CN103962274B - Resin cladding system - Google Patents

Abstract

The present invention provides a kind of resin cladding system, when framework cleans, suppresses to be coated on being partially stripped for the water-soluble resin of chip, covers the upper surface of chip well with water-soluble resin.The resin cladding system is configured to, in ring-shaped frame（F）On be pasted with protection band（T）, the chip for being attached at protection band is covered with water-soluble resin（W）Upper surface, the resin cladding system has：Water-soluble resin nozzle（4）, it is coated with water-soluble resin in the upper surface of chip and forms diaphragm（11）；Air curtain forming unit（6）, it forms the air curtain being spaced apart by chip with ring-shaped frame（C1）；And rinse water feed unit（5）, it is supplying rinse water relative to position of the chip than air curtain in the outer part to ring-shaped frame.

Description

Resin covering device

technical field

The present invention relates to a resin coating device for coating the upper surface of a wafer before laser processing with a water-soluble resin.

Background technique

In the manufacturing process of a semiconductor device, streets are formed in a grid pattern on the surface of a wafer, and devices such as ICs and LSIs are formed in regions defined by the streets. The wafer is separated vertically and horizontally along grid-like intervals and divided into individual devices. As a method of dividing the wafer along the streets, a method of dividing by laser processing may be used for reasons such as reducing debris. However, when the laser beam is irradiated on the surface of the wafer, droplets called debris generated by melting of the wafer splash and adhere to the surface of the device to degrade the quality.

Therefore, in order to prevent the splashed debris from directly adhering to the device, the present applicant discovered a method of irradiating laser light with the surface of the wafer covered with a water-soluble resin (for example, refer to Patent Document 1). In the processing method described in Patent Document 1, a wafer is supported by a ring frame via a protective tape, a water-soluble resin is dropped on the wafer in this state, and the surface of the wafer is uniformly covered with the water-soluble resin by a so-called spin coating method. . However, since the ring frame is located on the outer peripheral side of the wafer, the water-soluble resin dripped onto the wafer adheres to the upper surface of the ring frame due to the rotation of the turntable.

Therefore, when proceeding to subsequent steps with the water-soluble resin attached to the ring frame, there is a problem that the suction pad cannot be separated due to the water-soluble resin being adhered to the ring frame when the wafer is transported by the transfer mechanism. Therefore, a frame cleaning method has been proposed in which, after applying a water-soluble resin to the wafer, spray cleaning water on the upper surface of the ring frame, and rotate the turntable to remove the particles adhered to the upper surface of the ring frame. water-soluble resin (for example, refer to Patent Document 2).

prior art literature

Patent Document 1: Japanese Patent Laid-Open No. 2004-322168

Patent Document 2: Japanese Patent Laid-Open No. 2007-73670

In the frame cleaning described in Patent Document 2, unless the turntable is rotated at a high speed, sufficient centrifugal force does not act on the cleaning water, and the cleaning water may splash onto the upper surface of the wafer. Therefore, as in the case of thickening the resin film, when the turntable cannot be rotated at a high speed after the coating of the water-soluble resin, the water-soluble resin coated on the wafer will be partially peeled off due to the splashed cleaning water, and there will be subsequent problems. There is a risk of deterioration in the quality of the device due to the adhesion of debris in the laser processing of the process.

Contents of the invention

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a resin coating device capable of satisfactorily coating the upper surface of a wafer with a water-soluble resin while suppressing splashing of cleaning water to a wafer during cleaning of a ring frame.

Regarding the resin covering device of the present invention, it covers the upper surface of the wafer with a water-soluble resin, and the wafer is integrated with the ring frame through the protective tape, and the resin covering device is characterized in that it has:

a rotary table that holds and rotates the wafer integrated with the ring frame via the protective tape;

a water-soluble resin nozzle that drips water-soluble resin onto the wafer held on the turntable;

a washing water supply unit spraying washing water to the ring frame held on the turntable; and

An air curtain forming unit configured to be able to move to an active position between the wafer and the ring frame and a non-active position away from the turntable, and to form a spacer between the wafer and the ring frame at the active position. open air curtain,

When cleaning the ring-shaped frame, the cleaning water supply unit is positioned to pass The air curtain sprays the cleaning water above the annular frame separated from the wafer side, and rotates the turntable to clean and remove the water-soluble resin adhering to the upper surface of the annular frame.

According to this configuration, by spraying washing water on the ring frame, the rotation of the turntable forms a flow of washing water on the ring frame, thereby washing and removing the water-soluble resin adhering to the ring frame. At this time, since the frame cleaning is performed with the wafer and the annular frame separated by the air curtain, the cleaning water does not splash on the wafer side. This suppresses local peeling of the water-soluble resin coated on the wafer, prevents debris from directly adhering to the device during laser processing in the subsequent process, and prevents quality deterioration of the device. In addition, since the ring frame is cleaned well, even when the ring frame is adsorbed by the suction pad and transported, there is no problem caused by the water-soluble resin.

In addition, in the above-mentioned resin coating apparatus of the present invention, the air curtain forming unit has an air ejection hole forming an annular air curtain having a diameter larger than the outer diameter of the wafer and smaller than the inner peripheral edge of the annular frame,

When cleaning the annular frame, the air curtain forming unit is positioned at the action position and forms an annular air curtain on the outer periphery of the wafer and around the inner periphery of the annular frame, The washing water supply unit is positioned above the annular frame, sprays washing water, and rotates the turntable, thereby washing and removing the water-soluble resin attached to the upper surface of the annular frame.

In addition, in the above-mentioned resin covering device of the present invention, the air curtain forming unit further has an air ejection hole forming an annular air curtain surrounding the outer periphery of the annular frame, and when cleaning the annular frame, In a state where an annular air curtain is formed around the inner and outer peripheries of the annular frame, the washing water supply unit is positioned above the annular frame to spray washing water, and the turntable is rotated to prevent the attached The water-soluble resin on the upper surface of the ring frame is cleaned and removed.

Invention effect

According to the present invention, by supplying washing water to the ring frame in a state where the wafer and the ring frame are separated by the air curtain, local peeling of the water-soluble resin coated on the wafer is suppressed, and the water-soluble resin can be favorably removed. Cover the top surface of the wafer.

Description of drawings

FIG. 1 is a perspective view of a resin coating device according to a first embodiment.

2 is a perspective view of the frame of the resin coating device according to the first embodiment during cleaning.

Fig. 3 is an explanatory diagram of the operation of the resin coating device according to the first embodiment.

Fig. 4 is a perspective view of the air curtain forming unit according to the second embodiment viewed from below.

FIG. 5 is an explanatory diagram of a cleaning operation of the resin coating device according to the second embodiment.

FIG. 6 is an explanatory diagram of a cleaning operation of a resin coating device according to a modified example of the second embodiment.

Label description

1 Resin covering device

3 turntables

4 water-soluble resin nozzles

5.9 Cleaning water supply unit

6, 7, 8 air curtain forming unit

11 resin film

72, 73 air ejection holes

C1, C2, C3 air curtain

F ring frame

T protection belt

detailed description

Hereinafter, the resin coating device of this embodiment will be described with reference to the drawings. FIG. 1 is a perspective view of a resin coating device according to a first embodiment. Fig. 2 is a perspective view of the frame of the first embodiment during cleaning. In addition, the resin covering device of the first embodiment is not limited to the structure shown in FIG. 1 . The resin covering device may have any structure as long as it has a structure for cleaning the frame while separating the wafer and the annular frame with the air curtain.

As shown in FIG. 1 , the resin coating device 1 is configured to perform frame cleaning on an annular frame F around the wafer W after coating the upper surface of the wafer W with a water-soluble resin by a spin coating method. The wafer W is a semiconductor wafer such as a silicon wafer or gallium arsenide, and is formed in a disc shape. The wafer W is divided into a plurality of regions by lanes arranged in a grid pattern, and various devices D such as ICs and LSIs are formed in the divided regions. In addition, the wafer W is attached to the protective tape T stretched on the ring frame F in a state facing upward.

In addition, in this embodiment, although the semiconductor wafer was demonstrated as an example as the wafer W, it is not limited to this structure. The wafer W is only required to be integrated with the annular frame F via the protective tape T, for example, packages of semiconductor products, ceramics, glass, sapphire (Al ₂ O ₃ )-based inorganic material substrates, and various electrical components can also be used. Or various processing materials requiring precision-level processing position accuracy are used as the wafer W.

The resin coating device 1 has a bottomed cylindrical casing 2 composed of a cylindrical peripheral wall portion 21 and a bottom wall portion 22 . A turntable 3 holding and rotating a wafer W is accommodated in the housing 2 . Around the turntable 3, a water-soluble resin nozzle 4, a washing water supply unit 5, and an air curtain forming unit 6 are provided. The turntable 3 is formed to be larger in diameter than the annular frame F of the wafer W, and the turntable 3 is formed with a suction cup made of a porous material. The chuck is connected to a suction source via a pipe of the turntable 3 , and suction holds the wafer W through the protective tape T by the negative pressure generated on the chuck.

The water-soluble resin nozzle 4 is formed into a substantially L-shape in side view by a horizontal portion 41 extending horizontally above the turntable 3 and a vertical portion 42 extending downward from the proximal end of the horizontal portion 41 . At the end of the horizontal portion 41, a supply head 43 for dripping a water-soluble resin is provided. In addition, the water-soluble resin nozzle 4 is supported by the casing 2 so as to be rotatable above the turntable 3 . The water-soluble resin nozzle 4 is connected to a supply source (not shown) via a pipe in the housing 2 , and drips the water-soluble resin from the supply head 43 to the center of the front surface of the wafer W. Then, the resin film 11 is formed on the entire upper surface of the wafer W by the centrifugal force accompanying the rotation of the turntable 3 (see FIG. 2 ).

At this time, since the front surface of the wafer W is covered with the resin film 11 , debris generated by melting of the wafer does not directly adhere to the front surface of the wafer W during laser processing in a subsequent step. In addition, as the water-soluble resin, for example, polyvinyl alcohol (PVA), polyethylene glycol (PEG), or the like is dropped onto the wafer W. In addition, it is preferable to add an absorber that absorbs light having a laser wavelength to the water-soluble resin. Thus, since the resin film 11 is removed simultaneously with the processing of the wafer W during laser processing, the resin film 11 is prevented from being peeled off from the front surface of the wafer W due to the vapor of pyrolysis products of the wafer W or the like.

In the resin coating device 1 , after the resin film is formed by the water-soluble resin nozzle 4 , frame cleaning by the cleaning water supply unit 5 is performed. Inside the casing 2, like the water-soluble resin nozzle 4, a washing water supply unit 5 and an air curtain forming unit 6 are rotatably provided. The washing water supply unit 5 is formed into a substantially L-shape in side view by a horizontal portion 51 extending horizontally above the turntable 3 and a vertical portion 52 extending downward from the proximal end of the horizontal portion 51 . At the end of the horizontal portion 51, a supply head 53 that sprays washing water is provided. The washing water supply unit 5 is connected to a supply source (not shown) via a pipe in the housing 2 , and sprays washing water from the supply head 53 to the ring frame F. As shown in FIG.

The air curtain forming unit 6 is formed in a substantially L-shape in a side view from a long plate-shaped injection plate 61 and a vertical portion 62 extending downward from the base end of the injection plate 61 . The ejection plate 61 extends horizontally in a vertical posture above the turntable 3 and is formed to be slightly curved in the middle of the extending direction. A plurality of air ejection holes (not shown) aligned in the extending direction of the ejection plate 61 are formed on the lower surface of the ejection plate 61 . The air curtain forming unit 6 is connected to an air supply source 63 via a pipeline in the housing 2 , and forms an air curtain C1 (see FIG. 2 ) by injecting air from a plurality of air ejection holes.

As shown in FIG. 2 , the spray plate 61 of the air curtain forming unit 6 is positioned between the annular frame F and the wafer W at the time of cleaning the frame of the resin coating apparatus 1 . At this time, the injection plate 61 extends across a part of the ring frame F and between the ring frame F and the wafer W. As shown in FIG. The air curtain C1 is formed so as to separate the annular frame F and the wafer W by spraying air from the spray plate 61 . In this state, the supply head 53 of the washing water supply unit 5 is positioned above the annular frame F, and the frame is washed by rotating the turntable 3 while supplying washing water from the supply head 53 .

In the frame washing, the washing water flow S is formed on the ring-shaped frame F by the rotation of the turntable 3 . The washing water flows upstream from the injection position of the supply head 53 of the washing water supply unit 5 , and flows downstream across the annular frame F toward the injection plate 61 of the air curtain forming unit 6 . The water-soluble resin adhering to the ring frame F due to the resin coating of the wafer W is washed by the washing water flow S on the ring frame F. As shown in FIG. At this time, since the wafer W and the ring frame F are separated by the air curtain C1, the cleaning water does not splash onto the wafer W.

In addition, downstream of the washing water flow S, a part of the annular frame F is obliquely partitioned by the air curtain C1. At this position, the washing water flow S on the ring frame F is blocked by the air curtain, so that part of the washing water is blocked, and the washing water generates turbulence to improve the washing efficiency of the ring frame F. In addition, the washing water flowing from the ring frame F is discharged through a drain pipe (not shown) provided in the casing 2 . As described above, since the cleaning water does not enter the inside of the air curtain C1 and is discharged, the resin film 11 of the wafer W is not partially peeled off, and the adhesion of debris in the subsequent laser processing to the device D is suppressed.

Referring to FIG. 3 , the coating operation of the water-soluble resin on the wafer and the cleaning operation of the ring frame by the resin coating device will be described. Fig. 3 is an explanatory diagram of the operation of the resin coating device according to the first embodiment. In addition, the following operation|movement of the resin coating apparatus is an example, and can be changed suitably.

As shown in A in FIG. 3 , in the coating operation of the water-soluble resin on the wafer W, when the wafer W is placed on the turntable 3 , the wafer W is held by a suction cup through a protective tape T. Next, the water-soluble resin nozzle 4 is rotated, and the supply head 43 at the end of the nozzle is positioned at the center of the wafer W. As shown in FIG. Then, the water-soluble resin is dropped onto the wafer W from the supply head 43 to form a liquid reservoir R in the center of the front surface of the wafer W. As shown in FIG. At this time, the washing water supply unit 5 and the air curtain forming unit 6 retreat from above the turntable 3 .

As shown in B in FIG. 3 , when the supply of the water-soluble resin is stopped, the water-soluble resin nozzle 4 retracts from above the turntable 3 to rotate the turntable 3 holding the wafer W. Thus, a telecentric force acts on the water-soluble resin reservoir R at the center of the upper surface of the wafer W, and the water-soluble resin spreads to cover the entire upper surface of the wafer W. Also, the resin film 11 that prevents debris from adhering to the device D during laser processing is uniformly formed on the upper surface of the wafer W by curing the water-soluble resin.

As shown in C in FIG. 3 , the air curtain forming unit 6 is arranged to be movable between an active position between the wafer W and the ring frame F and an inactive position away from the turntable 3 . When the resin film 11 is formed on the upper surface of the wafer W during the cleaning operation on the ring frame F, the air curtain forming unit 6 is rotated toward the wafer W side and positioned at the active position. At this time, the air curtain forming unit 6 traverses a part of the ring frame F, and extends between the wafer W and the ring frame F. As shown in FIG. The cleaning water supply unit 5 is positioned above the annular frame F on the outer side of the wafer W than the air curtain forming unit 6 . Therefore, the outside of the air curtain forming unit 6 is utilized as a cleaning area.

Next, as shown in D in FIG. 3 , an air curtain C1 (refer to FIG. 2 ) is formed between the ring frame F and the wafer W by the air curtain forming unit 6 , and the ring frame F is supplied with cleaning water from the cleaning water supply unit 5 . water. Then, the flow S of washing water is formed on the annular frame F by rotating the turntable 3 . The water-soluble resin adhering to the ring frame F during resin coating is removed by the washing water flow S. At this time, since the annular frame F and the wafer W are separated by the wall of the air curtain C1, the cleaning water does not enter the wafer W side.

The cleaning water passes outside the air curtain C1 and flows out of the turntable 3 at the intersection between the air curtain C1 and the ring frame F. At the intersection part, the cleaning water flow S is blocked by the air curtain C1 to generate turbulent flow, and the ring frame F is effectively cleaned by the irregular movement of the fluid. The wafer W after the frame cleaning is loaded into the laser processing apparatus. Since the wafer W is subjected to frame cleaning in a state in which cleaning water is prevented from adhering to the resin film 11 by the air curtain C1, partial peeling of the resin film 11 does not occur. Thereby, fragments splashed during laser processing do not directly adhere to the device D. As shown in FIG.

In addition, in the first embodiment, by increasing the overall length of the washing water flow S, the washing effect on the ring frame F can be enhanced. At this time, the spraying plate 61 of the air curtain forming unit 6 is formed to be long in a shape along the outer peripheral edge of the wafer W between the wafer W and the ring frame F, and the spraying position of the cleaning water supply unit 5 is positioned at a rotational position. The upstream side in the direction of rotation of the table 3 .

As described above, according to the resin coating device 1 of the first embodiment, the cleaning water is sprayed on the ring frame F, and the rotation of the turntable 3 forms the cleaning water flow S on the ring frame F, thereby cleaning the resin attached to the ring frame F. The water-soluble resin on the surface is cleaned and removed. At this time, since the frame cleaning is performed with the wafer W and the annular frame F separated by the air curtain C1, the cleaning water does not splash on the wafer W side. This suppresses partial peeling of the resin film 11 applied to the wafer W, prevents debris from directly adhering to the device D during laser processing in a subsequent step, and prevents the quality of the device D from deteriorating.

Next, a resin coating device according to a second embodiment will be described with reference to FIGS. 4 and 5 . In addition, the resin coating device of the second embodiment differs from the resin coating device of the first embodiment in the structures of the washing water supply unit and the air curtain forming unit. Therefore, differences will be mainly described. Fig. 4 is a perspective view of the air curtain forming unit according to the second embodiment viewed from below. FIG. 5 is an explanatory diagram of a cleaning operation of the resin coating device according to the second embodiment.

As shown in FIG. 4 , the air curtain forming unit 7 is formed in a hollow cylindrical shape having a diameter larger than that of the wafer W. As shown in FIG. On the lower surface 71 of the air curtain forming unit 7, a plurality of arc-shaped air ejection holes 72 are formed along the inner peripheral edge, and a plurality of arc-shaped air ejection holes 73 are formed along the outer peripheral edge. The air ejection holes 72 on the inner peripheral side form an annular air curtain C2 having a diameter larger than the outer peripheral edge of the wafer W and smaller than the inner peripheral edge of the ring frame F (see FIG. 5 ). The air ejection holes 73 on the outer peripheral side form an annular air curtain C3 surrounding the outer periphery of the annular frame F (see FIG. 5 ).

In addition, a plurality of washing water supply holes 74 are arranged in a ring shape on the lower surface 71 of the air curtain forming unit 7 between the inner air ejection holes 72 and the outer air ejection holes 73 . The washing water supply hole 74 supplies washing water to the annular frame F inside the two-layered air curtains C2 and C3 formed in the air ejection holes 72 and 73 . That is, in the resin coating device of the second embodiment, the air curtain forming unit 7 and the washing water supply unit are integrated. The air curtain forming unit 7 configured as described above is disposed so as to be movable between an inactive position separated upward from the turntable 3 and an active position close to the turntable 3 .

As shown in FIG. 5 , during frame cleaning, two layers of air curtains C2 and C3 are formed by the air curtain forming unit 7 so as to partition the inner side and the outer side of the annular frame F. As shown in FIG. In addition, washing water is sprayed toward the ring frame F in the space sandwiched between the inner and outer two-layer air curtains C2 and C3. Then, frame cleaning of the ring frame F is performed by rotating the turntable 3 . At this time, since the wafer W and the ring frame F are separated by the inner air curtain C2, the cleaning water does not splash on the wafer W, and local peeling of the resin film 11 is prevented.

In addition, since the ring frame F is surrounded by two layers of air curtains C2 and C3 on the inner side and the outer side, the cleaning water stays on the ring frame F to improve the cleaning effect. Furthermore, since the washing water is supplied to the annular frame F from the plurality of washing water supply holes 74 (see FIG. 4 ), the washing time can be shortened. In addition, since the washing water supply unit and the air curtain forming unit 7 are integrated, the number of components is reduced compared to the first embodiment. In addition, the cleaning water stagnated by the two air curtains C2 and C3 is discharged to the turntable 3 through the gap between the outer air curtain C1 and the outer peripheral edge of the ring frame F and the notch formed in the ring frame F. outside.

As described above, according to the resin coating device 1 of the second embodiment, the water-soluble resin adhering to the ring frame F is washed and removed by retaining cleaning water on the ring frame F by the outer and inner air curtains C2 and C3. . At this time, since the frame cleaning is performed with the wafer W and the annular frame F separated by the inner air curtain C1, the cleaning water does not splash onto the wafer W side. This suppresses partial peeling of the resin film 11 applied to the wafer W, prevents debris from directly adhering to the device D during laser processing in a subsequent step, and prevents the quality of the device D from deteriorating.

In addition, this invention is not limited to the said embodiment, It can change variously and can implement. In the above-described embodiment, the size, shape, and the like shown in the drawings are not limited thereto, and can be appropriately changed within the range in which the effects of the present invention are exhibited. In addition, unless it deviates from the objective range of this invention, it can change suitably and implement.

For example, in the above-mentioned second embodiment, although the air curtain forming unit 7 and the washing water supply unit have an integrated structure, it is not limited to this structure. As shown in FIG. 6 , a washing water supply unit 9 may be provided separately from the air curtain forming unit 8 . At this time, two layers of air curtains C2, C3 are formed by the air curtain forming unit 8 to separate the inner side and the outer side of the ring frame F, and the supply head 91 of the cleaning water supply unit 9 is positioned on the two layers of air curtains C2, C3. Inside of C3. Then, the frame is washed by rotating the turntable 3 while supplying washing water from the supply head 91 . In addition, as shown in FIG. 6 , the washing water may be supplied from a plurality of supply heads 91 , or the washing water may be supplied from a single supply head 91 .

In addition, in the above-mentioned second embodiment, although the air curtain forming units 7 and 8 are configured to form two layers of the inner and outer air curtains C2 and C3, the configuration is not limited to this. The air curtain forming units 7 and 8 may be configured to form an air curtain at least between the wafer W and the ring frame F.

In addition, in the above-mentioned second embodiment, although the air curtain forming units 7 and 8 have a structure formed in a hollow cylindrical shape, they are not limited to this structure. The air curtain forming units 7 and 8 may be formed in any shape as long as they form an annular air curtain.

Industrial availability

As explained above, the present invention has the effect of suppressing splashing of cleaning water to the wafer during cleaning of the annular frame, thereby being able to cover the upper surface of the wafer well with a resin film, especially for covering the upper surface of the wafer with a resin film before laser processing. Surface resin covering devices are useful.

Claims (3)

1. a kind of resin cladding system, it covers the upper surface of chip with water-soluble resin, the chip via protection band and with Ring-shaped frame is integrally formed, and the resin cladding system is characterised by having：

Turntable, it keeps the chip being integrally formed via protection band with ring-shaped frame and rotated；

Water-soluble resin nozzle, it drips water-soluble resin to the chip for being held in the turntable；

Rinse water feed unit, it is to the ring-shaped frame jet cleaning water for being held in the turntable；And

Air curtain forming unit, it is arranged to be moved to active position between chip and the ring-shaped frame and from rotation The non-working position that platform leaves, and the air curtain that is spaced apart of the formation by chip with the ring-shaped frame at the active position,

When being cleaned to the ring-shaped frame, the active position is located in and in chip with being somebody's turn to do in the air curtain forming unit In the state of foring air curtain between ring-shaped frame, by the rinse water feed unit be positioned at by the air curtain and with wafer side every The rinse water is simultaneously sprayed in the top for the ring-shaped frame opened, and rotates the turntable, so as to being attached to the ring-shaped frame The water-soluble resin of upper surface carry out cleaning removal.

2. resin cladding system according to claim 1, it is characterised in that

The air curtain forming unit has the gas for forming the diameter ring-type bigger and smaller than the inner peripheral of the ring-shaped frame than chip external diameter The air squit holes of curtain,

When being cleaned to the ring-shaped frame, the active position is located in and in the outer of chip in the air curtain forming unit In the state of week and the air curtain for foring ring-type around the inner circumferential inner side of the ring-shaped frame, the rinse water feed unit is positioned In the top of the ring-shaped frame and jet cleaning water, and rotate the turntable, so as to being attached to the upper of the ring-shaped frame The water-soluble resin on surface carries out cleaning removal.

3. resin cladding system according to claim 2, it is characterised in that

The air curtain forming unit also has the air squit holes for the air curtain for forming the ring-type around the periphery of the ring-shaped frame,

When being cleaned to the ring-shaped frame, the air curtain of ring-type is formd in the inner periphery and the outer periphery around the ring-shaped frame Under state, the rinse water feed unit is positioned above the ring-shaped frame simultaneously jet cleaning water, and rotates the turntable, So as to which the water-soluble resin of the upper surface to being attached to the ring-shaped frame carries out cleaning removal.