CN103980667B - Integrated circuit compositions of thermosetting resin, prepreg and laminate - Google Patents
Integrated circuit compositions of thermosetting resin, prepreg and laminate Download PDFInfo
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- CN103980667B CN103980667B CN201410232765.8A CN201410232765A CN103980667B CN 103980667 B CN103980667 B CN 103980667B CN 201410232765 A CN201410232765 A CN 201410232765A CN 103980667 B CN103980667 B CN 103980667B
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- resin
- epoxy resin
- integrated circuit
- parts
- thermosetting resin
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- 229920005989 resin Polymers 0.000 title claims abstract description 63
- 239000011347 resin Substances 0.000 title claims abstract description 63
- 239000000203 mixture Substances 0.000 title claims abstract description 32
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 15
- -1 prepreg and laminate Polymers 0.000 claims abstract description 39
- 239000003822 epoxy resin Substances 0.000 claims abstract description 38
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 38
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims abstract description 32
- 150000002148 esters Chemical class 0.000 claims abstract description 13
- 239000007787 solid Substances 0.000 claims abstract description 8
- 239000011574 phosphorus Substances 0.000 claims description 18
- 229910052698 phosphorus Inorganic materials 0.000 claims description 18
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 17
- 239000003292 glue Substances 0.000 claims description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 10
- 239000011256 inorganic filler Substances 0.000 claims description 9
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 9
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229940106691 bisphenol a Drugs 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000007598 dipping method Methods 0.000 claims description 4
- 239000012779 reinforcing material Substances 0.000 claims description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 3
- 150000008064 anhydrides Chemical class 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 3
- 125000001624 naphthyl group Chemical group 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- KGSFMPRFQVLGTJ-UHFFFAOYSA-N 1,1,2-triphenylethylbenzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 KGSFMPRFQVLGTJ-UHFFFAOYSA-N 0.000 claims description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 2
- NBAUUNCGSMAPFM-UHFFFAOYSA-N 3-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=CC(C(O)=O)=C1C(O)=O NBAUUNCGSMAPFM-UHFFFAOYSA-N 0.000 claims description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000005995 Aluminium silicate Substances 0.000 claims description 2
- 229930185605 Bisphenol Natural products 0.000 claims description 2
- 229920001730 Moisture cure polyurethane Polymers 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 2
- 235000012211 aluminium silicate Nutrition 0.000 claims description 2
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 235000012241 calcium silicate Nutrition 0.000 claims description 2
- 239000004927 clay Substances 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 239000000428 dust Substances 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 claims description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 150000002790 naphthalenes Chemical class 0.000 claims description 2
- 239000004843 novolac epoxy resin Substances 0.000 claims description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 2
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 claims description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 2
- 239000010456 wollastonite Substances 0.000 claims description 2
- 229910052882 wollastonite Inorganic materials 0.000 claims description 2
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 claims description 2
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 claims description 2
- 150000003851 azoles Chemical class 0.000 claims 1
- SZKXDURZBIICCF-UHFFFAOYSA-N cobalt;pentane-2,4-dione Chemical group [Co].CC(=O)CC(C)=O SZKXDURZBIICCF-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 claims 1
- 229910010272 inorganic material Inorganic materials 0.000 claims 1
- 239000011147 inorganic material Substances 0.000 claims 1
- 125000003099 maleoyl group Chemical group C(\C=C/C(=O)*)(=O)* 0.000 claims 1
- 125000004957 naphthylene group Chemical group 0.000 claims 1
- 239000013034 phenoxy resin Substances 0.000 claims 1
- 229920006287 phenoxy resin Polymers 0.000 claims 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 9
- 230000009477 glass transition Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 18
- 230000015572 biosynthetic process Effects 0.000 description 10
- 239000003063 flame retardant Substances 0.000 description 10
- 238000003786 synthesis reaction Methods 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 6
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 229920001568 phenolic resin Polymers 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000005587 bubbling Effects 0.000 description 5
- 125000005842 heteroatom Chemical group 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000010992 reflux Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000005711 Benzoic acid Substances 0.000 description 3
- 235000010233 benzoic acid Nutrition 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000032050 esterification Effects 0.000 description 3
- 238000005886 esterification reaction Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical group Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- DWSWCPPGLRSPIT-UHFFFAOYSA-N benzo[c][2,1]benzoxaphosphinin-6-ium 6-oxide Chemical class C1=CC=C2[P+](=O)OC3=CC=CC=C3C2=C1 DWSWCPPGLRSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000003116 impacting effect Effects 0.000 description 2
- 229910001867 inorganic solvent Inorganic materials 0.000 description 2
- 239000003049 inorganic solvent Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229960003742 phenol Drugs 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 2
- 230000005070 ripening Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000013517 stratification Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- WGHUCJVZWJRELE-UHFFFAOYSA-N CC(C)(C1(N=CNC1(CC)CC)CC)C Chemical class CC(C)(C1(N=CNC1(CC)CC)CC)C WGHUCJVZWJRELE-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- JXASPPWQHFOWPL-UHFFFAOYSA-N Tamarixin Natural products C1=C(O)C(OC)=CC=C1C1=C(OC2C(C(O)C(O)C(CO)O2)O)C(=O)C2=C(O)C=C(O)C=C2O1 JXASPPWQHFOWPL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 239000002635 aromatic organic solvent Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000013521 mastic Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 125000002467 phosphate group Chemical class [H]OP(=O)(O[H])O[*] 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000979 retarding effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000003333 secondary alcohols Chemical class 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
The invention discloses integrated circuit compositions of thermosetting resin, prepreg and laminate, resin combination is in terms of 100 parts by solid weight sum, including: (a) pi-allyl modified bismaleimide resin prepolymer: 10 ~ 50 parts；(b) anhydride compound: 10 ~ 30 parts；(c) epoxy resin: 5 ~ 40 parts；(d) phosphorous active ester: 20 ~ 40 parts.The resin combination of the present invention has high glass transition temperature, excellent humidity resistance, relatively low dielectric constant, can preferably meet the design requirement in terms of multi-layer sheet impedance, beneficially high density interconnecting integrated circuit and encapsulate the application in contour performance printed wiring board field.
Description
Technical field
The invention belongs to technical field of electronic materials, relate to a kind of halogen-free resin composition for integrated circuit and use
Its prepreg made and laminate, can be applicable to the fields such as high density interconnection integrated antenna package.
Background technology
In recent years, along with the development of electronic technology, electronic product updates more rapid, to printed electronic circuit
Having higher requirement, the high multiple stratification of Printed Circuit Board Design, the chemical conversion of high wiring density is sent out in order to printed electronic circuit
One of exhibition direction.High multiple stratification, high wiring density, this basic material copper-clad plate just requiring to make circuit board, have
Relatively low thermal coefficient of expansion, higher thermostability, the most also there is relatively low dielectric constant, to the mistake in printed circuit design
Cheng Zhong, meets the thermal shock born in impedance design and the course of processing.
Along with the progressively intensification of environmental pollution, the living environment gone from bad to worse, the theme of " environmental protection " gradually gos deep into people
The heart, therefore, in copper-clad plate industry, green halogen-free board develops the Main way of development in recent years especially, and phosphonium flame retardant
The main technological route being applied to halogen-free flameproof.At present, widely used on copper-clad plate market phosphorus flame retardant: mainly divide
For response type and addition type two kinds.Response type is mainly DOPO compounds, with phosphorous epoxy resin, phosphorus containing phenolic resin is
Main, phosphorus content between 2-10%, but, actual application finds, uses phosphorous epoxy resin to contain as matrix resin or employing
Phosphorous-containing phenolic resin is the resin combination of epoxy curing agent, and it has bigger water absorption rate and higher dielectric constant, and
The humidity resistance of its sheet material made decreases；Addition type is mainly phosphine nitrile and phosphate compounds, additive flame retardant
Flame retarding efficiency relative response type on the low side, needing to add more phosphorus content, to can be only achieved UL 94V-0 level fire-retardant, meanwhile, because of it
Relatively low fusing point (generally below 150 DEG C), in the course of processing of laminate, the surface of easy " migration " to sheet material.
Therefore, the application of above-mentioned phosphor-containing flame-proof technology, tend not to meet low-k, the tree of excellent humidity resistance
The requirement of oil/fat composition formula design, seeks new halogen-free flame retardants, prepares and have halogen-free flameproof and high-fire resistance, low dielectric concurrently
The copper-clad plate of constant, becomes one of direction of copper-clad plate future development.
Phosphorous active ester is a class novel reaction type fire retardant, as the firming agent of epoxy resin, because of in its solidification process,
The higher hydroxyl of polarity will not be generated with epoxy reaction, therefore, the resin system after its solidification have relatively low water absorption rate with
Relatively low dielectric constant.
Therefore, use phosphorous active ester to substitute the phosphonium flame retardant of main flow in the market, improve halogen-free flameproof
At the same time it can also be reduce dielectric properties and the water absorption rate of resin combination, keep the wet-hot aging performance that whole compositions is excellent.
Summary of the invention
The goal of the invention of the present invention is to provide a kind of integrated circuit compositions of thermosetting resin, prepreg and lamination
Plate, to improve the fire resistance of laminate, thermostability and dielectric properties.
To achieve the above object of the invention, the technical solution used in the present invention is:
A kind of integrated circuit compositions of thermosetting resin, it is characterised in that be in terms of 100 parts by solid weight sum, bag
Include:
(a) pi-allyl modified bismaleimide resin prepolymer: 10 ~ 50 parts；
(b) anhydride compound: 10 ~ 30 parts；
(c) epoxy resin: 5 ~ 40 parts；
(d) phosphorous active ester: 20 ~ 40 parts.
In technique scheme, the number-average molecular weight of described pi-allyl modified bismaleimide resin prepolymer is 1500
~ 8000g/mol, via 100 parts of bimaleimide resins and 40 ~ 100 parts of allyl compounds, reacts at 130 ~ 160 DEG C
40 ~ 100min prepares；
The monomer structure of described bimaleimide resin is:
,
Wherein, R base is:,Or；
The structural formula of described allyl compound is:
,
Wherein, R base is:,Or。
Preferably, the number-average molecular weight of described pi-allyl modified bismaleimide resin prepolymer is 2000 ~ 6000g/
Mol, the content in its resin combination is preferably 20-45 part.
In technique scheme, described anhydride compound be selected from maleic anhydride of styrene, phenylethylene-maleic anhydride,
3,3 ', 4,4 '-oxydiphthalic, 2,3,3', 4'-diphenyl ether tetraformic dianhydride, 3,3', 4,4'-bibenzene tetracarboxylic dianhydrides,
2,3,3', 4'-bibenzene tetracarboxylic dianhydride, 3,3 ', 4,4 '-benzophenone tetracarboxylic dianhydride, Bisphenol A Type Diether Dianhydride, 1,2,4,5-is equal
One or more in acid dianhydride, the content in its resin combination is preferably 15-30 part.
In technique scheme, described epoxy resin is selected from: bisphenol A epoxide resin, bisphenol F epoxy resin, o-cresol formaldehyde
Epoxy resin, bisphenol-A phenolic epoxy resin, phenol novolac epoxy resins, trifunctional phenol-type epoxy resin, tetraphenyl ethane epoxy
Resin, biphenyl type epoxy resin, naphthalene nucleus type epoxy resin, dicyclopentadiene type epoxy resin, aralkyl novolak type epoxy tree
Fat, glycidyl amine type epoxy resin, one or more mixture of glycidyl ester type epoxy resin, its resin group
Content in compound is 10-30 part.
In technique scheme, the structural formula of described phosphorous active ester compound is,
,
In formula, R1 is methyl, ethyl or the tert-butyl group；
Y is H or CH3；
Z isOr, wherein R is phenyl, naphthyl or C1～C5Alkyl；
N is the integer of 1～10；
X is:、、Or。
The preparation method of above-mentioned active ester compound, by phosphorus compound and hydroxy benzaldehyde, addition 50～70% mass are dense
The H of degree2SO4In, heat at 90～130 DEG C, condensing reflux 3～8hr, then product is washed by 3～10 alcohol, 95
～under the vacuum condition of 105 DEG C, be dried 3～6hr, obtain pre-product；Above-mentioned gained pre-product is dissolved in aromatic series organic solution
In, add benzoic acid or naphthyl, benzene alkylbenzoic acid compound, under the temperature conditions of 100～120 DEG C, add catalyst, cold
Solidifying backflow 2～8hr, is dried 3～6hr under the vacuum condition of 95～105 DEG C after washing, i.e. obtain required phosphorous active esterifying
Compound, esterification yield is 65～85%；Wherein, described phosphorus compound is selected from 9, and 10-dihydro-9-oxy miscellaneous-10-phospho hetero phenanthrene-10-aoxidizes
Thing, 10-(2,5-dihydroxy phenyl)-10-hydrogen-9-oxa--10-phospho hetero phenanthrene-10-oxide, 10-(2,5-dihydroxy naphthyl)-
10-hydrogen-9-oxa--10-phospho hetero phenanthrene-10-oxide or 10-(2,5-dihydroxybiphenyl base)-10-hydrogen-9-oxa--10-phospha
One or more mixture in the phospho hetero phenanthrene compounds such as phenanthrene-10-oxide.
Described aromatic organic solvent is selected from toluene, dimethylbenzene, ethylbenzene, isopropylbenzene.
Described catalyst is AlCl3。
In described phosphorous active ester compound, in mass, phosphorus content is 5.2～7.2%.
In technique scheme, the content of phosphorous active ester is preferably 25-40 part.
Further technical scheme, containing curing accelerator, in technique scheme, described curing accelerator is selected from second
One or several in acyl acetone cobalt, zinc naphthenate, zinc octoate, 2-methylimidazole, 2-ethyl-4-methylimidazole and 2-phenylimidazole
The mixture planted.The content of curing accelerator is 0.01-3 part.
Preferably technical scheme, described resin combination is possibly together with inorganic filler, and the consumption of described inorganic filler is Halogen
The 0～35% of resin combination solid gross mass；Described inorganic filler is aluminium hydroxide, magnesium hydroxide, wollastonite, silicon dioxide
In micropowder, magnesium oxide, calcium silicates, calcium carbonate, clay, Kaolin, glass dust, mica powder, titanium dioxide, Firebrake ZB, zinc molybdate
One or more mixture.Particle diameter is 0.3～20 μm, preferential selection 0.5～5 μm.Above-mentioned inorganic filler can be straight
Connect input or previously prepared filler dispersion liquid or make in mastic input resin combination.
Use the prepreg that above-mentioned halogen-free resin composition makes, halogen-free resin composition solvent is dissolved and makes
Glue, is then immersed in reinforcing material in above-mentioned glue；By the reinforcing material heat drying after dipping, it is thus achieved that described semi-solid preparation
Sheet.
Described solvent selected from acetone, butanone, methylisobutylketone, N, dinethylformamide, N, N-dimethyl acetylamide,
The mixture of one or more in ethylene glycol monomethyl ether, propylene glycol monomethyl ether.Described reinforcing material can use natural fiber, organic
Synthetic fibers, organic fabric or inorganic fabric.
Described prepreg be temperature at 130～190 DEG C, the time be under 3～20min dry be prepared.
Use above-mentioned prepreg, be covered with metal forming, hot forming at single or double, obtain described laminate.
The quantity of prepreg is that the laminate thickness according to customer requirement determines, available one or more.Described gold
Belonging to paper tinsel, can be Copper Foil, it is also possible to be aluminium foil, their thickness be not particularly limited.
Owing to technique scheme is used, the present invention compared with prior art has the advantage that
1. the present invention devises four component trees of a kind of halogen-free flameproof low-k with phosphorous active ester as fire retardant
Oil/fat composition, the application of phosphorous active ester, it is to avoid draw as fire retardant because introducing phosphorous epoxy resin or phosphorus containing phenolic resin
After entering, the rising of resin water absorption rate；
2. in the present invention in the halogen-free resin composition of design, the pi-allyl modified bismaleimide resin of introducing, protect
Demonstrate,prove resin system and there is higher Tg and high heat stability, for applying the copper-clad plate prepared by this resin combination in printing
In circuit fabrication process, it is provided that the preferably guarantee in terms of hot property；And the thermal coefficient of expansion of its sheet material can be significantly reduced,
This is advantageously in the design of high multilayer board material；
3. in the present invention, anhydride and phosphorous active ester are as the co-curing agent of epoxy resin, under conditions of halogen-free flameproof,
The dielectric constant of resin system can be significantly decreased；
4. the resin combination of the present invention has high glass transition temperature, excellent humidity resistance, relatively low dielectric
Constant, can preferably meet the design requirement in terms of multi-layer sheet impedance, and beneficially high density interconnecting integrated circuit encapsulation is contour
The application in performance printed wiring board field.
Accompanying drawing explanation
Fig. 1 be synthesis example one product nmr spectrum (13C)；
Fig. 2 be synthesis example one product nmr spectrum (1H)。
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described:
First carry out the synthesis of raw material.
Synthesis example one:
The preparation 1 of phosphorous active ester compound:
Weigh 0.6mol 10-(2,5-dihydroxy phenyl)-10-hydrogen-9-oxa--10-phospho hetero phenanthrene-10-oxide with
The hydroxy benzaldehyde of 0.6mol, adds the H of 65% mass concentration2SO4, condensing reflux 3～5hr under 100 DEG C of heating conditions, then
This mixture is washed by 4～6 alcohol, obtains pre-product；Above-mentioned gained pre-product is dissolved in toluene solution, adds 0.2mol
Benzoic acid, under the temperature conditions of 120 DEG C, adds the catalyst (AlCl of 0.05mol3), condensing reflux 4hr, it is then passed through number
After secondary washing, under the vacuum condition of 105 DEG C, being dried 4hr, i.e. obtain required phosphorous active ester compound, esterification yield is 70
～80%, phosphorus content is the phosphorous active ester compound of 6.4%, is designated as D1, and concrete structure is as follows:
X=, Y=H, Z=, R is phenyl, R1=CH3, n is 3 ~ 5.
The nmr spectrum of above-mentioned product (13C) as it is shown in figure 1, at 165ppm peak position relatively strong, show in resin containing tool
Activated ester composition, nmr spectrum (1H) as in figure 2 it is shown, 7-8ppm is mainly on phenyl ring corresponding peak position, 3-
4ppm is mainly DOPO and CH2The peak position of the correspondence that is connected, this synthesis compound described above meets phosphorous active ester compound
Architectural feature.
The preparation 2 of phosphorous active ester compound:
Weigh the 9,10-dihydro-9-oxy miscellaneous-10-phospho hetero phenanthrene-10-oxide of 0.6mol and the para hydroxybenzene first of 0.6mol
Aldehyde, adds the H of 65% mass concentration2SO4, condensing reflux 3～5hr under 105 DEG C of heating conditions, then by this mixture by 4～8
Secondary alcohol is washed, and obtains pre-product；Above-mentioned gained pre-product is dissolved in toluene solution, adds 0.2mol benzoic acid, the temperature of 120 DEG C
Under the conditions of degree, add the catalyst (AlCl of 0.05mol3), condensing reflux 4hr, after being then passed through washing for several times, at 105 DEG C
Under vacuum condition, being dried 4hr, i.e. obtain required phosphorous active ester compound, esterification yield is 75～85%, and phosphorus content is 7.2%
Phosphorous active ester compound, be designated as D2, concrete structure is as follows:
X=, Y=H, Z=, R is phenyl, R1=CH3, n is 3 ~ 5.
Synthesis example two: the synthesis of pi-allyl modified bismaleimide prepolymer
By 100 part 4,4 '-diphenyl methane dimaleimide resin and 50 parts of diallyl bisphenol compounds, at 135 DEG C
At a temperature of, react 80min, be then cooled to room temperature, i.e. obtain required pi-allyl modified bismaleimide resin prepolymer
A1, its molecular weight is 2000 ~ 4000g/mol；
By 100 part 4,4 '-Diphenyl Ether Bismaleimide resin and 100 parts of diallyl bisphenol allyl compounds,
At a temperature of 155 DEG C, react 50min, be then cooled to room temperature, i.e. obtain required pi-allyl modified bismaleimide resin pre-
Polymers A2, its molecular weight is 4000 ~ 6000g/mol.
Embodiment:
According to weight ratio shown in table 1 by pi-allyl modified bismaleimide prepolymer, anhydride compound, epoxy resin,
Phosphorous active ester compound, curing accelerator and inorganic filler and solvent join in mixed glue still, control glue solids content and are
65%, stir, and ripening 8hr, make resin combination composition glue liquid；Then glass cloth is immersed in above-mentioned resin combination glue
In liquid；Then the glass cloth after dipping is formed prepreg after 155 ~ 175 DEG C of baking 4 ~ 7min；Prepreg is cut to necessarily
After size, 8 prepreg superpositions are formed folded structure, respectively place an electrolytic copper foil at folded structure, send in vacuum press and press
Closing, program is 150 DEG C/60min+200 DEG C/120min, prepares laminate.
Comparative example
According to weight ratio shown in table 1 by pi-allyl modified bismaleimide prepolymer, anhydride compound, epoxy resin,
Phosphorous epoxy or phosphorus containing phenolic resin, firming agent, curing accelerator and inorganic filler and solvent join in mixed glue still, control glue
Liquid-solid body burden is 65%, stirs, and ripening 8hr, makes resin combination composition glue liquid；Then glass cloth is immersed in above-mentioned
In resin combination composition glue liquid；Then the glass cloth after dipping is formed prepreg after 165 DEG C of baking 5min；By prepreg cutting
To certain size, 8 prepreg superpositions are formed folded structure, respectively place an electrolytic copper foil at folded structure, send into vacuum press
Middle pressing, program is 150 DEG C/60min+200 DEG C/120min, prepares laminate.
Table 1 composite formula
In upper table, component A (A1, A2) represents that pi-allyl modified bismaleimide prepolymer, B component represent anhydride chemical combination
Thing, component C represent that epoxy resin, D component represent that phosphorous active ester, component E represent that other phosphorus-containing compounds, F component represent solid
Changing accelerator, G component represents inorganic filler.
Component A: pi-allyl modified bismaleimide prepolymer
A1, A2: pi-allyl modified bismaleimide prepolymer, is shown in synthesis example two；
B component: anhydride compound
B1: maleic anhydride of styrene compound；
B2:3,3', 4,4'-bibenzene tetracarboxylic dianhydride compound；
Component C: epoxy resin
C1: biphenyl type epoxy resin；
C2: dicyclopentadiene type epoxy resin；
D component: active ester
D1, D2: phosphorous active ester compound, is shown in synthesis example one.
Component E: other phosphorus-containing compounds
E1: phosphorous epoxy resin, CHIN YEE PE-315, phosphorus content 3.5%wt；
E2: phosphorus containing phenolic resin, Dow 92741 phosphorus content 9.2%wt；
F component: curing accelerator
F: dimethyl-tetraethyl imidazoles
G component: inorganic filler
G: silicon dioxide, particle diameter 0.5 ~ 5 micron.
Table 2 is the performance test carrying out embodiment one to five and comparative example one to three respectively, and result is as shown in the table:
Table 2 embodiment and the performance data of comparative example
In table, the method for testing of each performance is as follows:
(1) glass transition temperature (Tg):
According to differential scanning calorimetry, it is measured according to the DSC method of IPC-TM-650 2.4.25 defined.
(2) peel strength (PS):
According to " after the thermal stress " experiment condition in IPC-TM-650 2.4.8 method, the stripping of test metallic cover layer is strong
Degree.
(3) wicking thermostability:
Use the two sides band copper sample of 50 × 50mm, immerse in the scolding tin of 288 DEG C, the time that record sample layering is bubbled.
(4) wicking thermostability after moist process:
By the substrate coupons of 3 pieces of 100 × 100mm 121 DEG C, keep 5hr in the pressure cooking processing means of 105Kpa after,
Immersing 2min in the solder bath of 288 DEG C, observe whether sample occurs to be layered the phenomenons such as bubbling, 3 pieces all do not occur to be layered bubbling note
Being 3/3,2 pieces does not occurs layering bubbling to be designated as 2/3, and 1 piece does not occurs to be layered bubbling and is designated as 1/3, and 0 piece does not occurs to be layered bubbling and is designated as
0/3。
(5) heat decomposition temperature Td:
It is measured according to IPC-TM-650 2.4.26 method.
(6) dielectric constant:
Use flat band method according to IPC-TM-650 2.5.5.9, measure the dielectric constant under 1GHz.
(7) dielectric loss angle tangent:
Use flat band method according to IPC-TM-650 2.5.5.9, measure the dielectric loss factor under 1GHz.
(8) drop impact toughness (laminate fragility):
Use Apparatus for Impacting at low-temp, Apparatus for Impacting at low-temp height of the fall 45cm, whereabouts weight weight 1kg.
The judge that toughness is good and bad: cross is clear, illustrates that the toughness of product is the best, represents with character ☆；Cross mould
Stick with paste, illustrate that the poor toughness of product, fragility are big, represent with character ◎；The explanation between clear and fuzzy of cross readability
Toughness of products is general, represents with character ◇.
(9) thermally stratified layer time T-300:
It is measured according to IPC-TM-650 2.4.24 method.
(10) flame resistance (flame retardancy):
Measure according to UL94 method.
From upper table data, in the present invention being designed, the phosphorous active ester of synthesis is incorporated in resin combination, made
The copper-clad plate made has the most excellent dielectric properties, a relatively low dielectric constant, has more preferable humidity resistance, it is to avoid resin
After system is because introducing phosphorous epoxy resin or phosphorus containing phenolic resin and introducing as fire retardant (comparative example), resin water absorption rate upper
Rise.Equally, the introducing of pi-allyl modified bismaleimide resin in the present invention, it is ensured that resin system have higher Tg and
High heat stability, for applying the copper-clad plate prepared by this resin combination in the printed circuit course of processing, it is provided that preferably
Hot property in terms of guarantee, this is advantageously in the design of high multilayer board material.
Claims (9)
1. an integrated circuit compositions of thermosetting resin, it is characterised in that be in terms of 100 parts by solid weight sum, by under
Row component is constituted:
(a) pi-allyl modified bismaleimide resin prepolymer: 10 ~ 50 parts；
(b) anhydride compound: 10 ~ 30 parts；
(c) epoxy resin: 5 ~ 40 parts；
(d) phosphorous active ester: 20 ~ 40 parts；
The structural formula of described phosphorous active ester compound is,
,
In formula, R1 is methyl, ethyl or the tert-butyl group；
Y is H or CH3；
Z is, wherein R is phenyl, naphthyl or C1～C5Alkyl；Or Z is
, wherein R is phenylene, naphthylene or C1～C5Alkylidene；
N is 1；
X is:、、Or。
Integrated circuit compositions of thermosetting resin the most according to claim 1, it is characterised in that: described pi-allyl is modified
Bismaleimides resin pre-polymer is the prepolymer of allyl compound and bimaleimide resin, and its number-average molecular weight is
1500~8000g/mol；
Described allyl compound is selected from diallyl bisphenol, diallyl bisphenol S, allyl phenoxy resin, pi-allyl phenolic aldehyde
One or more in resin, diallyl diphenyl ether；
Described bimaleimide resin is selected from 4,4 '-diphenyl methane dimaleimide resin, 4, the double maleoyl of 4 '-diphenyl ether
Imide resin, 4,4 '-hexichol isopropyl bimaleimide resin, 4, the one in 4 '-diphenyl sulphone (DPS) bimaleimide resin
Or it is several.
3. according to the integrated circuit compositions of thermosetting resin described in claim 1, it is characterised in that: described anhydride chemical combination
Thing be selected from maleic anhydride of styrene, phenylethylene-maleic anhydride, 3,3 ', 4,4 '-oxydiphthalic, 2,3,3', 4'-
Diphenyl ether tetraformic dianhydride, 3,3', 4,4'-bibenzene tetracarboxylic dianhydrides, 2,3,3', 4'-bibenzene tetracarboxylic dianhydride, 3,3 ', 4,4 '-
Benzophenone tetracarboxylic dianhydride, Bisphenol A Type Diether Dianhydride, one or more in 1,2,4,5-pyromellitic acid dianhydride.
4. according to the integrated circuit compositions of thermosetting resin described in claim 1, it is characterised in that: described epoxy resin
It is selected from: bisphenol A epoxide resin, bisphenol F epoxy resin, o-cresol formaldehyde epoxy resin, bisphenol-A phenolic epoxy resin, phenol novolac
Epoxy resin, trifunctional phenol-type epoxy resin, tetraphenyl ethane epoxy resin, biphenyl type epoxy resin, naphthalene nucleus type epoxy resin,
Dicyclopentadiene type epoxy resin, glycidyl amine type epoxy resin, the one of glycidyl ester type epoxy resin or one with
On mixture.
5. according to the integrated circuit compositions of thermosetting resin described in claim 1, it is characterised in that: described phosphorous activity
In ester compounds, in mass, phosphorus content is 5.2～7.2%.
6. according to the integrated circuit compositions of thermosetting resin described in claim 1, it is characterised in that: promote containing solidification
Agent, described curing accelerator is selected from acetylacetone cobalt, zinc naphthenate, zinc octoate, 2-methylimidazole, 2-ethyl-4-methyl miaow
The mixture of one or more in azoles and 2-phenylimidazole.
7. according to the integrated circuit compositions of thermosetting resin described in claim 1, it is characterised in that: fill out containing inorganic
Material, described inorganic filler be aluminium hydroxide, magnesium hydroxide, wollastonite, fine silica powder, magnesium oxide, calcium silicates, calcium carbonate,
One or more mixture in clay, Kaolin, glass dust, mica powder, titanium dioxide, Firebrake ZB, zinc molybdate.
8. using the prepreg that integrated circuit compositions of thermosetting resin as claimed in claim 1 makes, it is special
Levy and be: the integrated circuit compositions of thermosetting resin solvent described in claim 1 is dissolved and makes glue, then will increase
Strong material is immersed in above-mentioned glue；By the reinforcing material heat drying after dipping, it is thus achieved that described prepreg.
9. use the laminate that integrated circuit compositions of thermosetting resin as claimed in claim 1 makes, its feature
It is: the single or double at least one prepreg obtained by claim 8 is covered with metal forming, hot forming, obtains
Described laminate.
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| CN105778499B (en) * | 2016-04-26 | 2018-05-04 | 广东生益科技股份有限公司 | A kind of compositions of thermosetting resin and its application |
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| CN114605780B (en) * | 2020-12-09 | 2023-09-12 | 广东生益科技股份有限公司 | Thermosetting resin composition, prepreg comprising thermosetting resin composition, laminated board, circuit substrate and printed circuit board |
| CN114656749B (en) * | 2020-12-23 | 2024-03-29 | 广东生益科技股份有限公司 | Thermosetting resin composition and application thereof |
| CN112778701B (en) * | 2020-12-30 | 2023-02-28 | 广东生益科技股份有限公司 | Halogen-free flame-retardant resin composition and application thereof |
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