CN103888567A - Intelligent mobile phone and main board component thereof - Google Patents
Intelligent mobile phone and main board component thereof Download PDFInfo
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- CN103888567A CN103888567A CN201410151626.2A CN201410151626A CN103888567A CN 103888567 A CN103888567 A CN 103888567A CN 201410151626 A CN201410151626 A CN 201410151626A CN 103888567 A CN103888567 A CN 103888567A
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- main pcb
- pcb plate
- mainboard assembly
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- 230000003044 adaptive effect Effects 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 238000005493 welding type Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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Abstract
The invention discloses an intelligent mobile phone and a main board component thereof. The main board component comprises a main PCB, an auxiliary PCB and an FPC connecting wire which is electrically connected between the main PCB and the auxiliary PCB. The main PCB is provided with a first opening groove, a second opening groove and a third opening groove. A side-by-side Micro-SIM card + a T-flash card or a two-in-one card base of double Micro-SIM cards is arranged in the first opening groove. An earphone base is welded to the back face of the main PCB in the second opening groove. A back-arranged camera is arranged from the back face of the main PCB in the third opening groove. The three opening grooves are formed in the main PCB, the side-by-side two-in-one card base with large broken plate mounting thickness, the earphone base and the back-arranged camera are used, accordingly, the thickness of the main PCB is thickened at low cost, and the functions of the independent T-flash card or the double SIM cards are supported.
Description
Technical field
The present invention relates to smart mobile phone field, in particular low, the thickness ultrathin of a kind of cost and support T-flash card independently or the smart mobile phone of double SIM card.
Background technology
Nowadays, smart mobile phone has occupied most markets of mobile phone, and the various smart mobile phone of style is just towards lightening future development, and Ge great cell phone manufacturer, in order to improve the market competitiveness, starts to release the smart mobile phone of low cost, thickness ultrathin successively.
But, smart mobile phone of the prior art, the stack manner of mainboard has determined the cost of mobile phone and peripheral component thereof, and guaranteeing that its required hardware capability configures under constant prerequisite, for example support independently T-flash card or double SIM card function, be difficult to realize lower cost and ultra-thin complete machine thickness.
Therefore, prior art still haves much room for improvement and develops.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of mainboard assembly, cost is low, thin thickness, and supports independently T-flash card or double SIM card function.
Meanwhile, the present invention also provides a kind of smart mobile phone, and complete machine cost is low, thin thickness, and supports independently T-flash card or double SIM card function.
Technical scheme of the present invention is as follows: a kind of mainboard assembly, comprise main PCB plate, secondary pcb board and electric connection FPC connecting line between the two, wherein: the left side in main PCB plate front is provided with the first open slot, the two-in-one deck of side-by-side Micro-SIM card+T-flash card or two Micro-SIM cards is installed in the first open slot, the top in main PCB plate front is provided with the second open slot and the 3rd open slot, the second open slot is positioned at the centre of main PCB plate, the 3rd open slot is positioned at the right side of the second open slot, in the second open slot, be welded with earphone base from the back side of main PCB plate, in the 3rd open slot, from the back side of main PCB plate, post-positioned pick-up head is installed.
Described mainboard assembly, wherein: described two-in-one deck carries the push rod of the card taking that matches with the Kato of T-flash card or SIM card.
Described mainboard assembly, wherein: the lower end in described main PCB plate front is horizontally arranged with the main pad of adaptive welding FPC connecting line, the upper end in described secondary pcb board front is horizontally arranged with the secondary pad of adaptive welding FPC connecting line.
Described mainboard assembly, wherein: the upper end in described main PCB plate front is provided with front-facing camera, on the main PCB plate of front-facing camera below, be vertically arranged with front-facing camera pad, front-facing camera is welded on front-facing camera pad by front-facing camera FPC, on the main PCB plate in front-facing camera left side, be provided with range sensor, on the main PCB plate on front-facing camera right side, be provided with wire welding type receiver, receiver is positioned at the back side of earphone base, and across on the second open slot, the back side of main PCB plate is provided with receiver pad, the bonding wire of receiver is welded on receiver pad through main PCB plate.
Described mainboard assembly, wherein: the main PCB plate front of described receiver pad below is provided with the connector for connecting electric capacity TP FPC, and the lower right corner of main PCB backboard face is provided with the ZIF connector for connecting LCM FPC.
Described mainboard assembly, wherein: described main PCB plate region division positive and that TFT LCD MODULE is overlapping is the dew copper region without components and parts, and contacts with stainless steel heat sink by heat conductive silica gel.
Described mainboard assembly, wherein: the front of described main PCB plate is horizontally arranged with case type oval cut hole, the back side of main PCB plate is horizontally arranged with post-positioned pick-up head connector, post-positioned pick-up head connector is positioned at the below of oval cut hole, and the FPC of post-positioned pick-up head is connected with post-positioned pick-up head connector through oval cut hole.
Described mainboard assembly, wherein: the back side of described main PCB plate is provided with photoflash lamp, photoflash lamp is positioned at the right side of post-positioned pick-up head and the top of oval cut hole, and the front of main PCB plate is provided with photoflash lamp pad, and the top margin that the FPC of photoflash lamp walks around main PCB plate is welded on photoflash lamp pad.
Described mainboard assembly, wherein: the back side of main PCB plate arranges BB master chip, BB radome, RF chip and RF radome, RF radome is positioned at the left-of-center position of main PCB plate, BB radome is positioned at the below of RF radome, and the main PCB backboard face of BB radome below is provided with the battery lead pad for connecting internal battery lead-in wire.
A kind of smart mobile phone, comprises electric capacity TP, LCM and mainboard assembly, and electric capacity TP is connected with mainboard assembly by its FPC separately with LCM, wherein: described mainboard assembly is the mainboard assembly described in above-mentioned middle any one.
A kind of smart mobile phone provided by the present invention and mainboard assembly thereof, owing to having adopted three open slots on main PCB plate, broken plate is installed the thicker two-in-one deck of side-by-side, earphone base and the post-positioned pick-up head of thickness, thus with lower cost attenuate the thickness of main PCB plate, and support independently T-flash card or double SIM card function.
Accompanying drawing explanation
Fig. 1 is the front view of smart mobile phone mainboard assembly of the present invention.
Fig. 2 is the left view of smart mobile phone mainboard assembly of the present invention.
Fig. 3 is the right view of smart mobile phone mainboard assembly of the present invention.
Fig. 4 is the rearview of smart mobile phone mainboard assembly of the present invention.
Embodiment
Below with reference to accompanying drawing, the specific embodiment of the present invention and embodiment are described in detail, described specific embodiment only, in order to explain the present invention, is not intended to limit the specific embodiment of the present invention.
As shown in Figure 1, Fig. 1 is the front view of smart mobile phone mainboard assembly of the present invention, this mainboard assembly comprises main PCB plate 100, secondary pcb board 200 and is electrically connected the FPC connecting line 300 of between, for the thickness of attenuate smart mobile phone, the present invention has improved the stack manner of mainboard, on main PCB plate 100, driven three open slots (101,102 and 103), the deck 110, earphone base 120 and the post-positioned pick-up head 130 that are respectively used to T-flash card and SIM card are installed in the mode of breaking plate, concrete, left side or the left side in main PCB plate 100 fronts are provided with the first open slot 101, the first open slot 101 two-in-one deck 110 of interior installation one Micro-SIM card+T-flash card (or the two-in-one deck of two Micro-SIM cards), be provided with the second open slot 102 and the 3rd open slot 103 in the top in main PCB plate 100 fronts, the second open slot 102 is positioned near the axis of main PCB plate 100, the 3rd open slot 103 is positioned at the right side of the second open slot 102, in the second open slot 102, weld an earphone base 120 from the back side of main PCB plate 100, in the 3rd open slot 103, a post-positioned pick-up head 130 is installed from the back side of main PCB plate 100.
Shown in Fig. 2 and Fig. 3, Fig. 2 is the left view of smart mobile phone mainboard assembly of the present invention, Fig. 3 is the right view of smart mobile phone mainboard assembly of the present invention, the broken board-like this mainboard stack manner that is arranged on two-in-one deck 110, earphone base 120 and post-positioned pick-up head 130 on main PCB plate 100 really obviously attenuate the thickness of main PCB plate 100 and even smart mobile phone complete machine, deck 110 does not also protrude in the front of main PCB plate 100, is conducive to like this complete machine thickness of attenuate smart mobile phone; Facts have proved, at the ultrathin that keeps complete machine to be accomplished in lower-cost situation 7.5mm left and right, met the requirement of user to the ultra-thin performance of mobile phone, also can support independently T-flash card or double SIM card function simultaneously.
In the preferred implementation of mainboard assembly of the present invention, be preferably, between two SIM card draw-in grooves (or SIM card draw-in groove and T-flash card draw-in groove) in described two-in-one deck 110, adopt the mode being arranged side by side, to facilitate key hardware modules such as arranging BB master chip, RF chip, and do not need to increase main PCB plate 100 areas; In addition, deck 110 also carries the push rod 111 with Kato (the scheming not shown) card taking that matches of T-flash card or SIM card, to facilitate user to take out T-flash card or SIM card; Such design, under the prerequisite that main PCB plate 100 sizes do not strengthen, cost does not increase, still can realize the function of double SIM card, and this is very difficult realization of smart mobile phone of the internal battery formula of most market mainstream.
Return shown in Fig. 1, the lower end in described main PCB plate 100 fronts is horizontally arranged with the main pad 109 of adaptive welding FPC connecting line 300, the upper end in described secondary pcb board 200 fronts is horizontally arranged with the secondary pad 209 of adaptive welding FPC connecting line 300, save thus two FPC connector, further reduced material cost.
Shown in Fig. 1 and Fig. 4, Fig. 4 is the rearview of smart mobile phone mainboard assembly of the present invention, be preferably, the upper end in described main PCB plate 100 fronts is provided with front-facing camera 140, on the main PCB plate 100 of front-facing camera 140 belows, be vertically arranged with front-facing camera pad 104, front-facing camera 140 is welded on front-facing camera pad 104 by its FPC 141, can save thus a FPC connector; On the front of the main PCB plate 100 in front-facing camera 140 left sides, be provided with range sensor 150, range sensor 150 is directly welded on main PCB plate 100 in SMT paster mode, can save the FPC cost of traditional rotary-connecting range sensor, also simplify assembling mode simultaneously; On the front of the main PCB plate 100 on front-facing camera 140 right sides, be provided with wire welding type receiver 160, this receiver 160 is positioned at the back side of earphone base 120, and across on the second open slot 102, the back side of main PCB plate 100 is provided with receiver pad 106, the bonding wire of receiver 160 is welded on receiver pad 106 through main PCB plate 100, and main PCB plate 100 fronts of receiver pad 106 belows are provided with the connector 410 for connecting electric capacity TP FPC.
Be preferably, the lower right corner at main PCB plate 100 back sides is provided for connecting the ZIF connector 430 of LCM FPC, to facilitate the LCD MODULE of TFT can just put, also can put upside down, be applicable to doing different ID (Industrial Design, industrial design) style.
Be preferably, the front of described main PCB plate 100 is horizontally arranged with case type oval cut hole 103a, the back side of main PCB plate 100 is horizontally arranged with post-positioned pick-up head connector 132, such as ZIF connector etc., post-positioned pick-up head connector 132 is positioned at the below of oval cut hole 103a, the FPC 131 of post-positioned pick-up head 130 is connected with post-positioned pick-up head connector 132 through oval cut hole 103a, has solved the problem that post-positioned pick-up head 130 and its connector 132 too are closely inconvenient to assemble because of distance.
Simultaneously, the back side of main PCB plate 100 is provided with photoflash lamp 170, photoflash lamp 170 is positioned at the right side of post-positioned pick-up head 130, photoflash lamp 170 is also positioned at the top of oval cut hole 103a simultaneously, the front of main PCB plate 100 is provided with photoflash lamp pad 107, the top margin that the FPC 171 of photoflash lamp 170 walks around main PCB plate 100 is welded on photoflash lamp pad 107, can save thus the FPC connector that can bear large electric current; In addition, can be provided with Micro USB interface 420 in the top edge in main PCB plate 100 fronts, Micro USB interface 420 is between post-positioned pick-up head and 130 receivers 160.
Be preferably, the right side in main PCB plate 100 fronts is provided with the control board 180 of on & off switch and volume key, the lower right corner in main PCB plate 100 fronts is provided with the operating key pad 108 of adaptive welding control board 180, the FPC 181 of control board 180 is welded on operating key pad 108, can save again thus a FPC connector, four FPC connector that save before adding, obviously provide cost savings, and have met the demand of mobile-phone manufacturers to cost control.
Be preferably, main PCB plate 100 region positive and that TFT LCD MODULE is overlapping does not arrange any components and parts, can be provided with heat conductive silica gel and stainless steel heat sink, so that winner's pcb board 100 has preferably heat dispersion, avoids smart mobile phone local overheating; Concrete, design large-area dew copper at the internal layer in main PCB plate 100 fronts, and at large area dew copper place, heat conductive silica gel is set, contact with stainless steel heat sink again by heat conductive silica gel, strengthen thus the heat radiation to master chip, extended the useful life of main PCB plate 100.
Be preferably, the back side of main PCB plate 100 arranges BB radome 440, BB master chip (being hidden under BB radome 440 not shown), RF radome 460 and RF chip (being hidden under RF radome 460 not shown), RF radome 460 is positioned at the left-of-center position of main PCB plate 100, BB radome 440 is positioned at the below of RF radome 460, thus the chip easily generating heat, power consumption is large is all placed on to the back side of main PCB plate 100, more be conducive to the heat radiation of main PCB plate 100, can better solve the problem of smart mobile phone local overheating; In addition, main PCB plate 100 back sides be also provided with below battery lead pad 450, battery lead pad 450 is positioned at the below of BB radome 440, the lead-in wire of internal battery is directly welded on battery lead pad 4450, also the battery connector that has saved thus expensive large electric current, has further reduced cost.
Be preferably, the lower left corner at secondary pcb board 200 back sides is provided with the first contact flat spring 260, be provided with the second contact flat spring 470 in the upper left corner at main PCB plate 100 back sides, be provided with the 3rd contact flat spring 480 in the upper right corner at main PCB plate 100 back sides, the first contact flat spring 260 is for being electrically connected with the contact jaw of mobile phone main antenna FPC, the second contact flat spring 470 is for being electrically connected with the contact jaw of mobile phone WIFI and BT antenna FPC, and the 3rd contact flat spring 480 is for being electrically connected with the contact jaw of the gps antenna FPC of mobile phone.
Be preferably, be provided with RF test connector 490 in the lower left corner at main PCB plate 100 back sides, for connect the radio circuit of conducting main PCB plate 100 and secondary pcb board 200 by coaxial line; The upper left corner at secondary pcb board 200 back sides is provided with RF connector 290, is connected with the RF coaxial line of secondary pcb board 200 for main PCB plate 100.
Be preferably, right side at secondary pcb board 200 back sides is provided with loudspeaker 270 and motor 280, the lower left corner in secondary pcb board 200 fronts is provided with the 4th open slot 204, in the 4th open slot 204, be provided with microphone 250, be provided with microphone pad 205 and motor pad 208 in the left side in secondary pcb board 200 fronts; In addition, be also provided with key-press backlight lamp 230 in the front of secondary pcb board 200, for corresponding with the virtual key position on electric capacity TP.
Based on above-mentioned mainboard assembly, the present invention also proposes a kind of smart mobile phone, comprise electric capacity TP, LCM and mainboard assembly, electric capacity TP is connected with mainboard assembly by its FPC separately with LCM, wherein: described mainboard assembly is the mainboard assembly described in above-mentioned any one embodiment, guaranteeing that the required hardware capability of smart mobile phone configures under constant prerequisite, not only make up the defect that common internal battery form smart mobile phone is only supported single SIM card there is no again T-flash card function or can not be supported double SIM card, and do not needed to increase independent T-flash deck and SIM card seat; It is ultra-thin that this design can also realize smart mobile phone entirety, and low cost, meets the demand of user to smart mobile phone thickness and cost.
Should be understood that; the foregoing is only preferred embodiment of the present invention; be not sufficient to limit technical scheme of the present invention; for those of ordinary skills; within the spirit and principles in the present invention; can be increased and decreased according to the above description, replaced, converted or be improved, and all these increases and decreases, replace, conversion or improve after technical scheme, all should belong to the protection range of claims of the present invention.
Claims (10)
1. a mainboard assembly, comprise main PCB plate, secondary pcb board and electric connection FPC connecting line between the two, it is characterized in that: the left side in main PCB plate front is provided with the first open slot, the two-in-one deck of side-by-side Micro-SIM card+T-flash card or two Micro-SIM cards is installed in the first open slot, the top in main PCB plate front is provided with the second open slot and the 3rd open slot, the second open slot is positioned at the centre of main PCB plate, the 3rd open slot is positioned at the right side of the second open slot, in the second open slot, be welded with earphone base from the back side of main PCB plate, in the 3rd open slot, from the back side of main PCB plate, post-positioned pick-up head is installed.
2. mainboard assembly according to claim 1, is characterized in that: described two-in-one deck carries the push rod of the card taking that matches with the Kato of T-flash card or SIM card.
3. mainboard assembly according to claim 1, is characterized in that: the lower end in described main PCB plate front is horizontally arranged with the main pad of adaptive welding FPC connecting line, and the upper end in described secondary pcb board front is horizontally arranged with the secondary pad of adaptive welding FPC connecting line.
4. mainboard assembly according to claim 1, it is characterized in that: the upper end in described main PCB plate front is provided with front-facing camera, on the main PCB plate of front-facing camera below, be vertically arranged with front-facing camera pad, front-facing camera is welded on front-facing camera pad by front-facing camera FPC, on the main PCB plate in front-facing camera left side, be provided with range sensor, on the main PCB plate on front-facing camera right side, be provided with wire welding type receiver, receiver is positioned at the back side of earphone base, and across on the second open slot, the back side of main PCB plate is provided with receiver pad, the bonding wire of receiver is welded on receiver pad through main PCB plate.
5. mainboard assembly according to claim 4, is characterized in that: the main PCB plate front of described receiver pad below is provided with the connector for connecting electric capacity TP FPC, and the lower right corner of main PCB backboard face is provided with the ZIF connector for connecting LCM FPC.
6. mainboard assembly according to claim 1, is characterized in that: described main PCB plate region division positive and that TFT LCD MODULE is overlapping is the dew copper region without components and parts, and contacts with stainless steel heat sink by heat conductive silica gel.
7. mainboard assembly according to claim 1, it is characterized in that: the front of described main PCB plate is horizontally arranged with case type oval cut hole, the back side of main PCB plate is horizontally arranged with post-positioned pick-up head connector, post-positioned pick-up head connector is positioned at the below of oval cut hole, and the FPC of post-positioned pick-up head is connected with post-positioned pick-up head connector through oval cut hole.
8. mainboard assembly according to claim 7, it is characterized in that: the back side of described main PCB plate is provided with photoflash lamp, photoflash lamp is positioned at the right side of post-positioned pick-up head and the top of oval cut hole, the front of main PCB plate is provided with photoflash lamp pad, and the top margin that the FPC of photoflash lamp walks around main PCB plate is welded on photoflash lamp pad.
9. mainboard assembly according to claim 1, it is characterized in that: the back side of main PCB plate arranges BB master chip, BB radome, RF chip and RF radome, RF radome is positioned at the left-of-center position of main PCB plate, BB radome is positioned at the below of RF radome, and the main PCB backboard face of BB radome below is provided with the battery lead pad for connecting internal battery lead-in wire.
10. a smart mobile phone, comprises electric capacity TP, LCM and mainboard assembly, and electric capacity TP is connected with mainboard assembly by its FPC separately with LCM, it is characterized in that: described mainboard assembly is the mainboard assembly described in any one in claim 1 to 9.
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| CN201410151626.2A CN103888567B (en) | 2014-04-16 | 2014-04-16 | A kind of smart mobile phone and mainboard assembly thereof |
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| CN201410151626.2A CN103888567B (en) | 2014-04-16 | 2014-04-16 | A kind of smart mobile phone and mainboard assembly thereof |
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| CN103888567A true CN103888567A (en) | 2014-06-25 |
| CN103888567B CN103888567B (en) | 2016-08-17 |
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| CN104580861A (en) * | 2014-12-26 | 2015-04-29 | 深圳市兰丁科技有限公司 | Intelligent camera shooting device |
| CN104967926A (en) * | 2015-06-16 | 2015-10-07 | 成都西可科技有限公司 | Sealing and sound outputting structure for sound chamber of loudspeaker |
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| CN106231781A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | PCB board, manufacturing method of PCB board and mobile terminal |
| CN108391369B (en) * | 2016-07-28 | 2019-07-23 | Oppo广东移动通信有限公司 | PCB board, manufacturing method of PCB board and mobile terminal |
| WO2018018915A1 (en) * | 2016-07-28 | 2018-02-01 | 广东欧珀移动通信有限公司 | Pcb board, manufacturing method for the pcb board and mobile terminal |
| CN106231781B (en) * | 2016-07-28 | 2018-05-22 | 广东欧珀移动通信有限公司 | PCB, manufacturing method of PCB and mobile terminal |
| CN108391369A (en) * | 2016-07-28 | 2018-08-10 | Oppo广东移动通信有限公司 | PCB board, manufacturing method of PCB board and mobile terminal |
| CN106961498A (en) * | 2017-05-19 | 2017-07-18 | 深圳市沃特沃德股份有限公司 | Mobile terminal |
| CN107690251A (en) * | 2017-08-23 | 2018-02-13 | 广东欧珀移动通信有限公司 | Electronic Components and Electronic Devices |
| CN107660097A (en) * | 2017-08-23 | 2018-02-02 | 广东欧珀移动通信有限公司 | Electronic Components and Electronic Devices |
| CN107660097B (en) * | 2017-08-23 | 2020-02-18 | Oppo广东移动通信有限公司 | Electronic components and electronic devices |
| CN110233283A (en) * | 2019-07-10 | 2019-09-13 | 深圳先进储能材料国家工程研究中心有限公司 | High-energy density secondary lithium ion battery |
| CN110233283B (en) * | 2019-07-10 | 2021-07-23 | 深圳先进储能材料国家工程研究中心有限公司 | High energy density secondary lithium ion battery |
| CN110995977A (en) * | 2019-12-24 | 2020-04-10 | 华勤通讯技术有限公司 | PCB and electronic equipment |
| CN110995977B (en) * | 2019-12-24 | 2021-09-03 | 华勤技术股份有限公司 | PCB and electronic equipment |
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| CN103888567B (en) | 2016-08-17 |
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Address after: 518000 Guangdong city of Shenzhen province Futian District Shennan Avenue and Xiangmi Lake road at the junction of the southeast side of the Green Plaza building 27 floor 27H Applicant after: SHENZHEN KOOBEE COMMUNICATION CO., LTD. Address before: 518000 Guangdong city of Shenzhen province Futian District Shennan Avenue and Xiangmi Lake road at the junction of the southeast side of the Green Plaza building 27 floor 27H Applicant before: Shenzhen Kubi Communication Equipment Co.,Ltd. |
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Effective date of registration: 20190410 Address after: 644000 Yibin Port-Lingang Economic and Technological Development Zone, Yibin City, Sichuan Province Patentee after: Sichuan Kusai Technology Co., Ltd. Address before: 518000 Shennan Avenue and Xiangmihu Road, Futian District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN KOOBEE COMMUNICATION CO., LTD. |