[go: up one dir, main page]

CN103928628A - A modified indium tin oxide anode and its preparation method and organic electroluminescent device - Google Patents

A modified indium tin oxide anode and its preparation method and organic electroluminescent device Download PDF

Info

Publication number
CN103928628A
CN103928628A CN201310010848.8A CN201310010848A CN103928628A CN 103928628 A CN103928628 A CN 103928628A CN 201310010848 A CN201310010848 A CN 201310010848A CN 103928628 A CN103928628 A CN 103928628A
Authority
CN
China
Prior art keywords
tin oxide
indium tin
fluorine
anode
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201310010848.8A
Other languages
Chinese (zh)
Other versions
CN103928628B (en
Inventor
周明杰
王平
冯小明
张娟娟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiashan Weitang Asset Management Co.,Ltd.
Original Assignee
Oceans King Lighting Science and Technology Co Ltd
Shenzhen Oceans King Lighting Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oceans King Lighting Science and Technology Co Ltd, Shenzhen Oceans King Lighting Engineering Co Ltd filed Critical Oceans King Lighting Science and Technology Co Ltd
Priority to CN201310010848.8A priority Critical patent/CN103928628B/en
Priority to CN201610095917.3A priority patent/CN105895824B/en
Priority to CN201610096055.6A priority patent/CN105576141B/en
Publication of CN103928628A publication Critical patent/CN103928628A/en
Application granted granted Critical
Publication of CN103928628B publication Critical patent/CN103928628B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80Constructional details
    • H10K30/81Electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80Constructional details
    • H10K30/81Electrodes
    • H10K30/82Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/81Anodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/81Anodes
    • H10K50/816Multilayers, e.g. transparent multilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/10Transparent electrodes, e.g. using graphene
    • H10K2102/101Transparent electrodes, e.g. using graphene comprising transparent conductive oxides [TCO]
    • H10K2102/102Transparent electrodes, e.g. using graphene comprising transparent conductive oxides [TCO] comprising tin oxides, e.g. fluorine-doped SnO2
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The embodiments of the invention disclose a modification indium tin oxide anode. The modification indium tin oxide anode comprises an indium tin oxide anode and a modification layer. The indium tin oxide anode comprises a glass substrate and an indium tin oxide film arranged on the surface of the glass substrate. The modification layer is arranged on the surface of the indium tin oxide film. The modification layer is a fluorine containing dipole layer existing in an In-F form, which is formed through bonding of the indium on the surface of the indium tin oxide film and fluorine. The mass percentage of the fluorine element of the fluorine containing dipole layer is 11%-20%. The ratio of the mass percentage of a tin element to the mass percentage of an indium element is 0.004-0.017. The existence of the fluorine containing dipole layer enables the work content of the surface of the anode to be improved. Besides, the embodiments of the invention further disclose a preparation method of the modification indium tin oxide anode, and an organic electroluminescent device using the modification indium tin oxide anode.

Description

一种修饰氧化铟锡阳极及其制备方法和有机电致发光器件A modified indium tin oxide anode and its preparation method and organic electroluminescent device

技术领域technical field

本发明涉及电子器件相关领域,尤其涉及一种修饰氧化铟锡阳极及其制备方法和有机电致发光器件。The invention relates to the related field of electronic devices, in particular to a modified indium tin oxide anode, a preparation method thereof and an organic electroluminescent device.

背景技术Background technique

目前,在有机半导体行业中,有机电致发光器件(OLED)具有亮度高、材料选择范围宽、驱动电压低、全固化主动发光等特性,同时拥有高清晰、广视角,以及响应速度快等优势,是一种极具潜力的显示技术和光源,符合信息时代移动通信和信息显示的发展趋势,以及绿色照明技术的要求,是目前国内外众多研究者的关注重点。At present, in the organic semiconductor industry, organic electroluminescent devices (OLEDs) have the characteristics of high brightness, wide range of material selection, low driving voltage, full-cure active light emission, etc., and have the advantages of high definition, wide viewing angle, and fast response speed. , is a very potential display technology and light source, in line with the development trend of mobile communication and information display in the information age, and the requirements of green lighting technology, it is the focus of many researchers at home and abroad.

在有机电致发光器件的结构中,阳极作为器件结构的一个重要部分,承担着载流子注入和电路连接的作用,而同时载流子的注入又与电极同有机材料之间的界面势垒有关。阳极一般都是承担空穴注入的作用,通常采用的导电氧化物薄膜如氧化铟锡(ITO)等,其功函只有4.7eV,而采用的有机空穴传输材料,其HOMO能级通常在5.1V左右,这样导致空穴注入需要克服较大的势垒,从而导致空穴注入效率不高。提高ITO的功函,将大大有利于提高空穴的注入效率。目前一般通过降低ITO表面元素的Sn/In比或者提高表面氧原子的含量来实现提高功函的目的,此外,在阳极表面形成偶极层也能达到这一效果。In the structure of organic electroluminescent devices, the anode, as an important part of the device structure, undertakes the role of carrier injection and circuit connection, and at the same time, the carrier injection and the interface barrier between the electrode and the organic material related. The anode generally undertakes the role of hole injection. The commonly used conductive oxide film such as indium tin oxide (ITO) has a work function of only 4.7eV, while the organic hole transport material used has a HOMO energy level of 5.1 V, which leads to the need to overcome a large potential barrier for hole injection, resulting in low hole injection efficiency. Improving the work function of ITO will greatly help to improve the hole injection efficiency. At present, the purpose of improving the work function is generally achieved by reducing the Sn/In ratio of ITO surface elements or increasing the content of surface oxygen atoms. In addition, forming a dipole layer on the surface of the anode can also achieve this effect.

发明内容Contents of the invention

为解决上述技术问题,本发明旨在提供一种修饰氧化铟锡阳极及其制备方法,该方法通过将氧化铟锡阳极表面进行修饰处理,使氧化铟锡薄膜表面形成了含氟偶极层,提高了阳极表面功函,从而使该阳极在应用中可大大提高空穴的注入效率,提高器件发光效率。本发明还提供了包含上述修饰氧化铟锡阳极的有机电致发光器件。In order to solve the above-mentioned technical problems, the present invention aims to provide a modified indium tin oxide anode and a preparation method thereof, in which a fluorine-containing dipole layer is formed on the surface of an indium tin oxide film by modifying the surface of the indium tin oxide anode, The surface work function of the anode is improved, so that the anode can greatly improve the hole injection efficiency in application, and improve the luminous efficiency of the device. The present invention also provides an organic electroluminescent device comprising the above-mentioned modified indium tin oxide anode.

第一方面,本发明提供了一种修饰氧化铟锡阳极,包括氧化铟锡阳极和修饰层,所述氧化铟锡阳极包括玻璃基板和设置在所述玻璃基板表面的氧化铟锡薄膜,所述修饰层设置在所述氧化铟锡薄膜表面,所述修饰层为所述氧化铟锡薄膜表面的铟与氟成键形成的以In-F形式存在的含氟偶极层,所述含氟偶极层的氟元素的质量百分含量为11~20%,锡元素与铟元素的质量百分含量比为0.004~0.017。In a first aspect, the present invention provides a modified indium tin oxide anode, including an indium tin oxide anode and a modification layer, the indium tin oxide anode includes a glass substrate and an indium tin oxide film disposed on the surface of the glass substrate, the The modification layer is arranged on the surface of the indium tin oxide film, and the modification layer is a fluorine-containing dipole layer in the form of In-F formed by bonding indium and fluorine on the surface of the indium tin oxide film. The mass percent content of fluorine element in the pole layer is 11-20%, and the mass percentage content ratio of tin element and indium element is 0.004-0.017.

优选地,所述氧化铟锡薄膜的厚度为70~200nm。Preferably, the thickness of the indium tin oxide thin film is 70-200 nm.

第二方面,本发明提供了一种修饰氧化铟锡阳极的制备方法,包括以下步骤:In a second aspect, the present invention provides a method for preparing a modified indium tin oxide anode, comprising the following steps:

所述氧化铟锡阳极包括玻璃基板和设置在所述玻璃基板表面的氧化铟锡薄膜;The indium tin oxide anode includes a glass substrate and an indium tin oxide film arranged on the surface of the glass substrate;

将所述氧化铟锡阳极浸入浓度为0.2~2mol/L的含氟有机酸水溶液中,于5~20℃下浸泡0.5~2分钟后,取出,干燥;Immerse the indium tin oxide anode in a fluorine-containing organic acid aqueous solution with a concentration of 0.2-2mol/L, soak at 5-20°C for 0.5-2 minutes, take it out, and dry it;

将干燥后的所述氧化铟锡阳极置于等离子体设备中,通入含氟气体,使等离子体设备内的气体压力为10Pa~60Pa,调整射频功率为40w~100w,进行等离子体处理5~10分钟,得到修饰氧化铟锡阳极,所述修饰氧化铟锡阳极的表面具有修饰层,所述修饰层为所述氧化铟锡薄膜表面的铟与氟成键形成的以In-F形式存在的含氟偶极层。The dried indium tin oxide anode is placed in the plasma equipment, and the fluorine-containing gas is introduced to make the gas pressure in the plasma equipment 10Pa~60Pa, adjust the radio frequency power to 40w~100w, and perform plasma treatment for 5~ In 10 minutes, a modified indium tin oxide anode was obtained. The surface of the modified indium tin oxide anode has a modified layer, and the modified layer is formed by bonding indium and fluorine on the surface of the indium tin oxide film and exists in the form of In-F. Fluorine-containing dipole layer.

所述含氟偶极层的氟元素的百分含量为11~20%,锡元素与铟元素的质量百分含量比为0.004~0.017。The percentage content of fluorine element in the fluorine-containing dipole layer is 11-20%, and the mass percentage content ratio of tin element and indium element is 0.004-0.017.

所述氧化铟锡阳极包括玻璃基板和设置在所述玻璃基板表面的氧化铟锡薄膜。采用如下方式制备:提供洁净的玻璃基板,采用磁控溅射法在所述玻璃基板上溅射制备氧化铟锡薄膜。The indium tin oxide anode includes a glass substrate and an indium tin oxide thin film arranged on the surface of the glass substrate. The preparation method is as follows: a clean glass substrate is provided, and a magnetron sputtering method is used to sputter on the glass substrate to prepare an indium tin oxide thin film.

所述玻璃基板为市售普通玻璃。The glass substrate is commercially available common glass.

优选地,所述玻璃基板的清洗操作具体为:依次采用洗洁精、去离子水、异丙醇和丙酮分别进行超声清洗20分钟,然后氮气吹干。Preferably, the cleaning operation of the glass substrate is as follows: sequentially use detergent, deionized water, isopropanol and acetone to perform ultrasonic cleaning for 20 minutes respectively, and then blow dry with nitrogen.

优选地,所述氧化铟锡薄膜的厚度为70~200nm。Preferably, the thickness of the indium tin oxide thin film is 70-200 nm.

将所述氧化铟锡阳极浸入浓度为0.2~2mol/L的含氟有机酸水溶液中,于5~20℃下浸泡0.5~2分钟后,取出,干燥。The indium tin oxide anode is immersed in an aqueous solution of fluorine-containing organic acid with a concentration of 0.2-2 mol/L, soaked at 5-20° C. for 0.5-2 minutes, taken out, and dried.

优选地,所述含氟有机酸为二氟乙酸、三氟乙酸或2,2-二氟丙酸。Preferably, the fluorine-containing organic acid is difluoroacetic acid, trifluoroacetic acid or 2,2-difluoropropionic acid.

优选地,所述含氟有机酸水溶液的浓度为0.5~1mol/L。Preferably, the concentration of the fluorine-containing organic acid aqueous solution is 0.5-1 mol/L.

所述干燥的具体方式不做特殊限制。优选地,所述干燥操作为:在50~80℃真空干燥12~24小时。The specific method of drying is not particularly limited. Preferably, the drying operation is: vacuum drying at 50-80° C. for 12-24 hours.

所述氧化铟锡阳极通过含氟有机酸的预处理后,其表面吸附有大量含氟功能基团,由于氟具有强吸电子能力,因此这些含氟功能基团将在氧化铟锡(ITO)表面与铟In形成部分In-F键,从而氧化铟锡(ITO)表面的部分Sn被F取代,但此时形成的In-F键不是很稳定,需做进一步处理。After the indium tin oxide anode is pretreated with a fluorine-containing organic acid, a large number of fluorine-containing functional groups are adsorbed on its surface. Since fluorine has a strong electron-withdrawing ability, these fluorine-containing functional groups will The surface and indium In form part of the In-F bond, so that part of the Sn on the surface of indium tin oxide (ITO) is replaced by F, but the In-F bond formed at this time is not very stable and needs further processing.

将干燥后的所述氧化铟锡阳极置于等离子体设备中,通入含氟气体进行等离子体处理,得到修饰氧化铟锡阳极。该修饰氧化铟锡阳极的表面具有修饰层,所述修饰层为所述氧化铟锡薄膜表面的In与F成键形成的以In-F形式存在的含氟偶极层。The dried indium tin oxide anode is placed in a plasma device, and a fluorine-containing gas is passed through for plasma treatment to obtain a modified indium tin oxide anode. The surface of the modified indium tin oxide anode has a modified layer, and the modified layer is a fluorine-containing dipole layer in the form of In-F formed by bonding of In and F on the surface of the indium tin oxide film.

优选地,所述含氟气体为四氟化碳或三氟化碳。Preferably, the fluorine-containing gas is carbon tetrafluoride or carbon trifluoride.

等离子体处理过程中,等离子体设备内的气体压力为10~60Pa,射频功率为40~100w,等离子体处理的时间为5~10分钟。During the plasma treatment process, the gas pressure in the plasma equipment is 10~60Pa, the radio frequency power is 40~100w, and the plasma treatment time is 5~10 minutes.

氧化铟锡阳极经含氟气体等离子体处理后,将使不稳定的In-F键变得更加稳定;同时,含氟气体中的氟也会与ITO表面的铟(In)形成In-F键,使ITO表面的锡(Sn)进一步被氟(F)取代;另外,经过含氟有机酸预处理后吸附在表面的未与ITO成键的含氟功能基团也将与In形成In-F键,从而进一步提高了ITO表面的In-F键比例,提高了阳极表面元素F的百分含量,减少了阳极表面的Sn/In元素含量比。这样一来,在阳极ITO表面将形成了一层以In-F形式存在的含氟偶极层,该含氟偶极层的氟元素的百分含量为11~20%,锡元素与铟元素的质量百分含量比为0.004~0.017,因此,相对于普通未修饰的ITO阳极,该含氟偶极层作为修饰层存在可提高ITO阳极表面功函,从而降低空穴注入需要克服的势垒,提高空穴注入效率。这是由于偶极层的存在将提高ITO表面的真空能级Evac,提高一个数值δ,这样使阳极的费米能级EF与真空能级Evac的差值ΔE相比原有的差值多了δ。根据功函的定义,功函是材料费米能级与真空能级的差值,这样就意味着功函提高了δ数值。即含氟偶极层的存在提高了阳极表面功函。After the indium tin oxide anode is treated with fluorine-containing gas plasma, the unstable In-F bond will become more stable; at the same time, the fluorine in the fluorine-containing gas will also form In-F bond with indium (In) on the surface of ITO , so that the tin (Sn) on the surface of ITO is further replaced by fluorine (F); in addition, the fluorine-containing functional groups that are not bonded to ITO and adsorbed on the surface after pretreatment with fluorine-containing organic acids will also form In-F with In bond, thereby further increasing the ratio of In-F bonds on the ITO surface, increasing the percentage of element F on the anode surface, and reducing the Sn/In element content ratio on the anode surface. In this way, a layer of fluorine-containing dipole layer in the form of In-F will be formed on the surface of the anode ITO. The percentage of fluorine in the fluorine-containing dipole layer is 11-20%. The mass percentage ratio of 0.004~0.017, therefore, compared with the ordinary unmodified ITO anode, the presence of the fluorine-containing dipole layer as a modified layer can improve the surface work function of the ITO anode, thereby reducing the barrier that needs to be overcome for hole injection , to improve the hole injection efficiency. This is because the existence of the dipole layer will increase the vacuum energy level E vac on the surface of ITO, and increase a value δ, so that the difference ΔE between the Fermi energy level EF of the anode and the vacuum energy level E vac is compared with the original difference The value is more than δ. According to the definition of the work function, the work function is the difference between the Fermi level and the vacuum energy level of the material, which means that the work function increases the δ value. That is, the presence of the fluorine-containing dipole layer increases the work function of the anode surface.

所述修饰氧化铟锡阳极应当进行妥善保存,保存环境为真空环境<10-3Pa或者保存在N2手套箱中。The modified indium tin oxide anode should be properly stored in a vacuum environment <10 −3 Pa or in a N 2 glove box.

第三方面,本发明提供了一种有机电致发光器件,包括阳极、功能层、发光层和阴极,所述阳极为修饰氧化铟锡阳极,所述修饰氧化铟锡阳极包括氧化铟锡阳极和修饰层,所述氧化铟锡阳极包括玻璃基板和设置在所述玻璃基板表面的氧化铟锡薄膜,所述修饰层设置在所述氧化铟锡薄膜表面,所述修饰层为所述氧化铟锡薄膜表面的铟与氟成键形成的以In-F形式存在的含氟偶极层,所述含氟偶极层的氟元素的质量百分含量为11~20%,锡元素与铟元素的质量百分含量比为0.004~0.017。In a third aspect, the present invention provides an organic electroluminescent device, including an anode, a functional layer, a light-emitting layer and a cathode, the anode is a modified indium tin oxide anode, and the modified indium tin oxide anode includes an indium tin oxide anode and A modification layer, the indium tin oxide anode includes a glass substrate and an indium tin oxide thin film disposed on the surface of the glass substrate, the modification layer is disposed on the surface of the indium tin oxide thin film, and the modification layer is the indium tin oxide A fluorine-containing dipole layer in the form of In-F formed by indium and fluorine on the surface of the film. The mass percentage ratio is 0.004~0.017.

优选地,所述氧化铟锡薄膜的厚度为70~200nm。Preferably, the thickness of the indium tin oxide thin film is 70-200 nm.

其中,所述功能层包括空穴注入层、空穴传输层、电子传输层和电子注入层中的至少一种。Wherein, the functional layer includes at least one of a hole injection layer, a hole transport layer, an electron transport layer and an electron injection layer.

当所述功能层为多层时,所述空穴注入层、空穴传输层、发光层、电子传输层、电子注入层和阴极按顺序依次设置在修饰氧化铟锡阳极的ITO薄膜表面。When the functional layer is multi-layered, the hole injection layer, hole transport layer, light emitting layer, electron transport layer, electron injection layer and cathode are sequentially arranged on the surface of the ITO thin film of the modified indium tin oxide anode.

所述空穴注入层的材质可以为酞菁锌(ZnPc),酞菁铜(CuPc),酞菁氧钒(VOPc),酞菁氧钛(TiOPc),酞菁铂(PtPc)或4,4',4″-三(N-3-甲基苯基-N-苯基氨基)三苯胺(m-MTDATA)。空穴注入层的厚度为10~40nm。The material of the hole injection layer can be zinc phthalocyanine (ZnPc), copper phthalocyanine (CuPc), vanadyl phthalocyanine (VOPc), titanium phthalocyanine (TiOPc), platinum phthalocyanine (PtPc) or 4,4 ',4″-tris(N-3-methylphenyl-N-phenylamino)triphenylamine (m-MTDATA). The thickness of the hole injection layer is 10~40nm.

所述空穴传输层的空穴传输材料可以为N,N'-二苯基-N,N'-二(3-甲基苯基)-1,1'-联苯-4,4'-二胺(TPD);N,N,N',N’-四甲氧基苯基)-对二氨基联苯(MeO-TPD);2,7-双(N,N-二(4-甲氧基苯基)氨基)-9,9-螺二芴(MeO-Sprio-TPD),N,N'-二苯基-N,N'-二(1-萘基)-1,1'-联苯-4,4'-二胺(NPB),1,1-二(4-(N,N′-二(p-甲苯基)氨基)苯基)环己烷(TAPC)或2,2',7,7′-四(N,N-二苯胺基)-9,9′-螺二芴(S-TAD),空穴传输层的厚度为20~50nm。The hole transport material of the hole transport layer can be N,N'-diphenyl-N,N'-bis(3-methylphenyl)-1,1'-biphenyl-4,4'- Diamine (TPD); N,N,N',N'-tetramethoxyphenyl)-p-diaminobiphenyl (MeO-TPD); 2,7-bis(N,N-di(4-methyl oxyphenyl)amino)-9,9-spirobifluorene (MeO-Sprio-TPD), N,N'-diphenyl-N,N'-di(1-naphthyl)-1,1'- Biphenyl-4,4'-diamine (NPB), 1,1-bis(4-(N,N'-bis(p-tolyl)amino)phenyl)cyclohexane (TAPC) or 2,2 ', 7,7'-tetra(N,N-diphenylamino)-9,9'-spirobifluorene (S-TAD), the thickness of the hole transport layer is 20~50nm.

所述发光层的材质为发光材料掺杂空穴传输材料或电子传输材料形成的混合材料。The material of the light-emitting layer is a mixed material formed by doping a light-emitting material with a hole-transport material or an electron-transport material.

所述发光材料可以为4-(二腈甲基)-2-丁基-6-(1,1,7,7-四甲基久洛呢啶-9-乙烯基)-4H-吡喃(DCJTB),2,3,6,7-四氢-1,1,7,7-四甲基-1H,5H,11H-10-(2-苯并噻唑基)-喹嗪并[9,9A,1GH]香豆素(C545T),二(2-甲基-8-羟基喹啉)-(4-联苯酚)铝(BALQ),4-(二腈甲烯基)-2-异丙基-6-(1,1,7,7-四甲基久洛呢啶-9-乙烯基)-4H-吡喃(DCJTI),二甲基喹吖啶酮(DMQA)、8-羟基喹啉铝(Alq3),5,6,11,12-四苯基萘并萘(Rubrene),4,4'-二(2,2-二苯乙烯基)-1,1'-联苯(DPVBi),双(4,6-二氟苯基吡啶-N,C2)吡啶甲酰合铱(FIrpic),双(4,6-二氟苯基吡啶)-四(1-吡唑基)硼酸合铱(FIr6),双(4,6-二氟-5-氰基苯基吡啶-N,C2)吡啶甲酸合铱(FCNIrpic),二(2′,4′-二氟苯基)吡啶](四唑吡啶)合铱(FIrN4),二(2-甲基-二苯基[f,h]喹喔啉)(乙酰丙酮)合铱(Ir(MDQ)2(acac)),二(1-苯基异喹啉)(乙酰丙酮)合铱(Ir(piq)2(acac)),乙酰丙酮酸二(2-苯基吡啶)铱(Ir(ppy)2(acac)),三(1-苯基-异喹啉)合铱(Ir(piq)3)或三(2-苯基吡啶)合铱(Ir(ppy)3)中的一种或几种。发光层的厚度为10~20nm。The luminescent material can be 4-(dinitrile methyl)-2-butyl-6-(1,1,7,7-tetramethyljulonesidine-9-vinyl)-4H-pyran ( DCJTB), 2,3,6,7-tetrahydro-1,1,7,7-tetramethyl-1H,5H,11H-10-(2-benzothiazolyl)-quinazino[9,9A ,1GH]coumarin (C545T), bis(2-methyl-8-hydroxyquinoline)-(4-biphenol)aluminum (BALQ), 4-(dinitrilemethylenyl)-2-isopropyl -6-(1,1,7,7-Tetramethyljuronesidine-9-vinyl)-4H-pyran (DCJTI), Dimethylquinacridone (DMQA), 8-Hydroxyquinoline Aluminum (Alq3), 5,6,11,12-Tetraphenylnaphthalene (Rubrene), 4,4'-bis(2,2-distyryl)-1,1'-biphenyl (DPVBi) , bis(4,6-difluorophenylpyridine-N,C2)iridium picolinate (FIrpic), bis(4,6-difluorophenylpyridine)-tetrakis(1-pyrazolyl)iridium borate (FIr6), bis(4,6-difluoro-5-cyanophenylpyridine-N,C2)iridium picolinate (FCNIrpic), bis(2′,4′-difluorophenyl)pyridine](tetra pyridine) iridium (FIrN4), bis(2-methyl-diphenyl[f,h]quinoxaline) (acetylacetonate) iridium (Ir(MDQ)2(acac)), bis(1-phenyl Isoquinoline) (acetylacetonate) iridium (Ir(piq)2(acac)), bis(2-phenylpyridine)iridium acetylacetonate (Ir(ppy)2(acac)), tris(1-phenyl One or more of the base-isoquinoline) iridium (Ir(piq)3) or tris(2-phenylpyridine)iridium (Ir(ppy)3). The thickness of the light emitting layer is 10~20nm.

所述电子传输层的电子传输材料可以为2-(4-联苯基)-5-(4-叔丁基)苯基-1,3,4-噁二唑(PBD),(8-羟基喹啉)-铝(Alq3),4,7-二苯基-邻菲咯啉(Bphen),1,3,5-三(1-苯基-1H-苯并咪唑-2-基)苯(TPBi),2,9-二甲基-4,7-联苯-1,10-邻二氮杂菲(BCP),1,2,4-三唑衍生物(如TAZ)或双(2-甲基-8-羟基喹啉-N1,O8)-(1,1'-联苯-4-羟基)铝(BAlq)。电子传输层的厚度为30~60nm。The electron transport material of the electron transport layer can be 2-(4-biphenyl)-5-(4-tert-butyl)phenyl-1,3,4-oxadiazole (PBD), (8-hydroxy Quinoline)-aluminum (Alq3), 4,7-diphenyl-o-phenanthroline (Bphen), 1,3,5-tris(1-phenyl-1H-benzimidazol-2-yl)benzene ( TPBi), 2,9-dimethyl-4,7-biphenyl-1,10-phenanthroline (BCP), 1,2,4-triazole derivatives (such as TAZ) or bis(2- Methyl-8-hydroxyquinoline-N 1 ,O 8 )-(1,1′-biphenyl-4-hydroxy)aluminum (BAlq). The thickness of the electron transport layer is 30~60nm.

所述电子注入层的材质可以为LiF,CsF或NaF,厚度为1nm;The material of the electron injection layer can be LiF, CsF or NaF, and the thickness is 1nm;

所述阴极可采用Ag,Al,Sm,Yb,Mg-Ag合金或Mg-Al合金,厚度为70~200nm。The cathode can be Ag, Al, Sm, Yb, Mg-Ag alloy or Mg-Al alloy, with a thickness of 70-200nm.

上述空穴注入层、空穴传输层、发光层、电子传输层、电子注入层和阴极均可采用真空蒸镀的方式依次制备在修饰氧化铟锡阳极上。The above-mentioned hole injection layer, hole transport layer, light emitting layer, electron transport layer, electron injection layer and cathode can be sequentially prepared on the modified indium tin oxide anode by vacuum evaporation.

实施本发明实施例,具有如下有益效果:Implementing the embodiment of the present invention has the following beneficial effects:

(1)本发明提供的修饰氧化铟锡阳极的制备方法,通过将氧化铟锡阳极进行含氟有机酸预处理和含氟气体等离子体处理,减少了阳极表面的Sn/In元素含量比,同时使氧化铟锡阳极表面形成了修饰层,即以In-F的形式存在的含氟偶极层,从而提高了阳极表面功函;(1) The preparation method of the modified indium tin oxide anode provided by the present invention reduces the Sn/In element content ratio on the surface of the anode by subjecting the indium tin oxide anode to pretreatment with fluorine-containing organic acid and plasma treatment with fluorine-containing gas, and at the same time A modified layer is formed on the surface of the indium tin oxide anode, that is, a fluorine-containing dipole layer in the form of In-F, thereby improving the work function of the anode surface;

(2)本发明提供的修饰氧化铟锡阳极的制备方法,工艺简单,成本低;(2) The preparation method of the modified indium tin oxide anode provided by the present invention has simple process and low cost;

(3)本发明提供的修饰氧化铟锡阳极,可广泛应用于有机电致发光器件和有机太阳能电池中,提高器件的效率。(3) The modified indium tin oxide anode provided by the present invention can be widely used in organic electroluminescent devices and organic solar cells to improve the efficiency of the devices.

附图说明Description of drawings

图1是本发明实施例1提供的有机电致发光器件的结构图;Figure 1 is a structural diagram of an organic electroluminescent device provided in Example 1 of the present invention;

图2是本发明实施例4提供的有机电致发光器件与现有有机电致发光器件的电流密度与电压的关系图。Fig. 2 is a graph showing the relationship between current density and voltage of the organic electroluminescent device provided by Example 4 of the present invention and the existing organic electroluminescent device.

具体实施方式Detailed ways

下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

实施例1Example 1

一种修饰氧化铟锡阳极的制备方法,包括以下步骤:A method for preparing a modified indium tin oxide anode, comprising the following steps:

(1)取玻璃基板,依次采用洗洁精、去离子水、异丙醇和丙酮分别进行超声清洗20分钟,然后氮气吹干;在玻璃基板上采用磁控溅射法制备厚度为100nm的氧化铟锡薄膜,得到氧化铟锡阳极;(1) Take the glass substrate, ultrasonically clean it with detergent, deionized water, isopropanol and acetone for 20 minutes, and then dry it with nitrogen; prepare indium oxide with a thickness of 100nm on the glass substrate by magnetron sputtering Tin film, obtain indium tin oxide anode;

(2)将所述氧化铟锡阳极浸入浓度为2mol/L的二氟乙酸水溶液中,于10℃下浸泡0.5分钟后,取出,50℃真空干燥12小时;(2) Immerse the indium tin oxide anode in an aqueous difluoroacetic acid solution with a concentration of 2 mol/L, soak it at 10°C for 0.5 minutes, take it out, and dry it under vacuum at 50°C for 12 hours;

(3)将干燥后的氧化铟锡阳极置于等离子体设备中,通入四氟化碳(CF4)气体进行等离子体处理,得到修饰氧化铟锡阳极,修饰氧化铟锡阳极的表面具有修饰层,修饰层为氧化铟锡薄膜表面的In与F成键形成的以In-F形式存在的含氟偶极层。(3) Place the dried indium tin oxide anode in the plasma equipment, pass through carbon tetrafluoride (CF4) gas for plasma treatment, and obtain a modified indium tin oxide anode, and the surface of the modified indium tin oxide anode has a modified layer , the modification layer is a fluorine-containing dipole layer in the form of In-F formed by the bond between In and F on the surface of the indium tin oxide film.

等离子体处理过程中,等离子体设备内的气体压力为10Pa,射频功率为50w,等离子体处理的时间为6分钟。During the plasma treatment process, the gas pressure in the plasma equipment is 10Pa, the radio frequency power is 50w, and the plasma treatment time is 6 minutes.

本实施例制得的修饰氧化铟锡阳极,其表面修饰层为以In-F的形式存在的含氟偶极层,该偶极层将提高ITO表面的真空能级Evac,提高一个数值δ,这样使阳极的费米能级EF与真空能级Evac的差值ΔE相比原有的差值多了δ。根据功函的定义,功函是材料费米能级与真空能级的差值,这样就意味着功函提高了δ数值。未经修饰的氧化铟锡阳极的表面功函一般为4.7eV,本实施例制备得到的修饰氧化铟锡阳极的表面功函为5.7eV。The modified indium tin oxide anode prepared in this example has a surface modification layer that is a fluorine-containing dipole layer in the form of In-F. This dipole layer will increase the vacuum energy level E vac of the ITO surface and increase a value δ , so that the difference ΔE between the Fermi level EF of the anode and the vacuum level E vac is δ more than the original difference. According to the definition of the work function, the work function is the difference between the Fermi level of the material and the vacuum energy level, which means that the work function increases the δ value. The surface work function of the unmodified indium tin oxide anode is generally 4.7eV, and the surface work function of the modified indium tin oxide anode prepared in this embodiment is 5.7eV.

实施例2Example 2

一种修饰氧化铟锡阳极的制备方法,包括以下步骤:A method for preparing a modified indium tin oxide anode, comprising the following steps:

(1)取玻璃基板,依次采用洗洁精、去离子水、异丙醇和丙酮分别进行超声清洗20分钟,然后氮气吹干;在玻璃基板上采用磁控溅射法制备厚度为70nm的氧化铟锡薄膜,得到氧化铟锡阳极;(1) Take the glass substrate, ultrasonically clean it with detergent, deionized water, isopropanol and acetone for 20 minutes, and then dry it with nitrogen; prepare indium oxide with a thickness of 70nm on the glass substrate by magnetron sputtering Tin film, obtain indium tin oxide anode;

(2)将氧化铟锡阳极浸入浓度为0.2mol/L的三氟乙酸水溶液中,于20℃下浸泡2分钟后,取出,80℃真空干燥12小时;(2) Immerse the indium tin oxide anode in an aqueous solution of trifluoroacetic acid with a concentration of 0.2mol/L, soak at 20°C for 2 minutes, take it out, and dry it under vacuum at 80°C for 12 hours;

(3)将干燥后的氧化铟锡阳极置于等离子体设备中,通入三氟化碳(CHF3)气体进行等离子体处理,得到修饰氧化铟锡阳极,修饰氧化铟锡阳极的表面具有修饰层,修饰层为氧化铟锡薄膜表面的In与F成键形成的以In-F形式存在的含氟偶极层。(3) Place the dried indium tin oxide anode in the plasma equipment, pass through carbon trifluoride (CHF3) gas for plasma treatment, and obtain a modified indium tin oxide anode, and the surface of the modified indium tin oxide anode has a modified layer , the modification layer is a fluorine-containing dipole layer in the form of In-F formed by the bond between In and F on the surface of the indium tin oxide film.

等离子体处理过程中,等离子体设备内的气体压力为30Pa,射频功率为40w,等离子体处理的时间为10分钟。During the plasma treatment process, the gas pressure in the plasma equipment is 30Pa, the radio frequency power is 40w, and the plasma treatment time is 10 minutes.

本实施例制备得到的修饰氧化铟锡阳极的表面功函为5.8eV。The surface work function of the modified indium tin oxide anode prepared in this example is 5.8 eV.

实施例3Example 3

一种修饰氧化铟锡阳极的制备方法,包括以下步骤:A method for preparing a modified indium tin oxide anode, comprising the following steps:

(1)取玻璃基板,依次采用洗洁精、去离子水、异丙醇和丙酮分别进行超声清洗20分钟,然后氮气吹干;在玻璃基板上采用磁控溅射法制备厚度为200nm的氧化铟锡薄膜,得到氧化铟锡阳极;(1) Take the glass substrate, ultrasonically clean it with detergent, deionized water, isopropanol and acetone for 20 minutes, and then dry it with nitrogen; prepare indium oxide with a thickness of 200nm on the glass substrate by magnetron sputtering Tin film, obtain indium tin oxide anode;

(2)将氧化铟锡阳极浸入浓度为1mol/L的2,2-二氟丙酸水溶液中,于5℃下浸泡1分钟后,取出,60℃真空干燥24小时;(2) Immerse the indium tin oxide anode in 2,2-difluoropropionic acid aqueous solution with a concentration of 1mol/L, soak at 5°C for 1 minute, take it out, and dry it in vacuum at 60°C for 24 hours;

(3)将干燥后的氧化铟锡阳极置于等离子体设备中,通入四氟化碳(CF4)气体进行等离子体处理,得到修饰氧化铟锡阳极,修饰氧化铟锡阳极的表面具有修饰层,修饰层为氧化铟锡薄膜表面的In与F成键形成的以In-F形式存在的含氟偶极层。(3) The dried indium tin oxide anode is placed in a plasma device, and carbon tetrafluoride (CF 4 ) gas is introduced for plasma treatment to obtain a modified indium tin oxide anode. The surface of the modified indium tin oxide anode has a modified The modification layer is a fluorine-containing dipole layer in the form of In-F formed by the bond between In and F on the surface of the indium tin oxide film.

等离子体处理过程中,等离子体处理室内的气体压力为60Pa,射频功率为100w,等离子体处理的时间为5分钟。During the plasma treatment process, the gas pressure in the plasma treatment chamber is 60Pa, the radio frequency power is 100w, and the plasma treatment time is 5 minutes.

本实施例制备得到的修饰氧化铟锡阳极的表面功函为5.9eV。The surface work function of the modified indium tin oxide anode prepared in this example is 5.9 eV.

将本发明上述实施例1~3所得修饰氧化铟锡阳极以及未经修饰的普通氧化铟锡阳极进行表面元素分析,测试方法采用XPS(X射线光电子谱),仪器型号为ESCA2000(VG Microtech Inc.公司),测试条件为使用Al靶Kα射线源,射线能量为1486.6eV。分别测算ITO薄膜表面C元素的1s轨道,In元素的3d5/2轨道,Sn元素的3d5/2轨道O元素的1s轨道,F元素的1s轨道,测算出各元素百分含量,其检测结果如表1所示。The modified indium tin oxide anode obtained in the above-mentioned examples 1 to 3 of the present invention and the unmodified common indium tin oxide anode were subjected to surface element analysis. The test method used XPS (X-ray photoelectron spectroscopy), and the instrument model was ESCA2000 (VG Microtech Inc. company), the test condition is to use the Al target Kα ray source, and the ray energy is 1486.6eV. Calculate the 1s orbit of the C element on the surface of the ITO film, the 3d 5/2 orbit of the In element, the 3d 5/2 orbit of the Sn element, the 1s orbit of the O element, and the 1s orbit of the F element, and calculate the percentage content of each element. The results are shown in Table 1.

表1Table 1

从表1中可以看出,未经修饰的普通氧化铟锡阳极,其表面由C,O,In,Sn四种元素组成,经过本发明方法修饰处理后的修饰氧化铟锡阳极,表面多了F元素,说明经过修饰处理,F元素与In成键形成在ITO薄膜表面,从而在ITO薄膜表面形成了以In-F形式存在的含氟偶极层。从元素分析数据结果可以看出,本发明制备的修饰氧化铟锡阳极,其表面含氟偶极层的F元素的百分含量达到了11%以上,最高达到了19.46%。同时通过本发明的修饰处理,ITO表面的Sn/In比大幅降低,从0.188最低降到了0.004。说明F取代了部分Sn的键位,与In成键。As can be seen from Table 1, the surface of the unmodified common indium tin oxide anode is composed of C, O, In, and Sn four elements, and the modified indium tin oxide anode after the method of the present invention has more F element, indicating that after modification, F element and In form a bond to form on the surface of the ITO film, thereby forming a fluorine-containing dipole layer in the form of In-F on the surface of the ITO film. It can be seen from the elemental analysis data results that the modified indium tin oxide anode prepared by the present invention has a percentage content of F element in the fluorine-containing dipole layer on the surface of more than 11%, and the highest reaches 19.46%. At the same time, through the modification treatment of the present invention, the Sn/In ratio on the ITO surface is greatly reduced, from 0.188 to 0.004. It shows that F replaces some of the bonds of Sn and forms a bond with In.

实施例4Example 4

一种有机电致发光器件,包括依次层叠的阳极、空穴注入层、空穴传输层、发光层、电子传输层、电子注入层和阴极,所述阳极为本发明实施例1制备的修饰氧化铟锡阳极。An organic electroluminescent device, comprising an anode, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer and a cathode stacked in sequence, the anode is the modified oxide prepared in Example 1 of the present invention Indium tin anode.

具体地,本实施例中,空穴注入层的材质为酞菁锌(ZnPc),厚度为15nm;空穴传输层的材质为N,N'-二苯基-N,N'-二(3-甲基苯基)-1,1'-联苯-4,4'-二胺(TPD),厚度为50nm;发光层的材质为三(2-苯基吡啶)合铱(Ir(ppy)3)掺杂8%质量分数的1,3,5-三(1-苯基-1H-苯并咪唑-2-基)苯(TPBi)形成的混合材料,表示为Ir(ppy)3:TPBi(8%),厚度为15nm;电子传输层的电子传输材料为1,3,5-三(1-苯基-1H-苯并咪唑-2-基)苯(TPBi),厚度为50nm;电子注入层的材质为LiF,厚度为1nm;阴极为Ag,厚度为100nm。Specifically, in this embodiment, the material of the hole injection layer is zinc phthalocyanine (ZnPc) with a thickness of 15 nm; the material of the hole transport layer is N,N'-diphenyl-N,N'-bis(3 -methylphenyl)-1,1'-biphenyl-4,4'-diamine (TPD), with a thickness of 50nm; the material of the light-emitting layer is tris(2-phenylpyridine)iridium (Ir(ppy) 3 ) A mixed material formed by doping 8% mass fraction of 1,3,5-tris(1-phenyl-1H-benzimidazol-2-yl)benzene (TPBi), expressed as Ir(ppy) 3 :TPBi (8%), with a thickness of 15nm; the electron transport material of the electron transport layer is 1,3,5-tris(1-phenyl-1H-benzimidazol-2-yl)benzene (TPBi), with a thickness of 50nm; The injection layer is made of LiF with a thickness of 1 nm; the cathode is Ag with a thickness of 100 nm.

本实施例有机电致发光器件的结构为:ITO阳极/修饰层/ZnPc(15nm)/TPD(50nm)/Ir(ppy)3:TPBi(8%,15nm)/TPBi(50nm)/LiF(1nm)/Ag(100nm)。The structure of the organic electroluminescence device of this embodiment is: ITO anode/modification layer/ZnPc (15nm)/TPD (50nm)/Ir (ppy) 3 : TPBi (8%, 15nm)/TPBi (50nm)/LiF (1nm )/Ag(100nm).

图1是本实施例的有机电致发光器件的结构示意图。如图1所示,该有机电致发光器件的结构包括,修饰ITO阳极10,空穴注入层20、空穴传输层30、发光层40、电子传输层50、电子注入层60和阴极70。其中,修饰ITO阳极10包括ITO阳极101和修饰层102,所述修饰层102为以In-F的形式存在含氟偶极层。FIG. 1 is a schematic structural view of the organic electroluminescence device of this embodiment. As shown in FIG. 1 , the structure of the organic electroluminescent device includes a modified ITO anode 10 , a hole injection layer 20 , a hole transport layer 30 , a light emitting layer 40 , an electron transport layer 50 , an electron injection layer 60 and a cathode 70 . Wherein, the modified ITO anode 10 includes an ITO anode 101 and a modified layer 102, and the modified layer 102 is a fluorine-containing dipole layer in the form of In-F.

与现有有机电致发光器件相比,本发明实施例有机电致发光器件由于采用了修饰氧化铟锡阳极,阳极表面功函提高了,空穴注入效率得到改善,从而使得器件的启动电压明显降低。现有有机电致发光器件的结构为:普通未修饰ITO阳极/ZnPc(15nm)/TPD(50nm)/Ir(ppy)3:TPBi(8%,15nm)/TPBi(50nm)/LiF(1nm)/Ag(100nm)。现有有机电致发光器件的启动电压为3.0eV,本实施例有机电致发光器件的启动电压为2.1eV。Compared with the existing organic electroluminescent device, the organic electroluminescent device of the embodiment of the present invention adopts the modified indium tin oxide anode, the work function of the anode surface is improved, and the hole injection efficiency is improved, so that the starting voltage of the device is significantly improved. reduce. The structure of the existing organic electroluminescent device is: common unmodified ITO anode/ZnPc(15nm)/TPD(50nm)/Ir(ppy) 3 : TPBi(8%, 15nm)/TPBi(50nm)/LiF(1nm) /Ag(100nm). The starting voltage of the existing organic electroluminescent device is 3.0eV, and the starting voltage of the organic electroluminescent device in this embodiment is 2.1eV.

图2是本实施例的有机电致发光器件与现有发光器件的电流密度与电压的关系图。其中,曲线1为本实施例有机电致发光器件的电流密度与电压的关系图;曲线2为现有有机电致发光器件的电流密度与电压的关系图。从图中可以看出,在相同的启动电压下,本实施例有机电致发光器件能获得更高的注入电流,从而使器件具有更高的发光效率。现有有机电致发光器件的发光效率为13.1lm/W,本实施例有机电致发光器件的发光效率为26.4lm/W。这是由于本实施例有机电致发光器件采用了修饰氧化铟锡阳极,提高了空穴的注入效率,因此能够获得更高的载流子注入效率,提高器件有机电致发光效率。Fig. 2 is a graph showing the relationship between the current density and the voltage of the organic electroluminescent device of this embodiment and the existing light emitting device. Wherein, Curve 1 is a relationship diagram between current density and voltage of the organic electroluminescent device in this embodiment; Curve 2 is a relationship diagram between current density and voltage of an existing organic electroluminescent device. It can be seen from the figure that under the same start-up voltage, the organic electroluminescent device of this embodiment can obtain higher injection current, so that the device has higher luminous efficiency. The luminous efficiency of the existing organic electroluminescent device is 13.1lm/W, and the luminous efficiency of the organic electroluminescent device in this embodiment is 26.4lm/W. This is because the organic electroluminescent device of this embodiment uses a modified indium tin oxide anode, which improves the hole injection efficiency, so that higher carrier injection efficiency can be obtained, and the organic electroluminescence efficiency of the device can be improved.

实施例5Example 5

一种有机电致发光器件,包括依次层叠的阳极、空穴注入层、空穴传输层、发光层、电子传输层、电子注入层和阴极,所述阳极为本发明实施例2制备的修饰氧化铟锡阳极。所述空穴注入层、空穴传输层、发光层、电子传输层、电子注入层和阴极的材质与实施例4同。An organic electroluminescent device, comprising an anode, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer and a cathode stacked in sequence, the anode is the modified oxide prepared in Example 2 of the present invention Indium tin anode. The materials of the hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer, the electron injection layer and the cathode are the same as those in Example 4.

本实施例有机电致发光器件的启动电压为2.1eV,发光效率为31.1lm/w。The start-up voltage of the organic electroluminescent device in this embodiment is 2.1 eV, and the luminous efficiency is 31.1 lm/w.

实施例6Example 6

一种有机电致发光器件,包括依次层叠的阳极、空穴注入层、空穴传输层、发光层、电子传输层、电子注入层和阴极,所述阳极为本发明实施例3制备的修饰氧化铟锡阳极。所述空穴注入层、空穴传输层、发光层、电子传输层、电子注入层和阴极的材质与实施例4同。An organic electroluminescent device, comprising an anode, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer and a cathode stacked in sequence, the anode is the modified oxide prepared in Example 3 of the present invention Indium tin anode. The materials of the hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer, the electron injection layer and the cathode are the same as those in Example 4.

本实施例有机电致发光器件的启动电压为2.0eV,发光效率为35.2lm/w。The start-up voltage of the organic electroluminescent device in this embodiment is 2.0 eV, and the luminous efficiency is 35.2 lm/w.

以上所述是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本发明的保护范围。The above description is a preferred embodiment of the present invention, and it should be pointed out that for those skilled in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications are also considered Be the protection scope of the present invention.

Claims (9)

1.一种修饰氧化铟锡阳极,包括氧化铟锡阳极和修饰层,所述氧化铟锡阳极包括玻璃基板和设置在所述玻璃基板表面的氧化铟锡薄膜,所述修饰层设置在所述氧化铟锡薄膜表面,其特征在于,所述修饰层为所述氧化铟锡薄膜表面的铟与氟成键形成的以In-F形式存在的含氟偶极层,所述含氟偶极层的氟元素的质量百分含量为11~20%,锡元素与铟元素的质量百分含量比为0.004~0.017。1. A modified indium tin oxide anode, comprising an indium tin oxide anode and a modification layer, the indium tin oxide anode comprising a glass substrate and an indium tin oxide film arranged on the surface of the glass substrate, the modification layer being arranged on the The surface of the indium tin oxide film is characterized in that the modification layer is a fluorine-containing dipole layer in the form of In-F formed by bonding indium and fluorine on the surface of the indium tin oxide film, and the fluorine-containing dipole layer The mass percentage content of the fluorine element is 11-20%, and the mass percentage content ratio of the tin element and the indium element is 0.004-0.017. 2.如权利要求1所述的修饰氧化铟锡阳极,其特征在于,所述氧化铟锡薄膜的厚度为70~200nm。2. The modified indium tin oxide anode according to claim 1, wherein the thickness of the indium tin oxide thin film is 70-200 nm. 3.一种修饰氧化铟锡阳极的制备方法,其特征在于,包括以下步骤:3. A method for preparing a modified indium tin oxide anode, comprising the following steps: 提供洁净的氧化铟锡阳极;所述氧化铟锡阳极包括玻璃基板和设置在所述玻璃基板表面的氧化铟锡薄膜;A clean indium tin oxide anode is provided; the indium tin oxide anode includes a glass substrate and an indium tin oxide film arranged on the surface of the glass substrate; 将所述氧化铟锡阳极浸入浓度为0.2~2mol/L的含氟有机酸水溶液中,于5~20℃下浸泡0.5~2分钟后,取出,干燥;Immerse the indium tin oxide anode in a fluorine-containing organic acid aqueous solution with a concentration of 0.2-2mol/L, soak at 5-20°C for 0.5-2 minutes, take it out, and dry it; 将干燥后的所述氧化铟锡阳极置于等离子体设备中,通入含氟气体,使等离子体设备内的气体压力为10Pa~60Pa,调整射频功率为40w~100w,进行等离子体处理5~10分钟,得到修饰氧化铟锡阳极,所述修饰氧化铟锡阳极的表面具有修饰层,所述修饰层为所述氧化铟锡薄膜表面的铟与氟成键形成的以In-F形式存在的含氟偶极层。The dried indium tin oxide anode is placed in the plasma equipment, and the fluorine-containing gas is introduced to make the gas pressure in the plasma equipment 10Pa~60Pa, adjust the radio frequency power to 40w~100w, and perform plasma treatment for 5~ In 10 minutes, a modified indium tin oxide anode was obtained. The surface of the modified indium tin oxide anode has a modified layer, and the modified layer is formed by bonding indium and fluorine on the surface of the indium tin oxide film and exists in the form of In-F. Fluorine-containing dipole layer. 4.如权利要求3所述的修饰氧化铟锡阳极的制备方法,其特征在于,所述含氟偶极层的氟元素的百分含量为11~20%,锡元素与铟元素的质量百分含量比为0.004~0.017。4. The preparation method of modified indium tin oxide anode according to claim 3, characterized in that, the percentage of fluorine element in the fluorine-containing dipole layer is 11-20%, and the mass of tin element and indium element is 100%. The content ratio is 0.004~0.017. 5.如权利要求3所述的修饰氧化铟锡阳极的制备方法,其特征在于,所述含氟有机酸为二氟乙酸、三氟乙酸或2,2-二氟丙酸。5 . The method for preparing the modified indium tin oxide anode according to claim 3 , wherein the fluorine-containing organic acid is difluoroacetic acid, trifluoroacetic acid or 2,2-difluoropropionic acid. 6.如权利要求3所述的修饰氧化铟锡阳极的制备方法,其特征在于,所述含氟气体为四氟化碳或三氟化碳。6 . The method for preparing a modified indium tin oxide anode according to claim 3 , wherein the fluorine-containing gas is carbon tetrafluoride or carbon trifluoride. 7.如权利要求3所述的修饰氧化铟锡阳极的制备方法,其特征在于,所述氧化铟锡薄膜的厚度为70~200nm。7. The method for preparing a modified indium tin oxide anode according to claim 3, wherein the thickness of the indium tin oxide thin film is 70-200 nm. 8.一种有机电致发光器件,包括阳极、功能层、发光层和阴极,其特征在于,所述阳极为修饰氧化铟锡阳极,所述修饰氧化铟锡阳极包括氧化铟锡阳极和修饰层,所述氧化铟锡阳极包括玻璃基板和设置在所述玻璃基板表面的氧化铟锡薄膜,所述修饰层设置在所述氧化铟锡薄膜表面,所述修饰层为所述氧化铟锡薄膜表面的铟与氟成键形成的以In-F形式存在的含氟偶极层,所述含氟偶极层的氟元素的质量百分含量为11~20%,锡元素与铟元素的质量百分含量比为0.004~0.017。8. An organic electroluminescent device, comprising an anode, a functional layer, a light-emitting layer and a cathode, characterized in that the anode is a modified indium tin oxide anode, and the modified indium tin oxide anode includes an indium tin oxide anode and a modification layer , the indium tin oxide anode includes a glass substrate and an indium tin oxide film disposed on the surface of the glass substrate, the modification layer is disposed on the surface of the indium tin oxide film, and the modification layer is the surface of the indium tin oxide film A fluorine-containing dipole layer in the form of In-F formed by bonding indium and fluorine, the fluorine element in the fluorine-containing dipole layer is 11 to 20% by mass, and the mass percentage of tin and indium elements is 100%. The content ratio is 0.004~0.017. 9.如权利要求8所述的有机电致发光器件,其特征在于,所述氧化铟锡薄膜的厚度为70~200nm。9. The organic electroluminescence device according to claim 8, wherein the thickness of the indium tin oxide thin film is 70-200 nm.
CN201310010848.8A 2013-01-11 2013-01-11 A kind of preparation method modifying indium-tin oxide anode Active CN103928628B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201310010848.8A CN103928628B (en) 2013-01-11 2013-01-11 A kind of preparation method modifying indium-tin oxide anode
CN201610095917.3A CN105895824B (en) 2013-01-11 2013-01-11 One kind modification indium-tin oxide anode
CN201610096055.6A CN105576141B (en) 2013-01-11 2013-01-11 A kind of organic electroluminescence device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310010848.8A CN103928628B (en) 2013-01-11 2013-01-11 A kind of preparation method modifying indium-tin oxide anode

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN201610095917.3A Division CN105895824B (en) 2013-01-11 2013-01-11 One kind modification indium-tin oxide anode
CN201610096055.6A Division CN105576141B (en) 2013-01-11 2013-01-11 A kind of organic electroluminescence device

Publications (2)

Publication Number Publication Date
CN103928628A true CN103928628A (en) 2014-07-16
CN103928628B CN103928628B (en) 2016-10-05

Family

ID=51146776

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201610095917.3A Expired - Fee Related CN105895824B (en) 2013-01-11 2013-01-11 One kind modification indium-tin oxide anode
CN201310010848.8A Active CN103928628B (en) 2013-01-11 2013-01-11 A kind of preparation method modifying indium-tin oxide anode
CN201610096055.6A Expired - Fee Related CN105576141B (en) 2013-01-11 2013-01-11 A kind of organic electroluminescence device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201610095917.3A Expired - Fee Related CN105895824B (en) 2013-01-11 2013-01-11 One kind modification indium-tin oxide anode

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201610096055.6A Expired - Fee Related CN105576141B (en) 2013-01-11 2013-01-11 A kind of organic electroluminescence device

Country Status (1)

Country Link
CN (3) CN105895824B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019085045A1 (en) * 2017-10-30 2019-05-09 武汉华星光电技术有限公司 Preparation method for oled anode and preparation method for oled display device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106601924A (en) * 2016-12-21 2017-04-26 浙江大学 A quantum dot light-emitting diode and its preparation method
CN111384271B (en) * 2018-12-29 2021-05-28 Tcl科技集团股份有限公司 Quantum dot light-emitting diode and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999039393A1 (en) * 1998-02-02 1999-08-05 International Business Machines Corporation Anode modification for organic light emitting diodes
US6208075B1 (en) * 1998-11-05 2001-03-27 Eastman Kodak Company Conductive fluorocarbon polymer and method of making same
CN1983664A (en) * 2005-12-14 2007-06-20 中国科学院化学研究所 Organic LED based on anode modification
CN101123299A (en) * 2007-08-31 2008-02-13 吉林大学 A blue-light top-emitting organic electroluminescent device
CN101179114A (en) * 2007-12-10 2008-05-14 天津理工大学 A kind of flexible organic electroluminescence device and preparation method thereof
CN102610725A (en) * 2012-03-29 2012-07-25 华北电力大学 Semiconductor quantum dot light-emitting diode and preparing method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100289649B1 (en) * 1998-06-25 2001-05-02 박종섭 Manufacturing Method of Thin Film Transistor Liquid Crystal Display Device
CN202308074U (en) * 2011-09-08 2012-07-04 深圳市创益科技发展有限公司 Organic solar battery

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999039393A1 (en) * 1998-02-02 1999-08-05 International Business Machines Corporation Anode modification for organic light emitting diodes
US6208075B1 (en) * 1998-11-05 2001-03-27 Eastman Kodak Company Conductive fluorocarbon polymer and method of making same
CN1983664A (en) * 2005-12-14 2007-06-20 中国科学院化学研究所 Organic LED based on anode modification
CN101123299A (en) * 2007-08-31 2008-02-13 吉林大学 A blue-light top-emitting organic electroluminescent device
CN101179114A (en) * 2007-12-10 2008-05-14 天津理工大学 A kind of flexible organic electroluminescence device and preparation method thereof
CN102610725A (en) * 2012-03-29 2012-07-25 华北电力大学 Semiconductor quantum dot light-emitting diode and preparing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019085045A1 (en) * 2017-10-30 2019-05-09 武汉华星光电技术有限公司 Preparation method for oled anode and preparation method for oled display device

Also Published As

Publication number Publication date
CN105576141B (en) 2017-08-25
CN103928628B (en) 2016-10-05
CN105895824A (en) 2016-08-24
CN105895824B (en) 2017-12-26
CN105576141A (en) 2016-05-11

Similar Documents

Publication Publication Date Title
US9166184B2 (en) Organic light emitting device having three successive light emitting sub-layers with mixture matrix material for the second light emitting sub-layer and method of preparing same and display device thereof
EP2728635A1 (en) Top-emitting organic light-emitting device and method for preparing the same
CN103730589A (en) Top emission organic light-emitting device and manufacturing method thereof
EP2728636A1 (en) Top-emitting flexible organic light emission diode device and preparation method thereof
EP2728637A1 (en) Top-emitting organic electroluminescent device and manufacturing method thereof
US20140319506A1 (en) Organic electroluminescent device having ternary doped hole transportation layer and preparation method therefor
CN106531897B (en) A kind of organic electroluminescence device and preparation method thereof based on exciplex
EP2787792A1 (en) Polymeric electroluminescent device and method for preparing same
CN103928628B (en) A kind of preparation method modifying indium-tin oxide anode
CN104218162A (en) Organic light emission diode device and preparation method thereof
KR20060033448A (en) Organic electroluminescent element
CN103928627B (en) A kind of preparation method modifying indium-tin oxide anode
CN105576142B (en) A kind of preparation method of modified indium tin oxide anode
CN105679963B (en) A kind of organic electroluminescence device
CN104183718A (en) Organic light emission diode and preparation method thereof
CN104183713A (en) Top-emission organic light emission diode and preparation method thereof
CN103928618A (en) Organic electroluminescence apparatus and preparation method thereof
CN104183761A (en) Inverted organic light emission diode and preparation method thereof
CN103545450A (en) Organic electroluminescence device and manufacturing method thereof
CN104051630A (en) Organic light-emitting device and preparation method thereof
CN104183719A (en) Inverted organic light emission diode and preparation method thereof
CN103730578A (en) Organic electroluminescence device and manufacturing method of organic electroluminescence device
CN112661708A (en) Single-layer doped electron transport layer green phosphorescent device and preparation method and application thereof
CN104051637A (en) Organic light-emitting device and preparation method thereof
CN104638141A (en) Organic light-emitting device and production method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20160214

Address after: 362300, brocade 56, four Huangcun village, Xia Mei Town, Quanzhou City, Fujian, Nanan

Applicant after: Lin Zhenkun

Address before: 518104, building four, building 403, building A3, manholes Industrial Zone, manhole community, Gonghe subdistrict, Gonghe, Shenzhen, Guangdong, Baoan District

Applicant before: SHENZHEN OUKELI TECHNOLOGY Co.,Ltd.

Effective date of registration: 20160214

Address after: 518104, building four, building 403, building A3, manholes Industrial Zone, manhole community, Gonghe subdistrict, Gonghe, Shenzhen, Guangdong, Baoan District

Applicant after: SHENZHEN OUKELI TECHNOLOGY Co.,Ltd.

Address before: 518000 Guangdong city of Shenzhen province A Nanshan District Haiwang building Nanhai Road Block 22 layer

Applicant before: OCEAN'S KING LIGHTING SCIENCE & TECHNOLOGY Co.,Ltd.

Applicant before: Shenzhen Haiyangwang Illumination Technology Co.,Ltd.

Applicant before: SHEN ZHEN OCEAN'S KING LIGHTING ENGINEERING Co.,Ltd.

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20160708

Address after: 266000 Licang, Qingdao, No. nine East water road, No. 320, No.

Applicant after: Gu Yukui

Address before: 362300, brocade 56, four Huangcun village, Xia Mei Town, Quanzhou City, Fujian, Nanan

Applicant before: Lin Zhenkun

C14 Grant of patent or utility model
GR01 Patent grant
CP02 Change in the address of a patent holder
CP02 Change in the address of a patent holder

Address after: 266700 Qingdao, Shandong Province, Cui Jia village, Cui Jia village, Pingdu City, Pingdu City, east side of 603 provincial road

Patentee after: Gu Yukui

Address before: 266000 Licang, Qingdao, No. nine East water road, No. 320, No.

Patentee before: Gu Yukui

CP02 Change in the address of a patent holder
CP02 Change in the address of a patent holder

Address after: 210000 77 Shishicheng Road, Gulou District, Nanjing City, Jiangsu Province

Patentee after: Gu Yukui

Address before: 266700 East of 603 Provincial Road, Cuijiaji Village, Cuijiaji Town, Pingdu City, Qingdao City, Shandong Province

Patentee before: Gu Yukui

TR01 Transfer of patent right

Effective date of registration: 20191108

Address after: Room 2, west of the second floor, No. 355, Huanbei West Road, Weitang street, Jiashan County, Jiaxing City, Zhejiang Province

Patentee after: Jiashan Weitang Asset Management Co.,Ltd.

Address before: 210000 77 Shishicheng Road, Gulou District, Nanjing City, Jiangsu Province

Patentee before: Gu Yukui

TR01 Transfer of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: A preparation method of modified indium tin oxide anode

Effective date of registration: 20210531

Granted publication date: 20161005

Pledgee: Weitang sub branch of Zhejiang Jiashan Rural Commercial Bank Co.,Ltd.

Pledgor: Jiashan Weitang Asset Management Co.,Ltd.

Registration number: Y2021980004130

PC01 Cancellation of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20231018

Granted publication date: 20161005

Pledgee: Weitang sub branch of Zhejiang Jiashan Rural Commercial Bank Co.,Ltd.

Pledgor: Jiashan Weitang Asset Management Co.,Ltd.

Registration number: Y2021980004130

PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: A preparation method for modifying indium tin oxide anode

Effective date of registration: 20231127

Granted publication date: 20161005

Pledgee: Weitang sub branch of Zhejiang Jiashan Rural Commercial Bank Co.,Ltd.

Pledgor: Jiashan Weitang Asset Management Co.,Ltd.

Registration number: Y2023330002807

PC01 Cancellation of the registration of the contract for pledge of patent right

Granted publication date: 20161005

Pledgee: Weitang sub branch of Zhejiang Jiashan Rural Commercial Bank Co.,Ltd.

Pledgor: Jiashan Weitang Asset Management Co.,Ltd.

Registration number: Y2023330002807

PC01 Cancellation of the registration of the contract for pledge of patent right