CN103904391B - Multilayer hybrid guided mode hexagon substrate integral wave guide filter - Google Patents
Multilayer hybrid guided mode hexagon substrate integral wave guide filter Download PDFInfo
- Publication number
- CN103904391B CN103904391B CN201410136134.6A CN201410136134A CN103904391B CN 103904391 B CN103904391 B CN 103904391B CN 201410136134 A CN201410136134 A CN 201410136134A CN 103904391 B CN103904391 B CN 103904391B
- Authority
- CN
- China
- Prior art keywords
- metal layer
- hexagonal
- resonant cavity
- filter
- dielectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 55
- 229910052751 metal Inorganic materials 0.000 claims abstract description 55
- 230000008878 coupling Effects 0.000 claims abstract description 50
- 238000010168 coupling process Methods 0.000 claims abstract description 50
- 238000005859 coupling reaction Methods 0.000 claims abstract description 50
- 230000000149 penetrating effect Effects 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000008054 signal transmission Effects 0.000 abstract description 3
- 238000007598 dipping method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000005684 electric field Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
本发明公开了一种带外选择性较高且体积小、损耗低的多层混合模六边形基片集成波导滤波器。该滤波器的共面波导输入端与共面波导输出端之间存在夹角,并通过设置在第一金属层上的六边形耦合槽组合结构的加载效应,既可以有效激励腔体中谐振的二次模,以及左倾和右倾两个非谐振高次模,又可以激发滤波器源和负载之间的电磁耦合,有效增加信号传输路径,从而在原有一个传输零点的基础上额外获得两个传输零点,通过设置在第二金属层上的两个对称分布的V形耦合槽可以实现第一谐振腔与第二谐振腔之间的耦合,再产生第四个传输零点,进一步展宽了阻带宽度并提高阻带衰减量,同时该滤波器损耗较低、体积较小。适合在微波毫米波技术领域推广应用。
The invention discloses a multilayer mixed-mode hexagonal substrate integrated waveguide filter with high out-of-band selectivity, small volume and low loss. There is an included angle between the coplanar waveguide input end and the coplanar waveguide output end of the filter, and through the loading effect of the hexagonal coupling slot combination structure arranged on the first metal layer, it can effectively excite the resonance in the cavity The secondary mode, as well as the left-leaning and right-leaning non-resonant high-order modes, can also excite the electromagnetic coupling between the filter source and the load, effectively increasing the signal transmission path, thereby obtaining two additional transmissions on the basis of the original transmission zero. Zero point, the coupling between the first resonant cavity and the second resonant cavity can be realized through two symmetrically distributed V-shaped coupling grooves arranged on the second metal layer, and the fourth transmission zero point is generated to further broaden the stopband width And increase the attenuation of the stop band, and at the same time, the filter has low loss and small volume. It is suitable for promotion and application in the field of microwave and millimeter wave technology.
Description
技术领域technical field
本发明涉及微波毫米波技术领域,具体涉及一种多层混合模六边形基片集成波导滤波器。The invention relates to the field of microwave and millimeter wave technology, in particular to a multilayer mixed-mode hexagonal substrate integrated waveguide filter.
背景技术Background technique
滤波器是通信系统中最常用的元器件之一,其性能的优劣直接影响到电路系统的质量。传统的滤波器一般分为金属波导滤波器和平面微带或带线结构滤波器。传统的金属波导滤波器具有损耗低、Q值高、选择性好等优点,但存在体积大、加工复杂以及与平面电路难以集成的缺点。微带或带线滤波器虽易于与平面电路集成,但其损耗大、Q值低,特别是在高频频段,存在较大辐射,从而影响电路稳定性。Filter is one of the most commonly used components in communication systems, and its performance directly affects the quality of the circuit system. Traditional filters are generally divided into metal waveguide filters and planar microstrip or stripline structure filters. Traditional metal waveguide filters have the advantages of low loss, high Q value, and good selectivity, but have the disadvantages of large volume, complex processing, and difficulty in integrating with planar circuits. Although microstrip or stripline filters are easy to integrate with planar circuits, they have large losses and low Q values, especially in high-frequency bands, and there is large radiation, which affects circuit stability.
基于基片集成波导技术的滤波器在保留了金属波导滤波器Q值高、选择性好的特点的同时,还兼具了平面微带及带线滤波器的易于集成、成本低、加工方便的优势,在近年来受到了广泛的关注。随着频谱资源的日益匮乏,对滤波器的传输零点及选择性要求更高,而在传统的基片集成波导滤波器的设计中,N阶谐振腔获得的传输零点一般只能获得N-2个,如需更多的传输零点,只能通过增加谐振腔个数的方式来实现,但基片集成波导谐振腔单元所占的面积依然相对较大,如果谐振腔个数增多,滤波器在电路中将会占用较多的面积,非常不利于满足现代通信系统对滤波器的体积、选择性和集成度方面提出的苛刻要求。The filter based on the substrate integrated waveguide technology not only retains the characteristics of high Q value and good selectivity of the metal waveguide filter, but also has the advantages of easy integration, low cost and convenient processing of planar microstrip and stripline filters. advantage has received extensive attention in recent years. With the increasing scarcity of spectrum resources, the requirements for the transmission zero and selectivity of the filter are higher, and in the design of the traditional substrate integrated waveguide filter, the transmission zero obtained by the N-order resonator can only obtain N- 2. If more transmission zeros are needed, it can only be achieved by increasing the number of resonant cavities, but the area occupied by the substrate integrated waveguide resonant cavity unit is still relatively large. If the number of resonant cavities increases, the filter It will take up a lot of area in the circuit, which is very unfavorable to meet the stringent requirements of the modern communication system on the volume, selectivity and integration of the filter.
发明内容Contents of the invention
本发明所要解决的技术问题是提供一种带外选择性较高且体积小、损耗低的多层混合模六边形基片集成波导滤波器。The technical problem to be solved by the invention is to provide a multilayer mixed-mode hexagonal substrate integrated waveguide filter with high out-of-band selectivity, small volume and low loss.
本发明解决上述技术问题所采用的技术方案是:该多层混合模六边形基片集成波导滤波器,包括从上到下依次层叠设置的第一金属层、第一介质基板、第二金属层、第二介质基板、第三金属层,所述第一金属层上设置有共面波导输入端、共面波导输出端,所述共面波导输入端与共面波导输出端之间存在夹角,所述第一介质基板上设置有贯穿第一介质基板的上金属化通孔阵列,所述上金属化通孔阵列与第一金属层、第二金属层共同围成六边形的第一谐振腔,所述第二介质基板上设置有贯穿第二介质基板的下金属化通孔阵列,所述下金属化通孔阵列与第二金属层、第三金属层共同围成六边形的第二谐振腔,所述第二谐振腔位于第一谐振腔的正下方,所述第一金属层上设置有六边形耦合槽组合结构,所述六边形耦合槽组合结构位于第一谐振腔的内,所述六边形耦合槽组合结构包括一个依次贯穿第一金属层、第一介质基板的金属化耦合通孔、设置在第一金属层上的一个六边形耦合槽和两个弯折形槽,所述金属化耦合通孔位于六边形耦合槽的围成的空间内,所述六边形耦合槽位于两个弯折形槽围成的空间内;所述第二金属层上设置有两个对称分布的V形耦合槽,所述两个V形耦合槽位于第二谐振腔内并且围绕第二谐振腔的中心对称设置。The technical solution adopted by the present invention to solve the above-mentioned technical problems is: the multilayer mixed-mode hexagonal substrate integrated waveguide filter includes a first metal layer, a first dielectric substrate, a second metal layer, a second dielectric substrate, and a third metal layer, the first metal layer is provided with a coplanar waveguide input end and a coplanar waveguide output end, and there is an angle between the coplanar waveguide input end and the coplanar waveguide output end , the first dielectric substrate is provided with an upper metallized through-hole array penetrating through the first dielectric substrate, and the upper metallized through-hole array together with the first metal layer and the second metal layer forms a hexagonal first A resonant cavity, the second dielectric substrate is provided with an array of lower metallized through holes penetrating through the second dielectric substrate, and the array of lower metallized through holes together with the second metal layer and the third metal layer forms a hexagonal The second resonant cavity, the second resonant cavity is located directly below the first resonant cavity, the first metal layer is provided with a hexagonal coupling groove combination structure, and the hexagonal coupling groove combination structure is located in the first resonant cavity In the cavity, the combined structure of the hexagonal coupling groove includes a metallized coupling through hole that runs through the first metal layer and the first dielectric substrate in sequence, a hexagonal coupling groove on the first metal layer, and two A bent groove, the metallized coupling through hole is located in the space surrounded by the hexagonal coupling groove, and the hexagonal coupling groove is located in the space surrounded by two bent grooves; the second metal Two symmetrically distributed V-shaped coupling grooves are arranged on the layer, and the two V-shaped coupling grooves are located in the second resonant cavity and arranged symmetrically around the center of the second resonant cavity.
进一步的是,所述共面波导输入端与共面波导输出端之间的夹角为115~125°。Further, the angle between the input end of the coplanar waveguide and the output end of the coplanar waveguide is 115-125°.
进一步的是,所述金第一金属层、第二金属层、第三金属层采用金或银制作而成。Further, the gold first metal layer, the second metal layer and the third metal layer are made of gold or silver.
进一步的是,所述第一介质基板、第二介质基板采用介电常数在1-20范围内的微波介质陶瓷制作而成。Further, the first dielectric substrate and the second dielectric substrate are made of microwave dielectric ceramics with a dielectric constant in the range of 1-20.
本发明的有益效果:本发明所述多层混合模六边形基片集成波导滤波器的共面波导输入端与共面波导输出端之间存在夹角,并通过设置在第一金属层上的六边形耦合槽组合结构的加载效应,既可以有效激励谐振腔腔体中谐振的二次模,以及左倾和右倾两个非谐振高次模,又可以激发滤波器源和负载之间的电磁耦合,有效增加信号传输路径,从而在原有一个传输零点的基础上额外获得两个传输零点,由于第二谐振腔位于第一谐振腔的正下方,通过设置在第二金属层上的两个对称分布的V形耦合槽可以实现第一谐振腔与第二谐振腔之间的耦合,再产生第四个传输零点,进一步展宽了阻带宽度并提高阻带衰减量,而且本发明所述的谐振腔垂直分布的布局特点,无需占用更多的电路面积,使得多层混合模六边形基片集成波导滤波器的体积较小,同时也可以根据需求垂直级联更多的谐振腔,另外,只使用了两个谐振腔就能实现四个极点和传输零点,而传统的交叉耦合腔体滤波器实现相似的性能需要六个腔体,因此本发明所述的多层混合模六边形基片集成波导滤波器损耗较低,再者,通过控制共面波导输入端、共面波导输出端和六边形耦合槽结构的位置和角度,可以灵活调整四个零点的位置,满足实际应用的需求。Beneficial effects of the present invention: there is an angle between the coplanar waveguide input end and the coplanar waveguide output end of the multilayer mixed-mode hexagonal substrate integrated waveguide filter of the present invention, and through the The loading effect of the combined structure of the hexagonal coupling groove can not only effectively excite the resonant secondary mode in the cavity of the resonant cavity, but also the two non-resonant high-order modes, left-dipping and right-dipping, and can also excite the electromagnetic wave between the filter source and the load. Coupling, which effectively increases the signal transmission path, thereby obtaining two additional transmission zero points on the basis of the original one transmission zero point. Since the second resonant cavity is located directly below the first resonant cavity, two symmetrical The distributed V-shaped coupling grooves can realize the coupling between the first resonant cavity and the second resonant cavity, and generate the fourth transmission zero point, which further widens the stop band width and improves the stop band attenuation, and the resonance described in the present invention The layout characteristics of the vertical cavity distribution do not need to occupy more circuit area, so that the volume of the multilayer mixed-mode hexagonal substrate integrated waveguide filter is smaller, and more resonant cavities can be vertically cascaded according to requirements. In addition, Only two resonant cavities can be used to achieve four poles and transmission zeros, while the traditional cross-coupled cavity filter requires six cavities to achieve similar performance, so the multilayer mixed-mode hexagonal base of the present invention The chip integrated waveguide filter has low loss. Furthermore, by controlling the position and angle of the coplanar waveguide input end, the coplanar waveguide output end, and the hexagonal coupling slot structure, the positions of the four zero points can be flexibly adjusted to meet the requirements of practical applications. need.
附图说明Description of drawings
图1是本发明多层混合模六边形基片集成波导滤波器的三维结构示意图;Fig. 1 is the three-dimensional structure schematic diagram of multilayer mixed-mode hexagonal substrate integrated waveguide filter of the present invention;
图2本发明多层混合模六边形基片集成波导滤波器的耦合拓扑图,其中R1和R2代表第一谐振腔的两个谐振二次模,R3和R4代表第二谐振腔的两个谐振二次模,R5和R6代表第一谐振腔中的左倾和右倾两个非谐振高次模;Fig. 2 is the coupling topological diagram of the multilayer mixed-mode hexagonal substrate integrated waveguide filter of the present invention, wherein R1 and R2 represent the two resonant secondary modes of the first resonant cavity, R3 and R4 represent the two resonant secondary modes of the second resonant cavity Resonant secondary mode, R5 and R6 represent two non-resonant high-order modes, left-leaning and right-leaning in the first resonant cavity;
图3本发明多层混合模六边形基片集成波导滤波器的左倾非谐振高次模式的电场分布图;Fig. 3 is the electric field distribution diagram of the left-leaning non-resonant high-order mode of the multilayer mixed-mode hexagonal substrate integrated waveguide filter of the present invention;
图4本发明多层混合模六边形基片集成波导滤波器的右倾非谐振高次模式的电场分布图;Fig. 4 is the electric field distribution diagram of the right-leaning non-resonant high-order mode of the multilayer mixed-mode hexagonal substrate integrated waveguide filter of the present invention;
图5本发明多层混合模六边形基片集成波导滤波器与传统的双模基片集成波导滤波器的传输特性对比图;Figure 5 is a comparison diagram of transmission characteristics between the multilayer mixed-mode hexagonal substrate integrated waveguide filter of the present invention and the traditional dual-mode substrate integrated waveguide filter;
图中标记说明:第一金属层1、第一介质基板2、第二金属层3、第二介质基板4、第三金属层5、上金属化通孔阵列61、下金属化通孔阵列62、共面波导输入端7、共面波导输出端8、六边形耦合槽组合结构9、金属化耦合通孔91、六边形耦合槽92、弯折形槽93、V形耦合槽10;第一谐振腔11、第二谐振腔12。Explanation of symbols in the figure: first metal layer 1, first dielectric substrate 2, second metal layer 3, second dielectric substrate 4, third metal layer 5, upper metallized through-hole array 61, lower metallized through-hole array 62 , coplanar waveguide input end 7, coplanar waveguide output end 8, hexagonal coupling groove combination structure 9, metallized coupling through hole 91, hexagonal coupling groove 92, bent groove 93, V-shaped coupling groove 10; The first resonant cavity 11 and the second resonant cavity 12 .
具体实施方式detailed description
下面结合附图对本发明的具体实施方式作进一步的说明。The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.
如图1所示,该多层混合模六边形基片集成波导滤波器,包括从上到下依次层叠设置的第一金属层1、第一介质基板2、第二金属层3、第二介质基板4、第三金属层5,所述第一金属层1上设置有共面波导输入端7、共面波导输出端8,所述共面波导输入端7与共面波导输出端8之间存在夹角,所述第一介质基板2上设置有贯穿第一介质基板2的上金属化通孔阵列61,所述上金属化通孔阵列61与第一金属层1、第二金属层3共同围成六边形的第一谐振腔11,所述第二介质基板4上设置有贯穿第二介质基板4的下金属化通孔阵列62,所述下金属化通孔阵列62与第二金属层3、第三金属层5共同围成六边形的第二谐振腔12,所述第二谐振腔12位于第一谐振腔11的正下方,所述第一金属层1上设置有六边形耦合槽组合结构9,所述六边形耦合槽组合结构9位于第一谐振腔11的内,所述六边形耦合槽组合结构9包括一个依次贯穿第一金属层1、第一介质基板2的金属化耦合通孔91、设置在第一金属层1上的一个六边形耦合槽92和两个弯折形槽93,所述金属化耦合通孔91位于六边形耦合槽92的围成的空间内,所述六边形耦合槽92位于两个弯折形槽93围成的空间内;所述第二金属层3上设置有两个对称分布的V形耦合槽10,所述两个V形耦合槽10位于第二谐振腔12内并且围绕第二谐振腔12的中心对称设置。所述两个弯折形槽93围成一个不连续的六边形槽,所述两个弯折形槽93的端头不连通,所述两个V形耦合槽10的V形开口相对设置。本发明所述多层混合模六边形基片集成波导滤波器的共面波导输入端7与共面波导输出端8之间存在夹角,并通过设置在第一金属层1上的六边形耦合槽组合结构9的加载效应,既可以有效激励谐振腔腔体中谐振的二次模,以及左倾和右倾两个非谐振高次模,又可以激发滤波器源和负载之间的电磁耦合,有效增加多条信号传输路径,如图3、4所示,从而在原有一个传输零点的基础上额外获得两个传输零点,由于第二谐振腔12位于第一谐振腔11的正下方,通过设置在第二金属层3上的两个对称分布的V形耦合槽10可以实现第一谐振腔11与第二谐振腔12之间的耦合,再产生第四个传输零点,进一步展宽了阻带宽度并提高阻带衰减量,而且本发明所述的谐振腔垂直分布的布局特点,无需占用更多的电路面积,使得多层混合模六边形基片集成波导滤波器的体积较小,同时也可以根据需求垂直级联更多的谐振腔,另外,只使用了两个谐振腔就能实现四个极点和传输零点,而传统的交叉耦合腔体滤波器实现相似的性能需要六个腔体,因此本发明所述的多层混合模六边形基片集成波导滤波器损耗较低,再者,通过控制共面波导输入端7、共面波导输出端8和六边形耦合槽92结构的位置和角度,可以灵活调整四个零点的位置,满足实际应用的需求。As shown in Figure 1, the multilayer mixed-mode hexagonal substrate integrated waveguide filter includes a first metal layer 1, a first dielectric substrate 2, a second metal layer 3, a second A dielectric substrate 4 and a third metal layer 5, the first metal layer 1 is provided with a coplanar waveguide input end 7 and a coplanar waveguide output end 8, between the coplanar waveguide input end 7 and the coplanar waveguide output end 8 There is an included angle, the first dielectric substrate 2 is provided with an upper metallized through hole array 61 penetrating through the first dielectric substrate 2, and the upper metallized through hole array 61 is connected to the first metal layer 1 and the second metal layer 3 A hexagonal first resonant cavity 11 is formed together. The second dielectric substrate 4 is provided with a lower metallized through-hole array 62 penetrating through the second dielectric substrate 4. The lower metallized through-hole array 62 and the second The metal layer 3 and the third metal layer 5 together form a hexagonal second resonant cavity 12, the second resonant cavity 12 is located directly below the first resonant cavity 11, and the first metal layer 1 is provided with six The hexagonal coupling groove combination structure 9, the hexagonal coupling groove combination structure 9 is located in the first resonant cavity 11, the hexagonal coupling groove combination structure 9 includes a first metal layer 1, a first dielectric The metallized coupling through hole 91 of the substrate 2, one hexagonal coupling groove 92 and two bent grooves 93 arranged on the first metal layer 1, the metallized coupling through hole 91 is located in the hexagonal coupling groove 92 In the enclosed space, the hexagonal coupling groove 92 is located in the space enclosed by two bent grooves 93; the second metal layer 3 is provided with two symmetrically distributed V-shaped coupling grooves 10, The two V-shaped coupling grooves 10 are located in the second resonant cavity 12 and arranged symmetrically around the center of the second resonant cavity 12 . The two bent grooves 93 form a discontinuous hexagonal groove, the ends of the two bent grooves 93 are not connected, and the V-shaped openings of the two V-shaped coupling grooves 10 are oppositely arranged. . There is an angle between the coplanar waveguide input end 7 and the coplanar waveguide output end 8 of the multi-layer mixed-mode hexagonal substrate integrated waveguide filter of the present invention, and through the hexagonal waveguide arranged on the first metal layer 1 The loading effect of the coupling slot combination structure 9 can not only effectively excite the resonant secondary mode in the resonant cavity cavity, but also the two non-resonant high-order modes, left-dipping and right-dipping, and can also stimulate the electromagnetic coupling between the filter source and the load, Effectively increase multiple signal transmission paths, as shown in Figures 3 and 4, so as to obtain two additional transmission zero points on the basis of the original one transmission zero point. Since the second resonant cavity 12 is located directly below the first resonant cavity 11, by setting Two symmetrically distributed V-shaped coupling grooves 10 on the second metal layer 3 can realize the coupling between the first resonant cavity 11 and the second resonant cavity 12, and generate a fourth transmission zero point, further widening the stopband width And improve the attenuation of the stop band, and the layout characteristics of the vertical distribution of the resonant cavity described in the present invention does not need to occupy more circuit area, so that the volume of the multilayer mixed-mode hexagonal substrate integrated waveguide filter is smaller, and it is also More resonant cavities can be vertically cascaded according to requirements. In addition, only two resonant cavities can be used to achieve four poles and transmission zeros, while traditional cross-coupled cavity filters require six cavities to achieve similar performance. Therefore, the loss of the multilayer mixed-mode hexagonal substrate integrated waveguide filter of the present invention is relatively low, moreover, by controlling the coplanar waveguide input end 7, the coplanar waveguide output end 8 and the hexagonal coupling slot 92 structure The positions and angles of the four zero points can be flexibly adjusted to meet the needs of practical applications.
图3、图4给出了该多层混合模六边形基片集成波导滤波器的左倾和右倾两个非谐振高次模式的电场分布。为了更加有效的激励谐振腔左倾和右倾两个非谐振高次模,所述共面波导输入端7与共面波导输出端8之间的夹角优选为115~125°。Figure 3 and Figure 4 show the electric field distribution of the left-dipping and right-dipping non-resonant high-order modes of the multilayer mixed-mode hexagonal substrate integrated waveguide filter. In order to more effectively excite the left-dipping and right-dipping non-resonant high-order modes of the resonator, the included angle between the coplanar waveguide input end 7 and the coplanar waveguide output end 8 is preferably 115-125°.
为了便于制作加工,所述金第一金属层1、第二金属层3、第三金属层5采用金或银制作而成;所述第一介质基板2、第二介质基板4采用介电常数在1-20范围内的微波介质陶瓷制作而成。In order to facilitate production and processing, the gold first metal layer 1, the second metal layer 3, and the third metal layer 5 are made of gold or silver; the first dielectric substrate 2 and the second dielectric substrate 4 are made of dielectric constant Made of microwave dielectric ceramics in the range of 1-20.
图5是本发明多层混合模六边形基片集成波导滤波器与传统的双模基片集成波导滤波器的传输特性对比图,由图中可以看出,本发明多层混合模六边形基片集成波导滤波器可以产生四个传输零点,而传统的双模基片集成波导滤波器只产生一个传输零点,即在没有增加滤波器传输损耗的基础上实现更好的选择特性和更宽的阻带。Fig. 5 is a comparison diagram of transmission characteristics between the multilayer mixed-mode hexagonal substrate integrated waveguide filter of the present invention and the traditional dual-mode substrate integrated waveguide filter, as can be seen from the figure, the multilayer mixed-mode hexagonal substrate of the present invention The shape SIWG filter can produce four transmission zeros, while the traditional dual-mode SIWG filter only produces one transmission zero, that is, to achieve better selectivity and more efficiency without increasing the filter transmission loss. wide stopband.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410136134.6A CN103904391B (en) | 2014-04-08 | 2014-04-08 | Multilayer hybrid guided mode hexagon substrate integral wave guide filter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410136134.6A CN103904391B (en) | 2014-04-08 | 2014-04-08 | Multilayer hybrid guided mode hexagon substrate integral wave guide filter |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103904391A CN103904391A (en) | 2014-07-02 |
CN103904391B true CN103904391B (en) | 2016-03-02 |
Family
ID=50995610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410136134.6A Expired - Fee Related CN103904391B (en) | 2014-04-08 | 2014-04-08 | Multilayer hybrid guided mode hexagon substrate integral wave guide filter |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103904391B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104167578B (en) * | 2014-08-06 | 2016-04-13 | 电子科技大学 | Substrate integration wave-guide band pass filter |
CN109149034A (en) * | 2017-06-15 | 2019-01-04 | 乐山顺辰科技有限公司 | A kind of microwave filter |
CN108682924B (en) * | 2018-05-29 | 2019-09-20 | 广东曼克维通信科技有限公司 | Substrate integral wave guide filter |
CN109378561B (en) * | 2018-10-19 | 2020-06-05 | 广东曼克维通信科技有限公司 | Double-passband filter |
CN109860966B (en) * | 2019-04-15 | 2024-04-05 | 江苏贝孚德通讯科技股份有限公司 | Dielectric filter and 5G communication device |
CN110364793A (en) * | 2019-06-13 | 2019-10-22 | 中国人民解放军国防科技大学 | Hybrid SIW and SLSP structure broadband cavity filter |
CN113611993B (en) * | 2021-07-21 | 2022-03-29 | 杭州电子科技大学 | A Folded Substrate Integrated Waveguide Dual Mode Filter with High Selectivity and Wide Stop Band |
CN115395191B (en) * | 2022-09-08 | 2024-04-16 | 南京邮电大学 | A wide stopband substrate integrated waveguide filter based on hybrid coupling |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101777678A (en) * | 2010-03-08 | 2010-07-14 | 华东交通大学 | Double-mode double-band band-pass filter based on hexagonal ring resonator |
CN103413998A (en) * | 2013-08-09 | 2013-11-27 | 电子科技大学 | Single-cavity double-die hexagonal substrate integrated waveguide filter |
CN103427138A (en) * | 2013-08-15 | 2013-12-04 | 电子科技大学 | Multilayer hexagonal substrate integrated waveguide filter |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5050986B2 (en) * | 2008-04-30 | 2012-10-17 | ソニー株式会社 | Communications system |
-
2014
- 2014-04-08 CN CN201410136134.6A patent/CN103904391B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101777678A (en) * | 2010-03-08 | 2010-07-14 | 华东交通大学 | Double-mode double-band band-pass filter based on hexagonal ring resonator |
CN103413998A (en) * | 2013-08-09 | 2013-11-27 | 电子科技大学 | Single-cavity double-die hexagonal substrate integrated waveguide filter |
CN103427138A (en) * | 2013-08-15 | 2013-12-04 | 电子科技大学 | Multilayer hexagonal substrate integrated waveguide filter |
Also Published As
Publication number | Publication date |
---|---|
CN103904391A (en) | 2014-07-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103904391B (en) | Multilayer hybrid guided mode hexagon substrate integral wave guide filter | |
CN102800906B (en) | Multilayer ceramic substrate integrated waveguide filter | |
CN103390784B (en) | Miniaturized substrate integration waveguide duplexer | |
CN106602190A (en) | Multilayer substrate integration waveguide filter with high out-of-band rejection | |
CN106785290B (en) | Filtering power divider based on quarter-mode substrate integrated waveguide circular cavity | |
CN103427138A (en) | Multilayer hexagonal substrate integrated waveguide filter | |
CN102509837B (en) | Substrate Integrated Waveguide Miniaturized Bandpass Hybrid Ring | |
CN103904392B (en) | Substrate integral wave guide filter | |
CN108539338B (en) | A kind of a quarter mould substrate integral wave guide filter based on notching construction | |
CN103236571B (en) | A kind of line of rabbet joint double band bandpass filter | |
CN109462000B (en) | Multi-layer substrate integrated waveguide third-order filtering power divider | |
CN110277612B (en) | A dielectric waveguide filter with symmetrical cross-coupling zeros | |
CN103326093A (en) | Novel cross coupling substrate integrated waveguide band-pass filter | |
CN104218279B (en) | Novel dual-mode band-pass filter based on LTCC (low temperature co-fired ceramics) | |
CN203085713U (en) | Substrate integrated waveguide dual-mode wave filter | |
CN103647123B (en) | Half mode substrate integration waveguide horizontal symmetrical filter | |
CN105990630A (en) | High-selectivity Balun band pass filter based on substrate integrated waveguide | |
CN202275910U (en) | Substrate integrated waveguide miniaturized bandpass hybrid ring | |
CN108493534A (en) | A kind of four mould chip integrated waveguide broad-band filters | |
CN102354781A (en) | Planar integrated waveguide bandpass filter with quasi-elliptic function type | |
Fan et al. | An effective method to suppress high-order modes of SIW filters with compact size | |
CN103413998A (en) | Single-cavity double-die hexagonal substrate integrated waveguide filter | |
CN106252804A (en) | Multilamellar millimeter wave filter | |
CN203339280U (en) | A Miniaturized Substrate Integrated Waveguide Duplexer | |
CN107256998A (en) | Based on half module substrate integrated wave guide Meta Materials line filter |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160302 Termination date: 20190408 |