CN103913471B - The method held and plate buries and holds layer contraposition is buried in a kind of inspection - Google Patents

Abstract

The invention belongs to the field of printed circuit board manufacturing, and in particular relates to a method for checking the alignment of a buried capacitance layer of a buried capacitance board. It includes the following steps: find out the minimum isolation pad or pad size of each buried capacitance layer, and make the minimum isolation pad or pad of the layer at the blank positions at the four corners of each buried capacitance layer; each buried capacitance layer The minimum isolation pads or pads made on the horizontal direction are sequentially staggered by a set distance; when the embedding layers and the inner core board are pressed together to form a multi-layer circuit board, according to the set distance, drill holes to form a plurality of through-holes that run through the smallest isolation pad or pad; check each of the embedding layers and the inner core board under an X-ray machine with the circuit board after the drilling is completed The pattern of the minimum isolation pad or pad on the layer, if the pattern of the minimum isolation pad or pad is not damaged, then the layer has no damage. In this way, it is possible to directly determine whether the market is broken or not and which floor it is.

Description

A method for checking the alignment of buried capacitor layers on buried capacitor plates

technical field

The invention belongs to the field of printed circuit board manufacturing, and in particular relates to a method for checking the alignment of a buried capacitance layer on a buried capacitance board.

Background technique

At present, the conventional PCB sets square copper points on the frame to confirm the misalignment. Since the size of the square copper points on each layer is the same, even if the misalignment occurs, it is impossible to confirm which layer is broken. It is necessary to sign the scrap board The parts are confirmed in the board, which increases the scrapping of the PCB board.

Especially when the embedding material is very thin, it is easy to be misplaced during the PCB processing process. When the X-ray machine checks, there will be a shift shadow of each layer of superimposed graphics. After drilling, it is impossible to visually judge whether the disk is broken. It needs to be observed under a microscope by taking a slice. It takes about an hour.

To sum up, the existing buried layer alignment detection method is not easy to observe and judge the failure, and the scrap rate is high.

Contents of the invention

The purpose of the present invention is to provide a method for inspecting the alignment of the embedding layer of the embedded capacitor board, aiming at solving the problem that it is difficult to observe and judge the failure of the multilayer circuit board in the prior art, and the detection and scrapping rate of the multilayer circuit board is high question.

The present invention is achieved in this way, a method for checking the alignment of the buried capacity layer of the buried capacity plate, comprising the following steps:

Find the minimum isolation pad or pad size for each buried capacitance layer;

In the blank positions at the four corners of each buried capacitor layer, respectively make the smallest isolation pad or pad of the layer;

The graphics of the minimum isolation pads or pads fabricated on each of the embedding layers are sequentially staggered by a set distance in the horizontal direction;

After the embedding layers are pressed together with the inner core board to form a multi-layer circuit board, holes are drilled according to the set distance to form a plurality of through holes, and the through holes respectively pass through the embedding capacitors. Minimum isolated pads or pads on layers and on said inner core board;

With the circuit board after the drilling is completed, check the patterns of the minimum isolation pads or pads on each of the embedding layers and the inner core board under an X-ray machine, if the minimum isolation pads or pads If there is no broken market in the graph, then the layer has no broken market.

Further, the pattern of the minimum isolation pad or pad is a square, the four corners of the square are rounded, and a circle is set in the center of the square, and the diameter of the circle is used as the minimum isolation pad or pad diameter of.

Further, the side length of the square is 5 mm, and the four corners of the square are rounded with a radius of 1 mm.

Further, the set distance is greater than 2mm.

Further, on the buried capacity layer, only the circular part of the pattern of the smallest isolation pad or pad is not covered with copper metal; on the inner core board, the smallest isolation pad or pad Only the circular portion of the graphic is covered with copper metal.

Compared with the prior art, in the present invention, minimum pads or isolation pad patterns are set at the four corners of each buried capacitance layer, and the minimum pads or isolation pads on each of the buried capacitance layers are staggered from each other by a design. In this way, after the embedding layers are laminated on the inner core board to form a multilayer circuit board, a plurality of embedding layers and the inner layer are drilled according to a preset distance. The through hole of the core board, and then drill the multilayer circuit board with the through hole under the X-ray machine to check whether the patterns of the minimum isolation pads or pads on each of the embedded layers and the inner core board are broken. If the disk is broken, it means that the embedding layer or inner core board where the pattern of the broken disk is located has shifted. During the whole process, it is possible to intuitively and quickly determine whether the laminated multilayer circuit board is broken, and which layer is broken, without the need to sign the waste board for confirmation, avoiding high-quality The multi-layer circuit board is scrapped by detection, which greatly improves the detection efficiency.

Description of drawings

Figure 1 is a schematic diagram of the distribution of the smallest pads or isolation pads on the embedding layer in the blank positions of the four corners in the embodiment of the present invention;

Fig. 2 is a schematic side view of the distribution of the minimum pads or isolation pads on the embedding layer in the blank positions of the four corners in the embodiment of the present invention;

Fig. 3 is a schematic diagram after drilling a plurality of buried capacity layers in an embodiment of the present invention;

FIG. 4 is a schematic diagram of the smallest pad or isolation pad in an embodiment of the present invention.

Mark Description:

1 the first surface of the first buried capacity layer 11 the first pad

2 The second surface of the first buried capacity layer 21 The second pad

3 The first surface of the second buried capacity layer 31 The third pad

4 The second surface 41 of the second buried capacity layer The fourth pad

5 Inner layer core board 51 fifth welding pad

6 through holes 71 round

8 minimum pad or isolation pad distribution area 72 square

9 The side length of effective graphics area D1

10 blank position R fillet radius

detailed description

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

The implementation of the present invention will be described in detail below in conjunction with specific drawings.

As shown in Figures 1-4, it is a preferred embodiment provided by the present invention.

In the method for checking the alignment of the embedding layer of the embedding plate in the present invention, the middle part of the embedding layer is an effective pattern area 9, and its periphery is a blank position 10, comprising the following steps:

Find the minimum isolation pad or pad size for each buried capacitance layer;

At the blank positions 10 at the four corners of each layer of buried capacity layer, make the minimum isolation pad or pad of the layer respectively; as shown in Figure 1, the distribution area 8 of the minimum isolation pad or pad is located at the blank position 10 at the four corners.

Referring to Fig. 2, the minimum isolation pads or pads made on each of the embedding layers are sequentially staggered by a set distance in the horizontal direction;

Referring to Fig. 3, after the embedding layers are pressed together with the inner core board 5 to form a multilayer circuit board, holes are drilled according to the set distance to form a plurality of through holes 6, and the through holes 6 are formed. The holes 6 respectively pass through the minimum isolation pads or pads on the buried capacitance layers and on the inner core board 5;

The printed circuit board after the drilling is completed, check each of the embedding layers and the pattern of the minimum isolation pads or pads on the inner core board 5 under the X-ray machine, if the minimum isolation pads or solder pads If the graph of the market is not broken, then the layer is not broken.

Compared with the prior art, in the present invention, minimum isolation rings or pad patterns are set at the four corner blank positions 10 of each buried capacitance layer, and the minimum isolation rings or pads on each buried capacitance layer are staggered from each other by one set distance, so that after the embedding layers and the inner core board 5 are pressed together to form a multilayer circuit board, a plurality of embedding layers and the embedding layers are drilled according to a preset distance. The through hole 6 of the inner layer core board 5, and then the multi-layer circuit board drilled with the through hole 6 is checked under the X-ray machine for each of the buried capacity layers and the minimum isolation disk or disk on the inner layer core board 5 Whether the pattern of the pad is broken, if it is broken, it means that the buried layer or the inner core board 5 where the pattern of the broken disk is located has shifted. During the whole process, it is possible to intuitively and quickly determine whether the laminated multilayer circuit board is broken, and which layer is broken, without the need to sign the waste board for confirmation, avoiding high-quality The multi-layer circuit board is detected and scrapped, which greatly improves the detection efficiency.

Specifically, in this embodiment, two embedding layers are provided, and each embedding layer has two sides. As shown in Figure 2, from top to bottom, the first surface 1 of the first buried capacity layer, the second surface 2 of the first buried capacity layer, the first surface 3 of the second buried capacity layer, and the second buried capacity layer The second face 4 of the layer, and the inner core 5. The first surface 1 of the first buried volume layer, the second surface 2 of the first buried volume layer, the first surface 3 of the second buried volume layer, the second surface 4 of the second buried volume layer, and the inner core board 5 are respectively provided with a first pad, a second pad, a third pad, a fourth pad and a fifth pad.

Further, the pattern of the smallest isolating pad or pad is a square 72, the four corners of the square are rounded, and a circle is set at the center of the square 72, and the diameter of the circle serves as the smallest pad or pad. The diameter of the isolation disc. Through the setting of this structure, when a break occurs, it is convenient for observation, and it can be intuitively judged which layer has broken.

Preferably, as shown in FIG. 4 , the side length D1 of the square 72 is 5 mm, and the four corners of the square 72 are rounded with a radius R of 1 mm. In this way, the small design is more convenient for production and processing. Of course, this size can be reasonably set according to the specific precision requirements of the multilayer board. Of course, depending on the needs of the buried capacity layer, the diameter of the circle can be reasonably set, that is, the size of the smallest isolation pad or pad can be set.

Further, the set distance is greater than 2mm. In this way, minimal spacer rings between layers or detection interference between pads can be avoided. Make broken disk detection more intuitive and reliable.

Further, on the buried capacity layer, only the circular 71 part of the pattern of the minimum isolation pad or pad is not covered with copper metal as a negative; on the inner core board 5, the minimum isolation Only the circular 71 portion of the pattern of pads or pads is covered with copper metal. In this way, the buried capacity layer and the non-buried capacity layer can be quickly distinguished, and it is convenient to determine which layer the breach occurred in.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. within range.

Claims (5)

1. inspection is buried and is held the method that plate buries the contraposition of appearance layer, it is characterized in that, comprises the following steps:

Find out every layer and bury the minimum trap-out tray or pad size that hold layer;

Bury in every layer the blank position holding layer four corner, make minimum trap-out tray or the pad of this layer respectively;

Bury the minimum trap-out tray or pad that hold and layer makes described in each, in horizontal direction, stagger a distance set in interval successively;

When described respectively burying is held after layer and core material pressing form multilayer circuit board, according to the distance of described setting, hole, form multiple through hole, described through hole run through respectively described respectively bury on appearance layer with the minimum trap-out tray on described core material or pad;

To the described wiring board after boring be completed, check under X-ray machine device each described in bury the figure holding minimum trap-out tray on layer and described core material or pad, if the broken dish of the figure of described minimum trap-out tray or pad, then the broken dish of this layer.

2. a kind of inspection according to claim 1 is buried and is held the method that plate buries the contraposition of appearance layer, it is characterized in that: the figure of described minimum trap-out tray or pad is a square, described foursquare corner place rounding, and a circle is provided with in described foursquare center, described diameter of a circle is as minimum trap-out tray or pad diameter.

3. a kind of inspection according to claim 2 is buried and is held the method that plate buries the contraposition of appearance layer, and it is characterized in that: the described foursquare length of side is 5mm, described foursquare corner place reciprocal radius is the fillet of 1mm.

4. a kind of inspection according to claim 3 is buried and is held the method that plate buries the contraposition of appearance layer, it is characterized in that: the distance of described setting is greater than 2mm.

5. a kind of inspection according to claim 3 is buried and is held the method that plate buries the contraposition of appearance layer, it is characterized in that: hold on layer in described burying, in the figure of described minimum trap-out tray or pad, only circular portion is not coated with copper metal; On other core material, in the figure of described minimum trap-out tray or pad, only circular portion is coated with copper metal.