CN103904488A - Headphone socket - Google Patents
Headphone socket Download PDFInfo
- Publication number
- CN103904488A CN103904488A CN201210586342.7A CN201210586342A CN103904488A CN 103904488 A CN103904488 A CN 103904488A CN 201210586342 A CN201210586342 A CN 201210586342A CN 103904488 A CN103904488 A CN 103904488A
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- China
- Prior art keywords
- contact
- wafer
- earphone
- earphone socket
- headset plug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000002184 metal Substances 0.000 claims abstract description 30
- 238000001514 detection method Methods 0.000 claims abstract description 13
- 238000005452 bending Methods 0.000 claims abstract description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 24
- 239000000835 fiber Substances 0.000 claims description 6
- 230000011664 signaling Effects 0.000 claims description 6
- 239000013307 optical fiber Substances 0.000 description 6
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Images
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- Coupling Device And Connection With Printed Circuit (AREA)
- Headphones And Earphones (AREA)
Abstract
Disclosed is a headphone socket. The headphone socket comprises a socket body, a first contact, a second contact, a third contact, a fourth contact, a fifth contact and a sixth contact, a headphone jack is formed in the socket body, the first contact, the second contact and the third contact are matched and correspondingly and electrically connected with independent metal hubs of a headphone plug respectively, the third contact receives the headphone right channel signal of the headphone plug, the fourth contact is arranged to be exactly opposite to the first contact, the fourth contact is matched and correspondingly and electrically connected with the metal hub corresponding to the first contact, the fifth contact comprises a bending portion and an abutting portion, the bending portion is matched and correspondingly and electrically connected with the metal hub, connected with a left channel signal, of the headphone plug, and the abutting portion abuts against the sixth contact. Whether the headphone plug is completely inserted into the headphone jack or not is judged through the fifth contact and the sixth contact, the last metal hub of the headphone plug is inducted by the first contact and the fourth contact, and detection accuracy is improved.
Description
Technical field
The present invention relates to connector, relate in particular to a kind of earphone socket.
Background technology
Existing earphone socket arranges induction contact in earphone jack bottom conventionally, and in the time of the complete plugged earphone jack of headset plug, induction contact can sense headset plug end.But this earphone socket for example,, when inserting other nonmetallic columnar objects (: optical fiber), also can be judged as headset plug insertion, thereby cause the error of judgement.
Summary of the invention
Technical problem to be solved by this invention is, the poor problem of earphone socket detection accuracy existing for solving prior art.
To achieve these goals, the invention provides following technical scheme:
On the one hand, a kind of earphone socket is provided, described earphone socket comprises pedestal, the first contact, the second wafer, the third wafer, the 4th contact, the 5th contact and the 6th contact, described pedestal is offered earphone jack, described the first contact, the second wafer and the third wafer are set in turn in described earphone jack one side along entrance to the bottom of described earphone jack, described the 4th contact, the 5th contact and the 6th contact are set in turn in the opposite side of described earphone jack along entrance to the bottom of described earphone jack.Described the first contact, the each independent metal hubs of the second wafer and the third wafer respectively with one headset plug matches and merges corresponding electrical connection, described the third wafer is used for receiving earphone right-channel signals, described the 4th contact and described the first contact are just to arranging, and the metal hubs corresponding with described the first contact matches and merges corresponding electrical connection, described the 5th contact comprises kink and butting section, described kink matches and merges corresponding electrical connection with the metal hubs of the connection left channel signals of described headset plug, described butting section and described the 6th contact are inconsistent, in described headset plug inserts described earphone jack completely time, the kink of described the 5th contact is conflicted and strain, the butting section of described the 5th contact and described the 6th contact are separated, the first testing circuit that described the 6th contact disconnects for connecting described the 5th contact of a detection and the 6th contact, the second testing circuit that described the 4th contact is connected for connecting described the first contact of a detection and the 4th contact.
In the possible implementation of the first, described pedestal is offered multiple for accommodating the first accepting groove, the second accepting groove, the 3rd accepting groove, the 4th accepting groove, the 5th accepting groove and the 6th accepting groove of described the first contact, the second wafer, the third wafer, the 4th contact, the 5th contact and the 6th contact.
In conjunction with the possible implementation of the first, in the possible implementation of the second, described the 5th contact comprises the 5th fixed part, brace and bent sheet, described brace comprises the first end and the second end that are oppositely arranged, the entrance setting of the contiguous described earphone jack of described first end, the bottom of the contiguous described earphone jack of described the second end arranges, described the 5th fixed part is connected in described brace the second end, described the 5th fixed part and brace are fixed on described pedestal, described bent sheet is connected in the first end of described brace, and extend the bottom towards described earphone jack, described kink is connected in the end that described bent sheet is extended, described kink is U-bend folded structure, described kink is outstanding along the direction away from described brace, described butting section is connected in described kink end.
In conjunction with the possible implementation of the second, in the third possible implementation, described brace the second end also connects a limited post, and described limited post is positioned at described kink depression, limits the stroke of described kink.
In conjunction with the second or any possible implementation in the third, in the 4th kind of possible implementation, described the 6th contact comprises the 6th fixed part and the 6th connecting portion, described the 6th fixed part and the 6th connecting portion are fixed in described pedestal, described the 6th connecting portion is resisted against the butting section of described the 5th contact, described the 6th connecting portion is also offered breach, and the bending part of described the 5th contact is in described breach.
In the 5th kind of possible implementation, described earphone socket also comprises fiber chip, and described fiber chip is positioned at the bottom of described earphone jack.
In the 6th kind of possible implementation, described the first contact is for receiving the ground signalling of headset plug, and described the second wafer is for receiving the microphone signal of headset plug.
In the 7th kind of possible implementation, described the first contact is for receiving the microphone signal of headset plug, described the second wafer is for receiving the ground connection of headset plug, and described earphone socket is also electrically connected a diverter switch, and described diverter switch is used for switching described microphone signal and ground signalling.
In the 8th kind of possible implementation, described diverter switch comprises to be controlled pin, grounding pin, microphone pin and connects pin, described grounding pin ground connection, described microphone pin connects described microphone signal, described connection pin is electrically connected with described the first contact, described control pin reception control signal, is electrically connected with one of them in described grounding pin or microphone pin to control described connection pin.
In the 9th kind of possible implementation, described the first contact, the second wafer, the third wafer, the 4th contact, the 5th contact and the 6th contact are resilient sheet-like structure.
Earphone socket provided by the invention, judge by described the 5th contact and described the 6th contact whether headset plug has inserted described earphone jack completely, respond to last metal hubs of headset plug simultaneously by described the first contact and the 4th contact, thereby improve the accuracy that earphone socket detects.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing of required use during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the decomposing schematic representation of the earphone socket that provides of first embodiment of the invention;
Fig. 2 is the schematic internal view of the earphone socket of Fig. 1;
Fig. 3 is the view of earphone socket each contact of when work of Fig. 1;
Fig. 4 is the 5th contact of earphone socket of Fig. 1 and the schematic diagram of the 6th contact;
Fig. 5 is the 5th contact of Fig. 4 and the 6th contact schematic diagram while connecting;
Fig. 6 is the decomposing schematic representation of the earphone socket that provides of second embodiment of the invention;
Fig. 7 is the schematic diagram of the diverter switch of the connection of the earphone socket of Fig. 6.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Earphone socket provided by the invention, judge by described the 5th contact and described the 6th contact whether headset plug has inserted described earphone jack completely, respond to last metal hubs of headset plug simultaneously by described the first contact and the 4th contact, thereby improve the accuracy that earphone socket detects.
Refer to Fig. 1, the earphone socket 100 that first embodiment of the invention provides, described earphone socket 100 comprises pedestal 10, the first contact 20, the second wafer 30, the third wafer 40, the 4th contact 50, the 5th contact 60 and the 6th contact 70.In present embodiment, described the first contact 20, the second wafer 30, the third wafer 40, the 4th contact 50, the 5th contact 60 and the 6th contact 70 are resilient sheet-like structure.Certainly, in other embodiments, described each contact can be also metal contact or telescopic structure of contact terminal.
In present embodiment, described pedestal 10 is cuboid.Described pedestal 10 is offered earphone jack 11.For the described each contact of convenient installation, described pedestal 10 is offered multiple for accommodating the first accepting groove 12, the second accepting groove 13, the 3rd accepting groove 14, the 4th accepting groove 15, the 5th accepting groove 16 and the 6th accepting groove 17 of described the first contact 20, the second wafer 30, the third wafer 40, the 4th contact 50, the 5th contact 60 and the 6th contact 70.Described the first accepting groove 12, the second accepting groove 13, the 3rd accepting groove 14 are opened in described pedestal 10 1 side 10a.Described the 4th accepting groove 15, the 5th accepting groove 16 and the 6th accepting groove 17 are opened in the opposite side 10b of described pedestal 10.Described earphone socket 100 also comprises fiber chip (not shown), and described fiber chip is positioned at the bottom 11b (referring to Fig. 2) of described earphone jack 11.Thereby make described earphone socket 100 not only can insert headset plug but also can insert Optical fiber plug, realize dual-use material, reduce interface quantity, reduction small product size.
Refer to Fig. 2, described the first contact 20, the second wafer 30, the third wafer 40 are set in turn in described earphone jack 11 1 sides along the entrance 11a of described earphone jack 11 to described bottom 11b.
See also Fig. 2 and Fig. 3, the each independent metal hubs 201,202,203,204 of described the first contact 20, the second wafer 30, the third wafer 40 respectively with one headset plugs 200 matches and merges corresponding electrical connection.In present embodiment, described the first contact 20, the second wafer 30, the third wafer 40 are contained in the first accepting groove 12, the second accepting groove 13 and the 3rd accepting groove 14 of described pedestal 10 1 side 10a successively.Described the first contact 20 is for ground connection.Described first contact 20 one end 21 are fixed in described pedestal 10, and the other end 22 of described the first contact 20 extends towards the entrance 11a of described earphone jack 11, and the other end 22 of described the first contact 20 contacts at described metal hubs 201, and electrical connection.Described the second wafer 30 is for connecing microphone signal.Described the second wafer 30 one end 31 are fixed in described pedestal 10, and the other end 32 of described the second wafer 30 extends towards the entrance 11a of described earphone jack 11, and the other end 32 of described the second wafer 30 contacts at described metal hubs 202, and electrical connection.Described the third wafer 40 is for receiving the right-channel signals of headset plug 200.Described the third wafer 40 one end 41 are fixed in described pedestal 10, and the other end 42 of described the third wafer 40 extends towards the entrance 11a of described earphone jack 11, and the other end 42 of described the third wafer 40 contacts at described metal hubs 203, and electrical connection.
Described the 4th contact 50, the 5th contact 60 and the 6th contact 70 are set in turn in the opposite side of described earphone jack 11 to bottom 11b along the entrance 11a of described earphone jack 11.Described the 4th contact 50 and described the first contact 20 are just to arranging, and the metal hubs 201 corresponding with described the first contact 20 matches and merges corresponding electrical connection, the second testing circuit (not shown) that described the 4th contact 50 is connected for connecting described the first contact 20 of a detection and the 4th contact 50.In present embodiment, described the second testing circuit is the low level testing circuit of existing detection.Described the 4th contact 50, the 5th contact 60 and the 6th contact 70 are contained in the 4th accepting groove 15, the 5th accepting groove 16 and the 6th accepting groove 17 of described pedestal 10 opposite side 10b successively.Described the 4th contact 50 one end 51 are fixed in described pedestal 10, and the other end 52 of described the 4th contact 50 extends towards the entrance 11a of described earphone jack 11, and the other end 52 of described the 4th contact 50 contacts at described metal hubs 201, and electrical connection.Described the 4th contact 50 connects a high level, described the second testing circuit detects described the 4th contact 50, in the time that described the 4th contact 50 touches metal hubs 201 with described the first contact 20 simultaneously, due to described the first contact 20 ground connection, described the 4th contact 50 and described the first contact 20 are by described metal hubs 201 conductings, thereby described the 4th contact 50 becomes low level, it is the plug insertion of the earphone of metal that thereby described the second testing circuit detects low level judgement, and the plug of nonmetallic optical fiber inserts, thereby avoid erroneous judgement.Because when the plug of optical fiber inserts, because the plug of optical fiber does not have corresponding metal hubs 201, so cannot conduct electricity, not conducting between described the 4th contact 50 and described the first contact 20, described the 4th contact 50 keeps high level, described the second testing circuit can't detect low level, and what distinguish successively insertion is not the plug of earphone.
Described the 5th contact 60 comprises kink 61 and butting section 62, described kink 61 matches and merges corresponding electrical connection with the metal hubs 204 of the connection left channel signals of described headset plug 200, described butting section 62 is inconsistent with described the 6th contact 70, when described headset plug 200 inserts described earphone jack 11 when interior completely, the conflict metal hubs 204 of described headset plug 200 of the kink 61 of described the 5th contact 60, and being pushed strain by described metal hubs 204, butting section 62 and described the 6th contact 70 of described the 5th contact 60 are separated.
Refer to Fig. 4, in present embodiment, described the 5th contact 60 comprises the 5th fixed part 63, brace 64 and bent sheet 65.Described brace 64 comprises the first end 64a and the second end 64b that are oppositely arranged.The entrance 11a of the contiguous described earphone jack 11 of described first end 64a arranges, and the bottom 11b of the contiguous described earphone jack 11 of described the second end 64b arranges.Described the 5th fixed part 63 is connected in the second end 64b of described brace 64, described the 5th fixed part 63 and brace 64 are fixed on the described pedestal 10 of Fig. 1, described bent sheet 65 is connected in the first end 64a of described brace 64, and the bottom 11b towards described earphone jack 11 extends, described kink 61 is connected in the end 65a that described bent sheet 65 is extended, described kink 61 is U or V-arrangement bending structure, and described kink 61 is outstanding along the direction away from described brace 64.Described butting section 62 is connected in described kink 61 ends.In order to limit the bending degree of described the 5th contact 60, described brace 64 second end 64b also connect a limited post 64c, and described limited post 64c is positioned at described kink 61 depressions, limit the stroke of described kink 61.Described limited post 64c is formed by described brace 64 bendings.
The first testing circuit that described the 6th contact 70 disconnects for connecting described the 5th contact 60 of a detection and the 6th contact 70.In present embodiment, described the 6th contact 70 comprises the 6th fixed part 71 and the 6th connecting portion 72, and described the 6th fixed part 71 and the 6th connecting portion 72 are fixed in the described pedestal 10 of Fig. 1.Described the 6th connecting portion 72 is resisted against the butting section 62 (referring to Fig. 5) of described the 5th contact 60, and described the 6th connecting portion 72 is also offered breach 72a, and the kink 61 of described the 5th contact 60 is positioned at described breach 72a.Certainly, in other embodiments, described the 6th connecting portion 72 also can pass through to reduce length, thereby does not offer breach 72a.After described headset plug 200 inserts completely, the kink 61 of described the 5th contact 60 is strain under the extruding of described headset plug 200 metal hubs 204, the butting section of described the 5th contact 60 62 and the 6th connecting portion 72 of described the 6th contact 70 be separated (referring to Fig. 3).Described the first testing circuit is the testing circuit of existing detection high level.In circuit design, generally can use large resistance by the signal clamper of described the 6th contact 70 at high level, use small resistor by the signal clamper of described the 5th contact 60 in low level.In not having described headset plug 200 to insert, the butting section 62 of described the 5th contact 60 contacts (referring to Fig. 5) with the 6th connecting portion 72 of described the 6th contact 70, and described the 6th contact 70 is low level.After described headset plug 200 inserts, the butting section 62 of described the 5th contact 60 separates (referring to Fig. 3) with the 6th connecting portion 72 of described the 6th contact 70, described the 6th contact 70 is now high level, described the first testing circuit detects high level, is now judged as described headset plug 200 and inserts completely.In the present embodiment, first and second in the first testing circuit and the second testing circuit do not have sequential restriction, is expressed as different testing circuits.
Refer to Fig. 6, the earphone socket 300 providing for second embodiment of the invention, the earphone socket 100 that described earphone socket 300 and the first execution mode provide is basic identical, its difference is, described earphone socket 300 is for detection of the metal hubs 201 of headset plug 200 described in Fig. 3, the situation of 202 holding wire reversal connection, described first contact 320 of described earphone socket 300 is for connecing microphone signal, described the second wafer 330 is for ground connection, described earphone socket 300 is also electrically connected a diverter switch 400 (referring to Fig. 7), described diverter switch 400 is for switching described microphone signal and ground signalling.In present embodiment, described diverter switch 400 is analog switch, and described diverter switch 400 comprises to be controlled pin 401, grounding pin 402, microphone pin 403 and connects pin 404.Described connection pin 404 is electrically connected with described the first contact 320, and described control pin 401 receives external control signal, is electrically connected with one of them in described grounding pin 402 or microphone pin 403 to control described connection pin 404.Described external control signal can be sent or hand switch triggers by the detection software of electronic equipment that adopts described earphone socket 300.After headset plug 200 inserts, what described the second wafer 330 connect in fact is the ground signalling of headset plug 200, and what the first contact 320 was connected with the 4th contact 350 is the microphone signal of headset plug 200.Now, by the control pin 401 of described diverter switch 400, the microphone signal of controlling headset plug 200 is first connected to grounding pin 402, i.e. ground connection by the connection pin 404 of described the first contact 320 and described diverter switch 400.It is low level that described the second testing circuit detects described the 4th contact 350, proves that described headset plug 200 final stages are metal, determines that inserting object is headset plug.If it is high level that described the second testing circuit detects described the 4th contact 350, prove that described headset plug 200 final stages are nonmetal, determine that inserting object is non-headset plug, as devices such as optical fiber splices.After completing detection, control by the control pin 401 of described diverter switch 400, described connection pin 404 is connected with described microphone pin 403, and the microphone signal of headset plug 200 is just connected to above actual microphone circuit.
The present invention is by improving the structure of current earphone socket, judge by described the 5th contact and described the 6th contact whether headset plug has inserted described earphone jack completely, simultaneously by last metal hubs of described the first contact and the 4th contact induction headset plug, thereby realize the reliable Detection that described headset plug inserts, the nonmetal columnar object insertion that prevents other similar described headset plugs is judged as described headset plug insertion later, improves the accuracy that earphone socket detects.
Above disclosed is only a kind of preferred embodiment of the present invention, certainly can not limit with this interest field of the present invention, and the equivalent variations of therefore doing according to the claims in the present invention, still belongs to the scope that the present invention is contained.
Claims (10)
1. an earphone socket, described earphone socket comprises pedestal, the first contact, the second wafer, the third wafer, the 4th contact, the 5th contact and the 6th contact, described pedestal is offered earphone jack, described the first contact, the second wafer and the third wafer are set in turn in described earphone jack one side along entrance to the bottom of described earphone jack, described the 4th contact, the 5th contact and the 6th contact are set in turn in the opposite side of described earphone jack along entrance to the bottom of described earphone jack, it is characterized in that: described the first contact, the each independent metal hubs of the second wafer and the third wafer respectively with one headset plug matches and merges corresponding electrical connection, described the third wafer is for receiving the right-channel signals of headset plug, described the 4th contact and described the first contact are just to arranging, and the metal hubs corresponding with described the first contact matches and merges corresponding electrical connection, described the 5th contact comprises kink and butting section, described kink matches and merges corresponding electrical connection with the metal hubs of the connection left channel signals of described headset plug, described butting section and described the 6th contact are inconsistent, in described headset plug inserts described earphone jack completely time, the kink of described the 5th contact is conflicted and strain, the butting section of described the 5th contact and described the 6th contact are separated, in the time that earphone socket judges that described headset plug inserts, the first testing circuit that described the 6th contact disconnects for connecting described the 5th contact of a detection and the 6th contact, the second testing circuit that described the 4th contact is connected for connecting described the first contact of a detection and the 4th contact.
2. earphone socket as claimed in claim 1, it is characterized in that, described pedestal is offered multiple for accommodating the first accepting groove, the second accepting groove, the 3rd accepting groove, the 4th accepting groove, the 5th accepting groove and the 6th accepting groove of described the first contact, the second wafer, the third wafer, the 4th contact, the 5th contact and the 6th contact.
3. earphone socket as claimed in claim 2, it is characterized in that, described the 5th contact comprises the 5th fixed part, brace and bent sheet, described brace comprises the first end and the second end that are oppositely arranged, the entrance setting of the contiguous described earphone jack of described first end, the bottom of the contiguous described earphone jack of described the second end arranges, described the 5th fixed part is connected in described brace the second end, described the 5th fixed part and brace are fixed on described pedestal, described bent sheet is connected in the first end of described brace, and extend the bottom towards described earphone jack, described kink is connected in the end that described bent sheet is extended, described kink is U-bend folded structure, described kink is outstanding along the direction away from described brace, described butting section is connected in described kink end.
4. earphone socket as claimed in claim 3, is characterized in that, described brace the second end also connects a limited post, and described limited post is positioned at described kink depression, limits the stroke of described kink.
5. the earphone socket as described in claim 3 or 4, it is characterized in that, described the 6th contact comprises the 6th fixed part and the 6th connecting portion, described the 6th fixed part and the 6th connecting portion are fixed in described pedestal, described the 6th connecting portion is resisted against the butting section of described the 5th contact, described the 6th connecting portion is also offered breach, and the bending part of described the 5th contact is in described breach.
6. earphone socket as claimed in claim 1, is characterized in that, described earphone socket also comprises fiber chip, and described fiber chip is positioned at the bottom of described earphone jack.
7. earphone socket as claimed in claim 1, is characterized in that, described the first contact is for receiving the ground signalling of headset plug, and described the second wafer is for receiving the microphone signal of headset plug.
8. earphone socket as claimed in claim 1, it is characterized in that, described the first contact is for receiving the microphone signal of headset plug, described the second wafer is for receiving the ground connection of headset plug, described earphone socket is also electrically connected a diverter switch, and described diverter switch is used for switching described microphone signal and ground signalling.
9. earphone socket as claimed in claim 1, it is characterized in that, described diverter switch comprises to be controlled pin, grounding pin, microphone pin and connects pin, described grounding pin ground connection, described microphone pin connects described microphone signal, described connection pin is electrically connected with described the first contact, and described control pin reception control signal is electrically connected with one of them in described grounding pin or microphone pin to control described connection pin.
10. earphone socket as claimed in claim 1, is characterized in that, described the first contact, the second wafer, the third wafer, the 4th contact, the 5th contact and the 6th contact are resilient sheet-like structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210586342.7A CN103904488B (en) | 2012-12-28 | 2012-12-28 | Earphone socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210586342.7A CN103904488B (en) | 2012-12-28 | 2012-12-28 | Earphone socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103904488A true CN103904488A (en) | 2014-07-02 |
| CN103904488B CN103904488B (en) | 2016-03-30 |
Family
ID=50995698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210586342.7A Active CN103904488B (en) | 2012-12-28 | 2012-12-28 | Earphone socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103904488B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485557A (en) * | 2014-12-19 | 2015-04-01 | 深圳市中兴移动通信有限公司 | Earphone socket and terminal |
| WO2016165297A1 (en) * | 2015-04-15 | 2016-10-20 | 华为技术有限公司 | Earphone jack and method for detecting whether earphone is inserted in place |
| CN107768876A (en) * | 2016-08-18 | 2018-03-06 | 深圳君泽电子有限公司 | Earphone socket and electronic device |
| WO2018068535A1 (en) * | 2016-10-13 | 2018-04-19 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Mobile terminal, earphone socket and method for manufacturing earphone socket |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2296391B (en) * | 1994-12-21 | 1999-06-09 | Hewlett Packard Co | Socket for contacting an electronic circuit during testing |
| EP1124285A2 (en) * | 2000-02-11 | 2001-08-16 | Precision Controls Bt | Appliance plug socket |
| CN102290657A (en) * | 2011-06-08 | 2011-12-21 | 昆山德力康电子科技有限公司 | Board-to-board connector with blanking socket terminals |
| CN202363620U (en) * | 2011-10-28 | 2012-08-01 | 富港电子(天津)有限公司 | Audio socket connector |
-
2012
- 2012-12-28 CN CN201210586342.7A patent/CN103904488B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2296391B (en) * | 1994-12-21 | 1999-06-09 | Hewlett Packard Co | Socket for contacting an electronic circuit during testing |
| EP1124285A2 (en) * | 2000-02-11 | 2001-08-16 | Precision Controls Bt | Appliance plug socket |
| CN102290657A (en) * | 2011-06-08 | 2011-12-21 | 昆山德力康电子科技有限公司 | Board-to-board connector with blanking socket terminals |
| CN202363620U (en) * | 2011-10-28 | 2012-08-01 | 富港电子(天津)有限公司 | Audio socket connector |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485557A (en) * | 2014-12-19 | 2015-04-01 | 深圳市中兴移动通信有限公司 | Earphone socket and terminal |
| CN104485557B (en) * | 2014-12-19 | 2016-06-29 | 努比亚技术有限公司 | Earphone socket and terminal |
| WO2016165297A1 (en) * | 2015-04-15 | 2016-10-20 | 华为技术有限公司 | Earphone jack and method for detecting whether earphone is inserted in place |
| US9820030B2 (en) | 2015-04-15 | 2017-11-14 | Huawei Technologies Co., Ltd | Headset jack and method for detecting whether headset is inserted in position |
| CN107768876A (en) * | 2016-08-18 | 2018-03-06 | 深圳君泽电子有限公司 | Earphone socket and electronic device |
| CN107768876B (en) * | 2016-08-18 | 2024-07-12 | 深圳君泽电子有限公司 | Earphone socket and electronic device |
| WO2018068535A1 (en) * | 2016-10-13 | 2018-04-19 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Mobile terminal, earphone socket and method for manufacturing earphone socket |
| US10158202B2 (en) | 2016-10-13 | 2018-12-18 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Mobile terminal, earphone socket and method for manufacturing earphone socket |
| US10439340B2 (en) | 2016-10-13 | 2019-10-08 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Earphone socket with housing and support bracket |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103904488B (en) | 2016-03-30 |
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Address after: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee after: Huawei terminal (Shenzhen) Co.,Ltd. Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee before: HUAWEI DEVICE Co.,Ltd. |
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