CN103972315B - Integrated form backboard, back-contact photovoltaic module and its production method - Google Patents

Abstract

Integrated form backboard, the back-contact photovoltaic module including above-mentioned integrated form backboard and its production method the present invention relates to be used for back-contact photovoltaic module.The combined electrical interconnection member included for back-contact photovoltaic module integrated form backboard for providing the electrical connection between the conducting channel in back-contact barrier-layer cell and integrated form backboard.Technology of the invention be for the manufacturer of back-contact photovoltaic module in the urgent need to.The present invention can either improve the efficiency and durability of back-contact photovoltaic module, and the consumption of electroconductive binder can be greatlyd save again, so as to significantly reduce manufacturing cost.

Description

Integrated backplane, back-contact photovoltaic module and production method thereof

technical field

The invention relates to an integrated backplane for a back contact photovoltaic module, a back contact photovoltaic module comprising the integrated backplane and a production method thereof. In particular, the present invention relates to an integrated backplane for a back-contact photovoltaic module including a composite electrical interconnection member and a production method thereof, a back-contact photovoltaic module including a composite electrical interconnection member Voltaic modules and methods for their production.

Background technique

The use of photovoltaic (or solar) cells is rapidly expanding due to their ability to provide sustainable energy. In conventional silicon solar cells that have been commercialized, both the emitter and the emitter electrode are located in front of the cell.

In the manufacture of conventional photovoltaic modules, in order to achieve at least 20 years of weather resistance, photovoltaic cells are usually sandwiched or laminated between polymer encapsulation layers, and the front and back sheets are used to further enclose the light-generating The voltaic cell is isolated from the environment and provides mechanical support for the module. Therefore, the front panel and the back panel are also called outer protective layer panels.

In general, in a photovoltaic module derived from crystalline silicon cells, in order of position from the back (non-sun-facing side) to the front (sun-facing side), it has a laminated structure consisting of: (1) Backsheet, (2) back encapsulation layer, (3) photovoltaic cell, (4) front encapsulation layer, and (5) front sheet.

In the photovoltaic module with this structure, it is important that the materials (i.e. the front plate such as the glass plate and the front encapsulation layer) disposed on the sun-facing side of the back-contact photovoltaic cell have a high light transmittance, to allow enough sunlight to reach the photovoltaic cells.

The encapsulants (i.e. front and back encapsulants) are typically made of polymeric materials such as acid copolymers, ionomers, ethylene vinyl acetate (EVA), poly(vinyl acetal) (e.g. poly(ethylene butyral) (PVB)), polyurethane, poly(vinyl chloride), polyethylene (such as linear low density polyethylene), polyolefin block copolymer elastomers, α-olefins with α,β-ethylenic Copolymers of saturated carboxylic acid esters such as ethylene methyl acrylate and ethylene butyl acrylate, silicone elastomers, epoxy resins, and combinations of two or more of these polymeric materials. Among these materials, EVA has been the most popular choice for photovoltaic cell encapsulation layer materials. The front encapsulant layer may be laminated from one or more layers of polymeric material, and the back encapsulant layer may be laminated from one or more layers of polymeric material.

The emitter electrode of the conventional silicon photovoltaic cell that has been commercialized is located in front of the cell, which is beneficial to improve the charge carrier collection efficiency. However, this structure has its limitations: although the electrode occupies a small area, it will still block part of the sunlight, reducing the effective light-receiving area of the photovoltaic cell; The front is welded to the back of another battery, a connection that makes automated production more difficult. For this reason, the researchers transferred the electrodes located in the front of the battery to the back of the battery, and developed many back-contact photovoltaic cells with different structures. The back-contact photovoltaic cell refers to a photovoltaic cell in which all or part of the emitter electrode is located on the back of the cell. Back-contact cells have attracted the attention of the photovoltaic market due to their unique device structure, simple manufacturing process and high cell efficiency. The back contact battery has many advantages: ①High efficiency. The efficiency of the cell is improved by reducing or completely eliminating the shading loss of the front grid electrode. ②Suitable for automated assembly production. Adopting a brand-new component packaging mode for coplanar connection not only reduces the interval between cells, improves the packaging density, but also simplifies the manufacturing process and reduces the difficulty of packaging. ③ more beautiful. The front of the back-contact photovoltaic cell is uniform and beautiful, which meets the aesthetic requirements of consumers.

In the back-contact photovoltaic cell, due to the transfer of the front electrode of the cell to the back of the cell, the coverage of the silver paste on the light-receiving side of the front of the cell is reduced, thereby improving the efficiency of the back-contact photovoltaic cell.

Currently, the production process of back-contact photovoltaic modules is extremely complex and costly. For back-contact photovoltaic modules, the existing technology generally uses two methods to connect the electrodes on the back-contact photovoltaic cells and the conductive circuit arranged on the back plate (or substrate) to lead out the back-contact photovoltaic modules. The power produced by photovoltaic cells.

The first way is to fill the via holes in the EVA back encapsulation layer and/or the back insulation layer with a conductive adhesive. The disadvantage of this connection method is that a large amount of conductive adhesive needs to be used. Generally speaking, the conductive adhesive contains a large amount of silver particles, which is expensive, resulting in a significant increase in manufacturing costs. FIG. 1 is an exploded schematic diagram of a laminated structure of a prior art back-contact photovoltaic module. Figure 2 is a schematic cross-sectional view of a prior art back-contact photovoltaic module showing in detail the electrical contacts and contacts on the back side of the back-contact photovoltaic cell. An electrical interconnection member that provides electrical connection between conductive circuits. It can be seen from FIG. 1 and FIG. 2 that the back-contact photovoltaic module 1000 includes the following layers along the direction from the back (non-sun-facing side) to the front (sun-facing side): backplane (or substrate) 1010, A conductive circuit 1011 , a back insulation layer (or back encapsulation layer) 1020 , a back contact photovoltaic cell 1030 , a front encapsulation layer 1040 and a front plate 1050 are provided on the back plate. As shown in FIG. 2, the back side of the back contact photovoltaic cell 1030 has a plurality of electrical contacts 1031 aligned with the plurality of through holes 1021 on the back insulating layer 1020, the back contact photovoltaic cell 1030 There are also a plurality of electrode guide holes 1032 extending from the front side to the back side, which are aligned with the upper part of the electrical contacts 1031 on the back side of the back contact photovoltaic cell 1030 . The electrical connection between the electrical contacts 1031 provided on the back side of the back contact photovoltaic cell 1030 and the conductive circuit 1011 is through an electrical interconnection member filled in the plurality of through holes 1021 on the back insulating layer 1020 (i.e. conductive adhesive) 1022 provided. For the production of back-contact photovoltaic modules, the amount of conductive adhesive used is usually high.

In the second way, the interconnection strips are soldered directly to the electrodes on the backside of the back-contact photovoltaic cell and the interconnection strips are simultaneously used as backside circuits. Although the cost of this connection is lower, the production efficiency of the module is lower. Moreover, high-temperature welding will introduce higher thermal stress on the back-contact photovoltaic cells, resulting in a higher rate of cell damage. Since there is a specific positive and negative electrode corresponding structure between the interconnection strip circuit and the back contact photovoltaic cell, it is also necessary to solve the electrical insulation problem between the back contact photovoltaic cell and the interconnection strip.

Therefore, for manufacturers of back-contact photovoltaic modules, there is an urgent need for a cost-effective method for back-contact photovoltaic modules that can further improve cell performance and save the use of conductive adhesives. An integrated backsheet of a module, a back-contact photovoltaic module comprising the above-mentioned integrated backsheet, and a production method thereof.

Contents of the invention

The present invention successfully solves the above-mentioned problems existing in the prior art by a combined electrical interconnection member for providing electrical connection between the electrical contacts on the back side of the back-contact photovoltaic cell and the conductive circuit. question.

By using metal conductive parts in the combined electrical interconnection member to replace part of the conductive adhesive, the conductive efficiency between the back-contact photovoltaic cell and the conductive circuit is improved, thereby improving the reliability of the back-contact photovoltaic module. Photoelectric conversion efficiency. In addition, the application of this combined electrical interconnection member in the back-contact photovoltaic module can also reduce the manufacturing cost.

Specifically, the present invention relates to the following aspects:

1. An integrated backplane for a back-contact photovoltaic module, said integrated backplane comprising in sequence from the back to the front:

a substrate having a back side and a front side opposite to each other;

a conductive circuit disposed on the front side of the substrate;

a back insulating layer adjacent to the conductive circuit, the back insulating layer has a back side adjacent to the conductive circuit and a front side away from the conductive circuit, and the back insulating layer has a plurality of The back side of the back insulating layer extends to the through hole on the front side of the back insulating layer, the through hole is aligned with the conductive circuit;

Wherein, each of the plurality of through-holes is filled with a combined electrical interconnection member, and the combined electrical interconnection member includes a first electrical bonding component and a shape of the first electrical bonding component. Complementary at least one conductive part, and relative to the position of the at least one conductive part in the through hole, the first conductive adhesive part is close to the front side of the back insulating layer;

When the integrated backsheet is used to produce a back contact photovoltaic module, the first electrical bonding part of the combined electrical interconnection member is adhered to the electrical connection on the back side of the back contact photovoltaic cell. on the contacts.

2. The integrated backplane according to aspect 1, wherein the at least one conductive component is made of one or more metal materials.

3. The integrated backplane according to aspect 2, wherein the one or more metal materials are selected from the group consisting of copper, aluminum, tungsten, tin, nickel, titanium, silver-plated copper, nickel-plated copper, Group of substances of tin-copper, tin-plated aluminum, gold-plated nickel, stainless steel, and their alloys and combinations.

4. The integrated backplane according to aspect 3, wherein the at least one conductive component is in the form of one or more of sheets, blocks, nets and combinations thereof.

5. The integrated backplane according to aspect 1, characterized in that, in the combined electrical interconnection member, the at least one conductive component accounts for 3-95% of the total volume of the combined electrical interconnection member .

6. The integrated backplane according to aspect 1, wherein the first electrical bonding component is made of a conductive material including at least 5% (volume percentage) of a polymer material.

7. The integrated backplane according to aspect 6, wherein the first electrical bonding member is made of a conductive polymer material.

8. The integrated backplane according to aspect 6, wherein the first electrical bonding member is made of a conductive adhesive, and the conductive adhesive includes a polymer material and conductive particles dispersed therein.

9. The integrated backplane according to aspect 7, wherein the conductive particles are selected from the group consisting of gold, silver, nickel, copper, aluminum, tin, zinc, titanium, tin, bismuth, tungsten, lead and alloys thereof group.

10. The integrated backplane of any one of aspects 1-9, wherein the at least one conductive component is directly adhered to the conductive circuit.

11. The integrated backplane according to any one of aspects 1-9, wherein the combined electrical interconnection member further comprises a second electrical bonding part, relative to the at least one conductive part at the In terms of the position in the through hole, the second electrical bonding member is close to the back side of the back insulating layer and is adhered to the conductive circuit, and the second electrical bonding member is connected to the at least One conductive member is complementary in shape.

12. The integrated backplane according to aspect 11, wherein the second electrical bonding component is made of conductive adhesive, conductive polymer material or solder.

13. The integrated backsheet according to aspect 1, wherein the back insulation layer is made of ethylene-vinyl acetate copolymer (EVA), ionomer (ionomer) or poly(vinyl butyral) ( PVB) polymer composition.

14. A back-contact photovoltaic module, said back-contact photovoltaic module sequentially comprising:

An integrated backplane according to any one of aspects 1-13;

A back contact photovoltaic cell having a front light receiving side and a back side opposite to each other and a plurality of electrical contacts are formed on the back side of the back contact photovoltaic cell On the side, the back side of the back contact photovoltaic cell is adjacent to the back insulating layer of the integrated back sheet;

a front encapsulation layer adjacent to the front side of the back contact photovoltaic cell; and

A transparent front plate adjacent to the front encapsulation layer.

15. The back-contact photovoltaic module according to aspect 14, wherein the back-contact photovoltaic cell is a photovoltaic cell that has undergone a metallization through-winding (MWT) treatment.

16. A method of producing an integrated backsheet for a back-contact photovoltaic module, said method comprising the steps of:

(a) providing a substrate having a back side and a front side opposite to each other;

(b) providing conductive circuitry on said front side of said substrate;

(c) stacking a back insulating layer on the conductive circuit, wherein the back insulating layer has a plurality of through holes extending from the back side of the back insulating layer to the front side of the back insulating layer so that the through-holes are aligned with the conductive circuit, wherein at least one conductive member and a first electrical bonding member are filled in each of the plurality of through-holes to fill the through-holes, the at least one conductive member is close to The back side of the back insulating layer adjacent to the conductive circuit, the first electrical bonding member is close to the front side of the back insulating layer away from the conductive circuit, and the at least one conductive member is connected to the first The electrically bonded components are complementary in shape and together form part of a combined electrical interconnection structure;

(d) thermocompression lamination of the multilayer structure obtained from step (c) to obtain said integrated backsheet.

17. The method for producing an integrated backplane for a back-contact photovoltaic module according to aspect 16, wherein at least one of the plurality of through-holes in step (c) and step (d) A conductive member is in direct contact with the conductive circuit.

18. The method for producing an integrated backplane for a back-contact photovoltaic module according to aspect 16, wherein in step (c), in each of the plurality of through-holes further filling a second electrical bonding member so that it is positioned adjacent to the back side of the back insulating layer, complementary in shape to the at least one conductive member, and in direct contact with the conductive circuit, such that the at least one conductive member is interposed between said first and second electrical bonding members and jointly forming an integral part of said combined electrical interconnection member, and in step (d) said combined electrical interconnection member is Two electrobonding members are adhered to the conductive circuit.

19. A method of producing a back-contact photovoltaic module, said method comprising the steps of:

(a) providing a substrate having a back side and a front side opposite to each other;

(b) providing conductive circuitry on said front side of said substrate;

(c) stacking a back insulating layer on the conductive circuit, wherein the back insulating layer has a plurality of through holes extending from the back side of the back insulating layer to the front side of the back insulating layer so that the The through hole is aligned with the conductive circuit, wherein at least one conductive member and a first electrical bonding member are filled in each hole of the plurality of through holes so as to fill the through hole, and the at least one conductive member is close to The back side of the back insulating layer adjacent to the conductive circuit, the first electrical bonding member is close to the front side of the back insulating layer away from the conductive circuit, and the at least one conductive member is connected to the first The electrically bonded components are complementary in shape and together form part of a combined electrical interconnection structure;

(d) stacking a back-contact photovoltaic cell having a front light-receiving side and a back side opposite to each other and a plurality of electrical contacts formed on the back side on the back insulating layer and making the plurality The first electrical bonding member in each through hole is in direct contact with a plurality of electrical contacts on the back side of the back contact photovoltaic cell;

(e) laminating a front encapsulation layer on said front light receiving side of said back contact photovoltaic cell;

(f) laminating a transparent front sheet over said front encapsulation layer;

(g) hot press lamination of the multilayer structure obtained from step (f) to obtain said back contact photovoltaic module.

20. The method for producing a back-contact photovoltaic module according to aspect 19, wherein in step (c), at least one conductive member in the plurality of through holes is in direct contact with the conductive circuit, and In step (g) the first electrical bonding member is adhered to a plurality of electrical contacts on the back side of the back contact photovoltaic cell.

21. The method for producing a back-contact photovoltaic module according to aspect 20, wherein in step (c), each of the plurality of through-holes is further filled with a second electrical bonding member It is placed close to the back side of the back insulating layer, complementary in shape to the at least one conductive component and in direct contact with the conductive circuit, so that the at least one conductive component is placed on the first electro-adhesive between the junction member and the second electrical bonding member and jointly form an integral part of the combined electrical interconnection member, and in step (g), the second electrical bonding member is adhered to the on conductive circuits.

22. A method of producing a back-contact photovoltaic module, said method comprising the steps of:

(a) preparing an integrated backplane using a method as described in any one of aspects 16-18;

(b) stacking a back contact photovoltaic cell having a front light receiving side and a back side facing each other and a plurality of electrical contacts formed on the back side on the integrated back sheet and making the a first electrical bonding member in the plurality of through holes is in direct contact with a plurality of electrical contacts on the back side of the back contact photovoltaic cell;

(c) laminating a front encapsulation layer on said front light receiving side of said back contact photovoltaic cell;

(d) laminating a transparent front sheet over said front encapsulation layer;

(e) hot press lamination of the multilayer structure obtained from step (d) to obtain said back contact photovoltaic module.

The present invention particularly has the following beneficial effects:

The technique of the present invention is urgently needed for producers of back-contact photovoltaic modules. The invention can not only improve the efficiency and durability of the back-contact photovoltaic module, but also can greatly save the amount of conductive adhesive, and at the same time greatly reduce the manufacturing cost and have considerable cost-effectiveness.

The advantages and features of novelty which characterize the invention are pointed out with particularity in the claims annexed to and forming a part hereof. However, for a better understanding of the invention, its advantages and objects attained by its application, reference should be made to the accompanying drawings forming a further part hereof, and to the accompanying matters of a descriptive nature, in which there is illustrated and described one or more aspects of the invention. Multiple preferred embodiments.

Description of drawings

The present invention will be described in detail below in conjunction with the accompanying drawings. The drawings in the specification are not necessarily drawn to scale and are merely schematic representations. In the drawings of the specification of the present application, the same or similar reference numerals are used to denote the same or similar elements.

1 is an exploded schematic diagram of a laminated structure of a back contact photovoltaic module of the prior art;

Figure 2 is a schematic cross-sectional view of a prior art back-contact photovoltaic module showing in detail the electrical contacts and contacts on the back side of the back-contact photovoltaic cell. an electrical interconnection member providing electrical connection between said conductive circuits;

3 is a schematic cross-sectional view of a back-contact photovoltaic module comprising a first embodiment of the combined electrical interconnection member of the present invention;

4 is a schematic cross-sectional view of a back-contact photovoltaic module comprising a second embodiment of the combined electrical interconnection member of the present invention; and

5a-5e are schematic flowcharts of the production method of the back-contact photovoltaic module shown in FIG. 4 .

List of parts and reference signs

1000 Back Contact Photovoltaic Modules 1010 Substrate 1011 conductive circuit 1020 back insulating layer 1021 through hole 1022 electrical interconnection member 1030 Back Contact Photovoltaic Cell 1031 electrical contacts 1032 electrode guide hole 1040 Front encapsulation layer 1050 Ger 2000 Back Contact Photovoltaic Modules 2010 Substrate 2011 conductive circuit 2020 back insulating layer 2021 through hole 2022 electrical interconnection member 2022a first electrical bonding member 2022b Conductive parts 2030 Back Contact Photovoltaic Cell 2031 electrical contacts 2040 Front encapsulation layer 2050 Ger 3000 Back Contact Photovoltaic Modules 3010 Substrate 3011 conductive circuit 3020 back insulating layer 3021 through hole 3022 electrical interconnection member 3022a first electrical bonding member 3022b Conductive parts 3022c second electrical bonding member 3030 Back Contact Photovoltaic Cell 3031 electrical contacts 3040 Front encapsulation layer 3050 Ger 3000a Back-contact photovoltaic module assembly (substrate with conductive circuits) in the first production step 3000b Back contact photovoltaic module assembly in second production step 3000c Back-contact photovoltaic module assembly (integrated backsheet) in the third production step 3000d Back contact photovoltaic module assembly in fourth production step 3000e Back contact photovoltaic module assembly in fifth production step

detailed description

Unless otherwise limited by particular circumstances, the following definitions apply to the terms used in this specification.

Moreover, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control.

Although methods and materials similar or equivalent to those described herein can be used in the practice or testing of the present invention, suitable methods and materials are those described herein.

Definitions of some terms used in this application are as follows:

As used herein, the directional terms "upper" and "lower" are consistent with the specific directions on the paper of the accompanying drawings.

As used herein, the directional terms "front", "back", "front side" and "back side" are consistent with the conventional nomenclature for back-contact photovoltaic modules in the art.

As used herein, the term "about" means that quantities, dimensions, formulations, parameters, and other quantities and characteristics are not exact and need not be exact values, but may be approximately and/or greater or less than exact values, so that Reflect tolerances, conversion factors, rounding off of values, measurement errors, etc., and other factors known to those skilled in the art. In general, an amount, size, formulation, parameter or other quantity or characteristic is "about" or "approximate", whether or not such explicit statement is made.

Furthermore, ranges stated herein include their endpoints unless expressly stated in rare cases. Furthermore, when an amount, concentration or other value or parameter is given in the form of a range, one or more preferred ranges or a listing of preferred upper and preferred lower values, it is to be understood that any range upper or preferred value is specifically disclosed All ranges constituted by any pair of any range lower limit or preferred value, whether or not such ranges are individually disclosed.

Further, where a numerical range is recited herein, that range is intended to include its endpoints and all integers and fractions within that range, unless otherwise indicated in a specific instance. It is not intended that the scope of the invention be limited to the specific values recited when defining a range. Finally, when the term "about" is used to describe a value or an endpoint of a range, the disclosure should be understood to include that specific value or endpoint referred to.

When the phrase "known to those skilled in the art", or a synonymous word or phrase, is used herein to describe a material, method, or mechanical device, this term means that the material, method, and mechanical device were described at the time of filing this patent application. are routine and are included in this description. Also encompassed in this description are materials, methods, and machinery that are not presently conventional but would become art-recognized when adapted for a similar purpose.

As used herein, the terms "comprises," "comprising," "including," "covers," "characterized by," "having," or any other synonym or any other variation thereof, mean a non-exclusive inclusion. For example, a process, method, article, or apparatus that includes a particular list of elements is not necessarily limited to those specifically listed elements, but may include other elements not expressly listed, or inherent to such a process, method, article, or apparatus.

The transitional phrase "consisting essentially of" limits the scope of the claim to the specified materials or steps, and those materials or steps that do not substantially affect the essential and novel features of the claimed invention. "'Consisting essentially of' claims fall within the scope of closed claims written in the 'consisting of' format and fully open claims written in the 'comprises/comprises' format."

When applicants use open-ended terms such as "comprising" to describe an invention or a portion thereof, it should be understood that the description also includes descriptions of the invention using the above-defined term "consisting essentially of" unless specifically stated otherwise. circumstances are specified.

The quantifiers "a" and "an" are used to describe an element or component of the invention. Use of these quantifiers is intended to indicate the presence of one or at least one of these elements or components. While such quantifiers are generally used to indicate that the noun they modify is singular, as used herein, the quantifiers "a" and "an" also include plurals unless the specific context dictates otherwise. Likewise, as used herein, the demonstrative pronoun "the" also means that the noun it modifies may be singular or plural, unless the specific circumstances indicate otherwise.

As used herein, the term "back contact photovoltaic module" means a functional finished device including a multilayer laminate structure such as shown in Figure 3 and Figure 4 of the present application; the term "back contact photovoltaic module assembly" means the multi-layer semi-finished assembly formed during the lamination process for the production of back-contact photovoltaic modules; the term "back-contact photovoltaic cell" means the The core functional components that are transformed into electrical energy.

In addition, the term "back insulating layer" means one or more polymer films or sheets located between the conductive circuit and the back-contact photovoltaic cells in the back-contact photovoltaic module, which function as encapsulation and insulation role.

The term "copolymer" refers to a polymer comprising interpolymerized units or residues resulting from the copolymerization of two or more comonomers. In this regard, a copolymer may be described herein in combination with its constituent comonomers or the amount of its constituent comonomers, e.g. "copolymer comprising ethylene and 9% by weight acrylic acid", or a similar description of. Such a description can be considered informal because it does not treat comonomers as comonomer units; because it does not include conventional nomenclature for copolymers, such as that of the International Union of Pure and Applied Chemistry (IUPAC); because it Not using method-qualified item terms; or for other reasons. However, as used herein, a description of a copolymer in connection with its constituent comonomers or amounts of its constituent comonomers means that the copolymer contains interpolymerized units of the specified comonomers (in the specified amounts when specified). From this it follows that a copolymer is not the product of a reaction mixture comprising a given amount of a given comonomer, unless such explicit statement is made in limited cases.

The term "acid copolymer" means a compound comprising an α-olefin, an α,β-ethylenically unsaturated carboxylic acid, and optionally other suitable comonomers (such as an α,β-ethylenically unsaturated carboxylic acid ester) polymers of copolymerized units.

The term "ionomer" refers to a polymer prepared by partially or completely neutralizing an acid copolymer as described above. More specifically, ionomers contain ionic groups that are metal ion carboxylates, such as alkali metal carboxylates, alkaline earth metal carboxylates, transition metal carboxylates, and derivatives of such carboxylates. mixture. As defined herein, such polymers are generally prepared by partially or completely neutralizing (for example by reacting with a base) the carboxylic acid groups of a precursor or matrix polymer, where the precursor or matrix polymer is an acid copolymer. Examples of alkali metal ionomers useful herein are sodium ionomers (or sodium neutralized ionomers), such as copolymers of ethylene and methacrylic acid, in which all of the carboxylic acid groups of the copolymerized methacrylic acid units Or partly in the form of sodium carboxylate.

As used herein, alone or in combination (eg, "laminated" or "laminated"), the term "laminate" refers to a structure having at least two layers firmly adhered or bonded to each other. These layers may be adhered to each other directly or indirectly. "Directly" means that there is no additional material between the two layers, such as an interlayer or an adhesive layer; "indirectly" means that there is additional material between the two layers.

The materials, methods, and examples herein are illustrative only and not intended to be limiting unless specifically stated otherwise.

Finally, all percentages, parts, etc., recited herein are by weight unless otherwise indicated in a particular instance.

Multiple embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

Fig. 3 is a schematic cross-sectional view of a back-contact photovoltaic module 2000 comprising a first embodiment of the combined electrical interconnection member of the present invention. The back contact photovoltaic module 2000 of the present invention is made of multi-layer lamination. As shown in FIG. 3 , the back-contact photovoltaic module 2000 of the present invention includes the following layers sequentially along the direction from the back (non-sun-facing side) to the front (sun-facing side): a substrate 2010 , a substrate disposed on the substrate 2010 A conductive circuit 2011, a back insulating layer 2020 with a plurality of through holes (not shown in the figure), a back contact photovoltaic cell 2030, a front encapsulation layer 2040, a front plate 2050, any of which are Has a front side (sun-facing side) and a back side (non-sun-facing side). The back contact photovoltaic cell 2030 has a front light receiving side (upper side of the back contact photovoltaic cell 2030 in FIG. 3 ) and a back side (upper side of the back contact photovoltaic cell 2030 in FIG. 3 ) facing each other. lower side), and a plurality of electrical contacts 2031 are formed on the back side of the back contact photovoltaic cell, the back side of the back contact photovoltaic cell 2030 is in contact with the back insulating layer 2020 are adjacent, and a plurality of electrical contacts 2031 on the back side thereof are aligned with a plurality of through holes 2021 (not shown in the figure) in the back insulating layer 2020; each of the plurality of through holes It is filled with combined electrical interconnection member 2022 (not shown in the figure), and the electrical connection between the electrical contact 2031 and the conductive circuit 2011 is filled in a plurality of through holes 2021 (not shown in the figure) through these An electrical interconnection member 2022 is provided. The electrical interconnection member 2022 includes a first electrical bonding feature 2022a and one or more conductive features 2022b complementary in shape thereto. In the back-contact photovoltaic module 2000, the first electrical bonding member 2022a is adhered to the electrical contact 2031, and the one or more conductive members 2022b are directly connected to the conductive circuit 2011 disposed on the substrate 2010. Contact, thereby realizing the electrical connection between the electrical contact 2031 on the back side of the back contact photovoltaic cell 2030 and the conductive circuit 2011 on the substrate 2010 via the first embodiment of the combined electrical interconnection member of the present invention .

The front sheet 2050 of the back contact photovoltaic module 2000 such as a glass sheet and the front encapsulation layer 2040 preferably have a high light transmittance to allow sufficient sunlight to reach the back contact photovoltaic cells 2030 . In the back contact photovoltaic module 2000 of the present invention shown in FIG. 3 , both the front sheet 2050 and the front encapsulation layer 2040 are transparent. The front encapsulation layer 2040 and the back insulation layer 2020 may be respectively made of a polymer material such as ethylene-vinyl acetate (EVA). Each of the front encapsulation layer 2040 and the back insulating layer 2020 may be formed by laminating one or more layers of polymeric material. Specifically, the material used to form the front encapsulation layer 2040 and/or the back insulating layer 2020 may be selected from materials including ethylene-vinyl acetate copolymer (EVA), ionomer (ionomer) or poly(vinyl butyral) ( Composition of polymers of PVB). Wherein, the back insulating layer 2020 can be a single-layer or multi-layer structure, which not only plays the role of encapsulating the battery, but also plays the role of electrical insulation between the battery and the conductive circuit. In the back contact photovoltaic module 2000 , the back contact photovoltaic cell 2030 is a photovoltaic cell that has undergone a metallization through winding process (MWT). In the electrical interconnection member 2022, the first electrical bonding part 2022a is made of a conductive adhesive or a conductive polymer material, the conductive adhesive includes a polymer material and conductive particles dispersed therein, and the conductive particles are selected from From the group including gold, silver, nickel, copper, aluminum, tin, zinc, titanium, tin, bismuth, tungsten, lead, and alloys thereof. For example, the first electrical bonding member 2022a may be made of a conductive material including at least 5% (volume percent) polymer material. The one or more conductive components 2022b may be made of one or more metal materials selected from the group consisting of copper, aluminum, tungsten, tin, nickel, titanium, silver-plated copper, plated Group of substances for nickel-copper, tin-plated copper, tin-plated aluminum, gold-plated nickel, stainless steel, and their alloys and combinations. The one or more conductive components may be in a form including one or more of a sheet, block, mesh, and combinations thereof. In the combined electrical interconnection member 2022, the at least one conductive component accounts for 3-95% of the total volume of the combined electrical interconnection member. For example, in the composite electrical interconnection member 2022, the conductive member 2022b may be a metal (eg, copper) sheet or mesh. Preferably, the electrical conductivity of the conductive part in the combined electrical interconnection member is greater than the electrical conductivity of the first electrical bonding part. This is more conducive to improving the efficiency of the back-contact photovoltaic module.

FIG. 4 is a schematic cross-sectional view of a laminated structure of a back-contact photovoltaic module 3000 comprising a second embodiment of the combined electrical interconnection member of the present invention. The back contact photovoltaic module 3000 has a similar structure to the back contact photovoltaic module 2000 shown in FIG. The member 3022 includes a first electrical bonding feature 3022a, one or more conductive features 3022b complementary in shape thereto, and a second electrical bonding feature 3022c complementary in shape to the conductive features 3022b. The second electrical bonding member 3022c can be made of conductive adhesive, conductive polymer material or solder. In the laminate structure of the back contact photovoltaic module 3000, the first electrical bonding member 3022a is adhered to the electrical contacts 3031, and the second electrical bonding member 3022c is adhered to the conductive circuit 3011 , so that the electrical connection between the electrical contacts 3031 on the back side of the back-contact photovoltaic cell 3030 and the conductive circuit 3011 on the substrate is realized via the second embodiment of the combined electrical interconnection member of the present invention. For those skilled in the art, it is also conceivable that the conductive member 3022b can be copper sheet (foil), copper mesh, stainless steel mesh (sheet), regular-shaped metal conductive member, irregular-shaped metal conductive member, etc. One or more components, as long as the following conditions are met: the at least one conductive component fills the through hole 3021 in a complementary shape to the first electrical bonding component 3022a and the second electrical bonding component 3022c. It can be seen that the second electrical bonding component 3022c plays a role in making the electrical interconnection member 3022 electrically communicate with the conductive circuit 3011 on the substrate 3010 . Preferably, the electrical conductivity of the conductive part in the combined electrical interconnection member is greater than the electrical conductivity of the first electrical bonding part and/or the electrical conductivity of the second electrical bonding part. This is more conducive to improving the efficiency of the back-contact photovoltaic module.

In this application, part of the back contact photovoltaic modules 2000, 3000 except the back contact photovoltaic cells 2030, 3030, front encapsulation layers 2040, 3040, and front plates 2050, 3050 can be produced in units, The unit is called an "integrated backplane", as shown in Figure 5c. The unitized production of the integrated backsheet is very advantageous for the production of the back contact photovoltaic modules 2000, 3000 of the present invention.

The present invention discloses an integrated backplane for a back-contact photovoltaic module, said integrated backplane sequentially comprising: a substrate 2010 having a back side and a front side opposite to each other along the direction from the back side to the front side a conductive circuit 2011 disposed on the front side of the substrate; a back insulating layer 2020 adjacent to the conductive circuit, the back insulating layer having a back side adjacent to the conductive circuit and away from The front side of the conductive circuit, and the back insulating layer has a plurality of through holes 2021 (not shown) extending from the back side of the back insulating layer to the front side of the back insulating layer; wherein, Each of the plurality of through-holes is filled with a combined electrical interconnection member comprising a first electrical bonding component 2022a and a shape complementary to the first electrical bonding component. At least one conductive part 2022b of the at least one conductive part 2022b, and relative to the position of the at least one conductive part in the through hole, the first conductive adhesive part is close to the front side of the back insulating layer; when using the integrated When producing a back contact photovoltaic module 2000 with a back sheet, the first electrical bonding part of the combined electrical interconnection member is adhered to the electrical contacts 2031 on the back side of the back contact photovoltaic cell .

In the integrated backplane, the combined electrical interconnection member may further include a second electrical bonding part 3022c, and relative to the position of the at least one conductive part in the through hole, the first Two electrical bonding components are attached to the conductive circuit 3011 near the back side of the back insulating layer, and the second point bonding component is complementary in shape to the at least one conductive component.

The present invention also discloses a method for producing an integrated backplane 3000c for a photovoltaic cell module 3000, the method comprising the following steps (see Figures 5a-5c):

(a) providing a substrate 3010 having a back side and a front side opposite to each other;

(b) providing a conductive circuit 3011 on the front side of the substrate 3010, thereby forming an assembly 3000a, as shown in FIG. 5a;

(c) Overlaying the back insulating layer 3020 on the conductive circuit, wherein the back insulating layer 3020 has a plurality of through holes 3021 extending from the back side of the back insulating layer to the front side of the back insulating layer , aligning the through hole 3021 with the conductive circuit 3011, thereby forming an assembly 3000b, as shown in FIG. 5b;

(d) Further, filling the second electrical bonding member 3022c, at least one conductive member and the first electrical bonding member 3022a in each of the plurality of through holes 3021, and filling the through holes 3021, the first electrical bonding member 3022a is close to the front side of the back insulating layer 3020 away from the conductive circuit 3011, and the second electrical bonding member 3022c is close to the back side of the back insulating layer 3020, so The at least one conductive component 3022b is placed between the first electrical bonding component 3022a and the second electrical bonding component 3022c, and is complementary in shape to become an integral part of the combined electrical interconnection member;

(e) heat press lamination of the multilayer structure obtained in step (d) to obtain the integrated backsheet 3000c ( FIG. 5c ), wherein the second electrical bonding member 3022c is adhered to the conductive circuit 3011 superior.

In another optional mode of the production method of the integrated backplane of the present invention (ie, the method of producing the integrated backplane for the photovoltaic cell module 2000), the method includes the following steps:

(a) providing a substrate having a back side and a front side opposite to each other;

(b) providing conductive circuitry on said front side of said substrate;

(c) stacking a back insulating layer on the conductive circuit, wherein the back insulating layer has a plurality of through holes extending from the back side of the back insulating layer to the front side of the back insulating layer so that the the through hole is aligned with the conductive circuit;

(d) Further, at least one conductive member and a first electrical bonding member are filled in each of the plurality of through holes, and the through holes are filled, and the first electrical bonding member Near the back side of the back insulating layer, the at least one conductive part is complementary in shape to the first electrical bonding part and together become an integral part of a combined electrical interconnection member;

(e) thermocompression lamination of the multilayer structure resulting from step (d) to obtain an integrated backplane, wherein said conductive members are in direct contact with the conductive circuits.

The present invention also discloses a method of producing a back-contact photovoltaic module 3000, the method comprising the following steps (see Figures 5c-5e):

(f) After the above-mentioned integrated back sheet 3000c is produced as above, the back contact photovoltaic cell 3030 is further stacked on the front of the back insulation layer 3020, and the back side of the back contact photovoltaic cell 3030 is The electrical contact 3031 of the electrical contact 3031 is aligned with the through hole 3021 on the back insulation layer 3020, and the assembly formed thereby is shown in FIG. 5d;

(g) stacking the front encapsulation layer 3040 on the front light receiving side of the back contact photovoltaic cell 3030, the resulting assembly is shown in Figure 5e;

(h) Laminating a transparent front sheet 3050 on the front side of said front encapsulation layer 3040; and laminating the multilayer structure obtained above to obtain a back-contact photovoltaic module 3000 (see FIG. 4 ).

In the thus obtained back-contact photovoltaic module 3000, the first electrical bonding part 3022a and the second electrical bonding part 3022c among the plurality of combined electrical interconnection members 3022 are respectively adhered to the back-contact photovoltaic module 3000. Connect the electrical contact 3031 on the back side of the battery 3030 and the conductive circuit 3011, so that the electrical connection between the back contact photovoltaic cell 3030 and the conductive circuit 3011 is realized.

For the production method of the back-contact photovoltaic module 2000 shown in FIG. 3 , it is only necessary to slightly improve the production method of the above-mentioned back-contact photovoltaic module 3000 . Specifically, the method includes the following steps:

(f) After producing the above-mentioned integrated back sheet for the photovoltaic cell module 2000, further stacking the back-contact photovoltaic cell on the front of the back insulating layer, and making the back-contact photovoltaic cell the electrical contacts on the back side of the voltaic cell are aligned with the through-holes on said back insulating layer;

(g) laminating a front encapsulation layer on the front light receiving side of said back contact photovoltaic cell;

(h) Laminating a transparent front sheet on the front side of the front encapsulation layer; and laminating the multilayer structure obtained above to obtain a back contact photovoltaic module 2000 (see FIG. 3 ).

Another option is that, in the method of producing the back-contact photovoltaic module shown in Fig. 3 and Fig. 4, the through-holes on the back insulating layer may also be filled with combined electrical interconnections After the component, lamination is not carried out, but the back-contact photovoltaic cell is directly further stacked on the front side of the back insulating layer, and the electrical contacts on the back side of the back-contact photovoltaic cell are connected to the Through-hole alignment on the back insulation layer;

stacking the front encapsulation layer on the front light receiving side of the back contact photovoltaic cell;

stacking a transparent front sheet on the front side of the encapsulation layer; and

The multilayer structure obtained above was laminated to obtain a back contact photovoltaic module 3000 .

Those skilled in the art can realize that the method for manufacturing the above-mentioned back-contact photovoltaic module is not limited thereto. For example, the back insulation layer 3020 having a plurality of through holes 3021 can also be laminated with the back contact photovoltaic cells 3030 first, filled with the composite electrical interconnection member, and then laminated with other layers.

The technique of the present invention is urgently needed for producers of back-contact photovoltaic modules. The back-contact photovoltaic module including combined electrical interconnection components adopted in the present invention, the back-contact photovoltaic module including combined electrical interconnection components and the production method thereof can greatly save the amount of conductive adhesive , greatly reducing the manufacturing cost, and at the same time improving the performance of the back-contact photovoltaic module.

example

The beneficial technical effects of the present invention are described in further detail below through examples, but the present invention is not limited to the following examples.

The specific materials used in the photovoltaic module (photovoltaic module) of the present invention are as follows:

MWT cell : 156 mm polysilicon metal through-wound (MWT) back-contact photovoltaic cell was purchased from Shanghai JA Solar Photovoltaic Technology Co., Ltd.;

Glass plate : 3.2 mm ultra-clear glass purchased from Henan Sida New Energy Co., Ltd.;

EVA film-1 : a 450 micron thick ethylene-vinyl acetate copolymer (EVA) film purchased from Wenzhou Ruiyang Photovoltaic Materials Co., Ltd. under the brand name of "Revax ^TM ";

EVA film-2 : obtained by pressing EVA film-1 into a 250 micron film at a temperature of 100°C and a pressure of 20 MPa;

PET film : (both sides) ^corona -treated polyethylene terephthalate film (thickness 250 microns with a density of 1.40 g/cm ³ );

ECP-1 : a modified ethylene/acrylate copolymer resin (ethylene/acrylate copolymer) purchased from DuPont under the trade name Bynel® 22E757, with a density of 0.94 g/cm ³ and a melt index (MFI) of 8.0 g/10 min , with a melting point of 92°C;

ECP-2 : Ethylene methacrylic acid copolymer resin (Ethylene methacrylic acid copolymer) purchased from DuPont under the trade name Nucrel® 0910, containing 9% (weight percent) of methacrylic acid, with a density of 0.93 g/cm ³ , melt index (MFI is) 10.0 g/10 min, melting point is 100°C;

PVF film : polyvinyl fluoride (polyvinyl fluoride) oriented film purchased from DuPont under the trade name Tedlar®, with a thickness of 38 microns;

Adhesive : two-component polyurethane (polyurethane) adhesive purchased from Mitsui (Mitsui) Company with trade names PP-5430 and A50;

Copper foil-1 : 35 micron thick copper foil purchased from Suzhou Futian Metal Co., Ltd., China;

Copper foil-2 : 105 micron thick copper foil purchased from Suzhou Futian Metal Co., Ltd., China;

Copper mesh : a 310-mesh phosphor copper metal mesh with a wire diameter of 30 microns purchased from Hebei Yingkaimo Metal Mesh Co., Ltd.;

Stainless steel mesh : purchased from Hebei Yingkaimo Metal Mesh Co., Ltd., 300 mesh, wire diameter of 40 microns, made of 316 stainless steel mesh;

Conductive adhesive-1 : the conductive adhesive containing silver particles purchased from LORD Corporation (U.S.) under the trade name Thermoset® MD-140;

Conductive adhesive-2 : the conductive adhesive containing silver particles prepared as follows: now 33 grams of ethylene-vinyl acetate copolymer (EVA, purchased from DuPont with the trade name Elvax® PV1650) and 0.4 grams of peroxide (with the trade name LQ-TBEC was purchased from China Lanzhou Auxiliary Factory), 0.3 g of silane coupling agent (purchased from Japan Shin-Etsu Chemical Co., Ltd. under the trade name ^KBM403 ) and 0.12 g of antioxidant (purchased from BASF, Germany) premixed; then the resulting premix was mixed with 92 grams of amorphous silver powder with a particle size of 3-5 microns (Kunming Norman Electronic Materials Co., Ltd.) and 25 grams of spherical silver powder with a particle size of 5.4-11 microns (DuPont Company of the United States) obtained by internal mixing and blending at 80°C for 10 minutes;

Solder paste : lead-free solder paste purchased from Daikin Sakata Corporation in Japan under the trade name DK-309Bi;

Substrate with conductive circuit : prepared by (i) laminating PET film and PVF film with adhesive to form substrate; (ii) Extrusion laminator manufactured by Davis Standarded Company, at a temperature of 285°C 35 micron thick copper foil laminated to the PET film of the substrate with an adhesive layer (60 micron thick) in between made of a 1:1 (w/w) blend of ECP-1 and ECP-2 and (iii) a flat die-cutting press manufactured by Suzhou Chuanri Machinery Co., Ltd., China, was used to cut the metal foil and adhesive layers to form conductive circuits.

Photovoltaic module output power test method

The output power of photovoltaic modules is measured by using SPI-SUN Simulators 3500SLP solar simulator and PV module QA detector.

Comparative example 1 and example 1-2

In Comparative Example 1, the EVA film-1 with a plurality of through holes with a diameter of 3 mm was laminated on the back side of the MWT battery by hot pressing at 65°C for two minutes, and the through holes and the back side of the battery were laminated. corresponding to the electrodes. Next, inject the conductive glue-1 into the through hole, and the height is basically equal to the upper edge of the through hole. After drying at room temperature for half an hour, the EVA film-1 and glass were laminated to the front side of the MWT cell, with a conductive circuit substrate to its back side. Finally, a vacuum laminator was used to apply pressure to the laminated structure at 145 °C for 15 minutes to obtain a monolithic MWT photovoltaic module. Its output power is 3.65 watts.

In Example 1, the EVA film-1 with a plurality of through holes with a diameter of 3 mm was laminated on the back side of the MWT battery by hot pressing at 65°C for two minutes, and the through holes and the electrodes on the back side of the battery were laminated. correspond. Then, first inject a part of conductive adhesive-1 into the through hole, then add a 105 micron thick copper foil disc (the same diameter as the through hole), and finally inject another part of conductive adhesive-1 on the copper foil of the through hole, the total height It is basically level with the upper edge of the through hole. After drying at room temperature for half an hour, the EVA film-1 and glass were laminated to the front side of the MWT cell, with a conductive circuit substrate to its back side. Finally, a vacuum laminator was used to apply pressure to the laminated structure at 145 °C for 15 minutes to obtain a monolithic MWT photovoltaic module. After testing, the output power of Example 1 is 3.72 watts compared to 3.65 watts of Comparative Example 1, an increase of 2%.

In Example 2, the EVA film-1 with a plurality of through holes with a diameter of 3 mm was laminated on the back side of the MWT battery by hot pressing at 65°C for two minutes, and the through holes and the electrodes on the back side of the battery were laminated. correspond. Next, first inject a part of conductive glue-1 into the through hole, and then add a 410-micron thick metal disc (purchased from Wuxi Sveck Technology Co., Ltd. with a structure of plating 15 (µm)/copper (170 µm)/plating (40 µm)/copper (170 µm)/coating (15 µm) multilayer metal sheet, where the coating composition is a Sn/Pd/Ag alloy, and the weight ratio of Sn/Pd/Ag in the alloy is 62/36/2 , and its diameter is slightly smaller than the through hole), and finally inject another part of conductive adhesive-1 onto the copper foil of the through hole, and the total height is basically the same as the upper edge of the through hole. After drying at room temperature for half an hour, the EVA film-1 and glass were laminated to the front side of the MWT cell, with a conductive circuit substrate to its back side. Finally, a vacuum laminator was used to apply pressure to the laminated structure at 145 °C for 15 minutes to obtain a monolithic MWT photovoltaic module. After testing, the output power of Example 2 is 3.7 watts, an increase of 1.4% compared to 3.65 watts of Comparative Example 1.

Comparative example 2 and example 3

In Comparative Example 2, an EVA film-2 having a plurality of through holes with a diameter of 3 mm was laminated on a substrate with conductive circuits, and the through holes and the conductive circuits were made to correspond. Next, heat-press the conductive adhesive-2 (100°C) and die-cut a conductive film with a thickness of 250 microns and a diameter of 2.5 mm, and put it into each through-hole, and then hot-press at a temperature of 65°C for 2.5 minutes fixed. Finally, the MWT battery, EVA film-1 and glass were sequentially laminated on the back insulating layer with conductive adhesive, and the laminated structure was pressed at 145°C for 15 minutes using a vacuum laminator to obtain a monolithic MWT photovoltaic module. Its output power is 3.6 watts.

In Example 3, the solder paste was first printed and bonded on the conductive circuit, keeping the cross-sectional area, number and position of the solder paste dots to match the back electrode of the MWT battery. The EVA film-2 with multiple through-holes of 3 mm in diameter was then laminated on the substrate with conductive circuits, with the through-holes aligned with the solder paste dots. Hot-press conductive adhesive-2 onto copper foil with a thickness of 105 µm at 100 °C and keep the total thickness at 150 µm, then die-cut into conductive adhesive sheets with a diameter of 2.5 mm. Put the conductive film into each through-hole so that the copper surface is connected with the solder paste, and the upper surface of the conductive glue is basically flat with the upper edge of the through-hole. Finally, the MWT battery, EVA film-1 and glass were sequentially laminated on the back insulating layer with conductive adhesive, and the laminated structure was pressed at 145°C for 15 minutes using a vacuum laminator to obtain a monolithic MWT photovoltaic module. After testing, the output power of Example 3 is 3.74 watts, which is 3.9% higher than that of Comparative Example 2 (3.6 watts).

Comparative example 3 and example 4-5

In Comparative Example 3, the EVA film-1 with a plurality of through holes with a diameter of 3 mm was laminated on the back side of the MWT battery by hot pressing at 63°C for two minutes, and the through holes and the back side of the battery were made corresponding to the electrodes. Next, inject the conductive glue-1 into the through hole, and the height is basically equal to the upper edge of the through hole. After drying at room temperature for half an hour, the EVA film-1 and glass were laminated to the front side of the MWT cell, with a conductive circuit substrate to its back side. Finally, a vacuum laminator was used to apply pressure to the laminated structure at 145 °C for 15 minutes to obtain a monolithic MWT photovoltaic module. Its output power is 3.63 watts. After aging for 100 thermal cycles (IEC61215 standard test procedure, -40°C to 85°C cycle), its output power is 3.48 watts.

In Example 4, the EVA film-1 with a plurality of through holes with a diameter of 3 mm was laminated on the back side of the MWT battery by hot pressing at 63°C for two minutes, and the through holes and the electrodes on the back side of the battery were laminated. correspond. Next, inject conductive glue-1 into the through hole, and then put a copper mesh disc with the same diameter as the through hole. After drying at room temperature for half an hour, the EVA film-1 and glass were laminated to the front side of the MWT cell, with a conductive circuit substrate to its back side. Finally, a vacuum laminator was used to apply pressure to the laminated structure at 145 °C for 15 minutes to obtain a monolithic MWT photovoltaic module. After testing, the output power of Example 4 is 3.71 watts. After aging for 100 thermal cycles (IEC61215 standard test procedure, -40°C to 85°C cycle), its output power is 3.56 watts. Compared with Comparative Example 3, they have increased by 2.2% and 2.3% respectively.

In Example 5, the EVA film-1 with a plurality of through holes with a diameter of 3 mm was laminated on the back side of the MWT battery by hot pressing at 63°C for two minutes, and the through holes and the electrodes on the back side of the battery were laminated. correspond. Next, inject conductive glue-1 into the through hole, and then put a stainless steel mesh disc with the same diameter as the through hole. After drying at room temperature for half an hour, the EVA film-1 and glass were laminated to the front side of the MWT cell, with a conductive circuit substrate to its back side. Finally, a vacuum laminator was used to apply pressure to the laminated structure at 145 °C for 15 minutes to obtain a monolithic MWT photovoltaic module. After testing, the output power of Example 5 is 3.75 watts. After aging for 100 thermal cycles (IEC61215 standard test procedure, -40°C to 85°C cycle), its output power is 3.61 watts. Compared with Comparative Example 3, it has increased by 3.3% and 3.7% respectively.

While certain preferred embodiments of the invention have been described and specifically exemplified above, it is not intended to limit the invention to such embodiments. Furthermore, it is to be understood that while the foregoing description has shown many of the features and advantages of the invention, as well as details of construction and function of the invention, this disclosure is illustrative only and can be changed without departing from the invention. On the basis of the principles of the invention, the details of the invention are modified to the greatest extent within the broad general meaning of the terms used in the appended claims, especially as regards shape, size and arrangement of parts.

Claims (22)

1. a kind of integrated form backboard for back-contact photovoltaic module, the integrated form backboard is along from the back side to above Direction order include：

Substrate with rear side and front face side relative to each other；

It is arranged on the conducting channel in the front face side of the substrate；

The back of the body insulating barrier adjacent with the conducting channel, the back of the body insulating barrier has the rear side adjacent with the conducting channel Extended to multiple rear sides from the back of the body insulating barrier with the front face side away from the conducting channel, and the back of the body insulating barrier The through hole of the front face side of the back of the body insulating barrier, the through hole aligns with the conducting channel；

Wherein, the type electrical interconnection member that is combined of each through hole in the multiple through hole is full of, the combined electricity Interconnecting component includes that the first electricity bonds part and bonds at least one complementary conductive component of component shape with the described first electricity, and For position of at least one conductive component in the through hole, first electricity bonds part near described Carry on the back the front face side of insulating barrier；

When back-contact photovoltaic module is produced using the integrated form backboard, the first of the combined electrical interconnection member Electricity bonds part and is adhered on the electric contact above the rear side of back-contact barrier-layer cell.

2. integrated form backboard according to claim 1, it is characterised in that at least one conductive component is by a kind of or many Metal material is planted to be made.

3. integrated form backboard according to claim 2, it is characterised in that one or more metal material is selected to be included Copper, aluminium, tungsten, tin, nickel, titanium, silver-plated copper, nickel-clad copper, tin-coated copper, tin plating aluminium, gold-plated nickel, stainless steel and their alloy and group The material group of conjunction.

4. integrated form backboard according to claim 3, it is characterised in that at least one conductive component be include piece, One or more of form in block, net and combinations thereof.

5. integrated form backboard according to claim 1, it is characterised in that described in the combined electrical interconnection member At least one conductive component accounts for the 3-95 % of the combined electrical interconnection member cumulative volume.

6. integrated form backboard according to claim 1, it is characterised in that first electricity bonds part by including at least 5% （Volumn concentration）The conductive material of macromolecular material be made.

7. integrated form backboard according to claim 6, it is characterised in that first electricity bonds part by conducting polymer Material is made.

8. integrated form backboard according to claim 6, it is characterised in that first electricity bonds part by electroconductive binder It is made, the electroconductive binder includes macromolecular material and disperses conducting particles therein.

9. integrated form backboard according to claim 8, it is characterised in that the conducting particles be selected from include gold, silver, nickel, The group of copper, aluminium, tin, zinc, titanium, bismuth, tungsten, lead and its alloy.

10. the integrated form backboard according to any one of claim 1-9, it is characterised in that at least one conductive part Part is directly adhered in the conducting channel.

The 11. integrated form backboard according to any one of claim 1-9, it is characterised in that the combined electrical interconnection structure Part further include the second electricity bond part, position relative at least one conductive component in the through hole and Speech, second electricity bonds part near the rear side of the back of the body insulating barrier and is adhered in the conducting channel, and described It is complementary with least one conductive component shape that second electricity bonds part.

12. integrated form backboards according to claim 11, it is characterised in that second electricity bonds part by conductive adhesion Agent, conducting polymer composite or solder are made.

13. integrated form backboards according to claim 1, it is characterised in that the back of the body insulating barrier is by comprising ethyl vinyl acetate second Alkene copolymer（EVA）, ionomer (ionomer) or poly-（Vinyl butyral）(PVB) polymer composition is made.

A kind of 14. back-contact photovoltaic modules, the back-contact photovoltaic module is along from the back side to side above Include to order：

Integrated form backboard according to any one of claim 1-13；

Back-contact barrier-layer cell, the back-contact barrier-layer cell have before relative to each other light-receiving side and Rear side, and multiple electric contact is formed in above the rear side of the back-contact barrier-layer cell, the back contacts The rear side of formula barrier-layer cell is abutted with the back of the body insulating barrier of the integrated form backboard；

The preceding encapsulated layer adjacent with the front face side of the back-contact barrier-layer cell；With

The transparent front plate adjacent with the preceding encapsulated layer.

15. back-contact photovoltaic modules according to claim 14, it is characterised in that the back-contact photoproduction volt It is to be processed through winding by metallizing to play battery（MWT）Barrier-layer cell.

A kind of 16. methods for producing the integrated form backboard for back-contact photovoltaic module, methods described includes following step Suddenly：

A () provides the substrate with rear side and front face side relative to each other；

B () sets conducting channel in the front face side of the substrate；

C () is stacked in insulating barrier is carried on the back in the conducting channel, wherein the back of the body insulating barrier has multiple from the back of the body insulating barrier Rear side extend to the back of the body insulating barrier front face side through hole, the through hole is directed at the conducting channel, wherein, At least filled in each through hole of the multiple through hole at least one conductive component and first electricity bond part so as to Full of the through hole, at least one conductive component is near the back side neighbouring with the conducting channel of the back of the body insulating barrier Side, first electricity bonds front face side away from the conducting channel of the part near the back of the body insulating barrier, and described at least one Individual conductive component and the first electricity bond component shape complementation and the jointly part as combined electrical interconnection member；

D the laminated sandwich construction obtained by step (c) of () hot pressing is to obtain the integrated form backboard.

17. methods for producing the integrated form backboard for back-contact photovoltaic module according to claim 16, its It is characterised by, at least one of multiple through holes conductive component and conduction described in step (c) and step (d) Circuit directly contact.

18. methods for producing the integrated form backboard for back-contact photovoltaic module according to claim 16, its It is characterised by, in step (c), the second electric binding part is further filled in each through hole of the multiple through hole Part makes it be disposed close to rear side and at least one conductive component shape complementation for carrying on the back insulating barrier and be led with described Circuit directly contact so that at least one conductive component be placed in it is described first and second electricity bond parts between simultaneously It is collectively forming the part of the combined electrical interconnection member, and the combined electrical interconnection member described in step (d) Part is bonded by means of the described second electricity to be adhered in the conducting channel.

A kind of 19. methods for producing back-contact photovoltaic module, the described method comprises the following steps：

A () provides the substrate with rear side and front face side relative to each other；

B () sets conducting channel in the front face side of the substrate；

C () is stacked in insulating barrier is carried on the back in the conducting channel, wherein the back of the body insulating barrier has multiple from the back of the body insulating barrier Rear side extend to the back of the body insulating barrier front face side through hole, the through hole is directed at the conducting channel, wherein, At least one conductive component is at least filled in each hole of the multiple through hole and the first electricity bonds part so as to be full of The through hole, at least one conductive component is close to the rear side neighbouring with the conducting channel of the back of the body insulating barrier, First electricity bonds front face side away from the conducting channel of the part near the back of the body insulating barrier, and described at least one leads Electric part and the first electricity bond component shape complementation and the jointly part as combined electrical interconnection member；

D () is by with light-receiving side before relative to each other and rear side and the multiple electric contacts for being formed in the rear side Back-contact barrier-layer cell is stacked on the back of the body insulating barrier and the first electricity in the multiple through hole is bonded part With multiple electric contact directly contacts of the back-contact barrier-layer cell rear side；

E be stacked in before described in the back-contact barrier-layer cell preceding encapsulated layer on light-receiving side by ()；

F be stacked in transparent front plate above the preceding encapsulated layer by ()；

G the laminated sandwich construction obtained by step (f) of () hot pressing is to obtain the back-contact photovoltaic module.

The method of 20. production back-contact photovoltaic modules according to claim 19, it is characterised in that in step At least one of multiple through holes conductive component and conducting channel directly contact described in (c), and in step (g) First electricity bonds part and is adhered on multiple electric contacts of the back-contact barrier-layer cell rear side.

The method of 21. production back-contact photovoltaic modules according to claim 20, it is characterised in that in step C in (), further the electricity of filling second bonds part to be disposed close to it described in each hole of the multiple through hole Carry on the back insulating barrier rear side and at least one conductive component shape it is complementary and with the conducting channel directly contact so that It is placed at least one conductive component between the first electricity bonding part and the second electricity bonding part and common The part of the combined electrical interconnection member is formed, and in step (g), second electricity bonds part and is attached Onto the conducting channel.

A kind of 22. methods for producing back-contact photovoltaic module, the described method comprises the following steps：

A () prepares integrated form backboard using the method as any one of claim 16-18；

B () is by with light-receiving side before relative to each other and rear side and the multiple electric contacts for being formed in the rear side Back-contact barrier-layer cell is stacked on the integrated form backboard and makes the first electric binding part in the multiple through hole Multiple electric contact directly contacts of part and the back-contact barrier-layer cell rear side；

C be stacked in before described in the back-contact barrier-layer cell preceding encapsulated layer on light-receiving side by ()；

D be stacked in transparent front plate above the preceding encapsulated layer by ()；

E the laminated sandwich construction obtained by step (d) of () hot pressing is to obtain the back-contact photovoltaic module.