic epoxy resin, 30-35 parts of polyurethane acrylate, 8-10 parts of acrylate thinner, 8-10 parts of vinyl ether thinner, 9-12 parts of adhesion promoter and photoinitiator 3 copies. In one embodiment, the cycloaliphatic epoxy resin is selected from at least one of CY184 epoxy resin, CY179 epoxy resin and CY178 epoxy resin.

In one embodiment, the urethane acrylate is selected from at least one of CN966 urethane acrylate, CN965 urethane acrylate and CN9893 urethane acrylate.

In one embodiment, the adhesion promoter is selected from at least one of CN9010 adhesion promoter, CN704 adhesion promoter, CN710 adhesion promoter, SP270 adhesion promoter and SP271 adhesion promoter.

In one of the embodiments, the photoinitiator includes a free radical photoinitiator and a cationic photoinitiator, and the free radical photoinitiator is selected from 2-hydroxyl-2-methyl-1-phenylacetone, 1- Hydroxycyclohexyl phenyl ketone, 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio)phenyl]-1-propanone, 2-dimethylamino-2-benzyl Base-1-[4-(4-morpholinyl)phenyl]-1-butanone, 1-hydroxycyclohexyl phenyl ketone, 1-p-morpholinyl-2-dimethylamino-2- One of benzyl-1-butanone, 2-methyl-1-4-(methyl sulfide) phenyl-2-morpholine-propyl-2-ketone, the cationic photoinitiator is selected from 10 -(4-biphenyl)-2-isopropylthioxanthone hexafluorophosphate, 4,4'-dimethyldiphenyliodonium hexafluorophosphate and triarylsulfonium hexafluorophosphate A sort of.

In one embodiment, the acrylate diluent is selected from at least one of hydroxyethyl methacrylate, isobornyl methacrylate, 1,6-hexanediol diacrylate and tripropylene glycol diacrylate kind.

In one embodiment, the vinyl ether diluent is selected from at least one of triethylene glycol divinyl ether and 1,4-cyclohexyldimethanol divinyl ether.

The preparation method of above-mentioned adhesive bonding material, comprises the following steps:

In parts by weight, mix 5-15 parts of acrylate diluent, 5-15 parts of vinyl ether diluent and 2.5-3 parts of photoinitiator, stir and dissolve to obtain solution A;

In parts by weight, respectively add 20-50 parts of cycloaliphatic epoxy resin, 20-50 parts of polyurethane acrylate and 5-15 parts of adhesion promoter into the solution A, stir to obtain solution B;

The adhesive bonding material is obtained after vacuum defoaming the solution B.

In one of the embodiments, the specific operation of solution B vacuum defoaming treatment is:

The solution B is placed in a vacuum defoaming machine, the air pressure is set to be less than or equal to zero, and the defoaming time is 20 minutes to complete the vacuum defoaming treatment.

The photocuring reaction is a free radical and cationic reaction that occurs under ultraviolet light irradiation. As the photocuring progresses, the degree of polymerization of the molecular chains produced by the polymerization reaction becomes larger and larger, and the movement of the polymerized molecules is restricted, so the end of the photocuring reaction is still There will be some active groups, and under heating conditions, these active groups can promote polycondensation or ring-opening reactions between macromolecules to achieve 100% cross-linking polymerization and curing reactions.

The above-mentioned adhesive bonding material, under the irradiation of ultraviolet light, the C=C double bond of polyurethane acrylate and acrylate diluent undergoes free radical polymerization reaction under the action of photoinitiator, and the epoxy group of cycloaliphatic epoxy resin Cationic polymerization reaction with the C=C double bond of vinyl ether-based diluent; Diluents, polymers or adhesion promoters containing hydroxyl groups and amine groups at the end can react with epoxy groups on epoxy resins under heating Ring-opening addition reaction. Therefore, the above-mentioned adhesive bonding materials can undergo free radical-cationic polymerization hybrid curing at the same time. Since the polyurethane acrylate polymer has sufficient flexibility and the epoxy resin has sufficient hardness, diluent or polyester molecules are grafted between the two types of main resins. , play the role of extending the chain segment and excessive buffering, so as to ensure that the adhesive bonding material has good flexibility and is not easy to crack or embrittle.

Since free radical photocuring can be completed in tens of seconds, cationic photocuring can be completed in a few minutes, heating and curing is only a synergistic effect, and can be carried out simultaneously with light. Therefore, the curing time of the above-mentioned adhesive bonding material is very short.

Description of drawings

Fig. 1 is a flowchart of a method for preparing an adhesive bonding material according to an embodiment of the present invention.

Detailed ways

In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

The adhesive bonding material of one embodiment, by weight percentage, comprises the following components:

20-50 parts of cycloaliphatic epoxy resin, 20-50 parts of polyurethane acrylate, 5-15 parts of acrylate diluent, 5-15 parts of vinyl ether diluent, 5-15 parts of adhesion promoter and photoinitiator 2.5-3 servings.

Here, the alicyclic epoxy resin, that is, an epoxidized alicyclic olefin compound, refers to a low-molecular compound containing two alicyclic epoxy groups. The molecular structure of cycloaliphatic epoxy resin contains an alicyclic ring, and the epoxy group is directly connected to the alicyclic ring. In one embodiment, the cycloaliphatic epoxy resin is selected from one or both of CY184 epoxy resin, CY179 epoxy resin and CY178 epoxy resin.

Urethane acrylates with acrylic functional groups and urethane linkages in the molecule. In one embodiment, the urethane acrylate is selected from one or both of CN966 urethane acrylate, CN965 urethane acrylate and CN9893 urethane acrylate.

Acrylate diluents mainly refer to small organic molecules containing C=C unsaturated double bonds. They not only dissolve and dilute the resin, adjust the viscosity of the system, but also can interact with the C=C on the polyurethane acrylate resin or on the product during the polymerization process. The double bond undergoes polycondensation reaction and forms part of the cross-linked segment. In one embodiment, the acrylate diluent is at least one selected from hydroxyethyl methacrylate, isobornyl methacrylate, 1,6-hexanediol diacrylate and tripropylene glycol diacrylate. Hydroxyethyl methacrylate (HEMA) is a monofunctional reactive diluent, that is, each molecule contains only one active group that can participate in the curing reaction. 1,6-Hexanediol diacrylate (HDDA) is a difunctional reactive diluent, each molecule contains two active groups that can participate in the curing reaction, the use of difunctional reactive diluent can not only increase the reactivity, but also It can impart a cross-linked structure to the adhesive bonding material.

Vinyl ether diluent, the double bond in the vinyl ether monomer is affected by the adjacent oxygen atom, which is an electron-rich double bond, which can form a stable carbocation, so cationic polymerization is easy to occur. At the same time, vinyl ether monomers can also undergo free radical polymerization under certain conditions, such as forming charge transfer complexes with electron-deficient double bonds. Vinyl ether monomers are particularly suitable for cationic polymerization initiated by onium salts or radiation. In one embodiment, the vinyl ether diluent is selected from at least one of triethylene glycol divinyl ether and 1,4-cyclohexyldimethanol divinyl ether.

The photocuring activity of acryloxy group in acrylate diluent is better than that of vinyl group in vinyl ether diluent. Acrylic diluents can undergo free radical polymerization with urethane acrylates much faster than cationic polymerization. Vinyl ether diluents are amphoteric diluents that can undergo ring-opening reactions with alicyclic epoxy resins. Adding acrylate diluent and vinyl ether diluent at the same time can reduce the viscosity of the resin, increase the reaction speed, increase the length and flexibility of the polymerized molecular chain, and play a wetting role.

Adhesion promoters are used to improve the adhesion between adhesive bonding materials and substrates. In one embodiment, the adhesion promoter is selected from one or both of CN9010 adhesion promoter, CN704 adhesion promoter, CN710 adhesion promoter, SP270 adhesion promoter and SP271 adhesion promoter. CN9010 adhesion promoter is hexafunctional polyurethane acrylate. CN704 adhesion promoter and CN710 adhesion promoter are polyester acrylates. SP270 and SP271 are low viscosity polymers of polyester acrylate.

Photoinitiators, also known as photosensitizers or photocuring agents, are a type of compound that can absorb energy of a certain wavelength in the ultraviolet or visible light region to generate free radicals, cations, etc., thereby initiating monomer polymerization, crosslinking and curing. In one embodiment, the photoinitiator includes a free radical photoinitiator and a cationic photoinitiator, and the free radical photoinitiator is selected from 2-hydroxyl-2-methyl-1-phenylacetone, 1-hydroxycyclohexylphenyl Methanone, 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio)phenyl]-1-propanone, 2-dimethylamino-2-benzyl-1-[ 4-(4-morpholinyl)phenyl]-1-butanone, 1-hydroxycyclohexyl phenyl ketone, 1-p-morpholinyl-2-dimethylamino-2-benzyl-1- One of butanone and 2-methyl-1-4-(methylsulfide)phenyl-2-morpholin-propyl-2-one; the cationic photoinitiator is selected from 10-(4-biphenyl )-One of 2-isopropylthioxanthone hexafluorophosphate, 4,4'-dimethyldiphenyliodonium hexafluorophosphate and triarylsulfonium hexafluorophosphate. That is, the free radical photoinitiator and the free radical photoinitiator are added at the same time to realize the free radical and cationic reactions of the adhesive bonding material at the same time. Among them, 1-hydroxycyclohexyl phenyl ketone (HCPK) is an α-hydroxyalkyl phenone photoinitiator, which has excellent stability and good yellowing resistance. 1-p-morpholinephenyl-2-dimethylamino-2-benzyl-1-butanone (BDMB) and 2-methyl-1-4-(methylsulfide)phenyl-2-morpholine- Propyl-2-ketone (MMMP) is an α-aminoalkylphenone photoinitiator with high activity and higher initiation efficiency. At the same time, two types of photoinitiators are added, one is to initiate free radical curing, and the other is to initiate cationic curing. The adhesive bonding material can undergo free radical polymerization and cationic polymerization at the same time. And as the polymerization reaction continues, active groups such as hydroxyl groups, carbon-carbon double bonds, epoxy groups, and amino groups in macromolecular cationic polymerization products, free radical polymerization products, and small molecule diluents will react with initiators and heat. Polycondensation or addition crosslinking reaction occurs under the environment, forming a polymeric network with interlaced soft segments and hard segments, so the cured layer exhibits good flexibility and high and low temperature resistance.

As shown in Figure 1, the preparation method of above-mentioned adhesive bonding material comprises the following steps:

In step S110, by weight, 5-15 parts of acrylate diluent, 5-15 parts of vinyl ether diluent and 2.5-3 parts of photoinitiator are mixed, stirred, and dissolved to obtain solution A. Wherein, the stirring speed is 200r/min. In one embodiment, two different photoinitiators are contained in the adhesive bonding material. When preparing, firstly, the acrylate diluent and a photoinitiator are mixed and dissolved, and then the vinyl ether diluent and the photoinitiator are added to the solution. Another photoinitiator, stirred to obtain solution A.

Step S120, adding 20-50 parts of cycloaliphatic epoxy resin, 20-50 parts of urethane acrylate and 5-15 parts of adhesion promoter to solution A in parts by weight, and stirring to obtain solution B . In one embodiment, the stirring speed is increased from 200r/min to 600r/min. After the alicyclic epoxy resin, polyurethane acrylate and adhesion promoter are uniformly dispersed in solution A, stir for another 1 hour to obtain a solution b.

Step S130, vacuum degassing the solution B to obtain the adhesive bonding material. In one embodiment, the specific operation of the vacuum defoaming treatment of the solution B is as follows: the solution B is placed in a vacuum defoaming machine, the air pressure is set to zero, and the defoaming time is 20 minutes. After the defoaming is completed, put the glue into a brown or black plastic bottle.

The adhesive bonding material will be further described with specific examples below.

Example 1

The composition of a kind of adhesive bonding material is as shown in table 1:

The composition of the adhesive bonding material of table 1 embodiment 1

The preparation method of above-mentioned adhesive bonding material is as follows:

According to the weight percentages of the components in Table 1, firstly, hydroxyethyl methacrylate and 2-hydroxy-2-methyl-1-phenylacetone were stirred at a stirring speed of 200r/min, dissolved, and then successively dissolved in the above solution Triethylene glycol divinyl ether group and 10-(4-biphenyl)-2-isopropylthioxanthone hexafluorophosphate were added, and the stirring speed and stirring time were 200 r/min and 30 minutes, respectively, to obtain solution A.

Then add CY184, CN966 and CN704 to solution A respectively, and increase the stirring speed to 600r/min at this time. After the above polymer is uniformly dispersed in the solution, stir for 1 hour to obtain solution B.

Finally, put the solution B in a vacuum defoaming machine, the air pressure is zero, and the defoaming time is 20 minutes, and then put the glue into a brown or black plastic bottle.

Example 2

The composition of a kind of adhesive bonding material is as shown in table 2:

The composition of the adhesive bonding material of table 2 embodiment 2

Substance name parts by weight CY184 12.0 CY179 23.0 CN9893 30.0 CN704 12.0 1,6-Hexanediol diacrylate 5.0 Isobornyl Methacrylate 5.0 1,4-Cyclohexyldimethanol divinyl ether 10.0 1-Hydroxycyclohexyl phenyl ketone 1.6 Triarylsulfonium hexafluorophosphate 1.4

The preparation method of above-mentioned adhesive bonding material is as follows:

According to the percentage by weight of each composition in Table 2, at first 1,6-hexanediol diacrylate, isobornyl methacrylate and 1-hydroxycyclohexyl phenyl ketone were stirred, and the stirring speed was 200r/min, dissolved, Then, 1,4-cyclohexyldimethanol divinyl ether and triarylsulfonium hexafluorophosphate were successively added to the above solution, and the stirring speed and stirring time were 200 r/min and 30 minutes respectively, to obtain solution A.

Then increase the stirring speed to 600r/min, add CY184, CY179, CN9893 and CN704 to solution A respectively, after the above polymers are uniformly dispersed in the solution, stir for 1 hour to obtain solution B.

Finally, put the solution B in a vacuum defoaming machine, the air pressure is zero, and the defoaming time is 20 minutes, and then put the glue into a brown or black plastic bottle.

Example 3

The composition of a kind of adhesive bonding material is as shown in table 3:

The composition of the adhesive bonding material of table 3 embodiment 3

The preparation method of above-mentioned adhesive bonding material is as follows:

According to the weight percent of each composition in Table 3, at first tripropylene glycol diacrylate and 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio)phenyl]-1- Stir with acetone, the stirring speed is 200r/min, dissolve, then add triethylene glycol divinyl ether group and triaryl hexafluorosulfonium hexafluorophosphate successively in the above solution, the stirring speed and stirring time are respectively 200r/min and 30 minutes, Solution A is obtained.

Then increase the stirring speed to 600r/min, add appropriate amount of CY179, CN966, CN9893 and CN704 to solution A respectively, after the above polymers are uniformly dispersed in the solution, stir for 1 hour to obtain solution B.

Finally, put the solution B in a vacuum defoaming machine, the air pressure is zero, and the defoaming time is 20 minutes, and then put the glue into a brown or black plastic bottle.

Example 4

The composition of a kind of adhesive bonding material is as shown in table 4:

The composition of the adhesive bonding material of table 4 embodiment 4

Substance name parts by weight CY179 50.0 CN965 12.0 CN9893 10.0 CN710 10.0 Isobornyl Methacrylate 7.0 Triethylene glycol divinyl ether 8.0 2-Hydroxy-2-methyl-1-phenylacetone 1.4 4,4'-Dimethyldiphenyliodonium hexafluorophosphate 1.6

The preparation method of above-mentioned adhesive bonding material is as follows:

According to the percentage by weight of each component in Table 4, first, stir isobornyl methacrylate and 2-hydroxyl-2-methyl-1-phenylacetone at a stirring speed of 200r/min, dissolve, and then successively dissolve in the above solution Triethylene glycol divinyl ether group and 4,4'-dimethyldiphenyliodonium hexafluorophosphate were added, and the stirring speed and stirring time were 200 r/min and 30 minutes, respectively, to obtain solution A.

Then increase the stirring speed to 600r/min, add appropriate amount of CY179, CN965, CN9893 and CN710 to solution A respectively, after the above polymers are uniformly dispersed in the solution, stir for 1 hour to obtain solution B.

Finally, put the solution B in a vacuum defoaming machine, the air pressure is zero, and the defoaming time is 20 minutes, and then put the glue into a brown or black plastic bottle.

Example 5

The composition of a kind of adhesive bonding material is as shown in table 5:

The composition of the adhesive bonding material of table 5 embodiment 5

The preparation method of above-mentioned adhesive bonding material is as follows:

According to the percentage by weight of each component in Table 5, at first, hydroxyethyl methacrylate and HCPK were stirred, and the stirring speed was 200r/min, and dissolved, and then successively added triethylene glycol divinyl ether group and 4,4 '-Dimethyldiphenyliodonium hexafluorophosphate, the stirring speed and stirring time were 200r/min and 30 minutes, respectively, to obtain solution A.

Then increase the stirring speed to 600r/min, add CY179, CN965, CN9893 and CN710 to solution A respectively, after the above polymers are uniformly dispersed in the solution, stir for 1 hour to obtain solution B.

Finally, put the solution B in a vacuum defoaming machine, the air pressure is zero, and the defoaming time is 20 minutes, and then put the glue into a brown or black plastic bottle.

Example 6

The composition of a kind of adhesive bonding material is as shown in table 6:

The composition of the adhesive bonding material of table 6 embodiment 6

The preparation method of above-mentioned adhesive bonding material is as follows:

According to the percentage by weight of each composition in Table 6, at first 1,6-hexanediol diacrylate and 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl)phenyl]- Stir 1-butanone at a stirring speed of 200r/min, dissolve, and then add an appropriate amount of 1,4-cyclohexyldimethanol divinyl ether and 10-(4-biphenyl)-2-isopropyl to the above solution Thioxanthone hexafluorophosphate, stirring speed and stirring time were 200r/min and 30 minutes, respectively, to obtain solution A.

Then increase the stirring speed to 600r/min, add appropriate amount of CY179, CN966, CN9893, CN9010 and CN704 to solution A respectively, after the above polymers are uniformly dispersed in the solution, stir for 1 hour to obtain solution B.

Finally, put the solution B in a vacuum defoaming machine, the air pressure is zero, and the defoaming time is 20 minutes, and then put the glue into a brown or black plastic bottle.

Example 7

The composition of a kind of adhesive bonding material is as shown in table 7:

The composition of the adhesive bonding material of table 7 embodiment 7

The preparation method of above-mentioned adhesive bonding material is as follows:

According to the weight percentages of the ingredients in Table 7, firstly stir hydroxyethyl methacrylate, tripropylene glycol diacrylate and BDMB at a stirring speed of 200r/min, dissolve, and then add triethylene glycol diethylene successively to the above solution Ether group and 10-(4-biphenyl)-2-isopropylthioxanthone hexafluorophosphate, the stirring speed and stirring time were 200r/min and 30 minutes, respectively, to obtain solution A.

Then increase the stirring speed to 600r/min, add appropriate amount of CY179, CY178, CN965, CN9893, SPF270 and CN9010 to solution A respectively, after the above polymers are uniformly dispersed in the solution, stir for 1 hour to obtain solution B.

Finally, put the solution B in a vacuum defoaming machine, the air pressure is zero, and the defoaming time is 20 minutes, and then put the glue into a brown or black plastic bottle.

Example 8

The composition of a kind of adhesive bonding material is as shown in table 8:

The composition of the adhesive bonding material of table 8 embodiment 8

Substance name parts by weight CY179 35.0 CY184 15.0 CN966 12.0 CN9893 10.3 SP271 5.0 Hydroxyethyl methacrylate 5.0 Triethylene glycol divinyl ether 15.0 MMMP 1.2 Triarylsulfonium hexafluorophosphate 1.5

The preparation method of above-mentioned adhesive bonding material is as follows:

According to the weight percentages of the components in Table 8, firstly stir the hydroxyethyl methacrylate and MMMP at a stirring speed of 200r/min, dissolve, and then add triethylene glycol divinyl ether group and triarylhexa For sulfonium fluorophosphate, the stirring speed and stirring time were 200r/min and 30 minutes, respectively, to obtain solution A.

Then increase the stirring speed to 600r/min, add CY179, CY184, CN966, CN9893 and SPF271 to solution A respectively, after the above polymers are uniformly dispersed in the solution, stir for 1 hour to obtain solution B.

Finally, put the solution B in a vacuum defoaming machine, the air pressure is zero, and the defoaming time is 20 minutes, and then put the glue into a brown or black plastic bottle.

The above-mentioned embodiments only express several preferred implementation modes of the present invention, and the description thereof is relatively specific and detailed, but should not be construed as limiting the patent scope of the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention, as well as several deformations and changes made without departing from the concept of the present invention, shall be included within the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (10)

1. an adhesive bonding material, is characterized in that, by weight, comprises following component: 20-50 parts of cycloaliphatic epoxy resin, 20-50 parts of polyurethane acrylate, 5-15 parts of acrylate diluent, 5-15 parts of vinyl ether diluent, 5-15 parts of adhesion promoter and photoinitiator 2.5-3 servings. 2. The adhesive bonding material according to claim 1, characterized in that, comprising the following components: 30-35 parts of cycloaliphatic epoxy resin, 30-35 parts of polyurethane acrylate, 8-10 parts of acrylate thinner, 8-10 parts of vinyl ether thinner, 9-12 parts of adhesion promoter and photoinitiator 3 copies. 3. The adhesive bonding material according to claim 1, wherein the cycloaliphatic epoxy resin is selected from at least one of CY184 epoxy resin, CY179 epoxy resin and CY178 epoxy resin. 4. The adhesive bonding material according to claim 1, wherein the urethane acrylate is selected from at least one of CN966 urethane acrylate, CN965 urethane acrylate and CN9893 urethane acrylate. 5. adhesive bonding material according to claim 1, is characterized in that, described adhesion promoter is selected from CN9010 adhesion promoter, CN704 adhesion promoter, CN710 adhesion promoter, SP270 adhesion promoter and At least one of the SP271 adhesion promoters. 6. The adhesive bonding material according to claim 1, wherein the photoinitiator comprises a free radical photoinitiator and a cationic photoinitiator, and the free radical photoinitiator is selected from 2-hydroxyl-2- Methyl-1-phenylacetone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio)phenyl]-1- Acetone, 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone, 1-hydroxycyclohexyl phenyl ketone, 1-p-morpholine benzene One of -2-dimethylamino-2-benzyl-1-butanone and 2-methyl-1-4-(methylsulfide)phenyl-2-morpholine-propyl-2-one The cationic photoinitiator is selected from 10-(4-biphenyl)-2-isopropylthioxanthone hexafluorophosphate, 4,4'-dimethyldiphenyliodonium hexafluorophosphate and one of triarylsulfonium hexafluorophosphates. 7. adhesive bonding material according to claim 1, is characterized in that, described acrylate diluent is selected from hydroxyethyl methacrylate, isobornyl methacrylate, 1,6-hexanediol diacrylate and at least one of tripropylene glycol diacrylate. 8. The adhesive bonding material according to any one of claims 1-7, wherein the vinyl ether diluent is selected from triethylene glycol divinyl ether group and 1,4-cyclohexyl dimethanol dimethanol at least one of vinyl ethers. 9. A preparation method of adhesive bonding material, is characterized in that, comprises the following steps: In parts by weight, mix 5-15 parts of acrylate diluent, 5-15 parts of vinyl ether diluent and 2.5-3 parts of photoinitiator, stir and dissolve to obtain solution A; In parts by weight, respectively add 20-50 parts of cycloaliphatic epoxy resin, 20-50 parts of polyurethane acrylate and 5-15 parts of adhesion promoter into the solution A, stir to obtain solution B; The adhesive bonding material is obtained after vacuum defoaming the solution B. 10. The preparation method of adhesive bonding material according to claim 9, is characterized in that, the concrete operation of described solution B vacuum defoaming process is: The solution B is placed in a vacuum defoaming machine, the air pressure is set to be less than or equal to zero, and the defoaming time is 20 minutes to complete the vacuum defoaming treatment.