CN103993151B - Heattreatment of spring frame - Google Patents
Heattreatment of spring frame Download PDFInfo
- Publication number
- CN103993151B CN103993151B CN201410223954.9A CN201410223954A CN103993151B CN 103993151 B CN103993151 B CN 103993151B CN 201410223954 A CN201410223954 A CN 201410223954A CN 103993151 B CN103993151 B CN 103993151B
- Authority
- CN
- China
- Prior art keywords
- laminate
- chassis
- pillar
- heattreatment
- locating dowel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 25
- 230000001105 regulatory effect Effects 0.000 abstract description 5
- 238000007669 thermal treatment Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005555 metalworking Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to a kind of heattreatment of spring frame, comprise chassis, pillar, locating dowel and stacked wafer module, described locating dowel is evenly arranged on chassis, locating dowel is vertical with chassis, described pillar is vertically fixed on chassis edge, described stacked wafer module correspondence is arranged on above chassis, stacked wafer module comprises laminate and preset pieces, described laminate is parallel with chassis, laminate is evenly provided with some locating dowels vertical with laminate, laminate is fixed on pillar by the preset pieces being arranged on below, and described preset pieces is set on pillar.This heattreatment of spring frame is designed by location-independent post, makes between spring separate, unaffected, maintain consistence, by the height of regulating laminate, the spring of different heights can be adapted to, by the independent assortment between individual part, add space availability ratio, enhance productivity.
Description
Technical field
The present invention relates to a kind of equipment for Heating Processing, particularly a kind of heattreatment of spring frame.
Background technology
Thermal treatment metallic substance is placed on heating in certain medium, insulation, cooling, by changing the metallurgical structure of material surface or inside, controls a kind of metal working process of its performance, and thermal treatment process comprises heating, insulation, cooling three processes.
At present, the thermal treatment of spring is generally on a pillar by some spring overlapped in series, then send heat treatment furnace to heat, and this modes of emplacement meeting spring deformation state is from bottom to top different, affect the homogeneity of spring, make the spring performance of same batch that heat-treats uneven, affect the quality of spring.
Summary of the invention
The technical problem to be solved in the present invention is: in order to overcome the deficiencies in the prior art, and provide a kind of structure design exquisite, combination flexibly, is installed easy to operate, and the heattreatment of spring frame that spring can be made to keep consistency.
The technical solution adopted for the present invention to solve the technical problems is: a kind of heattreatment of spring frame, comprise chassis, pillar, locating dowel and stacked wafer module, described locating dowel is evenly arranged on chassis, locating dowel is vertical with chassis, described pillar is vertically fixed on chassis edge, described stacked wafer module correspondence is arranged on above chassis, stacked wafer module comprises laminate and preset pieces, described laminate is parallel with chassis, laminate is evenly provided with some locating dowels vertical with laminate, laminate is fixed on pillar by the preset pieces being arranged on below, and described preset pieces is set on pillar.
Conveniently dismounting, flexible combination, described pillar is provided with outside screw, and be provided with threaded hole in described preset pieces, preset pieces is threaded with pillar.
Conveniently dismounting, described chassis is provided with threaded hole, and described lower rod end is provided with outside screw, and described pillar is threaded with chassis.
The conveniently height of regulating laminate, described laminate offers the aperture mated with pillar, and described laminate is set on pillar.
Conveniently operate, described chassis and laminate are equipped with cylindrical thread hole, described locating dowel lower end is provided with outside screw, and locating dowel and chassis and laminate are all threaded connection.
Connection conveniently between each several part, described laminate side is provided with contiguous block and connective slot, and described contiguous block mates with connective slot.
The invention has the beneficial effects as follows: this heattreatment of spring frame is designed by location-independent post, make between spring separate, unaffected, maintain consistence, by the height of regulating laminate, the spring of different heights can be adapted to, by the independent assortment between individual part, add space availability ratio, enhance productivity.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is the structural representation of heattreatment of spring frame of the present invention;
Fig. 2 is the structural representation of a preferred embodiment of heattreatment of spring frame of the present invention;
In figure: 1. chassis, 2. laminate, 3. pillar, 4. preset pieces, 5. locating dowel, 6. contiguous block.
Embodiment
In conjunction with the accompanying drawings, the present invention is further detailed explanation.These accompanying drawings are the schematic diagram of simplification, only basic structure of the present invention are described in a schematic way, and therefore it only shows the formation relevant with the present invention.
As shown in Figure 1, a kind of heattreatment of spring frame, comprise chassis 1, pillar 3, locating dowel 5 and stacked wafer module, described locating dowel 5 is evenly arranged on chassis 1, locating dowel 5 is vertical with chassis 1, described pillar 3 is vertically fixed on edge, chassis 1, described stacked wafer module correspondence is arranged on above chassis 1, stacked wafer module comprises laminate 2 and preset pieces 4, described laminate 2 is parallel with chassis 1, laminate 2 is evenly provided with some locating dowels 5 vertical with laminate 2, laminate 2 is fixed on pillar 3 by the preset pieces 4 being arranged on below, and described preset pieces 4 is set on pillar 3.
Conveniently dismounting, flexible combination, described pillar 3 is provided with outside screw, and be provided with threaded hole in described preset pieces 4, preset pieces 4 is threaded with pillar 3.
Conveniently dismounting, described chassis 1 is provided with threaded hole, and described pillar 3 lower end is provided with outside screw, and described pillar 3 is threaded with chassis 1.
The conveniently height of regulating laminate 2, described laminate 2 offers the aperture mated with pillar 3, and described laminate 2 is set on pillar 3.
Conveniently operate, described chassis 1 and laminate 2 are equipped with cylindrical thread hole, described locating dowel 5 lower end is provided with outside screw, and locating dowel 5 is all threaded connection with chassis 1 and laminate 2.
Connection conveniently between each several part, described laminate 2 side is provided with contiguous block 6 and connective slot, and described contiguous block 6 mates with connective slot.
As shown in Figure 2, for the structural representation of a preferred embodiment of the present invention, this device is made up of two heattreatment of spring framves, be connected with connective slot coupling with the contiguous block 6 of side, chassis 1 by laminate 2 between two thermal treatment framves, in fact, chassis 1 and laminate 2 are rectangle, and chassis 1 and laminate 2 surrounding are equipped with contiguous block 6 and connective slot, and the relative position of contiguous block 6 and connective slot is all consistent.
According to the situation in the space of heat treatment furnace inside, this heattreatment of spring frame can have different combinations to adapt to, and prevents space waste, thus increases the quantity with the spring of batch thermal, enhances productivity.
In fact, the connection of laminate 2 and pillar 3 is for being flexibly connected, and revocable, is first arranged on chassis 1 by locating dowel 5, and then spring is set in locating dowel 5 respectively, then according to the height of spring, regulate the height of preset pieces 4, and then laminate 2 is set on pillar 3, again spring housing is located in the locating dowel 5 of laminate 2, by that analogy, complete the installation of whole shelf inner spring, convenient and simple.
The invention has the beneficial effects as follows: this heattreatment of spring frame is designed by location-independent post, make between spring separate, unaffected, maintain consistence, by the height of regulating laminate 2, the spring of different heights can be adapted to, by the independent assortment between individual part, add space availability ratio, enhance productivity.
With above-mentioned according to desirable embodiment of the present invention for enlightenment, by above-mentioned description, relevant staff in the scope not departing from this invention technological thought, can carry out various change and amendment completely.The technical scope of this invention is not limited to the content on specification sheets, must determine its technical scope according to right.
Claims (6)
1. a heattreatment of spring frame, it is characterized in that, comprise chassis (1), pillar (3), locating dowel (5) and stacked wafer module, described locating dowel (5) is evenly arranged on chassis (1), locating dowel (5) is vertical with chassis (1), described pillar (3) is vertically fixed on chassis (1) edge, described stacked wafer module correspondence is arranged on top, chassis (1), stacked wafer module comprises laminate (2) and preset pieces (4), described laminate (2) is parallel with chassis (1), laminate (2) is evenly provided with some locating dowels (5) vertical with laminate (2), laminate (2) is fixed on pillar (3) by the preset pieces (4) being arranged on below, described preset pieces (4) is set on pillar (3).
2. heattreatment of spring frame as claimed in claim 1, it is characterized in that, described pillar (3) is provided with outside screw, and described preset pieces is provided with threaded hole in (4), and preset pieces (4) is threaded with pillar (3).
3. heattreatment of spring frame as claimed in claim 1, it is characterized in that, described chassis (1) is provided with threaded hole, and described pillar (3) lower end is provided with outside screw, and described pillar (3) is threaded with chassis (1).
4. heattreatment of spring frame as claimed in claim 1, it is characterized in that, described laminate (2) offers the aperture mated with pillar (3), described laminate (2) is set on pillar (3).
5. heattreatment of spring frame as claimed in claim 1, it is characterized in that, described chassis (1) and laminate (2) are equipped with cylindrical thread hole, and described locating dowel (5) lower end is provided with outside screw, and locating dowel (5) is all threaded connection with chassis (1) and laminate (2).
6. heattreatment of spring frame as claimed in claim 1, it is characterized in that, described laminate (2) side is provided with contiguous block (6) and connective slot, and described contiguous block (6) mates with connective slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410223954.9A CN103993151B (en) | 2014-05-26 | 2014-05-26 | Heattreatment of spring frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410223954.9A CN103993151B (en) | 2014-05-26 | 2014-05-26 | Heattreatment of spring frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103993151A CN103993151A (en) | 2014-08-20 |
| CN103993151B true CN103993151B (en) | 2015-11-18 |
Family
ID=51307477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410223954.9A Expired - Fee Related CN103993151B (en) | 2014-05-26 | 2014-05-26 | Heattreatment of spring frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103993151B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108922769B (en) * | 2018-07-20 | 2020-07-28 | 赣州嘉通新材料有限公司 | Heat preservation device after sintering of neodymium iron boron magnetism post |
| CN110714115B (en) * | 2019-11-21 | 2024-06-14 | 沈阳飞机工业（集团）有限公司 | Spring heat treatment deformation limiting device |
| CN114381593A (en) * | 2021-10-28 | 2022-04-22 | 中国航发西安动力控制科技有限公司 | Material tray for preventing spring from deforming during vacuum quenching and vacuum heat treatment method based on material tray |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2903091Y (en) * | 2005-11-30 | 2007-05-23 | 李德锵 | Spring automatic heat treatment apparatus |
| CN203212605U (en) * | 2013-03-29 | 2013-09-25 | 中国科学院金属研究所 | Thermal treatment furnace for spring |
| CN203855614U (en) * | 2014-05-26 | 2014-10-01 | 常州市新城光大热处理有限公司 | Spring heat treatment frame |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62156222A (en) * | 1985-12-27 | 1987-07-11 | France Bed Co | Unit spring heat treatment equipment |
| KR200461244Y1 (en) * | 2009-03-19 | 2012-07-02 | 조태구 | Jig for heating a spring |
-
2014
- 2014-05-26 CN CN201410223954.9A patent/CN103993151B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2903091Y (en) * | 2005-11-30 | 2007-05-23 | 李德锵 | Spring automatic heat treatment apparatus |
| CN203212605U (en) * | 2013-03-29 | 2013-09-25 | 中国科学院金属研究所 | Thermal treatment furnace for spring |
| CN203855614U (en) * | 2014-05-26 | 2014-10-01 | 常州市新城光大热处理有限公司 | Spring heat treatment frame |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103993151A (en) | 2014-08-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Qiu Peng Inventor after: Liu Chunling Inventor before: Qiu Peng |
|
| CB03 | Change of inventor or designer information | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151118 |