CN103909361A - Low-silver-content cadmium-free solder - Google Patents
Low-silver-content cadmium-free solder Download PDFInfo
- Publication number
- CN103909361A CN103909361A CN201410100696.5A CN201410100696A CN103909361A CN 103909361 A CN103909361 A CN 103909361A CN 201410100696 A CN201410100696 A CN 201410100696A CN 103909361 A CN103909361 A CN 103909361A
- Authority
- CN
- China
- Prior art keywords
- silver
- solder
- manganese
- nickel
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 57
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 71
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052709 silver Inorganic materials 0.000 claims abstract description 38
- 239000004332 silver Substances 0.000 claims abstract description 38
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 35
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 28
- 239000010949 copper Substances 0.000 claims abstract description 28
- 239000011701 zinc Substances 0.000 claims abstract description 28
- 239000011572 manganese Substances 0.000 claims abstract description 27
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 27
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 23
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims abstract description 6
- 238000003756 stirring Methods 0.000 claims abstract description 5
- 238000005266 casting Methods 0.000 claims abstract description 4
- 239000002994 raw material Substances 0.000 claims abstract description 3
- 229910052793 cadmium Inorganic materials 0.000 claims description 17
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 abstract description 21
- 230000000694 effects Effects 0.000 abstract description 4
- 239000013078 crystal Substances 0.000 abstract description 3
- 238000003723 Smelting Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000000746 purification Methods 0.000 abstract 1
- 238000005219 brazing Methods 0.000 description 48
- 229910052751 metal Inorganic materials 0.000 description 34
- 239000002184 metal Substances 0.000 description 34
- 229910000881 Cu alloy Inorganic materials 0.000 description 16
- 239000000203 mixture Substances 0.000 description 16
- 238000005275 alloying Methods 0.000 description 15
- 238000007796 conventional method Methods 0.000 description 15
- 239000000945 filler Substances 0.000 description 15
- 230000004907 flux Effects 0.000 description 15
- 230000004927 fusion Effects 0.000 description 15
- 239000004615 ingredient Substances 0.000 description 15
- 229910001092 metal group alloy Inorganic materials 0.000 description 15
- 238000003466 welding Methods 0.000 description 4
- 241001417490 Sillaginidae Species 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 241001062472 Stokellia anisodon Species 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
The invention discloses low-silver-content cadmium-free solder and relates to the technical field of soldering. The low-silver-content cadmium-free solder is prepared by proportionally smelting raw materials comprising silver, copper, zinc, manganese and nickel, uniformly stirring, casting, and subjecting a cast ingot to squeezing and drawing so as to obtain a needed solder wire material. The low-silver-content cadmium-free solder comprises, by weight, 24%-26% of the silver, 31.5%-35% of the zinc, 0.8%-2.5% of the manganese, 0.5%-2.0% of the nickel, and the balance copper. By adding small amounts of the nickel and the manganese in the silver solder, wettability and joint strength of the solder can be enhanced, good effects on crystal boundary purification, plasticity improvement and strength enhancement can be achieved, processability of the low-silver-content cadmium-free solder can be improved, and production cost is lowered since silver content is reduced.
Description
Technical field
The present invention relates to welding technology field, relate to specifically a kind of solder without cadmium of low silver content.
Background technology
Soldering is a kind of important means of stainless steel welding, and traditional soldering silver solder, for containing cadmium solder, owing to having good soldering processes performance and Technical Economy containing cadmium solder, is widely used.But due to the illeffects of cadmium to human body Ankang and the adverse effect of environmental pollution, in the world to making to be used as certain restriction containing cadmium material.Soldering is an important means of stainless steel welding, present silver-base solder is mainly take silver, copper, three kinds of alloys of zinc as basis, owing to having forbidden the practicality of cadmium element, because the replacer who starts to find cadmium in the industry realizes without cadmium, obtain with tradition containing the identical performance of cadmium solder, conventionally need to be undertaken by the content that improves silver and other noble metal, because silver solder contains a large amount of noble silvers, its brazing product, in a large amount of manufactures and the outlet of China, makes the silver-colored resource of China day by day nervous.In order to reduce costs, improve the competitiveness of product, need to research and develop the solder without cadmium of low silver content.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of solder without cadmium of low cost function admirable.
In order to achieve the above object, the technical solution adopted in the present invention is:
A kind of solder without cadmium of low silver content, the raw material of argentiferous, copper, zinc, manganese, nickel is smelted by proportioning, after stirring, cast, then ingot casting is passed through to extruding, drawing, obtain needed solder wire material, described solder wire material comprises zinc, silver, tin, manganese, copper, wherein silver weight range is 24%～26% by mass percentage, and zinc is 31.5%～35%, and manganese is 0.8%～2.5%, nickel is 0.5%～2.0%, and surplus is copper.The present invention drops into silver, copper, zinc, nickel, manganese in sequence, smelts good stirring later, finally casts.
More specifically, the mass percent of described manganese is that the mass percent of 1.0%-1.5%, described nickel is 1%.
Beneficial effect of the present invention is:
The present invention mainly by adding a small amount of nickel in silver solder, the copper that nickel enters solder tissue mutually in, can be at the interface continuous crystallisation near mother metal, can improve wetability and the strength of joint of solder, to purifying crystal boundary, improving plasticity, the good effect of having gained in strength, and can improve processing characteristics, be easy to be processed into band.Add manganese and can increase wetability, improve weld strength.By optimizing the chemical composition of solder, obtain compared with the solder without cadmium of high wettability, weld strength.Add the content that other elements can reduce silver element simultaneously, effectively reduce production costs.
The specific embodiment
The solder without cadmium of a kind of low silver content of the present invention, solder wire material comprises zinc, silver, copper, manganese, nickel element, and wherein silver weight range is 24%～26% by mass percentage, and zinc is 31.5%～35%, and manganese is 0.8%～2.5%, nickel is 0.5%～2.0%.This solder is produced as follows: formula according to the rules, adopt cathode copper, zinc ingot metal, silver, manganese metal, metallic nickel to prepare burden, adopt conventional intermediate frequency smelting furnace to carry out melting, after melting, cast, then ingot casting is passed through to extruding, drawing, obtaining needed solder wire material, must be wherein to drop in sequence silver, copper, zinc, nickel, manganese to smelt, and smelts after stirring after having got well and casts.
Embodiment 1:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 24%, and zinc 31.5%, manganese 0.8%, nickel 0.5%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 355MPa, 800 ℃ of left and right of fusion temperature, 905 ℃ of left and right of brazing temperature.
Embodiment 2:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 25%, and zinc 33%, manganese 0.8%, nickel 0.5%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 355MPa, 793 ℃ of left and right of fusion temperature, 899 ℃ of left and right of brazing temperature.
Embodiment 3:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 26%, and zinc 35%, manganese 0.8%, nickel 0.5%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 355MPa, 787 ℃ of left and right of fusion temperature, 891 ℃ of left and right of brazing temperature.
Embodiment 4:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 25%, and zinc 33%, manganese 1%, nickel 1%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 355MPa, 753 ℃ of left and right of fusion temperature, 858 ℃ of left and right of brazing temperature.
Embodiment 5:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 24%, and zinc 34%, manganese 1%, nickel 1%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 355MPa, 756 ℃ of left and right of fusion temperature, 863 ℃ of left and right of brazing temperature.
Embodiment 6:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 26%, and zinc 35%, manganese 1%, nickel 1%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 355MPa, 750 ℃ of left and right of fusion temperature, 859 ℃ of left and right of brazing temperature.
Embodiment 7:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 25%, and zinc 31.5%, manganese 1.5%, nickel 1%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 355MPa, 743 ℃ of left and right of fusion temperature, 849 ℃ of left and right of brazing temperature.
Embodiment 8:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 25%, and zinc 33%, manganese 1.5%, nickel 1%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 355MPa, 740 ℃ of left and right of fusion temperature, 843 ℃ of left and right of brazing temperature.
Embodiment 9:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 26%, and zinc 34%, manganese 1.5%, nickel 1.5%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 355MPa, 736 ℃ of left and right of fusion temperature, 824 ℃ of left and right of brazing temperature.
Embodiment 10:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 24%, and zinc 31.5%, manganese 1.5%, nickel 1.5%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 355MPa, 740 ℃ of left and right of fusion temperature, 837 ℃ of left and right of brazing temperature.
Embodiment 11:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 24%, and zinc 31.5%, manganese 2%, nickel 2%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 355MPa, 743 ℃ of left and right of fusion temperature, 837 ℃ of left and right of brazing temperature.
Embodiment 12:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 25%, and zinc 31.5%, manganese 2%, nickel 1.5%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 355MPa, 705 ℃ of left and right of fusion temperature, 790 ℃ of left and right of brazing temperature.
Embodiment 13:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 26%, and zinc 31.5%, manganese 2.5%, nickel 2%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 355MPa, 732 ℃ of left and right of fusion temperature, 828 ℃ of left and right of brazing temperature.
Embodiment 14:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 24%, and zinc 33%, manganese 2.5%, nickel 1.5%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 355MPa, 727 ℃ of left and right of fusion temperature, 824 ℃ of left and right of brazing temperature.
Embodiment 15:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 26%, and zinc 33%, manganese 2.5%, nickel 1.0%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 355MPa, 765 ℃ of left and right of fusion temperature, 870 ℃ of left and right of brazing temperature.
Obtained by above-described embodiment, by solder is added nickel, manganese element and optimizes its partition ratio, the processing performance such as tensile strength, brazing temperature of solder is better, and when the mass percent that is 1.0%-1.5%, described nickel when manganese mass percent is especially 1%, solder performance better and stable.
The present invention adds a small amount of nickel in silver solder, the copper that nickel enters solder tissue mutually in, can be at the interface continuous crystallisation near mother metal, wetability and the strength of joint of solder can be improved, to purifying crystal boundary, improving plasticity, the good effect of having gained in strength, and processing characteristics can be improved, be easy to be processed into band, but can improve the liquidus temperature of solder, add nickel and can prevent that the Zn in brazing process from evaporating the compactness defect of the soldering point causing, thereby can improve soldered fitting intensity.Add manganese and can increase wetability, improve weld strength.Can find out from above-described embodiment, by adding manganese, nickel alloy element, and optimize its content proportioning.Solder product can obtain good wettability on copper alloy mother metal, and after welding, tensile strength is higher, and silver content total amount is lower, has the advantage on cost.
Claims (2)
1. the solder without cadmium of a low silver content, the raw material of argentiferous, copper, zinc, manganese, nickel is smelted by proportioning, after stirring, cast, then ingot casting is passed through to extruding, drawing, obtain needed solder wire material, it is characterized in that: described solder wire material comprises zinc, silver, tin, manganese element, wherein silver weight range is 24%～26% by mass percentage, and zinc is 31.5%～35%, and manganese is 0.8%～2.5%, nickel is 0.5%～2.0%, and surplus is copper.
2. the solder without cadmium of a kind of low silver content according to claim 1, is characterized in that: the mass percent of described manganese is that the mass percent of 1.0%-1.5%, described nickel is 1%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410100696.5A CN103909361A (en) | 2014-03-17 | 2014-03-17 | Low-silver-content cadmium-free solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410100696.5A CN103909361A (en) | 2014-03-17 | 2014-03-17 | Low-silver-content cadmium-free solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103909361A true CN103909361A (en) | 2014-07-09 |
Family
ID=51035528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410100696.5A Pending CN103909361A (en) | 2014-03-17 | 2014-03-17 | Low-silver-content cadmium-free solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103909361A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106514042A (en) * | 2016-11-30 | 2017-03-22 | 安徽华众焊业有限公司 | Cadmium-free silver-based brazing filler metal |
| CN108136548A (en) * | 2015-01-22 | 2018-06-08 | 优美科股份公司及两合公司 | Brazing alloy |
| CN112004638A (en) * | 2018-04-23 | 2020-11-27 | 田中贵金属工业株式会社 | Silver solder and bonding method using the same |
| CN112872077A (en) * | 2021-01-29 | 2021-06-01 | 宁波江丰电子材料股份有限公司 | Preparation method of high-purity silver evaporation material |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52126660A (en) * | 1976-04-19 | 1977-10-24 | Ishifuku Metal Ind | Silverrbrazing alloy |
| KR20020073777A (en) * | 2001-03-16 | 2002-09-28 | 주식회사삼화합금사 | an alloy composition for a filler metal |
| CN101524793A (en) * | 2009-04-20 | 2009-09-09 | 金华市三环焊接材料有限公司 | Cadmium-free silver filler containing lithium and niobium and production method thereof |
| CN101693325A (en) * | 2009-10-14 | 2010-04-14 | 郑州机械研究所 | High-toughness cadmium-free silver solder and preparation method thereof |
| CN103264259A (en) * | 2013-05-15 | 2013-08-28 | 张兵权 | Abrasion-resistant fire-proof brick mold plate and fast manufacturing method thereof |
-
2014
- 2014-03-17 CN CN201410100696.5A patent/CN103909361A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52126660A (en) * | 1976-04-19 | 1977-10-24 | Ishifuku Metal Ind | Silverrbrazing alloy |
| KR20020073777A (en) * | 2001-03-16 | 2002-09-28 | 주식회사삼화합금사 | an alloy composition for a filler metal |
| CN101524793A (en) * | 2009-04-20 | 2009-09-09 | 金华市三环焊接材料有限公司 | Cadmium-free silver filler containing lithium and niobium and production method thereof |
| CN101693325A (en) * | 2009-10-14 | 2010-04-14 | 郑州机械研究所 | High-toughness cadmium-free silver solder and preparation method thereof |
| CN103264259A (en) * | 2013-05-15 | 2013-08-28 | 张兵权 | Abrasion-resistant fire-proof brick mold plate and fast manufacturing method thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108136548A (en) * | 2015-01-22 | 2018-06-08 | 优美科股份公司及两合公司 | Brazing alloy |
| CN108136548B (en) * | 2015-01-22 | 2020-07-14 | 优美科股份公司及两合公司 | Brazing alloy |
| CN106514042A (en) * | 2016-11-30 | 2017-03-22 | 安徽华众焊业有限公司 | Cadmium-free silver-based brazing filler metal |
| CN112004638A (en) * | 2018-04-23 | 2020-11-27 | 田中贵金属工业株式会社 | Silver solder and bonding method using the same |
| EP3785845A4 (en) * | 2018-04-23 | 2021-03-03 | Tanaka Kikinzoku Kogyo K.K. | SILVER SOLDER MATERIAL AND JOINING METHODS USED WITH THE SAID SILVER SOLDER MATERIAL |
| US11638973B2 (en) | 2018-04-23 | 2023-05-02 | Tanaka Kikinzoku Kogyo K.K. | Silver brazing material and joining method using the silver brazing material |
| CN112872077A (en) * | 2021-01-29 | 2021-06-01 | 宁波江丰电子材料股份有限公司 | Preparation method of high-purity silver evaporation material |
| CN112872077B (en) * | 2021-01-29 | 2022-12-02 | 宁波江丰电子材料股份有限公司 | Preparation method of high-purity silver evaporation material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101716702B (en) | Multi-component alloy cadmium-free low-silver solder | |
| CN102581507B (en) | Tin, zinc and bismuth multi-element eutectic lead-free solder and preparation method | |
| CN102615447B (en) | Tin-based lead-free solder and preparation method thereof | |
| CN100496864C (en) | Cadmium-free silver solder containing gallium, indium, and rare earth neodymium and cerium | |
| CN100558499C (en) | A kind of manufacture method of cadmium-free silver brazing alloy | |
| CN103909363A (en) | Cadmium-free low-silver solder containing tin, manganese and indium | |
| CN103909361A (en) | Low-silver-content cadmium-free solder | |
| CN101716705B (en) | Multi-alloy cadmium-free phosphor-free copper-based solder | |
| CN101362265B (en) | Tin wire production method of welding material | |
| CN100398251C (en) | Cadmium-free silver solder containing gallium and cerium | |
| CN100463763C (en) | Cu-P-Ag solder containing Ga, In and Ce | |
| CN102642097A (en) | Low-silver lead-free solder alloy | |
| CN100453244C (en) | Lead les tin solder | |
| CN107199416A (en) | A kind of brass silver-less solder alloy | |
| CN103846569A (en) | Cobalt-containing low-silver cadmium-free silver solder | |
| CN102766780A (en) | Zinc alloy | |
| CN101524793B (en) | Cadmium-free silver filler containing lithium and niobium | |
| CN103909360A (en) | Cadmium-free low-silver solder containing nickel, manganese and indium | |
| CN102717200A (en) | Lead-free soft braze welding material and preparation method of lead-free soft braze welding material | |
| CN101985193B (en) | Cadmium-free silver solder and preparation method thereof | |
| CN104191101A (en) | Little-defect clean Sn-Zn solder containing palladium and preparing method thereof | |
| CN100471613C (en) | Silver solder of containing gallium, indium, and rare earth silicon and neodymium without cadmium | |
| CN102766783A (en) | Zinc alloy | |
| CN102848100A (en) | Low-silver Sn-Ag-Cu lead-free brazing filler metal containing Nd and Ga | |
| CN103909362A (en) | Low-silver brazing filler metal containing nickel and indium |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140709 |