CN103900409A - Process and structure of thermosiphon heat pipe - Google Patents
Process and structure of thermosiphon heat pipe Download PDFInfo
- Publication number
- CN103900409A CN103900409A CN201210574311.XA CN201210574311A CN103900409A CN 103900409 A CN103900409 A CN 103900409A CN 201210574311 A CN201210574311 A CN 201210574311A CN 103900409 A CN103900409 A CN 103900409A
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- China
- Prior art keywords
- heat
- column jecket
- heat pipe
- processing procedure
- moulding
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000007788 liquid Substances 0.000 claims abstract description 16
- 239000007769 metal material Substances 0.000 claims abstract description 16
- 238000000465 moulding Methods 0.000 claims description 26
- 238000005538 encapsulation Methods 0.000 claims description 22
- 238000003466 welding Methods 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000010992 reflux Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 3
- 230000005855 radiation Effects 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002510 pyrogen Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a process and structure of a thermosiphon heat pipe, wherein the process comprises taking a section of metal material, exercising the metal material to integrally form a column pipe, wherein the column pipe is provided with a planar bottom surface, the inner wall of the column pipe is provided with a flow guide surface with a preset shape, the inner surface of the bottom surface of the column pipe is provided with a heat exchange surface, then the top of the column pipe is formed by shrinking the top of the column pipe, the column pipe is pumped into a similar vacuum state, a liquid medium with high-speed heat transfer is filled in the column pipe, and the shrunk pipe at the top of the column pipe is welded and packaged; therefore, the process of the thermosiphon heat pipe adopts the integral forming, the bottom part is contacted with the heat source without additional processing, and the integral forming is provided with the bottom surface (plane) to facilitate the conduction contact of the heat source.
Description
[technical field]
The present invention is relevant with heat pipe, espespecially manufacturing process adopts one-body molded (exercise moulding), after moulding, have bottom surface (plane), guide face and heat-exchange surface, bottom surface contacts and does not need additional processing to become plane with thermal source, and pay in order to thermal source lock bottom surface, guide face and heat-exchange surface, do to help the liquid medium backflow of high rate heat transport to accelerate, shorten the cycle of heat radiation, and help to accelerate heat exchange, without the welding encapsulation at two ends, reduce processing procedure and the structure of a kind of heat siphon type heat pipe of making flow process.
[background technology]
Cryo Heat Tube or normal temperature heat pipe are in the body with copper, aluminium or other metal tubulations, implantation can high rate heat transport particulate metal powder medium or liquid medium (high-temperature heat pipe as: the metal dusts such as yttrium, barium) or other hot superconduction material persons (moderate temperature heat pipe is as ammonia), in the time that its molecule receives heat, can produce the evaporation of height, after causing body condensation, reflux again, and thermal source is conducted fast in the mode of fluctuation; Because its conduction velocity is than the high several times of the rates of heat transfer of common metal rod or fin or more than picking up several times; This heat pipe is had and lead at a high speed thermal property, quick heat radiating produces the object of heat energy.
As shown in Figure 1, for the generalized section of conventional heat pipe, it is mainly a heat pipe 1, interior near vacuum state, and insert can high rate heat transport liquid medium 2, in the time that liquid medium 3 receives heat, can produce the evaporation of height, the condensation segment 3 of pyrogenicity pipe 1 refluxes again, and so circulation is continuous, by quick heat radiating; So traditional heat pipe 1 is mainly tubulose kenel, and the area of its conduction or finite volume, though thermal source conduction fast, but it is limited to dispel the heat, and traditional heat pipe 1 its processing procedure complexity, need multiprogram operation, and not convenient, traditional heat pipe 1 its processing procedure has mode as described below:
The moulding of general traditional plume heat column is to adopt two to add a cover encapsulation, and as shown in Figure 2, plume 4 needs two additionally to install capping 5 additional with encapsulation, and moulding and encapsulation process time are long, and moulding and encapsulation process are also not convenient.
Again, as shown in Figure 3, or general conventional heat pipe 6 need to the contact-making surface of thermal source on flatten flat-shapedly, contact with thermal source to obtain flat contact surface 7, just can obtain the contact-making surface that preferably dispels the heat, the other punch process of these flat contact surface 7 needs, and not convenient.
Or, general conventional heat pipe 8 needs two 9 welding encapsulation, as shown in Figure 4, in the time that near vacuum state is taken out at these heat pipe 8 two 9, and insert can high rate heat transport liquid medium, welding encapsulation is done at heat pipe 8 two 9, these two 9 welding encapsulation, more general one end is done welding encapsulation and is had more one times of time weld job, and not convenient.
Above-mentioned many disadvantages, obviously haves much room for improvement.
[summary of the invention]
Processing procedure and the structure of a kind of heat siphon type heat pipe of the present invention, its objective is: 1, processing procedure adopts one-body molded (exercise moulding), has bottom surface after moulding, and bottom surface contacts and do not need additional processing to become plane with thermal source, and plane is paid in order to thermal source lock; 2, heat siphon type heat pipe inner wall has guide face, does to help the liquid medium backflow of high rate heat transport to accelerate, and shortens the cycle of heat radiation; 3, the inner face of heat siphon type heat pipe bottom surface has heat-exchange surface, does to help to accelerate heat exchange; 4, without the heat siphon type heat pipe of two ends welding encapsulation, also install capping additional without two ends, reduce and make flow process.
A kind of processing procedure and structure of heat siphon type heat pipe, its fabrication steps is respectively:
One joint metal material, is a block, is that a metal bar cuts the metal material after a predetermined length;
Temper moulding, this metal material is taken exercise, the one-body molded column jecket that becomes, column jecket has a bottom surface, and bottom surface is plane;
Draw moulding, column jecket top one predetermined length is made draw moulding one draw;
Welding encapsulation, takes out near vacuum state in column jecket, insert the liquid medium of a high rate heat transport, and the draw at column jecket top is done to welding encapsulation;
Be provided with the guide face of a reservation shape in the inwall of this column jecket, the bottom surface inner face of column jecket is provided with heat-exchange surface;
The processing procedure of heat siphon type heat pipe adopt one-body molded go out, bottom contact and does not need additional processing with thermal source, adopts when one-body molded and has possessed bottom surface, conducts and contacts in order to thermal source.
Wherein, the guide face of this column jecket has groove in inwall, groove from inwall top to bottom around, help high rate heat transport liquid medium reflux accelerate.
Wherein, the groove of this guide face is axially to arrange.
Wherein, the heat-exchange surface of the bottom surface inner face moulding of this column jecket, be plural number protrusion particulate, help accelerate heat exchange.
Wherein, this protrusion particulate is circumference circulating type, protrudes particulate and be width to penetrate arranged distribution.
Advantage of the present invention and effect are:
One, heat siphon type heat pipe processing procedure adopts one-body molded (exercise moulding), has bottom surface after moulding, and bottom surface contact and do not need additional processing to become plane with thermal source, adopts to have possessed plane when one-body molded and lock pair in order to thermal source;
Two or, heat siphon type heat pipe one-body molded (exercise moulding), has guide face and heat-exchange surface after moulding, do not need processing and forming again;
Three, heat siphon type heat pipe, owing to there being guide face, does to help the liquid medium backflow of high rate heat transport to accelerate, and contributes to heat radiation to accelerate, and shortens the cycle of heat radiation;
Four, heat siphon type heat pipe, owing to there being heat-exchange surface, helps to accelerate heat exchange;
Five, heat siphon type heat pipe only needs the welding encapsulation of the top draw, without the welding encapsulation at two ends, reduces and makes flow process;
Six, heat siphon type heat pipe installs capping additional without two ends, reduces and makes flow process;
[accompanying drawing explanation]
Fig. 1 is the generalized section of conventional heat pipe.
Fig. 2 is the floor map of traditional plume.
Fig. 3 is that conventional heat pipe need to flatten to obtain the floor map that plane contacts with thermal source.
Fig. 4 is the floor map that conventional heat pipe needs two encapsulation.
Fig. 5 is the schematic perspective view of metal material of the present invention.
Fig. 6 is the schematic perspective view of moulding column jecket of the present invention.
Fig. 7 is the schematic perspective view of the guide face of column jecket inwall of the present invention.
Fig. 8 is the schematic perspective view that the 7th figure guide face amplifies.
Fig. 9 is the schematic perspective view of the heat-exchange surface of column jecket of the present invention bottom surface.
Figure 10 is the schematic perspective view that heat-exchange surface of the present invention is positioned at column jecket bottom surface.
Figure 11 is the schematic perspective view of draw moulding of the present invention.
Figure 12 is the schematic perspective view that the present invention welds encapsulation.
Figure 13 is the schematic perspective view that the present invention completes.
Number in the figure is described as follows:
10 metal material 100 column jeckets
110 bottom surface 120 guide faces
121 groove 130 heat-exchange surfaces
131 protrude particulate 140 draws
[specific embodiment]
First, processing procedure and the structure of a kind of heat siphon type heat pipe of the present invention, its fabrication steps is respectively:
One, get a joint metal material 10, as shown in Figure 5, metal material 10 is a block, one metal bar is cut to the metal material 10 after a predetermined length, and metal bar is cylindrical rod, and the metal material 10 after cutting is also cylindrical rod, this metal material 10 is copper product, also can be aluminum products or other heat-conductings;
Two, temper moulding, this metal material 10 is tempered to moulding, take one-body molded as main, become a column jecket 100, as shown in Figure 6, column jecket 100 has a bottom surface 110, bottom surface 110 is plane, top is hollow, when one-body molded, there is special structure in the inside of column jecket 10, the guide face 120(that is provided with a reservation shape at the inwall of this column jecket 10 as Figure 7-8), the guide face 120 of this column jecket 100 has uprightly a plurality of grooves 121 of (axially) in inwall, groove 121 from inwall top to bottom around, do to help the liquid medium backflow of high rate heat transport to accelerate, bottom surface 110 inner faces of column jecket 100 are provided with heat-exchange surface 130(as shown in Fig. 9-10), the heat-exchange surface 130 of the bottom surface 110 inner face moulding of this column jecket 100, it is the protrusion particulate 131 of plural, help to accelerate heat exchange, wherein this protrusion particulate 131 is circumference circulating type, protrude particulate 131 and be width and penetrate arranged distribution, the outside diameter of bottom surface 110 is that the diameter of 52mm is wide, it is the area that meets the board design of current height watt LED illuminating lamp,
Three, draw moulding, as shown in figure 11, column jecket 100 top one predetermined lengths are made draw moulding one draw 140, and the draw is shaped to can be in response to the size of demand, controls length and coordinates welding encapsulation;
Four, welding encapsulation, as shown in Figure 12-13, takes out near vacuum state in column jecket 100, insert the liquid medium of a high rate heat transport, and by the draw 140 at column jecket 100 tops, does welding encapsulation, makes the draw 140 at column jecket 100 tops be closed state;
Assembled by above-mentioned processing procedure and structure, processing procedure and the structure of a kind of heat siphon type heat pipe of the present invention, when make completely and the liquid medium of all filling high rate heat transport and encapsulation after, make contact thermal source object with the bottom surface 110 of column jecket 100, when its molecule of the liquid medium of high rate heat transport receives heat, can produce the evaporation of height, after causing column jecket 100 body condensations, reflux again, and thermal source is conducted fast in the mode of fluctuation, this thermal source object of quick heat radiating, because heat siphon type heat pipe has possessed bottom surface 110(plane when one-body molded), bottom surface 110 is contacted completely with thermal source object, in order to thermal source conduction contact, improve thermal source conduction efficiency.
Claims (5)
1. the processing procedure of heat siphon type heat pipe and a structure, its fabrication steps is respectively:
One joint metal material, is a block, is that a metal bar cuts the metal material after a predetermined length;
Temper moulding, this metal material is taken exercise, the one-body molded column jecket that becomes, column jecket has a bottom surface, and bottom surface is plane;
Draw moulding, column jecket top one predetermined length is made draw moulding one draw;
Welding encapsulation, takes out near vacuum state in column jecket, insert the liquid medium of a high rate heat transport, and the draw at column jecket top is done to welding encapsulation;
Be provided with the guide face of a reservation shape in the inwall of this column jecket, the bottom surface inner face of column jecket is provided with heat-exchange surface;
The processing procedure of heat siphon type heat pipe adopt one-body molded go out, bottom contact and does not need additional processing with thermal source, adopts when one-body molded and has possessed bottom surface, conducts and contacts in order to thermal source.
2. the processing procedure of heat siphon type heat pipe according to claim 1 and structure, is characterized in that: the guide face of this column jecket has groove in inwall, groove from inwall top to bottom around, help high rate heat transport liquid medium reflux accelerate.
3. the processing procedure of heat siphon type heat pipe according to claim 2 and structure, is characterized in that: the groove of this guide face is for axially arranging.
4. the processing procedure of heat siphon type heat pipe according to claim 1 and structure, is characterized in that: the heat-exchange surface of the bottom surface inner face moulding of this column jecket, be plural number protrusion particulate, help accelerate heat exchange.
5. the processing procedure of heat siphon type heat pipe according to claim 1 and structure, is characterized in that: this protrusion particulate is circumference circulating type, protrudes particulate and be width to penetrate arranged distribution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210574311.XA CN103900409A (en) | 2012-12-26 | 2012-12-26 | Process and structure of thermosiphon heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210574311.XA CN103900409A (en) | 2012-12-26 | 2012-12-26 | Process and structure of thermosiphon heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103900409A true CN103900409A (en) | 2014-07-02 |
Family
ID=50991884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210574311.XA Pending CN103900409A (en) | 2012-12-26 | 2012-12-26 | Process and structure of thermosiphon heat pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103900409A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000146471A (en) * | 1998-11-16 | 2000-05-26 | Mitsubishi Electric Corp | Loop type heat pipe |
| CN1725481A (en) * | 2004-07-21 | 2006-01-25 | 台达电子工业股份有限公司 | Cylindrical heat pipe |
| US20060042786A1 (en) * | 2004-09-01 | 2006-03-02 | Hon Hai Precision Industry Co., Ltd. | Heat pipe |
| CN101295685A (en) * | 2007-04-28 | 2008-10-29 | 新灯源科技有限公司 | Heat pipe and manufacturing method thereof |
| CN102338581A (en) * | 2010-07-23 | 2012-02-01 | 奇鋐科技股份有限公司 | Thermosiphon plate structure |
-
2012
- 2012-12-26 CN CN201210574311.XA patent/CN103900409A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000146471A (en) * | 1998-11-16 | 2000-05-26 | Mitsubishi Electric Corp | Loop type heat pipe |
| CN1725481A (en) * | 2004-07-21 | 2006-01-25 | 台达电子工业股份有限公司 | Cylindrical heat pipe |
| US20060042786A1 (en) * | 2004-09-01 | 2006-03-02 | Hon Hai Precision Industry Co., Ltd. | Heat pipe |
| CN101295685A (en) * | 2007-04-28 | 2008-10-29 | 新灯源科技有限公司 | Heat pipe and manufacturing method thereof |
| CN102338581A (en) * | 2010-07-23 | 2012-02-01 | 奇鋐科技股份有限公司 | Thermosiphon plate structure |
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| PB01 | Publication | ||
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Application publication date: 20140702 |