CN103901240B - Probe card identifying chip installation method - Google Patents
Probe card identifying chip installation method Download PDFInfo
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- CN103901240B CN103901240B CN201410111293.0A CN201410111293A CN103901240B CN 103901240 B CN103901240 B CN 103901240B CN 201410111293 A CN201410111293 A CN 201410111293A CN 103901240 B CN103901240 B CN 103901240B
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- Prior art keywords
- identification chip
- probe card
- isolation material
- annular isolation
- installation method
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Abstract
The invention provides a probe card identifying chip installation method. The method comprises the first step of manufacturing an annular insulation material handle corresponding to a central area of a probe card substrate; the second step of fixing an indentifying chip fixing base to a specific position of the annular insulation material handle; the third step of arranging the identifying chip in the identifying chip fixing base; the fourth step of fixing the annular insulation material handle to the probe card substrate through screws at a plurality of positions of the annular insulation material handle.
Description
Technical field
The present invention relates to semi-conductive electrical testing field, it is more particularly related to a kind of probe card identification chip
Installation method.
Background technology
In fabrication test probe card (for example, HP407X probe cards) used, (such as RFID cores of identification chip 20
Piece：Radio Frequency IDentification technologies, also known as electronic tag, radio frequency identification) generally by identification
Chip fixed base 10 and be fitted in the top of probe card substrate 100, as depicted in figs. 1 and 2.
But, in the prior art, wrap the drawbacks of identification chip 20 is fitted in the technical scheme on the surface of probe card substrate 100
Include：
1. as shown in Figure 3 and Figure 4, the radio frequency testing first 40 of some test machine types 200 (for example, part HP407X types)
In the fetching process of probe card, chip has the problem of (as shown in Figure 4) of being touched down.As fruit chip drops in board
Portion, would detract from hindering the risk of board.
2. when probe card does maintaining, chip be possible to because high-temperature baking lose with the adhesive force of substrate and take off
Fall.
3. (chip will occur the inapplicable part Agilent HP407X types of the installation site of current chip with board measuring head
Contact damages chip/measuring head).
The content of the invention
The technical problems to be solved by the invention are directed to and there is drawbacks described above in the prior art, there is provided one kind can solve the problem that
Identification chip comes off the probe card identification chip installation method of problem.
In order to realize above-mentioned technical purpose, according to the present invention, there is provided a kind of probe card identification chip installation method, its bag
Include：
First step：The manufacture annular isolation material handle corresponding with the middle section of probe card substrate；
Second step：Identification chip firm banking is fixed to the ad-hoc location of the annular isolation material handle；
Third step：Identification chip is arranged in the identification chip firm banking；
Four steps：In multiple positions of the annular isolation material handle, using screw by the annular isolation material
Handle is fixed to probe card substrate.
Preferably, the material of the annular isolation material handle is lucite.
Preferably, identification chip firm banking is permanently affixed to the ad-hoc location of the annular isolation material handle.
Preferably, the multiple position of the annular isolation material handle and the ad-hoc location are the annular insulation
Evenly spaced four positions of material handle.
Preferably, the multiple position of the annular isolation material handle and the ad-hoc location are the annular insulation
Evenly spaced three positions of material handle.
Preferably, the identification chip firm banking uses transparent insulation material.
Preferably, the section of the inner space of the identification chip firm banking is square.
Brief description of the drawings
With reference to accompanying drawing, and by reference to following detailed description, it will more easily have more complete understanding to the present invention
And its adjoint advantages and features is more easily understood, wherein：
Fig. 1 schematically shows the top view of the probe card identification chip installation method according to prior art.
Fig. 2 schematically shows the sectional view of the probe card identification chip installation method according to prior art.
Fig. 3 and Fig. 4 schematically show the probe card identification chip installation method produced problem according to prior art.
Fig. 5 to Fig. 8 schematically shows probe card identification chip installation method according to the preferred embodiment of the invention.
It should be noted that accompanying drawing is used to illustrate the present invention, it is not intended to limit the present invention.Note, represent that the accompanying drawing of structure can
Can be not necessarily drawn to scale.Also, in accompanying drawing, same or similar element indicates same or similar label.
Specific embodiment
In order that present disclosure is more clear and understandable, with reference to specific embodiments and the drawings to of the invention interior
Appearance is described in detail.
Fig. 5 to Fig. 8 schematically shows probe card identification chip installation method according to the preferred embodiment of the invention.
As shown in Fig. 5 to Fig. 8, probe card identification chip installation method according to the preferred embodiment of the invention includes：
First step：The manufacture annular isolation material handle 101 (example corresponding with the middle section of probe card substrate 100
Such as, the material of the annular isolation material handle 101 is lucite), as shown in Figure 6；For example, annular isolation material handle
101 correspond to region of all Agilent HP407X types measuring heads all without contact.
Second step：Identification chip firm banking 10 is fixed to (for example, being permanently affixed to) described annular isolation material
The ad-hoc location of handle 101, as shown in Figure 6；
Third step：Identification chip 20 is arranged in the identification chip firm banking 10, as shown in Figure 7；
Four steps：In multiple positions of the annular isolation material handle 101, using screw by the annular insulation material
Matter handle 101 is fixed to probe card substrate 100, as shown in Figure 8.
For instance, it is preferred that the multiple position of the annular isolation material handle 101 and the ad-hoc location can be
Evenly spaced four positions of the annular isolation material handle 101, as shown in Figure 5 (in the case, shown in the drawings
3 points, 6 points and 9 positions are fixed using screw).Alternatively, the annular isolation material handle 101 is the multiple
Position and the ad-hoc location can be evenly spaced three positions of the annular isolation material handle 101.
Preferably, the identification chip firm banking 10 uses transparent insulation material (for example, lucite)；Preferably,
The section of the inner space of the identification chip firm banking 10 (has square-section for square in identification chip firm banking 10
In the case of, can prevent identification chip from being rolled in identification chip firm banking 10).
The present invention at least has following advantage：
1. the drawbacks of identification chip being solved and easily comes off；
2. newly-designed installation site is applicable on all Agilent HP407X types；
3. newly-increased annular hand grip can be used to pick and place probe card, convenient working person's operation, while operator can be avoided on hand
Electrostatic probe card is impacted.
For example, in actual applications, can be allowed in all Agilent by changing the installation site of identification chip
It is applicable on HP407X types.
Furthermore, it is necessary to explanation, unless stated otherwise or points out, term " first " otherwise in specification, " the
Two ", description such as " 3rd " is used only for distinguishing each component, element, step in specification etc., without being intended to indicate that each
Logical relation or ordinal relation between component, element, step etc..
Although it is understood that the present invention is disclosed as above with preferred embodiment, but above-described embodiment and being not used to
Limit the present invention.For any those of ordinary skill in the art, in the case where technical solution of the present invention ambit is not departed from,
Many possible variations and modification are all made to technical solution of the present invention using the technology contents of the disclosure above, or is revised as
With the Equivalent embodiments of change.Therefore, every content without departing from technical solution of the present invention, according to technical spirit pair of the invention
Any simple modification, equivalent variation and modification made for any of the above embodiments, still fall within the scope of technical solution of the present invention protection
It is interior.
Claims (5)
1. a kind of probe card identification chip installation method, it is characterised in that including：
First step：The manufacture annular isolation material handle corresponding with the middle section of probe card substrate；
Second step：Identification chip firm banking is fixed to the ad-hoc location of the annular isolation material handle, it is described specific
Position be the annular isolation material handle evenly spaced four positions in one or the annular isolation material handle
One in evenly spaced three positions；
Third step：Identification chip is arranged in the identification chip firm banking；
Four steps：In multiple positions of the annular isolation material handle, the multiple position is the annular isolation material
Evenly spaced four positions of handle or evenly spaced three positions of the annular isolation material handle, will using screw
The annular isolation material handle is fixed to probe card substrate.
2. probe card identification chip installation method according to claim 1, it is characterised in that the annular isolation material hand
The material of handle is lucite.
3. probe card identification chip installation method according to claim 1 and 2, it is characterised in that fix identification chip
Base is permanently affixed to the ad-hoc location of the annular isolation material handle.
4. probe card identification chip installation method according to claim 1 and 2, it is characterised in that the identification chip is consolidated
Determine base and use transparent insulation material.
5. probe card identification chip installation method according to claim 1 and 2, it is characterised in that the identification chip is consolidated
The section for determining the inner space of base is square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410111293.0A CN103901240B (en) | 2014-03-24 | 2014-03-24 | Probe card identifying chip installation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410111293.0A CN103901240B (en) | 2014-03-24 | 2014-03-24 | Probe card identifying chip installation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103901240A CN103901240A (en) | 2014-07-02 |
| CN103901240B true CN103901240B (en) | 2017-05-24 |
Family
ID=50992696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410111293.0A Active CN103901240B (en) | 2014-03-24 | 2014-03-24 | Probe card identifying chip installation method |
Country Status (1)
| Country | Link |
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| CN (1) | CN103901240B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW533310B (en) * | 1999-01-06 | 2003-05-21 | Vertest Systems Corp | Electronic test probe interface assembly and method of manufacture |
| JP2006071358A (en) * | 2004-08-31 | 2006-03-16 | Fujitsu Ltd | Probe card and probe card manufacturing method |
| CN1952667A (en) * | 2005-10-05 | 2007-04-25 | 株式会社瑞萨科技 | Probe sheet adhesive holder, probe card, semiconductor inspection apparatus, and method for manufacturing semiconductor device |
| CN101236912A (en) * | 2007-02-02 | 2008-08-06 | 京元电子股份有限公司 | ZIF connector pin test card and assembly method thereof, wafer test system and test method |
| CN201166674Y (en) * | 2007-12-06 | 2008-12-17 | 沈阳圣仁电子科技有限公司 | Buffering vertical probe card |
| JP4486248B2 (en) * | 1999-12-28 | 2010-06-23 | 株式会社日本マイクロニクス | Probe card and manufacturing method thereof |
| TWI331220B (en) * | 2007-04-13 | 2010-10-01 | Microelectonics Technology Inc | |
| CN101881787A (en) * | 2009-05-07 | 2010-11-10 | 旺矽科技股份有限公司 | Multi-chip test probe device |
| TW201100811A (en) * | 2009-06-26 | 2011-01-01 | Yamaichi Electronics Co Ltd | Probe card |
-
2014
- 2014-03-24 CN CN201410111293.0A patent/CN103901240B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW533310B (en) * | 1999-01-06 | 2003-05-21 | Vertest Systems Corp | Electronic test probe interface assembly and method of manufacture |
| JP4486248B2 (en) * | 1999-12-28 | 2010-06-23 | 株式会社日本マイクロニクス | Probe card and manufacturing method thereof |
| JP2006071358A (en) * | 2004-08-31 | 2006-03-16 | Fujitsu Ltd | Probe card and probe card manufacturing method |
| CN1952667A (en) * | 2005-10-05 | 2007-04-25 | 株式会社瑞萨科技 | Probe sheet adhesive holder, probe card, semiconductor inspection apparatus, and method for manufacturing semiconductor device |
| CN101236912A (en) * | 2007-02-02 | 2008-08-06 | 京元电子股份有限公司 | ZIF connector pin test card and assembly method thereof, wafer test system and test method |
| TWI331220B (en) * | 2007-04-13 | 2010-10-01 | Microelectonics Technology Inc | |
| CN201166674Y (en) * | 2007-12-06 | 2008-12-17 | 沈阳圣仁电子科技有限公司 | Buffering vertical probe card |
| CN101881787A (en) * | 2009-05-07 | 2010-11-10 | 旺矽科技股份有限公司 | Multi-chip test probe device |
| TW201100811A (en) * | 2009-06-26 | 2011-01-01 | Yamaichi Electronics Co Ltd | Probe card |
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| Publication number | Publication date |
|---|---|
| CN103901240A (en) | 2014-07-02 |
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