CN104022749B - Lamination sheet type electromagnetic interface filter - Google Patents
Lamination sheet type electromagnetic interface filter Download PDFInfo
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- CN104022749B CN104022749B CN201310066395.0A CN201310066395A CN104022749B CN 104022749 B CN104022749 B CN 104022749B CN 201310066395 A CN201310066395 A CN 201310066395A CN 104022749 B CN104022749 B CN 104022749B
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- 238000003475 lamination Methods 0.000 title claims abstract description 21
- 239000000919 ceramic Substances 0.000 claims abstract description 117
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 100
- 239000003990 capacitor Substances 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 238000003780 insertion Methods 0.000 abstract description 7
- 230000037431 insertion Effects 0.000 abstract description 7
- 239000000203 mixture Substances 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229910052573 porcelain Inorganic materials 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
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Abstract
The present invention relates to the technical field of wave filter, disclose lamination sheet type electromagnetic interface filter, including main structure body, the main structure body includes the electronic component that multilayer is sequentially laminated, electronic component described in multilayer includes the first ferrite inductance being electrically connected with external input lines, first ceramic inductance, ceramic condenser, second ceramic inductance and the second ferrite inductance being electrically connected with outside output line, the ceramic condenser includes the first capacitance electrode and the second capacitance electrode being electrically connected with external ground line, first ferrite inductance, first ceramic inductance, first capacitance electrode, second ceramic inductance and the second ferrite inductance sequentially electrical series, the upper and lower side of the main structure body is stacked with lid and ferrite lower cover on ferrite respectively.Lamination sheet type electromagnetic interface filter in the present invention is provided with two groups of ferrite inductances for intermediate-freuqncy signal noise is lost, the lc circuit of two groups of ceramic inductances and ceramic condenser composition is used for that high-frequency signal noise is lost, on the basis of component size miniaturization, the insertion loss demand of intermediate frequency and high frequency can be met.
Description
Technical field
The present invention relates to the technical field of electromagnetic interface filter, more particularly to lamination sheet type electromagnetic interface filter.
Background technology
With the development of electronic technology, increasing electronic equipment is appeared in the environment of people's life production.Big number
The electronic equipment of amount can produce high density, the electromagnetic signal of wide spectrum at work, form complicated electromagnetic environment.And complexity
Electromagnetic environment requirements electronic equipment and power supply have Electro Magnetic Compatibility higher, and then the technology of suppression electromagnetic interference is also increasingly
Paid attention to.
Plate type EMI filter is the composition element for being usually used in suppressing electromagnetic noise at present.It can effectively shield electromagnetism
Interference, improves the antijamming capability and system reliability of electronic equipment.
Plate type EMI filter of the prior art is mainly integrated by inductance and electric capacity and constitutes LC filter circuits.Collection
Into mode can be divided into packaging structure and cofired materials type structure.Packaging structure is typically embedded in by ferrite inductance pedestal
Individually ceramic laminated electric capacity is constituted, or is constituted for ceramic condenser and inductance are encapsulated in sealing space simultaneously.And lamination is common
Burning type structure is main to be made up of setting inductive circuit and setting condenser network, and its matrix is generally ceramics.
The advantage of the electromagnetic interface filter of packaging structure is can to provide capacitance and preferable magnetic shield property higher,
But its high frequency characteristics is general, and component size is larger.The advantage of the electromagnetic interface filter of cofired materials type is to be obtained in that high frequency
（GHz magnitudes) insertion loss excellent miniaturized element, but its intermediate frequency state（100MHz magnitudes）Insertion loss it is limited,
And without magnetic shield property, particularly make electromagnetic radiation external during high inductance LC combinational circuits larger.
The content of the invention
It is an object of the invention to provide lamination sheet type electromagnetic interface filter, it is intended to solve sheet EMI filtering of the prior art
Body accumulates excessive, unshielded characteristic and cannot simultaneously meet the problem of the preferable characteristic of medium-high frequency.
The present invention is achieved in that lamination sheet type electromagnetic interface filter, including main structure body, and the main structure body includes many
The electronic component that layer is sequentially laminated, electronic component described in multilayer includes the first ferrite electricity being electrically connected with external input lines
Sense, the first ceramic inductance, ceramic condenser, the second ceramic inductance and the second ferrite inductance being electrically connected with outside output line,
The ceramic condenser includes the first capacitance electrode and the second capacitance electrode being electrically connected with external ground line, the first iron oxygen
Body inductance, the first ceramic inductance, the first capacitance electrode, the second ceramic inductance and the second ferrite inductance sequentially electrical series,
The upper and lower side of the main structure body is stacked with lid and ferrite lower cover on ferrite respectively.
Two ferrite inductances of the lamination sheet type electromagnetic interface filter in the present invention can be as input/output terminal, when low frequency can
With signal from ferrite inductance flow into when, due to two groups of ferrites, ceramic inductance, in low frequency, impedance is very low, and low frequency will not be believed
Number cause decay.When mid-frequency noise (30MHz~1GHz) signal passes through wave filter, ferrite inductance has larger impedance, from
And the enough decay to the formation of noise.When high-frequency noise (1GHz~5GHz) signal passes through wave filter, although ferrite electricity
The impedance reduction of sense, but ceramic inductance starts the insertion enough to the formation of noise with the high frequency lc circuit of ceramic condenser composition to be damaged
Consumption.Compared with prior art, present invention employs laminated construction, miniaturization of components is both can guarantee that, intermediate frequency insertion can be met again and is damaged
The requirement of consumption and high frequency insertion loss.
Brief description of the drawings
Fig. 1 is the exploded isometric schematic diagram of lamination sheet type electromagnetic interface filter provided in an embodiment of the present invention;
Fig. 2 is the schematic front view of capacitor dielectric layer provided in an embodiment of the present invention；
Fig. 3 is the schematic front view of the first ferrite inductance provided in an embodiment of the present invention；
Fig. 4 is the schematic front view of the first ceramic inductance provided in an embodiment of the present invention.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
As shown in Fig. 1 ~ 4, for the preferred embodiment that the present invention is provided.
As shown in figure 1, the lamination sheet type electromagnetic interface filter 1 in the present invention, including main structure body, the main structure body includes many
The electronic component that layer is sequentially stacked, electronic component described in the multilayer includes the first ferrite electricity being electrically connected with external input lines
The 12, first ceramic inductance 13 of sense and ceramic condenser 14, second ceramic inductance 15 and defeated with outside of the connection of external ground line electric wire
Outlet be electrically connected with the second ferrite inductance 16, first ferrite inductance 12, the first ceramic inductance 13, ceramic condenser 14,
Second ceramic inductance 15 and the second ferrite inductance 16 sequentially arranged stacked, and sequentially electrical series.Ceramic condenser 14 includes
First capacitance electrode 143 and the second capacitance electrode 141 being electrically connected with external ground line, second capacitance electrode 141 and the
One capacitance electrode 143 sequentially arranged stacked.The upper and lower side of main structure body is stacked with lid 11 and ferrite lower cover on ferrite respectively
17。
First ferrite inductance 12 and the second ferrite inductance 16 can be used as signal input output ends, two groups of ferrite electricity
Sense effectively can decay to mid-frequency noise (30MHz~1GHz) signal.Ceramic condenser 14 and two groups of ceramic inductance compositions
Lc circuit effectively high-frequency noise (1GHz~5GHz) signal can be decayed, give up ripple pass through the second capacitance electrode 141
Filter out.So both can guarantee that intermediate frequency inserted the loss of signal, can guarantee that high frequency inserted the loss of signal again.Meanwhile, whole frequency
During section work, the internal integrated filter circuit of upper lid 11 and lower cover 17 pairs of wave filter 1 forms effective magnetic screening action, it is ensured that
Internal circuit is not disturbed by external electromagnetic radiation, while also ensure that wave filter 1 does not produce new external electromagnetic radiation.This
The stepped construction for using is invented, electronic component structure is small, save space.
Capacitor dielectric layer 142 is provided between first capacitance electrode 143 and the second capacitance electrode 141, capacitor dielectric layer 142 is
High permittivity ceramic medium layer, refers to the dielectric layer being made of dielectric constant ceramic material higher, can improve capacitance, and it is right to increase
The loss ability of high-frequency signal.
As shown in Fig. 2 offering the through hole 1422 of first through hole 1421 and second, the first through hole in capacitor dielectric layer 142
1421 and second through hole 1422 through capacitor dielectric layer 142.After multilayer electronic component is stacked together, the first ceramic inductance 13
Any one hole being placed in the two holes with the coil one end on the first capacitance electrode 143 simultaneously at, can directly contact completion
Electrical connection.
High permittivity ceramic medium is directly laminated with low permittivity ceramic medium, is easily produced and is burnt unmatched phenomenon altogether, so as to influence
The stability of whole component structure.How high permittivity ceramic medium, low permittivity ceramic medium to be set simultaneously simultaneously in laminated filter
And ensure that it is an insoluble problem to burn stability altogether.The capacitor dielectric layer 142 of high-permitivity ceramics is inserted in the present embodiment
Between the second capacitance electrode 141 and the first capacitance electrode 143, not with adjacent low permittivity ceramic dielectric layer directly contact.So
Both high capacitance is can guarantee that, increase of the low permittivity ceramic directly in conjunction with face is in turn ensure that, the co-fire match characteristic of integral member is promoted.
Reference picture 4, the first ceramic inductance 13 includes the first medium layer 130 that multilayer is sequentially laminated, each first medium layer 130
On be provided with the first ceramic inductance coil 131, and first medium layer 130 is provided with third through-hole 132, the third through-hole 130 with
One end alignment of the first ceramic inductance coil 131 thereon, so, is easy to the first pottery on two adjacent first medium layers 130
Porcelain inductance coil 131 is electrically connected with by third through-hole 130.So, the first ceramic inductance of multilayer coil 131 is sequentially connected, according to
Sequence is electrically connected in series.
After multilayer electronic component is stacked together, one end of the first ceramic inductance coil 131 of the first ceramic inductance 13
Can be electrically connected by the through hole 1422 of first through hole 1421 or second and the electronic component of lower floor.
In the present embodiment, the opposed of the first ceramic inductance coil 131 on adjacent first medium layer 130, so that, the
Three through holes 132 are also to be reversed, and are electrically connected so as to realize that the first ceramic inductance coil 131 that multilayer is sequentially arranged sequentially is connected
Connect.Certainly, the arrangement is not unique, and the deployment scenarios according to the ceramic inductance coil 131 of third through-hole 132 and first are not
Together, it is also possible to realize that the first ceramic inductance coil 131 that multilayer is sequentially arranged sequentially is electrically connected in series.
The structure of the second ceramic inductance 15 is identical with the first ceramic inductance 13, and it includes the second medium that multilayer is sequentially laminated
Layer and the second ceramic inductance coil being arranged in the second dielectric layer, are provided with fourth hole, the 4th in each second dielectric layer
Through hole aligns with one end of the second ceramic inductance coil thereon, so that the second ceramic inductance of multilayer coil sequentially company of series connection
Connect.
Specifically, the setting of fourth hole and the second ceramic inductance coil and above-mentioned third through-hole and the first ceramic inductance line
The setting of circle is communicated, and is no longer described in detail herein.
In the present embodiment, above-mentioned first medium layer 130 and second dielectric layer employ low permittivity ceramic dielectric layer, refer to
The dielectric layer being made of the relatively low ceramics of dielectric constant, reaches relatively low equivalent series capacitance ESR, so as to avoid high frequency state
The loss of inductance noise elimination ability.And in practice, its quantity that can adjust inductance coil and dielectric layer, to meet difference
Product electrical property design requirement.
Specifically, the second ceramic inductance 15 is identical with the structure of the first ceramic inductance 13 in the present embodiment, is all situated between including two-layer
Matter layer, i.e., include two-layer first medium layer 130 and two-layer second dielectric layer respectively.
As shown in figure 3, the first ferrite inductance 12 includes the first ferrite dielectric layer 120 and is arranged on the first ferrite Jie
The first ferrite inductance coil 121 on matter layer 120, the first ferrite inductance coil 121 is on the first ferrite dielectric layer 120
Arrange in the shape of a spiral.The one end of first ferrite inductance coil 121 is tangential on the outward flange of the first ferrite dielectric layer 120, also
The outward flange of main structure body is tangent to, so, is easy to the first ferrite inductance coil 121 electrically to connect with external input lines
Connect.
Offer fifth hole 122 on the first ferrite dielectric layer 120, the first ferrite inductance coil 121 it is another
End is alignd with the fifth hole 122, also, the fifth hole 122 aligns with the third through-hole 132 on the first ceramic inductance 13,
So, when the first ceramic inductance 13 is superimposed in the first ferrite inductance 12, by third through-hole and fifth hole, can make
The first ferrite inductance coil 121 is obtained to be electrically connected with the first ceramic inductance coil 131.
First ferrite dielectric layer 120 uses magnetic flux rate ferrite dielectric layer high, coordinates individual layer the characteristics of its magnetic flux rate is high
First ferrite inductance coil 121 of helical form arrangement, the bigger inductance value in space such as can obtain, and contribute intermediate frequency high impedance
Meanwhile, save the valuable space of electronic component.
The structure of the second ferrite inductance 16 is identical with the first ferrite inductance 12, including the second ferrite dielectric layer and sets
The second ferrite inductance coil on the second ferrite dielectric layer is put, the second ferrite inductance coil is in the second ferrite
Arrange that its one end is tangential in the outward flange of the second ferrite dielectric layer, that is, the knot in individual layer helical form on dielectric layer
The outward flange of structure main body, and be electrically connected with outside output line.
Similarly, offer the 6th through hole on the second ferrite dielectric layer, the other end of the second ferrite inductance coil with
The fifth hole aligns, also, the fifth hole aligns with the fourth hole on the second ceramic inductance 15, so, when the second pottery
Porcelain inductance is superimposed on when in the second ferrite inductance 16, by fourth hole and the 6th through hole, can cause the second ferrite electricity
Sense coil and the second ceramic inductance coil are electrically connected with
Between first ferrite inductance 12 and the first ceramic inductance between the ceramic inductance 15 of 13, ceramic condenser 14 and second,
Between second ceramic inductance 15 and the second ferrite inductance 16, the ceramic dielectric layer for separating adjacent layer is inserted with respectively,
The hole of the adjacent layer electrical connection is offered on the dielectric layer.
In the present embodiment, the 3rd dielectric layer 18 is inserted between the first ferrite inductance 12 and the first ceramic inductance 13, should
Offer the 7th through hole in 3rd dielectric layer 18, the 7th through hole respectively with the first ceramic inductance 13 on third through-hole 132 and
Fifth hole 122 in first ferrite inductance 12 aligns, so, it is ensured that the first ferrite inductance coil 121 and the first ceramics
Inductance coil 131 is electrically connected with.
The 4th dielectric layer 19, the 4th dielectric layer 19 are inserted between first capacitance electrode 143 and the second ceramic inductance 15
In offer the 8th through hole, the second ceramic inductance coil in alignment on the 8th through hole and the second ceramic inductance 15, so, when
When one capacitance electrode 143, the 4th dielectric layer 19 and the second ceramic inductance 15 are laminated, it is ensured that the second ceramic inductance coil and first
Capacitance electrode 143 is electrically connected with.
The 5th dielectric layer 20, the 5th dielectric layer 20 are inserted between second ceramic inductance 15 and the second ferrite inductance 16
In offer the 9th through hole, the 9th through hole aligns with the fourth hole on the second ceramic inductance 15, so, when the second ceramic electrical
When the 15, the 5th dielectric layer 20 of sense and the second ferrite inductance 16 are superimposed together, it is ensured that the second ceramic inductance coil and second
Ferrite inductance coil is electrically connected with.
As shown in figure 3, the second capacitance electrode 141 of ceramic condenser 14 is identical with the structure of the first capacitance electrode 143, including extremely
Few one layer of electrode pattern plate.The electrode pattern plate includes multiple sequentially end to end battery lead plates, and multiple electrodes plate shape is into closing
Electrode pattern plate.The region of empty avoiding is provided with the battery lead plate of the second capacitance electrode 141 and the first capacitance electrode, in order to pacify
The circuit pretended between adjacent bed by electrically connecting.In practice, the electrode pattern plate of the different numbers of plies can be selected, to meet not
Same product electrical property design requirement.Specifically, the second capacitance electrode 141 and the first capacitance electrode 143 in the present embodiment are wrapped
The electrode pattern plate for including is one layer.
The course of work of lamination sheet type electromagnetic interface filter 1 in the present embodiment is as follows：
Signal code is flowed into from the first ferrite inductance coil 121 of the first ferrite inductance 12, sequentially by the first pottery
Second ferrite inductance line of porcelain inductance 13, the first capacitance electrode 143, the second ceramic inductance 15 and the second ferrite inductance 16
Circle, from the output of the second ferrite inductance coil.External ground line is connected on the second capacitance electrode 141.
When low frequency available signal passes through the wave filter, due to the first ferrite inductance 12, the second ferrite inductance 16, the
One ceramic inductance 13 and the impedance in low frequency of the second ceramic inductance 15 are very low, so not resulting in decay to signal.Work as intermediate frequency
When noise (30MHz~1GHz) signal passes through wave filter, the first ferrite inductance coil 121 and the second iron of helical form arrangement
Oxysome inductance coil and high-permeability material are designed, can produce larger impedance, so as to enough to intermediate frequency the formation of noise
Decay.When high-frequency noise (1GHz~5GHz) signal passes through wave filter, although the first ferrite inductance 12 and the second iron oxygen
The impedance reduction of body inductance 16, but the high frequency LC that the first ceramic inductance 13, the second ceramic inductance 15 are constituted with ceramic condenser 14
Circuit starts the insertion loss enough to the formation of noise.Capacitance its main noise suppression task is in the high frequency stage by slightly lower frequency
Rate section undertakes, thus capacitance need not set it is higher, then can obtain more stable structure；And ceramic inductance ceramic condenser
14 form multistage lc circuit, assume responsibility for being enough in the slightly higher frequency band in high frequency stage appointing the work of the formation of noise effective attenuation
Business.
The compact conformation of Stacked electromagnetic interface filter 1 stabilization in this specific embodiment, size are small, rational technology, with right
The excellent rejection characteristic of high-frequency noises, while having good magnetic screen feature.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.
Claims (9)
1. lamination sheet type electromagnetic interface filter, including main structure body, the main structure body includes the electronic component that multilayer is sequentially laminated,
Characterized in that, electronic component described in multilayer includes the first ferrite inductance, the first ceramics that are electrically connected with external input lines
Inductance, ceramic condenser, the second ceramic inductance and the second ferrite inductance being electrically connected with outside output line, the ceramic condenser
The second capacitance electrode being electrically connected with including the first capacitance electrode and with external ground line, first ferrite inductance, first
Ceramic inductance, the first capacitance electrode, the second ceramic inductance and the second ferrite inductance sequentially electrical series, the main structure body
Upper and lower side be stacked with ferrite lid and ferrite lower cover respectively, first ceramic inductance include that multilayer is sequentially laminated the
One dielectric layer, the first ceramic inductance coil is provided with each first medium layer, the first ceramic inductance coil described in multilayer according to
Sequence is electrically connected in series；Second ceramic inductance includes the second dielectric layer that multilayer is sequentially laminated, in each second dielectric layer
The second ceramic inductance coil is provided with, the second ceramic inductance coil described in multilayer is sequentially electrically connected in series.
2. lamination sheet type electromagnetic interface filter as claimed in claim 1, it is characterised in that first capacitance electrode and described
Capacitor dielectric layer is provided between two capacitance electrodes, second capacitance electrode, capacitor dielectric layer and the first capacitance electrode are sequentially
Stacking, the capacitor dielectric layer is high permittivity ceramic medium layer, and offers through hole.
3. lamination sheet type electromagnetic interface filter as claimed in claim 1, it is characterised in that the is provided with each first medium layer
Three through holes, the third through-hole aligns with one end of the first ceramic inductance coil on first medium layer；Described second is situated between
Fourth hole is provided with matter layer, one end pair of the second ceramic inductance coil in the fourth hole and the second dielectric layer
Together.
4. lamination sheet type electromagnetic interface filter as claimed in claim 1, it is characterised in that first ferrite inductance includes the
One ferrite dielectric layer and the first ferrite inductance coil on the first ferrite dielectric layer, first ferrite
One end that inductance coil is electrically connected with external input lines is tangential on the outward flange of the first ferrite dielectric layer, other end electricity
It is connected to first ceramic inductance；Second ferrite inductance includes the second ferrite dielectric layer and located at second iron
The second ferrite inductance coil on oxysome dielectric layer, one end that the second ferrite inductance coil is connected with outside output line
The outward flange of the second ferrite dielectric layer is tangential on, the other end is electrically connected to second ceramic inductance.
5. lamination sheet type electromagnetic interface filter as claimed in claim 4, it is characterised in that the first ferrite inductance coil in
Arranged in the shape of a spiral on the first ferrite dielectric layer；The second ferrite inductance coil is in the second ferrite medium
Arranged in the shape of a spiral on layer.
6. lamination sheet type electromagnetic interface filter as claimed in claim 4, it is characterised in that first ferrite inductance with it is described
The 3rd dielectric layer is provided between first ceramic inductance, the 7th through hole, the 7th through hole difference are provided with the 3rd dielectric layer
In the other end and first ceramic inductance of the first ferrite inductance coil being aligned in first ferrite inductance
First ceramic inductance coil.
7. lamination sheet type electromagnetic interface filter as claimed in claim 1, it is characterised in that first capacitance electrode and described
The 4th dielectric layer is provided between two ceramic inductances, the 8th through hole is provided with the 4th dielectric layer, the 8th through hole is right respectively
Neat the second ceramic inductance coil in the first capacitance electrode and second ceramic inductance.
8. lamination sheet type electromagnetic interface filter as claimed in claim 4, it is characterised in that second ceramic inductance and described
The 5th dielectric layer is provided between two ferrite inductances, the 9th through hole, the 9th through hole difference are provided with the 5th dielectric layer
The second ceramic inductance coil being aligned in second ceramic inductance and the second ferrite in second ferrite inductance
Inductance coil.
9. the lamination sheet type electromagnetic interface filter as described in any one of claim 2~8, it is characterised in that first capacitance electrode
Identical with the second capacitance electrode structure, respectively including at least one of which electrode pattern plate, each electrode pattern plate includes many
Individual sequentially end to end battery lead plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310066395.0A CN104022749B (en) | 2013-02-28 | 2013-02-28 | Lamination sheet type electromagnetic interface filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310066395.0A CN104022749B (en) | 2013-02-28 | 2013-02-28 | Lamination sheet type electromagnetic interface filter |
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| CN104022749A CN104022749A (en) | 2014-09-03 |
| CN104022749B true CN104022749B (en) | 2017-06-27 |
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| CN201310066395.0A Active CN104022749B (en) | 2013-02-28 | 2013-02-28 | Lamination sheet type electromagnetic interface filter |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104779034A (en) * | 2015-04-20 | 2015-07-15 | 禾邦电子（中国）有限公司 | Common-mode filter and manufacturing method thereof |
| CN105141273B (en) * | 2015-09-10 | 2017-11-28 | 华中科技大学 | A kind of electromagnetic interface filter for folding chain type feedthrough capacitor structure |
| CN105187026A (en) * | 2015-10-12 | 2015-12-23 | 深圳振华富电子有限公司 | Laminated filter network and manufacturing method thereof |
| CN107093992B (en) * | 2017-05-23 | 2023-08-29 | 深圳振华富电子有限公司 | filter |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201039096Y (en) * | 2007-04-29 | 2008-03-19 | 深圳市麦捷微电子科技有限公司 | Slice type EMI filter |
| CN102064785A (en) * | 2010-10-28 | 2011-05-18 | 昆山锦泰电子器材有限公司 | Ceramic stack filter |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3900104B2 (en) * | 2003-04-10 | 2007-04-04 | 松下電器産業株式会社 | Antistatic parts |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201039096Y (en) * | 2007-04-29 | 2008-03-19 | 深圳市麦捷微电子科技有限公司 | Slice type EMI filter |
| CN102064785A (en) * | 2010-10-28 | 2011-05-18 | 昆山锦泰电子器材有限公司 | Ceramic stack filter |
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